Wafer rotation transposition mechanism, semiconductor measurement equipment and use method

Abstract

The invention discloses a wafer rotation transposition mechanism, semiconductor measurement equipment and a use method. The wafer rotation transposition mechanism comprises an arm assembly, a magnetofluid assembly and a driving assembly. The arm assembly comprises a transposition arm and a rotating shaft, the two ends of the transposition arm symmetrically extend to form bearing parts used for bearing wafers, and the upper end of the rotating shaft is fixedly connected with the center position of the transposition arm; the magnetofluid assembly comprises a sealing shell sleeve and a magnetofluid seal, the rotating shaft is sleeved with the sealing shell sleeve, and the magnetofluid seal is located between the sealing shell sleeve and the rotating shaft; the driving assembly is connected with the lower end of the rotating shaft and used for driving the rotating shaft to rotate. The wafer rotation transposition mechanism has the advantages of simple structure, small size, low assembly difficulty, low manufacturing cost and maintenance cost and the like.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor measurement technology, and in particular relates to a wafer rotation and transposition mechanism, a semiconductor measurement device and a use method. Background Art

[0002] At present, there are many types of wafer transfer mechanisms used in semiconductor equipment, each of which achieves different purposes. For example, when performing wafer measurement, a multi-degree-of-freedom vacuum manipulator is usually used to achieve wafer transposition transfer, that is, to transfer the wafer to be tested from the vacuum sub-chamber to the vacuum main chamber (testing position), or to transfer the tested wafer from the vacuum main chamber to the vacuum sub-chamber, thereby completing the measurement and loading and unloading of the wafer.

[0003] However, multi-degree-of-freedom vacuum manipulators are not only complex in structure and large in size, but also have high procurement costs. On the one hand, the vacuum chamber in the semiconductor measurement equipment needs to be set very large to accommodate the vacuum manipulator, which is not conducive to the miniaturization of semiconductor measurement equipment; on the other hand, it is difficult to assemble the multi-degree-of-freedom vacuum manipulator in the vacuum chamber, which increases the difficulty of assembling semiconductor measurement equipment. In addition, the high price of multi-degree-of-freedom vacuum manipulators also increases the manufacturing cost and maintenance cost of semiconductor measurement equipment. Summary of the invention

[0004] In view of the above problems, the present invention discloses a wafer rotation and transposition mechanism, a semiconductor measurement device and a use method to overcome the above problems or at least partially solve the above problems.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] On one hand, the present invention discloses a wafer rotation transposition mechanism, comprising an arm component, a magnetic fluid component and a drive component;

[0007] The arm assembly includes a transposition arm and a rotating shaft, two ends of the transposition arm are symmetrically extended with receiving parts for receiving wafers, and the upper end of the rotating shaft is fixedly connected to the center position of the transposition arm;

[0008] The magnetic fluid assembly comprises a sealing shell and a magnetic fluid seal, wherein the sealing shell is sleeved on the rotating shaft, and the magnetic fluid seal is located between the sealing shell and the rotating shaft;

[0009] The driving assembly is connected to the lower end of the rotating shaft and is used for driving the rotating shaft to rotate.

[0010] Further, the arm assembly also includes an upper pressing plate and a lower pressing plate;

[0011] The upper pressing plate is located above the transposition arm, and the lower pressing plate is located below the transposition arm. The upper pressing plate, the transposition arm and the lower pressing plate are fixedly connected by screws or bolts, and the lower pressing plate and the rotating shaft are fixedly connected by screws or bolts. The lower pressing plate is provided with a plurality of top screw holes, and each of the top screw holes is provided with a top screw. The upper end of the top screw presses the transposition arm to adjust the flatness of the transposition arm.

[0012] Further, the arm assembly also includes a positioning pin;

[0013] An upper positioning hole is provided on the transposition arm below the upper pressure plate, and a lower positioning hole corresponding to the upper positioning hole is provided on the lower pressure plate, and the positioning pin is located in the upper positioning hole and the lower positioning hole; two positioning protrusions are formed on the upper end surface of the lower pressure plate, and the two positioning protrusions are used to position the two sides of the transposition arm.

