Electronic device and manufacturing method thereof

Abstract

The invention discloses an electronic device and a manufacturing method thereof. The electronic device includes a redistribution structure configured with a redistribution line; the substrate is provided with a substrate circuit, and the substrate circuit faces the redistribution structure; the adhesive layer bonds the redistribution structure to the substrate. And a plurality of conductive members at least penetrating through the adhesive layer and electrically connecting the redistribution lines of the redistribution structure to the substrate lines of the substrate.

Description

Technical Field

[0001] The invention relates to an electronic device and a manufacturing method thereof. Background Art

[0002] Traditionally, wafer manufacturers have attempted to maximize chip size and integrate multiple functions into the package by means of redistribution layer (RDL) settings. This process is performed in semiconductor fabrication plants. However, for substrate manufacturers, maintaining the two advantages of improving substrate accuracy and reducing feature size is not only another way to combine wafer packaging and substrates, but also a must for the semiconductor industry. Summary of the invention

[0003] An object of the present invention is to provide an electronic device and a manufacturing method thereof, which can improve the flexibility of combining a substrate with a component.

[0004] The electronic device of the present invention includes a redistribution structure, a substrate, an adhesive layer that combines the redistribution structure to the substrate, and a plurality of conductive members that penetrate at least the adhesive layer; the redistribution structure is configured with a redistribution line (RDL line), the substrate is configured with a substrate line facing the redistribution structure, and the conductive members electrically connect the redistribution line of the redistribution structure to the substrate line of the substrate.

[0005] The present invention also discloses a method for manufacturing an electronic device, which includes the following steps: arranging a redistribution wiring structure on an initial substrate, the redistribution wiring structure being configured with an initial circuit; bonding the redistribution wiring structure to a substrate, the substrate being configured with a substrate circuit, and the substrate circuit facing the redistribution wiring structure; removing at least a portion of the initial substrate; and before bonding the redistribution wiring structure to the substrate, setting an adhesive layer and a plurality of conductive members between the redistribution wiring structure and the substrate to complete the electronic device of the present invention. After removing at least a portion of the initial substrate, a redistribution structure is obtained, the redistribution structure being configured with a redistribution circuit (RDL circuit), and a plurality of conductive members electrically connecting the redistribution circuit to the substrate circuit of the substrate.

[0006] The present invention also relates to another method for manufacturing an electronic device, comprising the following steps: arranging a redistribution wiring structure on an initial substrate, wherein the redistribution wiring structure is configured with an initial circuit; removing at least a portion of the initial substrate; before bonding the redistribution wiring structure to a substrate, setting an adhesive layer and a plurality of conductive members between the redistribution wiring structure and the substrate; bonding the redistribution wiring structure to a substrate, wherein the substrate is configured with a substrate circuit, and the substrate circuit faces the redistribution wiring structure; and completing the electronic device of the present invention. After removing at least a portion of the initial substrate, a redistribution structure is obtained, and the redistribution structure is configured with a redistribution circuit (RDL circuit), and a plurality of conductive members electrically connect the redistribution circuit to the substrate circuit of the substrate.

[0007] In one embodiment, a redistribution line (RDL line) of the redistribution structure defines a line width, and a substrate line of the substrate defines a line width; near at least one or more conductive elements, the line width of the RDL line is smaller than the line width of the substrate line.

[0008] In one embodiment, the redistribution structure defines a redistribution structure thickness, and the substrate defines a substrate thickness, and a ratio of the redistribution structure thickness to the substrate thickness is not less than 5, or further for example, a ratio of not less than 1, 2, 3, 4 or 5.

[0009] In one embodiment, the redistribution line of the redistribution structure defines an average thickness, and the substrate line of the substrate defines an average thickness, and the average thickness of the redistribution line is less than the average thickness of the substrate line.

[0010] In one embodiment, the redistribution structure defines an average thickness, and the substrate defines an average thickness, and the average thickness of the redistribution structure is less than the average thickness of the substrate.

[0011] In one embodiment, an electronic device includes a plurality of thin film elements formed on a redistribution structure, and the thin film elements are electrically connected to a redistribution line (RDL line).

[0012] In one embodiment, the redistribution structure defines two opposing surfaces, and one or more thin film elements are formed on either or both surfaces of the redistribution structure.

[0013] In one embodiment, a portion of the redistribution line (RDL line) is no thicker than 10 μm.

[0014] In one embodiment, the redistribution lines (RDL lines) of the redistribution structure define line widths, and a portion of the line widths is no greater than 50 μm.

[0015] In one embodiment, the redistribution structure includes one or more sub-wiring layers stacked thereon.

