Antenna packaging heat dissipation structure

Abstract

The invention provides an antenna packaging heat dissipation structure. The antenna packaging heat dissipation structure comprises a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a shell and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrate is arranged on the first surface of the circuit board. The chip is arranged between the antenna substrate and the first surface of the circuit board and is electrically connected with the antenna substrate. The plurality of heat dissipation fins protrude out of the second surface of the circuit board. The housing encapsulates the circuit board, the antenna substrate, the chip and the plurality of heat dissipation fins. The dielectric fluid circularly flows in the housing through the cooling circulation device and is in direct contact with the plurality of heat dissipation fins.

Description

Technical Field

[0001] The invention relates to a packaging structure, and in particular to an antenna packaging heat dissipation structure. Background Art

[0002] With the development of 5G communication industry and low-orbit satellite applications, the introduction of high-power chips and the trend of chip miniaturization will cause the temperature of antenna packaging modules to rise. Generally speaking, antenna packaging modules transfer the heat generated by chips to the air through heat diffusion components. However, due to the limitations of the module architecture, the air flow in the module is poor, resulting in difficulty in heat dissipation, thereby reducing the energy conversion efficiency of the chip and increasing the energy consumption of the system. Therefore, how to improve the heat dissipation efficiency of antenna packaging modules is an urgent problem to be solved. Summary of the invention

[0003] The present invention is directed to an antenna package heat dissipation structure, which has good heat dissipation capability to improve the reliability of the antenna package heat dissipation structure.

[0004] According to one embodiment of the present invention, an antenna package heat dissipation structure includes a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a housing, and a dielectric fluid. The circuit board has a first surface and a second surface relative to the first surface. The antenna substrate is arranged on the first surface of the circuit board. The chip is arranged between the antenna substrate and the first surface of the circuit board and is electrically connected to the antenna substrate. A plurality of heat dissipation fins protrude from the second surface of the circuit board. The housing encloses the circuit board, the antenna substrate, the chip, and the plurality of heat dissipation fins. The dielectric fluid circulates in the housing through a cooling circulation device and is in direct contact with the plurality of heat dissipation fins.

[0005] According to another embodiment of the present invention, an antenna package heat dissipation structure includes a circuit board, an antenna substrate, a chip, a housing and a dielectric fluid. The circuit board has a first surface and a second surface relative to the first surface. The antenna substrate is arranged on the first surface of the circuit board, wherein the antenna substrate includes an antenna layer arranged on the surface of the antenna substrate. The chip is arranged between the antenna substrate and the first surface of the circuit board and is electrically connected to the antenna substrate. The housing encapsulates the circuit board, the antenna substrate and the chip. The dielectric fluid circulates in the housing through a cooling circulation device and is in direct contact with the antenna layer.

[0006] According to another embodiment of the present invention, an antenna package heat dissipation structure includes a housing, a circuit board, an antenna substrate, a chip, a heat sink fin, and a cooling fluid. The housing includes a first space and a second space, wherein the first space and the second space are isolated from each other by a heat sink. The circuit board is located in the first space and is disposed on the heat sink. The antenna substrate is located in the first space and is disposed on the circuit board. The chip is disposed between the antenna substrate and the circuit board and is electrically connected to the antenna substrate. The heat sink fin is located in the second space and is disposed on the heat sink. The cooling fluid is located in the second space and in contact with the heat sink fin, wherein the cooling fluid absorbs heat from the heat sink fin to produce a phase change.

[0007] Based on the above, the antenna package heat dissipation structure of the present invention improves its heat dissipation efficiency by setting a dielectric fluid or a cooling fluid, making the antenna package heat dissipation structure suitable for application in the 5G communication industry and low-orbit satellite ground stations.

[0008] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1A is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to an embodiment of the present invention;

[0010] Figure 1B yes Figure 1A A partially enlarged cross-sectional schematic diagram of an embodiment of an antenna package heat dissipation structure;

[0011] Figure 1C yes Figure 1A A partially enlarged cross-sectional schematic diagram of another embodiment of the antenna package heat dissipation structure;

[0012] Figure 1D yes Figure 1A A partially enlarged cross-sectional schematic diagram of another embodiment of the antenna package heat dissipation structure;

[0013] Figure 2 is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0014] Figure 3 is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0015] Figure 4 is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0016] Figure 5 is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0017] Figure 6is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0018] Figure 7 is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0019] Figure 8 is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention;

[0020] Fig. 9 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention.

[0021] Description of Reference Numerals

[0022] 10,20,30,40,50,60,70,80,90: Antenna package heat dissipation structure

[0023] 100: Circuit board

[0024] 100a: first surface

[0025] 100b: second surface

[0026] 110: Antenna substrate

[0027] 110a: upper surface

[0028] 110b: Lower surface

[0029] 112: Antenna layer

[0030] 120: Chip

[0031] 120a: Front

[0032] 120b: Back

[0033] 122: Thermal interface material layer

[0034] 130,930: cooling fins

[0035] 130a: Part I

[0036] 130b: Part 2

[0037] 130c: Part 3

[0038] 132,932: Radiator

[0039] 132a: micro bump

[0040] 134,934:Heat sink

[0041] 140: Shell

[0042] 141: Baffle

[0043] 142: Main body

[0044] 144: Top cover

[0045] 150: Dielectric fluid

[0046] 160,160a,160b: Cooling circulation device

[0047] 162: Pump

[0048] 164: Radiator

[0049] 170: Conductive connector

[0050] 180: Spoiler

[0051] 190: Temperature plate

[0052] 931: External fins

[0053] 950: Cooling fluid

[0054] 950v: Steam

[0055] IN: Entrance

[0056] OUT, OUT1, OUT2: Export

[0057] R: Region

[0058] S11, S21, S91: First Space

[0059] S12, S22, S92: Second Space

[0060] TH:Through hole

[0061] V:Through hole DETAILED DESCRIPTION

[0062] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0063] The following will fully describe exemplary embodiments of the present invention with reference to the accompanying drawings, but the present invention can still be implemented in many different forms and should not be interpreted as being limited to the embodiments described herein. In the accompanying drawings, for the sake of clarity, the size and thickness of each region, part and layer may not be drawn according to the actual scale.