[0014] Further, the rotating shaft comprises an upper central shaft and a magnetic fluid shaft which are fixedly connected in sequence from top to bottom;

[0015] The upper central shaft and the magnetic fluid shaft are fixedly connected via a bellows coupling.

[0016] Furthermore, the magnetic fluid assembly further comprises a first bearing and a second bearing disposed in the sealing shell;

[0017] The magnetic fluid shaft is inserted into the sealing shell from the top of the sealing shell, the first bearing is sleeved on the magnetic fluid shaft above the magnetic fluid seal, the upper end of the sealing shell is covered with a sealing shell cover, the sealing shell cover is used to axially compress and fix the outer ring of the first bearing, a first spacer is provided between the outer circle of the first bearing and the magnetic fluid seal, the second bearing is sleeved on the magnetic fluid shaft below the magnetic fluid seal, a second spacer is provided between the outer circle of the second bearing and the magnetic fluid seal, retaining rings are respectively sleeved on the magnetic fluid shaft on both sides of the second bearing, and the two retaining rings are used to fix the inner ring of the second bearing; a flange is formed on the outer circumference of the sealing shell, an annular sealing groove is opened on the upper end surface of the flange, a sealing member is provided in the sealing groove, and a plurality of fixing holes are provided on the flange.

[0018] Further, the drive assembly includes a motor and a mounting plate;

[0019] The motor is fixed on the mounting plate, the output shaft of the motor is fixedly connected to the lower end of the magnetic fluid shaft, and a plurality of connecting columns are connected between the mounting plate and the flange.

[0020] Further, two sensing components are included;

[0021] The sensing component includes a photoelectric sensor and a baffle, the photoelectric sensor is fixed to the connecting column through a bracket, the baffle is fixed to the magnetic fluid axis, the two photoelectric sensors are arranged at 90 degrees in the horizontal direction, and the two baffles are arranged at 180 degrees in the horizontal direction.

[0022] Furthermore, a plurality of accommodating grooves and a plurality of concentric arc-shaped engraved lines are provided on the upper end surface of the receiving portion, a flexible member is provided in each of the accommodating grooves, and the radius of each of the arc-shaped engraved lines is different.

[0023] Another aspect of the present invention discloses a semiconductor measurement device, including a vacuum chamber, a lifting mechanism, a workbench and the wafer rotation and transposition mechanism described above;

[0024] A through hole is provided at the bottom of the vacuum chamber, and the transposition arm extends into the vacuum chamber through the through hole. The sealing shell is located at the through hole and is fixedly connected to the bottom wall of the vacuum chamber. The lifting mechanism and the workbench are arranged in the vacuum chamber and on both sides of the transposition arm along the X-axis direction. A first support column is provided on the lifting mechanism, and the first support column can lift the wafer and move between a high position, a middle position and a low position in a vertical direction. A second support column is provided on the workbench, and the second support seat can lift the wafer and move between a loading and unloading position and an avoidance position in a vertical direction.

[0025] Another aspect of the present invention discloses a method for using the semiconductor measurement device described above, which specifically comprises the following steps:

[0026] Step 01, after the wafer on the workbench has been measured, the second support column lifts the measured wafer to the loading and unloading position, and the first support column lifts the wafer to be measured to the middle position;

[0027] Step 02, the transposition arm is rotated 90° in the positive direction from the initial position along the X-axis direction, so that one of the receiving parts is located below the measured wafer and the other receiving part is located below the wafer to be measured;

[0028] Step 03, the second supporting column moves down to the avoidance position, so that the measured wafer is placed on the corresponding receiving portion, and the first supporting column moves down to the low position, so that the wafer to be measured is placed on the corresponding receiving portion;

[0029] Step 04, the transposition arm rotates 180° in the opposite direction, so that the wafer to be measured rotates to the top of the workbench, and the measured wafer rotates to the top of the lifting mechanism, and then the second support column moves up to the loading and unloading position, so that the wafer to be measured is placed on the second support column, and the first support column moves up to the middle position, so that the measured wafer is placed on the first support column;

[0030] Step 05, the position change arm rotates forward 90° and returns to the initial position, and then the first support column moves up to a high position to load and unload the wafer on the first support column.

