Membrane type keyboard and manufacturing method thereof

Abstract

The invention relates to a film type keyboard and a manufacturing method thereof, and the manufacturing method comprises the following steps: forming a first positioning hole in an upper circuit layer, forming a second positioning hole and a plurality of hollow parts in a spacing layer, forming a third positioning hole in a lower circuit layer, the minimum aperture of the second positioning hole is smaller than that of the third positioning hole; the upper circuit layer, the spacing layer and the lower circuit layer are bonded, and the first positioning hole, the second positioning hole and the third positioning hole jointly form a reset piece positioning hole; and the reset piece positioning hole penetrates through a positioning column of a reset piece assembling jig, and an inner wall of the second positioning hole abuts against the positioning column, so that the central positions of the reset pieces respectively correspond to the central positions of the hollow parts.

Description

Technical Field

[0001] The invention relates to a membrane keyboard and a manufacturing method thereof, and in particular to a method for assembling a reset element of the membrane keyboard to a membrane circuit board. Background Art

[0002] In terms of current computer usage habits, the keyboard is one of the indispensable input devices. Whether it is the computer itself or its peripheral products, they are all developing towards the design concept of light, thin, short and small. Thin keyboards usually use membrane circuit boards, also known as membrane keyboards. Figure 1A is a partial schematic diagram of a conventional membrane keyboard. Figure 1B for Figure 1A Please refer to the top view of the thin film circuit board and reset part shown in Figure 1A and Figure 1B The main components of the membrane keyboard 9 include a membrane circuit board 91, a key cap 92 and a reset member 93. The reset member 93 is, for example, a rubber dome structure, which is disposed between the membrane circuit board 91 and the key cap 92.

[0003] The thin film circuit board 91 includes an upper circuit layer 911, a spacer layer 912 and a lower circuit layer 913. The corresponding surfaces of the upper circuit layer 911 and the lower circuit layer 913 respectively have a conductive circuit C (for example, a circuit configured with a silver paste line). The spacer layer 912 has a hollow portion 912a at a position corresponding to the conductive circuit C. Therefore, when the keycap 92 is pressed, the reset member 93 can press down the upper circuit layer 911, so that the conductive circuits C of the upper circuit layer 911 and the lower circuit layer 913 located in the hollow portion 912a can contact and conduct, thereby generating a corresponding input signal. Therefore, the positioning between the reset member 93 and the hollow portion 912a is quite important.

[0004] The current manufacturing method of the thin film circuit board 91 is to first bond the upper circuit layer 911, the spacer layer 912 (having a hollow portion 912a) and the lower circuit layer 913, and then punch a hole to form a positioning hole 94. Among them, the positioning hole 94 can be used to position the thin film circuit board 91 and the reset member 93 for assembly, and can also be used for positioning the subsequent assembly of the scissor-type connector. Specifically, the thin film circuit board 91 is placed in a jig for assembling the thin film circuit board 91 and the reset member 93. The jig includes a positioning column, and the relative position of the thin film circuit board 91 and the reset member 93 is fixed by passing the positioning hole 94 through the positioning column. If there is no tolerance in the assembly, the central position (for example, the center point) of the reset member 93, the conductive circuit C and the hollow portion 912a will be on the same straight line.

[0005] However, if assembly tolerance occurs when bonding the upper circuit layer 911, the spacer layer 912, and the lower circuit layer 913, the center position of the conductive circuit C may be misaligned with the center position of the hollow portion 912a. When the reset member 93 is subsequently attached, the center position of the reset member 93 may correspond to the center position of the conductive circuit C, but may be misaligned with the center position of the hollow portion 912a. Figure 1A and Figure 1B As shown. In the aforementioned case, the central position of the reset member 93 may correspond to the edge of the hollow portion 912a. When the keycap 92 is pressed and the reset member 93 presses down the upper circuit layer 911, the edge of the hollow portion 912a will block the deformation of the upper circuit layer 911, thereby affecting the smoothness of the user's pressing. In other words, the user must press the keycap 92 hard to effectively trigger and generate an input signal. Therefore, there is still room for improvement in the manufacturing and assembly methods of the membrane circuit board and reset member of the current membrane keyboard. Summary of the invention

[0006] In view of the above problems, the main purpose of the present invention is to provide a membrane keyboard and a manufacturing method thereof, which solves the problems that may be caused by assembly tolerance of the membrane circuit board of the conventional membrane keyboard through a novel design of a reset member positioning hole of a membrane circuit board.

