Small-space connector
By designing a small space connector including a shell, inner conductor and seal, and using technical means such as soldering connection and glass packaging, the existing technology is difficult to meet the requirements of air-sealing, high temperature resistance and high performance in narrow spaces and dual-port misaligned connection environments, and the reliability and environmental adaptability of signal transmission are achieved.
Patent Information
- Application Number
- CN202411896455.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-03-28
AI Technical Summary
Existing RF coaxial connectors are difficult to meet the requirements of air-sealing, high temperature resistance and high performance in narrow spaces and dual-port misaligned connection environments.
A small space connector is designed, including a housing, a first inner conductor, a second inner conductor and a seal. Through technical means such as soldering connection and glass packaging, the requirements for axial and radial offset are achieved, and the reliability and high temperature resistance of the connection are improved through insulating medium and airtight medium.
This connector can realize the reliability of signal transmission in a narrow space and a dual-port misaligned connection environment. It is suitable for environments with small space and airtight requirements in the entire machine system, improving the environmental adaptability of the product.
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Figure CN119726222A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of joints, in particular to a small space connector. Background Art
[0002] RF coaxial connectors are usually considered to be a component installed on cables or instruments. As a component for electrical connection or separation of transmission lines, it is a mechatronics product and mainly plays a bridging role. Nowadays, RF connectors are increasingly used in microwave communication fields such as aviation, aerospace, weapons, radar, etc., and the use environment is becoming more and more complex.
[0003] There is an axial and radial distance difference between the two ports in the whole system, and it is necessary to achieve the environmental requirements of airtightness, high temperature resistance, and high performance. Due to the limitation of space size, it cannot be achieved by interconnecting multiple straight or curved coaxial connectors or cable assemblies. This requires that a single connector not only meets the basic RF signal transmission function, but also meets the environmental conditions of narrow space, dual-port misaligned connection, etc. Summary of the invention
[0004] The purpose of the present invention is to provide a small space connector to solve the problems existing in the above-mentioned prior art, so that the connector can meet the connection requirements of narrow space and dual port misalignment.
[0005] To achieve the above object, the present invention provides the following solutions:
[0006] The present invention provides a small space connector, comprising a shell, a first inner conductor, a second inner conductor and a seal, wherein the first inner conductor and the second inner conductor are both arranged in the inner cavity of the shell, an insulating seal is arranged between the first inner conductor and the second inner conductor and the shell, the first inner conductor and the second inner conductor are internally connected, a first plug is formed at the port of the shell by the first inner conductor and a second plug is formed at the port of the shell by the second inner conductor, and the first plug and the second plug are respectively used for plugging with a quick-connect connector.
[0007] Preferably, the shell is Z-shaped, the first inner conductor is linear, the second inner conductor is L-shaped, the two ends of the shell are the first plug and the second plug respectively, and the axial distance between the first plug and the second plug is at least 1 mm.
[0008] Preferably, the inner end of the first inner conductor is provided with a welding groove, and the welding groove is connected to the inner end of the second inner conductor by soldering.
[0009] Preferably, the melting point of the solder used for soldering is greater than 230° C., and the material of the solder includes Sn10Pb88Ag2.
[0010] Preferably, a welding opening is provided on the shell at the welding point between the first inner conductor and the second inner conductor, and a sealing cover is sealed and clamped on the welding opening.
[0011] Preferably, the material of the shell is the same as the material of the second inner conductor.
[0012] Preferably, the material of the first inner conductor includes copper alloy or stainless steel; the material of the second inner conductor includes Kovar alloy or stainless steel.
[0013] Preferably, an insulating support ring is provided between the first inner conductor and the shell; the insulating support ring is made of polytetrafluoroethylene, polyimide or polyetheretherketone.
[0014] Preferably, an airtight medium is encapsulated between the second inner conductor and the shell, the material of the airtight medium is glass, one end of the airtight medium is the second plug, and the other end is the connection between the first inner conductor and the second inner conductor.
[0015] Preferably, an insulating medium is provided at the inner end of the airtight medium, and the insulating medium is provided between the second inner conductor and the shell, the second inner conductor penetrates and protrudes from the surface of the insulating medium, the dielectric parameter of the insulating medium is 3-4.5, and the material of the insulating medium includes polyimide or polyetheretherketone.