[0016] In one embodiment, the redistribution structure includes an insulating structure, and the insulating structure is combined with two adjacent sub-circuit layers.

[0017] In one embodiment, the substrate and the redistribution structure respectively define a coefficient of thermal expansion (CTE), and a difference between the CTE of the substrate and the CTE of the redistribution structure is no greater than 30 ppm / °C.

[0018] In one embodiment, the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine laminated (BT) substrate, a fiberglass-reinforced epoxy-laminated (FR4) substrate, an ajinomoto build-up film (ABF) substrate, a Rogers substrate, or a PI substrate.

[0019] In one embodiment, the initial substrate includes a rigid board and a flexible board stacked on the rigid board; wherein the redistribution wiring structure is arranged on the flexible board and away from the side of the rigid board, and the redistribution wiring structure configures the initial circuit; in addition, in the step of removing at least a portion of the initial substrate, the rigid board is removed from the flexible board, and the redistribution structure includes the flexible board and the redistribution wiring structure.

[0020] In one embodiment, the initial substrate includes a rigid board, and the redistribution wiring structure is arranged on the rigid board and configured with an initial circuit; when the redistribution structure is bonded to the substrate, the initial circuit faces the substrate. In addition, in the step of removing at least a portion of the initial substrate, the rigid board is removed from one surface of the redistribution wiring structure, and at least one additional circuit and / or connection pad is formed on the surface, wherein the redistribution wiring structure is regarded as at least a portion of the redistribution structure, and the additional circuit is regarded as a redistribution circuit (RDL circuit) after the rigid board is removed.

[0021] In one embodiment, before removing at least a portion of the initial substrate, a temporary molding layer is formed to cover at least a portion of the initial wiring of the redistribution wiring structure; and after the redistribution wiring structure is bonded to the substrate, the temporary molding layer is removed.

[0022] In one embodiment, before forming a temporary molding layer, a plurality of connection pads are formed on the redistribution wiring structure, and the connection pads are electrically connected to the initial circuits; and before the step of combining the redistribution wiring structure with the substrate, a plurality of substrate connection pads are formed on the substrate, and the substrate connection pads are electrically connected to the substrate circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figures 1 to 3It is a schematic flow chart of the manufacturing method of the present invention;

[0024] Figures 4 to 7 is a schematic diagram of a method for manufacturing an electronic device of the present invention; and

[0025] Figure 8 The present invention is Figures 4 to 7 Schematic diagram of an electronic device made by the method. DETAILED DESCRIPTION

[0026] The following will describe electronic devices according to various embodiments of the present invention with reference to the relevant drawings, wherein the same elements will be described with the same reference numerals; the ratios between elements in the drawings are for understanding the structure, but not for limitation.

[0027] Figure 1 1 is a flow chart of a method for manufacturing an electronic device of the present invention, the manufacturing method comprising at least two steps: in step S10, a redistribution wiring structure is formed on an initial substrate; in step S20, the redistribution wiring structure is bonded to a substrate and at least a portion of the initial substrate is removed. In step S10 and step 20, or between the two steps, an adhesive layer and a plurality of conductive members are provided between the redistribution wiring structure and the substrate. In some cases, the redistribution wiring structure may be formed on the initial substrate by means of a thin film process, but is not limited thereto.

[0028] The manufacturing method of the present invention includes various types. Figure 2 and Figure 3 The two most preferred types.

[0029] exist Figure 2 In the method, step S20a includes steps S30a, S40 and S50a. Step S30a is to remove at least part of the initial substrate. Step S50a is to combine the redistribution wiring structure on the substrate, the substrate is configured with substrate circuits, and the substrate circuits face the redistribution wiring structure. Step S40 is to set an adhesive layer and a plurality of conductive members between the redistribution wiring structure and the substrate before combining the redistribution wiring structure to the substrate.

[0030] exist Figure 3 In the embodiment, step S20b includes steps S30b, S40 and S50b. Step S30b is to combine the redistribution wiring structure on a substrate, the substrate is provided with substrate circuits, and the substrate circuits face the redistribution wiring structure; step S50b is to remove at least part of the initial substrate, and step S40 is to set an adhesive layer and a plurality of conductive members between the redistribution wiring structure and the substrate before combining the redistribution wiring structure to the substrate.

[0031] To further explain the present invention, more examples are given below.

[0032] Example 1

[0033] Figure 4 is used Figure 2 An embodiment of the electronic device of the present invention is manufactured by a manufacturing method. In step S10, a redistribution wiring structure 20 is formed on an initial substrate 10, and the initial substrate 10 includes a rigid board 12 and a flexible board 14 stacked on the rigid board 12. The redistribution wiring structure 20 is arranged behind the flexible board 14 of the initial substrate 10 to form a temporary redistribution structure 40, and forms at least one initial line with the redistribution wiring structure 20.

