Mute key processing method

Abstract

The invention relates to the technical field of metal processing, and discloses a mute key processing method which comprises the following steps: S1, providing a plate; s2, the third side and the fourth side of the plate serve as a first machining area and a second machining area and are machined, so that a product rough blank is formed; s3, a main body part and a touch part are sequentially machined on the product rough blank, a groove is machined in the main body part, and a closing part is machined in the groove; and S4, blanking is conducted, and the mute key is obtained. When the magnet is mounted, the magnet penetrates into the groove from the first wall surface to be embedded into the main body part, the closing part is used for blocking the magnet and preventing the magnet from being separated from the groove in the width direction of the plate, and the closing part can also be used for containing soldering tin or glue. After the magnet is assembled and fixed, one side surface, facing the internal structure of the mobile phone, of the mute key is kept flat, so that the connection of the magnet is not affected by the sliding use of the mute key, and the service life of the mute key is prolonged by improving the stability of the connection of the magnet.

Description

Technical Field

[0001] The invention relates to the technical field of metal processing, and in particular to a silent key processing method. Background Art

[0002] The mute button is a function button used in modern electronic devices to quickly turn off or lower the volume. It is used to lower the volume of electronic devices (such as computers, mobile phones, audio equipment, car audio systems, etc.) to achieve a mute effect.

[0003] With people's pursuit of personalization, the design of the mute button of the mobile phone is diverse, but all of them are only flat designs. When in use, a protruding touch part is formed on the mute button, so that the trigger part passes through the mute hole of the mobile phone, and the straight part of the mute button is supported on the inner wall of the mobile phone, and the mute or canceling of the mute is triggered by pressing. The existing mute button usually has a magnet fixedly connected to the side surface of the main part of the mute button facing away from the touch part, which is used for sensing and controlling the mute. However, the magnet is usually fixed to the main part by means of glue or welding. For this reason, the thickness of the magnet cannot be too thick, and during the use of the mute button, since the mute button needs to slide, the magnet rubs against the internal structure of the collection, which will affect the firmness between the magnet and the main part. For this reason, how to process a mute key that is easy to connect firmly with the magnet becomes a problem. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: to provide a silent key processing method to solve the problem that the existing silent key is not easy to connect with the magnet.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: providing a silent key processing method comprising the following steps:

[0006] S1. Provide a plate, wherein the plate comprises a first side distributed along a thickness direction of the plate, a second side arranged opposite to the first side, and a third side and a fourth side distributed along a width direction of the plate;

[0007] S2, using the third side and the fourth side of the plate as the first processing area and the second processing area, and processing the first processing area and the second processing area to form a rough product;

[0008] S3, processing a main body part and a touch part in sequence on the rough product along the width direction of the plate, processing a groove on one side of the main body part along the width direction of the plate, and processing a closing part on the side of the groove away from the touch part along the width direction of the plate;

[0009] S4, drop the material and get the mute key.

[0010] Furthermore, the step S2 includes the following sub-steps:

[0011] S21, providing a positioning structure on the plate and penetrating the plate in the thickness direction of the plate to fix the plate;

[0012] S22, based on the thickness of the mute key, thinning the first processing area and the second processing area to form a first molding area and a second molding area that are adapted to the thickness of the mute key, the thickness of the first molding area and the second molding area are both less than the thickness of the plate, the width of the first molding area and the second molding area are adapted to the width of the mute key, and the length of the first molding area and the second molding area are both greater than the length of the mute key, so as to be used for molding at least one mute key;

[0013] S23, processing a first spacing groove on the first molding area and the second molding area along the length direction of the plate, wherein the first spacing groove penetrates the first molding area and the second molding area along the thickness direction of the plate of the mute key, so as to separate the first molding area and the second molding area into a plurality of product blanks;

[0014] S24. A connecting area is reserved on the plate at the inner area of ​​the product rough blank corresponding to the position of each product rough blank, and second spacing grooves are processed on the part other than the connecting area. The second spacing grooves are distributed along the length direction of the plate, so that each product rough blank is separated from the plate except the connecting area.

