Connector cable assembly and assembling method thereof

Abstract

The invention provides a connector cable assembly and an assembling method thereof. The cable assembly comprises a tail supporting block and an insulating mounting plate, and the insulating mounting plate is provided with a mounting area used for mounting a first high-speed terminal wafer and a second high-speed terminal wafer; each of the first high-speed terminal wafer and the second high-speed terminal wafer comprises an inner shielding sheet, a wafer body and a plurality of high-speed terminals arranged on the wafer body; the inner shielding sheet is attached to the wafer body, and the inner shielding sheet is in close contact with the ground PIN through welding; after the first high-speed terminal wafer and the second high-speed terminal wafer are installed in the installation area, the tail supporting block is installed on the insulation installation plate and then used for fixing the first high-speed terminal wafer and the second high-speed terminal wafer in the installation area and supporting the bent wire. In actual use, the contact between the inner shielding sheet and the ground PIN is realized by adopting elastic contact and laser welding modes, and the stability during contact is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical equipment, and in particular to a connector cable assembly and an assembly method thereof. Background Art

[0002] A cable connector is an electrical connector used for data transmission between different electronic devices. Chip technology connects all interface modules (including control modules) to a matrix backplane, and can communicate between multiple modules at the same time through direct chip-to-chip forwarding. It is characterized by high access efficiency, suitable for simultaneous multi-point access, easy to provide very high bandwidth, and convenient performance expansion, and is not easily restricted by CPU bus and memory technology.

[0003] In the prior art, hybrid connector cable assemblies that meet the high-speed transmission performance of PCIe Gen 6 mostly use conductive plastics to achieve shielding functions. The contact between the conductive plastic and the ground PIN is almost inelastic. In a thermal environment of a certain temperature, the contact force of this structure will gradually fail due to thermal stress relaxation, resulting in a gradual decrease in its high-speed performance. Summary of the invention

[0004] The object of the present invention is to provide a connector cable assembly and an assembly method thereof, which in actual use adopts elastic contact and laser welding to achieve contact between an inner shielding sheet and a ground PIN, thereby improving the stability during contact.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A connector cable assembly includes an insulating mounting plate, and a mounting area for mounting a first high-speed terminal wafer and a second high-speed terminal wafer is provided on the insulating mounting plate;

[0007] The present invention also includes a tail support block,

[0008] The first high-speed terminal wafer and the second high-speed terminal wafer each include an inner shielding sheet, a wafer body, and a plurality of high-speed terminals arranged on the wafer body;

[0009] The inner shielding sheet is fitted with the wafer body, and the inner shielding sheet is in close contact with the ground PIN by welding;

[0010] After the first high-speed terminal wafer and the second high-speed terminal wafer are installed in the installation area, the tail support block is installed on the insulating installation plate to fix the first high-speed terminal wafer and the second high-speed terminal wafer in the installation area.

[0011] Furthermore, groove structures are arranged on both sides of the tail support block, and the groove structures on both sides are arranged in a staggered manner, and bent wires are arranged in the grooves.

[0012] In actual use, the wires are welded to the high-speed terminals.

[0013] Furthermore, a plurality of first protrusions corresponding to the groove structure are arranged on the inner shielding sheet, the first protrusions are interference fit with the groove structure, and the first protrusions are located below the bending wire stripping transition section.

[0014] Preferably, after the wire and the high-speed terminal are welded, they are fixed with UV glue, and the UV glue solidifies to form a UV glue layer.

[0015] Furthermore, a wire-wrapped plastic package is also provided on the insulating mounting board, and the wire-wrapped plastic package is used to package the first high-speed terminal wafer, the second high-speed terminal wafer and the tail support block on the insulating mounting board.

[0016] Wherein, a wedge-shaped groove is arranged on the side of the insulating mounting plate, and after the wire-wrapped plastic-encapsulated body is encapsulated on the insulating mounting plate, the wedge-shaped structure formed on the wire-wrapped plastic-encapsulated body fits with the wedge-shaped groove.

[0017] Furthermore, a hanging platform is arranged on the side of the wafer body, and a hanging hole corresponding to the hanging platform is arranged on the insulating mounting plate.