[0064] Directional terms mentioned herein, such as "upper", "lower", "front", "back", "left", "right", etc., refer to the directions of the accompanying drawings. Therefore, the directional terms used are for illustration, not for limiting the present invention.

[0065] In the following embodiments, the same or similar components will be denoted by the same or similar reference numerals, and their redundant description will be omitted. In addition, the features in different embodiments can be combined with each other without conflict, and simple equivalent changes and modifications made according to this specification or claims are still within the scope of this patent.

[0066] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, parts, regions, layers and / or portions, these components, parts, regions, and / or portions should not be limited by these terms. These terms are used to distinguish one component, part, region, layer or portion from another component, part, region, layer or portion. Therefore, the first component, part, region, layer or portion discussed below may be referred to as a second component, part, region, layer or portion without departing from the teachings of this document.

[0067] Figure 1A The figure is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to an embodiment of the present invention. Figure 1B yes Figure 1A A partially enlarged cross-sectional schematic diagram of an embodiment of a region R of FIG. Figure 1C yes Figure 1A A partially enlarged cross-sectional schematic diagram of another embodiment of the region R of FIG. Figure 1D yes Figure 1A A partially enlarged cross-sectional schematic diagram of another embodiment of the region R of FIG.

[0068] Please refer to Figure 1A The antenna package heat dissipation structure 10 includes a circuit board 100, an antenna substrate 110, a chip 120, a plurality of heat dissipation fins 130, a housing 140 and a dielectric fluid 150. The circuit board 100 has a first surface 100a and a second surface 100b relative to the first surface 100a. The antenna substrate 110 is disposed on the first surface 100a of the circuit board 100. The chip 120 is disposed between the antenna substrate 110 and the first surface 100a of the circuit board 100 and is electrically connected to the antenna substrate 110. A plurality of heat dissipation fins 130 protrude from the second surface 100b of the circuit board 100. The housing 140 encloses the circuit board 100, the antenna substrate 110, the chip 120 and the heat dissipation fins 130. The dielectric fluid 150 circulates in the housing 140 through the cooling circulation device 160 and is in direct contact with the plurality of heat dissipation fins 130.

[0069] Figure 1AThe detailed structures of the circuit board 100 and the antenna substrate 110 are omitted in the figure, but the circuit board 100 and the antenna substrate 110 may include conductive circuits, insulating layers, vias, active / passive components and other structures, and their wiring design may be adjusted according to actual needs, and the present invention is not limited thereto.

[0070] The circuit board 100 may be electrically connected to the antenna substrate 110 via a conductive connector 170. In some embodiments, the conductive connector 170 may be a solder ball, a conductive column, a conductive bump or a similar conductive connector, but the present invention is not limited thereto.

[0071] The antenna substrate 110 has an upper surface 110a and a lower surface 110b opposite to each other, and the lower surface 110b faces the first surface 100a of the circuit board 100. The antenna substrate 110 includes an antenna layer 112 disposed on the upper surface 110a of the antenna substrate 110.

[0072] The chip 120 is, for example, a radio frequency chip (RF IC), which includes a front surface 120a and a back surface 120b opposite to each other. The front surface 120a of the chip 120 faces the lower surface 110b of the antenna substrate 110 and can be electrically connected to the antenna substrate 110 via solder balls or other conductive structures.

[0073] In some embodiments, the housing 140 includes at least one inlet IN and at least one outlet OUT to serve as an inlet and outlet for the dielectric fluid 150 to enter and exit the interior and exterior of the housing 140 . Figure 1A Schematically, an inlet IN and an outlet OUT are shown at the bottom of the housing 140 , but the present invention is not limited thereto. The number and position of the inlet and outlet of the housing 140 can be adjusted according to actual needs.

[0074] In some embodiments, the cooling circulation device 160 includes a pump 162 and a radiator 164 disposed outside the shell 140. The dielectric fluid 150 can be pumped out from at least one outlet portion OUT of the shell 140 through the pump 162 and pass through the radiator 164 so as to dissipate the heat of the dielectric fluid 150 to the outside. The dielectric fluid 150 flowing through the radiator 164 then returns to the inside of the shell 140 through at least one inlet portion IN, and the cycle operation is performed in this way to improve the heat dissipation efficiency.

[0075] The outlet OUT of the housing 140 and the pump 162, the pump 162 and the radiator 164, and the radiator 164 and the inlet IN may be connected by pipes (not shown) to serve as a channel for the dielectric fluid 150. In some embodiments, the radiator 164 may be a fin radiator or other suitable radiator, but the present invention is not limited thereto.

