A contactless wafer loading and unloading device for wafer box

Abstract

The present application relates to the technical field of wafer box loading, and specifically discloses a device for contactless wafer loading and unloading of wafer boxes. In the present application, multiple carrier plates overlappingly arranged from top to bottom are respectively slidably connected to a storage box, and multiple carrier plates are slid out one by one from bottom to top, and wafers are gradually placed on each carrier plate, so that when each wafer is taken and placed on the corresponding carrier plate, the upper space is not blocked, multiple wafers can be sent into the wafer box together, and the reverse operation can take out many wafers together without special attention, which can effectively improve the safety and efficiency of loading or taking out many wafers from the wafer box, and because there is no need to complete the loading or taking out operation of wafers one by one in the wafer box, the upper and lower adjacent card slots in the wafer box can be arranged closer, which is beneficial to increase the loading capacity of wafers in the unit space of the wafer box, and reduces the cost of wafer box loading to a certain extent.

Description

Technical Field

[0001] The present application relates to the technical field of wafer box loading, and in particular to a device for contactless wafer loading and unloading of wafer boxes. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Normally, the wafer formed by cutting has a thin circular structure. It is thin and brittle. Its surface is easily worn after contact with foreign objects. In order to avoid damage to the wafer during transportation or storage, the wafer is usually packed in a box for protection.

[0003] In the process of loading wafers into or taking them out of a wafer box, the staff uses a Bernoulli suction cup to grab the wafers without contact, which requires the Bernoulli suction cup to reach into the wafer box. During manual operation, the Bernoulli suction cup is prone to shaking, and if you are not careful, the surface of the wafer will be accidentally contacted and rubbed. The safety of loading and unloading wafers is difficult to be effectively guaranteed, and because the operation requires precision and caution, the efficiency of loading and unloading wafers is also easily affected. At the same time, in order to provide enough space for the Bernoulli suction cup to move, the distance between the two adjacent upper and lower card slots in the wafer box is usually set to be larger, which greatly reduces the loading capacity of wafers in a single wafer box, thereby greatly increasing the box loading cost.

[0004] Therefore, a non-contact wafer loading and unloading device for wafer box is proposed to solve some problems existing in the above-mentioned prior art. Summary of the invention

[0005] The purpose of the present application is to improve the efficiency and stability and safety of wafer loading and unloading. The device changes the way wafers are loaded into and taken out of the wafer box, so that the Bernoulli suction cup does not need to reach into the wafer box, effectively improving the safety and efficiency of the wafer loading and unloading process. It can also greatly reduce the distance between the two upper and lower adjacent card slots in the wafer box, and increase the number of wafers loaded in a single wafer box. Compared with the prior art, a device for non-contact wafer loading and unloading of wafer boxes is provided, including a supporting base, a deflection table is installed on the top of the supporting base, and a storage box is slidably installed on the top right side of the deflection table, and a first handle is fixedly installed on the front of the storage box, and the front and rear side end walls of the first handle are automatically There are multiple sliding grooves evenly arranged in pairs from bottom to top, and a slide is slidably installed in the two sliding grooves symmetrically front and back, and a carrying plate is fixedly installed on the left side of the slide, and the carrying plate is used to hold the wafer. A second handle arranged on the outside of the storage box is fixedly installed at the front end of the slide, and multiple limit columns are fixedly installed on the top of the carrying plate, and the limit columns are used to limit the movement of the wafer. A carrying platform is arranged on the left side of the top of the deflection table, and the top of the carrying platform is used to place the wafer box, and elbow clamps for locking the wafer box are fixedly installed on the front and rear sides of the carrying platform, and the spacing between two adjacent carrying plates is matched with the spacing between two adjacent slots in the wafer box, and an XYZ adjustment platform is installed between the deflection table and the carrying platform.

[0006] Furthermore, each carrier plate is provided with three equidistantly distributed limiting columns, and the lower end of the limiting column is provided with a truncated cone structure.

[0007] Further, the XYZ adjustment platform includes a first platform fixedly installed on the left side of the top of the deflection table, a second platform is installed on the first platform for transverse sliding, and a third platform is installed on the second platform for longitudinal sliding, a fourth platform arranged parallel to the third platform is installed on the top of the third platform, the bearing platform is fixedly installed on the top of the fourth platform, a first screw sleeve is fixedly installed on the top of the first platform, and a first screw rod arranged transversely is screwed on the internal thread of the first screw sleeve, the first screw rod is rotatably connected to the bottom of the second platform, a second screw sleeve is fixedly installed on the top of the second platform, and a second screw rod arranged longitudinally is screwed on the internal thread of the second screw sleeve, and the second screw rod is rotatably connected to the bottom of the third platform.

[0008] Furthermore, a first hinged rod and a second hinged rod hinged to each other in an X shape are arranged between the third platform and the fourth platform, the right end of the first hinged rod is hinged to the top of the third platform, the right end of the second hinged rod is hinged to the bottom of the fourth platform, the left end of the first hinged rod is hinged to a first slider slidably mounted on the bottom of the fourth platform, the left end of the second hinged rod is hinged to a second slider slidably mounted on the top of the third platform, the inner thread of the first slider is screwed with a transversely arranged third screw, and the third screw is rotatably connected to the bottom of the fourth platform.

