Integrated circuit chip packaging structure and integrated circuit chip packaging body

Abstract

The invention discloses an integrated circuit chip packaging structure and an integrated circuit chip packaging body, and relates to the field of integrated circuit chips, the integrated circuit chip packaging structure comprises a substrate, a chip and a packaging layer are sequentially installed on the substrate, two sides of the substrate are connected with a plurality of pins, heat dissipation assemblies are attached to the bottom surface of the substrate and the top surface of the packaging layer, and the heat dissipation assemblies are connected with the chip and the packaging layer. The bottom surface of the substrate is fixedly connected with a plurality of elastic supporting legs, the width of each pin is smaller than the diameter of a through hole of the circuit board, a deformation clamping structure used for clamping the through hole of the circuit board is arranged, and the pins are clamped with the circuit board. According to the chip packaging body, the deformation clamping structures are arranged on the pins, the clamping structures on the pins are deformed and clamped with the circuit board through elastic force provided when the elastic supporting feet are compressed, the pin structures can be smoothly inserted into the circuit board and rapidly and stably connected with the circuit board, and the stability degree of connection of the chip packaging body is effectively improved.

Description

Technical Field

[0001] The present invention relates to a field, in particular to an integrated circuit chip packaging structure and an integrated circuit chip packaging body. Background Art

[0002] Chip packaging is a process of installing and sealing chips and related components. The packaging structure plays the role of placing, fixing, sealing and protecting the chip. A Chinese patent with related announcement number CN110265380B discloses a peripheral device integrated circuit chip packaging structure, including a substrate, an adhesive, a chip, a lead, a pin, an epoxy resin, a circuit board and a through hole, wherein bumps are fixedly installed on the left and right sides of the pin, and the total width of the bump and the pin is slightly larger than the diameter of the through hole, a groove is provided on the bottom surface of the epoxy resin, a compression block is fixedly installed inside the groove, a cavity is provided inside the epoxy resin and located above the chip, a through groove 1 is provided on the top surface of the epoxy resin, a heat conduction box is fixedly installed on the top surface of the chip and located inside the cavity, a through groove 2 is provided on the top surface of the heat conduction box, a spring is fixedly installed on the bottom surface of the inside of the heat conduction box, and a heat sink is fixedly installed on the top of the spring.

[0003] In order to solve the problem of poor chip heat dissipation, the existing chip packaging structure opens a cavity above the chip and uses a heat-conducting structure that can be raised and lowered to transfer heat. In addition, in order to ensure that the chip package is stably connected to the circuit board, a bump wider than the pin hole on the circuit board is set at the bottom of the pin.

[0004] With respect to the above-mentioned related technologies, it is not easy to achieve a good thermal conductivity in the cavity of the chip package, and the heat can only be transferred through the inner wall of the heat conduction box. The effective heat dissipation area formed by the multiple fins that rise and fall when extended is small, and the heat dissipation method of the chip in the prior art will not be easily changed in actual use. When selecting a chip for secondary packaging, it is determined whether to install an external heat sink or rely solely on the chip itself for heat dissipation based on the heat dissipation requirements of the chip. In addition, the bending strength of the chip pins is generally weak, and the bumps at the bottom of the chip pins require greater pressure when passing through the holes in the circuit board. Pressing the chip package hard can easily cause the pins to bend, which may damage the chip and affect the yield rate of the chip secondary packaging. In summary, the existing chip packaging structure makes it difficult for the chip package to be stably installed and used. Summary of the invention

[0005] Based on this, an object of the present invention is to provide an integrated circuit chip packaging structure and an integrated circuit chip package to solve the technical problem that the existing chip packaging structure is difficult to stably install and use the chip package.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an integrated circuit chip packaging structure, comprising a substrate, on which a chip and a packaging layer are mounted in sequence, a plurality of pins are connected to both sides of the substrate, a heat dissipation component is attached to the bottom surface of the substrate and the top surface of the packaging layer, a plurality of elastic support feet are fixedly connected to the bottom surface of the substrate, the width of the pins is smaller than the diameter of the perforation of the circuit board, and a deformable clamping structure for clamping the perforation of the circuit board is provided, when the pins are clamped with the circuit board, the elastic support feet are in a compressed state, and the heat dissipation component on the bottom surface of the substrate does not contact the circuit board.