[0018] Furthermore, a positioning groove is provided on the tail support block, and a positioning protrusion is provided in the installation area of ​​the insulating installation plate, and the positioning groove and the positioning protrusion cooperate with each other.

[0019] The present invention also discloses a method for assembling a connector cable assembly. The connector cable assembly is a connector cable assembly as described above. The specific assembly method is as follows:

[0020] Step 1: The high-speed terminal and the wafer body are made into an integrated structure by injection molding to form a first high-speed terminal wafer and a second high-speed terminal wafer;

[0021] Step 2: Use laser welding to weld the protrusion on the inner shielding sheet and the ground PIN in the high-speed terminal together;

[0022] Step 3: Install the first high-speed terminal wafer and the second high-speed terminal wafer on the insulating mounting plate;

[0023] Step 4: Install the tail support block on the insulating mounting plate and weld the wires;

[0024] Step 5: Use UV glue to cure the welded wires;

[0025] Step 6: Use low-pressure injection molding hot melt adhesive to form a wire-wrapped plastic package.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] In actual use, the present invention provides a countersunk hole on the wafer body, the countersunk hole corresponds to the ground PIN in the high-speed terminal, and a plurality of protrusions are provided on the inner shielding sheet. The inner shielding sheet is fitted with the wafer body, and the protrusions provided on the inner shielding sheet pass through the countersunk hole and are in close contact with the ground PIN by laser welding. The contact between the inner shielding sheet and the ground PIN is achieved by elastic contact and laser welding, thereby improving the stability during contact. The present invention adopts a structure that uses a shielding sheet to achieve PCIe Gen 6 high-speed transmission performance, and the contact is achieved by elastic contact and laser welding. The contact reliability is excellent and can be fully adapted within the product operating temperature range. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0030] Figure 2 For the present invention Figure 1 Schematic diagram of the overall structure after removing the insulating mounting plate.

[0031] Figure 3 It is a schematic diagram of the matching relationship between the first high-speed terminal wafer, the second high-speed terminal wafer and the tail support block of the present invention.

[0032] Figure 4 It is a schematic diagram of the overall structure of the first high-speed terminal wafer of the present invention.

[0033] Figure 5 It is a schematic diagram of the overall structure of the inner shielding sheet of the present invention.

[0034] Figure 6 It is a schematic diagram of the matching relationship between the wafer body and the high-speed terminal of the present invention.

[0035] Figure 7 It is a schematic diagram of the structure in which the outer shielding sheet of the present invention is installed on the insulating mounting plate.

[0036] Figure 8 For the present invention Figure 7 A partial enlarged schematic diagram in the middle.

[0037] Fig. 9 It is a schematic diagram of the overall structure of the outer shielding sheet of the present invention.

[0038] Fig.10 This is a diagram of the insertion loss simulation results of the present invention.

[0039] Fig.11 This is a diagram of the return loss simulation results of the present invention.

[0040] Fig.12 This is a diagram of the near-end crosstalk simulation results of the present invention.

[0041] Fig.13 This is a diagram of the far-end crosstalk simulation results of the present invention.

[0042] Reference numerals:

[0043] 101 insulating mounting plate, 102 tail support block, 103 first high-speed terminal wafer, 104 second high-speed terminal wafer, 105 mounting area, 106 inner shielding sheet, 107 wafer body, 108 high-speed terminal, 109 countersunk hole, 110 protrusion, 111 first through hole, 112 groove structure, 113 wire, 114 first protrusion, 115 UV glue layer, 116 wire-wrapped plastic package, 117 wedge-shaped groove, 118 wedge-shaped structure, 119 hanging platform, 120 hanging hole, 121 first low-speed terminal, 122 positioning protrusion, 123 outer shielding sheet, 124 vertical portion, 125 first spring clip, 126 second spring clip, 127 mounting groove, 128 clearance groove, 129 second low-speed terminal, 130 ground PIN, 131 supporting unit, 132 clearance gap, 133 first guide slope. DETAILED DESCRIPTION

