IGBT pin equipment and its assembly process

Abstract

The present invention belongs to the technical field of electrical components, and specifically relates to equipment for processing semiconductors, and in particular to IGBT pin insertion equipment and its assembly process; the present invention provides an IGBT pin insertion equipment, including: a pin insertion device, which is rotatably arranged on a workbench; a glue stripping device, which is arranged on the workbench and is suitable for stripping glue on the surface of a workpiece; a positioning member, which is located on the surface of the workpiece; wherein the workpiece carrying the positioning member moves to a pin insertion station, and the pin insertion device is suitable for plugging the pins onto the workpiece; the workpiece moves to the glue stripping station, and the glue stripping head of the glue stripping device moves circumferentially along the outer wall of the positioning member to apply glue on the surface of the workpiece; after the glue stripping is completed, the positioning member moves upward and detaches from the workpiece, and the positioning member is suitable for removing glue at the overlapped end point and starting point during the glue stripping process; through the arrangement of the positioning member, it is possible to avoid the glue at the overlapped end point and starting point during the glue stripping process from overflowing when the cap is sealed.

Description

Technical Field

[0001] The present invention belongs to the technical field of electrical components, and specifically relates to equipment for processing semiconductors, and in particular to IGBT pin equipment and an assembly process thereof. Background Art

[0002] Before the chip is capped, it is necessary to insert matrix pins on the surface of the chip body; after the pin insertion is completed, the conveying device moves the chip to the capping device, and the chip surface is stripped, inspected, and capped.

[0003] When glue is applied to the chip surface, the glue gun moves along the circumference of the chip so that the end point coincides with the starting point. The inventor has found that there is a technical problem of increased chip signal interference at the coincidence point. It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0004] The embodiments of the present disclosure at least provide an IGBT pin device and a working method thereof.

[0005] In a first aspect, an embodiment of the present disclosure provides an IGBT pin device, including:

[0006] A pin insertion device, which is rotatably arranged on a workbench;

[0007] A glue scribing device is arranged on a workbench and is suitable for scribing glue on the surface of a workpiece;

[0008] A positioning member, which is located on the surface of the workpiece;

[0009] A first manipulator, which is arranged on a workbench;

[0010] Wherein, the first manipulator moves the workpiece carrying the positioning member to the pin insertion station, and the pin insertion device is suitable for inserting the pin on the workpiece;

[0011] The workpiece is moved to the glue scribing station, and the glue scribing head of the glue scribing device moves circumferentially along the outer wall of the positioning member to apply glue on the surface of the workpiece;

[0012] After the glue stripping is completed, the positioning member moves upward and away from the workpiece, and the positioning member is suitable for removing the glue at the position where the end point and the starting point coincide during the glue stripping process.

[0013] In an optional embodiment, a rectangular groove is provided on the surface of the workpiece;

[0014] The positioning member comprises a positioning plate, the length and width of which are smaller than the workpiece, and a plurality of through holes adapted to the pins are provided in a matrix;

[0015] A limit block is arranged at one corner of the positioning plate and is adapted to the rectangular groove;

[0016] Wherein, when the positioning plate abuts against the workpiece, the limit block is inserted into the rectangular groove;

[0017] When glueing, the glue-scraping head moves along the circumference of the outer wall of the positioning plate with the limit block as the starting point;

[0018] After the glue stripping is completed, the positioning plate is clamped by the third manipulator and separated from the workpiece, and the limit block removes the glue at the point where the end point and the starting point coincide during the glue stripping process.

[0019] In an optional embodiment, the workbench is provided with a conveyor belt along the length direction, and the conveyor belt is suitable for driving the first tray to move horizontally;

[0020] The workbench is provided with a pin insertion station slidably along the width direction, and the pin insertion station is arranged between the conveyor belt and the pin insertion device;

[0021] A first manipulator is arranged above the conveyor belt;

[0022] The conveyor belt drives the first tray to move to the first loading station, and the first manipulator clamps the workpiece and the positioning piece and moves to the pin insertion workbench;

[0023] The pin insertion station table moves horizontally to the pin insertion station, and the pin insertion device is suitable for passing the pin through the through hole to be inserted on the surface of the workpiece.