[0007] By adopting the above technical solution, a deformation clamping structure is set on the pin, and the clamping structure on the pin is deformed and clamped with the circuit board by utilizing the elastic force provided by the compression of the elastic support foot. The elastic support foot also supports a space under the chip package for the heat dissipation of the heat dissipation component. The pin structure can be smoothly inserted into the circuit board and quickly achieve a stable connection with the circuit board, effectively improving the stability of the chip package connection.

[0008] The present invention is further configured such that a first stamping groove and a second stamping groove are spaced apart at the bottom end of the pin along the height direction, a connecting section is left between the first stamping groove and the second stamping groove of the pin, a bending section is connected above the connecting section, and a vertical section is connected below the connecting section, the bending section is used to limit the pin from sliding up after passing through the through hole of the circuit board, and the height from the top of the bending section to the bottom of the vertical section is greater than the diameter of the through hole of the circuit board.

[0009] By adopting the above technical solution, the elastic supporting foot is kept in a compressed state, and the elastic force of the elastic supporting foot is utilized to conveniently and stably connect the pin to the circuit board.

[0010] The present invention is further configured such that after the connecting section is deformed by torsion, the elastic supporting foot is in a compressed state, and the bent section and the vertical section contact the circuit board at the same time.

[0011] By adopting the above technical solution, when the bent section and the vertical section contact the bottom surface of the circuit board at the same time, under the elastic force of the elastic supporting foot, the pin completes a stable connection with the circuit board.

[0012] The present invention is further configured such that when the bottom surface of the bending section contacts the through hole of the circuit board, it rotates toward the first punching groove, and when the top surface of the bending section contacts the through hole of the circuit board, it rotates away from the first punching groove.

[0013] By adopting the above technical solution, the pins can be easily inserted into the through holes of the circuit board.

[0014] An integrated circuit chip package comprises a substrate, on which a chip and a packaging layer are sequentially mounted, and a heat dissipation component is attached to the bottom surface of the substrate and the top surface of the packaging layer.

[0015] By adopting the above technical solution, a heat dissipation component that can be broken is set on the top surface of the chip package. When the chip package needs to dissipate heat by itself, the heat dissipation components at both ends of the chip package cooperate with the heat-conducting structure to improve the heat dissipation efficiency of the chip. When the chip package needs to be installed with external cooling fans or liquid cooling plates and other external components, the heat dissipation components at both ends of the chip package can be broken and rotated toward the heat dissipation components on the top surface of the chip package. Under the premise that thermal grease is coated on the top surface of the chip package, the heat dissipation components on both sides of the chip package can allow the thermal grease to fill the gaps between the heat dissipation components, thereby effectively improving the thermal conductivity efficiency of the external heat dissipation component solution.

[0016] The present invention is further configured such that the bottom surface of the substrate is connected to a first heat sink, the top surface of the packaging layer is connected to a second heat sink, both ends of the second heat sink are fixedly connected to a third heat sink, and a broken groove is opened between the second heat sink and the third heat sink along the width direction.

[0017] By adopting the above technical solution, the first heat sink and the second heat sink can effectively improve the heat dissipation efficiency of the chip package.

[0018] The present invention is further configured such that first fins are connected at intervals on the first heat sink, second fins are connected at intervals on the second heat sink, third fins are connected at intervals on the third heat sink, and the second fins and third fins are alternately arranged.

[0019] By adopting the above technical solution, the natural heat dissipation efficiency of the chip package is effectively improved.

[0020] The present invention is further configured such that a heat conducting sheet is pasted on the bottom surface of the third heat sink, a heat conducting coating tape is pasted on the edge of the packaging layer, and the heat conducting coating tape is connected to the heat conducting sheet.

