Heat sink, heating disc and thin film deposition apparatus

Abstract

The application discloses a heat dissipation device, a heating disc and a thin film deposition equipment, and relates to the technical field of heat dissipation devices, wherein the heat dissipation device is used for dissipating heat of the heating disc, and comprises a heat conduction piece, at least one heat conduction pipe and a cooling assembly. The heat conduction piece is installed on a disc handle of the heating disc. One end of the heat conduction pipe is connected to the heat conduction piece, and the other end of the heat conduction pipe is connected to the cooling assembly. The cooling assembly is used for cooling the heat conduction pipe. The heat conduction pipe extends along the radial direction of the disc handle of the heating disc so that the cooling assembly is away from the heating disc. According to the application, heat is transferred to an area away from the heating disc through the heat conduction pipe and then dissipated, heat dissipation is avoided in a narrow space near a radio frequency heating rod inside the disc handle of the heating disc, heat dissipation position is transferred to an open area nearby, heat dissipation effect is improved, and the reliability of the heating disc is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a heat dissipation device, a heating plate, and a thin film deposition apparatus. Background Technology

[0002] In modern industrial manufacturing and materials processing, radio frequency (RF) heating technology is widely used in numerous fields such as plastic welding, rubber vulcanization, wood drying, and semiconductor manufacturing. As a core component of RF heating systems, the RF heating rod plays a crucial role on the machine. It not only participates in energy transmission and conversion as part of the RF circuit but also directly bears the heat conduction effect from the heating plate, while its temperature is further increased by the Joule heat generated by the RF current. In actual operation, the working environment of the RF heating rod is extremely harsh, especially in the absence of effective heat dissipation measures, where its surface temperature can rapidly rise to over 200°C. High temperatures have multifaceted effects on the RF heating rod. First, excessively high temperatures can cause the weld points between the heating rod and the heating plate to loosen due to differences in thermal expansion coefficients, affecting structural stability. Second, high temperatures may accelerate the aging of the insulating materials surrounding the heating rod, leading to decreased insulation performance and even short-circuit faults. Furthermore, sustained high temperatures can shorten the lifespan of the heating rod, increase maintenance costs and downtime, and severely impact production efficiency. Therefore, ensuring effective cooling of the RF heating rod is a critical factor in ensuring the normal operation of the equipment. Currently, common cooling methods include natural cooling, forced air cooling (such as using nitrogen to blow air), and liquid cooling. However, in practical applications, it has been found that simple air blowing cooling is not ideal for radio frequency heating rods installed in confined spaces. On the one hand, space constraints make it difficult to arrange sufficiently large fans or ducts to achieve effective airflow; on the other hand, gases such as nitrogen have relatively low heat exchange efficiency, especially under high heat load conditions, and cannot remove enough heat in time to maintain the heating rod at a suitable operating temperature. Summary of the Invention

[0003] Embodiments of the present invention provide a heat dissipation device, a heating plate, and a thin film deposition apparatus, which aim to solve the problem of poor heat dissipation performance of existing radio frequency heating rods.

[0004] In a first aspect, the present invention provides a heat dissipation device for dissipating heat from a heating plate. The heat dissipation device includes: a heat-conducting element, at least one heat-conducting pipe, and a cooling assembly. The heat-conducting element is installed on the handle of the heating plate. One end of the heat-conducting pipe is connected to the heat-conducting element, and the other end of the heat-conducting pipe is connected to the cooling assembly. The cooling assembly is used to cool the heat-conducting pipe.

[0005] The heat pipe extends radially along the handle of the heating plate to keep the cooling assembly away from the heating plate.

[0006] Furthermore, the heat-conducting element is a heat-conducting ring, which is sleeved on the handle of the heating plate.

[0007] Furthermore, at least one set of mounting holes is provided on the side wall of the heat-conducting component. Each set of mounting holes includes a first through hole, a second through hole, and a connecting hole. The connecting hole connects the first through hole and the second through hole. One end of the heat-conducting pipe passes through the first through hole, the connecting hole, and the second through hole in sequence.

