Substrate transfer chamber precursor and method of manufacturing substrate transfer chamber

Abstract

Substrate processing systems and methods have extended substrate processing capabilities. For such a system, standard substrate handling chamber precursors may be used to form substrate handling chamber bodies of different types and different regions of a substrate processing system. Such a substrate handling chamber precursor may include an external shape, where a majority of the substrate handling chamber precursor may be used for two (or more) different types of substrate handling chamber bodies. During the polishing process, the standard precursor may be polished in different ways and substrate handling chamber bodies having different numbers of facets, different shapes, and for different locations in a substrate processing system are formed by removing different amounts of material.

Description

Technical Field

[0001] The present disclosure generally relates to substrate processing systems with expanded substrate processing capabilities. Some more specific aspects of the technology relate to substrate handling chamber precursors that can be used to make two (or more) different types of substrate handling chamber bodies. Other aspects of the technology relate to methods of using standard substrate handling chamber precursors to make different types of substrate handling chamber bodies for different areas of a substrate processing system. Background Art

[0002] During the manufacture of semiconductor devices, such as integrated circuits and electronic devices, material layers are typically deposited onto a substrate. Material layer deposition is typically accomplished by supporting the substrate within a substrate processing chamber arrangement, heating the substrate to a desired deposition temperature, and flowing one or more material layer precursor gases through the chamber arrangement and across the substrate. As the precursor gases flow through the substrate, a material layer is gradually formed on the surface of the substrate, typically depending on the temperature of the substrate and the environmental conditions within the chamber arrangement.

[0003] In a cluster-type semiconductor vacuum processing tool, multiple substrate processing chambers may be coupled to a single substrate handling chamber that moves substrates in and out of the substrate processing chambers, as well as in and out of the entire substrate processing system. Such a system allows multiple substrates to be processed simultaneously using some common equipment.

[0004] Conventional semiconductor production systems and methods are generally acceptable for their intended purposes, but there is room for improvement. For example, other methods of improving production efficiency, increasing yield, reducing costs and / or simplifying the production process would be a welcome advancement in the art. Summary of the invention

[0005] Various aspects of the technology relate to substrate processing systems and methods with expanded substrate processing capabilities. Some more specific aspects of the technology relate to substrate handling chamber precursors that can be used to make two (or more) different types of substrate handling chamber bodies. Other aspects of the technology relate to methods of using standard substrate handling chamber precursors to make different types of substrate handling chamber bodies for different areas of a substrate processing system.

[0006] A substrate handling chamber precursor according to at least some examples of the present technology includes one or more of the following: (a) a main body portion including a first major surface, a second major surface opposite the first major surface, and a plurality of facets forming a side wall extending between the first major surface and the second major surface; (b) a protrusion extending from the second major surface and in a direction away from the first major surface, wherein the main body portion and the protrusion are formed as a single single-piece forged component; (c) a first groove extending inwardly from the first major surface, the first groove including a bottom surface; and / or (d) a through hole opening extending from the bottom surface of the first groove through the protrusion.

[0007] In addition to or as an alternative to one or more of the features described above, in at least some examples of the present technology, the protrusion will include a cylindrical structure extending from the second major surface.

[0008] In addition to or instead of one or more of the features described above, in at least some examples of the technology, the first groove will define a circular perimeter having a first diameter and the through-hole opening will define a circular perimeter having a second diameter, wherein the second diameter is less than half the first diameter.

[0009] In addition to or as an alternative to one or more of the features described above, in at least some examples of the present technology, the plurality of facets forming the sidewalls of the body portion will form a hexagonal shape.

[0010] In addition to or instead of one or more of the features described above, in at least some examples of the technology, the plurality of facets will include: (a) a first facet, (b) a second facet extending from the first facet at a first angle, (c) a third facet extending from the first facet at a second angle, (d) a fourth facet extending from the second facet at a third angle, (e) a fifth facet extending from the third facet at a fourth angle, and (f) a sixth facet extending between the fourth facet and the fifth facet.

[0011] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, the second angle will be substantially equal to the first angle and / or the third angle will be substantially equal to the fourth angle.

[0012] In addition to or in lieu of one or more of the features described above, in at least some examples of the technology, the third angle will be at least 30 degrees greater than the first angle.

[0013] In addition to or instead of one or more of the features described above, in at least some examples of the technology, the sixth facet will extend from the fourth facet at a fifth angle, and the sixth facet will extend from the fifth facet at a sixth angle, wherein the fifth angle is substantially equal to the sixth angle.

[0014] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, the third angle will be at least 30 degrees greater than the first angle and / or at least 30 degrees greater than the fifth angle.

[0015] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, each of the first facet and the sixth facet will be wider than each of the second facet, the third facet, the fourth facet, and the fifth facet.

[0016] In addition to or instead of one or more of the features described above, in at least some examples of the technology, each of the first, second, third, and sixth facets will be at least 1.3 times wider than each of the fourth and fifth facets.

[0017] Methods for manufacturing substrate processing chambers according to at least some examples of the present technology may include one or more of the following: (a) providing a first substrate handling chamber precursor and a second substrate handling chamber precursor, the first substrate handling chamber precursor having a first set of dimensions, the second substrate handling chamber precursor having a second set of dimensions, the second set of dimensions being substantially equal to corresponding dimensions in the first set of dimensions, such that the first substrate handling chamber precursor and the second substrate handling chamber precursor are substantially identical in size and shape; (b) processing the first substrate handling chamber precursor to remove a first amount of material from the first substrate handling chamber precursor to form a first substrate handling chamber body, wherein the first substrate handling chamber precursor is provided with a first substrate handling chamber body and a second substrate handling chamber body having a second set of dimensions, the second set of dimensions being substantially equal to corresponding dimensions in the first set of dimensions; The bottom handling chamber body includes a first outer perimeter shape having a first number of facets located around the first substrate handling chamber body and forming a first side wall of the first substrate handling chamber body; and (c) processing a second substrate handling chamber precursor to remove a second amount of material from the second substrate handling chamber precursor to form a second substrate handling chamber body, wherein the second substrate handling chamber body includes a second outer perimeter shape having a second number of facets located around the second substrate handling chamber body and forming a second side wall of the second substrate handling chamber body, wherein the second number of facets is less than the first number of facets, and wherein the second amount of material is greater than the first amount of material.

[0018] In addition to or instead of one or more of the features described above, in at least some examples of the technology, each of the first substrate handling chamber precursor and the second substrate handling chamber precursor will have a main body portion including a first major surface, a second major surface opposite the first major surface, and a plurality of facets forming a sidewall extending between the first major surface and the second major surface.

[0019] In addition to or instead of one or more of the features described above, in at least some examples of the technology, each of the first substrate handling chamber precursor and the second substrate handling chamber precursor may also include a protrusion extending from the second major surface in a direction away from the first major surface, wherein the main body and the protrusion are formed as a single single-piece forged component.

[0020] In addition to or instead of one or more of the features described above, in at least some examples of the technology, each of the first substrate handling chamber precursor and the second substrate handling chamber precursor can also include a first groove extending inwardly from the first major surface, the first groove including a bottom surface.

[0021] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, each of the first substrate handling chamber precursor and the second substrate handling chamber precursor may further include a through hole opening extending from a bottom surface of the first recess through the protrusion.

[0022] In addition to or instead of one or more of the features described above, in at least some examples of the technology, the first groove will define a circular perimeter having a first diameter and the through-hole opening will define a circular perimeter having a second diameter, wherein the second diameter is less than half the first diameter.

[0023] In addition or alternatively to one or more of the features described above, in at least some examples of the technology, the protrusion of each of the first substrate handling chamber precursor and the second substrate handling chamber precursor includes a cylindrical structure extending from the second major surface.

[0024] In addition to or instead of one or more of the features described above, in at least some examples of the technology, a first number of facets forming a first sidewall of the first substrate handling chamber body includes at least six facets, and / or a second number of facets forming a second sidewall of the second substrate handling chamber body includes no more than five facets.