[0021] By adopting the above technical solution, the heat dissipation efficiency of the chip package is further improved.

[0022] The present invention is further configured such that an adhesive sheet is adhered to a side of the second heat sink and the third heat sink away from the broken groove.

[0023] By adopting the above technical solution, the adhesive sheet can prevent the third heat sink from being lost after the second heat sink and the third heat sink are separated from each other.

[0024] The present invention is further configured such that the length of the third heat sink is half the length of the second heat sink.

[0025] By adopting the above technical solution, the third heat sink can better cover the second heat sink after being flipped over and covered on the second heat sink.

[0026] In summary, the present invention mainly has the following beneficial effects: The present invention attaches a heat dissipation component to the surface of the substrate and the packaging layer, utilizes the heat-conducting structure on the heat dissipation component to efficiently take away the heat generated by the chip, and at the same time, a deformation clamping structure is provided on the pin, and the elastic force provided by the compression of the elastic support foot is utilized to deform the clamping structure on the pin and clamp it with the circuit board. The elastic support foot simultaneously supports a space for the heat dissipation component to dissipate heat under the chip package. The pin structure can be smoothly inserted into the circuit board and quickly realize a stable connection with the circuit board, thereby effectively improving the stability of the connection of the chip package and at the same time improving the heat dissipation efficiency of the chip package. The present invention provides a heat dissipation component that can be broken on the top surface of the chip package. When the chip package needs to dissipate heat by itself, the heat dissipation components at both ends of the chip package cooperate with the heat-conducting structure to improve the heat dissipation efficiency of the chip. When the chip package needs to be installed with external cooling fans or liquid cooling plates and other external components, the heat dissipation components at both ends of the chip package can be broken and rotated toward the heat dissipation component on the top surface of the chip package. Under the premise that the top surface of the chip package is coated with thermal grease, the heat dissipation components on both sides of the chip package can fill the gaps between the heat dissipation components with the thermal grease, thereby effectively improving the thermal conductivity efficiency of the external heat dissipation component solution. The present invention provides an easily-broken broken groove structure at the joint between the second heat sink and the third heat sink, so that the third heat sink can be broken and separated from the second heat sink along the broken groove when bent downward, and the second heat sink and the third heat sink are connected to each other by an adhesive sheet at the joint, so as to prevent the second heat sink from being lost after being broken and separated; The present invention adheres a heat conductive sheet to the bottom surface of the third heat sink and adheres a heat conductive coating tape to the edge of the packaging layer, and utilizes the heat conductive coating tape and the heat conductive sheet to efficiently conduct heat from the side of the chip package, thereby effectively improving the self-heating efficiency of the chip package. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A perspective view of the present invention; Figure 2 For the present invention Figure 1 A magnified view of middle; Figure 3 Another perspective view of the present invention; Figure 4 For the present invention Figure 3 Enlarged view of middle B; Figure 5 is a side view of the present invention; Figure 6 For the present invention Figure 5 Enlarged view of middle C; Figure 7 An exploded view of the present invention; Figure 8 It is another perspective exploded view of the present invention; Fig. 9 For the present invention Figure 8 Enlarged view of D in the middle.

[0028] In the figure: 1, substrate; 2, chip; 3, packaging layer; 4, pin; 401, connecting section; 402, bending section; 403, vertical section; 404, first stamping groove; 405, second stamping groove; 5, adhesive layer; 6, first heat sink; 601, first fin; 7, elastic supporting foot; 8, second heat sink; 801, second fin; 9, third heat sink; 901, third fin; 10, adhesive sheet; 11, broken groove; 12, thermal conductive sheet; 1201, thermal conductive coating tape. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] The following describes an embodiment of the present invention based on its overall structure. Example