[0024] In an optional embodiment, a receiving device is provided for lifting the workbench near the unloading end of the conveyor belt;

[0025] A second manipulator is disposed on one side of the receiving device, and the second manipulator is suitable for transporting the workpiece on the receiving device to the glue drawing station.

[0026] In an optional embodiment, a detection device is provided on a side of the workbench away from the receiving device, and the detection device is suitable for detecting whether the glue marking on the surface of the workpiece is qualified.

[0027] In an optional embodiment, a placement tray is provided on one side of the detection device, and the placement tray is suitable for placing the cover plate;

[0028] A third robot is disposed on one side of the tray, and the third robot is suitable for clamping the cover plate or the positioning piece.

[0029] In an optional embodiment, the bottom wall of the cover plate is provided with a circular groove along the circumferential direction, and the length and width of the circular groove are consistent with the length and width of the positioning member;

[0030] Wherein, when the cover plate is covered on the workpiece, the circular groove is located above the glue line.

[0031] In a second aspect, the present disclosure also provides a chip encapsulation structure, including:

[0032] A positioning member, which is located on the surface of the workpiece and includes a limiting block, and the limiting block is rectangular;

[0033] A rectangular groove matching the limit block is provided on the surface of the workpiece;

[0034] After the limit block is inserted into the rectangular groove, the glue scribing head of the glue scribing device moves along the outer wall of the positioning member to scribing the surface of the workpiece;

[0035] After the glue stripping is completed, the positioning piece is separated from the workpiece surface, and the limit block is suitable for removing the glue at the overlapped end point and the starting point during the glue stripping process.

[0036] In an optional embodiment, the chip stripping and sealing structure further includes a sealing cover plate, a bottom wall of which is provided with a circular groove along the circumferential direction, and the length and width of the circular groove are consistent with the length and width of the positioning member.

[0037] In an optional embodiment, the positioning member is rectangular and has a plurality of through holes adapted to the pins;

[0038] Wherein, when the positioning piece is separated from the workpiece, the side wall of the through hole is suitable for straightening the pin with the upper end inclined.

[0039] In a second aspect, the present disclosure also provides a chip pin assembly process, including:

[0040] The workpiece carrying the positioning piece is moved to the pin insertion station, and the pin insertion device is suitable for inserting the pin into the workpiece;

[0041] The workpiece moves to the glue stripping station, and the glue stripping head of the glue stripping device moves circumferentially along the outer wall of the positioning member to apply glue on the surface of the workpiece. At this time, the positioning member is suitable for limiting the glue to prevent it from flowing toward the pin direction;

[0042] After the glue stripping is completed, the positioning member moves upward and away from the workpiece, and the positioning member is suitable for removing the glue at the overlapped end point and the starting point during the glue stripping process;

[0043] When the positioning piece is separated from the workpiece, the inner wall of the through hole on the positioning piece is suitable for straightening the pin with the upper end inclined.

[0044] The beneficial effect of the present invention is that, in an IGBT pin device and an assembly process thereof, through the setting of a positioning member, during the glue stripping process, the starting point and the end point of the glue overlap at the limit block, and the positioning member can remove the glue at the overlapped end point and the starting point during the glue stripping process when it is separated from the workpiece. The glue overflowing from the overlapped part is avoided. At the same time, during the glue stripping process, the positioning member can prevent the glue from flowing toward the pin direction on the surface of the workpiece.

[0045] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0046] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 A three-dimensional diagram of an IGBT pin device provided in an embodiment of the present disclosure;

[0049] Figure 2 A three-dimensional diagram of a positioning member provided in an embodiment of the present disclosure located on a surface of a workpiece;

[0050] Figure 3 A perspective view of a cover plate provided for an embodiment of the present disclosure;

[0051] Figure 4 A perspective view of a pin inserted into a workpiece according to an embodiment of the present disclosure;

[0052] Figure 5 A three-dimensional diagram of a cover plate provided in an embodiment of the present disclosure covering a surface of a workpiece;

[0053] Figure 6 A sectional stereoscopic view of a cover plate provided in an embodiment of the present disclosure covering a surface of a workpiece.