[0025] In addition to or instead of one or more of the features described above, in at least some examples of the technology, each of the first substrate handling chamber precursor and the second substrate handling chamber precursor includes: (a) a first facet, (b) a second facet extending from the first facet at a first angle, (c) a third facet extending from the first facet at a second angle, (d) a fourth facet extending from the second facet at a third angle, (e) a fifth facet extending from the third facet at a fourth angle, and (f) a sixth facet extending between the fourth facet and the fifth facet.

[0026] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, the second angle will be substantially equal to the first angle and / or the third angle will be substantially equal to the fourth angle.

[0027] In addition to or instead of one or more of the features described above, in at least some examples of the technology, the sixth facet will extend from the fourth facet at a fifth angle, and / or the sixth facet will extend from the fifth facet at a sixth angle, wherein the fifth angle is substantially equal to the sixth angle.

[0028] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, the third angle will be at least 30 degrees greater than the first angle and / or at least 30 degrees greater than the fifth angle.

[0029] In addition to or as an alternative to one or more of the features described above, in at least some examples of the technology, each of the first facet and the sixth facet will be wider than each of the second facet, the third facet, the fourth facet, and the fifth facet.

[0030] In addition to or instead of one or more of the features described above, in at least some examples of the technology, each of the first, second, third, and sixth facets will be at least 1.3 times wider than each of the fourth and fifth facets.

[0031] In addition to or instead of one or more of the features described above, in at least some examples of the technology, the first substrate handling chamber precursor and the second substrate handling chamber precursor are provided as part of a precursor inventory for forming a plurality of substrate handling chamber bodies, wherein each precursor in the inventory includes a set of dimensions that are substantially equal to corresponding dimensions in the first set of dimensions such that all precursors in the inventory have substantially the same size and shape.

[0032] In addition to or instead of one or more of the above features, in at least some examples of the technology: (i) a first substrate handling chamber body is formed to include: (a) a first top surface, (b) a first bottom surface opposite to the first top surface, and (c) a first chamber extending inward from the first top surface, and wherein the method further includes: engaging a first cover with the first substrate handling chamber body, wherein the size, shape and movable position of the first cover are configured to cover a first opening leading to the first chamber at the first top surface; and / or (ii) a second substrate handling chamber body is formed to include: (a) a second top surface, (b) a second bottom surface opposite to the second top surface, and (c) a second chamber extending inward from the second top surface, and wherein the method further includes: engaging a second cover with the second substrate handling chamber body, wherein the size, shape and movable position of the second cover are configured to cover a second opening leading to the second chamber at the second top surface.

[0033] In addition to one or more of the features described above, or as an alternative, in at least some examples of the technology: (i) the first substrate handling chamber body is formed to include: (a) a first top surface, (b) a first bottom surface opposite to the first top surface, (c) a first chamber extending inwardly from the first top surface to the first inner bottom surface, and (d) a first through-hole opening extending from the first inner bottom surface to the first bottom surface, and wherein the method further includes: placing a first substrate transfer robot in the first chamber so that a first portion of the first substrate transfer robot extends into the first through-hole opening below the first inner bottom surface; and / or (ii) the second substrate handling chamber body is formed to include: (a) a second top surface, (b) a second bottom surface opposite to the second top surface, (c) a second chamber extending inwardly from the second top surface to the second inner bottom surface, and (d) a second through-hole opening extending from the second inner bottom surface to the second bottom surface, and wherein the method further includes: placing a second substrate transfer robot in the second chamber so that a second portion of the second substrate transfer robot extends into the second through-hole opening below the second inner bottom surface.

[0034] The present invention is provided to introduce some concepts related to the technology in a simplified form. These concepts are further described in detail in the detailed description of the examples of the following disclosure. The present invention is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] These and other features, aspects and advantages of the present invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than to limit the present invention.

[0036] Figure 1 is a schematic diagram of an expanded cluster-type substrate processing system that may incorporate and / or utilize aspects of the technology;

[0037] FIG. 2A to FIG. 2D Various views of a substrate handling chamber precursor according to some examples of the technology are provided;

[0038] FIG. 3A to FIG. 3C Various views are provided illustrating features and use of a standard substrate processing chamber precursor according to some examples of the technology; and

[0039] FIG. 4A to FIG. 4C Various features of structures, methods, and components of substrate handling chambers according to some examples of the technology are shown.

[0040] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative sizes of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION

[0041] Reference will now be made to the drawings, wherein like reference numerals represent similar structural features or aspects of the subject disclosure.

[0042] Figure 1 A top view of a substrate processing system 100 (e.g., a cluster-type semiconductor processing system) with extended substrate processing capabilities according to some examples of the present technology is schematically shown. Compared to conventional cluster-type semiconductor processing systems, the substrate processing system 100 expands substrate processing capabilities by at least adding additional substrate handling chambers and one or more additional substrate processing chambers. Various aspects of the present technology can be used for and / or produce substrate processing systems (e.g., cluster-type semiconductor processing systems) with extended substrate processing capabilities of the type described in U.S. Provisional Patent Application No. 63 / 524,272, entitled “Extended Substrate Processing Systems and Methods with Additional Processing Chamber Connectability,” filed on June 30, 2023. U.S. Provisional Patent Application No. 63 / 524,272 is incorporated herein by reference in its entirety.

[0043] like Figure 1 As shown, the example extended substrate processing system 100 includes: (a) a first substrate handling chamber 300 ("inside" substrate handling chamber), including a first robot 320 with an end effector 320A; (b) a first load lock module 400 ("inside" load lock module), which is connected to one edge or facet of the first substrate handling chamber 300; (c) a second load lock module 500 ("outside" load lock module), which is connected to the opposite edge or facet of the first substrate handling chamber 300; and (d) a second substrate handling chamber 600 ("outside" substrate processing chamber), including a second robot 620 with an end effector 620A. The second load lock module 500 extends between and connects the first substrate handling chamber 300 and the second substrate handling chamber 600. The first load lock module 400 of this example is also connected to the equipment front end module 700, which includes a third robot 720 with an end effector 720A. The equipment front end module 700 may include or be connected to a nitrogen source for providing a nitrogen atmosphere within the equipment front end module 700. The equipment front end module 700 receives new substrates for processing into the substrate processing system 100 and discharges processed substrates from the substrate processing system 100 via one or more load ports 800A-800D (using a robot 720 to move substrates between the load ports 800A-800D and the first load lock module 400). Figure 1Four loadports 800A-800D are shown in the example of FIG. 1 , but more or fewer loadports may be provided in other specific examples of the technology.

[0044] Each of the first substrate handling chamber 300 and the second substrate handling chamber 600 is connected to a plurality of substrate processing chambers 900. Substrates are transferred into the substrate processing chambers 900, where one or more layers of material are deposited onto the substrate surface and / or other desired substrate processing is performed. Figure 1 Each substrate processing chamber 900 is shown to include four substrate supports 902 on which substrates may be placed during processing. More or fewer substrate supports 902 may be provided in the substrate processing chamber 900 (e.g., the substrate processing chamber 900 may be a dual chamber module (DCM) or a quad chamber module (QCM)). A substrate processing chamber 900 according to some examples of the technology may include an additional four substrate supports 902 located Figure 1 902. Each substrate processing chamber 900 may have the same structure, or one or more substrate processing chambers 900 may have a different structure than other substrate processing chambers 900.