[0031] An integrated circuit chip packaging structure, such as Figure 1-9 As shown, it includes a substrate 1, on which a chip 2 and a packaging layer 3 are sequentially mounted, an adhesive layer 5 is coated on the substrate 1, and multiple pins 4 are connected to both sides of the substrate 1. The bottom surface of the substrate 1 and the top surface of the packaging layer 3 are both attached with a heat dissipation component. The bottom surface of the substrate 1 is fixedly connected with multiple elastic support feet 7, the width of the pin 4 is smaller than the diameter of the circuit board perforation, and a deformable clamping structure for clamping the circuit board perforation is provided. Specifically, the deformable clamping structure includes a connecting section 401, a bending section 402 and a vertical section 403 of the pin 4. When the pin 4 is clamped with the circuit board, the elastic support foot 7 is in a compressed state, and the heat dissipation component on the bottom surface of the substrate 1 does not contact the circuit board. The pin 4 can easily pass through the circuit board perforation and be stably connected to the circuit board body. After subsequent soldering, the pin 4 can effectively avoid loosening. The elastic force of the elastic support foot 7 allows the chip package to be stably installed on the circuit board, and the gap left between the heat dissipation component on the bottom surface of the substrate 1 and the circuit board can provide better air flow, thereby improving the heat dissipation efficiency of the heat dissipation component installed on the bottom surface of the substrate 1.

[0032] See also Figure 3-4 , Figure 7-9, a first stamping groove 404 and a second stamping groove 405 are spaced apart at the bottom end of the pin 4 in the height direction. Specifically, the bending section 402 and the vertical section 403 on the pin 4 are both formed by stamping, and a connecting section 401 is left between the first stamping groove 404 and the second stamping groove 405 of the pin 4. The connecting section 401 can produce elastic deformation when subjected to torsion, and plastic deformation occurs when the twisting angle of the connecting section 401 is large. Specifically, when the pin 4 is inserted downward into the through hole of the circuit board, the connecting section 401 undergoes elastic deformation, and when the pin 4 moves upward, the bending section 402 is limited by the circuit board, and the bending section 402 and the vertical section 403 rotate. At this time, the connecting section 401 undergoes plastic deformation, and the upper part of the connecting section 401 is connected A bending section 402 is connected, and a vertical section 403 is connected below. The bending section 402 is used to limit the pin 4 from sliding up after passing through the circuit board hole. The height from the top of the bending section 402 to the bottom of the vertical section 403 is greater than the diameter of the circuit board hole. After the bending section 402 is deformed and passes through the circuit board hole, the chip package is released, and the elastic force of the elastic support foot 7 is used to make the top of the bending section 402 contact the bottom surface of the circuit board hole until the connecting section 401 is deformed, and the vertical section 403 and the bending section 402 both contact the bottom surface of the circuit board hole. At this time, the vertical section 403 and the bending section 402 limit the elastic support foot 7 from continuing to recover, so that the elastic support foot 7 remains in a compressed state, and the elastic force of the elastic support foot 7 is used to conveniently and stably connect the pin 4 to the circuit board.

[0033] See also Figure 3-9 After the connecting section 401 is deformed by torsion, the elastic supporting foot 7 is in a compressed state, and the bending section 402 and the vertical section 403 contact the circuit board at the same time. When the bending section 402 and the vertical section 403 contact the bottom surface of the circuit board at the same time, under the elastic force of the elastic supporting foot 7, the pin 4 completes a stable connection with the circuit board. When the bottom surface of the bending section 402 contacts the perforation of the circuit board, it will rotate toward the first stamping groove 404. When the top surface of the bending section 402 contacts the perforation of the circuit board, it will rotate away from the first stamping groove 404, so that the pin 4 can be easily inserted into the perforation of the circuit board.

[0034] An integrated circuit chip package includes a substrate 1, on which a chip 2 and a packaging layer 3 are sequentially mounted, and the bottom surface of the substrate 1 and the top surface of the packaging layer 3 are both attached with a heat dissipation component. Specifically, the heat dissipation component includes a first heat dissipation plate 6, a second heat dissipation plate 8, and a third heat dissipation plate 9.