[0031] The advantages and beneficial effects of the present invention are:

[0032] In the wafer rotation and transposition mechanism of the present invention, a magnetic fluid component with a vacuum sealing function is arranged between the arm component and the drive component, so that the transposition arm can be placed in the vacuum chamber, and the drive component is placed outside the vacuum chamber, thereby reducing the difficulty of assembling the wafer rotation and transposition mechanism on the vacuum chamber; and, by providing a transposition arm, and symmetrically extending receiving parts for receiving the wafer at both ends of the transposition arm, the wafer transposition transfer can be achieved, and the structure is simple, the size is small, and the manufacturing cost and maintenance cost are lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0034] Figure 1 A three-dimensional structural diagram of a wafer rotation and transposition mechanism in one embodiment of the present invention;

[0035] Figure 2 The exploded structural diagram of an arm assembly with the rotating axis removed according to one embodiment of the present invention;

[0036] Figure 3 is a top view of an arm assembly according to an embodiment of the present invention;

[0037] Figure 4 is an axial cross-sectional view of a magnetic fluid assembly in one embodiment of the present invention;

[0038] Figure 5 A diagram showing the connection structure of a driving component and a magnetic fluid component in one embodiment of the present invention;

[0039] Figure 6 A diagram showing the connection structure of a photoelectric sensor and a bracket in one embodiment of the present invention;

[0040] Figure 7 A front view of a semiconductor measurement device according to another embodiment of the present invention;

[0041] Figure 8 and Fig. 9 is an internal structure diagram of a semiconductor measurement device in another embodiment of the present invention;

[0042] Fig.10It is a structural schematic diagram of another embodiment of the present invention when the first support column is located at the middle position and the second support column is located at the loading and unloading position;

[0043] Fig.11 It is a structural schematic diagram of another embodiment of the present invention when the first support column is located at a low position and the second support column is located at an avoidance position;

[0044] Fig.12 FIG. 4 is a diagram showing the implementation steps of a method for using a semiconductor measurement device in yet another embodiment of the present invention.

[0045] In the figure: 1, transposition arm; 2, receiving part; 3, sealing shell; 4, magnetic fluid seal; 5, upper center axis; 6, lower center axis; 7, magnetic fluid axis; 8, bellows coupling; 9, first screw; 10, upper pressure plate; 11, lower pressure plate; 12, positioning pin; 13, second screw; 14, top screw; 15, washer; 16, positioning protrusion; 17, first bearing; 18, second bearing; 19, sealing shell cover; 20, first spacer; 21, second spacer; 2 2. retaining ring; 23. flange; 24. sealing groove; 25. fixing hole; 26. motor; 27. mounting plate; 28. connecting column; 29. ​​coupling; 30. photoelectric sensor; 31. long bracket; 32. short bracket; 33. third screw; 34. fourth screw; 35. flexible part; 36. arc-shaped engraved line; 37. retaining plate; 38. vacuum chamber; 39. lifting mechanism; 40. workbench; 41. first supporting column; 42. second supporting column; 43. wafer. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0048] In one embodiment of the present invention, a wafer rotation and transposition mechanism is provided, such as Figures 1 to 5 As shown, the wafer rotation and transposition mechanism includes an arm component, a magnetic fluid component and a drive component.

[0049] Specifically, the arm assembly includes a transposition arm 1 and a rotating shaft. The two ends of the transposition arm 1 are symmetrically extended with receiving parts 2 for receiving wafers. The upper end of the rotating shaft is fixedly connected to the center position of the transposition arm 1. The driving assembly is connected to the lower end of the rotating shaft, and is used to drive the rotating shaft to rotate, so that when the driving assembly drives the rotating shaft to rotate, the transposition arm 1 can rotate with the center position as the rotation center. When the wafer is transposed, the two receiving parts 2 respectively receive two wafers, and the transposition arm 1 is driven to rotate through the rotating shaft to achieve the transposition of the two wafers. Among them, the thickness of the transposition arm is 2mm to 4mm, and the material is preferably ceramic to avoid metal contamination.