[0008] Furthermore, the first through hole and the second through hole are spaced apart on the side wall of the heat-conducting component, and the connecting hole is opened on the side wall of the heat-conducting component facing away from the first through hole and the second through hole.

[0009] Furthermore, the heat pipe includes a first pipe segment, a second pipe segment, and a connecting pipe segment. The two ends of the connecting pipe segment are respectively connected to one end of the first pipe segment and one end of the second pipe segment, and the other ends of the first pipe segment and the second pipe segment are connected to the cooling assembly. The connecting pipe segment surrounds at least a portion of the sidewall of the heat-conducting component.

[0010] Furthermore, the connecting pipe section passes through the side wall of the heat-conducting component.

[0011] Furthermore, the first pipe segment and the second pipe segment are arranged in parallel and spaced apart, and the other ends of the first pipe segment and the second pipe segment extend in the same direction.

[0012] Furthermore, the cooling assembly includes at least one set of air-cooled heat dissipation components, each set of air-cooled heat dissipation components including a fan and fins, the fins being disposed on the air intake side of the fan, and the other end of the heat pipe being inserted into the fins.

[0013] Furthermore, the cooling assembly includes two sets of air-cooled heat dissipation assemblies, and the other end of the heat pipe includes a first pipe segment and a second pipe segment, which are respectively inserted into the fins of the two sets of air-cooled heat dissipation assemblies.

[0014] Furthermore, the heat-conducting element and / or the heat-conducting pipe are made of aluminum nitride ceramic material.

[0015] Furthermore, the heat pipe is a closed heat pipe, and the interior of the heat pipe is provided with a phase change cooling medium.

[0016] Secondly, the present invention also provides a heating plate, comprising: a plate handle, a radio frequency heating rod, and a heat dissipation device, wherein the heat dissipation device is the aforementioned heat dissipation device, the radio frequency heating rod is disposed in the plate handle, and the heat-conducting element of the heat dissipation device is mounted on the plate handle.

[0017] Thirdly, the present invention also provides a thin film deposition apparatus, including the heating plate described above.

[0018] This invention provides a heat dissipation device, a heating plate, and a thin film deposition apparatus. The heat dissipation device includes a heat-conducting element, a heat-conducting pipe, and a cooling assembly. The heat-conducting element is mounted on the handle of the heating plate. One end of the heat-conducting pipe is connected to the heat-conducting element, and the other end of the heat-conducting pipe extends radially away from the handle of the heating plate, thus moving away from the heating plate. The cooling assembly is connected to the other end of the heat-conducting pipe away from the heating plate, and the cooling assembly dissipates heat from the heat-conducting pipe. Thus, heat is transferred to an area away from the heating plate through the heat-conducting pipe for further dissipation, avoiding heat dissipation in the narrow space near the radio frequency heating rod inside the handle of the heating plate. The heat dissipation location is shifted to a nearby open area, improving the heat dissipation effect and increasing the reliability of the heating plate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A schematic diagram of a heat dissipation device according to an embodiment of the present invention is shown;

[0021] Figure 2 An exploded view of the heat dissipation device according to an embodiment of the present invention is shown;

[0022] Figure 3 A schematic diagram of the heat-conducting component of the heat dissipation device according to an embodiment of the present invention is shown;

[0023] Figure 4 Another schematic diagram of the heat dissipation device according to an embodiment of the present invention is shown;

[0024] Figure 5 A schematic diagram of the heat pipe of the heat dissipation device according to an embodiment of the present invention is shown;

[0025] Figure 6 A schematic diagram of the cooling component of the heat dissipation device according to an embodiment of the present invention is shown;

[0026] Figure label:

[0027] 1. Heat-conducting component; 11. First through hole; 12. Second through hole; 13. Connecting hole; 2. Heat-conducting pipe; 21. First pipe section; 22. Second pipe section; 23. Connecting pipe section; 3. Cooling assembly; 31. Fan; 32. Fin; 4. Heating plate; 41. Plate handle; 42. Radio frequency heating rod. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] The directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding this invention, and not for limiting it. Furthermore, in the drawings, structures that are similar or identical are indicated by the same reference numerals.