[0076] In some embodiments, the antenna package heat dissipation structure 10 further includes a heat dissipation plate 132, which is disposed on the second surface 100b of the circuit board 100, and the heat dissipation fins 130 are disposed on the heat dissipation plate 132. In this way, the heat of the circuit board 100 can be dissipated through the heat dissipation plate 132 and the heat dissipation fins 130, and then the heat energy is taken away by the direct contact between the dielectric fluid 150 and the heat dissipation plate 132 and / or the heat dissipation fins 130, and then dissipated to the outside of the housing 140 through the cooling circulation device 160.

[0077] In some embodiments, the surface of the heat dissipation plate 132 that contacts the dielectric fluid 150 may have a plurality of micro-bumps or micro-cavities (not shown) to increase the disturbance of the dielectric fluid 150 in the housing 140 .

[0078] In some embodiments, the circuit board 100 has a plurality of through holes TH, which are arranged corresponding to the chips 120 .

[0079] In some embodiments, the antenna package heat dissipation structure 10 further includes a heat sink 134 disposed on the heat sink 132 and disposed in the through hole TH. In some embodiments, the heat sink 134 penetrates the circuit board 100 and directly contacts the back surface 120b of the chip 120. In this way, the heat sink 134 can conduct the heat generated by the chip 120 to the heat sink 132 and the heat sink fins 130, and then dissipate the heat energy to the outside of the housing 140 through the dielectric fluid 150. However, the present invention is not limited thereto. In other embodiments, a temperature equalizer (not shown) or a thermal interface material (not shown) may be further included between the chip 120 and the heat sink 134 to enhance the heat dissipation effect of the chip 120.

[0080] Figure 1A The corresponding arrangement of the heat dissipation fins and the heat dissipation block is schematically illustrated but is not intended to limit the present invention. The number and position of the heat dissipation fins can be adjusted according to actual needs.

[0081] In some embodiments, the antenna package heat dissipation structure 10 further includes a baffle 141, which is disposed on the inner surface of the housing 140, and the circuit board 100 is fixed on the baffle 141. In this way, the circuit board 100, the baffle 141, and the heat sink 132 can divide the housing 140 into a first space S11 and a second space S12. The first space S11 includes the circuit board 100, the antenna substrate 110, and the chip 120 disposed therein, and the second space S12 includes the heat sink 132 and the heat dissipation fins 130 disposed therein. In some embodiments, the dielectric fluid 150 flows in the second space S12 to contact the heat dissipation fins 130. In other words, the dielectric fluid 150 does not directly contact the antenna substrate 110 and the chip 120.

[0082] In some embodiments, the dielectric fluid 150 may include a non-conductive fluid such as pure water, silicone oil, mineral oil or fluorinated liquid. The fluorinated liquid may refer to a fluorinated alkane, ether or ketone liquid. For example, the fluorinated liquid may be selected from the group consisting of methyl perfluoropropane ether, methyl nonafluoroisobutyl ether, methyl nonafluorobutyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy-4-(trifluoromethyl)-pentane, 1,1,1,2,2,4,5,5,5-nonafluoro-4-(trifluoromethyl)-3-pentanone and combinations thereof.

[0083] In some embodiments, the heat dissipation fins 130 , the heat dissipation plate 132 , and the heat dissipation block 134 may be made of copper, aluminum, or other suitable thermally conductive materials.

[0084] Figures 1B to 1D Some embodiments of the heat sink 130 are shown. In some embodiments, Figure 1B As shown, the heat sink 130 may include a first portion 130a, a second portion 130b and a third portion 130c. The first portion 130a is in direct contact with the heat sink 132, the second portion 130b is located on the side wall of the first portion 130a, and the third portion 130c is located on the bottom surface of the first portion 130a, wherein the porosity of the third portion 130c is greater than the porosity of the second portion 130b. For example, the second portion 130b and the third portion 130c may be metal materials with holes, such as foam metal. The second portion 130b may be a foam metal with dense holes to increase the contact area with the dielectric fluid, thereby improving the heat conduction efficiency. The third portion 130c may be a foam metal with loose holes to increase the disturbance of the dielectric fluid flow and reduce the possibility of fluid quiescence on the back of the fin.

[0085] In some embodiments, the porosity of the second portion 130b may be greater than or equal to the porosity of the first portion 130a. For example, the first portion 130a may be a metal material without pores, or the first portion 130a may be a foam metal and have a similar porosity to the second portion 130b.

[0086] exist Figure 1C In the embodiment of the present invention, the heat sink 130 is similar to Figure 1B In the embodiment, the second portion 130b can also extend to the bottom surface of the first portion 130a, so that the second portion 130b is located on the side wall and the bottom surface of the first portion 130a, and the third portion 130c can be located on the side wall and the bottom surface of the second portion 130b. In other words, the second portion 130b is located between the first portion 130a and the third portion 130c, and the third portion 130c does not directly contact the first portion 130a.

[0087] exist Figure 1D In the embodiment of the present invention, the heat sink 130 is similar to Figure 1B In an embodiment, the third portion 130c may further extend onto the sidewall of the second portion 130b, so that the third portion 130c directly contacts the bottom surface and sidewall of the second portion 130b and the bottom surface of the first portion 130a.

[0088] However, the heat dissipation fins 130 of the present invention are not limited to Figures 1B to 1D In other embodiments, the heat dissipation fins 130 may also be a metal heat dissipation material without holes.

[0089] In some embodiments, the heat dissipation plate 132 and the heat dissipation block 134 may be made of metal heat dissipation materials without holes.