[0016] Compared with the prior art, the present invention has achieved the following technical effects:
[0017] The RF connector structure of the present invention can meet the connection requirements of a narrow space with dual-port misalignment, ensure the reliability of signal transmission of the entire system, and can be widely used in environments with narrow space and airtightness requirements in the entire system to improve the environmental adaptability of the product in the entire system. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0019] Figure 1 This is a schematic diagram of the structure of a small space connector in an embodiment of the present invention;
[0020] In the figure: 1-first inner conductor, 2-insulating support ring, 3-insulating medium, 4-airtight medium, 5-second inner conductor, 6-housing, 7-first plug, 8-second plug, 9-sealing cover, 10-solder. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0022] The purpose of the present invention is to provide a small space connector to solve the problems existing in the prior art.
[0023] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0024] like Figure 1 As shown, in this embodiment, a small space connector is provided, including a shell 6, a first inner conductor 1, a second inner conductor 5 and an insulating seal. The first inner conductor 1 and the second inner conductor 5 are both arranged in the inner cavity of the shell 6, and insulating seals are arranged between the first inner conductor 1 and the second inner conductor 5 and the shell 6. The first inner conductor 1 and the second inner conductor 5 are internally connected, and a first plug 7 is formed at the port of the first inner conductor 1 and the shell 6, and a second plug 8 is formed at the port of the second inner conductor 5 and the shell 6. The first plug 7 and the second plug 8 are respectively used for plugging with a quick-connect connector.
[0025] As an optional solution, in this embodiment, the housing 6 is linear or Z-shaped, the first inner conductor 1 is linear, the second inner conductor 5 is linear or L-shaped, and the two ends of the housing 6 are respectively the first plug 7 and the second plug 8; when the housing 6 is Z-shaped, the Z-shape can be a Z-shape on a plane, that is, the axes of the first plug 7 and the second plug 8 are parallel, or a Z-shape in three-dimensional space, that is, the axes of the first plug 7 and the second plug 8 are skew lines, and the distance between the axes of the first plug 7 and the second plug 8 is at least 1 mm. In this embodiment, the radial offset distance between the first plug 7 and the second plug 8 is achieved by the L-shaped inner conductor structure.
[0026] As an optional solution, in this embodiment, the inner end of the first inner conductor 1 is provided with a welding groove, which is convenient for processing and increases the welding surface and improves the welding strength. The welding groove is connected to the inner end of the second inner conductor 5 by soldering. If the welding groove is provided on the second inner conductor 5, it will increase the difficulty of product processing and cause the problem of bubbles and cavities on the glass surface of the upper end surface after glass packaging.
[0027] As an optional solution, the melting point of the solder 10 used for soldering in this embodiment is greater than 230° C., which is higher than the soldering temperature of a general circuit board, to ensure that the soldering does not come off during reprocessing. The material of the solder 10 includes Sn10Pb88Ag2 and other solders with a melting point greater than 230° C. In this embodiment, the high-temperature soldering connection can achieve the requirements for the axial and radial offset of the product.
[0028] As an optional solution, in this embodiment, a welding opening is provided on the shell 6 at the welding point between the first inner conductor 1 and the second inner conductor 5 , and a sealing cover 9 is sealed and clamped on the welding opening.
[0029] As an optional solution, in this embodiment, the material of the shell 6 is the same as that of the second inner conductor 5 to ensure that the two have the same thermal expansion coefficient.
[0030] As an optional solution, in this embodiment, the material of the first inner conductor 1 includes copper alloy or stainless steel; the material of the second inner conductor 5 includes Kovar alloy or stainless steel.
[0031] As an optional solution, in this embodiment, an insulating support ring 2 is provided between the first inner conductor 1 and the housing 6; the material of the insulating support ring 2 includes insulating materials such as polytetrafluoroethylene, polyimide or polyetheretherketone. The housing 6 is preferably provided with a limiting groove, and the insulating support ring 2 can be sealed in the housing 6 through the limiting groove, and the first inner conductor 1 is inserted into the insulating support ring 2.
[0032] As an optional solution, in this embodiment, an airtight medium 4 is encapsulated between the second inner conductor 5 and the shell 6. The material of the airtight medium 4 is glass. One end of the airtight medium 4 is the second plug 8, and the other end is the connection between the first inner conductor 1 and the second inner conductor 5, forming an L shape. In this embodiment, the second inner conductor 5 and the shell 6 are fixed together by a glass encapsulation process.