[0045] Each of the first substrate handling chamber 300 and the second substrate handling chamber 600 is connected to its respective substrate processing chamber 900 through one or more gate valves 1000. Although two gate valves 1000 are shown to connect the substrate handling chambers 300, 600 to each of their respective substrate processing chambers 900, in other examples of the technology, each substrate processing chamber 900 may be provided with more or fewer gate valves 1000. The substrate processing chambers 900 according to some examples of the technology may be connected to their respective substrate handling chambers 300, 600 through two additional gate valves 1000, for example, located at Figure 1 600 are vertically below the two gate valves 1000 shown in the top view of . When closed, the gate valves 1000 sealably separate the substrate handling chambers 300, 600 from their respective substrate processing chambers 900 (so that independent atmospheric conditions can be maintained in each chamber). When opened, the gate valves 1000 provide openings (e.g., substrate transfer slots) through which the end effectors 320A, 620A of the robot arms 320, 620 can extend to move substrates into and out of the substrate processing chambers 900. The openings through the gate valves 1000 are aligned with the substrate transfer slots provided in the substrate processing chambers 900 and the substrate handling chambers 300, 600 so that the substrates can be moved between the substrate processing chambers 900 and the substrate handling chambers 300, 600 through the gate valves 1000. Each gate valve 1000 may have the same structure, or one or more gate valves 1000 may have a different structure than other existing gate valves 1000.

[0046] One face of the first load lock module 400 is closed by one or more gate valves 1100A ( Figure 1 Two are shown in FIG. 1 ) are connected to the front end module 700 of the equipment, and the opposite side of the first load lock module 400 is connected through one or more gate valves 1100B ( Figure 1 The first load lock module 400 also includes one or more substrate supports 402 (e.g., “positioning plates”, Figure 1 The gate valves 1100A and 1100B are used to hold substrates while they are waiting to be moved into the equipment front end module 700 or the first substrate handling chamber 300. When closed, the gate valves 1100A, 1100B sealably separate the first load lock module 400 from the equipment front end module 700 and the substrate handling chamber 300 (so that independent atmospheric conditions can be maintained in each chamber). When opened, the gate valve 1100A provides an opening (e.g., a substrate transfer slot) through which the end effector 720A of the robot 720 can extend to move substrates into and out of the equipment front end module 700. The opening through the gate valve 1100A is aligned with the substrate transfer slot provided in the equipment front end module 700 and the first load lock module 400 so that the substrate can be moved between the equipment front end module 700 and the first load lock module 400 through the gate valve 1100A. When opened, the gate valve 1100B provides an opening (e.g., a substrate transfer slot) through which the end effector 320A of the robot 320 can extend to move a substrate into and out of the substrate handling chamber 300. The opening through the gate valve 1100B is aligned with a substrate transfer slot provided in the substrate handling chamber 300 and the first load lock module 400 to enable the substrate to be moved between the substrate handling chamber 300 and the first load lock module 400 through the gate valve 1100B. Each of the gate valves 1100A, 1100B may have the same structure, or one or more of the gate valves 1100A, 1100B may have a different structure than other gate valves 1100A, 1100B, 1000 that exist.

[0047] exist Figure 1 In the substrate processing system 100, one side of the second load lock module 500 is closed by one or more gate valves 1200A ( Figure 1 The second load lock module 500 is connected to the first substrate handling chamber 300 through one or more gate valves 1200B ( Figure 1 The second load lock module 500 also includes one or more substrate supports 502 (e.g., “positioning plates”, Figure 1The gate valves 1200A, 1200B are used to hold substrates while they are waiting to be moved between the two substrate handling chambers 300, 600. When closed, the gate valves 1200A, 1200B sealably separate the second load lock module 500 from the two substrate handling chambers 300, 600 (so that independent atmospheric conditions can be maintained in each chamber). When open, the gate valve 1200A provides an opening (e.g., a substrate transfer slot) through which the end effector 320A of the robot 320 can extend to move substrates into and out of the first substrate handling chamber 300. The opening through the gate valve 1200A is aligned with the substrate transfer slot provided in the first substrate handling chamber 300 and the second load lock module 500 so that the substrate can be moved between the substrate handling chamber 300 and the second load lock module 500 through the gate valve 1200A. When opened, the gate valve 1200B provides an opening (e.g., a substrate transfer slot) through which the end effector 620A of the robot 620 can extend to move a substrate into and out of the second substrate handling chamber 600. The opening through the gate valve 1200B is aligned with a substrate transfer slot provided in the second substrate handling chamber 600 and the second load lock module 500 so that the substrate can be moved between the second substrate handling chamber 600 and the second load lock module 500 through the gate valve 1200B. Each of the gate valves 1200A, 1200B can have the same structure, or one or more of the gate valves 1200A, 1200B can have a different structure from the other gate valves 1200A, 1200B. The gate valves 1200A and / or 1200B can also have the same or different structure as the gate valves 1100A and / or 1100B and / or the gate valve 1000.

[0048] The first load lock module 400 can have the same structure as the second load lock module 500, and / or the first and second load lock modules 400, 500 can be interchangeable (e.g., such that the load lock modules 400, 500 can switch positions and / or have a modular structure). In other examples, the first load lock module 400 and the second load lock module 500 can have different structures and / or be non-interchangeable (e.g., such that the load lock modules 400, 500 cannot switch positions in the substrate processing system 100). Either or both of the load lock modules 400, 500 can be a multi-station cooling type and / or a path-through type.

[0049] The above-described substrate processing system 100 provides manufacturers and end users with additional flexibility, options, and the potential for increased production capacity. For example, a cluster substrate processing system manufacturer may offer customers multiple product line options. As an option, some customers may purchase a cluster substrate processing system such as Figure 1The entire extended substrate processing system 100 is shown, i.e., having two substrate handling chambers 300, 600 and two load lock modules 400, 500. However, other customers may not want or need the expanded and extended substrate processing capabilities. These customers may choose a less expensive cluster-type substrate processing system option in which the inner substrate handling chamber 300 and one of the load lock modules 400 or 500 are removed. Such a substrate processing system may include: (a) a substrate handling chamber 600, which is connected to (b) up to four substrate processing chambers 900, and to (c) one load lock module 400 or 500, and the load lock module 400 or 500 is connected to (d) an equipment front end module 700, and the equipment front end module 700 is connected to (e) one or more loading ports 800A-800D. Therefore, in order to provide a variety of product line options and better meet the needs of all of its potential customers, substrate processing equipment manufacturers may need to produce more substrate handling chambers 600 than substrate handling chambers 300 (because not all customers want Figure 1 A complete, expanded substrate processing system 100 in the form shown).

[0050] However, if Figure 1 As shown, the substrate handling chambers 300, 600 are not interchangeable with each other. The "inside" substrate handling chamber 300 of this example includes six facets: (a) one long facet 300A connected to the first load lock module 400, (b) two long facets 300B, 300C connected to the substrate processing chamber 900, (c) two short facets 300D, 300E, which may include a single substrate transfer groove 252 along the width direction of the facet, and (d) one long facet 300F connected to the second load lock module 500. The "outside" substrate handling chamber 600 of this example includes five facets: (a) one facet 600A connected to the load lock module 500, and (b) four facets 600B, 600C, 600D and 600E connected to the substrate processing chamber 900. Although other options are possible, in Figure 1 In the example of FIG. 6 , the width dimensions (left-right dimensions) of each of the facets 600A- 600E are substantially equal.

[0051] However, despite the differences in overall size and shape, each of the inner substrate handling chamber 300 and the outer substrate handling chamber 600 of this example may be fabricated from a common or standard substrate handling chamber precursor 200 in accordance with aspects of the present technique. Figures 2A-2DVarious views of a standard substrate handling chamber precursor 200 according to various aspects of the present technology are provided. The standard precursor 200 can be further processed (as described in more detail below) to form an inner substrate handling chamber 300 or an outer substrate handling chamber 600. Therefore, a manufacturer (or a supplier to the manufacturer) only needs to maintain this single type of substrate handling chamber precursor 200 in its inventory, and these substrate handling chamber precursors 200 can be used to manufacture either the inner substrate handling chamber 300 or the outer substrate handling chamber 600, depending on the manufacturer's needs at a given time. These features simplify the manufacturer's inventory of substrate handling chamber precursors, can reduce the total inventory volume required (e.g., by not needing to maintain a minimum inventory of two separate precursors), and can help avoid unexpected manufacturing delays by making the precursor 200 usable for both substrate handling chamber 300, 600 configurations. These features can also simplify the manufacturer and / or reduce the tooling required to manufacture the substrate handling chamber precursor 200, as a single set (or single type) of specific tools (e.g., forging hammer, die, anvil, etc.) and a single set of manufacturing process steps can be used to manufacture the substrate handling chamber precursor 200 to produce two (or more) different types of substrate handling chambers 300, 600.