[0007] To achieve the above-mentioned purpose, the present invention provides a method for manufacturing a membrane keyboard, which is used to assemble multiple reset parts in a reset part assembly jig to a membrane circuit board. The method for manufacturing a membrane keyboard includes the following steps: forming at least one first positioning hole in an upper circuit layer, forming at least one second positioning hole and multiple hollow parts in a spacer layer, and forming at least one third positioning hole in a lower circuit layer, wherein a minimum aperture of the second positioning hole is smaller than a minimum aperture of the first positioning hole, and the minimum aperture of the second positioning hole is smaller than a minimum aperture of the third positioning hole; bonding the upper circuit layer, the spacer layer and the lower circuit layer to form a semi-finished membrane circuit board, and the first positioning hole, the second positioning hole and the third positioning hole together form a reset part positioning hole; placing the membrane circuit board on the reset part assembly jig, and passing the reset part positioning hole through a positioning column of the reset part assembly jig, and an inner wall of the second positioning hole abuts against the positioning column, so that a central position of the multiple reset parts corresponds to a central position of the multiple hollow parts respectively; and assembling the multiple reset parts to the membrane circuit board.

[0008] According to an embodiment of the present invention, after forming the positioning hole of the reset member, the manufacturing method further comprises the step of punching a plurality of structural holes in the semi-finished thin film circuit board to form the thin film circuit board.

[0009] According to an embodiment of the present invention, when punching the thin film circuit board semi-finished product to form the plurality of structural holes, at least one assembly positioning hole is formed simultaneously. The assembly positioning hole is used to position the plurality of key structures so that the plurality of structural holes correspond to the plurality of key structures respectively.

[0010] According to an embodiment of the present invention, the upper circuit layer, the spacer layer and the lower circuit layer each include a circuit board positioning hole, and the circuit board positioning hole is used for bonding the upper circuit layer, the spacer layer and the lower circuit layer.

[0011] According to an embodiment of the present invention, the method for manufacturing a membrane keyboard further includes the step of cutting the membrane circuit board semi-finished product to remove the circuit board positioning holes.

[0012] To achieve the above-mentioned purpose, the present invention further provides a membrane keyboard, including a membrane circuit board and a plurality of reset members. The membrane circuit board includes an upper circuit layer, a spacer layer and a lower circuit layer. The upper circuit layer has at least one first positioning hole. The spacer layer has at least one second positioning hole and a plurality of hollow parts. A minimum aperture of the second positioning hole is smaller than a minimum aperture of the first positioning hole. The lower circuit layer has at least one third positioning hole. The minimum aperture of the second positioning hole is smaller than a minimum aperture of the third positioning hole, and the first positioning hole, the second positioning hole and the third positioning hole together form a reset member positioning hole. The plurality of reset members are arranged on the membrane circuit board, and a central position of the plurality of reset members corresponds to a central position of the plurality of hollow parts respectively.

[0013] According to one embodiment of the present invention, the plurality of reset members are placed in a reset member assembly jig before assembly, and a positioning column of the reset member assembly jig is passed through a reset member positioning hole through a thin film circuit board, and an inner wall of a second positioning hole abuts against the positioning column, so that the central positions of the plurality of reset members correspond to the central positions of the plurality of hollow portions respectively.

[0014] According to an embodiment of the present invention, the membrane keyboard further comprises a plurality of key structures disposed on the membrane circuit board, and the plurality of reset members are in contact with the plurality of key structures respectively.

[0015] According to an embodiment of the present invention, the thin film circuit board includes a plurality of structural holes and at least one assembly positioning hole. The plurality of structural holes correspond to the plurality of key structures respectively. The assembly positioning hole is used for assembling and positioning the plurality of key structures.

[0016] According to an embodiment of the present invention, the minimum diameter of the first positioning hole is larger than the minimum diameter of the second positioning hole plus a combination tolerance. The minimum diameter of the third positioning hole is larger than the minimum diameter of the second positioning hole plus a combination tolerance.

[0017] According to an embodiment of the present invention, the assembly tolerance is between 0.15 mm and 3 mm.

[0018] According to an embodiment of the present invention, an inner diameter of the second positioning hole is greater than or equal to an outer diameter of the positioning post.

[0019] According to an embodiment of the present invention, the upper circuit layer includes a plurality of the first positioning holes, the spacing layer includes a plurality of the second positioning holes, and the lower circuit layer includes a plurality of the third positioning holes, so as to form a plurality of the reset member positioning holes.