[0009] Furthermore, the left end of the deflection table is rotatably connected to the support base, and a plurality of support columns for horizontally supporting the deflection table are evenly distributed on the top of the support base, and the support columns are made of rubber material, and an angle adjustment component is installed between the right side of the support base and the deflection table.

[0010] Furthermore, the angle adjustment assembly includes a sliding seat slidably mounted on the top right side of the support base, and the top of the sliding seat is rotatably connected to a third hinge rod, the other end of the third hinge rod is rotatably connected to the right side of the deflection table, a vertically arranged sleeve is fixedly mounted on the sliding seat, and a dividing pin rod is inserted through the sleeve, a spring fixedly connected between the sleeve and the dividing pin rod is installed in the sleeve, a baffle plate is fixedly mounted on the support base and is arranged directly below the sleeve, and a plurality of recesses matching the lower ends of the dividing pin rods are provided on the top of the baffle plate.

[0011] Furthermore, the top end of the sleeve is configured as an inclined structure, and the upper end of the indexing pin is configured as an L-shaped structure.

[0012] Furthermore, a screw module is installed between the top right side of the deflection table and the bottom of the storage box, and the screw module includes an outer shell fixedly installed on the top right side of the deflection table, a screw body is rotatably installed in the outer shell, and the outer thread of the screw body is screwed with a screw sleeve fixedly installed on the bottom of the storage box, and the friction angle between the screw body and the screw sleeve is smaller than the helix angle thereof.

[0013] Furthermore, each left and right end of each slide slot is provided with a corresponding limit block fixedly installed on the back end wall of the storage box, and an extension rod extending to the outside of the storage box is fixedly installed on the back of each slide, and a retaining spring adapted to the limit block is fixedly installed on the end wall of the extension rod close to the storage box.

[0014] Furthermore, a plurality of evenly distributed footings are installed at the bottom edge of the support base, and the footings include studs threadedly connected to the bottom of the support base, a ball head is fixedly installed at the bottom end of the stud, and an outer movable sleeve of the ball head is provided with a pad set for a truncated cone-shaped structure, and a rubber pad is fixedly attached to the bottom of the pad.

[0015] Compared with the prior art, the advantages of this application are:

[0016] (1) In the present application, multiple carrier plates that are overlapped from top to bottom are slidably connected to the storage box respectively, and the multiple carrier plates are slid out one by one from bottom to top, and the wafers are gradually placed on each carrier plate, so that when each wafer is placed on the corresponding carrier plate for pick-up and placement operations, the upper space is not blocked. With the help of this device, multiple wafers can be uniformly stacked outside the wafer box and then sent into the wafer box together, or can be taken out of the wafer box together. When taking and placing the wafers, no special attention is required, which can effectively improve the safety and efficiency of loading the wafers into the wafer box or taking them out of the wafer box. In addition, since there is no need to complete the operation of loading or taking out the wafers one by one in the wafer box, the upper and lower adjacent card slots in the wafer box can be arranged closer, which is beneficial to increasing the loading capacity of wafers in the unit space of the wafer box and reducing the cost of wafer box loading to a certain extent.

[0017] (2) By setting the lower end of the limiting column as a truncated cone structure, the inclined surface can lift the bottom edge of the wafer so that the bottom of the wafer is suspended when placed on the carrier plate. The bottom of the wafer does not contact the top of the carrier plate, which helps to avoid damage due to contact and friction between the wafer and the carrier plate, and effectively ensures the stability and safety of loading the wafer into the wafer box through the device.

[0018] (3) By providing an XYZ adjustment platform, the position of the wafer box placed on the carrier table can be adjusted, so that after wafer boxes of different sizes are placed on the carrier table, their internal card slots can be aligned with the multiple carrier plates on the storage box, which is beneficial to improving the applicability of the device when loading boxes of different sizes. At the same time, after the carrier plate is inserted into the wafer box, the position height of the wafer box can be adjusted by the XYZ adjustment platform, so as to flexibly realize the separation and contact between the wafer and the carrier plate, which is beneficial to ensure the convenience of operation during the use of the device.

[0019] (4) By setting the deflection table to a structure with the left end tilted downward, under the action of gravity, it will be smoother for the staff to hold the first handle to slide the storage box to the lower left, and hold the second handle to slide the carrier to the lower left. At the same time, by adjusting the inclination of the deflection table, the opening of the wafer box installed on the carrier is set to face the upper right. In this state, it is easier for the staff to clearly observe the situation inside the wafer box, which is conducive to further improving the stability of the wafer box when it is loaded into the wafer box from many carriers.