[0050] In addition, the magnetic fluid component includes a sealing shell 3 and a magnetic fluid seal 4, the sealing shell 3 is sleeved on the rotating shaft, and the magnetic fluid seal 4 is located between the sealing shell 3 and the rotating shaft; in this way, when the wafer rotation and transposition mechanism is assembled on the vacuum chamber, the sealing shell 3 can be fixed to the cavity wall of the vacuum chamber, so that only the arm component is located in the vacuum chamber, and the driving component is located outside the vacuum chamber, and the sealing between the vacuum chamber and the wafer rotation and transposition mechanism is achieved by the sealing shell 3 and the magnetic fluid seal 4.

[0051] In summary, in the wafer rotation and transposition mechanism of the present embodiment, a magnetic fluid component with a vacuum sealing function is arranged between the arm component and the drive component, so that the transposition arm can be placed in the vacuum chamber, and the drive component is placed outside the vacuum chamber, thereby reducing the difficulty of assembling the wafer rotation and transposition mechanism on the vacuum chamber; and, by providing a transposition arm, and symmetrically extending receiving parts at both ends of the transposition arm for receiving the wafer, the wafer transposition transfer can be achieved, and the structure is simple, the size is small, and the manufacturing cost and maintenance cost are lower.

[0052] In this embodiment, if Figures 1 to 3 As shown, the arm assembly also includes an upper pressing plate 10 and a lower pressing plate 11.

[0053] Among them, the upper pressing plate 10 is located above the transposition arm 1, and the lower pressing plate 11 is located below the transposition arm 1. The upper pressing plate 10, the transposition arm 1 and the lower pressing plate 11 are fixedly connected by the first screw 9, or fixedly connected by bolts; in addition, the arm assembly is provided with a second screw 13, and the second screw 13 passes through the upper pressing plate 10, the transposition arm 1 and the lower pressing plate 11 in sequence, and is fixedly connected to the upper end of the rotating shaft. The second screw 13 is sleeved with a washer 15 to increase the tightness of the connection; of course, the second screw can also be replaced by a bolt. A plurality of top screw holes are provided on the lower pressing plate 11, and a top screw 14 is provided in each top screw hole. The plurality of top screw holes are not on the same straight line. The upper end of the top screw 14 presses the transposition arm 1 to adjust the flatness of the transposition arm 1, that is, the flatness of the transposition arm 1 is adjusted by the depth of the top screw 14 screwed into the top screw hole, so that the assembled transposition arm 1 can be parallel to the horizontal plane, further improving the accuracy of receiving the wafer. It should be noted that the adjustment is performed before the second screw is tightened.

[0054] And, if Figure 2 As shown, the arm assembly also includes a positioning pin 12.

[0055] An upper positioning hole is provided on the transposition arm 1 below the upper pressure plate 10, and a lower positioning hole corresponding to the upper positioning hole is provided on the lower pressure plate 11. The positioning pins 12 are located in the upper positioning hole and the lower positioning hole. The positioning pins 12 are used to realize the positioning of the transposition arm 1 and the lower pressure plate 11, so that the transposition arm 1 can be more accurately assembled on the lower pressure plate 11, thereby improving the accuracy of the transposition arm 1 in receiving the wafer; two positioning protrusions 16 are formed on the upper end surface of the lower pressure plate 11, and the two positioning protrusions 16 are used to position the two sides of the transposition arm 1, further increasing the positioning effect of the transposition arm 1, and at the same time can also share the torque generated when the lower pressure plate 11 drives the transposition arm 1 to rotate.

[0056] In addition, if Figure 1 and Figure 4 As shown, the rotating shaft includes an upper central shaft 5, a lower central shaft 6 and a magnetic fluid shaft 7 which are fixedly connected in sequence from top to bottom.