[0020] As described above, according to the membrane keyboard and its manufacturing method of the present invention, the first positioning hole, the second positioning hole and the third positioning hole are respectively formed in the upper circuit layer, the spacer layer and the lower circuit layer of the membrane circuit board. In addition, the first positioning hole, the second positioning hole and the third positioning hole jointly form a reset member positioning hole. Among them, the minimum aperture of the second positioning hole is smaller than the minimum aperture of the first positioning hole, and the minimum aperture of the second positioning hole is smaller than the minimum aperture of the third positioning hole. Through the special structure of this reset member positioning hole, when the reset member is set on the membrane circuit board, regardless of whether there is a tolerance in the assembly, the central position of the reset member can correspond to the central position of the hollow part respectively, thereby achieving the effect of avoiding affecting the feel and smoothness of the user pressing the keycap. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1A A partial schematic diagram of a conventional membrane keyboard;

[0022] Figure 1B for Figure 1A A simple top view of the thin film circuit board and the reset element shown;

[0023] Figure 2 is a flow chart of a method for manufacturing a membrane keyboard according to an embodiment of the present invention;

[0024] Figure 3 is a schematic diagram of a membrane keyboard according to an embodiment of the present invention;

[0025] Figure 4 for Figure 3 A partial cross-sectional schematic diagram of a membrane keyboard shown;

[0026] Figure 5 Based on Figure 2 A schematic diagram of a semi-finished thin film circuit board formed in step S20 is shown;

[0027] Figure 6 for Figure 5 An enlarged schematic diagram of one of the positioning holes of the reset member is shown;

[0028] Figure 7 for Figure 2 The schematic diagram of step S40 is shown;

[0029] Figure 8 for Figure 4 A simplified schematic diagram of a top view of a thin film circuit board and a reset element is shown.

[0030]

Explanation of symbols

[0031] Membrane keyboard 1, 9

[0032] Thin film circuit board 10, 91

[0033] Thin film circuit board semi-finished product 10a

[0034] Reset piece positioning hole 100

[0035] Circuit board positioning hole 101

[0036] Cut line 102

[0037] Upper circuit layer 11, 911

[0038] The first positioning hole 111

[0039] Upper conduction circuit 112

[0040] Spacer layer 12, 912

[0041] The second positioning hole 121

[0042] Hollow portion 122, 912a

[0043] Lower circuit layer 13, 913

[0044] The third positioning hole 131

[0045] Lower conduction circuit 132

[0046] Structural hole 14

[0047] Assembly positioning hole 15

[0048] Reset 20, 93

[0049] Conductive column 21

[0050] Key structure 30

[0051] Keycaps 31, 92

[0052] Reset assembly fixture 8

[0053] Positioning column 81

[0054] Positioning hole 94

[0055] Conducting circuit C

[0056] Minimum aperture H1, H2, H3

[0057] Steps S10 to S50 DETAILED DESCRIPTION

[0058] In order to better understand the technical content of the present invention, preferred specific embodiments are described below.

[0059] Figure 2 is a flow chart of a method for manufacturing a membrane keyboard according to an embodiment of the present invention; Figure 3 is a schematic diagram of a membrane keyboard according to an embodiment of the present invention; Figure 4 for Figure 3 A partial cross-sectional schematic diagram of a membrane keyboard shown; Figure 5 Based on Figure 2 A schematic diagram of a semi-finished thin film circuit board formed in step S20 is shown; Figure 6 for Figure 5 An enlarged schematic diagram of one of the positioning holes of the reset member is shown; Figure 7 for Figure 2 The schematic diagram of step S40 is shown; and Figure 8 for Figure 4 The following description should be combined with the above-mentioned figure.

[0060] Please refer to Figure 3 and Figure 4 As shown, the membrane keyboard 1 of this embodiment includes a membrane circuit board 10, a plurality of reset members 20 and a plurality of key structures 30. It should be noted that: Figure 4 It is a schematic diagram of the thin film circuit board 10 and the reset member 20 corresponding to one of the key structures 30. Generally speaking, the membrane keyboard 1 also has a base plate (not shown), the thin film circuit board 10 is arranged above the base plate, and the key structure 30 is arranged above the thin film circuit board 10. In addition, the base plate has a plurality of hooks. The key structure 30 includes a keycap 31 and a scissor-type connector (not shown). The scissor-type connector connects the keycap 31 and the base plate so that the scissor-type connector can guide the keycap 31 to rise and fall relative to the base plate. The reset member 20 is arranged between the thin film circuit board 10 and the key structure 30, and the reset member 20 contacts the keycap 31 of the key structure 30. When the keycap 31 is pressed, the reset member 20 can trigger the switch of the thin film circuit board 10. Then, the reset member 20 can guide the keycap 31 to return to its original position. The following combination Figure 2 The manufacturing method of the thin film circuit board 10 of this embodiment and its assembly with the restoring member 20 are further described. Preferably, the restoring member 20 can be a rubber dome. However, the present invention is not limited to the sequence of the steps in the following embodiments.