[0044] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0045] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] In the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0048] In the embodiments of the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0049] The disclosure below provides many different embodiments or examples to implement different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present invention. In addition, the embodiments of the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0050] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0051] See also Figure 1-Figure 9 , this embodiment discloses a connector cable assembly, including an insulating mounting plate 101 and a tail support block 102, the insulating mounting plate 101 is provided with a mounting area 105 for mounting a first high-speed terminal wafer piece 103 and a second high-speed terminal wafer piece 108 104;

[0052] Furthermore, the present embodiment further includes a first high-speed terminal wafer 103 and a second high-speed terminal wafer 108 104 both including an inner shielding sheet 106 , a wafer body 107 and a plurality of high-speed terminals 108 disposed on the wafer body 107 ;

[0053] The inner shielding sheet 106 is fitted with the wafer body 107, and the inner shielding sheet 106 and the ground PIN are in close contact by welding;

[0054] Furthermore, in actual use, a countersunk hole 109 is provided on the wafer body 107, and the countersunk hole 109 corresponds to the ground PIN 130 in the high-speed terminal 108. A plurality of protrusions 110 are provided on the inner shielding sheet 106, and the inner shielding sheet 106 is fitted with the wafer body 107. The protrusions 110 provided on the inner shielding sheet 106 pass through the countersunk hole 109 and are in close contact with the ground PIN 130 through laser welding.

[0055] In actual use, the countersunk hole 109 is set just enough to expose the PIN metal surface for welding with the protruding portion 110 of the inner shielding sheet 106;

[0056] It should be noted that in actual use, the countersunk hole may not be provided, but it is only necessary to ensure that the exposed PIN metal surface is welded to the protruding portion 110 of the inner shielding sheet 106 .

[0057] After the first high-speed terminal wafer 103 and the second high-speed terminal 108 wafer 104 are installed in the installation area 105, the tail support block 102 is installed on the insulating installation plate 101 to fix the first high-speed terminal wafer 103 and the second high-speed terminal 108 wafer in the installation area 105 and support the bent wire.

[0058] Furthermore, in actual use, laser welding or resistance welding may be used.

[0059] In this embodiment, a countersunk hole 109 is provided on the wafer body 107, and the countersunk hole 109 corresponds to the ground PIN 130 in the high-speed terminal 108. A plurality of protrusions 110 are provided on the inner shielding sheet 106, and the inner shielding sheet 106 is fitted with the wafer body 107. The protrusions 110 provided on the inner shielding sheet 106 pass through the countersunk hole 109 and are in close contact with the ground PIN 130 by laser welding. The contact between the inner shielding sheet 106 and the ground PIN 130 is achieved by elastic contact and laser welding, which improves the stability during contact. The present invention adopts a structure that uses a shielding sheet to achieve PCIe Gen 6 high-speed transmission performance, and the contact is achieved by elastic contact and laser welding. The contact reliability is excellent and can be fully adapted within the product operating temperature range.

[0060] In this embodiment, the tail support block 102 is also used to support the position of the tail welding wire (bent wire). The welding point will be subjected to force during welding, and the bottom cannot be empty. The tail support block 102 can serve the purpose of support; at the same time, it ensures the sealing of the wire during the plastic packaging process.

[0061] Furthermore, in actual use, four countersunk holes 109 form a group, and four countersunk holes 109 are set under the ground PIN 130 on both sides of each differential pair. The countersunk holes 109 are square holes, exposing the surface of the ground PIN 130, which is convenient for welding and connecting with the protrusion 110 torn and deep-drawn by the inner shielding sheet 106. At the same time, it can also ensure that the inner shielding sheet 106 is in multi-point contact with the ground PIN 130, thereby improving the contact effect.

[0062] Furthermore, in some preferred embodiments, a first through hole 111 is provided on the wafer body 107. The first through hole 111 is located in the middle of the differential pair molding. The first through hole 111 is a square hole, so that the upper and lower surfaces and the inner side surface of the differential pair contact are in contact with the air, thereby ensuring impedance matching at this location.