[0030] In radio frequency (RF) heating equipment, the RF heating rod (Rod) is a crucial component of the RF circuit. The Rod conducts RF current, forming the loop, and generates considerable heat during this process. It not only conducts RF current but is also directly subjected to heat conduction from the heating plate (heater). Due to this dual heating mechanism, the Rod's temperature can often rapidly rise above 200°C. Such high temperatures can cause the solder joints between the Rod and the heater to loosen and the insulation material to fail, severely impacting the normal operation and lifespan of the equipment. Therefore, effective cooling of the Rod is a critical factor in ensuring the stable operation of the RF heating equipment. Currently, one common cooling method is using airflow (such as nitrogen) to lower the Rod's temperature. However, this method is not ideal in practice. On the one hand, the limited space around the Rod makes it difficult for airflow to form an effective heat dissipation path; on the other hand, airflow cooling is relatively inefficient, making it difficult to control the Rod's temperature within a safe range.

[0031] This invention provides a heat dissipation device, a heating plate, and a thin film deposition equipment, which solves the problem of poor heat dissipation in existing radio frequency heating rods. By transferring the heat dissipation location from a narrow space to an open area through heat pipes, the heat dissipation effect is improved and the reliability of the heating plate is enhanced.

[0032] To address the aforementioned problem of poor heat dissipation, the embodiments of the present invention employ the following specific approach:

[0033] A high thermal conductivity heat-conducting component is added near the Rod and mounted on the handle. One end of a heat-conducting pipe is connected to the heat-conducting component, and the other end extends away from the heating plate. The other end is connected to a cooling component at a location away from the heating plate. The cooling component cools the heat-conducting pipe. The heat generated by the Rod is conducted to an open area nearby through the heat-conducting component and the heat-conducting pipe. This eliminates the need for heat dissipation in a narrow space near the Rod. The heat can be conducted to an open area nearby, and a cooling component is placed in the open area to dissipate heat from the heat-conducting pipe, improving heat dissipation efficiency and ensuring that the temperature of the Rod is within a safe range, thereby improving the reliability of the heating plate.

[0034] Please see Figures 1-6 This invention provides a heat dissipation device for cooling a heating plate 4. The heat dissipation device includes a heat-conducting element 1, at least one heat-conducting pipe 2, and a cooling assembly 3. The heat-conducting element 1 is mounted on the handle 41 of the heating plate 4. One end of the heat-conducting pipe 2 is connected to the heat-conducting element 1, and the other end of the heat-conducting pipe 2 is connected to the cooling assembly 3. The cooling assembly 3 is used to cool the heat-conducting pipe 2. The heat-conducting pipe 2 extends radially along the handle 41 of the heating plate 4 to keep the cooling assembly 3 away from the heating plate 4.

[0035] Specifically, since the radio frequency heating rod 42Rod is installed inside the handle 41 of the heating plate 4, and the Rod generates a large amount of heat around the handle 41, a heat-conducting component 1 is installed near the handle 41. The heat-conducting component 1 is fixedly installed at the bottom end of the handle 41 of the heating plate 4 to conduct the heat generated by the Rod. The heat-conducting pipe 2 is a tube structure with a certain length. One end of its tube is connected to the heat-conducting component 1 to receive the heat transferred from the heat-conducting component 1, and the other end is connected to the cooling component 3 to transfer the heat to the cooling component 3 for cooling and heat dissipation. The heat-conducting pipe 2 extends radially in the handle 41. One end of the heat-conducting pipe 2 is connected to the heat-conducting component 1 on the handle 41, and the other end extends away from the handle 41. The length and structure of the heat-conducting pipe 2 can be adjusted according to the actual space of the machine and the heat dissipation requirements. The cooling component 3 is connected to the other end of the heat-conducting pipe 2 and is used to cool and dissipate heat from the heat-conducting pipe 2. The cooling component 3 can be any cooling structure, such as an air-cooled structure or a liquid-cooled structure. Regardless of the type of cooling structure, as long as it can cool the heat from the heat pipe 2, it is acceptable. No limitation is made here.