[0061] Step S10 : forming at least one first positioning hole 111 in an upper circuit layer 11 , forming at least one second positioning hole 121 and a plurality of hollow portions 122 in a spacing layer 12 , and forming at least one third positioning hole 131 in a lower circuit layer 13 .

[0062] Specifically, in step S10, an upper circuit layer 11, a spacer layer 12, and a lower circuit layer 13 are provided for making a thin film circuit board 10. The upper circuit layer 11 includes an upper conductive circuit 112, and the lower circuit layer 13 includes a lower conductive circuit 132. The upper conductive circuit 112 and the lower conductive circuit 132 may be, for example, circuits configured with silver paste lines. In addition, the upper circuit layer 11, the spacer layer 12, and the lower circuit layer 13 may all be plastic films, which may be, for example but not limited to, polyethyleneterephthalate (PET or PETE for short). In this embodiment, a punching process is used to form a first positioning hole 111 in the upper circuit layer 11, a second positioning hole 121 and a hollow portion 122 are simultaneously formed in the spacer layer 12, and a third positioning hole 131 is formed in the lower circuit layer 13. In other words, the upper circuit layer 11 has a first positioning hole 111. The spacer layer 12 has a second positioning hole 121 and a hollow portion 122. The lower circuit layer 13 has a third positioning hole 131 .

[0063] In this embodiment, a minimum aperture H2 of the second positioning hole 121 is smaller than a minimum aperture H1 of the first positioning hole 111, and the minimum aperture H2 of the second positioning hole 121 is also smaller than a minimum aperture H3 of the third positioning hole 131. Figure 4 and Figure 6 Among them, the minimum apertures H1, H2, and H3 are marked on Figure 4 . It should be noted that the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131 of the present embodiment may be, for example but not limited to, circular, elliptical, or other shaped holes. Therefore, the minimum apertures H1, H2, and H3 of the first positioning hole 111, the second positioning hole 121, and the third positioning hole 131 described herein refer to the minimum spacing between the first positioning hole 111, the second positioning hole 121, and the third positioning hole 131. For example, the minimum aperture of a circular hole is its diameter. The minimum aperture of an elliptical hole is its short axis distance. If it is a hole of other shapes, its minimum aperture is the shortest distance between two opposite sides.

[0064] Step S20 : ​​bonding the upper circuit layer 11 , the spacer layer 12 and the lower circuit layer 13 to form a thin film circuit board semi-finished product 10 a , wherein the first positioning hole 111 , the second positioning hole 121 and the third positioning hole 131 together form a reset member positioning hole 100 .

[0065] The three plastic films of the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 are coated with glue and stacked so that the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 can be bonded to each other to form a semi-finished film circuit board 10a. Figure 5 At this time, the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131 can jointly form a reset member positioning hole 100, such as Figure 4 and Figure 6 It should be noted that in order to clearly show the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131, Figure 6 The upper circuit layer 11 and the spacer layer 12 are shown as partial structures. Since the minimum aperture H2 of the second positioning hole 121 is smaller than the minimum aperture H1 of the first positioning hole 111 and also smaller than the minimum aperture H3 of the third positioning hole 131, a structure is formed in which a portion of the spacer layer 12 protrudes from the reset member positioning hole 100 (i.e., the position of the second positioning hole 121).

[0066] As mentioned above, the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131 can be, for example, but not limited to, circular, elliptical, or other shaped holes. Correspondingly, the positioning hole 100 of the reset member formed after bonding can also be, for example, but not limited to, circular, elliptical, or other shaped holes. Generally speaking, the positioning column (or positioning needle) method is often used for positioning objects. This method requires the use of at least two positioning columns to achieve the positioning effect. The first positioning opening on the object (such as the thin film circuit board semi-finished product 10a) is usually a circular hole (for example Figure 6 The reset member positioning hole 100 is shown in the center, while the other positioning holes are elliptical holes (e.g. Figure 6 The reset member positioning holes 100 shown near the left and right sides are or long slot holes. For example, depending on whether the normal state of the object is left-right deformation or up-down deformation, a horizontal elliptical hole or a vertical elliptical hole is selected.

