Multi-band multifunctional antenna integration module and preparation method thereof

Abstract

The invention relates to a multi-band multifunctional antenna integration module and a preparation method thereof, and aims to solve the problem of single function of a communication element. The multi-band multifunctional antenna integration module comprises an electromagnetic wave capturing layer, a frequency selection circuit layer and a signal processing circuit layer which are vertically stacked in sequence, the frequency selection circuit layers are connected with each other through metalized through holes; the frequency selection circuit layer comprises a plurality of frequency selection circuit units with different processing frequency bands, the signal processing circuit layer comprises a plurality of signal processing circuit units with different functions, and the plurality of frequency selection circuit units and the plurality of signal processing circuit units are interconnected through a plurality of metalized through holes in a one-to-one correspondence manner.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuits, and in particular to a multi-band and multi-functional antenna integrated module and a preparation method thereof. Background Art

[0002] With the development of communication technology, from 5G to 6G, from MIMO antennas to the application of emerging metasurface technology, modern communication systems often need to undertake multi-band, multi-functional and highly complex tasks, such as the need to simultaneously reflect, transmit, absorb and convert signals in different frequency bands, and at the same time put forward higher requirements for integration, modularization and miniaturization. However, existing communication components are either single-band structures or single-function structures.

[0003] To this end, the present invention is proposed. Summary of the invention

[0004] The main purpose of the present invention is to provide a multi-band and multi-functional antenna integrated module and a preparation method thereof, so as to solve the problem of single function of communication elements.

[0005] In order to achieve the above objectives, the present invention provides the following technical solutions.

[0006] A first aspect of the present invention provides a multi-band and multi-functional antenna integrated module, which comprises an electromagnetic wave capture layer, a frequency selection circuit layer and a signal processing circuit layer vertically stacked in sequence;

[0007] The frequency selection circuit layer and the frequency selection circuit layer are interconnected through metallized through holes;

[0008] The frequency selection circuit layer includes multiple frequency selection circuit units for processing different frequency bands, and the signal processing circuit layer includes multiple signal processing circuit units with different functions. The multiple frequency selection circuit units and the multiple signal processing circuit units are interconnected one by one through multiple metallized through holes.

[0009] Therefore, the present invention connects the electromagnetic wave capture layer with the broadband electromagnetic wave signal capture function to the frequency selection circuit layer, and processes the signals of different frequency bands to the different signal processing circuit units of the signal processing circuit layer through the different frequency selection circuit units of the frequency selection circuit layer, thereby realizing different functions of different frequency bands, including but not limited to signal reflection, transmission, absorption and conversion, etc. Therefore, the antenna integrated module of the present invention has the characteristics of multi-band and multi-function, can undertake high-complexity tasks, and can further reduce the size of the radio frequency system, reduce transmission commas, and improve integration.

[0010] Furthermore, the electromagnetic wave capturing layer includes a first substrate, an antenna structure layer is arranged on the upper surface of the first substrate, and a metal grounding layer is arranged on the lower surface of the first substrate.

[0011] The electromagnetic wave capture layer is used to capture electromagnetic wave signals. The metal grounding layer is arranged on the back to enhance the antenna signal receiving ability, prevent electrostatic interference, and protect the safety of the device. The antenna structure layer is isolated from the metal grounding layer by the first substrate, which is easy to prepare and can better isolate the upper and lower surface functional layers.

[0012] Furthermore, the antenna structure layer includes a super-surface antenna structure.

[0013] As a two-dimensional planar structure of metamaterials, metasurface has the advantages of low profile, simple design, low loss, etc. The metasurface antenna structure has characteristics such as wide impedance bandwidth and high gain, and has greater performance advantages when used in communication equipment. In actual products, whether to use the metasurface structure can be selected according to functional requirements.

[0014] Furthermore, the frequency selection circuit layer includes a second substrate, the metal grounding layer is stacked on the upper surface of the second substrate, and the frequency selection circuit unit is arranged on the lower surface of the second substrate.