[0015] Furthermore, the step S22 includes the following sub-steps:

[0016] S221, performing thinning processing on the first side and the second side of the first processing area and the second processing area along the thickness direction of the plate to process a first thinning groove in an L-shape between the plate;

[0017] S222. Thinning processing is performed on the first and second sides of the first processing area and the second processing area along the thickness direction of the plate from the first thinning groove away from the side of the plate to process a second thinning groove that is stepped with the first thinning groove, and the first processing area and the second processing area The portion corresponding to the first thinning groove is formed as a first molding area, and the first processing area and the second processing area The portion corresponding to the second thinning groove is formed as a second molding area.

[0018] Furthermore, in the step S24, the second spacing groove is formed on a side of the first forming area close to the plate, and the connecting area is retained between each product blank and the plate.

[0019] Furthermore, the S3 step includes the following sub-steps:

[0020] S31, processing the first molding area to form a main body;

[0021] S32, processing a first side wall surface on one side surface of the main body close to the plate, and processing a shift groove and a groove on the first side surface respectively;

[0022] S33, processing the second molding area to form a touch portion;

[0023] S34, processing anti-skid patterns on a side surface of the touch portion facing away from the main body portion to form an anti-skid surface.

[0024] Furthermore, the step S31 includes the following sub-steps:

[0025] S311, processing a first wall surface on one side of the first forming area along the thickness direction of the plate, and processing first arc-shaped half end surfaces on both ends of the first forming area along the length direction of the plate from the first wall surface;

[0026] S312, a second wall surface is processed on the other side of the first forming area along the thickness direction of the plate, and second arcuate half-end surfaces are respectively processed from the second wall surface at both ends of the first forming area along the length direction of the plate, the first arcuate half-end surface and the second arcuate half-end surface are connected to form an arcuate end surface.

[0027] Furthermore, in the step S32: the first side wall surface is formed from the first molding area along the width direction of the plate toward one side of the plate, the gear groove and the groove are distributed on both sides of the connecting area along the length direction of the plate, and the groove passes through the first wall surface along the thickness direction of the plate.

[0028] Furthermore, in the step S32: three gear grooves are opened from the first side wall surface along the thickness direction of the plate, and each gear groove passes through along the thickness direction of the plate, and a transition arc surface is processed between any two adjacent gear grooves.

[0029] Furthermore, in the step S32: on the first side of the plate and on both side edges close to the first thinning groove and the connecting portion, thinning is performed along the thickness direction of the plate to form a third thinning groove, and the first side wall surface is formed facing the third thinning groove.

[0030] Furthermore, the step S33 includes the following sub-steps:

[0031] S331, a third wall surface is processed on one side of the second forming area along the thickness direction of the plate, and third arc-shaped half-end surfaces are processed on both ends of the third wall surface in the second forming area along the length direction of the plate, and a second side wall surface is processed on one side of the first forming area 32 along the width direction of the plate relative to the first side wall surface, so as to form a main body;

[0032] S332. A fourth wall surface is processed on the other side of the second molding area along the thickness direction of the plate, and fourth arc-shaped half-end surfaces are respectively processed from the fourth wall surface at both ends of the second molding area along the length direction of the plate, and the third arc-shaped half-end surface and the fourth arc-shaped half-end surface are connected to form a secondary arc-shaped end surface to form a touch portion.

[0033] The mute key processing method of the present invention has at least the following beneficial effects: by processing a groove on the mute key and processing a closing portion in the groove, when installing the magnet, the magnet can be inserted into the groove from the first wall surface and embedded in the main body part. The closing portion is used to block the magnet to prevent the magnet from escaping from the groove along the width direction of the plate. The closing portion can also be used to accommodate solder or glue to ensure that after the magnet is assembled and fixed, the side of the mute key facing the internal structure of the mobile phone remains flat, so that the sliding use of the mute key will not affect the connection of the magnet, thereby improving the stability of the magnet connection and the service life of the mute key. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0035] Figure 1 It is a flow chart of the silent key processing method of the present invention;