[0067] Preferably, the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 of the present embodiment each include a circuit board positioning hole 101, such as Figure 5 As shown. The circuit board positioning hole 101 is used to bond the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13. It should be noted that since the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 are stacked on each other (such as Figure 5 As shown in FIG. 1 , the circuit board positioning holes 101 of the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 together form a through hole, so the same element numbers are used, and Figure 5A circuit board positioning hole 101 is commonly indicated. Specifically, a corresponding jig can also be used when bonding the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13. The circuit board positioning holes 101 of the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 are respectively passed through the positioning posts of the jig to align the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 with each other.

[0068] In addition, when the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 are stacked on each other, the upper conductive circuit 112 of the upper circuit layer 11 and the lower conductive circuit 132 of the lower circuit layer 13 correspond to the hollow portion 122 of the spacer layer 12. That is, the upper conductive circuit 112 and the lower conductive circuit 132 are partially accommodated in the hollow portion 122. When the key cap 31 is pressed, the reset member 20 presses down the upper circuit layer 11, so that the upper conductive circuit 112 and the lower conductive circuit 132 located in the hollow portion 122 contact each other to generate a trigger signal.

[0069] If there is no tolerance in the assembly, the central positions (e.g., the center of the circle) of the upper conductive circuit 112, the lower conductive circuit 132, and the hollow portion 122 can be on the same straight line or at a position close to the same straight line. If there is a tolerance in the assembly, the central position of the upper conductive circuit 112 or the lower conductive circuit 132 may be misaligned with the central position of the hollow portion 122, such as Figure 4 and Figure 8 As shown. Since the membrane keyboard 1 and its manufacturing method disclosed in the present invention are used to solve the problem that the upper conducting circuit 112 and the lower conducting circuit 132 may not be triggered smoothly due to assembly tolerance, Figure 4 and Figure 8 All of them are taken as examples with group tolerance.

[0070] Preferably, the minimum aperture H1 of the first positioning hole 111 is larger than the minimum aperture H2 of the second positioning hole 121 plus a combination tolerance. Similarly, the minimum aperture H3 of the third positioning hole 131 is larger than the minimum aperture H2 of the second positioning hole 121 plus the combination tolerance. Specifically, the combination tolerance may include the tolerance of punching the first positioning hole 111, the second positioning hole 121, and the third positioning hole 131, as well as the misalignment tolerance when the upper circuit layer 11, the spacer layer 12, and the lower circuit layer 13 are bonded. Preferably, the combination tolerance may be between 0.15 millimeters (mm) and 3 millimeters. For example, the minimum aperture H2 of the second positioning hole 121 of the present embodiment is 3.5 millimeters, so the minimum aperture H1 and the minimum aperture H3 may be greater than 3.65 millimeters, or greater than 6.5 millimeters. Since the minimum aperture H1 of the first positioning hole 111 and the minimum aperture H3 of the third positioning hole 131 are both larger than the minimum aperture H2 of the second positioning hole 121 plus the assembly tolerance, even if there is an assembly tolerance when the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 are attached, the second positioning hole 121 will not be blocked by the upper circuit layer 11 or the lower circuit layer 13. That is, the structure can ensure that part of the spacer layer 12 protrudes from the positioning hole 100 of the reset member (i.e., the position of the second positioning hole 121), such as Figure 6 shown.

[0071] Step S30 : punching a plurality of structural holes 14 and at least one assembly positioning hole 15 in the thin film circuit board semi-finished product 10 a , and cutting the thin film circuit board semi-finished product 10 a to form the thin film circuit board 10 .

[0072] Next, the thin film circuit board semi-finished product 10a is punched to simultaneously form the structural hole 14 and the assembly positioning hole 15. The positions and shapes of the structural hole 14 and the assembly positioning hole 15 can be referred to. Figure 5 It should be noted that Figure 5 The thin film circuit board semi-finished product 10a shown is a punched and cut structure, so the structural hole 14 and the assembly positioning hole 15 are represented by dotted lines. Preferably, when the thin film circuit board semi-finished product 10a of this embodiment is punched to form the structural hole 14, the assembly positioning hole 15 is formed at the same time. The assembly positioning hole 15 of this embodiment is used for positioning the subsequent assembly of the key structure 30, so that the structural hole 14 can correspond to the key structure 30 respectively. Specifically, the structural hole 14 is used for the hook of the base plate to pass through, so that the scissor-type connector of the key structure 30 can be connected to the hook, and then the key structure 30 is assembled to the base plate. In the subsequent assembly procedure (after step S50), the position of the structural hole 14 must correspond to the hook of the base plate and the scissor-type connector of the key structure 30. Therefore, the assembly positioning hole 15 is used to position the jig for assembling the key structure 30.