[0034] In one embodiment, at least one initial circuit is a thin film circuit made using a thin film process, and the thickness of a portion of the initial circuit is not greater than 10 μm. If the number of initial circuits is greater than 1, at least one of the initial circuits is a thin film circuit. In one embodiment, the thickness of a portion of at least one initial circuit may be no greater than 5 μm. In one embodiment, a first initial circuit 21S and a second initial circuit 22S are formed on opposite surfaces of the redistribution wiring structure 20, respectively, the first initial circuit 21S is arranged away from the flexible board 14, and the second initial circuit 22S is arranged facing the flexible board 14. In addition, at least one connection pad can be arranged on a surface of the redistribution wiring structure 20 opposite to the initial substrate 10 to be electrically connected to the sub-circuit layer in the redistribution wiring structure 20 (described in the following section); the side of the initial substrate 10 on which the connection pad is arranged can be selectively provided with an insulating layer 23, and the connection pad is electrically connected to the sub-circuit layer in the redistribution wiring structure 20 through a via on the insulating layer 23 or a similar method.

[0035] In one embodiment, the redistribution wiring structure 20 includes one or more sub-circuit layers stacked thereon. In addition, the redistribution wiring structure 20 also includes an insulating structure, and the insulating structure combines two adjacent sub-circuit layers. In one embodiment, the insulating structure can also be applied to a single-layer circuit layer to fill the gaps between circuits on at least one sub-circuit layer. The insulating structure can be further extended to a sub-circuit layer higher than the top to replace the insulating layer 23, and the connection pads directly provided on the insulating structure can also be electrically connected to the sub-circuit layer through vias or similar methods.

[0036] In one embodiment, one or both of the rigid board 12 and the flexible board 14 may be a single-layer substrate. The rigid board 12 may be made of a glass material or a ceramic material, but is not limited thereto. The flexible board 14 may be made of polyimide (PI), polyether ether ketone (PEEK), polyethylene naphthalate, or a plurality of other materials. Ethylene glycol ester naphthalatep, PET), polytetrafluoroethylene (polytetrafluoroethylene,PTFE), liquid crystal polymer (LCP), aramid fiber or similar materials.

[0037] In one embodiment, the rigid board 12 may be a single-layer substrate, and the rigid board 12 may be made of glass material or ceramic material. In one embodiment, the insulating structure may be made of polyimide (PI) material or other materials similar to those used to make the flexible board 14 .

[0038] exist Figure 2 In the present invention, before the step S30a of removing at least part of the initial substrate 10, some other steps may be performed; one of which is to set a plurality of first connection pads 30 on the surface of the redistribution wiring structure 20 opposite to the initial substrate 10 to electrically connect at least one initial line; in this embodiment, the initial line is the first initial line 21S. In this stage, the temporary redistribution structure 40 further includes the first connection pads 30.

[0039] Another step before performing step S30a may be to form a temporary molding structure 50 on the redistribution wiring structure 20 and the first connection pad 30. The temporary molding structure 50 covers the redistribution wiring structure 20 and the first connection pad 30. The temporary molding structure 50 includes an insulating molding layer 52 and a support plate 54, wherein the insulating molding layer 52 covers the surface of the redistribution wiring structure 20 on which the first connection pad 30 is disposed, and the support plate 54 is connected to the insulating molding layer 52 and is disposed on a side away from the redistribution wiring structure 20; in this stage, the temporary redistribution structure 40 further includes the temporary molding structure 50.

[0040] In step S30a (removing at least part of the initial substrate 10), the rigid board 12 can be removed from the flexible board 14 of the temporary redistribution structure 40 because the insulating mold layer 52 is provided to maintain stability.

[0041] Before or after step S50a (bonding the temporary redistribution structure 40 to the substrate 80), the temporary molding structure 50 (insulating molding layer 52 and supporting plate 54) is removed; at this stage, the temporary redistribution structure 40 is only composed of the redistribution wiring structure 20 and the flexible board 14, and is regarded as a redistribution structure 40'.

[0042] The substrate 80 is configured with substrate circuits, and the substrate circuits face the redistribution structure 40 ′.

[0043] Before or during step S50a (bonding the temporary redistribution structure 40 to the substrate 80 ), an adhesive layer 60 and a plurality of conductive elements 70 are disposed between the redistribution wiring structure 20 and the substrate 80 to electrically connect the initial circuits of the redistribution wiring structure 20 with the substrate circuits of the substrate 80 .