[0020] (5) By providing an angle adjustment component to limit the inclination angle of the deflection table, the staff can adjust the inclination angle of the deflection table according to their own situation. The staff lifts the indexing pin and then slides the sliding seat to adjust the inclination angle of the deflection table, so that the device can be adapted to different staff for comfortable use. At the same time, by setting the upper end of the indexing pin as an L-shaped structure and setting the upper end opening of the sleeve as an inclined structure, the staff can provide an upward drive for the indexing pin by rotation, which further improves the convenience of adjusting the inclination angle of the deflection table through the angle adjustment component. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a stereoscopic view from the left side of this application;

[0022] Figure 2 This is a stereoscopic view from the right side of the application;

[0023] Figure 3 A top view of the present application;

[0024] Figure 4 For this application Figure 3 A cross-section of the structure at AA in the middle;

[0025] Figure 5 This is the front view of the application;

[0026] Figure 6 For this application Figure 5 Schematic diagram of the structure at B in the middle;

[0027] Figure 7 For this application Figure 5 A cross-section of the structure at the middle CC;

[0028] Figure 8 For this application Figure 7 Schematic diagram of the structure at D in the figure;

[0029] Fig. 9 A three-dimensional diagram of the carrier plate of this application;

[0030] Fig.10 A three-dimensional diagram of the XYZ adjustment platform for this application;

[0031] Fig.11 This is a front cross-sectional view of the sleeve of the present application;

[0032] Fig.12 This is a front cross-sectional view of the screw rod module of this application;

[0033] Fig.13 This is a breakdown diagram of the site for this application.

[0034] Description of the numbers in the figure:

[0035] 1. Support base; 101. Deflection table; 102. Storage box; 103. First handle; 104. Slide; 105. Slide; 106. Carrying plate; 107. Second handle; 108. Limit column; 109. Support column; 2. Carrying platform; 201. Elbow clamp; 3. XYZ adjustment platform; 301. First platform; 302. Second platform; 303. Third platform; 304. Fourth platform; 305. First screw sleeve; 306. First screw rod; 307. Second screw sleeve; 308. Second screw rod; 309. First hinge Connecting rod; 310, second hinged rod; 311, first slider; 312, second slider; 313, third screw; 4, angle adjustment assembly; 401, sliding seat; 402, third hinged rod; 403, sleeve; 404, indexing pin; 405, spring; 406, baffle; 407, notch; 5, screw module; 501, housing; 502, screw body; 503, screw sleeve; 6, anchor; 601, stud; 602, ball head; 603, cushion block; 7, limit block; 701, extension rod; 702, retaining spring. DETAILED DESCRIPTION

[0036] The embodiments will be combined with the drawings in the specification to clearly and completely describe the technical solution of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making any creative work shall fall within the scope of protection of the present application.

[0037] Embodiment 1:

[0038] The present invention provides a non-contact wafer loading and unloading device for wafer boxes, see Figure 1 - Fig.13 , comprising a support base 1, a deflection table 101 is installed on the top of the support base 1, and a storage box 102 is slidably installed on the right side of the top of the deflection table 101, a first handle 103 is fixedly installed on the front of the storage box 102, and a plurality of slide grooves 104 symmetrically arranged in pairs are evenly opened from bottom to top on the front and rear side end walls of the first handle 103, a slide 105 is slidably installed in the two front and rear symmetrical slide grooves 104, and a carrier plate 106 is fixedly installed on the left side of the slide 105, and the carrier plate 106 is used to hold the wafer, and the front end of the slide 105 A second handle 107 arranged on the outside of the storage box 102 is fixedly installed, and a plurality of limit columns 108 are fixedly installed on the top of the carrying plate 106. The limit columns 108 are used to limit the movement of the wafer. A carrying platform 2 is arranged on the left side of the top of the deflection table 101, and the top of the carrying platform 2 is used to place the wafer box. Toggle clamps 201 for locking the wafer box are fixedly installed on the front and rear sides of the carrying platform 2. The distance between two adjacent carrying plates 106 is matched with the distance between two adjacent slots in the wafer box, and an XYZ adjustment platform 3 is installed between the deflection table 101 and the carrying platform 2.

[0039] During use of the device, the staff places the device on a workbench, and places a wafer box for storing wafers on the carrier 2, and fixes the wafer box through the elbow clamps 201 symmetrically arranged on both sides of the carrier 2. By adjusting the XYZ adjustment platform 3, the wafer box on the carrier 2 corresponds to the multiple carrier plates 106 in the storage box 102.

[0040] When the device is used to load wafers into the wafer box, in the initial state, the storage box 102 is at the rightmost position on the top of the deflection table 101. When the device is used to load the wafers into the wafer box, the staff first holds the second handle 107 at the bottom and slides it from right to left, driving the corresponding slide 105 to slide from right to left along the slide groove 104, so that the carrier plate 106 at the bottom slides out of the storage box 102 from right to left under the movement of the corresponding slide 105. At this time, the staff can place the grasped wafer on the carrier plate 106 through the Bernoulli suction cup, and adjust the wafer so that the wafer is between the multiple limit posts 108 on the carrier plate 106. The wafer is stopped and restricted by the multiple limit posts 108 on the carrier plate 106 to ensure the stability of the wafer staying on the carrier plate 106. Then the staff moves and slides out the second carrier plate 106 from bottom to top, and also grasps the other wafer stably on the second carrier plate 106 by the Bernoulli suction cup.