[0054] In the figure:

[0055] 1. Pin insertion device; 2. Glue stripping device; 20. Glue stripping head;

[0056] 3. Positioning piece; 31. Positioning plate; 32. Limiting block; 33. Through hole;

[0057] 4. Workpiece; 40. Rectangular slot;

[0058] 5. Workbench; 51. Conveyor belt; 52. First manipulator; 53. Receiving device; 54. Second manipulator; 55. Detection device; 56. Third manipulator; 57. Place tray;

[0059] 6. Covering plate; 60. Round-shaped groove. DETAILED DESCRIPTION

[0060] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0061] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component may be directly formed on the second component, or the third component may be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components may be exaggerated or reduced.

[0062] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0063] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0064] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0065] Research has found that the shortcomings of the existing technology are: when glue is applied to the chip surface, the glue gun moves along the circumference of the chip, so that the end point and the starting point overlap, and this overlap will increase the amount of glue; and when the cover is directly applied to the chip, the overlap will cause glue to overflow, which will not only change the chip's signal transmission path or damage the signal integrity, but also cause the cover to be less stable and the heat dissipation to be poor. At the same time, during the process of inserting pins on the workpiece surface, the pins will tilt relative to the workpiece, that is, some pins cannot be guaranteed to be perpendicular to the workpiece.

[0066] Therefore, how to prevent glue from overflowing from the overlapped point between the end point and the starting point of glue during capping is a technical problem that needs to be solved urgently in the art.

[0067] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present invention in this article for the above problems should be the contributions made by the inventor to the present invention during the disclosure process.

[0068] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0069] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0070] like Figures 1 to 6 As shown, at least one embodiment provides an IGBT pin insertion device, comprising: a pin insertion device 1, which is rotatably arranged on a workbench 5; the pin insertion device 1 is suitable for inserting a pin into a surface of a workpiece 4. A glue stripping device 2, which is arranged on the workbench 5 and is suitable for stripping glue on the surface of the workpiece 4; a multi-station turntable is arranged between the glue stripping device 2, the second manipulator 54 and the detection device 55, and the multi-station turntable is rotatably arranged on the workbench 5.

[0071] Reference Figure 2 , a positioning member 3, which is located on the surface of the workpiece 4; the positioning member 3 is rectangular and smaller than the workpiece 4. Among them, the workpiece 4 carrying the positioning member 3 moves to the pin insertion station, and the pin insertion device 1 is suitable for plugging the pin into the workpiece 4; the second manipulator 54 transports the workpiece 4 to the multi-station turntable, and the multi-station turntable rotates the workpiece to the glue stripping station, and the glue stripping head 20 of the glue stripping device 2 moves circumferentially along the outer wall of the positioning member 3 to apply glue on the surface of the workpiece 4; after the glue stripping is completed, the positioning member 3 moves upward to separate from the workpiece 4, and the positioning member 3 is suitable for removing the glue at the point where the end point and the starting point coincide during the glue stripping process. Through the setting of the positioning member 3, during the glue stripping process, the starting point and the end point of the glue coincide at the limit block 32, and the positioning member 3 can remove the glue at the point where the end point and the starting point coincide during the glue stripping process when it is separated from the workpiece 4. Glue overflow at the overlapped position is avoided. At the same time, during the glue stripping process, the positioning member 3 can prevent the glue from flowing toward the pin direction on the surface of the workpiece 4.

[0072] Continue to refer to the attached Figure 2 , a rectangular groove 40 is provided on the surface of the workpiece 4; the positioning member 3 includes a positioning plate 31, the length and width of which are smaller than the workpiece 4, and a plurality of through holes 33 adapted to the pins are provided in a matrix; a limit block 32 is arranged at a corner of the positioning plate 31 and adapted to the rectangular groove 40; when the glue scribing head 20 starts to scribing, the point where the end point of the glue coincides with the starting point is located on the limit block 32. Therefore, when the positioning plate 31 is removed from the surface of the workpiece, the glue at the point where the end point coincides with the starting point can be removed. Among them, when the positioning plate 31 abuts against the workpiece 4, the limit block 32 is inserted into the rectangular groove 40. When the conveyor belt 51 drives the workpiece 4 and the positioning member 3 to move to the first loading station, the first manipulator 52 clamps the workpiece 4 and the positioning member 3 and moves them to the pin insertion station, and the pin insertion device 1 passes the pin through the through hole 33 to be plugged and fixed on the workpiece 4. At this time, each pin is perpendicular to the workpiece 4 and protrudes out of the positioning member 3.