[0073] In addition, step S30 may further include cutting the thin film circuit board semi-finished product 10a to remove the circuit board positioning hole 101 to form the thin film circuit board 10. Figure 5 The cutting line 102 near the outer side of the thin film circuit board semi-finished product 10a is cut to remove the circuit board positioning hole 101 that assists the alignment of the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 in step S20, and form a thin film circuit board 10 that can be assembled with the reset member 20.

[0074] Step S40 : The thin film circuit board 10 is placed on the reset member assembly jig 8 , and the reset member positioning hole 100 passes through the positioning post 81 of the reset member assembly jig 8 , and an inner wall of the second positioning hole 121 abuts against the positioning post 81 , so that the center of the reset member 20 corresponds to the center of the hollow portion 122 .

[0075] The reset member assembly jig 8 includes at least one positioning column 81. The number of the positioning columns 81 may correspond to the reset member positioning holes 100. In this embodiment, the number of the reset member positioning holes 100 is three. Figure 5 Correspondingly, the reset component assembly fixture 8 also has three positioning posts 81. Figure 7 Take one of the positioning posts 81 as an example.

[0076] like Figure 7 As shown, in operation, the reset member 20 can be placed in the reset member assembly jig 8 first, and the bottom surface of the reset member 20 faces upward. Then, the upper circuit layer 11 of the thin film circuit board 10 is directed toward the reset member 20, and the reset member positioning holes 100 are respectively passed through the positioning posts 81 of the reset member assembly jig 8, so that the thin film circuit board 10 is placed in the reset member assembly jig 8. Since the minimum aperture H2 of the second positioning hole 121 is smaller than the minimum aperture H1 of the first positioning hole 111 and the minimum aperture H3 of the third positioning hole 131, an inner wall of the second positioning hole 121 will abut against the positioning post 81, so that the central position of the reset member 20 corresponds to the central position of the hollow portion 122.

[0077] As mentioned above, the thin film circuit board 10 of this embodiment has three reset member positioning holes 100, which can prevent the thin film circuit board 10 from rotating relative to the positioning column 81, so as to achieve a better positioning effect. In other embodiments, the number of the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131 can also be one, so as to form a reset member positioning hole 100. By adjusting the shape of the reset member positioning hole 100 and the positioning column 81, or by setting other positioning structures, the same positioning effect can be achieved, and the present invention is not limited thereto.

[0078] Since the minimum aperture H2 of the second positioning hole 121 is smaller than the minimum aperture H1 of the first positioning hole 111 and smaller than the minimum aperture H3 of the third positioning hole 131, when the positioning hole 100 of the reset member passes through the positioning column 81, the inner wall of the second positioning hole 121 can abut against the positioning column 81. Figure 7 In other words, the positioning is actually performed by the second positioning hole 121 of the spacer layer 12. Therefore, the central position of the reset member 20 can correspond to the central position of the hollow portion 122. Here, it means that the central position of the reset member 20 and the central position of the hollow portion 122 are on the same straight line or at a position close to the same straight line, such as Figure 7 Dotted line shown.

[0079] In addition, since the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131 are formed before the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13 are bonded (that is, step S10 of forming the first positioning hole 111, the second positioning hole 121 and the third positioning hole 131 is earlier than step S20 of bonding the upper circuit layer 11, the spacer layer 12 and the lower circuit layer 13), and positioning is performed by the second positioning hole 121 of the spacer layer 12, even if there is an assembly tolerance in step S20, it will not affect the correspondence between the central position of the hollow portion 122 and the central position of the reset member 20.

[0080] The minimum aperture H2 of the second positioning hole 121 is greater than or equal to the maximum width of the positioning column 81, so that the second positioning hole 121 can be located outside the positioning column 81. For example, the maximum width of the positioning column 81 is 3.4 mm, and preferably, the minimum aperture H2 of the second positioning hole 121 can be 3.5 mm. In other words, the minimum aperture H2 of the second positioning hole 121 of this embodiment is slightly greater than the maximum width of the positioning column 81, so that the second positioning hole 121 can be sleeved on the outside of the positioning column 81.

[0081] Step S50 : assembling the restoring member 20 to the thin film circuit board 10 .