[0090] In some other embodiments, the heat sink 132, the heat sink block 134 and / or the heat sink fins 130 may be a heat dissipation structure filled with a working fluid having phase change properties. Specifically, the heat dissipation structure is a metal shell that encloses the working fluid. The interior of the metal shell has a vacuum or near-vacuum enclosed space and a capillary structure on its inner wall, and the working fluid is located in the enclosed space. When the heat dissipation structure contacts the heat source, the liquid-phase working fluid absorbs heat and boils and vaporizes, so a pressure difference is generated in the enclosed space, causing the steam to flow to a lower temperature area, and when the vapor-phase working fluid contacts a relatively cold area, condensation will occur. Since the inner wall of the metal shell has a capillary structure, the condensed working fluid can be guided back to the heat source. In this way, the working fluid can operate cyclically in the enclosed space to achieve the purpose of heat dissipation. In some embodiments, the working fluid may be a fluid with a boiling point of less than 70°C under vacuum, but the present invention is not limited to this.

[0091] In some embodiments, the housing 140 may include a main body 142 and a top cover 144. The main body 142 has a housing space formed by a side wall and a bottom plate, and the housing space is used for components such as the circuit board 100, the antenna substrate 110, the heat sink 132, and the heat sink fins 130 to be arranged therein. The main body 142 has an opening, and the opening corresponds to at least the antenna layer 112 of the antenna substrate 110. The top cover 144 is arranged in the opening of the main body 142 and connected to the main body 142 to seal the housing space, so that the components such as the circuit board 100, the antenna substrate 110, the heat sink 132, and the heat sink fins 130 are enclosed therein. The antenna substrate 110 is closer to the top cover 144 than the circuit board 100, and the upper surface 110a of the antenna substrate 110 faces the top cover 144.

[0092] In some embodiments, the material of the top cover portion 144 is different from that of the main body portion 142. For example, the main body portion 142 may be made of metal material to protect the antenna structure and have a good shielding effect on noise; and the top cover portion 144 may be made of plastic insulating materials such as PP polypropylene or other suitable non-magnetic materials, so that the antenna layer 112 can receive or transmit electromagnetic wave signals through the top cover portion 144.

[0093] Figure 2 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 2 The embodiment of FIG. 1 uses the component numbers and some contents of the embodiment of FIG. 1 , wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiment, and will not be repeated here.

[0094] Please refer to Figure 2 , Figure 2 The difference between the antenna package heat dissipation structure 20 of FIG. 1 and the antenna package heat dissipation structure 10 of FIG. 1 is that the dielectric fluid 150 flows in the space surrounded by the antenna substrate 110, the baffle 141 and the shell 140. Specifically, the baffle 141 of the antenna package heat dissipation structure 20 is disposed on the inner surface of the shell 140, and the lower surface 110b of the antenna substrate 110 is fixed on the baffle 141, so that the antenna substrate 110 and the baffle 141 divide the shell 140 into a first space S21 and a second space S22. The first space S21 includes the antenna substrate 110 disposed therein and the antenna layer 112 is exposed in the first space S21. The second space S22 includes the circuit board 100, the chip 120, the heat sink 132 and the heat sink fins 130 disposed therein, and the dielectric fluid 150 flows in the second space S22. In other words, the dielectric fluid 150 can be in direct contact with the circuit board 100, the heat sink 132, the heat sink fins 130 and the chip 120. The dielectric fluid 150 may also be in direct contact with the conductive connector 170 to facilitate heat dissipation of the conductive connector 170 .

[0095] In some embodiments, the dielectric fluid 150 may contact the lower surface 110 b of the antenna substrate 110 , but not the upper surface 110 a of the antenna substrate 110 . That is, the dielectric fluid 150 does not contact the antenna layer 112 .

[0096] In some embodiments, the heat dissipation plate 132 of the antenna package heat dissipation structure 20 has a plurality of through holes V, which may be located around the heat dissipation block 134 and correspond to the through holes TH of the circuit board 100. Therefore, the dielectric fluid 150 may flow into the gap between the heat dissipation block 134 and the circuit board 100 through the plurality of through holes V, thereby making it easier for the dielectric fluid 150 to flow into the space between the circuit board 100 and the antenna substrate 110 (including the space between the chip 120 and the antenna substrate 110) to improve the heat dissipation efficiency of the conductive connector 170 and the chip 120. In other embodiments, the antenna package heat dissipation structure 20 may not have the heat dissipation plate 132 and the heat dissipation block 134, but may have a conductive connector 170 and a conductive connector 170. Figure 2 The heat dissipation fins 130 are described below. Figure 7 The heat dissipation fin 130 shown in the embodiment is disposed in the through hole TH of the circuit board 100 and directly or indirectly contacts the chip 120. In addition, in some other embodiments, the antenna package heat dissipation structure 20 may not have the heat dissipation plate 132, the heat dissipation block 134 and the heat dissipation fin 130, so that the through hole TH of the circuit board 100 has the dielectric fluid 150 passing through and contacts the chip 120.

[0097] In some embodiments, the heat sink 130 may be as described above. Figures 1B to 1D In some embodiments, the surface or the entirety of the heat sink 134 may also be the same as the aforementioned Figures 1B to 1D The second portion 130 b of the heat dissipation fin 130 shown in the embodiment has a similar structure, that is, the surface or the entirety of the heat dissipation block 134 may be a foam metal with dense pores to improve the heat conduction efficiency.