[0044] There are several methods for setting the adhesive layer 60 and the plurality of conductive elements 70; for example, the adhesive layer 60 is first applied to the temporary redistribution structure 40 or the substrate 80, and then the conductive elements 70 are set; in one method, the adhesive layer 60 is applied to the temporary redistribution structure 40 and the substrate 80, respectively, and then the conductive elements 70 are set; in another method, the conductive elements 70 are first set and then the adhesive layer 60 is applied; in other methods, the conductive element 70 can be composed of two independent components, and the two components can be respectively set on the redistribution structure 40 and the substrate 80, and then the two components of the conductive element 70 are connected together; or, the two components can be set on the redistribution structure 40 and the substrate 80 at the same time, including but not limited to the configuration of the inner and outer diameters. However, the method of setting the adhesive layer 60 and the plurality of conductive elements 70 is not limited to the above methods.

[0045] In other words, the priority of performing the steps of removing the temporary molding structure 50 and setting the adhesive layer 60 and the conductive member 70 is not limited; in addition, the order of applying the adhesive layer 60 or setting the conductive member 70 is not limited.

[0046] In step S50a (bonding the temporary redistribution structure 40 to the substrate 80), the substrate is a glass substrate, a ceramic substrate, a bismaleimide triazine resin (or BT resin laminate, bismaleimide triazin laminated, BT) substrate, a fiberglass-reinforced epoxy-laminated (FR4) substrate, an ajinomoto build-up film (ABF) substrate, or a Rogers substrate, but is not limited thereto. The substrate 80 can also be formed of a flexible material, and the selection of its manufacturing material is similar to the material for manufacturing the flexible board 14; in another embodiment, the substrate 80 is a single-layer substrate or a multi-layer substrate.

[0047] The redistribution structure 40 ′ defines two opposite surfaces 21Sf and 22Sf, the first initial line 21S may be a redistribution line (RDL line), and the first connection pad 30 electrically connected to the redistribution line (RDL line) may be an RDL connection pad.

[0048] At this point, the electronic device 100 , which at least includes the redistribution structure 40 ′ and the substrate 80 , has been manufactured.

[0049] In addition, before or after step S50a (bonding the temporary redistribution structure 40 to the substrate 80), one or more thin film elements are formed on one of the two opposite surfaces of the temporary redistribution structure 40 (or the redistribution structure 40'); the thin film elements are electrically connected to the first initial circuit 21S or the second initial circuit 22S (two RDL circuits); in some embodiments, the thin film elements include one or both of active elements and passive elements.

[0050] In one embodiment, one or more of the substrate 80 , the redistribution wiring structure 20 and the adhesive layer 60 are made of different materials, but not limited thereto; in other words, they may also be made of similar materials.

[0051] In one embodiment, one or more of the substrate 80 , the redistribution wiring structure 20 and the adhesive layer 60 are rigid structures, but not limited thereto; in other words, one or more of the substrate 80 , the redistribution wiring structure 20 and the adhesive layer 60 are flexible structures.

[0052] The substrate 80, the redistribution wiring structure 20, the rigid board 12 and the flexible board 14 of the initial substrate 10, respectively define their coefficients of thermal expansion (CTE). In one embodiment, the difference between the CTE of the substrate 80 and the CTE of the redistribution wiring structure 20 is not greater than 30 ppm / °C, but is not limited thereto. For example, in other embodiments, the difference between the CTE of the substrate 80 and the CTE of the redistribution wiring structure 20 may be not greater than 20 ppm / °C, 10 ppm / °C or 5 ppm / °C.

[0053] In one embodiment, the difference in CTE between the rigid board 12 and the flexible board 14 of the initial substrate 10 is not large. At 30ppm / ℃ ;exist one In one embodiment, the CTE of the initial substrate 10 and the CTE of the redistribution wiring structure 20 The difference between CTE is no more than 30ppm / ℃.

[0054] Example 2

[0055] Figure 5 is used Figure 2 Another embodiment of the steps in manufacturing an electronic device. Figure 4 and Figure 5 The difference between the embodiments is that Figure 5The initial substrate 10a in the embodiment only includes the rigid board 12, so the temporary redistribution structure 40a in this embodiment only includes the redistribution wiring structure 20 and the rigid board 12. The redistribution structure 40a' in this embodiment only includes the redistribution wiring structure 20, and does not include the rigid board 12. In addition, at least one first connection pad 30 can be provided on the redistribution wiring structure 20, on a surface opposite to the initial substrate 10a, and an insulating layer 23 can be selectively provided. It should be noted that the insulating layers 23 and 23a disclosed in the present invention can replace the insulating structure, and similar elements and their numbers will not be further elaborated.