[0082] Next, the reset member 20 is assembled to the thin film circuit board 10. For example, an adhesive is applied to the bottom surface of the reset member 20 so that the bottom surface of the reset member 20 is bonded to the upper circuit layer 11 of the thin film circuit board 10. After bonding, the center position of the reset member 20 also corresponds to the center position of the hollow portion 122, such as Figure 4 and Figure 8As shown. As mentioned above, this embodiment takes the assembly tolerance in step S20 as an example, so the central position of the upper conductive circuit 112 and the lower conductive circuit 132 is misaligned with the central position of the hollow portion 122, and the two are separated by a distance. In step S40, this embodiment uses the second positioning hole 121 of the spacing layer 12 and the positioning column 81 to perform positioning, so that the central position of the reset member 20 can correspond to the central position of the hollow portion 122. Generally speaking, the reset member 20 has a conductive column 21. Through the structure of the reset member positioning hole 100 of this embodiment, the conductive column 21 can correspond to the central position of the hollow portion 122, rather than the central position of the upper conductive circuit 112 or the lower conductive circuit 132.

[0083] Therefore, when the key cap 31 is pressed, the conductive pillar 21 of the reset member 20 can be driven to press the upper circuit layer 11 downward, and the upper circuit layer 11 can move toward the hollow portion 122 and deform, thereby making the upper conductive circuit 112 contact with the lower conductive circuit 132 (such as Figure 4 As shown in FIG. 1 , a trigger signal is generated. Even though the conductive column 21 of the reset element 20 of the present embodiment does not correspond to the central position of the upper conductive circuit 112, the upper conductive circuit 112 and the lower conductive circuit 132 only need to partially contact to effectively generate a trigger signal. In addition, since the conductive column 21 can correspond to the central position of the hollow portion 122, it will not be affected by the edge of the hollow portion 122, and thus will not affect the deformation mode of the reset element 20. Therefore, according to Figure 2 The thin film circuit board 10 and the reset member 20 assembled by the manufacturing method will not affect the feel and smoothness of the user pressing the key cap 31 due to the assembly tolerance.

[0084] It should also be noted that the manufacturing method of the membrane keyboard 1 of the present embodiment mainly relates to the manufacturing process of the membrane circuit board 10 (e.g., the steps of forming the first positioning hole 111, the second positioning hole 121, the third positioning hole 131 and the reset member positioning hole 100) and the structural features (e.g., the minimum aperture H2 of the second positioning hole 121 is smaller than the minimum aperture H1 of the first positioning hole 111, and also smaller than the minimum aperture H3 of the third positioning hole 131), and the content of assembling the reset member 20 in the reset member assembly jig 8 to the membrane circuit board 10 (e.g., step S40). The subsequent steps of assembling the key structure 30 belong to the common manufacturing procedures in the technical field of the present invention and are not described in detail here.

[0085] In summary, according to the membrane keyboard and its manufacturing method of the present invention, the first positioning hole, the second positioning hole and the third positioning hole are respectively formed in the upper circuit layer, the spacer layer and the lower circuit layer of the membrane circuit board. In addition, the first positioning hole, the second positioning hole and the third positioning hole jointly form a reset member positioning hole. Among them, the minimum aperture of the second positioning hole is smaller than the minimum aperture of the first positioning hole, and the minimum aperture of the second positioning hole is smaller than the minimum aperture of the third positioning hole. Through the special structure of this reset member positioning hole, when the reset member is set on the membrane circuit board, regardless of whether there is a tolerance in the assembly, the central position of the reset member can correspond to the central position of the hollow part respectively, thereby achieving the effect of avoiding affecting the smoothness of the reset member generating the trigger signal and avoiding affecting the feel and smoothness of the user pressing the keycap.

[0086] It should be noted that the above embodiments are provided for the purpose of illustration, and the scope of rights claimed by the present invention should be based on the claims, rather than being limited to the above embodiments.

Claims

1. A method for manufacturing a membrane keyboard, characterized in that: The invention is applied to assembling a plurality of reset parts in a reset part assembly jig to a thin film circuit board. The manufacturing method of the thin film keyboard comprises the following steps: At least one first positioning hole is formed in an upper circuit layer, at least one second positioning hole and a plurality of hollow parts are formed in a spacing layer, and at least one third positioning hole is formed in a lower circuit layer, wherein a minimum aperture of the second positioning hole is smaller than a minimum aperture of the first positioning hole, and the minimum aperture of the second positioning hole is smaller than a minimum aperture of the third positioning hole; The upper circuit layer, the spacer layer and the lower circuit layer are bonded together to form a thin film circuit board semi-finished product, and the first positioning hole, the second positioning hole and the third positioning hole together form a reset member positioning hole; The thin film circuit board is placed on the reset member assembly jig, and the reset member positioning hole passes through a positioning post of the reset member assembly jig, an inner wall of the second positioning hole abuts against the positioning post, so that a central position of the plurality of reset members corresponds to a central position of the plurality of hollow portions respectively; and The plurality of reset elements are assembled to the thin film circuit board.