[0041] The above operation is subsequently repeated to slide multiple carrier plates 106 out of the storage box 102 from bottom to top, and wafers are placed one by one on the slid-out carrier plates 106 from bottom to top. When each carrier plate 106 slides out of the storage box 102 to the left and a wafer is placed on each carrier plate 106, the staff member holds the first handle 103 and applies force to the left, so that the storage box 102 is driven to slide to the left. Driven by the storage box 102, the many carrier plates 106 on the left side carry the wafers thereon and move synchronously to the left and enter the wafer box placed on the left side carrier table 2. At this time, the wafers on each carrier plate 106 just slide into the corresponding card slots on the inner end wall of the wafer box. Then, the staff member uses XYZ The adjustment platform 3 adjusts the carrier table 2 upward, so that the wafer box on the carrier table 2 rises a certain distance upward. The raised distance is smaller than the distance between the wafer and the carrier plate 106 above it when the wafer is placed on the carrier plate 106. Since the position of the wafer box is raised and many wafers are inserted into the corresponding slots when entering the wafer box, the wafers inside the wafer box are raised synchronously during the rising process, so that the wafer moves to above the limit column 108 on the corresponding carrier plate 106, and the limit column 108 on the carrier plate 106 loses the stopping restriction on the wafer. Subsequently, the staff holds the first handle 103 and applies a sliding action to the right, driving the storage box 102 to slide to the right, driving many carrier plates 106 to withdraw from the wafer box.

[0042] When the storage box 102 carrying many carrier plates 106 moves to the rightmost side of the deflection table 101, the staff holds all the second handles 107 except the bottom one and applies force to the right, so that all the carrier plates 106 above except the bottom one move to the right together and reset into the storage box 102. Then, the staff replaces the wafer box and performs the subsequent wafer loading operation into another wafer box.

[0043] When using the device to take out the wafers from the wafer box, the staff performs the above operation in reverse. The staff holds the multiple second handles 107 in turn and applies a moving force to the left to move the multiple carrier plates 106 out of the storage box 102 to the left. Then, the staff holds the first handle 103 and applies a moving force to the left, so that the storage box 102 moves to the left with the multiple carrier plates 106. The multiple carrier plates 106 are inserted into the wafer box under the drive of the storage box 102. Then, the staff adjusts the position of the wafer box so that the wafer box drops down a certain height. During this process, the multiple wafers in the wafer box automatically fall on the corresponding multiple carrier plates 106. Then, the staff holds the first handle 103 to control the storage box 102 to drive the multiple carrier plates 106 to move to the right together, so that the multiple carrier plates 106 carry the wafers out of the wafer box to the right, completing the operation of taking the wafers out of the wafer box together. The multiple wafers are correspondingly lifted by the multiple carrier plates 106.

[0044] After numerous carrier plates 106 carrying numerous wafers are taken out from the wafer box, the staff can use the Bernoulli suction cup to grab the wafers on the numerous carrier plates 106 one by one from top to bottom. After the wafer on the upper carrier plate 106 is taken away, the staff holds the second handle 107 corresponding to the carrier plate 106 and slides the carrier plate 106 to the right into the storage box 102, so that the wafer on the lower carrier plate 106 is completely exposed. The above operation is repeated, and the staff completes the wafer removal operation one by one.

[0045] During use of the device, multiple overlapping carrier plates 106 arranged from top to bottom are slidably connected to the storage box 102 respectively, and multiple carrier plates 106 are slid out one by one from bottom to top, so that when a wafer is placed on the carrier plate 106 and taken in by the Bernoulli suction cup, the space above the wafer will not be blocked. After multiple wafers are uniformly stacked outside the wafer box, they are sent into the wafer box together, or multiple wafers are taken out of the wafer box together under the support of many carrier plates 106, which can effectively avoid the wafers being put into the wafer box one by one, or taken out of the wafer box one by one. Compared with directly picking up and placing the wafers in the wafer box through the Bernoulli suction cup, the inconvenience caused by the small space when taking them out of the box can effectively improve the convenience of operation when taking them out in the wafer box, reduce the probability of wafer collision and damage when loading or taking them out of the wafer box, and help improve the operating efficiency when loading and unloading wafers. In addition, since there is no need to complete the operation of loading or removing wafers one by one in the wafer box, the upper and lower adjacent slots in the wafer box can be set closer, which to a certain extent improves the loading capacity of wafers in the unit space of the wafer box.