[0056] Similar to Figure 4 In the embodiment of Figure 2 Before step S30a in the above, a step of providing a plurality of first connection pads 30 on the redistribution wiring structure 20 and / or a step of providing a temporary molding structure 50 on the redistribution wiring structure 20 and the first connection pads 30 may be performed; in this embodiment, the temporary molding structure 50 includes an insulating molding layer 52 and a support plate 54; in this stage, the redistribution structure 40a' further includes a temporary molding structure 50. The redistribution structure 40a' defines two opposite surfaces 21Sf and 22Sf, and the redistribution structure 40a' is combined with the substrate 80 via the surface 22Sf.

[0057] In this embodiment, the step of removing the temporary molding structure 50, the step of setting the adhesive layer 60 and the conductive member 70, and the step 50a are also performed together. Figure 4 The embodiments are similar.

[0058] After completing step S50a, an electronic device is obtained; the configuration and / or materials used in the electronic device may be the same as Figure 4 The electronics in the Figure 5 The electronic device in the embodiment does not have the flexible board 14 between the redistribution wiring structure 20 and the substrate 80 .

[0059] Figure 6 and Figure 7 The third and fourth embodiments are respectively, which are used Figure 3 Made by the method in .

[0060] exist Figure 3 In the embodiment, step S20b includes steps S30b, S40 and S50b. Step S30b is to combine the redistribution wiring structure on a substrate, the substrate is provided with substrate circuits, and the substrate circuits face the redistribution wiring structure; step S50b is to remove at least part of the initial substrate, and step S40 is to set an adhesive layer and a plurality of conductive members between the redistribution wiring structure and the substrate before combining the redistribution wiring structure to the substrate.

[0061] Example 3

[0062] In this embodiment, the electronic device is used as Figure 3 . In step S10, a redistribution wiring structure 20 is arranged on an initial substrate 10, and the initial substrate 10 includes a rigid board 12 and a flexible board 14 stacked on the rigid board 12. After the redistribution wiring structure 20 is arranged on the initial substrate 10, a temporary redistribution structure 40b is obtained. The redistribution wiring structure 20 is configured with at least one initial circuit, and this initial circuit can be a thin film circuit. The partial thickness of at least one initial circuit is not greater than 10μm. If the number of initial circuits is greater than 1, at least one of the initial circuits is a thin film circuit. In one embodiment, the partial thickness of at least one initial circuit may be no greater than 5μm. In one embodiment, a first initial circuit 21S and a second initial circuit 22S are formed on opposite surfaces of the redistribution wiring structure 20, respectively, and the first initial circuit 21S is arranged on a side away from the flexible board 14, and the second initial circuit 22S is arranged on a side facing the flexible board 14.

[0063] In one embodiment, the redistribution wiring structure 20 includes one or more levels of wiring layers stacked thereon; in one embodiment, the redistribution wiring structure 20 further includes an insulating structure, which combines two adjacent sub-wiring layers; in one embodiment, the insulating structure can also be applied to a single-level wiring layer to fill the gaps between the wirings on at least one sub-wiring layer.

[0064] The materials or properties of the rigid board 12 and the flexible board 14 in this embodiment may be similar to those of the rigid board 12 and the flexible board 14 in the above-mentioned embodiments.

[0065] Before or during step S30b (bonding the temporary redistribution structure 40 to the substrate 80), an adhesive layer 60 and a plurality of conductive elements 70 are disposed between the temporary redistribution structure 40 and the substrate 80. The method of disposing the adhesive layer 60 and the conductive elements 70 is similar to the method in Embodiments 1 and 2, but is not limited thereto.

[0066] In step S30 b (bonding the temporary redistribution structure 40 to the substrate 80 ), the first initial lines 21S of the redistribution wiring structure 20 are turned over and stacked on the substrate 80 .

[0067] In step S50b (removing at least part of the initial substrate 10), the rigid board 12 is removed from the flexible board 14; at this point, the substrate 80 has been bonded to the redistribution wiring structure 20. At this stage, the temporary redistribution structure 40b consists only of the redistribution wiring structure 20 and the flexible board 14, and can be regarded as a redistribution structure 40b'.

[0068] After step S50b (removing the rigid board 12 from the flexible board 14), additional circuits and / or a plurality of connection pads 30b may be formed on the surface of the flexible board 14 relative to the redistribution wiring structure 20, and the connection pads 30b pass through the flexible board 14 and electrically connect the additional circuits to the second initial circuit 22S, thereby obtaining a redistribution structure 40b' having additional circuits and / or additional connection pads. In this embodiment, the flexible board 14 may be regarded as an insulating layer.