[0098] In some embodiments, the antenna package heat dissipation structure 20 further includes a spoiler 180, which is disposed on the inner surface of the housing 140 and is located between the inlet IN and the outlet OUT of the housing 140, and is in contact with the dielectric fluid 150 to promote the disturbance of the dielectric fluid 150 in the housing 140 and reduce the possibility of fluid bypass. In some embodiments, the spoiler 180 may be a foam metal, so that the dielectric fluid 150 can pass through the holes of the spoiler 180, reduce the dead zone on the side of the spoiler 180 facing away from the flow direction of the dielectric fluid 150, and promote the disturbance of the dielectric fluid 150, so that the dielectric fluid 150 can flow evenly in the second space S22, and can effectively take away the heat in the second space S22.

[0099] Figure 2 Three spoiler components 180 are schematically illustrated, but this is not intended to limit the present invention. The number, size and location of the spoiler components 180 can be adjusted according to actual needs.

[0100] Figure 3 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 3 The implementation examples are used Figure 2 The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0101] Please refer to Figure 3 , Figure 3 The antenna package heat dissipation structure 30 and Figure 2 The difference between the antenna package heat dissipation structure 20 and the antenna package heat dissipation structure 30 is that the antenna package heat dissipation structure 30 further includes a temperature averaging plate 190, which is disposed between the chip 120 and the heat dissipation block 134. In this way, the heat generated by the chip 120 can be firstly conducted to the temperature averaging plate 190, and then transmitted to the dielectric fluid 150 through the heat dissipation block 134, the heat dissipation plate 132 and the heat dissipation fins 130, and the heat energy is dissipated to the outside of the housing 140 through the dielectric fluid 150.

[0102] exist Figure 3 In the embodiment, the temperature plate 190 may be in direct contact with the first surface 100a of the circuit board 100 through a thermal interface material (TIM) (not shown), but this is not intended to limit the present invention, as long as the temperature plate 190 is attached to the back surface 120b of the chip 120. In other words, in other embodiments, there may be a gap between the temperature plate 190 and the first surface 100a of the circuit board 100.

[0103] In some embodiments, the dielectric fluid 150 may also be in direct contact with the vapor chamber 190 .

[0104] exist Figure 3 In the embodiment, the heat sink 132 is not provided with through holes, and the gap between the heat sink 134 and the circuit board 100 can be filled with a non-conductive thermal interface material to promote heat conduction. However, this is not intended to limit the present invention, and the heat sink 132 can also be as Figure 2 The embodiment has a plurality of through holes so that the dielectric fluid can flow into the gap between the heat dissipation plate 132 and the circuit board 100.

[0105] Figure 3 Although the spoiler component is not shown in the figure, the antenna package heat dissipation structure 30 may further include a spoiler component to enhance the flow of the dielectric fluid 150 in the housing 140 .

[0106] Figure 4 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 4 The implementation examples are used Figure 2The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0107] Please refer to Figure 4 The antenna package heat dissipation structure 40 includes a circuit board 100, an antenna substrate 110, a chip 120, a shell 140 and a dielectric fluid 150. The circuit board 100 has a first surface 100a and a second surface 100b relative to the first surface 100a. The antenna substrate 110 is disposed on the first surface 100a of the circuit board 100. The antenna substrate 110 includes an antenna layer 112, which is disposed on the upper surface 110a of the antenna substrate 110. The chip 120 is disposed between the antenna substrate 110 and the first surface 100a of the circuit board 100, and is electrically connected to the antenna substrate 110. The shell 140 encloses the circuit board 100, the antenna substrate 110 and the chip 120. The dielectric fluid 150 circulates in the shell 140 through the cooling circulation device 160 and is in direct contact with the antenna layer 112.

[0108] exist Figure 4 In the embodiment, since the circuit board 100, the antenna substrate 110, the chip 120 and the dielectric fluid 150 are all located in the same space of the housing 140, the dielectric fluid 150 can flow throughout the housing 140 and directly contact the circuit board 100, the antenna substrate 110 and the chip 120. The circuit board 100 and / or the antenna substrate 110 are fixed in the housing 140. Figure 4 The connection method between the circuit board 100 and the housing 140 is omitted. In some embodiments, the circuit board 100 and / or the antenna substrate 110 can be fixed in the housing 140 by means of support columns, bolts, etc., which is not limited by the present invention.

[0109] In some embodiments, the dielectric fluid 150 may be fully filled in the housing 140 .

[0110] In some embodiments, the vertical distance between the antenna layer 112 and the top cover portion 144 of the housing 140 is less than 2 cm, for example, between 1.0 cm and 2.0 cm.

[0111] exist Figure 4 In the embodiment, the through hole TH of the circuit board 100 has the dielectric fluid 150 passing through it without a heat sink or heat sink fin, but the present invention is not limited thereto. In other embodiments, a heat sink or heat sink fin may be disposed in the through hole TH of the circuit board 100.

[0112] Figure 5 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 5 The implementation examples are used Figure 4The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0113] Please refer to Figure 5 , Figure 5 The antenna package heat dissipation structure 50 and Figure 4 The difference between the antenna package heat dissipation structure 40 and the antenna package heat dissipation structure 50 is that the housing 140 of the antenna package heat dissipation structure 50 includes an inlet IN and two outlets OUT1 and OUT2. The inlet IN is disposed on the bottom plate of the housing 140, and the outlets OUT1 and OUT2 are disposed on the side walls of the housing 140. In some embodiments, the outlet OUT1 and the outlet OUT2 are opposite to each other, but the present invention is not limited thereto.