[0036] In this embodiment, the heat in the narrow space near Rod is transferred to the nearby open area through the heat-conducting component 1 and the heat-conducting pipe 2, and the cooling component 3 is used to cool and dissipate heat in the open area. Therefore, it is not necessary to set up a heat dissipation structure in the narrow space near Rod. Instead, the heat dissipation location is transferred to the nearby open area for cooling and heat dissipation, which greatly improves the heat dissipation effect and the reliability of the heating plate 4.

[0037] In one embodiment, the heat-conducting component 1 and / or the heat-conducting pipe 2 are made of aluminum nitride ceramic material. Specifically, aluminum nitride (AlN) ceramic is an important inorganic non-metallic material with excellent thermal conductivity, good electrical insulation, and chemical stability. It is composed of aluminum (Al) and nitrogen (N) elements, with the chemical formula AlN. The thermal conductivity of aluminum nitride ceramic is between 170-230 W / m·K, and the thermal conductivity of a single crystal can even reach over 275 W / m·K. In this embodiment, the thermal conductivity of the heat-conducting component 1 can be 310 W / m·K, making aluminum nitride one of the materials with the best thermal conductivity, far exceeding that of traditional materials such as copper and silver. Moreover, aluminum nitride has excellent chemical stability at high temperatures and can withstand acid and alkali corrosion; it has high hardness and good mechanical strength and toughness; aluminum nitride has very high resistivity, making it a good electrical insulating material; and aluminum nitride has a low coefficient of thermal expansion (approximately 4.5 × 10⁻⁶). -6 / ℃), with silicon (3.5~4×10 -6 / ℃) and gallium arsenide (6×10) -6 The aluminum nitride (ANO) is compatible with the temperature range (°C). Aluminum nitride is heat-resistant, can be used in environments up to 2200°C, and is resistant to molten metal corrosion and acid stability. Therefore, this embodiment uses an aluminum nitride ceramic heat-conducting component 1 and an aluminum nitride ceramic heat-conducting pipe 2 to transfer heat, greatly improving heat conduction efficiency and heat dissipation.

[0038] In one embodiment, the heat pipe 2 is a closed heat pipe, and a phase change cooling medium is disposed inside the heat pipe. Specifically, the heat pipe 2 is a heat pipe, which is a highly efficient heat transfer element with a thermal conductivity of up to 4000. The end of the heat pipe 2 connected to the heat-conducting component 1 is the hot end of the heat pipe, and the other end of the heat pipe 2 connected to the cooling component 3 is the cold end of the heat pipe. A certain gas pressure is maintained inside the heat pipe, and it is filled with a phase change cooling medium, which can be water. The hot end of the heat pipe is the evaporation section, and the cold end of the heat pipe is the condensation section. Water absorbs heat in the evaporation section and changes phase to gas. The gas moves along the heat pipe to the condensation section, where it dissipates heat through the cooling component 3 and changes phase to liquid again. The condensed liquid returns to the evaporation section through capillary action. Specifically, firstly, when the heat generated by the heat-conducting component 1 is transferred to the evaporation section, the water absorbs the heat and quickly evaporates into steam. Because water has a large latent heat, even with a small temperature change, it can absorb a large amount of heat, thereby effectively removing heat from the heat source. Then, the evaporated steam moves along the cavity inside the heat pipe towards the condensation section. During this process, the steam carries a large amount of heat, but its temperature is relatively low because the phase change process of water is isothermal, meaning the temperature remains essentially constant during evaporation and condensation. Next, when the steam reaches the condensation section, it encounters the low-temperature environment provided by the cooling component 3, releasing heat and recondensing into liquid. In this process, heat is transferred to the cooling component 3, achieving effective heat dissipation. Finally, to ensure continuous circulation of the phase change cooling medium, the heat pipe typically has capillary structures (such as porous materials or microchannels). These structures, through capillary action, draw the condensed liquid back from the condensation section to the evaporation section, forming a closed-loop system. This design not only ensures a continuous supply of cooling medium but also improves the heat transfer efficiency of the heat pipe. This embodiment significantly improves heat transfer efficiency through the heat pipe.