[0036] Figure 2 It is a schematic diagram of the structure of the plate in step S1 of the present invention;

[0037] Figure 3 A flowchart of the sub-steps of step S2 of the present invention;

[0038] Figure 4 This is a schematic diagram of the structure after processing in step S21 of the present invention;

[0039] Figure 5 Flow chart of the sub-steps of step S22 of the present invention;

[0040] Figure 6 This is a schematic diagram of the structure after processing in step S22 of the present invention;

[0041] Figure 7This is a schematic diagram of the structure after processing in step S23 and step S24 of the present invention;

[0042] Figure 8 A flowchart of the sub-steps of step S3 of the present invention;

[0043] Fig. 9 Flow chart of the sub-steps of step S31 of the present invention;

[0044] Fig.10 Flow chart of the sub-steps of step S33 of the present invention;

[0045] Fig.11 This is a schematic diagram of the structure after processing in step S34 of the present invention;

[0046] Fig.12 It is a schematic diagram of the structure at another angle after processing in step S34 of the present invention;

[0047] Fig.13 for Fig.12 An enlarged view of section A is shown;

[0048] Fig.14 It is a structural schematic diagram at another angle after processing in step S4 of the present invention.

[0049] The meanings of the symbols in the accompanying drawings are:

[0050] Mute key 1, main body 11, touch part 12, plate 2, first positioning hole 21, first side 22, second side 23, third side 24, fourth side 25, second positioning hole 26, foolproof hole 27, first processing area 281, second processing area 282, product rough 29, first thinning groove 30, second thinning groove 31, first molding area 32, first wall 321, first arc-shaped half end surface 322, second wall 323, second arc shaped half end face 324, arcuate end face 32a, first side wall face 325, second side wall face 326, second molding area 33, third wall face 331, third arcuate half end face 332, fourth wall face 333, fourth arcuate half end face 334, secondary arcuate end face 33a, first spacing groove 34, connecting material area 35, groove 36, closing part 37, gear groove 38, transition arc surface 381, third thinning groove 39, anti-slip pattern 40, second spacing groove 41. DETAILED DESCRIPTION

[0051] The present invention will be further described below in conjunction with the accompanying drawings.

[0052] Please refer to Fig.14For ease of understanding, the mute key 1 processed by the present invention is a three-stage mute key 1, including a main body 11 and a touch part 12, the main body 11 and the touch part 12 are T-shaped and integrally formed. There are three gear slots 38 on the mute key 1, so that three gears can be formed by sliding when in use, so as to achieve three-stage use. The main body 11 is installed inside the mobile phone when in use, and the touch part 12 passes through the mute hole to the outside of the mobile phone for controlling the volume.

[0053] Please refer to Figures 1 to 14 The processing method of the mute key 1 of the present invention comprises the following steps:

[0054] S1. Please refer to Figure 1 and Figure 2 A plate 2 is provided, wherein the plate 2 includes a first side 22 distributed along a thickness direction of the plate 2 , a second side 23 arranged opposite to the first side 22 , and a third side 24 and a fourth side 25 distributed along a width direction of the plate 2 .

[0055] In this step, the plate 2 is in a rectangular parallelepiped shape, and the plate 2 has a first side 22 and a second side 23 that are relatively distributed along the thickness direction of the plate 2, and the plate 2 has a third side 24 and a fourth side 25 that are distributed along the width direction of the plate 2. The first side 22, the second side 23, the third side 24 and the fourth side 25 all refer to a certain side of the plate 2. The plate 2 is double-sided ground by DDG with a flatness of 0.03, and the thickness error of the plate 2 is controlled within ±0.015 mm to remove burrs, etc.

[0056] S2, please refer to Figures 3 to 7 The third side 24 and the fourth side 25 of the plate 2 are used as the first processing area 281 and the second processing area 282 , and the first processing area 281 and the second processing area 282 are processed to form a rough product 29 .