[0052] The substrate handling chamber precursor 200 of this example comprises a forging, such as Figures 2A-2D shown. Figure 2A A top view of the precursor 200 is shown; Figure 2B Shown along Figure 2A A cross-sectional view taken along line BB in FIG. Figure 2C A top perspective view is shown; and Figure 2D A bottom perspective view is shown. Figures 2A-2D The substrate handling chamber precursor 200 can be manufactured into the form shown by a forging process, for example, by forging an aluminum or aluminum alloy raw material billet (such as aluminum 6061-t6) into Figures 2A-2D Sizes and shapes shown. Figures 2A-2D The illustrated exemplary precursor 200 may be formed as a unitary, unitary, one-piece structure.

[0053] like Figures 2A-2D As shown, the example substrate handling chamber precursor 200 includes a body portion 202, which includes a first main surface 202A, a second main surface 202B opposite to the first main surface 202A, and a plurality of facets forming a sidewall between the first main surface 202A and the second main surface 202B. Figures 2A-2DIn a specific example, the sidewall of the substrate handling chamber precursor 200 includes: (a) a first facet 204A, (b) a second facet 204B extending from the first facet 204A at an oblique angle (angle 1), (c) a third facet 204C extending from the first facet 204A at an oblique angle (angle 2), (d) a fourth facet 204D extending from the second facet 204B at an oblique angle (angle 3), (e) a fifth facet 204E extending from the third facet 204C at an oblique angle (angle 4), and (f) a sixth facet 204F extending between the fourth facet 204D and the fifth facet 204E, extending at an oblique angle (angle 5) relative to the fourth facet 204D, and extending at an oblique angle (angle 6) relative to the fifth facet 204E. Therefore, as Figures 2A-2D As shown, the main body 202 of the substrate handling chamber precursor 200 can have a hexagonal shape formed by the side walls (facets 204A-204F). Figure 2C and 2D As shown, in this illustrated example: (a) second major surface 202B also has a hexagonal outer perimeter shape, (b) angles from angle 1 to angle 6 are the same, (c) facets 204A-204F extend perpendicularly between first major surface 202A and second major surface 202B, and (d) facets 204A-204F are planar (or substantially planar). Alternatively, if desired, second major surface 202B can have a different shape and / or different angular dimensions than first major surface 202A (e.g., if the sidewalls formed by facets 204A-204F are not perpendicular to major surfaces 202A, 202B and / or are not planar).

[0054] According to at least some examples of the technology, additional potential features of the geometry of the substrate handling chamber precursor 200 include various relative dimensional features. For example, in at least some examples of the technology: (a) the first facet 204A and the sixth facet 204F can be substantially equal in width (e.g., W1≈W6); (b) the second facet 204B and the third facet 204C can be substantially equal in width (e.g., W2≈W3); and (c) the fourth facet 204D and the fifth facet 204E can be substantially equal in width (e.g., W4≈W5). The term "substantially equal" as used herein in the context of dimensional measurements (e.g., height, width, length, depth, etc.) means that the two measurements being compared (e.g., width) are equal or within 5% of each other (e.g., W1=W6±(W6×0.05)). Additionally or alternatively, if desired, in at least some examples of the present technology, any two or more facets 204A-204F may have a height dimension (entering and exiting the facets) that is "substantially equal" to the height dimension of one or more other facets 204A-204F. Figure 2A ).

[0055] According to at least some examples of the technology, the widths W4 and W5 of fourth facet 204D and fifth facet 204E may be smaller than the widths W1, W2, W3, and W6 of other facets 204A, 204B, 204C, and 204F, respectively. Additionally or alternatively, in some examples of the technology, the widths W2 and W3 of second facet 204B and third facet 204C may be smaller than or "substantially equal to" the widths W1 and W6 of first facet 204A and sixth facet 204F, respectively. In some examples of the technology, at least one of first facet 204A, second facet 204B, third facet 204C, and / or sixth facet 204F will be at least 1.15 times wider than fourth facet 204D and / or fifth facet 204E, and in some examples, at least 1.2 times wider, at least 1.25 times wider, at least 1.3 times wider, or even at least 1.35 times wider. In other words, W1, W2, W3 and / or W6 may be at least 1.15 times (and in some examples, at least 1.2 times, at least 1.25 times, at least 1.3 times, or even at least 1.35 times) greater than W4 and / or W5.

[0056] As some additional and / or alternative specific examples, facets 204A-204F may have any one or more of the following width characteristics and / or properties:

[0057] W4≤0.8×W1 W4≤0.8×W6 W4≤0.8×W2

[0058] W4≤0.8×W3 W5≤0.8×W1 W5≤0.8×W6

[0059] W5≤0.8×W2 W5≤0.8×W3 W2≤0.98×W1

[0060] W2≤0.98×W6 W3≤0.98×W1 W3≤0.98×W6

[0061] W4≥0.5×W1 W4≥0.5×W6 W4≥0.5×W2

[0062] W4≥0.5×W3 W5≥0.5×W1 W5≥0.5×W6

[0063] W5≥0.5×W2 W5≥0.5×W3 W2≥0.9×W1

[0064] W2≥0.9×W6 W3≥0.9×W1 W3≥0.9×W6

[0065] 0.5×W1≤W4≤0.8×W1 0.5×W6≤W4≤0.8×W6

[0066] 0.5×W1≤W5≤0.8×W1 0.5×W6≤W5≤0.8×W6

[0067] 0.6×W1≤W4≤0.75×W1 0.6×W6≤W4≤0.75×W6

[0068] 0.6×W1≤W5≤0.75×W1 0.6×W6≤W5≤0.75×W6

[0069] 0.85×W1≤W2≤0.98×W1 0.85×W6≤W2≤0.98×W6

[0070] 0.85×W1≤W3≤0.98×W1 0.85×W6≤W3≤0.98×W6

[0071] 0.9×W1≤W2≤0.95×W1 0.9×W6≤W2≤0.95×W6

[0072] 0.9×W1≤W3≤0.95×W1 0.9×W6≤W3≤0.95×W6

[0073] As some more absolute dimensions, the substrate handling chamber precursor 200 can be any desired dimensions, e.g., depending on the desired dimensions of the final substrate handling chamber 300, 600. According to at least some examples of the technology, W1 and W6 can be in the range of 800 mm to 1500 mm; W2 and W3 can be in the range of 700 mm to 1400 mm; and W4 and W5 can be in the range of 350 mm to 850 mm.

[0074] In accordance with at least some examples of the technology, additional or alternative potential features of the geometry of the substrate handling chamber precursor 200 include various facet angle features. For example, in at least some examples of the technology: (a) Angle 1 can be substantially equal to Angle 2; (b) Angle 3 can be substantially equal to Angle 4; and (c) Angle 5 can be substantially equal to Angle 6. The term "substantially equal" as used herein in the context of angle magnitudes means that the two angles being compared are equal or within 5 degrees of each other (e.g., Angle 1 = Angle 2 ± 5 degrees). Angles 1 to 6 can all be obtuse angles. Additionally or alternatively, the substrate handling chamber precursor 200 can be symmetrical about a line passing through the centers of the first facet 204A and the sixth facet 204F (e.g., about Figure 2A BB shown).