[0046] See also Figure 6Each carrier plate 106 is provided with three equally spaced limiting posts 108, and the lower ends of the limiting posts 108 are set to a truncated cone structure. During the use of the device, each carrier plate 106 is provided with three limiting posts 108 to stop and limit the wafer, and the minimum number of limiting posts 108 is used to complete the stable stopping of the wafer. By setting the lower ends of the limiting posts 108 to a truncated cone structure, the outer diameter of the lower ends of the limiting posts 108 is gradually increased from top to bottom, and the lower ends of the limiting posts 108 are shaped The inclined surface is formed. When the wafer is restricted between the three limiting posts 108, the side edges of the wafer will fit with the outer end walls of the upper ends of the three limiting posts 108, and the bottom edge of the wafer will be supported by the conical structure at the lower ends of the limiting posts 108, so that the wafer is suspended on the carrier plate 106, and the bottom of the wafer will not contact the top of the carrier plate 106, thereby avoiding damage due to contact and friction between the wafer and the carrier plate 106, which is beneficial to ensuring the stability of the wafer when it is loaded into the wafer box through the device.

[0047] See also Figure 4 , Figure 5 and Fig.10 The XYZ adjustment platform 3 includes a first platform 301 fixedly installed on the left side of the top of the deflection table 101, a second platform 302 is installed on the first platform 301 for horizontal sliding, and a third platform 303 is installed on the second platform 302 for vertical sliding, a fourth platform 304 arranged parallel to the third platform 303 is installed on the top of the third platform 303, the bearing platform 2 is fixedly installed on the top of the fourth platform 304, a first screw sleeve 305 is fixedly installed on the top of the first platform 301, and the first screw sleeve 305 is internally threaded with a first screw rod 306 arranged horizontally, the first screw rod 306 is rotatably connected to the bottom of the second platform 302, a second screw sleeve 307 is fixedly installed on the top of the second platform 302, and the second screw sleeve 307 is internally threaded with a second screw rod 306 arranged vertically 308, the second screw rod 308 is rotationally connected to the bottom of the third platform 303, and a first hinge rod 309 and a second hinge rod 310 which are hinged to each other in an X shape are arranged between the third platform 303 and the fourth platform 304. The right end of the first hinge rod 309 is hinged to the top of the third platform 303, and the right end of the second hinge rod 310 is hinged to the bottom of the fourth platform 304. The left end of the first hinge rod 309 is hinged to a first slider 311 slidably mounted on the bottom of the fourth platform 304, and the left end of the second hinge rod 310 is hinged to a second slider 312 slidably mounted on the top of the third platform 303. The first slider 311 is internally threaded with a transversely arranged third screw rod 313, and the third screw rod 313 is rotationally connected to the bottom of the fourth platform 304.

[0048] During use of the device, the staff can adjust the position of the wafer box on the carrier 2 through the XYZ adjustment platform 3. When the staff rotates the first screw 306, the threaded connection between the first screw 306 and the first screw sleeve 305 is used to make the first screw 306 move relative to the first screw sleeve 305 during rotation. Since the transversely arranged first screw sleeve 305 is fixedly connected to the top of the first platform 301 and rotatably connected to the bottom of the second platform 302, the first screw 306 moves laterally relative to the first screw sleeve 305, which will drive the second platform 302 to move laterally relative to the first platform 301. The direction of the lateral movement of the second platform 302 is changed by controlling the rotation direction of the first screw 306, and the position of the wafer box on the carrier 2 is adjusted laterally.

[0049] When the staff rotates the second screw 308, with the help of the threaded connection between the second screw 308 and the second screw sleeve 307, the second screw 308 will also move relative to the second screw sleeve 307 during the rotation process. Since the longitudinally arranged second screw sleeve 307 is fixedly connected to the top of the second platform 302 and rotatably connected to the bottom of the third platform 303, the second screw 308 will drive the third platform 303 to move longitudinally relative to the second platform 302 during the longitudinal movement of the second screw sleeve 307. The direction of the longitudinal movement of the third platform 303 is changed by controlling the rotation direction of the second screw 308, and the position of the wafer box on the carrier 2 is adjusted longitudinally.

[0050] When the staff rotates the third screw rod 313, with the help of the threaded connection between the third screw rod 313 and the first slider 311, the third screw rod 313 will move relative to the first slider 311 during the rotation process. Since the first slider 311 is slidably connected to the bottom of the fourth platform 304, and the third screw rod 313 arranged parallel to the sliding track of the first slider 311 is rotatably connected to the bottom of the fourth platform 304, the third screw rod 313 can drive the first slider 311 to slide at the bottom of the fourth platform 304 during the rotation process, thereby changing the position of the left end of the first hinged rod 309. By pushing and adjusting the left end of the first hinged rod 309, the inclination angle of the mutually hinged first hinged rod 309 and the second hinged rod 310 is changed. The third platform 303 and the fourth platform 304 are adjusted in height by rotating the third screw 313 so as to change the distance between the third platform 303 and the fourth platform 304. After the left end of the first hinged rod 309 is adjusted to the right, the height of the support between the first hinged rod 309 and the second hinged rod 310 is increased, and the fourth platform 304 drives the wafer box placed on the carrier 2 to rise. After the left end of the first hinged rod 309 is adjusted to the left, the height of the support between the first hinged rod 309 and the second hinged rod 310 is reduced, and the fourth platform 304 drives the wafer box placed on the carrier 2 to descend. By rotating the third screw 313, the distance between the third platform 303 and the fourth platform 304 is changed, and the height of the position of the wafer box on the carrier 2 is adjusted.