[0069] The redistribution structure 40b' defines two opposite surfaces 21Sf and 22Sf, the additional traces on the flexible board 14 form at least a portion of the redistribution line (RDL line), and the connection pad 30b on the flexible board 14 (which is electrically connected to the RDL line) can be at least a portion of the RDL connection pad. In summary, an electronic device 100b including at least the redistribution structure 40b and the substrate 80 is manufactured.

[0070] Before step S30b (bonding the temporary redistribution structure 40 to the substrate 80) or after step S50b (removing at least a portion of the initial substrate 10), one or more thin film components may be formed on one or both of the two opposite surfaces of the temporary redistribution structure 40b or the redistribution structure 40b' and electrically connected to the first initial circuit 21S or the second initial circuit 22S (two RDL circuits). In one embodiment, the thin film components include one or both of passive components or active components.

[0071] In the present embodiment, the first preliminary line 21S is disposed between the substrate 80 and the redistribution wiring structure 20 , and the second preliminary line 22S is disposed between the redistribution wiring structure 20 and the flexible board 14 .

[0072] Example 4

[0073] Figure 7 For use Figure 3 Another embodiment of a method of manufacturing an electronic device.

[0074] The manufacturing method of this embodiment is similar to that of embodiment 3, but the main differences between this embodiment and embodiment 3 are as follows:

[0075] The initial substrate 10 in this embodiment only includes the rigid board 12, so the temporary redistribution structure 40c includes the redistribution wiring structure 20 and the rigid board 12; however, after step 50b, the rigid board 12 is removed, and the redistribution structure 40c' only includes the redistribution wiring structure 20. In addition, the redistribution structure 40c' also defines two opposite surfaces 21Sf and 22Sf, wherein the redistribution structure 40c' is bonded to the substrate 80 with the aid of the surface 21Sf. In addition, an additional connection pad 30c can be formed on the surface 22Sf opposite to the surface 21Sf and electrically connected to the initial circuit. An insulating layer 23c can be more selectively formed on the surface 22Sf opposite to the surface 21Sf, and the additional connection pad 30c is electrically connected to the initial circuit through the insulating layer 23c.

[0076] See also Figure 8 , respectively showing the structures of four electronic devices 100, 100a, 100b, and 100c; these four electronic devices respectively use Figures 4 to 7 each of the four electronic devices 100, 100a, 100b, 100c includes a substrate 80, a redistribution structure 40', 40a', 40b', 40c', an adhesive layer 60 and a plurality of conductive members 70.

[0077] The substrate 80 defines two opposite surfaces, and a substrate circuit is formed on one of the two surfaces; wherein the substrate circuit defines a line width.

[0078] The redistribution structures 40 ′, 40 a ′, 40 b ′, and 40 c ′ are disposed on the substrate 80 and are configured with redistribution lines (RDL lines).

[0079] The adhesive layer 60 is disposed between the RDL structures 40', 40a', 40b', 40c' and the substrate 80. The conductive member 70 at least passes through the adhesive layer 60 and electrically connects the RDL circuits of the RDL structures 40', 40a', 40b', 40c' to the substrate circuits of the substrate 80.

[0080] In one embodiment, a portion of the first line width of the first initial line is no greater than 50 μm; in one embodiment, a portion of the first line width of the first initial line is no greater than 20 μm; in one embodiment, a portion of the first line width of the first initial line is no greater than 10 μm; in one embodiment, a portion of the first line width of the first initial line is no greater than 5 μm.

[0081] The RDL lines of the redistribution structures 40', 40a', 40b', 40c' define the RDL line width, and the substrate lines of the substrate 80 define the substrate line width; near one or more conductive members 70, the line width of the RDL lines is smaller than the line width of the substrate lines. In addition, the redistribution structures 40', 40a', 40b', 40c' also define the line spacing of the RDL lines, the substrate 80 also defines the line spacing of the substrate lines, and the line spacing of at least some of the RDL lines is not greater than the line spacing of the substrate lines. In some cases, the line width of the RDL lines is greater than the line width of the substrate lines, and the line spacing of the RDL lines is not greater than the line spacing of the substrate lines. In some cases, the line width of the RDL lines is not greater than the line width of the substrate lines, and the line spacing of the RDL lines is greater than the line spacing of the substrate lines.

[0082] The redistribution structures 40 ′, 40 a ′, 40 b ′, 40 c ′ define a thickness of the redistribution structures, and the substrate 80 defines a substrate thickness; the ratio of the substrate thickness to the redistribution structure thickness is not greater than 10.