[0073] Reference Figure 1, the workbench 5 is provided with a conveyor belt 51 along the length direction, and the conveyor belt 51 is suitable for driving the first pallet to move horizontally; a plurality of placement positions are provided on the first pallet, and the workpiece 4 and the positioning member 3 are placed horizontally in the placement positions. The workbench 5 is provided with a pin insertion station sliding along the width direction, and the pin insertion station is arranged between the conveyor belt 51 and the pin insertion device 1; a first manipulator 52 is arranged above the conveyor belt 51; wherein, the conveyor belt 51 drives the first pallet to move to the first loading station, and the first manipulator 52 clamps the workpiece 4 and the positioning member 3 and moves them to the pin insertion station; the pin insertion station moves horizontally to the pin insertion station, and the pin insertion device 1 is suitable for passing the pin through the through hole 33 to be plugged into the surface of the workpiece 4. After the pin insertion is completed, the first manipulator 52 clamps the workpiece 4 and the positioning member 3 and transports them to the first pallet, and the conveyor belt 51 drives the first pallet to move horizontally toward the receiving device 53.

[0074] Continue to refer to the attached Figure 1 , the workbench 5 is provided with a receiving device 53 at the unloading end near the conveyor belt 51; the receiving device 53 is suitable for supporting the first pallet, and after the workpiece on the first pallet is transported to the multi-station turntable by the second manipulator 54, the receiving device 53 is suitable for driving the first pallet to move downward. A second manipulator 54 is provided on one side of the receiving device 53, and the second manipulator 54 is suitable for transporting the workpiece 4 on the receiving device 53 to the glue stripping station. After the conveyor belt 51 drives the first pallet to move to the receiving device 53, the second manipulator 54 transports all the workpieces 4 on the first pallet to the glue stripping station, and the receiving device 53 moves downward to transport the first pallet to the unloading end for recycling again.

[0075] Continue to refer to the attached Figure 1 , a detection device 55 is provided on one side of the workbench 5 away from the receiving device 53, and the detection device 55 is arranged above the multi-station turntable. The detection device 55 is suitable for detecting whether the glue stripping on the surface of the workpiece 4 is qualified. A placement tray 57 is provided on one side of the detection device 55, and the placement tray 57 is suitable for placing the cover plate 6; a third manipulator 56 is provided on one side of the placement tray 57, and the third manipulator 56 is suitable for clamping the cover plate 6 or the positioning member 3. After the workpiece 4 is qualified in the inspection, the third manipulator 56 clamps the positioning member 3 so that the positioning member 3 is separated from the surface of the workpiece 4. In the process of separating the positioning plate 31 from the workpiece 4, the inner wall of the through hole 33 of the positioning plate 31 is suitable for straightening the inclined pins so that the pins can remain vertical relative to the workpiece 4. After the positioning plate 31 is removed, the third manipulator clamps the cover plate 6 to cover it on the surface of the workpiece 4.

[0076] Reference Figure 3 and Figure 6, the bottom wall of the cover plate 6 is provided with a circular groove 60 along the circumferential direction, and the circular groove 60 is used to contain excess glue to prevent the glue from overflowing when the cover plate 6 is covered. The length and width of the circular groove 60 are consistent with the length and width of the positioning member 3; wherein, when the cover plate 6 is covered on the workpiece 4, the circular groove 60 is located above the glue line. When the cover plate 6 is covered, the strip of glue on the surface of the workpiece 4 corresponds to the circular groove 60, and the excess glue flows into the circular groove 60, thereby preventing the glue from overflowing during the covering process.