[0039] Reference Figure 1 In one embodiment, the heat-conducting element 1 is a heat-conducting ring, which is sleeved on the handle 41 of the heating plate 4. Specifically, the heat-conducting element 1 is a ring-shaped heat-conducting ring, which, when sleeved on the handle 41, increases the contact area between the heat-conducting element 1 and the handle 41, enabling more effective heat conduction and improving heat transfer efficiency. Furthermore, the design of the heat-conducting ring simplifies installation, reduces the need for complex fixing structures, lowers installation costs and time, and the ring-shaped structure better adapts to the shape of the handle 41, providing better mechanical stability and reducing the risk of loosening due to vibration or external forces.

[0040] Reference Figure 3In this embodiment, at least one set of mounting holes is provided on the side wall of the heat-conducting component 1. Each set of mounting holes includes a first through hole 11, a second through hole 12, and a connecting hole 13. The connecting hole 13 connects the first through hole 11 and the second through hole 12. One end of the heat-conducting pipe 2 passes through the first through hole 11, the connecting hole 13, and the second through hole 12 in sequence. Specifically, multiple sets of mounting holes are provided on the side wall of the heat-conducting ring (heat-conducting component 1), and each set of mounting holes corresponds to the installation of one heat-conducting pipe 2. When there are multiple sets of mounting holes, the multiple sets of mounting holes can be opened along the height direction of the handle 41, and the multiple heat-conducting pipes 2 are also stacked along the height direction of the handle 41, with each heat-conducting pipe 2 corresponding to a set of mounting holes for installation. Each set of mounting holes includes three holes: a first through hole 11, a second through hole 12, and a connecting hole 13. The heat pipe 2 passes through these three holes on the heat-conducting component 1, forming three contact points between the heat pipe 2 and the heat-conducting component 1. This increases the contact area for heat dissipation, significantly improving heat transfer efficiency. Furthermore, each contact point is located at a different position on the heat pipe, ensuring uniform heat transfer. In this embodiment, by increasing the number of contact points, the contact area between the heat pipe 2 and the heat-conducting component 1 is significantly increased, allowing more heat to be transferred to the heat pipe 2 in a short time. This not only improves heat transfer efficiency but also shortens the thermal response time and enhances heat dissipation capacity.

[0041] Reference Figure 3 and Figure 4 In this embodiment, the first through hole 11 and the second through hole 12 are spaced apart on the side wall of the heat-conducting component 1, and the connecting hole 13 is located on the side wall of the heat-conducting component 1 facing away from the first through hole 11 and the second through hole 12. Specifically, the first through hole 11, the second through hole 12, and the connecting hole 13 are respectively located at different positions on the side wall of the heat-conducting component 1. The first through hole 11 and the second through hole 12 are spaced apart and adjacent to each other, while the connecting hole 13 is located on the back side. The connecting hole 13 and the first through hole 11 and the second through hole 12 are arranged radially opposite to each other along the radial direction of the handle 41. The connecting hole 13 has a certain length, which corresponds to the distance between the two through holes. Thus, when the heat pipe 2 passes through the first through hole 11, the connecting hole 13, and the second through hole 12, one end of the heat pipe 2 forms a bend. The section of the heat pipe 2 in the connecting hole 13 is the bend section, which allows the heat pipe 2 to be installed around the circumference of the handle 41 with the heat-conducting component 1. This increases the contact area between the heat pipe 2 and the heat-conducting component 1. On the one hand, the increased contact area improves the heat transfer efficiency, and on the other hand, the increased contact area for installation improves the stability and reliability of the connection.