[0083] The redistribution structure 40', 40a', 40b', 40c' includes one or more sub-circuit layers stacked thereon, and the redistribution structure 40', 40a', 40b', 40c' also includes an insulating structure, which connects two adjacent sub-circuit layers. In one case, the insulating structure can also be applied to a single-layer sub-circuit layer to fill the gaps between the wiring on the single-layer circuit layer.

[0084] The substrate 80 further includes a plurality of substrate connection pads (not shown) electrically connected to the substrate circuits, and the redistribution structures 40', 40a', 40b', 40c' also include a plurality of redistribution structure connection pads (not shown) facing the substrate 80 and electrically connected to the substrate connection pads, respectively. The substrate connection pads and the redistribution structure connection pads define their respective areas, and in some cases, the area of ​​the redistribution structure connection pads may not be less than the area of ​​the substrate connection pads.

[0085] like Figure 8 As shown in the electronic device 100 in FIG. 1 , the redistribution structure defines two opposite surfaces, a first initial circuit 21S is formed on a surface 21Sf away from the substrate 80, and a second initial circuit 22S is formed on the other surface 22Sf facing the substrate 80; the first initial circuit 21S has a first line width (also regarded as an RDL line here), and the second initial circuit 22S is formed by a thin film and provides a second line width (regarded as another RDL line).

[0086] The adhesive layer 60 bonds the redistribution structure 40 to the substrate 80 . The conductive member 70 is disposed in the adhesive layer 60 and electrically connects the second initial circuit 22S of the redistribution structure 40 ′ to the substrate circuit of the substrate 80 .

[0087] In one embodiment, the substrate lines of the substrate may face toward or away from the redistribution structure. Figure 8 In the electronic device 100a, the substrate 80 has two substrate circuits 81S and 82S. In one case, any one of the substrate circuits of the substrate 80 is formed of a thin film, wherein a thickness of a portion of the substrate circuit of the substrate 80 is not greater than 10 μm.

[0088] The substrate 80 includes a plurality of substrate connection pads electrically connected to the substrate circuit, and the redistribution structures 40', 40a', 40b', 40c' include a plurality of first connection pads and second connection pads, and are electrically connected to the first initial circuit 21S and the second initial circuit 22S respectively; each of the first connection pads, the second connection pads and the substrate connection pads defines its area. In one case, the area of ​​the second connection pad may not be less than the area of ​​the substrate connection pad, and the area of ​​one or more first connection pads is less than the area of ​​one or more substrate connection pads.

[0089] It should be noted that the connection pads with labels in the present invention are used to electrically connect to external electronic components or substrates; some connection pads that are not drawn or labeled may also exist in the present invention, which are arranged on the redistribution wiring structure and electrically connected to the conductive member 70.

[0090] It should be noted that the surface where the first initial circuit 21S is disposed may be the surface 21Sf or another surface 22Sf of the redistribution wiring structure 20 , which depends on the method used to manufacture the electronic device and can be reasonably understood in the present invention.

[0091] In summary, the present invention provides an electronic device and a method for manufacturing the same, which involves forming a redistribution wiring structure on an initial substrate, and connecting the redistribution structure to the substrate through an adhesive layer and a conductive member. After removing part of the initial substrate, an electronic device having a redistribution structure and containing the same is obtained. The electronic device of the present invention benefits from both the delicate or fragile nature of the redistribution structure and the thickness or toughness of the substrate. In addition, the method of the present invention is beneficial to manufacturers who make substrates because it improves the precision of the substrate and reduces the feature size. This method is not only a combination of wafer packaging and substrates, but will also become increasingly important in the semiconductor industry.

[0092] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent applications.

Claims

1. An electronic device, comprising: Redistribution structure, configuration of redistribution lines; A substrate, configured with substrate circuits facing the redistribution structure; an adhesive layer, attaching the redistribution structure to the substrate; as well as A plurality of conductive members are at least disposed through the adhesive layer and electrically connect the redistribution circuit of the redistribution structure to the substrate circuit of the substrate.

2. The electronic device according to claim 1, wherein the redistribution circuit of the redistribution structure defines a line width, and the substrate circuit of the substrate defines a line width; near one or more conductive members, the line width of the redistribution circuit is smaller than the line width of the substrate circuit. 3 . The electronic device according to claim 1 , wherein the redistribution structure defines a thickness, and the substrate defines a substrate thickness, and a ratio of the substrate thickness to the thickness of the redistribution structure is not less than 5. 4 . 4 . The electronic device according to claim 1 , wherein the redistribution circuit of the redistribution structure defines an average thickness, the substrate circuit of the substrate defines an average thickness, and the average thickness of the redistribution circuit is smaller than the average thickness of the substrate circuit. The electronic device according to claim 1 , wherein the redistribution structure comprises one or more sub-circuit layers stacked thereon.