[0075] The substrate handling chamber precursor 200 according to at least some examples of the technology may include any one or more of the following features or characteristics: (i) Angle 3 and / or Angle 4 may be greater than any one or more of Angle 1, Angle 2, Angle 5 and / or Angle 6; (ii) Angle 3 and / or Angle 4 may be greater than each of Angle 1, Angle 2, Angle 5 and Angle 6; (iii) Angle 5 and / or Angle 6 may be greater than one or both of Angle 1 and / or Angle 2; (iv) Angle 3 and / or Angle 4 may be at least 30 degrees greater than any one or more of Angle 1, Angle 2, Angle 5 and / or Angle 6; (v) Angle 3 and / or Angle 4 may be greater than any one or more of Angle 1, Angle 2, Angle 5 and / or Angle 6; at least 30 degrees greater than each of Angle 1, Angle 2, Angle 5 and Angle 6; (vi) Angle 5 and / or Angle 6 may be at least 4 degrees greater than one or both of Angle 1 and / or Angle 2; (vii) Angle 3 and / or Angle 4 may be 145 degrees ± 20 degrees; (viii) Angle 3 and / or Angle 4 may be 145 degrees ± 10 degrees; (ix) Angle 1 and / or Angle 2 may be 105 degrees ± 20 degrees; (x) Angle 1 and / or Angle 2 may be 105 degrees ± 10 degrees; (xi) Angle 5 and / or Angle 6 may be 110 degrees ± 20 degrees; and / or (xii) Angle 5 and / or Angle 6 may be 110 degrees ± 10 degrees.

[0076] Figures 2A-2D The example substrate handling chamber precursor 200 also includes a protrusion 210 extending from the second main surface 202B in a direction away from the first main surface 202A. In the illustrated example, the main body portion 202 of the substrate handling chamber precursor and the protrusion 210 are formed as a single integral single-piece component, for example, during a forging process. The groove 212 is defined as extending inwardly from the first main surface 202A to the second main surface 202B. In this specific example, the groove 212 extends inwardly from the first main surface 202A in an area of ​​the main body portion 202 corresponding to the location of the protrusion 210, for example, as shown in FIG. Figures 2A-2C The groove 212 includes a bottom surface 212B. The groove 212 of this example extends inwardly beyond the position of the second main surface 202B, so that the bottom surface 212B is located inside the protrusion 210, as shown in FIG. Figure 2B As shown. The groove 212 can form a top opening 212A for the substrate handling chamber 300 or 600 formed by the substrate handling chamber precursor 200, and provide an opening for entering the interior chamber of the substrate handling chamber 300 or 600, which will be described in more detail below. The top of the groove 212 surrounding the opening 212A at the first major surface 202A can form (or can be formed into) a seat for engaging a cover (which closes the interior chamber of the final substrate handling chamber 300, 600 structure).

[0077] Figure 2B-2DThe protrusion 210 of this example is further shown to have a cylindrical shape extending downward from the second major surface 202B. Although other shapes are possible, the protrusion 210 of this specific example substrate handling chamber precursor 200 includes a cylindrical structure (having a circular cross-sectional shape) extending downward from the second major surface 202B. In addition, although other shapes are possible, the groove 212 of the substrate handling chamber precursor 200 of this specific example includes a first diameter (D1, see Figure 2B ) and forms a circular cylindrical recess 212. The protrusion 210 may have a height dimension H1 that accounts for approximately 25% to 50% (in some examples, 30% to 45%) of the total height dimension H2 of the substrate handling chamber precursor 200. Figure 2B .

[0078] In addition, the substrate handling chamber precursor 200 of the illustrated example further includes a through hole opening 214, which extends from the bottom surface 212B of the groove 212 and passes through the protrusion 210 to open at the bottom of the precursor 200. The bottom surface 212B of the groove 212 around the through hole opening 214 can form (or can be formed into) a seat for installing the robot arm 320 or 620 in the final substrate handling chamber 300, 600. As will be described below in conjunction with Figures 4A-4C In more detail, a lip of the mounting area of ​​the robot arm 320, 620 can engage an area of ​​the bottom surface 212B around the through hole opening 214, and the motor (and / or other parts) of the robot arm 320, 620 can extend into the through hole opening 214 below the bottom surface 212B.

[0079] Additionally, although other shapes are possible, the through hole opening 214 of this particular example substrate handling chamber precursor 200 includes a through hole opening 214 having a second diameter (D2, see Figure 2B ), for example, at the bottom surface 212B of the groove 212. In at least some examples of this technology, D2 may be less than half of D1 (i.e., D2 ≤ 0.5 × D1 (in some examples, less than 0.45 × D1, or even less than 0.4 × D1)). As some absolute dimensions: (a) D1 may be less than 1000 mm (in some examples, less than 900 mm) and / or greater than 600 mm (in some examples, greater than 750 mm); and / or (b) D2 may be less than 500 mm (in some examples, less than 400 mm) and / or greater than 200 mm (in some examples, greater than 300 mm).

[0080] Figures 3A-3C A top view of an exemplary substrate handling chamber precursor 200 is shown in solid lines, and the outline of the final substrate handling chamber 300, 600 formed by the precursor 200 is shown in dotted lines. Figure 3A2 shows how the outer substrate handling chamber 600 is formed from the substrate handling chamber precursor 200. Figure 3B It is shown how the inner substrate handling chamber 300 is formed from a substrate handling chamber precursor 200 of the same size, shape, dimensions, etc. Figure 3C The outlines of the inner substrate handling chamber 300 (shown in dashed lines) and the outer substrate handling chamber 600 (shown in dotted lines) are shown superimposed on the outline of a single substrate handling chamber precursor 200 (solid lines) to illustrate the overlapping characteristics, similarities and shape differences of these example products.

[0081] like Figure 3A As shown, in order to produce the outer substrate handling chamber 600, the outer surface of the substrate handling chamber precursor 200 is processed to remove materials at the fourth facet 204D, the fifth facet 204E and the sixth facet 204F, thereby producing the facets 600D and 600E of the substrate handling chamber 600. In addition, in this example, some processing is performed at the second facet 204B and the third facet 204C of the substrate handling chamber precursor 200 to form the second facet 600B and the third facet 600C of the substrate handling chamber 600. The first facet 204A of the substrate handling chamber precursor 200 of this illustrated example is formed to substantially match the first facet 600A of the outer substrate handling chamber 600.

[0082] In at least some examples of the technology, the angles β defined between adjacent facets 600A-600E of the outer substrate handling chamber 600 can be "substantially equal" to each other, such as so that the facets 600A-600E substantially form a regular pentagon. However, in other specific examples of the technology, other angular arrangements of the facets 600A-600E of the outer substrate handling chamber 600 are also possible.

[0083] like Figure 3B As shown, in order to form the inner substrate handling chamber 300, the outer surface of the substrate handling chamber precursor 200 is processed to remove the material at the fourth facet 204D and the fifth facet 204E, thereby forming a shorter fourth facet 300D and a shorter fifth facet 300E, and forming an extended region 300X of the substrate handling chamber 300. The extended region 300X provides some additional length in the substrate transfer axis direction A of the substrate handling chamber 300, for example, to allow the final assembled substrate processing system 100 (see Figure 1 ) to access the facets 300D and 300E. The extended region 300X can help provide additional space to allow a substrate processing chamber or other equipment 910 to be installed to the facets 300D and 300E of the substrate handling chamber 300, such as Figure 1 , as shown by the dotted line in , to provide the ability to expand even further.