[0042] Reference Figure 5In one embodiment, the heat pipe 2 includes a first pipe segment 21, a second pipe segment 22, and a connecting pipe segment 23. Both ends of the connecting pipe segment 23 are connected to one end of the first pipe segment 21 and one end of the second pipe segment 22, respectively. The other ends of the first pipe segment 21 and the second pipe segment 22 are connected to the cooling assembly 3. The connecting pipe segment 23 surrounds at least a portion of the sidewall of the heat-conducting component 1. Specifically, the heat pipe 2 in this embodiment has a U-shaped pipe structure with three pipe segments: the first pipe segment 21, the second pipe segment 22, and the connecting pipe segment 23. The first pipe segment 21 and the second pipe segment 22 are straight pipes, and the connecting pipe segment 23 is an arc-shaped pipe. One end of each of the two straight pipes is connected to both ends of the arc-shaped pipe, forming a U-shaped pipe structure. In a specific implementation, the first pipe segment 21 passes through the first through hole 11, the second pipe segment 22 passes through the second through hole 12, and the third pipe segment passes through the connecting hole 13. The connecting hole 13 matches the shape of the connecting segment, both being arc-shaped. It is understood, of course, that in other embodiments, the shape of the connecting hole 13 and the connecting segment can also be annular, as can be determined by those skilled in the art according to specific needs. This allows the connecting pipe segment 23 to fit tightly against the sidewall of the heat-conducting component 1, forming an arc-shaped channel, increasing the contact area and improving heat transfer efficiency.

[0043] In this embodiment, the connecting pipe segment 23 passes through the side wall of the heat-conducting component 1. Specifically, if the heat-conducting pipe 2 only contacts the surface of the heat-conducting component 1, the heat transfer path will be long and the thermal resistance will be high. Therefore, by partially embedding the connecting pipe segment 23 inside the heat-conducting component 1, the heat transfer path can be shortened, heat loss can be reduced, and heat dissipation efficiency can be improved. In this embodiment, a portion of the connecting pipe segment 23 is designed to be directly embedded in the side wall of the heat-conducting component 1, forming an embedded connection method, which increases the contact area between the heat-conducting component 1 and the heat-conducting pipe 2, making the heat transfer between the two more direct and efficient. To achieve this, the side wall of the heat-conducting component 1 needs to be pre-machined with corresponding holes or channels, such as the connecting hole 13 in the above embodiment. The connecting pipe segment 23 can pass through the connecting hole 13 so that the connecting pipe segment 23 can be smoothly embedded. In this embodiment, by embedding the connecting pipe segment 23 inside the heat-conducting component 1, the heat transfer path is greatly shortened and the thermal resistance is reduced, so that heat can be transferred from the heating plate 4 to the cooling component 3 more quickly, improving heat dissipation efficiency, enhancing stability, reducing the risk of failure caused by high temperature, and making heat transfer more direct. This can reduce the performance requirements of the cooling component 3 to a certain extent, thereby reducing costs.

[0044] In this embodiment, the first pipe segment 21 and the second pipe segment 22 are arranged in parallel and spaced apart, with their other ends extending in the same direction. Specifically, the first pipe segment 21 and the second pipe segment 22 are arranged in parallel and spaced apart, and their other ends extend in the same direction. This layout allows the heat pipe 2 to maximize its length within a limited space while maintaining good heat transfer performance. The parallel spacing helps to disperse heat and avoid local overheating, while the uniform extension facilitates the arrangement and maintenance of the cooling assembly 3. Specifically, the parallel spacing of the two pipe segments provides the heat pipe 2 with two heat dissipation paths, enabling heat to be evenly distributed, avoiding local overheating, and extending the service life of the equipment. At the same time, the uniform extension of the two pipe segments facilitates the arrangement and maintenance of the cooling assembly 3, which can be centrally located in a certain area to cool the heat pipe 2, simplifying the installation and commissioning process. Through the structural design of this embodiment, better heat dissipation performance can be provided within a limited machine space, maximizing the use of available space and improving heat dissipation efficiency.