[0015] The frequency selection circuit unit is arranged on the lower surface of the second substrate, and the second substrate can play the role of isolating the metal grounding layer and the frequency selection circuit unit without adding an additional insulating layer, which can make the component lighter and thinner and save materials.

[0016] Furthermore, the plurality of frequency selection circuit units include at least one of a low-pass filter, a band-pass filter, and a high-pass filter.

[0017] These filters are widely used filter structures and can be adjusted according to the requirements of specific practical applications.

[0018] Furthermore, the antenna structure layer and the frequency selection circuit layer are interconnected via metallized through holes penetrating the first substrate and the metal ground layer.

[0019] Furthermore, the signal processing circuit layer includes a third substrate, the upper surface of the third substrate is connected to the frequency selection circuit unit, and the signal processing circuit unit is arranged on the lower surface of the third substrate.

[0020] By arranging the signal processing circuit unit on the lower surface of the third substrate, the third substrate can isolate the frequency selection circuit unit and the signal processing circuit unit without adding an additional insulating layer, which can make the component thinner and save materials.

[0021] Furthermore, the plurality of signal processing circuit units include at least one of an absorptive resistor, a phase shifter, a chip for receiving a signal, and a circulator.

[0022] The absorptive resistor can completely absorb and exhaust the radiation, thus forming an electromagnetic stealth effect in this frequency band. After giving the signal in this frequency band a phase change, the phase shifter can realize the metasurface function; the chip receiving the signal can transmit the signal in this frequency band to the back-end for processing, and the entire module is equivalent to an antenna with filtering and frequency selection function. The circulator can be regarded as a transceiver antenna module with full-duplex function in this frequency band.

[0023] Furthermore, the first substrate, the second substrate and the third substrate are each independently made of at least one of a glass substrate, a PCB substrate, a ceramic substrate and a flexible material substrate.

[0024] The second aspect of the present invention provides a method for preparing the antenna integrated module of the first aspect, comprising:

[0025] The electromagnetic wave capturing layer, the frequency selection circuit layer and the signal processing circuit layer are bonded together.

[0026] Alternatively, prepare by the following method:

[0027] The layers are deposited in sequence, for example, first depositing to form an electromagnetic wave capture layer, then depositing on its surface to form a frequency selection circuit layer, and finally depositing to form a signal processing circuit layer.

[0028] In summary, compared with the prior art, the present invention achieves the following technical effects:

[0029] The present invention connects an electromagnetic wave capture layer with a broadband electromagnetic wave signal capture function to a frequency selection circuit layer, and processes signals of different frequency bands through different frequency selection circuit units of the frequency selection circuit layer, thereby sending signals of different frequency bands to different signal processing circuit units of the signal processing circuit layer, thereby achieving different functions of different frequency bands, including but not limited to signal reflection, transmission, absorption and conversion, etc. The present invention provides a design of a multi-band and multi-functional metasurface and antenna hybrid module, providing a feasible solution for a variety of complex application scenarios in the future. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the following detailed description of the preferred embodiment.The drawings are only for the purpose of illustrating the preferred embodiments and are not to be construed as limiting the invention.

[0031] Figure 1 An exploded schematic diagram of the antenna integration module provided by the present invention;

[0032] Figure 2 An overall schematic diagram of the antenna integration module provided by the present invention;

[0033] Figure 3 A top-down structural diagram of the electromagnetic wave capture layer;

[0034] Figure 4 It is a bottom view of the frequency selection circuit layer;

[0035] Figure 5 This is a bottom view of the signal processing circuit layer.

[0036] Reference numerals:

[0037] 101-electromagnetic wave capture layer, 102-frequency selection circuit layer, 103-signal processing circuit layer;

[0038] 201-antenna structure layer, 202-first substrate, 203-second substrate, 204-third substrate, 205-metallized through hole, 206-metal grounding layer, 207-frequency selection circuit unit, 208-metallized through hole, 209-signal processing circuit unit, 401-filter structure, 402-filter structure, 403-filter structure, 404-filter structure, 501-absorptive resistor, 502-phase shifter, 503-signal receiving chip, 504-circulator. DETAILED DESCRIPTION

[0039] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0040] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may further design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0041] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element or an intervening layer / element may exist therebetween. In addition, if a layer / element is "on" another layer / element in one orientation, the layer / element may be "below" the other layer / element when the orientation is reversed.