[0035] See also Figure 1-2The bottom surface of the substrate 1 is connected to a first heat sink 6, the top surface of the packaging layer 3 is connected to a second heat sink 8, and the two ends of the second heat sink 8 are fixedly connected to a third heat sink 9. A broken groove 11 is opened between the second heat sink 8 and the third heat sink 9 along the width direction. The first heat sink 6 and the second heat sink 8 can effectively improve the heat dissipation efficiency of the chip package. While the third heat sink 9 improves the heat dissipation efficiency of the chip package, when the chip package needs an external heat dissipation fan or a heat dissipation liquid cooling plate or other heat dissipation components, it can be broken from the broken groove 11. After the surface of the second heat sink 8 is coated with thermal grease, the broken third heat sink 9 is covered on the second heat sink 8, so that the thermal grease fully fills the gap between the third heat sink 9 and the second heat sink 8, while providing a good contact area for the external heat dissipation component.

[0036] See also Figure 1-6 , the first heat sink 6 is connected with first fins 601 at intervals, the second heat sink 8 is connected with second fins 801 at intervals, and the third heat sink 9 is connected with third fins 901 at intervals. The second fins 801 and the third fins 901 are arranged alternately. Specifically, after the third heat sink 9 is broken, it is flipped toward the direction of the second heat sink 8, and the second fins 801 and the third fins 901 on the second heat sink 8 and the third heat sink 9 are staggered with each other, which can squeeze the thermal conductive silicone grease coated on the second heat sink 8, so that the thermal conductive silicone grease fills the gap between the second heat sink 8 and the third heat sink 9. Specifically, in order to reduce the vertical height of the chip package, the second fins 801 and the third fins 901 are the same height, the first heat sink 6 expands the contact area with the air through the first fins 601, the second heat sink 8 expands the contact area with the air through the second fins 801, and the third heat sink 9 expands the contact area with the air through the third fins 901, which effectively improves the natural heat dissipation efficiency of the chip package. Example

[0037] An integrated circuit chip packaging structure, such as Figure 1-9As shown, it includes a substrate 1, on which a chip 2 and a packaging layer 3 are sequentially mounted, and multiple pins 4 are connected to both sides of the substrate 1. The bottom surface of the substrate 1 and the top surface of the packaging layer 3 are both fitted with heat dissipation components. The bottom surface of the substrate 1 is fixedly connected with multiple elastic support feet 7, the width of the pin 4 is smaller than the diameter of the circuit board perforation, and a deformable clamping structure for clamping the circuit board perforation is provided. Specifically, the deformable clamping structure includes a connecting section 401, a bending section 402 and a vertical section 403 of the pin 4. When the pin 4 is clamped with the circuit board, the elastic support feet 7 are in a compressed state, and the heat dissipation component on the bottom surface of the substrate 1 does not contact the circuit board. The pin 4 can easily pass through the circuit board perforation and be stably connected to the circuit board body. After subsequent soldering, the pin 4 can effectively avoid loosening. The elastic force of the elastic support feet 7 allows the chip package to be stably installed on the circuit board, and the gap left between the heat dissipation component on the bottom surface of the substrate 1 and the circuit board can provide better air flow, thereby improving the heat dissipation efficiency of the heat dissipation component installed on the bottom surface of the substrate 1.

[0038] See also Figure 3-4 , Figure 7-9 , a first stamping groove 404 and a second stamping groove 405 are spaced apart at the bottom end of the pin 4 in the height direction. Specifically, the bending section 402 and the vertical section 403 on the pin 4 are both formed by stamping, and a connecting section 401 is left between the first stamping groove 404 and the second stamping groove 405 of the pin 4. The connecting section 401 can produce elastic deformation when subjected to torsion, and plastic deformation occurs when the twisting angle of the connecting section 401 is large. Specifically, when the pin 4 is inserted downward into the through hole of the circuit board, the connecting section 401 undergoes elastic deformation, and when the pin 4 moves upward, the bending section 402 is limited by the circuit board, and the bending section 402 and the vertical section 403 rotate. At this time, the connecting section 401 undergoes plastic deformation, and the upper part of the connecting section 401 is connected A bending section 402 is connected, and a vertical section 403 is connected below. The bending section 402 is used to limit the pin 4 from sliding up after passing through the circuit board hole. The height from the top of the bending section 402 to the bottom of the vertical section 403 is greater than the diameter of the circuit board hole. After the bending section 402 is deformed and passes through the circuit board hole, the chip package is released, and the elastic force of the elastic support foot 7 is used to make the top of the bending section 402 contact the bottom surface of the circuit board hole until the connecting section 401 is deformed, and the vertical section 403 and the bending section 402 both contact the bottom surface of the circuit board hole. At this time, the vertical section 403 and the bending section 402 limit the elastic support foot 7 from continuing to recover, so that the elastic support foot 7 remains in a compressed state, and the elastic force of the elastic support foot 7 is used to conveniently and stably connect the pin 4 to the circuit board.