[0077] At least one embodiment provides a chip stripping and capping structure, including: a positioning member 3, which is located on the surface of a workpiece 4 and includes a limit block 32, and the limit block 32 is rectangular; a rectangular groove 40 adapted to the limit block 32 is opened on the surface of the workpiece 4; wherein, after the limit block 32 is inserted into the rectangular groove 40, the stripping head 20 of the stripping device 2 moves along the outer wall of the positioning member 3 to strip the surface of the workpiece 4; after the stripping is completed, the positioning member 3 is detached from the surface of the workpiece 4, and the limit block 32 is suitable for removing the glue at the point where the end point and the starting point coincide during the stripping process.

[0078] At least one embodiment provides a chip assembly process, including: a workpiece 4 carrying a positioning member 3 moves to a pin insertion station, and the pin insertion device 1 is suitable for inserting the pin on the workpiece 4; the workpiece 4 moves to a glue stripping station, and the glue stripping head 20 of the glue stripping device 2 moves circumferentially along the outer wall of the positioning member 3 to apply glue on the surface of the workpiece 4, and at this time, the positioning member 3 is suitable for limiting the glue to prevent it from flowing in the direction of the pin; after the glue stripping is completed, the positioning member 3 moves upward and separates from the workpiece 4, and the positioning member 3 is suitable for removing the glue at the point where the end point and the starting point coincide during the glue stripping process; in the process of the positioning member 3 separating from the workpiece 4, the inner wall of the through hole 33 on the positioning member 3 is suitable for straightening the pin with an inclined upper end.

[0079] In summary, the positioning member 3 is placed on the surface of the workpiece 4, and the limit block 32 is inserted into the rectangular groove 40, so that each through hole 33 is compatible with the pin insertion hole on the surface of the workpiece 4. The conveyor belt 51 drives the workpiece 4 to move to the first loading station, the first manipulator 52 clamps the workpiece 4 and moves it to the pin insertion station, the pin insertion station moves to the pin insertion station, and the pin insertion device 1 inserts the pins on the surface of the workpiece 4. After the pin insertion is completed, the first manipulator 52 transports the workpiece 4, and the conveyor belt 51 moves it to the receiving device 53. The second manipulator 54 clamps the workpiece 4 and moves it to the glue stripping station. The glue stripping head 20 of the glue stripping device 2 moves horizontally along the outer wall of the positioning plate 31 to strip glue on the surface of the workpiece 4. After the glue stripping is completed, the third manipulator 56 clamps the positioning plate 31 to separate the positioning plate 31 from the workpiece 4. The positioning plate 31 can straighten the tilted pins during the separation process. The third manipulator 56 covers the cover plate 6 on the surface of the workpiece 4 to complete the cover of the workpiece 4.

[0080] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0081] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0082] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. An IGBT pin device, characterized in that: include: A needle insertion device (1) rotatably arranged on a workbench (5); A glue scribing device (2), which is arranged on a workbench (5) and is suitable for scribing glue on the surface of a workpiece (4); A positioning member (3) located on the surface of a workpiece (4); A first manipulator (52) disposed on a workbench (5); The first manipulator (52) moves the workpiece (4) carrying the positioning member (3) to the pin insertion station, and the pin insertion device (1) inserts the pin into the workpiece (4); The workpiece (4) moves to the glue scribing station, and the glue scribing head (20) of the glue scribing device (2) moves circumferentially along the outer wall of the positioning member (3) to apply glue to the surface of the workpiece (4); After the glue stripping is completed, the positioning member (3) moves upward and away from the workpiece (4), and the positioning member (3) is suitable for removing glue at the point where the end point and the starting point coincide during the glue stripping process; The workpiece (4) has a rectangular groove (40) formed on its surface; The positioning member (3) comprises a positioning plate (31), the length and width of which are smaller than the workpiece (4), and a plurality of through holes (33) adapted to the pins are provided in a matrix manner; A limit block (32) is arranged at a corner of the positioning plate (31) and is adapted to fit the rectangular groove (40); When the positioning plate (31) abuts against the workpiece (4), the limiting block (32) is inserted into the rectangular groove (40); When glue is being applied, the glue-stripping head (20) moves along the circumferential direction of the outer wall of the positioning plate (31) with the limiting block (32) as a starting point; After the glue stripping is completed, the positioning plate (31) is clamped by the third robot (56) and separated from the workpiece (4), and the limit block (32) removes the glue at the point where the end point and the starting point overlap during the glue stripping process.