[0057] The S2 step includes the following sub-steps:

[0058] S21, please refer to Figure 4 A positioning structure is provided on the plate 2 and passes through the plate 2 along the thickness direction of the plate 2 to fix the plate 2.

[0059] In this step, after double-sided grinding, the plate 2 is fixed along the length direction of the plate 2 by a clamping device, and four first positioning holes 21 are opened on the plate 2 along the thickness direction of the plate 2. The four first positioning holes 21 are equidistantly distributed along the length direction of the plate 2. The four first positioning holes 21 are opened corresponding to the clamping device to fix the plate 2. Among them, each first positioning hole 21 is located in the middle position of the plate 2 in the width direction of the plate 2. The second positioning holes 26 are opened on the plate 2 along the thickness direction of the plate 2. The second positioning holes 26 are distributed at intervals along the length direction of the plate 2 and are spaced from the first positioning holes 21. In addition, the plate 2 is provided with a fool-proof hole 27 that passes through the thickness direction of the plate 2. The fool-proof hole 27 is staggered relative to the two second positioning holes 26 to avoid direction errors during positioning. According to the above steps, the first positioning holes 21 and the second positioning holes 26 are first processed to facilitate flipping and fixing the plate 2, thereby facilitating processing.

[0060] S22. Based on the thickness of the mute key 1, use a fixture to position the plate 2 with the first positioning hole 21, and thin the first processing area 281 and the second processing area 282 to form a first molding area 32 and a second molding area 33 that are adapted to the thickness of the mute key 1. The thickness of the first molding area 32 and the second molding area 33 are both less than the thickness of the plate 2, so that they are formed by processing the plate 2. The width of the first molding area 32 and the second molding area 33 is adapted to the width of the mute key 1, so that there is enough processing part to process the main part 11 and the touch part 12; the length of the first molding area 32 and the second molding area 33 are both greater than the length of the mute key 1, so as to be used to mold at least one mute key 1, thereby enabling batch processing.

[0061] Please refer to Figures 5 and 6 , the step S22 includes the following sub-steps:

[0062] S221 , performing thinning processing along the thickness direction of the plate 2 on the first side 22 and the second side 23 of the first processing area 281 and the second processing area 282 to form a first thinning groove 30 in an L-shape between the plate 2 .

[0063] In this step, since the first processing area 281 and the second processing area 282 are both part of the plate 2, the first processing area 281 and the second processing area 282 both have a first side 22 and a second side 23. The first processing area 281 is located on the side where the third side 24 of the plate 2 is located, and the second processing area 282 is located on the side where the fourth side 25 of the plate 2 is located. Therefore, the third side 24 is a side of the first processing area 281 away from the fourth side 25, and the fourth side 25 is a side of the second processing area 282 away from the third side 24. The first first thinning groove 30 is formed by processing along the thickness direction of the plate 2 on the first side 22 of the first processing area 281. The first first thinning groove 30 penetrates the first side 22 of the first processing area 281 along the thickness direction of the plate 2, and the first first thinning groove 30 penetrates the third side 24 along the width direction of the plate 2. A second first thinning groove 30 is formed on the second side 23 of the first processing area 281 along the thickness direction of the plate 2. The second first thinning groove 30 penetrates the second side 23 of the first processing area 281 along the thickness direction of the plate 2, and the second first thinning groove 30 penetrates the third side 24 along the width direction of the plate 2. A third first thinning groove 30 is formed on the first side 22 of the second processing area 282 along the thickness direction of the plate 2. The third first thinning groove 30 penetrates the first side 22 of the second processing area 282 along the thickness direction of the plate 2, and the third first thinning groove 30 penetrates the fourth side 25 along the width direction of the plate 2. The second side 23 of the second processing area 282 is processed along the thickness direction of the plate 2 to form a fourth first thinning groove 30, the fourth first thinning groove 30 penetrates the second side 23 of the second processing area 282 along the thickness direction of the plate 2, and the fourth first thinning groove 30 penetrates the fourth side 25 along the width direction of the plate 2, thereby forming a total of four first thinning grooves 30, and the four first thinning grooves 30 all penetrate the plate 2 along the length direction of the plate 2.