[0084] Aspects of the present technology further relate to substrate handling chambers of the type described herein, such as where the substrate handling chamber includes a plurality of facets (e.g., Figure 3B The type described above, wherein one facet (e.g., facet 300F) is offset from the other facets (e.g., 300A-300E) by an extension (e.g., extension region 300X). Figure 3B A substrate handling chamber 300 is shown, including: (a) a first facet 300A, (b) a second facet 300B extending from the first facet 300A at an oblique angle (angle AB), (c) a third facet 300C extending from the first facet 300A at an oblique angle (angle AC), (d) a fourth facet 300D extending from the second facet 300B at an oblique angle (angle BD), and (e) a fifth facet 300E extending from the third facet 300C at an oblique angle (angle CE). An extension region 300X extends outward from the fourth facet 300D and the fifth facet 300E, for example, in the substrate transfer axis direction A and / or the length direction L (the direction from the first facet 300A to the sixth facet 300F). The extension region 300X of this example is formed by parallel sidewalls 302X of the substrate handling chamber 300, which extend from the fourth facet 300D and the fifth facet 300E to the sixth facet 300F. In some examples of the technology, the parallel sidewalls 302X forming the extension region 300X can be substantially perpendicular (e.g., ±5 degrees) to the sixth facet 300F. Angle AB can be substantially equal to angle AC and / or angle BD can be substantially equal to angle CE. In addition or alternatively, if desired, the first facet 300A and the sixth facet 300F can have substantially equal widths; the second facet 300B and the third facet 300C can have substantially equal widths; and / or the fourth facet 300D and the fifth facet 300E can have substantially equal widths (these "widths" correspond to the dimensional directions of widths W1 to W6, as shown in FIG. 2 ). Figure 2A 300X) may also have substantially equal widths W7 (see FIG. Figure 3B ).

[0085] Extended region 300X may be any desired size and / or shape. In some examples, extended region 300X may form at least 5% of the length dimension L between first facet 300A and sixth facet 300F, and in some examples, at least 8%, at least 10%, at least 12%, or even at least 15% of the length L. Additionally or alternatively, in some examples, extended region 300X may form less than 30% of the length dimension L between first facet 300A and sixth facet 300F, and in some examples, less than 25% of the length L, or even less than 20% of the length L.

[0086] Furthermore, in this example, some processing is performed at the second facet 204B and the third facet 204C of the substrate handling chamber precursor 200 to form the second facet 300B and the third facet 300C of the substrate handling chamber 300. The first facet 204A of the substrate handling chamber precursor 200 of this illustrated example is formed to substantially match the first facet 300A of the inner substrate handling chamber 300. Similarly, the sixth facet 204F of the substrate handling chamber precursor 200 of this illustrated example is formed to substantially match the sixth facet 300F of the inner substrate handling chamber 300.

[0087] Figure 3C A top view of the outlines of the inner substrate handling chamber 300 and the outer substrate handling chamber 600 are shown superimposed on the outline of the substrate handling chamber precursor 200. This view enables a direct comparison of the material that will be removed from the substrate handling chamber precursor 200 to form each of the inner substrate handling chamber 300 and the outer substrate handling chamber 600. Figure 3C It is apparent that while both substrate handling chambers 300, 600 may be formed from a common size and shape of precursor 200 (also referred to herein as a "standard" precursor 200), the outer substrate handling chamber 600 has fewer facets (e.g., 5 facets in the example shown) than the number of facets that surround the inner substrate handling chamber 300 and form its outer perimeter shape and sidewalls (e.g., at least 6 facets in the example shown). Additionally or alternatively, from Figure 3C It can also be seen that more material (e.g., a larger volume of material) is removed from the standard precursor 200 than from the standard precursor 200 to form the outer substrate handling chamber 600. Figure 3C As shown, the inner substrate handling chamber 300 has a larger "footprint" than the outer substrate handling chamber 600 from a top view.

[0088] from Figure 3C It can also be seen that in the illustrated example, the first facet 300A, the second facet 300B, and the third facet 300C of the inner substrate handling chamber 300 match (or substantially match) the size and / or shape of the first facet 600A, the second facet 600B, and the third facet 600C of the outer substrate handling chamber 600. The size and shape of the precursor 200 can be such that when the precursor 200 is formed into the inner substrate handling chamber 300 and / or the outer substrate handling chamber 600, little processing is required at the first major surface 202A, the second major surface 202B, and / or the protrusion 210. Therefore, in at least some examples of the technology, the final inner substrate handling chamber 300 and / or the final outer substrate handling chamber 600 can include a protrusion 210 structure extending outward from the main body portion of the substrate handling chamber 300, 600, which includes the facets 300A-300F (and the extension region 300X) or the facets 600A-600E.

[0089] Figures 4A-4C Additional features of substrate handling chambers, systems, and methods according to examples of the present technology are shown. Figure 4A A flow chart of a method according to some aspects of the technology is provided. At step S400, the method includes providing or accessing an inventory of "standard" substrate handling chamber precursors 200, such as a plurality of substrate handling chamber precursors having a standard size and shape. More specifically, the "inventory" may include a plurality of substrate handling chamber precursors 200 (e.g., the above combined Figures 2A-2D 600 products. "Providing" may include, but is not limited to: purchasing a substrate handling chamber precursor 200 (e.g., directly or as part of an order to purchase a final substrate processing chamber product); ordering a substrate handling chamber precursor 200 for delivery to another party (e.g., a supplier for processing the precursor 200); shipping a substrate handling chamber precursor 200 to another; storing a substrate handling chamber precursor 200 for future use; retrieving a substrate handling chamber precursor 200 from a storage facility or inventory; sending a product order to a supplier, wherein the fulfillment of the order will include the use of the substrate handling chamber precursor 200, etc.

[0090] When an order for a substrate processing system 100 or a separate substrate handling chamber 300, 600 is received, at S402, the manufacturer may then process the first substrate handling chamber precursor 200 to remove a certain amount of material from the substrate handling chamber precursor 200 to form the inner substrate handling chamber 300 body. This type of machining may include CNC milling and / or other process steps to form the inner substrate handling chamber 300 body to include an outer perimeter shape having a first number of facets (e.g., at least six facets) located around the inner substrate handling chamber 300 body and forming the sidewalls of the body, such as Figure 3B The outer perimeter shape of the main body of the inner substrate handling chamber 300 may also be formed to include Figure 3BThe extended region 300X shown. At step S404, the manufacturer can then process the second substrate handling chamber precursor 200 to remove a certain amount of material from the substrate handling chamber precursor 200 to form the outer substrate handling chamber 600. This type of machining can include CNC milling and / or other process steps to form the outer substrate handling chamber 600 body to include an outer perimeter shape having a second number of facets located around the outer substrate handling chamber 600 body and forming the sidewalls of the body, such as Figure 3A As mentioned above, from Figures 3A-3C It is apparent that the second number of facets (e.g., no more than five facets) of the outer substrate handling chamber 600 may be different from the first number of facets (e.g., at least six facets) formed in the inner substrate handling chamber 300. In addition, the amount of material (e.g., volume) removed from the precursor 200 to form the outer substrate handling chamber 600 may be greater than the amount of material (e.g., volume) removed from the precursor 200 to form the inner substrate handling chamber 300.

[0091] In addition to the steps for forming the outer shape of these chambers 300, 600, steps S402 and S404 may include features for forming the final inner substrate handling chamber 300 body and the outer substrate handling chamber 600 body. As described above, the substrate handling chamber 300, 600 includes an inner chamber and a substrate transfer slot, and the robot arms 320, 620 are respectively installed in the inner chamber, and the substrate is moved to other components through the substrate transfer slot. The substrate handling chamber precursor 200 of this example includes a groove 212 forming an opening 212A at the first main surface 202A. The formation of the substrate handling chamber 300, 600 body may include further actions (such as machining, such as CNC milling) to form the remaining parts of the substrate handling chamber 300, 600 body. For example, as Figure 4B As shown (and optionally as part of step S402), starting from the sidewalls of the recess 212, the interior of the substrate handling chamber precursor 200 can be hollowed out to form an interior chamber 350 (whose interior sidewalls are Figure 4B In addition, substrate transfer slots 252 may be formed (machined, e.g., by CNC milling) in facets 300A-300F so that substrates may be moved from interior chamber 350 of substrate handling chamber 300 to other equipment that interfaces with substrate handling chamber 300. Facets 300A-300F provide surfaces for engaging gate valves and / or other equipment, such as Figure 1 In addition, Figure 4C As shown (and optionally as part of step S404), starting from the sidewalls of the recess 212, the interior of the substrate handling chamber precursor 200 may be hollowed out to form an interior chamber 650 (whose interior sidewalls are Figure 4C600A-600E) so that a substrate can be moved from the interior chamber 650 of the substrate handling chamber 600 to other equipment that interfaces with the substrate handling chamber 600. The facets 600A-600E provide surfaces for engaging gate valves and / or other equipment, such as Figure 1 Any desired number of substrate transfer grooves 252 may be formed in each facet 300A-300F and each facet 600A-600E, including, for example, one or more of the following: (a) one substrate transfer groove 252 per facet (e.g., in one or more of facets 300D and 300E); (b) two vertically spaced substrate transfer grooves 252 per facet (e.g., in one or more of facets 300D and 300E); (c) two horizontally spaced substrate transfer grooves 252 per facet (e.g., in one or more of facets 300A-300C, 300F, and 600A-600E); and / or (d) four spaced substrate transfer grooves 252 per facet in a 2×2 matrix (e.g., in one or more of facets 300A-300C, 300F, and 600A-600E), etc.