[0051] The present application uses the existence of the XYZ adjustment platform 3 to adjust the wafer box placed on the carrier 2. Through the adjustment, after wafer boxes of different specifications and sizes are placed on the carrier 2, their internal card slots can be aligned with the multiple carrier plates 106 on the storage box 102, which is beneficial to improving the applicability of the device for box loading operations for wafer boxes of different sizes. In addition, when the storage box 102 carries a plurality of carrier plates 106 and is inserted into the wafer box on the carrier 2 together to uniformly box multiple groups of wafers, the staff can rotate the third screw 313 to raise the height of the wafer box to complete the separation operation of the wafer and the carrier plate 106. When a plurality of carrier plates 106 are inserted into the wafer box together to uniformly take out a plurality of groups of wafers, the staff can rotate the third screw 313 in the opposite direction to lower the height of the wafer box, so that the wafers in the wafer box fall on the corresponding carrier plates 106, completing the lifting operation of the plurality of wafers by the plurality of carrier plates 106 during the wafer removal process.

[0052] See also Figure 1 , Figure 2 , Figure 5 and Fig.11The left end of the deflection table 101 is rotatably connected to the support base 1. A plurality of support columns 109 for horizontally supporting the deflection table 101 are evenly distributed on the top of the support base 1, and the support columns 109 are made of rubber material. An angle adjustment component 4 is installed between the right side of the support base 1 and the deflection table 101. The angle adjustment component 4 includes a sliding seat 401 slidably installed on the right side of the top of the support base 1, and the top of the sliding seat 401 is rotatably connected to a third hinge rod 402. The other end of the third hinge rod 402 is rotatably connected to the right side of the deflection table 101. Dynamic connection, a vertically arranged sleeve 403 is fixedly installed on the sliding seat 401, and a dividing pin 404 is inserted through the sleeve 403, a spring 405 fixedly connected between the sleeve 403 and the dividing pin 404 is installed in the sleeve 403, a baffle 406 arranged directly below the sleeve 403 is fixedly installed on the support base 1, and a plurality of recesses 407 matched with the lower end of the dividing pin 404 are opened on the top of the baffle 406, the top end of the sleeve 403 is arranged as an inclined structure, and the upper end of the dividing pin 404 is arranged as an L-shaped structure.

[0053] During the use of the device, since the left end of the deflection table 101 is rotatably connected to the support base 1, and an angle adjustment component 4 is installed between the right end of the deflection table 101 and the support base 1, the state of the deflection table 101 can be adjusted by adjusting the angle adjustment component 4 during the use of the device, so that the deflection table 101 originally horizontally arranged above the support base 1 presents a structure with a left end tilted downward. By setting the deflection table 101 to a structure with a left end tilted downward, under the action of gravity, when the staff holds the first handle 103 to slide the storage box 102 to the lower left, and holds the second handle 107 to slide the carrier plate 106 to the lower left, it will become smoother, and through the tilt adjustment, the wafer box installed on the carrier table 2 can be adjusted. The opening is set to the upper right. In this state, it is easier for the staff to clearly observe the situation inside the wafer box, which is beneficial to further improve the stability of the wafer box when it is loaded from multiple carriers 106 into the wafer box. At the same time, by adjusting the inclination of the deflection table 101, the sliding force applied by holding the first handle 103 and the second handle 107 is changed from the original horizontal force to the left to the lower left. In the process of sliding the carrier plate 106 out of the storage box 102, or sliding the storage box 102 to send multiple carrier plates 106 into the wafer box, a downward force is applied to the device. The friction resistance between the bottom of the device and the workbench is increased by pressing, thereby improving the stability of the device when it is placed on the workbench for use.

[0054] The staff can adjust the inclination angle of the deflection table 101 according to their own situation. There are at least three notches 407 on the baffle 406, which correspond to the three adjustable angles of the deflection table 101. In the process of adjusting the inclination angle of the deflection table 101, the staff applies an upward force to the indexing pin 404, and the indexing pin 404 overcomes the elastic force of the spring 405 and moves upward. The lower end of the indexing pin 404 exits the notch 407. After the indexing pin 404 is no longer engaged, the sliding seat 401 can slide along its slide rail on the top right side of the support base 1. The left and right sliding of the seat 401 changes the position of the lower end of the third hinge rod 402, changes the deflection angle of the third hinge rod 402, and then realizes the adjustment of the inclination angle of the deflection platform 101. When the deflection platform 101 is adjusted to a suitable position, the staff releases the force on the upward movement of the indexing pin 404. At this time, under the elastic reset of the spring 405, the indexing pin 404 moves downward, and its lower end is re-engaged in the corresponding recess 407 below, and the sliding seat 401 is restricted again. After the adjustment, the position of the sliding seat 401 no longer slides, thereby ensuring the stability of the tilt support of the deflection platform 101 by the third hinge rod 402.