2. The method for manufacturing a membrane keyboard according to claim 1, wherein: The minimum aperture of the first positioning hole is larger than the minimum aperture of the second positioning hole plus a combination tolerance, and the minimum aperture of the third positioning hole is larger than the minimum aperture of the second positioning hole plus the combination tolerance.

3. The method for manufacturing a membrane keyboard according to claim 2, wherein: The assembly tolerance is between 0.15 mm and 3 mm.

4. The method for manufacturing a membrane keyboard according to claim 1, wherein: An inner diameter of the second positioning hole is greater than or equal to an outer diameter of the positioning column.

5. The method for manufacturing a membrane keyboard according to claim 1, wherein: The upper circuit layer includes a plurality of the first positioning holes, the spacing layer includes a plurality of the second positioning holes, and the lower circuit layer includes a plurality of the third positioning holes, so as to form a plurality of the reset member positioning holes.

6. The method for manufacturing a membrane keyboard according to claim 1, wherein: After forming the positioning hole of the reset member, the method further comprises the following steps: A plurality of structural holes are punched in the semi-finished thin film circuit board to form the thin film circuit board.

7. The method for manufacturing a membrane keyboard according to claim 6, wherein: When the thin film circuit board semi-finished product is punched to form the multiple structural holes, at least one assembly positioning hole is formed at the same time. The assembly positioning hole is used for positioning the assembly of multiple key structures so that the multiple structural holes correspond to the multiple key structures respectively.

8. The method for manufacturing a membrane keyboard according to claim 1, wherein: The upper circuit layer, the spacing layer and the lower circuit layer respectively include a circuit board positioning hole, and the circuit board positioning hole is used for bonding the upper circuit layer, the spacing layer and the lower circuit layer for positioning.

9. The method for manufacturing a membrane keyboard according to claim 8, wherein: Also includes the steps: The thin film circuit board semi-finished product is cut to remove the circuit board positioning hole.

10. A membrane keyboard, characterized in that: include: A thin film circuit board, comprising: An upper circuit layer having at least one first positioning hole; a spacing layer having at least one second positioning hole and a plurality of hollow portions, wherein a minimum aperture of the second positioning hole is smaller than a minimum aperture of the first positioning hole; and A lower circuit layer has at least one third positioning hole, the minimum aperture of the second positioning hole is smaller than a minimum aperture of the third positioning hole, and the first positioning hole, the second positioning hole and the third positioning hole together form a reset member positioning hole; and A plurality of resetting members are arranged on the thin film circuit board, and a central position of the plurality of resetting members corresponds to a central position of the plurality of hollow parts respectively.

11. The membrane keyboard according to claim 10, characterized in that: The multiple reset members are placed in a reset member assembly jig before assembly, and the thin film circuit board passes through a positioning column of the reset member assembly jig through the reset member positioning hole, and an inner wall of the second positioning hole abuts against the positioning column, so that the central positions of the multiple reset members correspond to the central positions of the multiple hollow portions respectively.

12. The membrane keyboard according to claim 11, characterized in that: The minimum aperture of the first positioning hole is larger than the minimum aperture of the second positioning hole plus a combination tolerance, and the minimum aperture of the third positioning hole is larger than the minimum aperture of the second positioning hole plus the combination tolerance.

13. The membrane keyboard according to claim 12, characterized in that: The assembly tolerance is between 0.15 mm and 3 mm.

14. The membrane keyboard according to claim 11, characterized in that: An inner diameter of the second positioning hole is greater than or equal to an outer diameter of the positioning column.

15. The membrane keyboard according to claim 10, characterized in that: The upper circuit layer includes a plurality of the first positioning holes, the spacing layer includes a plurality of the second positioning holes, and the lower circuit layer includes a plurality of the third positioning holes, so as to form a plurality of the reset member positioning holes.

16. The membrane keyboard according to claim 10, characterized in that: Also includes: A plurality of key structures are arranged on the film circuit board, and the plurality of reset components are respectively in contact with the plurality of key structures.

17. The membrane keyboard according to claim 16, characterized in that: The thin film circuit board comprises a plurality of structural holes and at least one assembly positioning hole. The plurality of structural holes correspond to the plurality of key structures respectively, and the assembly positioning hole is used for assembling and positioning the plurality of key structures.

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