[0042] Existing communication components have single functions. For example, antennas and filters are usually designed independently. When applied to a system, they need to be interconnected through additional transmission lines and require additional circuit elements for matching between devices. Such products take up a lot of space.

[0043] To this end, the present invention provides Figures 1 to 2 The antenna integrated module shown has the characteristics of multi-band and multi-function, and specifically includes an electromagnetic wave capture layer 101, a frequency selection circuit layer 102 and a signal processing circuit layer 103 which are vertically stacked in sequence.

[0044] The frequency selection circuit layers 102 and the frequency selection circuit layers 102 are interconnected through metallized through holes 205 .

[0045] The frequency selection circuit layer 102 includes multiple frequency selection circuit units 207 for processing different frequency bands, and the signal processing circuit layer 103 includes multiple signal processing circuit units 209 with different functions. The multiple frequency selection circuit units 207 and the multiple signal processing circuit units 209 are interconnected one by one through multiple metallized through holes 208.

[0046] Therefore, the present invention connects the electromagnetic wave capture layer 101 with a wide-band electromagnetic wave signal capture function with the frequency selection circuit layer 102, and processes the signals of different frequency bands through different frequency selection circuit units 207 of the frequency selection circuit layer 102, thereby sending the signals of different frequency bands to different signal processing circuit units 209 of the signal processing circuit layer 103, thereby realizing different functions of different frequency bands, including but not limited to signal reflection, transmission, absorption and conversion, etc.

[0047] The electromagnetic wave capture layer 101 may include a first substrate 202, an antenna structure layer 201 is arranged on the upper surface of the first substrate 202, and a metal ground layer 206 is arranged on the lower surface of the first substrate 202, thereby forming an overall antenna structure. The electromagnetic wave capture layer 101 is used to capture electromagnetic wave signals. The metal ground layer 206 is arranged on the back side to enhance the antenna signal receiving ability, prevent electrostatic interference, and protect the safety of the device. The antenna structure layer 201 is isolated from the metal ground layer 206 by the first substrate 202, which is easy to prepare and can better isolate the upper and lower surface functional layers. The antenna structure layer 201 can also adopt a super surface antenna structure, such as Figure 3 The 2×4 rectangular patch metasurface antenna array structure shown in the figure uses a slot structure on each patch unit to broaden the working bandwidth. In actual applications, the specific size is determined according to the frequency, bandwidth, etc.

[0048] The frequency selection circuit layer 102 may include a second substrate 203, a metal grounding layer 206 is stacked on the upper surface of the second substrate 203, and a frequency selection circuit unit 207 is arranged on the lower surface of the second substrate 203. The frequency selection circuit layer 102 is connected through a metallized through hole penetrating the first substrate 202, the metal grounding layer 206, and the second substrate 203. Figure 4A view of the frequency selection circuit layer 102 is shown, and multiple frequency selection circuit units 207, namely multiple coupled filter structures, include filter structure 401, filter structure 402, filter structure 403, and filter structure 404. These structures can be low-pass filters, band-pass filters, high-pass filters, etc., and can be various forms of structures according to the requirements of specific practical applications to meet different frequency band requirements.