[0057] The upper end of the upper center shaft 5 is fixedly connected to the lower pressure plate 11, and the lower end of the upper center shaft 5 and the upper end of the lower center shaft 6 are fixedly connected via a bellows coupling 8. The rotating shaft adopts a segmented structure, which, on the one hand, facilitates the assembly of the wafer rotation and transposition mechanism in a narrow vacuum chamber; on the other hand, the axial length of the rotating shaft can be fine-tuned by the bellows coupling 8, so that the assembly accuracy of the wafer rotation and transposition mechanism is higher, thereby enabling the transposition arm 1 to more accurately receive the wafer. Of course, in other embodiments, the lower center shaft can also be omitted, and the upper center shaft is directly fixedly connected to the magnetic fluid shaft via a bellows coupling to make the structure simpler.

[0058] In this embodiment, if Figure 4As shown, the magnetic fluid assembly further includes a first bearing 17 and a second bearing 18 disposed in the sealing shell 3 .

[0059] The magnetic fluid shaft 7 is inserted into the sealing shell 3 from the top of the sealing shell 3, the first bearing 17 is sleeved on the magnetic fluid shaft 7 above the magnetic fluid seal 4, and the upper end of the sealing shell 3 is covered with a sealing shell cover 19. The sealing shell cover 19 is used to axially compress and fix the outer ring of the first bearing 17 to prevent the first bearing 17 from axially moving. A first spacer 20 is provided between the outer circle of the first bearing 17 and the magnetic fluid seal 4. The second bearing 18 is sleeved on the magnetic fluid shaft 7 below the magnetic fluid seal 4, and a second spacer 21 is provided between the outer circle of the second bearing 18 and the magnetic fluid seal 4. The first spacer 20 and the second spacer 21 are used to achieve the spacing between the first bearing 17, the magnetic fluid seal 4 and the second bearing 18. On the one hand, the outer ring of the first bearing 17 can be fixed, and on the other hand, the first bearing 17 and the second bearing 18 can be prevented from interfering with the magnetic fluid seal 4 when they rotate. The magnetic fluid shaft 7 on both sides of the second bearing 18 is respectively sleeved with retaining rings 22, and the two retaining rings 22 are used to fix the inner ring of the second bearing 18, so as to achieve relative fixation between the inner ring of the second bearing 18 and the magnetic fluid shaft 7; a flange 23 is formed on the outer circumference of the sealing shell 3, and an annular sealing groove 24 is formed on the upper end surface of the flange 23, and a sealing member is arranged in the sealing groove 24, and a plurality of fixing holes 25 are arranged on the flange 23. In this way, the wafer rotation transposition mechanism can be fixed on the cavity wall of the vacuum chamber through the fixing holes 25, and sealing can be achieved through the sealing member.

[0060] Among them, the magnetic fluid seal specifically includes an annular permanent magnet and two annular pole shoes; the annular permanent magnet and the two annular pole shoes are both sleeved on the magnetic fluid shaft, and the annular permanent magnet is located between the two annular pole shoes, a sealing O-ring is provided between each annular pole shoe and the sealing shell, and a magnetic liquid is provided between each annular pole shoe and the magnetic fluid shaft.

[0061] In addition, if Figure 1 and Figure 5 As shown, the driving assembly includes a motor 26 and a mounting plate 27; wherein the motor is a stepping motor, which can accurately control the rotation angle to ensure that the transposition arm can accurately rotate to the wafer and accurately deliver the wafer to the target position.

[0062] The motor 26 is fixed on the mounting plate 27, and the output shaft of the motor 26 is fixedly connected to the lower end of the magnetic fluid shaft 7. The output shaft of the motor 26 is fixedly connected to the lower end of the magnetic fluid shaft 7 through a coupling 29. The coupling 29 can be a bellows coupling, so that the distance between the motor 26 and the magnetic fluid shaft 7 can be fine-tuned through the coupling 29 to ensure the accuracy of assembly. A plurality of connecting columns 28 are connected between the mounting plate 27 and the flange 23, and the mounting plate 27 and the sealing shell 3 are relatively fixed through the connecting columns 28. Among them, the number of connecting columns is preferably four, and the four connecting columns are arranged in a square.

[0063] Furthermore, if Figure 1 , Figure 5 and Figure 6 As shown, the wafer rotation and transposition mechanism also includes two sensing components.