[0114] In some embodiments, a cooling circulation device 160a may be disposed between the outlet OUT1 and the inlet IN outside the housing 140, and a cooling circulation device 160b may be disposed between the outlet OUT2 and the inlet IN outside the housing 140, so that the dielectric fluid 150 flowing out of different outlets passes through different cooling circulation devices for heat dissipation and then returns to the inside of the housing 140. However, the present invention is not limited thereto, and the dielectric fluid 150 flowing out of different outlets may also be merged into one stream through a pipeline design and then return to the inside of the housing 140 through a single cooling circulation device.

[0115] Figure 6 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 6 The implementation examples are used Figure 4 The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0116] Please refer to Figure 6 , Figure 6 The antenna package heat dissipation structure 60 and Figure 4 The difference between the antenna package heat dissipation structure 40 and the embodiment is that the inlet portion IN and the outlet portion OUT are respectively disposed on opposite side walls of the housing 140 , and the position of the outlet portion OUT is higher than that of the inlet portion IN.

[0117] Figure 7 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 7 The implementation examples are used Figure 4The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0118] Please refer to Figure 7 , Figure 7 The antenna package heat dissipation structure 70 and Figure 4 The difference between the antenna package heat dissipation structure 40 and the antenna package heat dissipation structure 70 is that the antenna package heat dissipation structure 70 further includes heat dissipation fins 130 disposed in the through holes TH of the circuit board 100. The heat dissipation fins 130 may protrude from the second surface 100b of the circuit board 100 to promote the disturbance of the dielectric fluid 150 and improve the heat dissipation efficiency.

[0119] In some embodiments, the heat sink 130 may include foam metal. For example, the heat sink 130 may include the foam metal. Figures 1B to 1D As shown in the embodiment.

[0120] In some embodiments, there is a gap between the heat dissipation fin 130 and the circuit board 100 so that the dielectric fluid 150 can flow therein, so that the dielectric fluid 150 can easily flow to the space between the antenna substrate 110 and the circuit board 100 .

[0121] In some embodiments, the back side 120b of the chip 120 may include a thermal interface material layer 122 to facilitate connection with the heat sink 130, but the present invention is not limited thereto. In other embodiments, the heat sink 130 may be in direct contact with the back side 120b of the chip 120. In still other embodiments, a temperature averaging plate (not shown) may be further disposed between the heat sink 130 and the back side 120b of the chip 120.

[0122] In some embodiments, the thermal interface material layer 122 may be a thermally conductive adhesive, a heat dissipation pad, or other suitable thermal interface materials.

[0123] Figure 7 Although the spoiler component is not shown in the figure, the antenna package heat dissipation structure 70 may further include a spoiler component to enhance the disturbance of the dielectric fluid 150 in the housing 140 .

[0124] Figure 8 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Figure 8 The implementation examples are used Figure 7 The component numbers and partial contents of the embodiments are the same, wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiments, and will not be repeated here.

[0125] Please refer to Figure 8 , Figure 8The antenna package heat dissipation structure 80 and Figure 7 The difference between the antenna package heat dissipation structure 70 and the antenna package heat dissipation structure 80 is that the antenna package heat dissipation structure 80 also includes a heat dissipation plate 132. The heat dissipation plate 132 is disposed on the second surface 100b of the circuit board 100 and connected to the heat dissipation fins 130, wherein the surface of the heat dissipation plate 132 includes a plurality of micro-bumps 132a or micro-cavities (e.g., corresponding to the concave area between two micro-bumps) to help promote the flow of the dielectric fluid 150 in the housing 140. The present invention does not limit the shape of the micro-bump 132a, which can be cylindrical, spherical, hemispherical, etc., or a corresponding bump shape can be formed by forming micro-cavities.

[0126] In some embodiments, the heat sink 132 may be a foam metal to facilitate turbulence and heat conduction of the dielectric fluid 150 within the housing 140 .

[0127] In some embodiments, there is a gap between the heat sink 132 and the second surface 100 b of the circuit board 100 , so that the dielectric fluid 150 can flow into it, thereby allowing the dielectric fluid 150 to flow through the gap between the circuit board and the heat sink fins 130 and then flow to the space between the antenna substrate 110 and the circuit board 100 to improve the heat dissipation efficiency of the chip 120 .

[0128] Figure 8 Schematically, an inlet IN and an outlet OUT are shown at the bottom of the housing 140, but the present invention is not limited thereto. The number and position of the inlet and outlet of the housing 140 can be adjusted according to actual needs. In some embodiments, the inlet and outlet of the housing 140 can be similar to Figure 5 or Figure 6 Embodiment configuration.

[0129] Figure 8 Although the spoiler component is not shown in the figure, the antenna package heat dissipation structure 80 may further include a spoiler component to enhance the disturbance of the dielectric fluid 150 in the housing 140 .

[0130] Fig. 9 It is a cross-sectional schematic diagram of an antenna package heat dissipation structure according to another embodiment of the present invention. Fig. 9 The embodiment of FIG. 1 uses the component numbers and some contents of the embodiment of FIG. 1 , wherein the same or similar numbers are used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can be referred to the aforementioned embodiment, and will not be repeated here.