2. The IGBT pin device according to claim 1, characterized in that: The workbench (5) is provided with a conveyor belt (51) along the length direction, and the conveyor belt (51) is suitable for driving the first tray to move horizontally; The workbench (5) is provided with a needle insertion station slidably arranged along the width direction, and the needle insertion station is arranged between the conveyor belt (51) and the needle insertion device (1); The first robot (52) is arranged above the conveyor belt (51); The conveyor belt (51) drives the first tray to move to the first loading station, and the first manipulator (52) clamps the workpiece (4) and the positioning member (3) above the first tray and moves them to the pin insertion workbench (5); The pin insertion station table moves horizontally to the pin insertion station, and the pin insertion device (1) is suitable for passing the pin through the through hole (33) to be inserted into the surface of the workpiece (4).

3. The IGBT pin device according to claim 2, characterized in that: The workbench (5) is provided with a receiving device (53) at a position close to the unloading end of the conveyor belt (51) for lifting; A second robot (54) is provided on one side of the receiving device (53), and the second robot (54) is suitable for moving the workpiece (4) on the receiving device (53) to the glue marking station.

4. The IGBT pin device according to claim 3, characterized in that: A detection device (55) is provided on a side of the workbench (5) away from the receiving device (53), and the detection device (55) is suitable for detecting whether the glue stroke on the surface of the workpiece (4) is qualified.

5. The IGBT pin device according to claim 4, characterized in that: A placement tray (57) is provided on one side of the detection device (55), and the placement tray (57) is suitable for placing the cover plate (6); A third robot (56) is provided on one side of the placement tray (57), and the third robot (56) is suitable for clamping the cover plate (6) or the positioning member (3).

6. The IGBT pin device according to claim 5, characterized in that: The bottom wall of the cover plate (6) is provided with a circular groove (60) along the circumferential direction, and the length and width of the circular groove (60) are consistent with the length and width of the positioning member (3); Wherein, when the cover plate (6) is covered on the workpiece (4), the circular groove (60) is located above the glue line.

7. A chip encapsulation structure, characterized in that: include: A positioning member (3) is located on the surface of the workpiece (4) and comprises a limiting block (32), wherein the limiting block (32) is rectangular; A rectangular groove (40) adapted to the limit block (32) is provided on the surface of the workpiece (4); After the limiting block (32) is inserted into the rectangular groove (40), the glue scribing head (20) of the glue scribing device (2) moves along the outer wall of the positioning member (3) to scribing the surface of the workpiece (4); After the glue stripping is completed, the positioning member (3) is separated from the surface of the workpiece (4), and the limit block (32) is suitable for removing the glue at the point where the end point and the starting point coincide during the glue stripping process.

8. The chip encapsulation structure according to claim 7, characterized in that: The chip stripping and sealing structure further comprises a sealing cover plate (6), the bottom wall of which is provided with a circular groove (60) along the circumferential direction, the length and width of the circular groove being consistent with the length and width of the positioning member (3).

9. The chip encapsulation structure according to claim 8, characterized in that: The positioning member (3) is rectangular and is provided with a plurality of through holes (33) adapted to the pins; In the process of the positioning member (3) being separated from the workpiece (4), the side wall of the through hole (33) is suitable for straightening the pin with an inclined upper end.

10. A chip pin assembly process, characterized in that: The IGBT pin device according to any one of claims 1 to 6 comprises: The workpiece (4) carrying the positioning piece (3) is moved to the pin insertion station, and the pin insertion device (1) is suitable for inserting the pin into the workpiece (4); The workpiece (4) moves to the glue stripping station, and the glue stripping head (20) of the glue stripping device (2) moves circumferentially along the outer wall of the positioning member (3) to apply glue to the surface of the workpiece (4). At this time, the positioning member (3) is suitable for limiting the glue and preventing it from flowing toward the pin direction; After the glue stripping is completed, the positioning member (3) moves upward and away from the workpiece (4), and the positioning member (3) is suitable for removing glue at the point where the end point and the starting point coincide during the glue stripping process; When the positioning member (3) is separated from the workpiece (4), the inner wall of the through hole (33) on the positioning member (3) is suitable for straightening the upper end of the inclined pin.

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