6. A method for manufacturing an electronic device, comprising: forming a redistribution wiring structure on an initial substrate, wherein the redistribution wiring structure configures an initial circuit; Combining the redistribution wiring structure to a substrate, wherein the substrate is provided with substrate circuits, and the substrate circuits face the redistribution wiring structure; removing at least a portion of the initial substrate; Before combining the redistribution wiring structure with the substrate, an adhesive layer and a plurality of conductive members are disposed between the redistribution wiring structure and the substrate to obtain the electronic device; After removing at least a portion of the initial substrate, a redistribution structure is obtained, the redistribution structure is configured with a redistribution circuit, and the multiple conductive members electrically connect the redistribution circuit to the substrate circuit, and the initial circuit of the redistribution wiring structure forms at least a portion of the redistribution circuit.

7. The manufacturing method according to claim 6, wherein the initial substrate comprises a rigid board and a flexible board stacked on the rigid board; the redistribution wiring structure is arranged on the flexible board and away from the rigid board, and the redistribution wiring structure configures the initial circuit; in the step of removing at least a portion of the initial substrate, the rigid board is removed from the flexible board, and the redistribution structure comprises the flexible board and the redistribution wiring structure.

8. The manufacturing method according to claim 6, wherein the initial substrate comprises a rigid board, and the redistribution wiring structure is arranged on the rigid board and configured with the initial circuit, and the initial circuit faces the substrate when the redistribution structure is combined with the substrate; in the step of removing at least a portion of the initial substrate, the rigid board is removed from the surface of the redistribution wiring structure, and at least one connection pad is formed on the surface, and the redistribution wiring structure is regarded as the redistribution structure.

9. The manufacturing method according to claim 7, wherein before the step of removing at least a portion of the initial substrate, a temporary molding structure is formed to cover at least a portion of the initial circuit of the redistribution wiring structure; and after the redistribution wiring structure is bonded to the substrate, the temporary molding structure is removed.

10. The manufacturing method according to claim 8, wherein before the step of removing at least a portion of the initial substrate, a temporary molding structure is formed to cover at least a portion of the initial circuit of the redistribution wiring structure; and after the redistribution wiring structure is bonded to the substrate, the temporary molding structure is removed.

11. The manufacturing method according to claim 6, wherein before or after the step of combining the redistribution wiring structure or the redistribution structure to the substrate, one or more thin film elements are formed on the redistribution wiring structure or the redistribution structure, and the one or more thin film elements are electrically connected to the redistribution line.

12. A method for manufacturing an electronic device, comprising: forming a redistribution wiring structure on an initial substrate, wherein the redistribution wiring structure is configured with initial routing; removing at least a portion of the initial substrate; Combining the redistribution wiring structure with a substrate, wherein the substrate is provided with substrate circuits, and the substrate circuits face the redistribution wiring structure; Before combining the redistribution wiring structure with the substrate, an adhesive layer and a plurality of conductive members are disposed between the redistribution wiring structure and the substrate to obtain the electronic device; After removing at least a portion of the initial substrate, a redistribution structure is obtained, the redistribution structure is configured with a redistribution circuit, and the multiple conductive members electrically connect the redistribution circuit to the substrate circuit, and the initial circuit of the redistribution wiring structure forms at least a portion of the redistribution circuit.

13. The manufacturing method according to claim 12, wherein the initial substrate comprises a rigid board and a flexible board stacked on the rigid board; the redistribution wiring structure is arranged on the flexible board and away from the rigid board, and the redistribution wiring structure configures the initial circuit; in the step of removing at least a portion of the initial substrate, the rigid board is removed from the flexible board, and at least one connection pad is formed on the flexible board, wherein the redistribution structure comprises the flexible board and the redistribution wiring structure.

14. The manufacturing method according to claim 12, wherein the initial substrate comprises a rigid board, and the redistribution wiring structure is arranged on the rigid board and configured with the initial circuit, and the initial circuit faces the substrate when the redistribution structure is combined with the substrate; in the step of removing at least a portion of the initial substrate, the rigid board is removed from the surface of the redistribution wiring structure, and at least one connection pad is formed on the surface, and the redistribution wiring structure is regarded as the redistribution structure.

15. The manufacturing method according to claim 12, wherein before or after the step of combining the redistribution wiring structure or the redistribution structure to the substrate, one or more thin film elements are formed on the redistribution wiring structure or the redistribution structure, and the one or more thin film elements are electrically connected to the redistribution line.

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