[0063] Furthermore, the protrusion 110 is formed by tearing and drawing, and is located below each differential pair, and is welded to the ground PIN 130 on both sides of the differential pair to ensure shielding effectiveness.

[0064] Furthermore, in some preferred implementation cases, groove structures 112 are provided on both sides of the tail support block 102, and the groove structures 112 on both sides are staggered, and bent conductors 113 are provided in the grooves. The groove structure 112 is provided on the tail support block 102, and the gap with the high-speed bare wire (conductor 113) is matched, so that the plastic on both sides of the groove structure 112 can be closer to the welding transition end of the high-speed bare wire (conductor 113), so that the impedance of this section is matched.

[0065] Furthermore, the wire 113 is welded to the high-speed terminal 108 .

[0066] Furthermore, in some preferred implementation cases, a plurality of first protrusions 114 corresponding to the groove structure 112 are provided on the inner shielding sheet 106 , the first protrusions 114 are interference fit with the groove structure 112 , and the first protrusions 114 are located below the stripping transition section of the bent wire 113 .

[0067] The first protrusion 114 extending from the inner shielding sheet 106 is in interference fit with the tail support block 102 , and also serves to fix the tail support block 102 .

[0068] The first protrusion 114 on the inner shielding sheet 106 extends below the stripping transition section of the bent wire 113 to ensure impedance matching of this section and provide a shielding structure for the wire 113, thereby optimizing crosstalk performance and ensuring high-speed performance.

[0069] Furthermore, after the wire 113 and the high-speed terminal 108 are welded and fixed with UV glue, the UV glue solidifies to form a UV glue layer 115. The UV glue layer 115 can achieve a better sealing effect.

[0070] Furthermore, in some preferred implementation cases, a wire-wrapped plastic package 116 is also provided on the insulating mounting board 101 , and the wire-wrapped plastic package 116 is used to encapsulate the first high-speed terminal wafer 103 , the second high-speed terminal 108 wafer 104 and the tail support block 102 on the insulating mounting board 101 .

[0071] The insulating mounting plate 101 is provided with a wedge-shaped groove 117 on its side. After the wire-wrapped plastic package 116 is packaged on the insulating mounting plate 101, the wedge-shaped structure 118 formed on the wire-wrapped plastic package 116 fits with the wedge-shaped groove 117. The fixing of the contact piece and the holding force of the wire conductor 113 are ensured during the cooperation.

[0072] Furthermore, a hanging platform 119 is provided on the side of the wafer body 107 , and a hanging hole 120 corresponding to the side hanging platform 119 is provided on the insulating mounting plate 101 .

[0073] The provided hanging hole 120 and the side hanging platform 119 can improve the fastening effect between the wafer body 107 and the insulating mounting plate 101 , and achieve the purpose of double reinforcement under the action of the wedge-shaped structure 118 and the wedge-shaped groove 117 .

[0074] Furthermore, a positioning groove is provided on the tail support block 102, and a positioning protrusion 122 is provided in the installation area 105 of the insulating installation plate 101, and the positioning groove and the positioning protrusion cooperate with each other to realize the positioning of the tail support block 102 during installation.

[0075] In actual use, there is an outer shielding sheet 123 on the edge mounting plate, and the outer shielding sheet 123 can improve the electromagnetic shielding effect during use. The outer shielding sheet 123 includes a vertical portion 124 and a first elastic sheet 125 and a second elastic sheet 126 arranged on both sides of the vertical portion 124, and the first elastic sheet 125 and the second elastic sheet 126 are both bent structures;

[0076] The first elastic piece 125 and the second elastic piece 126 are connected to the vertical portion 124 to form a T-shaped structure as a whole;

[0077] The outer shielding plate 123 is used to be installed on the insulating mounting plate 101. The insulating mounting plate 101 is provided with a mounting groove 127 and a clearance groove 128 connected to the mounting groove 127. The vertical portion 124 is inserted into the mounting groove 127. The first spring piece 125 and the second spring piece 126 are located in the clearance groove 128. The mounting groove 127 is provided with a support unit 131 for moving the vertical portion 124 toward the PIN 130 in the high-speed terminal 108 installed on the insulating mounting plate 101.