[0039] See also Figure 3-9After the connecting section 401 is deformed by torsion, the elastic supporting foot 7 is in a compressed state, and the bending section 402 and the vertical section 403 contact the circuit board at the same time. When the bending section 402 and the vertical section 403 contact the bottom surface of the circuit board at the same time, under the elastic force of the elastic supporting foot 7, the pin 4 completes a stable connection with the circuit board. When the bottom surface of the bending section 402 contacts the perforation of the circuit board, it will rotate toward the first stamping groove 404. When the top surface of the bending section 402 contacts the perforation of the circuit board, it will rotate away from the first stamping groove 404, so that the pin 4 can be easily inserted into the perforation of the circuit board.

[0040] An integrated circuit chip package, such as Figure 1-9 As shown, based on the embodiment one, the difference from the embodiment one lies in that a heat conductive sheet 12 is pasted on the bottom surface of the third heat sink 9, a heat conductive coating tape 1201 is pasted on the edge of the packaging layer 3, the heat conductive coating tape 1201 is connected to the heat conductive sheet 12, the heat conductive coating tape 1201 efficiently transfers the heat from the side of the chip package to the heat conductive sheet 12, and the heat conductive sheet 12 can transfer heat to the third heat sink 9 while directly transferring the heat to the air, thereby further improving the heat dissipation efficiency of the chip package, and providing good conditions for the installation of external heat dissipation components when external heat dissipation components such as a heat dissipation fan or a liquid cooling plate are connected. Example

[0041] An integrated circuit chip packaging structure, such as Figure 1-9 As shown, it includes a substrate 1, on which a chip 2 and a packaging layer 3 are sequentially mounted, and multiple pins 4 are connected to both sides of the substrate 1. The bottom surface of the substrate 1 and the top surface of the packaging layer 3 are both fitted with heat dissipation components. The bottom surface of the substrate 1 is fixedly connected with multiple elastic support feet 7, the width of the pin 4 is smaller than the diameter of the circuit board perforation, and a deformable clamping structure for clamping the circuit board perforation is provided. Specifically, the deformable clamping structure includes a connecting section 401, a bending section 402 and a vertical section 403 of the pin 4. When the pin 4 is clamped with the circuit board, the elastic support feet 7 are in a compressed state, and the heat dissipation component on the bottom surface of the substrate 1 does not contact the circuit board. The pin 4 can easily pass through the circuit board perforation and be stably connected to the circuit board body. After subsequent soldering, the pin 4 can effectively avoid loosening. The elastic force of the elastic support feet 7 allows the chip package to be stably installed on the circuit board, and the gap left between the heat dissipation component on the bottom surface of the substrate 1 and the circuit board can provide better air flow, thereby improving the heat dissipation efficiency of the heat dissipation component installed on the bottom surface of the substrate 1.