[0064] S222, thinning processing is performed on the first side 22 and the second side 23 of the first processing area 281 and the second processing area 282 along the thickness direction of the plate 2 from the first thinning groove 30 to the side of the plate 2 away from the first thinning groove to process a second thinning groove 31 that is stepped with the first thinning groove 30, and the portion of the first processing area 281 and the second processing area 282 corresponding to the first thinning groove 30 is formed as a first molding area 32, and the portion of the first processing area 281 and the second processing area 282 corresponding to the second thinning groove 31 is formed as a second molding area 33.

[0065] In this step, a first second thinning groove 31 is machined and opened on a groove wall of the first first thinning groove 30 on the side facing the second side 23 along the thickness direction of the plate 2, and the first second thinning groove 31 is opened on the side facing the third side 24 relative to the first thinning groove 30. A second second thinning groove 31 is machined and opened on a groove wall of the second first thinning groove 30 on the side facing the first side 22 along the thickness direction of the plate 2, and the second second thinning groove 31 is opened on the side facing the third side 24 relative to the first thinning groove 30 so as to face the first second thinning groove 31 in the thickness direction of the plate 2. A third second thinning groove 31 is machined and opened on a groove wall of the third first thinning groove 30 on the side facing the second side 23 along the thickness direction of the plate 2, and the third second thinning groove 31 is opened on the side facing the fourth side 25 relative to the first thinning groove 30. A fourth second thinning groove 31 is machined and opened on the groove wall of the fourth first thinning groove 30 on one side facing the first side 22 along the thickness direction of the plate 2. The fourth second thinning groove 31 is opened on the side facing the fourth side 25 relative to the first thinning groove 30 so as to face the third second thinning groove 31 in the thickness direction of the plate 2. Four second thinning grooves 31 are formed in this way, so that the first processing area 281 and the second processing area 282 are both T-shaped, and the four second thinning grooves 31 all penetrate the plate 2 along the length direction of the plate 2. The portion corresponding to the first thinning groove 30 in the thickness direction of the plate 2 is defined as the first molding area 32, and the portion corresponding to the second thinning groove 31 in the thickness direction of the plate 2 is defined as the second molding area 33.

[0066] S23, a first spacing groove 34 is processed in the first molding area 32 and the second molding area 33 along the length direction of the plate 2, and the first spacing groove 34 penetrates the first molding area 32 and the second molding area 33 along the thickness direction of the plate 2 to separate the first molding area 32 and the second molding area 33 into a plurality of product blanks 29.

[0067] In this step, a plurality of first spacing grooves 34 are provided on the first processing area 281 and the second processing area 282, and the plurality of first spacing grooves 34 on the first processing area 281 and the second processing area 282 are provided at equal intervals along the length direction of the plate 2. Each first spacing groove 34 on the first processing area 281 and each first spacing groove 34 on the second processing area 282 sequentially disconnects the first forming area 32 and the second forming area 33 along the width direction of the plate 2, so that the first processing area 281 and the second processing area 282 are separated into a plurality of product blanks 29, each of which has the first forming area 32 and the second forming area 33, so that batch production can be achieved, and the setting of the first spacing grooves 34 cooperates with the positions of the first processing area 281 and the second processing area 282 located on the side, so that the product blanks 29 can be disconnected and spaced from each other without the need for additional processing.

[0068] S24. A connecting area 35 is reserved on the plate 2 at the inner area of ​​the product blank 29 corresponding to the position of each product blank 29, and second spacing grooves 41 are processed on the part other than the connecting area 35. The second spacing grooves 41 are distributed along the length direction of the product plate 2, so that each product blank 29 except the connecting area 35 is separated from the plate 2, so that it is convenient to process the mute key 1 from the third side 24 and the fourth side 25 of the plate 2, which is easier than processing in the middle position.