[0131] Please refer to Fig. 9The antenna package heat dissipation structure 90 includes a circuit board 100, an antenna substrate 110, a chip 120, a plurality of heat dissipation fins 930, a housing 140, and a cooling fluid 950. The housing 140 includes a first space S91 and a second space S92, and the first space S91 and the second space S92 are isolated from each other by a heat dissipation plate 932. The circuit board 100 is located in the first space S91 and is disposed on the heat dissipation plate 932. The antenna substrate 110 is located in the first space S91 and is disposed on the circuit board 100. The chip 120 is disposed between the antenna substrate 110 and the circuit board 100, and is electrically connected to the antenna substrate 110. The heat dissipation fins 930 are located in the second space S92 and are disposed on the heat dissipation plate 932. The cooling fluid 950 is located in the second space S92 and is in contact with the heat dissipation fins 930, wherein the cooling fluid 950 absorbs heat from the heat dissipation fins 930 and produces a phase change.

[0132] The cooling fluid 950 is in a state where the vapor phase and the liquid phase coexist in the second space S92. Specifically, the liquid phase cooling fluid 950 does not fill the second space S92, but at least directly contacts a portion of the heat sink fins 930, so that a portion of the liquid phase cooling fluid 950 absorbs heat from the heat sink fins 930 and vaporizes to form steam 950v. The generation of steam causes a pressure difference in the second space S92, causing the steam to flow to a region with a lower temperature and condense again into the liquid phase cooling fluid 950. This cyclic operation can effectively and quickly conduct heat.

[0133] The pressure of the second space S92 may be less than one atmosphere. In some embodiments, the second space S92 may be in a near vacuum state. In some embodiments, the pressure of the second space S92 is less than the pressure of the first space S91.

[0134] In some embodiments, the cooling fluid 950 may be a liquid with a low boiling point and high volatility, such as ethanol, ammonia, perfluorocarbon, perfluoropolyether or other suitable cooling fluids. In some embodiments, the boiling point of the cooling fluid 950 in the second space S92 may be less than 70° C., such as between 50° C. and 60° C., to enhance the heat dissipation effect of the chip 120.

[0135] In some embodiments, the antenna package heat dissipation structure 90 further includes a heat dissipation block 934 disposed on the heat dissipation plate 932 and disposed in the through hole TH. In some embodiments, the heat dissipation block 934 penetrates the circuit board 100 and directly contacts the back surface 120b of the chip 120. In this way, the heat dissipation block 934 can conduct the heat generated by the chip 120 to the heat dissipation fins 930, and then the cooling fluid 950 continuously circulates in the second space S92 to perform a liquid-vapor phase change to effectively conduct the heat generated by the chip 120.

[0136] In some embodiments, the heat sink 932, the heat sink fins 930 and the heat sink 934 are made of metal materials without holes. In some embodiments, the heat sink 932, the heat sink fins 930 and the heat sink 934 can be made of copper, aluminum or other suitable thermal conductive materials.

[0137] In some embodiments, a temperature vaporizer (not shown) may be included between the chip 120 and the heat sink 934 to enhance the heat dissipation effect of the chip 120. In some embodiments, a thermal interface material (not shown) may be included between the chip 120 and the heat sink 934 to enhance the connection between the chip 120 and the heat sink 934.

[0138] In some embodiments, the antenna package heat dissipation structure 90 further includes external fins 931 disposed on the outer surface of the housing 140 and corresponding to the second space S92 . In this way, the heat of the cooling fluid 950 can be further dissipated to the outside of the housing 140 through the external fins 931 .

[0139] In some embodiments, the surface of the heat sink fin 930 may have a microstructure (not shown) to increase its surface roughness, which can assist the boiling of the cooling fluid 950 so that the vaporized steam can easily separate from the surface of the heat sink fin 930, thereby allowing the cooling fluid 950 to smoothly undergo a phase change cycle. In some embodiments, the microstructure can be formed by laying metal micro particles on the surface of the heat sink fin 930, but the present invention is not limited thereto.

[0140] In summary, the antenna package heat dissipation structure of the present invention improves its heat dissipation efficiency by setting a dielectric fluid or a cooling fluid, making the antenna package heat dissipation structure suitable for application in the 5G communication industry and low-orbit satellite ground stations.

[0141] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An antenna packaging heat dissipation structure, characterized in that: include: A circuit board having a first surface and a second surface opposite to the first surface; An antenna substrate, disposed on the first surface of the circuit board; A chip, disposed between the antenna substrate and the first surface of the circuit board, and electrically connected to the antenna substrate; A plurality of heat dissipation fins protruding from the second surface of the circuit board; A housing encapsulating the circuit board, the antenna substrate, the chip and the plurality of heat dissipation fins; as well as The dielectric fluid circulates in the housing through a cooling circulation device and directly contacts the plurality of heat dissipation fins.

2. The antenna package heat dissipation structure according to claim 1, characterized in that: Also includes: A heat sink is disposed on the second surface of the circuit board, wherein the plurality of heat sink fins are disposed on the heat sink, and the dielectric fluid is in direct contact with the heat sink.

3. The antenna package heat dissipation structure according to claim 2, characterized in that: Also includes: The baffle is arranged on the inner surface of the shell, and the circuit board is fixed on the baffle, wherein the dielectric fluid flows in the space surrounded by the circuit board, the baffle, the heat sink and the shell to directly contact the plurality of heat sink fins.

4. The antenna package heat dissipation structure according to claim 2, characterized in that: Also includes: The heat dissipation block is arranged on the heat dissipation plate and penetrates the circuit board.