[0042] See also Figure 3-4 , Figure 7-9, a first stamping groove 404 and a second stamping groove 405 are spaced apart at the bottom end of the pin 4 in the height direction. Specifically, the bending section 402 and the vertical section 403 on the pin 4 are both formed by stamping, and a connecting section 401 is left between the first stamping groove 404 and the second stamping groove 405 of the pin 4. The connecting section 401 can produce elastic deformation when subjected to torsion, and plastic deformation occurs when the twisting angle of the connecting section 401 is large. Specifically, when the pin 4 is inserted downward into the through hole of the circuit board, the connecting section 401 undergoes elastic deformation, and when the pin 4 moves upward, the bending section 402 is limited by the circuit board, and the bending section 402 and the vertical section 403 rotate. At this time, the connecting section 401 undergoes plastic deformation, and the upper part of the connecting section 401 is connected A bending section 402 is connected, and a vertical section 403 is connected below. The bending section 402 is used to limit the pin 4 from sliding up after passing through the circuit board hole. The height from the top of the bending section 402 to the bottom of the vertical section 403 is greater than the diameter of the circuit board hole. After the bending section 402 is deformed and passes through the circuit board hole, the chip package is released, and the elastic force of the elastic support foot 7 is used to make the top of the bending section 402 contact the bottom surface of the circuit board hole until the connecting section 401 is deformed, and the vertical section 403 and the bending section 402 both contact the bottom surface of the circuit board hole. At this time, the vertical section 403 and the bending section 402 limit the elastic support foot 7 from continuing to recover, so that the elastic support foot 7 remains in a compressed state, and the elastic force of the elastic support foot 7 is used to conveniently and stably connect the pin 4 to the circuit board.

[0043] See also Figure 3-9 After the connecting section 401 is deformed by torsion, the elastic supporting foot 7 is in a compressed state, and the bending section 402 and the vertical section 403 contact the circuit board at the same time. When the bending section 402 and the vertical section 403 contact the bottom surface of the circuit board at the same time, under the elastic force of the elastic supporting foot 7, the pin 4 completes a stable connection with the circuit board. When the bottom surface of the bending section 402 contacts the perforation of the circuit board, it will rotate toward the first stamping groove 404. When the top surface of the bending section 402 contacts the perforation of the circuit board, it will rotate away from the first stamping groove 404, so that the pin 4 can be easily inserted into the perforation of the circuit board.

[0044] An integrated circuit chip package, such as Figure 1-9As shown, on the basis of Example 2, the difference from Example 2 lies that an adhesive sheet 10 is pasted on a side between the second heat sink 8 and the third heat sink 9 away from the broken groove 11, and the adhesive sheet 10 can prevent the third heat sink 9 from being lost after the second heat sink 8 and the third heat sink 9 are separated from each other. Specifically, after the second heat sink 8 and the third heat sink 9 are disconnected from each other, the third heat sink 9 is flipped toward the second heat sink 8. At this time, the connection between the thermally conductive sheet 12 and the thermally conductive coating tape 1201 will be stretched and remain connected. The length of the third heat sink 9 is half of the length of the second heat sink 8, so that the third heat sink 9 can better cover the second heat sink 8 after being flipped and covered on the second heat sink 8. The two third heat sinks 9 can completely cover the second heat sink 8 after being flipped.

[0045] The working principle of the present invention is as follows: when performing secondary packaging of a chip, the pin 4 of the chip package is aligned with the circuit board through-hole and inserted, the elastic support foot 7 is compressed and accumulates elastic potential energy, and the bent section 402 of the pin 4 rotates toward the first punching groove 404 when it contacts the circuit board through-hole, so that the pin 4 can easily penetrate the circuit board through-hole, and after the bent section 402 passes through the circuit board through-hole, the chip package is released, and the elastic force of the elastic support foot 7 is used to move the chip package away from the circuit board. At this time, the bent section 402 of the pin 4 contacts the bottom surface of the circuit board through-hole and rotates away from the first punching groove 404, so that the connecting section 401 of the pin 4 is twisted and deformed. When both the vertical section 402 and the vertical section 403 are in contact with the bottom surface of the circuit board, the elastic support foot 7 is still in a compressed state, and the elastic force of the elastic support foot 7 and the clamping structure on the pin 4 are used to realize a stable connection between the pin 4 and the circuit board perforation. A part of the heat generated by the chip in the chip package during operation can be directly conducted downward through the substrate 1 to the first heat sink 6 and dissipated into the air, and the other part is conducted upward through the packaging layer 3 to the second heat sink 8 and then conducted to the air. There is also a part of the heat that is conducted to the edge of the chip package, conducted to the heat conductive sheet 12 through the thermal conductive coating tape 1201, and dissipated into the air through the third heat sink 9, so that the chip can be stably installed and used.