[0069] In the step S24, the second spacing groove 41 is formed on the side of the first forming area 32 close to the plate 2, and the connecting area 35 is reserved between each product rough blank 29 and the plate 2. The second spacing groove 41 is opened along the thickness direction of the plate 2, and the second spacing grooves 41 corresponding to two adjacent product rough blanks 29 are connected to the corresponding first spacing grooves 34. In order to ensure the processing of the subsequent structure, the position for the gear slot 38 and the position for connecting the magnet are reserved on the side surface of each product rough blank 29 close to the plate 2 and located on both sides of the connecting area 35.

[0070] S3, please refer to Figures 8 to 14 , the main body 11 and the touch part 12 are processed in sequence on the rough product 29 along the width direction of the plate 2, a groove 36 is processed on one side of the main body 11 along the width direction of the plate 2, and a closing part 37 is processed on the side of the groove 36 away from the touch part 12 along the width direction of the plate 2. According to this step, the first molding area 32 is processed into the main body 11, the second molding area 33 is processed into the touch part 12, and the groove 36 for installing the magnet is processed to fix the magnet in an embedded manner, and the closing part 37 is processed to block the magnet, so that the magnet is installed more firmly.

[0071] The S3 step includes the following sub-steps:

[0072] S31 , processing the first molding area 32 to form the main body portion 11 .

[0073] The step S31 includes the following sub-steps:

[0074] S311, a first wall surface 321 is processed from the first forming area 32 on one side of the plate 2 in the thickness direction of the plate 2, the first wall surface 321 is parallel to the first side 22, and first arcuate half-end surfaces 322 are processed from the first wall surface 321 at both ends of the first forming area 32 in the length direction of the plate 2. In this step, the first arcuate half-end surface 322 is processed from the first wall surface 321 along the thickness direction of the plate to form an arc-shaped arc structure.

[0075] S312, a second wall surface 323 is processed on the other side of the first forming area 32 along the thickness direction of the plate 2, the second wall surface 323 is parallel to the first wall surface 321, and second arcuate half-end surfaces 324 are respectively processed from the second wall surface 323 at both ends of the first forming area 32 along the length direction of the plate 2, the second arcuate half-end surface 324 is bent to the first arcuate half-end surface 322, so that the first arcuate half-end surface 322 and the second arcuate half-end surface 324 are connected to form an arcuate end surface 32a.

[0076] S32, a first side wall surface 325 is processed on one side surface of the main body 11 close to the plate 2, and a shift groove 38 and a groove 36 are processed on the first side 22 respectively;

[0077] In the step S32: the first side wall surface 325 is formed from the first molding area 32 along the width direction of the plate 2 toward one side of the plate 2, and the gear groove 38 and the groove 36 are distributed on both sides of the material connection area 35 along the length direction of the plate 2. The gear groove 38 is opened from the first side wall surface 325 in three in the thickness direction of the plate 2, and each gear groove 38 is through in the thickness direction of the plate 2, and a transition arc surface 381 is processed between any two adjacent gear grooves 38. The first side 22 of the plate 2 and the two side edges close to the first thinning groove 30 and the connecting part are thinned along the thickness direction of the plate 2 to form a third thinning groove 39, and the first side wall surface 325 is processed to face the third thinning groove 39.

[0078] In this step, the groove 36 and the three gear slots 38 are processed in sequence along the length direction of the plate. The groove 36 has a wide section and a narrow section. The wide section faces the touch portion 12 side, and the narrow section faces the plate 2 side and is through-opened toward the plate 2 side. The narrow section is the closing portion 37. The gear slots 38 are through-opened along the thickness direction of the plate 2. The grooves 36 are used to install magnets, and the transition arc surfaces 381 between the gear slots 38 protrude as a shifting convex portion, which is used to shift the gear inside the mobile phone.