[0064] The sensing component includes a photoelectric sensor 30 and a baffle 37. The photoelectric sensor 30 is fixed on the connecting column 28 through a bracket. The bracket specifically includes a long bracket 31 and a short bracket 32. The photoelectric sensor 30 is fixed to one end of the long bracket 31 through a fourth screw 34. The short bracket 32 ​​is fixed to the other end of the long bracket 31 through a third screw 33. The long bracket 31 and the short bracket 32 ​​are clamped and fixed on the connecting column 28. The baffle 37 is fixed on the magnetic fluid shaft 7. The two photoelectric sensors 30 are arranged at 90° in the horizontal direction, and the two baffles 37 are arranged at 180° in the horizontal direction. In this way, the current position and the position after rotation of the transposition arm 1 can be confirmed through the photoelectric sensor 30 and the baffle 37.

[0065] In addition, if Figure 2 and Figure 3 As shown, a plurality of receiving grooves are provided on the upper end surface of the receiving portion 2, and a flexible member 35 is provided in each receiving groove. When the transposition arm 1 receives the wafer, the flexible member 35 contacts the wafer, which can increase the friction between the transposition arm 1 and the wafer, effectively preventing the wafer from being thrown off when the transposition arm 1 rotates, and also reducing metal pollution. The flexible member can be a rubber O-ring, and the receiving groove can be a dovetail groove, which can prevent the flexible member from falling off.

[0066] At the same time, a plurality of concentric arcuate lines 36 are provided on the upper end surface of the receiving portion 2, and the radius of each arcuate line 36 is different, which can be respectively applicable to four-inch wafers, six-inch wafers, and eight-inch wafers; when assembling the wafer rotation and transposition mechanism, the position of the transposition arm 1 can be calibrated through the arcuate lines 36, so that the receiving portion 2 can accurately receive the wafer. Among them, the arcuate lines can be grooves with a width of 1 mm and a depth of 1 mm.

[0067] Another embodiment of the present invention provides a semiconductor measurement device, such as Figures 7 to 9 As shown, the semiconductor measurement equipment includes a vacuum chamber 38, a lifting mechanism 39, a workbench 40 and the wafer rotation and transposition mechanism in the above embodiment.

[0068] Specifically, a through hole is opened at the bottom of the vacuum chamber 38, and the transposition arm 1 extends into the vacuum chamber 38 through the through hole. The sealing shell is located at the through hole, and the bearing shell is fixedly connected to the side wall of the vacuum chamber 38, that is, the bearing shell is fixedly connected to the bottom wall of the vacuum chamber 38 through the flange 23; in this way, the wafer rotation transposition mechanism is divided into two parts, which are respectively installed on the outside and inside of the vacuum chamber 38. Among them, the drive component is installed on the outside of the vacuum chamber, which reduces the assembly difficulty of the wafer rotation transposition mechanism, and can avoid electromagnetic interference with the electron beam in the vacuum chamber, and can also avoid metal contamination.

[0069] In addition, the lifting mechanism 39 and the workbench 40 are arranged in the vacuum chamber 38 and arranged on both sides of the transposition arm 1 along the X-axis direction. The workbench 40 can move along the X-axis, Y-axis and Z-axis directions, and is mainly used for the movement and positioning of the wafer during the measurement process; the lifting mechanism 39 is provided with a first support column 41, which can hold the wafer and move between the high position, the middle position and the low position in the vertical direction; the workbench 40 is provided with a second support column 42, which can hold the wafer and move between the loading and unloading position and the avoidance position in the vertical direction. Among them, the first support column and the second support column are both made of non-metallic materials to avoid metal contamination.

[0070] It should be noted that when the first support column 41 is located at a low position and the second support column 42 is located at an avoidance position, the first support column 41 and the second support column 42 will not interfere with the rotation of the transposition arm 1 .

[0071] In another embodiment of the present invention, a method for using the semiconductor measurement device in the above embodiment is provided. Fig.12 As shown, the method of use specifically includes the following steps:

[0072] Step 01, after the wafer 43 on the workbench 40 has been measured, the second support column 42 lifts the measured wafer (wafer 43) to the loading and unloading position, and the first support column 41 lifts the wafer to be measured (wafer 43) to the middle position.