[0078] In actual use, it is mainly used to achieve shielding of electromagnetic waves. The support unit 131 not only realizes the fixation of the vertical part 124 in the external shielding sheet 123, but also can support the vertical part 124 and form a support point. Since the first spring piece 125 and the second spring piece 126 are connected to the vertical part 124 to form a T-shaped structure as a whole, the first spring piece 125 and the second spring piece 126 can maintain good deformation ability after contacting the ground PIN 130, so that the first spring piece 125 and the second spring piece 126 can achieve elastic contact with the ground PIN 130 to ensure that the first spring piece 125 and the second spring piece 126 are in close contact with the ground PIN 130; the support point formed by the support unit 131 can enable the external shielding sheet 123 to be fully deformed, which can effectively solve the technical problem that when the shielding sheet contacts the ground PIN 130 in the high-speed terminal 108 in the prior art, the deformation effect is not good after the shielding sheet is fixed, resulting in poor contact effect.

[0079] During use, when the wafer body 107 is mounted on the insulating mounting plate 101, the first spring piece 125 and the second spring piece 126 can make elastic contact with the straight section of the ground PIN 130 in the high-speed terminal 108 on the wafer body 107, and the support unit 131 provides an effective elastic arm length for the elastic deformation of the outer shielding sheet 123, thereby ensuring the reliability of the elastic deformation and the reliability of the contact.

[0080] In actual use, the signal differential pair of the connector is arranged below (on the side) the vertical portion 124, which plays a good shielding role for the electromagnetic waves dissipated outside the signal differential pair connector.

[0081] A clearance gap 132 is formed between the side wall of the clearance groove 128 and the first spring sheet 125 and the second spring sheet 126, and the width of the clearance gap 132 is between 1-2 mm, preferably 2 mm, to ensure that the first spring sheet 125 and the second spring sheet 126 have sufficient elastic deformation to ensure elastic close contact.

[0082] In this embodiment, the supporting unit 131 is a supporting protrusion disposed on the inner wall of the mounting groove 127 .

[0083] In actual use, the width of the supporting ridge is one quarter of the width of the vertical portion 124 of the outer shielding plate 123. This not only ensures sufficient contact surface to fix the vertical portion 124, but also ensures that the vertical portion 124 has good support to ensure elastic deformation of the vertical portion 124.

[0084] Furthermore, the supporting convex strip is located in the middle of the mounting groove 127 , so that the vertical portion 124 of the outer shielding sheet 123 is subjected to a more uniform force when deformation occurs.

[0085] Furthermore, a first guiding inclined surface 133 is provided on the supporting convex strip. The provided first inclined surface can make the outer shielding sheet 123 more convenient to install, and the first guiding inclined surface 133 can play a better guiding role.

[0086] The first spring piece 125 and the second spring piece 126 both include an arc portion and a contact portion connected to the arc portion. The contact portion is used to elastically contact with the PIN 130 in the high-speed terminal 108. The arc portion can achieve better elastic deformation performance.

[0087] Furthermore, in actual use, the vertical portion 124 , the first elastic piece 125 and the second elastic piece 126 are an integrated structure.

[0088] Furthermore, in actual use, the insulating mounting plate 101 is also provided with a first low-speed terminal 121 and a second low-speed terminal 129 .

[0089] In addition, the present invention also discloses a connector cable assembly assembly method, the specific assembly method is as follows:

[0090] Step 1: The high-speed terminal 108 and the wafer body 107 are made into an integrated structure by injection molding to form a first high-speed terminal wafer 103 and a second high-speed terminal 108 wafer 104;

[0091] Step 2: Weld the protrusion 110 on the inner shielding sheet 106 and the ground PIN 130 in the high-speed terminal 108 together by laser welding;

[0092] Step 3: Install the first high-speed terminal wafer 103 and the second high-speed terminal wafer 108 104 on the insulating mounting plate 101;

[0093] Step 4: Install the tail support block 102 on the insulating mounting plate 101 and weld the wire 113;

[0094] Step 5: Curing the welded wire 113 with UV glue;

[0095] Step 6: Use low-pressure injection molding hot melt adhesive to form the wire-wrapped plastic package 116.