[0033] As an optional solution, in this embodiment, the inner end of the airtight medium 4 is provided with an insulating medium 3, and the insulating medium 3 is provided between the second inner conductor 5 and the shell 6. The second inner conductor 5 penetrates and protrudes from the surface of the insulating medium 3. The dielectric parameter of the insulating medium 3 is 3-4.5, and the material of the insulating medium 3 includes high-temperature resistant insulating media such as polyimide or polyetheretherketone. In this embodiment, by providing the insulating medium 3, the high-frequency band performance problem and the sintering process problem can also be solved; in the glass sintering packaging process, when the glass embryo is loaded into the shell before sintering, the upper end surface of the glass embryo will be higher than the glass surface after packaging, and it is easy to have the phenomenon that the upper end surface of the second inner conductor 5 has insufficient exposed size and cannot be positioned during packaging. Therefore, it is necessary to add an insulating medium 3 with a similar dielectric constant on the glass surface to reduce the processing difficulty of the product, improve the product processability and optimize the high-frequency performance, and further realize the product's airtightness and high-temperature environment resistance.
[0034] In this embodiment, the exterior of the shell 6 is preferably a double-bend Z-shaped shell, which is glass-encapsulated and supported by a high-temperature resistant insulating medium 3, and the internal connectors are connected by high-temperature soldering; when realizing a dual-port misaligned connection in a narrow space, the two ports can be set to a blind-matching plug-in series-like male head interface, which can achieve the requirement of allowing a maximum axial and radial floating of 0.25mm when plugged with the series of female head interfaces, that is, the board interconnection solution under dual-port misalignment, which is suitable for all environments and products with dual-port misalignment requirements.
[0035] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.
Claims
1. A small space connector, characterized in that: The invention comprises a shell, a first inner conductor, a second inner conductor and a seal, wherein the first inner conductor and the second inner conductor are both arranged in the inner cavity of the shell, an insulating seal is arranged between the first inner conductor and the second inner conductor and the shell, the first inner conductor and the second inner conductor are internally connected, a first plug is formed at the port of the shell by the first inner conductor and a second plug is formed at the port of the shell by the second inner conductor, and the first plug and the second plug are respectively used for connecting with a quick-connect connector.
2. The small space connector according to claim 1, characterized in that: The shell is Z-shaped, the first inner conductor is linear, the second inner conductor is L-shaped, the two ends of the shell are the first plug and the second plug respectively, and the axial distance between the first plug and the second plug is at least 1 mm.
3. The small space connector according to claim 1, characterized in that: The inner end of the first inner conductor is provided with a welding groove, and the welding groove is connected to the inner end of the second inner conductor by soldering.
4. The small space connector according to claim 3, characterized in that: The melting point of the solder of the tin solder is greater than 230° C., and the material of the solder includes Sn10Pb88Ag2.
5. The small space connector according to claim 3, characterized in that: A welding opening is provided on the shell body at the welding point between the first inner conductor and the second inner conductor, and a sealing cover is sealed and clamped on the welding opening.
6. The small space connector according to claim 1, characterized in that: The material of the shell is the same as that of the second inner conductor.
7. The small space connector according to claim 1, characterized in that: The material of the first inner conductor includes copper alloy or stainless steel; the material of the second inner conductor includes Kovar alloy or stainless steel.
8. The small space connector according to claim 1, characterized in that: An insulating support ring is arranged between the first inner conductor and the shell; the material of the insulating support ring includes polytetrafluoroethylene, polyimide or polyetheretherketone.
9. The small space connector according to claim 1, characterized in that: An airtight medium is encapsulated between the second inner conductor and the shell. The material of the airtight medium is glass. One end of the airtight medium is the second plug, and the other end is the connection between the first inner conductor and the second inner conductor.
10. The small space connector according to claim 1, characterized in that: An insulating medium is arranged at the inner end of the airtight medium, and the insulating medium is arranged between the second inner conductor and the shell. The second inner conductor penetrates and protrudes from the surface of the insulating medium. The dielectric parameter of the insulating medium is 3-4.5, and the material of the insulating medium includes polyimide or polyetheretherketone.