5. The antenna package heat dissipation structure according to claim 4, characterized in that: Also includes: The baffle is disposed on the inner surface of the shell, and the antenna substrate is fixed on the baffle, wherein the dielectric fluid flows in the space surrounded by the antenna substrate, the baffle and the shell to directly contact the plurality of heat dissipation fins.

6. The antenna package heat dissipation structure according to claim 5, characterized in that: The heat dissipation plate has a plurality of through holes, and the dielectric fluid flows into the gap between the heat dissipation block and the circuit board through the plurality of through holes.

7. The antenna package heat dissipation structure according to claim 5, characterized in that: The dielectric fluid is also in direct contact with the chip.

8. The antenna package heat dissipation structure according to claim 1, characterized in that: The antenna substrate includes an antenna layer disposed on an upper surface of the antenna substrate, and the antenna layer is not in contact with the dielectric fluid.

9. The antenna package heat dissipation structure according to claim 1, characterized in that: Also includes: The temperature plate is arranged on the back side of the chip.

10. The antenna package heat dissipation structure according to claim 1, characterized in that: The shell includes at least one inlet and at least one outlet. The cooling circulation device includes a pump and a radiator disposed outside the shell. The dielectric fluid is drawn out from the at least one outlet of the shell by the pump and passes through the radiator to dissipate the heat of the dielectric fluid to the outside. The dielectric fluid flowing through the radiator then returns to the inside of the shell through the at least one inlet.

11. The antenna package heat dissipation structure according to claim 1, characterized in that: Each of the plurality of heat dissipation fins comprises: A first part, in direct contact with the heat sink; a second portion located on a side wall of the first portion; and The third part is located on the bottom surface of the first part, The porosity of the third portion is greater than the porosity of the second portion.

12. The antenna package heat dissipation structure according to claim 1, characterized in that: The dielectric fluid includes pure water, silicone oil, mineral oil or fluorinated liquid.

13. An antenna packaging heat dissipation structure, characterized in that: include: A circuit board having a first surface and a second surface opposite to the first surface; An antenna substrate, disposed on the first surface of the circuit board, wherein the antenna substrate comprises an antenna layer disposed on the surface of the antenna substrate; A chip, disposed between the antenna substrate and the first surface of the circuit board, and electrically connected to the antenna substrate; A housing encapsulating the circuit board, the antenna substrate and the chip; The dielectric fluid circulates in the shell through a cooling circulation device and is in direct contact with the antenna layer.

14. The antenna package heat dissipation structure according to claim 13, characterized in that: The circuit board has a through hole corresponding to the chip, and the dielectric fluid flows through the through hole to contact the chip.

15. The antenna package heat dissipation structure according to claim 14, characterized in that: Also includes: The heat dissipation fin is disposed in the through hole of the circuit board and protrudes from the second surface of the circuit board.

16. The antenna package heat dissipation structure according to claim 15, characterized in that: The heat dissipation fins include foam metal.

17. The antenna package heat dissipation structure according to claim 15, characterized in that: Also includes: A heat sink is disposed on the second surface of the circuit board and connected to the heat sink fins, wherein the surface of the heat sink includes a plurality of micro bumps or micro recesses.

18. The antenna package heat dissipation structure according to claim 17, characterized in that: The dielectric fluid flows through the space between the heat dissipation plate and the circuit board.

19. The antenna package heat dissipation structure according to claim 13, characterized in that: The shell includes at least one inlet and at least one outlet. The cooling circulation device includes a pump and a radiator disposed outside the shell. The dielectric fluid is drawn out from the at least one outlet of the shell by the pump and passes through the radiator to dissipate the heat of the dielectric fluid to the outside. The dielectric fluid flowing through the radiator then returns to the inside of the shell through the at least one inlet.

20. The antenna package heat dissipation structure according to claim 19, characterized in that: Also includes: A flow-disturbing component is disposed on the inner surface of the shell and is located between the at least one inlet portion and the at least one outlet portion of the shell to promote disturbance of the dielectric fluid in the shell, wherein the flow-disturbing component is foamed metal.

21. An antenna packaging heat dissipation structure, characterized in that: include: A housing, comprising a first space and a second space, wherein the first space and the second space are isolated from each other by a heat dissipation plate; A circuit board is located in the first space and is disposed on the heat dissipation plate; An antenna substrate, located in the first space and arranged on the circuit board; A chip is disposed between the antenna substrate and the circuit board and is electrically connected to the antenna substrate; A heat dissipation fin is located in the second space and is arranged on the heat dissipation plate; as well as A cooling fluid is located in the second space and contacts the heat sink fins, wherein the cooling fluid absorbs heat from the heat sink fins to generate a phase change.

22. The antenna package heat dissipation structure according to claim 21, characterized in that: The pressure of the second space is lower than the atmospheric pressure.

23. The antenna package heat dissipation structure according to claim 21, characterized in that: The cooling fluid includes ethanol, ammonia, perfluorocarbon or perfluoropolyether.

24. The antenna package heat dissipation structure according to claim 21, characterized in that: The cooling fluid is in a state where a vapor phase and a liquid phase coexist in the second space.

25. The antenna package heat dissipation structure according to claim 21, characterized in that: The surface of the heat dissipation fin has a microstructure to increase the surface roughness of the heat dissipation fin.

26. The antenna package heat dissipation structure according to claim 21, characterized in that: Also includes: A heat sink is disposed on the heat sink and penetrates the circuit board to contact the chip.

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