[0079] S33, processing the second molding area 33 to form a touch portion 12;

[0080] The step S33 includes the following sub-steps:

[0081] S331, a third wall surface 331 is machined from the second molding area 22 on one side of the plate 2 in the thickness direction of the plate 2, and third arc-shaped half-end surfaces 332 are respectively machined from the third wall surface 331 on both ends of the second molding area 33 in the length direction of the plate 2, and a second side 23 wall surface is machined on one side of the first molding area 32 in the width direction of the plate 2 relative to the first side wall surface 325, so as to form the main body 11;

[0082] S332. A fourth wall surface 333 is processed on the other side of the second molding area 33 along the thickness direction of the plate 2, and fourth arcuate half-end surfaces 334 are respectively processed from the fourth wall surface 333 at both ends of the second molding area 33 along the length direction of the plate 2, the third arcuate half-end surface 332 and the fourth arcuate half-end surface 334 are connected to form a secondary arcuate end surface 33a32a to form the touch portion 12.

[0083] S34, a non-slip pattern 40 is processed on one side of the touch portion 12 facing away from the main body portion 11 to form a non-slip surface. In this step, a number of protruding non-slip protrusions are processed on the non-slip surface to form an uneven pattern on the entire non-slip surface. After this step is completed, a full inspection is required to screen out unqualified mute keys 1, and sandblasting is performed on qualified mute keys 1. After sandblasting, a full inspection is performed again to screen out unqualified mute keys 1, and then anodizing is performed, and then a full inspection is continued to perform subsequent blanking processing on qualified mute keys 1.

[0084] S4, drop the material and obtain the mute key 1.

[0085] In step S4, the material connection area 35 is located between the magnetic groove and the gear groove 38, and the material connection area 35 can be removed along the thickness direction of the plate 2. After the blanking is completed, the silent key 1 is formed, and the silent key 1 is fully inspected and unqualified silent keys 1 are removed. For qualified silent keys 1, auxiliary materials are assembled and fully inspected before packaging and shipment.

[0086] The mute key processing method of the present invention can fix the plate 2 through the first positioning hole 21 after the first positioning hole 21 is initially processed, so as to avoid affecting the processing by clamping the plate 2 on the side; and processing the mute key 1 from the opposite side edges of the plate 2 is less difficult than making a rough hole in the middle, which reduces the cost to a certain extent, and is easier to process the detailed structure. Finally, only one place needs to be cut when cutting the material, which improves the processing speed and reduces the processing cost to a certain extent; a groove 36 is processed on the mute key 1. Compared with directly welding the magnet or fixing the magnet on the mute key 1 with glue, the groove 36 can limit and fix the magnet in an embedded manner, and then fill it in the closing part 37 with glue or solder, so as to ensure the flatness of the side of the mute key 1 facing the inside of the mobile phone. Since the mute key 1 itself is relatively small, it will not have the magnetic attraction effect of the invisible magnet, thereby improving the connection of the magnet, making the assembly operation easier and the connection more firm.

Claims

1. A method for processing a silent key, characterized in that: The following steps are involved: S1. Provide a plate, wherein the plate comprises a first side distributed along a thickness direction of the plate, a second side arranged opposite to the first side, and a third side and a fourth side distributed along a width direction of the plate; S2, using the third side and the fourth side of the plate as the first processing area and the second processing area, and processing the first processing area and the second processing area to form a rough product; S3, processing a main body part and a touch part in sequence on the rough product along the width direction of the plate, processing a groove on one side of the main body part along the width direction of the plate, and processing a closing part on the side of the groove away from the touch part along the width direction of the plate; S4, drop the material and get the mute key.

2. The silent key processing method according to claim 1, characterized in that: The S2 step includes the following sub-steps: S21, providing a positioning structure on the plate and penetrating the plate in the thickness direction of the plate to fix the plate; S22, based on the thickness of the mute key, thinning the first processing area and the second processing area to form a first molding area and a second molding area that are adapted to the thickness of the mute key, the thickness of the first molding area and the second molding area are both less than the thickness of the plate, the width of the first molding area and the second molding area are adapted to the width of the mute key, and the length of the first molding area and the second molding area are both greater than the length of the mute key, so as to be used for molding at least one mute key; S23, processing a first spacing groove on the first molding area and the second molding area along the length direction of the plate, wherein the first spacing groove penetrates the first molding area and the second molding area along the thickness direction of the plate of the mute key, so as to separate the first molding area and the second molding area into a plurality of product blanks; S24. A connecting area is reserved on the plate at the inner area of ​​the product rough blank corresponding to the position of each product rough blank, and second spacing grooves are processed on the part other than the connecting area. The second spacing grooves are distributed along the length direction of the plate, so that each product rough blank is separated from the plate except the connecting area.