[0055] Since the upper end of the indexing pin 404 is set as an L-shaped structure, and the upper end opening of the sleeve 403 is set as an inclined structure, when the staff rotates the indexing pin 404, they are guided by the inclined structure of the upper end opening of the sleeve 403. There is no need for the staff to actively lift the indexing pin 404. The indexing pin 404 can automatically rise upward during the rotation process, which can effectively improve the operational convenience of the device during daily use. When the deflection table 101 is in a horizontal state, a plurality of support columns 109 fixed on the top of the support base 1 support the deflection table 101. The support columns 109 made of rubber material have strong buffering properties. When the deflection table 101 is adjusted from an inclined state to a horizontal state, the falling impact force can be absorbed to ensure the stability of the device during use.

[0056] See also Fig.12A screw module 5 is installed between the top right side of the deflection table 101 and the bottom of the storage box 102, and the screw module 5 includes a shell 501 fixedly installed on the top right side of the deflection table 101, a screw body 502 is rotatably installed in the shell 501, and the outer side of the screw body 502 is screwed with a screw sleeve 503 fixedly installed at the bottom of the storage box 102, and the friction angle between the screw body 502 and the screw sleeve 503 is smaller than the helix angle. During the use of the device, since the friction angle between the screw body 502 and the screw sleeve 503 is smaller than the helix angle, the screw body 502 and the screw sleeve 503 will not self-lock. During use, when the staff holds the first handle 103 and applies force to drive the storage box 102 to slide, it will not be locked by the screw module 5, and the friction resistance between the screw body 502 and the screw sleeve 503 The force is adapted to the gravitational potential energy of the storage box 102 sliding downward in the tilted state. Due to the existence of the screw module 5, when the deflection table 101 is in a tilted state, the storage box 102 will not slide directly to the lower left along the top of the deflection table 101. Only when the staff holds the first handle 103 to move, the storage box 102 can slide normally and smoothly. In addition, the friction resistance between the slide 105 and the slide groove 104 is also adapted to the gravitational potential energy applied to the carrier plate 106 on the slide 105 in the tilted state. This makes it possible for the carrier plate 106 to not automatically slide out of the storage box 102 when the deflection table 101 is in a tilted state. Only when the staff holds the second handle 107 to move, the carrier plate 106 will slide out of the storage box 102, which can effectively ensure the flexibility and stability of the device during actual use.

[0057] See also Figure 7 - Fig. 9 , the left and right ends of each slide groove 104 are correspondingly provided with a limit block 7 fixedly installed on the back end wall of the storage box 102, and the back of each slide 105 is fixedly installed with an extension rod 701 extending to the outside of the storage box 102, and a retaining spring 702 compatible with the limit block 7 is fixedly installed on the end wall of the extension rod 701 close to the storage box 102. During the use of the device, the staff holds the second handle 107 to apply a sliding action to the slide 105 and the carrier plate 106. When the slide 105 moves to the left or right end of the slide groove 104, the retaining spring 702 fixedly installed on the extension rod 701 will be engaged with the outside of the limit block 7 in the corresponding position, limiting the position of the slide 105, which can effectively ensure the stability of the carrier plate 106 after it is put into the storage box 102 or slides out of the storage box 102.

[0058] See also Fig.13A plurality of evenly distributed feet 6 are installed at the bottom edge of the support base 1, and the foot 6 includes a stud 601 screwed on the bottom of the support base 1, a ball head 602 is fixedly installed on the bottom end of the stud 601, and a cushion block 603 provided with a truncated cone structure is movably sleeved on the outer side of the ball head 602, and a rubber pad is fixedly attached to the bottom of the cushion block 603. During the use of the device, by screwing the stud 601 on the bottom of the support base 1, the height support of the support base 1 by the foot 6 can be adjusted by rotating the stud 601, and since the cushion block 603 is rollingly sleeved on the outer side of the ball head 602, the direction of the cushion block 603 can be flexibly adjusted. With the cooperation of the two, the support base 1 can be horizontally and stably supported on the workbench through adjustment, which effectively ensures the stability of the device during use.

[0059] The above are only the best implementation methods adopted by this application in combination with current actual needs, but the protection scope of this application is not limited to this.