[0092] Figures 4A-4C Additional potential features of the substrate processing system 100 , substrate handling chambers 300 , 600 , and methods according to aspects of the present technique are shown. Figure 4A The process includes installing a substrate transfer chamber robot in the substrate transfer chamber 300 or 600 in step S406 . Figure 4B The insertion of the robot arm 320 and its associated components into the substrate handling chamber 300 is shown (arrow 410). Figure 4C The insertion of the robot 620 and its associated components into the substrate handling chamber 600 is shown (arrow 412). If desired, the steps of forming the substrate handling chambers 300, 600 may include machining or other actions around the through hole openings 214 to form structures for mounting the robot 320, 620, respectively. Figure 4B and 4CAs shown, this may include forming a recessed seating area 214A around the through hole opening 214 and / or forming one or more holes 214H (e.g., for bolts or other fasteners) through the bottom surface 212B of the body of the substrate handling chamber 300, 600. The robot arm 320, 620 may include a retaining element 420 sized and shaped to fit over the through hole opening 214 and, when present, into the recessed seating area 214A at the bottom of the substrate handling chamber 300, 600. The retaining element 420 may include one or more openings 420H configured to align with corresponding holes 214H located at the bottom surface of the body of the substrate handling chamber 300, 600. The bottom of the retaining element 420 and / or the exposed surface around the through hole opening 214 (e.g., in the recessed seating area 214A) may include a seal 422. The retaining element 420 of the robotic arm 320 , 620 may be mounted about the through-hole opening 214 and fastened (and sealed) in place using, for example, bolts and / or other desired types of fasteners extending through the holes 214H and 420H.

[0093] When installed, a portion of the robot arm 320, 620 system can extend into and / or through the through-hole opening 214, for example, to a position below the bottom surface of the substrate handling chamber 300, 600 (e.g., below the bottom of the protrusion 210). In these illustrated examples, the motor 424 of the robot arm 320, 620 will extend to a position outside the interior chamber 350, 650 of the substrate handling chamber 300, 600, respectively. This can make the motor 424 accessible from outside the substrate handling chamber 300, 600.

[0094] Figure 4A The process further includes a step S408 of installing the cover 430 to the substrate transport chamber 300 , 600 . Figure 4B The cover 430 is shown mounted on the opening 212A at the top surface 430S of the substrate handling chamber 300 (arrow 432). Figure 4C The cover 430 is shown mounted on the opening 212A at the top surface 430S of the substrate handling chamber 600 (arrow 434). The top surface 430S of the substrate handling chamber 300, 600 can correspond to a portion of the first major surface 202A of the precursor 200. If needed or desired, the area around the perimeter of the opening 212A at the top surface 430S of the substrate handling chamber 300, 600 can be machined or otherwise configured, for example to form a cover seating area 436 or a groove. The bottom of the cover 430 and / or the exposed surface around the opening 212A can include a seal 438 so that the cover 430 can seal the opening 212A. Additional fasteners can be provided to secure the cover 430 in place on the opening 212A.

[0095] Figure 4B and 4CA lid 430 including one or more handle elements 440 is further shown. The handle element 440 can be manually engaged to move the lid 430 onto and away from the top surface 430A of the substrate handling chamber 300, 600, and to move above the opening 212A. Alternatively, one or more handle elements 440 (or other suitable structures) can be provided to engage a system for moving the lid 430 (e.g., for engaging a lift mounted on a stage, etc.). As another example, if desired, the lid 430 may be provided as part of a lid moving system and method of the type described in U.S. Provisional Patent Application No. 63 / 526,759, entitled “Lid Moving Systems and Methods for Chambers or Containers,” filed on July 14, 2023. U.S. Provisional Patent Application No. 63 / 526,759 is incorporated herein by reference in its entirety.

[0096] In at least some examples of the technology, the substrate handling chamber precursor 200 will be formed in a certain size and shape (e.g., during forging) so that most of it will not require further processing (or undergo relatively minor processing) when manufacturing the substrate handling chamber 300, 600. For example, when manufacturing the inner substrate handling chamber 300, the top surface 430A, the bottom surface, the first facet 300A, and the sixth facet 300F of the final substrate handling chamber 300 can correspond to the first major surface 202A, the second major surface 202B, the first facet 204A, and the sixth facet 204F of the precursor 200 formed therefrom, respectively (e.g., with little or no further processing or change). In addition, in some examples, the protrusion 210, the through-hole opening 214, and the bottom surface 212B of the recess 212 from the precursor 200 can be retained in the final substrate handling chamber 300 product (e.g., with little or no further processing or change). Additionally or alternatively, when manufacturing the outer substrate handling chamber 600, the top surface 430A, the bottom surface, and the first facet 600A of the final substrate handling chamber 600 can correspond to the first main surface 202A, the second main surface 202B, and the first facet 204A of the precursor 200 formed therefrom, respectively (e.g., with little or no further processing or change). Moreover, in some examples, the protrusions 210, the through-hole openings 214, and the bottom surface 212B of the recesses 212 from the precursor 200 can be retained in the final product of the substrate handling chamber 600 (e.g., with little or no further processing or change). These features help reduce the additional processing and steps required to form the final substrate handling chamber 300, 600 from the precursor 200.

[0097] As described above, an advantageous aspect of the technology relates to the fact that, despite the different overall sizes and shapes, each of the inner substrate handling chamber 300 and the outer substrate handling chamber 600 can be made from a standard substrate handling chamber precursor 200. Therefore, a manufacturer (or a supplier to the manufacturer) only needs to maintain this single type of substrate handling chamber precursor 200 in its inventory, and these substrate handling chamber precursors 200 can be used to manufacture either the inner substrate handling chamber 300 or the outer substrate handling chamber 600, depending on the manufacturer's needs at a given time. These features simplify the manufacturer's inventory of substrate handling chamber precursors, can reduce the overall volume of inventory (by not needing to maintain a minimum inventory of two separate precursors), and can help avoid unexpected manufacturing delays by making the precursors available for both substrate handling chamber 300, 600 structures. These features also help reduce the tools required to manufacture the substrate handling chamber precursor 200, because a single set (or a single type) of specific tools (e.g., forging hammers, dies, anvils, etc.) can be used to manufacture the substrate handling chamber precursor 200 to produce two different types of substrate handling chambers 300, 600. Furthermore, these features may simplify the manufacture of the precursor 200 by requiring only one method and procedure to manufacture the precursor 200 for use with multiple types of substrate handling chambers 300 , 600 .

[0098] Although the present disclosure has been provided in the context of certain embodiments and examples, it will be understood by those skilled in the art that the present disclosure extends to other alternative embodiments and / or uses of embodiments beyond the specifically described embodiments and obvious modifications and equivalents thereof. In addition, although various variations of the embodiments of the present disclosure have been shown and described in detail, other modifications within the scope of the present disclosure will be apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that the various features and aspects of the disclosed embodiments may be combined or replaced with one another to form different modes of embodiments of the present disclosure. Therefore, the scope of the present disclosure should not be limited by the specific embodiments described above.