[0073] When the second supporting column is located at the loading and unloading position and the first supporting column is located at the middle position, both the measured wafer and the wafer to be measured are slightly higher than the transposition arm.

[0074] Step 02, transpose arm 1 from its initial position along the X-axis direction (see Figure 8 ) is rotated 90° in the positive direction, such as Fig.10 As shown, one receiving portion is located below the measured wafer (wafer 43 ), and the other receiving portion is located below the wafer to be measured (wafer 43 ).

[0075] Step 03, as Fig.11As shown, the second support column 42 moves down to the avoidance position so that the measured wafer (wafer 43) is placed on the corresponding receiving portion, and the first support column 41 moves down to the low position so that the wafer to be measured (wafer 43) is placed on the corresponding receiving portion.

[0076] Step 04, the position change arm 1 rotates 180° in the opposite direction, so that the wafer to be measured (wafer 43) is rotated to the top of the workbench 40, and the measured wafer (wafer 43) is rotated to the top of the lifting mechanism 39, so as to realize the position change of the wafer to be measured (wafer 43) and the measured wafer (wafer 43); then, the second support column 42 moves up to the loading and unloading position, so that the wafer to be measured (wafer 43) is placed on the second support column 42, and the first support column 41 moves up to the middle position, so that the measured wafer (wafer 43) is placed on the first support column 41.

[0077] Step 05, the repositioning arm 1 rotates forward 90° and returns to the initial position, and the workbench 40 moves the wafer to be measured (wafer 43) for measurement; then, the first support column 41 moves up to a high position to load and unload the wafer 43 on the first support column 41, that is, the measured wafer (wafer 43) is removed from the first support column 41, and another wafer to be measured (wafer 43) is placed on the first support column 41.

[0078] The above is only a specific embodiment of the present invention. Under the above teachings of the present invention, those skilled in the art can make other improvements or modifications on the basis of the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of the present invention, and the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A wafer rotation and transposition mechanism, characterized in that: It includes an arm assembly, a magnetic fluid assembly and a drive assembly; The arm assembly includes a transposition arm and a rotating shaft, two ends of the transposition arm are symmetrically extended with receiving parts for receiving wafers, and the upper end of the rotating shaft is fixedly connected to the center position of the transposition arm; The magnetic fluid assembly comprises a sealing shell and a magnetic fluid seal, wherein the sealing shell is sleeved on the rotating shaft, and the magnetic fluid seal is located between the sealing shell and the rotating shaft; The driving assembly is connected to the lower end of the rotating shaft and is used for driving the rotating shaft to rotate.

2. The wafer rotation and transposition mechanism according to claim 1, characterized in that: The arm assembly also includes an upper pressing plate and a lower pressing plate; The upper pressing plate is located above the transposition arm, and the lower pressing plate is located below the transposition arm. The upper pressing plate, the transposition arm and the lower pressing plate are fixedly connected by screws or bolts, and the lower pressing plate and the rotating shaft are fixedly connected by screws or bolts. The lower pressing plate is provided with a plurality of top screw holes, and each of the top screw holes is provided with a top screw. The upper end of the top screw presses the transposition arm to adjust the flatness of the transposition arm.

3. The wafer rotation and transposition mechanism according to claim 2, characterized in that: The arm assembly also includes a locating pin; An upper positioning hole is provided on the transposition arm below the upper pressure plate, and a lower positioning hole corresponding to the upper positioning hole is provided on the lower pressure plate, and the positioning pin is located in the upper positioning hole and the lower positioning hole; two positioning protrusions are formed on the upper end surface of the lower pressure plate, and the two positioning protrusions are used to position the two sides of the transposition arm.

4. The wafer rotation and transposition mechanism according to claim 1, characterized in that: The rotating shaft comprises an upper central shaft and a magnetic fluid shaft which are fixedly connected in sequence from top to bottom; The upper central shaft and the magnetic fluid shaft are fixedly connected via a bellows coupling.