3. The method for processing a silent key according to claim 2, characterized in that: The step S22 includes the following sub-steps: S221, performing thinning processing on the first side and the second side of the first processing area and the second processing area along the thickness direction of the plate to process a first thinning groove in an L-shape between the plate; S222. Thinning processing is performed on the first and second sides of the first processing area and the second processing area along the thickness direction of the plate from the first thinning groove away from the side of the plate to process a second thinning groove that is stepped with the first thinning groove, and the first processing area and the second processing area The portion corresponding to the first thinning groove is formed as a first molding area, and the first processing area and the second processing area The portion corresponding to the second thinning groove is formed as a second molding area.

4. The method for processing a silent key according to claim 3, characterized in that: In the step S24, the second spacing groove is formed on a side of the first forming area close to the plate, and the connecting area is retained between each product blank and the plate.

5. The method for processing a silent key according to claim 2, characterized in that: The S3 step includes the following sub-steps: S31, processing the first molding area to form a main body; S32, processing a first side wall surface on one side surface of the main body close to the plate, and processing a shift groove and a groove on the first side surface respectively; S33, processing the second molding area to form a touch portion; S34, processing anti-skid patterns on a side surface of the touch portion facing away from the main body portion to form an anti-skid surface.

6. The method for processing a silent key according to claim 5, characterized in that: The step S31 includes the following sub-steps: S311, processing a first wall surface on one side of the first forming area along the thickness direction of the plate, and processing first arc-shaped half end surfaces on both ends of the first forming area along the length direction of the plate from the first wall surface; S312, a second wall surface is processed on the other side of the first forming area along the thickness direction of the plate, and second arcuate half-end surfaces are respectively processed from the second wall surface at both ends of the first forming area along the length direction of the plate, the first arcuate half-end surface and the second arcuate half-end surface are connected to form an arcuate end surface.

7. The method for processing a silent key according to claim 5, characterized in that: In the step S32: the first side wall surface is formed from the first forming area along the width direction of the plate toward one side of the plate, the gear groove and the groove are distributed on both sides of the connecting area along the length direction of the plate, and the groove passes through the first wall surface along the thickness direction of the plate.

8. The method for processing a silent key according to claim 7, characterized in that: In the step S32, three gear grooves are formed along the thickness direction of the plate from the first side wall, and each gear groove is through-through along the thickness direction of the plate, and a transition arc surface is processed between any two adjacent gear grooves.

9. The method for processing a silent key according to claim 7 or 8, characterized in that: In the step S32: on the first side of the plate and on both sides close to the first thinning groove and the connecting part, the plate is thinned along the thickness direction to form a third thinning groove, and the first side wall surface is formed facing the third thinning groove.

10. The method for processing a silent key according to claim 5, characterized in that: The step S33 includes the following sub-steps: S331, a third wall surface is processed on one side of the second forming area along the thickness direction of the plate, and third arc-shaped half-end surfaces are processed on both ends of the third wall surface in the second forming area along the length direction of the plate, and a second side wall surface is processed on one side of the first forming area 32 along the width direction of the plate relative to the first side wall surface, so as to form a main body; S332. A fourth wall surface is processed on the other side of the second molding area along the thickness direction of the plate, and fourth arc-shaped half-end surfaces are respectively processed from the fourth wall surface at both ends of the second molding area along the length direction of the plate, and the third arc-shaped half-end surface and the fourth arc-shaped half-end surface are connected to form a secondary arc-shaped end surface to form a touch portion.

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