[0099] The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A substrate handling chamber precursor, comprising: a body portion including a first major surface, a second major surface opposite the first major surface, and a plurality of facets forming a sidewall extending between the first major surface and the second major surface; a protrusion extending from the second major surface in a direction away from the first major surface, wherein the body portion and the protrusion are formed as a single, one-piece forged component; a first recess extending inwardly from the first major surface, the first recess comprising a bottom surface; and A through hole opens and extends from the bottom surface of the first recess through the protrusion.

2. The substrate handling chamber precursor according to claim 1, wherein: The protrusion includes a cylindrical structure extending from the second major surface.

3. The substrate handling chamber precursor according to claim 1, wherein: The first recess defines a circular perimeter having a first diameter, and the through-hole opening defines a circular perimeter having a second diameter, and wherein the second diameter is less than half of the first diameter.

4. The substrate handling chamber precursor according to claim 1, wherein: The plurality of facets forming the sidewall of the body portion form a hexagonal shape.

5. The substrate handling chamber precursor according to claim 4, wherein: The plurality of facets include: (a) a first facet, (b) a second facet extending from the first facet at a first angle, (c) a third facet extending from the first facet at a second angle, (d) a fourth facet extending from the second facet at a third angle, (e) a fifth facet extending from the third facet at a fourth angle, and (f) a sixth facet extending between the fourth facet and the fifth facet.

6. The substrate handling chamber precursor according to claim 5, wherein: The second angle is substantially equal to the first angle, and the third angle is substantially equal to the fourth angle.

7. The substrate handling chamber precursor according to claim 6, wherein: The third angle is at least 30 degrees greater than the first angle.

8. The substrate handling chamber precursor according to claim 6, wherein: The sixth facet extends from the fourth facet at a fifth angle, wherein the sixth facet extends from the fifth facet at a sixth angle, and wherein the fifth angle is substantially equal to the sixth angle.

9. The substrate handling chamber precursor according to claim 8, wherein: The third angle is at least 30 degrees greater than the first angle, and at least 30 degrees greater than the fifth angle.

10. The substrate handling chamber precursor according to claim 5, wherein: Each of the first and sixth facets is wider than each of the second, third, fourth, and fifth facets.

11. The substrate handling chamber precursor according to claim 5, wherein: Each of the first, second, third, and sixth facets is at least 1.3 times wider than each of the fourth and fifth facets.

12. A method for manufacturing a substrate handling chamber, comprising: Providing a first substrate handling chamber precursor and a second substrate handling chamber precursor, the first substrate handling chamber precursor having a first set of dimensions, the second substrate handling chamber precursor having a second set of dimensions, the second set of dimensions being substantially equal to corresponding dimensions in the first set of dimensions, such that the first substrate handling chamber precursor and the second substrate handling chamber precursor are substantially identical in size and shape; processing a first substrate handling chamber precursor to remove a first amount of material from the first substrate handling chamber precursor to form a first substrate handling chamber body, wherein the first substrate handling chamber body comprises a first outer perimeter shape having a first number of facets positioned about the first substrate handling chamber body and forming a first sidewall of the first substrate handling chamber body; as well as The second substrate handling chamber precursor is processed to remove a second amount of material from the second substrate handling chamber precursor to form a second substrate handling chamber body, wherein the second substrate handling chamber body includes a second outer perimeter shape having a second number of facets located around the second substrate handling chamber body and forming a second sidewall of the second substrate handling chamber body, wherein the second number of facets is less than the first number of facets, and wherein the second amount of material is greater than the first amount of material.

13. The method according to claim 12, wherein: Each of the first and second substrate handling chamber precursors has a body portion including a first major surface, a second major surface opposite the first major surface, and a plurality of facets forming a sidewall extending between the first and second major surfaces.

14. The method according to claim 13, wherein: Each of the first and second substrate handling chamber precursors further includes a protrusion extending from the second major surface in a direction away from the first major surface, wherein the body portion and the protrusion are formed as a single, one-piece forged component.

15. The method according to claim 14, wherein: Each of the first and second substrate handling chamber precursor bodies further includes a first recess extending inwardly from the first major surface, the first recess including a bottom surface.

16. The method according to claim 15, wherein: Each of the first and second substrate handling chamber precursors further includes a through-hole opening extending from a bottom surface of the first recess through the protrusion.

17. The method according to claim 16, wherein: The first recess defines a circular perimeter having a first diameter, and the through-hole opening defines a circular perimeter having a second diameter, and wherein the second diameter is less than half of the first diameter.

18. The method according to claim 14, wherein: The protrusion of each of the first substrate handling chamber precursor and the second substrate handling chamber precursor comprises a cylindrical structure extending from the second major surface.

19. The method according to claim 12, wherein: A first number of facets forming a first sidewall of the first substrate handling chamber body includes at least six facets, and wherein a second number of facets forming a second sidewall of the second substrate handling chamber body includes no more than five facets.

20. The method according to claim 12, wherein: Each of the first substrate handling chamber precursor and the second substrate handling chamber precursor includes: (a) a first facet, (b) a second facet extending from the first facet at a first angle, (c) a third facet extending from the first facet at a second angle, (d) a fourth facet extending from the second facet at a third angle, (e) a fifth facet extending from the third facet at a fourth angle, and (f) a sixth facet extending between the fourth facet and the fifth facet.

21. The method according to claim 20, wherein: The second angle is substantially equal to the first angle, and the third angle is substantially equal to the fourth angle.

22. The method according to claim 21, wherein: The sixth facet extends from the fourth facet at a fifth angle, wherein the sixth facet extends from the fifth facet at a sixth angle, and wherein the fifth angle is substantially equal to the sixth angle.

23. The method according to claim 22, wherein: The third angle is at least 30 degrees greater than the first angle and / or at least 30 degrees greater than the fifth angle.

24. The method according to claim 20, wherein: Each of the first and sixth facets is wider than each of the second, third, fourth, and fifth facets.

25. The method according to claim 20, wherein: Each of the first, second, third, and sixth facets is at least 1.3 times wider than each of the fourth and fifth facets.

26. The method of claim 12, wherein: The first substrate handling chamber precursor and the second substrate handling chamber precursor are provided as part of a precursor inventory for forming a plurality of substrate handling chamber bodies, wherein each precursor in the inventory comprises a set of dimensions that are substantially equal to corresponding dimensions in the first set of dimensions such that all precursors in the inventory have substantially the same size and shape.

27. The method of claim 12, wherein: The first substrate handling chamber body is formed to include: (a) a first top surface, (b) a first bottom surface opposite the first top surface, and (c) a first chamber extending inwardly from the first top surface, and wherein the method further comprises: engaging a first cover with the first substrate handling chamber body, wherein the size, shape and movable position of the first cover are configured to cover a first opening leading to the first chamber at the first top surface; and / or wherein the second substrate handling chamber body is formed to include: (a) a second top surface, (b) a second bottom surface opposite to the second top surface, and (c) a second chamber extending inwardly from the second top surface, and wherein the method further comprises: engaging a second cover with the second substrate handling chamber body, wherein the size, shape and movable position of the second cover are configured to cover a second opening leading to the second chamber at the second top surface.

28. The method of claim 12, wherein: The first substrate handling chamber body is formed to include: (a) a first top surface, (b) a first bottom surface opposite the first top surface, (c) a first chamber extending inwardly from the first top surface to a first interior bottom surface, and (d) a first through hole opening extending from the first interior bottom surface to the first bottom surface, and wherein the method further comprises: placing a first substrate transfer robot in the first chamber so that a first portion of the first substrate transfer robot extends into the first through hole opening below the first interior bottom surface; and / or Wherein, the second substrate handling chamber body is formed to include: (a) a second top surface, (b) a second bottom surface opposite to the second top surface, (c) a second chamber extending inward from the second top surface to the second inner bottom surface, and (d) a second through hole opening extending from the second inner bottom surface to the second bottom surface, and wherein the method also includes: placing a second substrate transfer robot in the second chamber so that the second part of the second substrate transfer robot extends into the second through hole opening below the second inner bottom surface.

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