[0045] Reference Figure 6In one embodiment, the cooling assembly 3 includes at least one set of air-cooled heat dissipation components. Each set of air-cooled heat dissipation components includes a fan 31 and fins 32. The fins 32 are disposed on the air inlet side of the fan 31, and the other end of the heat pipe 2 is inserted into the fins 32. Traditional cooling methods such as natural cooling or simple forced air cooling have limited effectiveness for radio frequency heating rods 42 or heating plates 4 under high heat load conditions, and are difficult to meet the requirements of efficient heat dissipation. In addition, due to the limited space around the heating plate 4, traditional large cooling devices cannot be installed, so a compact and efficient cooling assembly 3 is needed. The cooling assembly 3 of this embodiment adopts an air-cooled heat dissipation structure, including at least one set of air-cooled heat dissipation components. Each set of air-cooled heat dissipation components includes a fan 31 and fins 32. The fan 31 has an air inlet side and an air outlet side facing away from each other, and the fins 32 are disposed on the air inlet side. The fins 32 include a heat dissipation substrate and a plurality of fins. The plurality of fins are arranged at intervals on the heat dissipation substrate, with the fins close to the air inlet side and the heat dissipation substrate away from the air inlet side. The other end of the heat pipe 2 (first section 21 and second section 22) is directly inserted into the fins 32, meaning the heat pipe 2 passes through several fins and is exposed in the airflow channels formed between the fins, increasing the heat dissipation area of ​​the heat pipe 2. Under the action of the fan 31, airflow enters the fins 32, carrying away the heat from the other end of the heat pipe 2. The airflow then enters the inlet side of the fan 31 and is finally discharged from the outlet side of the fan 31, achieving efficient heat transfer. Through this embodiment, firstly, the forced convection provided by the fan 31 enhances airflow, significantly improving heat exchange efficiency compared to natural convection; secondly, the structure of the fins 32 increases the surface area in contact with air, further promoting heat dissipation; finally, the good contact between the heat pipe 2 and the fins 32 ensures that heat can be rapidly conducted from the heating plate 4 to the cooling assembly 3, improving heat dissipation efficiency, ensuring the working stability of the heating plate 4, extending the service life of the equipment, and reducing maintenance costs.

[0046] In this embodiment, the cooling assembly 3 includes two sets of air-cooled heat dissipation components. The other end of the heat pipe 2 includes a first pipe segment 21 and a second pipe segment 22, which are respectively inserted into the fins 32 of the two sets of air-cooled heat dissipation components. Specifically, a single set of air-cooled heat dissipation components may not be sufficient to cope with high heat loads under extreme conditions, especially when the Rod generates a large amount of heat. In addition, if there is only one heat conduction path, heat may be concentrated at a certain point, causing local overheating and making it difficult to dissipate heat in time. Therefore, a more distributed heat dissipation strategy is needed to ensure that the entire heat dissipation device can maintain good temperature control under any circumstances. Specifically, the cooling assembly 3 consists of two sets of air-cooled heat dissipation components, each equipped with an independent fan 31 and fins 32. The other end of the heat pipe 2 is designed as a U-shaped tube structure or a bifurcated structure, forming a first pipe segment 21 and a second pipe segment 22, which are respectively connected to the fins 32 of the two sets of heat dissipation components. When the heat generated by the Rod is conducted to the heat pipe 2 through the heat conductor 1, it is separated and transferred in two directions, and finally carried away by the airflow driven by the two fans 31. This dual-channel design not only increases the total heat dissipation area, but also makes the heat distribution more uniform, avoiding the problem of single-point overheating. It should be noted that the exhaust sides of the two fans 31 are set opposite to each other, so that the hot air blows out in opposite directions, avoiding airflow interference and affecting heat dissipation. Through this embodiment, the solution of using dual-set air-cooled heat dissipation components can further improve the heat dissipation performance on the original basis; on the one hand, the two fans 31 work simultaneously, providing a larger air volume and stronger cooling capacity; on the other hand, the heat is dissipated through two independent paths, reducing the formation of local hot spots and improving the stability and reliability of heat dissipation.

[0047] Reference Figure 1 and Figure 2 This invention also provides a heating plate 4, comprising: a plate handle 41, a radio frequency heating rod 42, and a heat dissipation device. The heat dissipation device is the same as that described in the above embodiments. The radio frequency heating rod 42 is disposed in the plate handle 41, and the heat-conducting element 1 of the heat dissipation device is mounted on the plate handle 41. The heat dissipation device has been described in detail in the above embodiments, and for the sake of brevity, it will not be described again here.

[0048] In this embodiment, by integrating the radio frequency heating rod 42 into the handle 41 of the heating plate 4 and using a high-efficiency heat dissipation device including a heat-conducting component 1, a two-section heat-conducting pipe 2 and a dual-group air-cooled heat dissipation component, the heat is rapidly conducted and evenly distributed, significantly reducing the operating temperature of the radio frequency heating rod 42, improving the stability and service life of the heating plate 4, and ensuring a compact space layout.