[0046] Although an embodiment of the present invention has been shown and described, this specific embodiment is only an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. An integrated circuit chip packaging structure, comprising a substrate (1), on which a chip (2) and a packaging layer (3) are sequentially mounted, and two sides of the substrate (1) are connected to a plurality of pins (4), characterized in that: The bottom surface of the substrate (1) and the top surface of the packaging layer (3) are both attached with a heat dissipation component. The bottom surface of the substrate (1) is fixedly connected with a plurality of elastic support legs (7). The width of the pins (4) is smaller than the diameter of the circuit board through-holes, and a deformable clamping structure for clamping the circuit board through-holes is provided. When the pins (4) are clamped with the circuit board, the elastic support legs (7) are in a compressed state, and the heat dissipation component on the bottom surface of the substrate (1) does not contact the circuit board.

2. The integrated circuit chip packaging structure according to claim 1, characterized in that: A first punching groove (404) and a second punching groove (405) are provided at the bottom end of the pin (4) at intervals in the height direction; a connecting section (401) is left between the first punching groove (404) and the second punching groove (405) of the pin (4); a bending section (402) is connected above the connecting section (401) and a vertical section (403) is connected below the connecting section (401); the bending section (402) is used to limit the pin (4) from sliding upward after passing through a hole in the circuit board; and a height from the top end of the bending section (402) to the bottom end of the vertical section (403) is greater than a diameter of the hole in the circuit board.

3. The integrated circuit chip packaging structure according to claim 2, characterized in that: After the connecting section (401) is deformed by torsion, the elastic supporting foot (7) is in a compressed state, and the bent section (402) and the vertical section (403) contact the circuit board at the same time.

4. The integrated circuit chip packaging structure according to claim 2, characterized in that: When the bottom surface of the bending section (402) contacts the circuit board hole, it rotates towards the first punching slot (404); when the top surface of the bending section (402) contacts the circuit board hole, it rotates away from the first punching slot (404).

5. An integrated circuit chip package, comprising a substrate (1), on which a chip (2) and a packaging layer (3) are sequentially mounted, characterized in that: The bottom surface of the substrate (1) and the top surface of the packaging layer (3) are both bonded with heat dissipation components.

6. The integrated circuit chip package according to claim 5, wherein: The bottom surface of the substrate (1) is connected to a first heat sink (6), the top surface of the packaging layer (3) is connected to a second heat sink (8), both ends of the second heat sink (8) are fixedly connected to a third heat sink (9), and a broken groove (11) is provided between the second heat sink (8) and the third heat sink (9) along the width direction.

7. The integrated circuit chip package according to claim 6, wherein: The first heat dissipation plate (6) is connected to first fins (601) at intervals, the second heat dissipation plate (8) is connected to second fins (801) at intervals, and the third heat dissipation plate (9) is connected to third fins (901) at intervals, and the second fins (801) and the third fins (901) are arranged in an alternating manner.

8. The integrated circuit chip package according to claim 6, wherein: A heat-conducting sheet (12) is adhered to the bottom surface of the third heat sink (9), a heat-conducting coating tape (1201) is adhered to the edge of the packaging layer (3), and the heat-conducting coating tape (1201) is connected to the heat-conducting sheet (12).

9. The integrated circuit chip package according to claim 6, wherein: An adhesive sheet (10) is adhered to a surface between the second heat dissipation plate (8) and the third heat dissipation plate (9) that is away from the broken groove (11).

10. The integrated circuit chip package according to claim 7, wherein: The length of the third heat dissipation plate (9) is half the length of the second heat dissipation plate (8).

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