Claims

1. A contactless wafer loading and unloading device for a wafer box, comprising a supporting base (1), characterized in that: A deflection platform (101) is installed on the top of the support base (1), and a storage box (102) is slidably installed on the right side of the top of the deflection platform (101), a first handle (103) is fixedly installed on the front of the storage box (102), and a plurality of slide grooves (104) are evenly opened on the front and rear side end walls of the first handle (103) from bottom to top and are symmetrically arranged in pairs, and a slide frame (105) is slidably installed in the two front and rear symmetrical slide grooves (104), and a load-bearing device is fixedly installed on the left side of the slide frame (105). A plate (106), the carrying plate (106) is used to hold up the wafer, a second handle (107) arranged on the outside of the storage box (102) is fixedly installed at one end of the front side of the slide (105), a plurality of limit posts (108) are fixedly installed on the top of the carrying plate (106), the limit posts (108) are used to limit the movement of the wafer, and each of the carrying plates (106) is provided with three limit posts (108) equidistantly distributed around, and the lower end of the limit post (108) is arranged as a truncated cone structure; A bearing platform (2) is arranged on the left side of the top of the deflection table (101), and the top of the bearing platform (2) is used to place a wafer box. Toggle clamps (201) for locking the wafer box are fixedly installed on the front and rear sides of the bearing platform (2). The distance between two adjacent bearing plates (106) matches the distance between two adjacent card slots in the wafer box. An XYZ adjustment platform (3) is installed between the deflection table (101) and the bearing platform (2). The left end of the deflection table (101) is rotatably connected to the support base (1). A plurality of support columns (109) for horizontally supporting the deflection table (101) are evenly distributed on the top of the support base (1), and the support columns (109) are made of rubber material. An angle adjustment component (4) is installed between the right side of the support base (1) and the deflection table (101); The left and right ends of each of the slide grooves (104) are respectively provided with a limit block (7) fixedly mounted on the back end wall of the storage box (102); the back of each of the slide racks (105) is fixedly mounted with an extension rod (701) extending to the outside of the storage box (102); and a retaining spring (702) adapted to the limit block (7) is fixedly mounted on the end wall of the extension rod (701) close to the storage box (102).

2. The device for non-contact wafer loading and unloading of wafer box according to claim 1, characterized in that: The XYZ adjustment platform (3) comprises a first platform (301) fixedly mounted on the left side of the top of the deflection table (101); a second platform (302) is slidably mounted on the first platform (301) in a transverse direction; and a third platform (303) is slidably mounted on the second platform (302) in a longitudinal direction; a fourth platform (304) arranged parallel to the third platform (303) is mounted on the top of the third platform (303); the bearing platform (2) is fixedly mounted on the top of the fourth platform (304); a first screw sleeve (305) is fixedly mounted on the top of the first platform (301); a first screw rod (306) arranged transversely is screwed to the internal thread of the first screw sleeve (305); the first screw rod (306) is rotatably connected to the bottom of the second platform (302); a second screw sleeve (307) is fixedly mounted on the top of the second platform (302); a second screw sleeve (308) is rotatably connected to the internal thread of the second screw sleeve (307); and the second screw rod (308) is rotatably connected to the bottom of the third platform (303).

3. The device for non-contact wafer loading and unloading of wafer box according to claim 2, characterized in that: A first hinged rod (309) and a second hinged rod (310) hinged to each other in an X shape are provided between the third platform (303) and the fourth platform (304); the right end of the first hinged rod (309) is hinged to the top of the third platform (303); the right end of the second hinged rod (310) is hinged to the bottom of the fourth platform (304); the left end of the first hinged rod (309) is hinged to a first slider (311) slidably mounted on the bottom of the fourth platform (304); the left end of the second hinged rod (310) is hinged to a second slider (312) slidably mounted on the top of the third platform (303); the first slider (311) is internally threadedly screwed with a third screw rod (313) arranged transversely, and the third screw rod (313) is rotatably connected to the bottom of the fourth platform (304).

4. The device for non-contact wafer loading and unloading of wafer box according to claim 1, characterized in that: The angle adjustment assembly (4) comprises a sliding seat (401) slidably mounted on the right side of the top of the support base (1), and the top of the sliding seat (401) is rotatably connected to a third hinge rod (402), and the other end of the third hinge rod (402) is rotatably connected to the right side of the deflection table (101), a vertically arranged sleeve (403) is fixedly mounted on the sliding seat (401), and a dividing pin (404) is inserted through the sleeve (403), and a spring (405) fixedly connected between the sleeve (403) and the dividing pin (404) is installed in the sleeve (403), and a baffle (406) arranged directly below the sleeve (403) is fixedly mounted on the support base (1), and a plurality of recesses (407) adapted to the lower end of the dividing pin (404) are provided on the top of the baffle (406).

5. The device for non-contact wafer loading and unloading of wafer box according to claim 4, characterized in that: The top end of the sleeve (403) is configured as an inclined structure, and the upper end of the indexing pin (404) is configured as an L-shaped structure.

6. The device for non-contact wafer loading and unloading of wafer box according to claim 1, characterized in that: A screw module (5) is installed between the top right side of the deflection platform (101) and the bottom of the storage box (102), and the screw module (5) comprises a housing (501) fixedly installed on the top right side of the deflection platform (101), a screw body (502) is rotatably installed in the housing (501), and a screw sleeve (503) fixedly installed on the bottom of the storage box (102) is screwed on the outer thread of the screw body (502), and the friction angle between the screw body (502) and the screw sleeve (503) is smaller than the helix angle thereof.

7. The device for non-contact wafer loading and unloading of wafer box according to claim 1, characterized in that: A plurality of evenly distributed footings (6) are installed at the bottom edge of the support base (1), and the footings (6) include a stud (601) threadedly screwed to the bottom of the support base (1), a ball head (602) is fixedly installed at the bottom end of the stud (601), and a cushion block (603) provided for a truncated cone structure is provided on the outer movable sleeve of the ball head (602), and a rubber cushion is fixedly attached to the bottom of the cushion block (603).

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