[0049] This invention also provides a thin film deposition apparatus, including the heating plate 4 described in the above embodiments. The heating plate 4 has been described in detail in the above embodiments, and for the sake of brevity, it will not be described again here.

[0050] The thin film deposition equipment in this embodiment uses a heating plate 4 with a high-efficiency heat dissipation device. By optimizing the thermal management of the Rod and the compact design of the heat dissipation structure, the temperature of the radio frequency heating rod 42 is kept stable under high load, which improves the quality and production efficiency of thin film deposition and extends the service life of the equipment.

[0051] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A heat dissipating device for dissipating heat from a heated disc, characterized by, The heat dissipation device comprises a heat conduction member, at least one heat conduction pipe and a cooling assembly, the heat conduction member is installed on the handle of the heating disc, one end of the heat conduction pipe is connected to the heat conduction member, and the other end of the heat conduction pipe is connected to the cooling assembly, and the cooling assembly is used for cooling the heat conduction pipe. The heat conduction pipe extends along the radial direction of the handle of the heating disc so that the cooling assembly is away from the heating disc.

2. The heat dissipating device according to claim 1, wherein The heat conduction member is a heat conduction ring, and the heat conduction ring is sleeved on the handle of the heating disc.

3. The heat dissipating device of claim 1, wherein At least one group of mounting holes are arranged on the side wall of the heat conduction member, each group of the mounting holes comprises a first through hole, a second through hole and a connecting hole, the connecting hole is in communication with the first through hole and the second through hole, and one end of the heat conduction pipe passes through the first through hole, the connecting hole and the second through hole in sequence.

4. The heat dissipating device according to claim 3, wherein The first through hole and the second through hole are arranged on the side wall of the heat conduction member in a spaced manner, and the connecting hole is arranged on the side of the side wall of the heat conduction member which is away from the first through hole and the second through hole.

5. The heat dissipating device of claim 1, wherein The heat conduction pipe comprises a first pipe segment, a second pipe segment and a connecting pipe segment, two ends of the connecting pipe segment are connected to one end of the first pipe segment and the second pipe segment respectively, the other end of the first pipe segment and the second pipe segment is connected to the cooling assembly, and the connecting pipe segment surrounds at least part of the side wall of the heat conduction member.

6. The heat dissipating device according to claim 5, wherein The connecting pipe segment is arranged in the side wall of the heat conduction member.

7. The heat dissipating device of claim 5, wherein The first pipe segment and the second pipe segment are arranged in parallel and in a spaced manner, and the other end of the first pipe segment and the second pipe segment extends in the same direction.

8. The heat dissipating device of claim 1, wherein, The cooling assembly comprises at least one group of air-cooled heat dissipation assemblies, each group of the air-cooled heat dissipation assemblies comprises a fan and a fin, the fin is arranged on the air inlet side of the fan, and the other end of the heat conduction pipe is inserted into the fin.

9. The heat dissipating device of claim 8, wherein, The cooling assembly comprises two groups of air-cooled heat dissipation assemblies, the other end of the heat conduction pipe comprises a first pipe segment and a second pipe segment, and the first pipe segment and the second pipe segment are inserted into the fins of the two groups of air-cooled heat dissipation assemblies respectively.

10. The heat dissipating device according to any one of claims 1 to 9, wherein The heat conduction member and / or the heat conduction pipe are made of aluminum nitride ceramic material.

11. The heat dissipating device according to any one of claims 1 to 9, wherein The heat conduction pipe is a closed heat pipe, and a phase change cooling medium is arranged in the heat pipe.

12. A heating tray characterized by, The heating disc comprises: a handle, a radio frequency heating rod and a heat dissipation device, the heat dissipation device is the heat dissipation device according to any one of claims 1-11, the radio frequency heating rod is arranged in the handle, and the heat conduction member of the heat dissipation device is installed on the handle.

13. A thin film deposition apparatus, characterized by, The heating disc comprises the heating disc according to claim 12.

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