5. The wafer rotation and transposition mechanism according to claim 4, characterized in that: The magnetic fluid assembly also includes a first bearing and a second bearing disposed in the sealing shell; The magnetic fluid shaft is inserted into the sealing shell from the top of the sealing shell, the first bearing is sleeved on the magnetic fluid shaft above the magnetic fluid seal, the upper end of the sealing shell is covered with a sealing shell cover, the sealing shell cover is used to axially compress and fix the outer ring of the first bearing, a first spacer is provided between the outer circle of the first bearing and the magnetic fluid seal, the second bearing is sleeved on the magnetic fluid shaft below the magnetic fluid seal, a second spacer is provided between the outer circle of the second bearing and the magnetic fluid seal, retaining rings are respectively sleeved on the magnetic fluid shaft on both sides of the second bearing, and the two retaining rings are used to fix the inner ring of the second bearing; a flange is formed on the outer circumference of the sealing shell, an annular sealing groove is opened on the upper end surface of the flange, a sealing member is provided in the sealing groove, and a plurality of fixing holes are provided on the flange.

6. The wafer rotation and transposition mechanism according to claim 5, characterized in that: The drive assembly includes a motor and a mounting plate; The motor is fixed on the mounting plate, the output shaft of the motor is fixedly connected to the lower end of the magnetic fluid shaft, and a plurality of connecting columns are connected between the mounting plate and the flange.

7. The wafer rotation and transposition mechanism according to claim 6, characterized in that: Also included are two sensing components; The sensing component includes a photoelectric sensor and a baffle, the photoelectric sensor is fixed to the connecting column through a bracket, the baffle is fixed to the magnetic fluid axis, the two photoelectric sensors are arranged at 90 degrees in the horizontal direction, and the two baffles are arranged at 180 degrees in the horizontal direction.

8. The wafer rotation and transposition mechanism according to any one of claims 1 to 7, characterized in that: A plurality of accommodating grooves and a plurality of concentric arc-shaped engraved lines are arranged on the upper end surface of the receiving portion, a flexible member is arranged in each of the accommodating grooves, and the radius of each of the arc-shaped engraved lines is different.

9. A semiconductor measurement device, characterized in that: It comprises a vacuum chamber, a lifting mechanism, a workbench and a wafer rotation and transposition mechanism as described in any one of claims 1 to 8; A through hole is provided at the bottom of the vacuum chamber, and the transposition arm extends into the vacuum chamber through the through hole. The sealing shell is located at the through hole and is fixedly connected to the bottom wall of the vacuum chamber. The lifting mechanism and the workbench are arranged in the vacuum chamber and on both sides of the transposition arm along the X-axis direction. A first support column is provided on the lifting mechanism, and the first support column can lift the wafer and move between a high position, a middle position and a low position in a vertical direction. A second support column is provided on the workbench, and the second support seat can lift the wafer and move between a loading and unloading position and an avoidance position in a vertical direction.

10. A method for using the semiconductor measurement device according to claim 9, characterized in that: The specific steps include: Step 01, after the wafer on the workbench has been measured, the second support column lifts the measured wafer to the loading and unloading position, and the first support column lifts the wafer to be measured to the middle position; Step 02, the transposition arm is rotated 90° in the positive direction from the initial position along the X-axis direction, so that one of the receiving parts is located below the measured wafer and the other receiving part is located below the wafer to be measured; Step 03, the second supporting column moves down to the avoidance position, so that the measured wafer is placed on the corresponding receiving portion, and the first supporting column moves down to the low position, so that the wafer to be measured is placed on the corresponding receiving portion; Step 04, the transposition arm rotates 180° in the opposite direction, so that the wafer to be measured rotates to the top of the workbench, and the measured wafer rotates to the top of the lifting mechanism, and then the second support column moves up to the loading and unloading position, so that the wafer to be measured is placed on the second support column, and the first support column moves up to the middle position, so that the measured wafer is placed on the first support column; Step 05, the position change arm rotates forward 90° and returns to the initial position, and then the first support column moves up to a high position to load and unload the wafer on the first support column.

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