[0049] The signal processing circuit layer 103 may include a third substrate 204, the upper surface of the third substrate 204 is connected to the frequency selection circuit unit 207, and the lower surface of the third substrate 204 is provided with a signal processing circuit unit 209. The electromagnetic signal divided by the frequency selection circuit layer 102 is connected to different signal processing circuit units 209 in a one-to-one correspondence through a plurality of metallized through holes 208 of the third substrate 204. Figure 5 The signal processing circuit layer 103 is shown. According to different frequency bands, the functions of the signal processing circuit unit 209 are different, and may include an absorptive resistor 501, a phase shifter 502, a chip 503 for receiving signals, and a circulator 504. The absorptive resistor 501, so that the electromagnetic wave model of the frequency band will be completely absorbed and exhausted, thereby forming an electromagnetic stealth effect of the frequency band; the phase shifter 502 can be a reflective microstrip phase shifter or an adjustable phase shifter, so that after giving the signal of the frequency band a phase change, the function of the metasurface can be realized; the chip 503 for receiving signals can transmit the signal of the frequency band to the back-end for processing, and the entire module is equivalent to an antenna with a filtering and frequency selection function; the frequency selection circuit unit 207 is connected to one of the ports of the circulator 504, so it can be regarded as a transceiver antenna module with full-duplex function in the frequency band. The multi-functions realized by the module depend on the connected signal processing function.

[0050] The first substrate 202 , the second substrate 203 and the third substrate 204 used in the above three functional layers can each independently use at least one of a glass substrate, a PCB substrate, a ceramic substrate and a flexible material substrate.

[0051] There are various methods for preparing the antenna integrated module, for example, the method may be: bonding the electromagnetic wave capture layer, the frequency selection circuit layer and the signal processing circuit layer together.

[0052] Alternatively, the layers are deposited in sequence, for example, the electromagnetic wave capturing layer is first deposited, then the frequency selection circuit layer is deposited on the surface thereof, and finally the signal processing circuit layer is deposited.

[0053] The embodiments of the present disclosure are described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present disclosure. The scope of the present disclosure is defined by the appended claims and their equivalents. Without departing from the scope of the present disclosure, a person skilled in the art may make a variety of substitutions and modifications, which should all fall within the scope of the present disclosure.

Claims

1. A multi-band and multi-functional antenna integrated module, characterized in that: It includes an electromagnetic wave capture layer, a frequency selection circuit layer and a signal processing circuit layer which are vertically stacked in sequence; The frequency selection circuit layer and the frequency selection circuit layer are interconnected through metallized through holes; The frequency selection circuit layer includes multiple frequency selection circuit units for processing different frequency bands, and the signal processing circuit layer includes multiple signal processing circuit units with different functions. The multiple frequency selection circuit units and the multiple signal processing circuit units are interconnected one by one through multiple metallized through holes.

2. The antenna integrated module according to claim 1, characterized in that: The electromagnetic wave capturing layer comprises a first substrate, an antenna structure layer is arranged on the upper surface of the first substrate, and a metal grounding layer is arranged on the lower surface of the first substrate.

3. The antenna integrated module according to claim 2, characterized in that: The antenna structure layer includes a super-surface antenna structure.

4. The antenna integrated module according to claim 2, characterized in that: The frequency selection circuit layer includes a second substrate, the metal grounding layer is stacked on the upper surface of the second substrate, and the frequency selection circuit unit is arranged on the lower surface of the second substrate.

5. The antenna integrated module according to claim 1, characterized in that: The plurality of frequency selection circuit units include at least one of a low-pass filter, a band-pass filter, and a high-pass filter.

6. The antenna integrated module according to claim 2, characterized in that: The antenna structure layer and the frequency selection circuit layer are interconnected via metallized through holes that penetrate the first substrate and the metal ground layer.

7. The antenna integrated module according to claim 4, characterized in that: The signal processing circuit layer includes a third substrate, the upper surface of the third substrate is connected to the frequency selection circuit unit, and the signal processing circuit unit is arranged on the lower surface of the third substrate.

8. The antenna integrated module according to claim 1, characterized in that: The plurality of signal processing circuit units include at least one of an absorptive resistor, a phase shifter, a chip for receiving a signal, and a circulator.

9. The antenna integrated module according to claim 7, characterized in that: The first substrate, the second substrate and the third substrate are each independently made of at least one of a glass substrate, a PCB substrate, a ceramic substrate and a flexible material substrate.

10. The method for preparing the antenna integrated module according to any one of claims 1 to 9, characterized in that: include: The electromagnetic wave capturing layer, the frequency selection circuit layer and the signal processing circuit layer are bonded together.

Images