[0096] In actual use, an external spring sheet installation step is also included between step 2 and step 3.

[0097] SI simulation is performed on the connector cable assembly disclosed in the embodiment, and the simulation results are as follows:

[0098] See also Fig.10 , IL is the insertion loss, diff1-7 represents the insertion loss of the two rows of terminal channels,

[0099] By reducing the direct connection between the ground pins, the impact of the backflow is reduced, and the insertion loss resonance in the high-frequency band is greatly reduced. At the same time, the reasonable setting of the inner and outer shielding sheets reduces the impact of crosstalk on the insertion loss and ensures the integrity of the connector's high-speed link.

[0100] See also Fig.11 , RL is the return loss, diff1-7 represents the return loss of the two rows of terminal channels, iRL is the time domain cumulative return loss value, and the impedance is controlled within ±5Ω of 85, which can achieve a good transmission matching impedance and reduce the return loss.

[0101] See also Fig.12 , NEXT is the near-end crosstalk, where channel 2 is the victim line and channels 5, 6, and 7 are the attack lines; the reasonable setting of the inner and outer shielding sheets can obtain an effective shielding effect, thereby reducing the crosstalk between the two rows of terminals.

[0102] See also Fig.13 , FEXT is far-end crosstalk, where channel 2 is the victim line, and channels 8 and 10 are the attack lines; the reasonable setting of the inner and outer shielding sheets, as well as the deep drawing structure on the inner shielding sheet have a certain isolation effect on the crosstalk, so that the far-end crosstalk can be better suppressed.

[0103] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0104] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A connector cable assembly, comprising an insulating mounting plate, the insulating mounting plate being provided with mounting areas for mounting a first high-speed terminal wafer and a second high-speed terminal wafer; Features: Also includes the tail support block, The first high-speed terminal wafer and the second high-speed terminal wafer each include an inner shielding sheet, a wafer body, and a plurality of high-speed terminals arranged on the wafer body; The inner shielding sheet is fitted with the wafer body, and the inner shielding sheet is in close contact with the ground PIN by welding; After the first high-speed terminal wafer and the second high-speed terminal wafer are installed in the installation area, the tail support block is installed on the insulating installation plate to fix the first high-speed terminal wafer and the second high-speed terminal wafer in the installation area, and the high-speed terminals are connected with bent wires.

2. A connector cable assembly according to claim 1, characterized in that: The wires are welded to the high-speed terminals.

3. A connector cable assembly according to claim 2, characterized in that: A plurality of first protrusions corresponding to the groove structure are arranged on the inner shielding sheet. The first protrusions are interference fit with the groove structure, and the first protrusions are located below the bending wire stripping transition section.

4. A connector cable assembly according to claim 2, characterized in that: After the wire and the high-speed terminal are welded, they are fixed with UV glue, and the UV glue solidifies to form a UV glue layer.

5. The connector cable assembly according to any one of claims 1 to 4, characterized in that: A wire-wrapped plastic package is also provided on the insulating mounting board, and the wire-wrapped plastic package is used to package the first high-speed terminal wafer, the second high-speed terminal wafer and the tail support block on the insulating mounting board.

6. A connector cable assembly according to claim 5, characterized in that: A wedge-shaped groove is arranged on the side of the insulating mounting plate. After the wire-wrapped plastic-encapsulated body is encapsulated on the insulating mounting plate, the wedge-shaped structure formed on the wire-wrapped plastic-encapsulated body fits with the wedge-shaped groove.

7. The connector cable assembly according to claim 5, characterized in that: A hanging platform is arranged on the side of the wafer sheet body, and a hanging hole corresponding to the hanging platform is arranged on the insulating mounting plate.

8. The connector cable assembly according to claim 5, characterized in that: A positioning groove is arranged on the tail support block, and a positioning protrusion is arranged in the installation area of ​​the insulating installation plate, and the positioning groove and the positioning protrusion cooperate with each other.

9. The connector cable assembly according to claim 1, characterized in that: Groove structures are arranged on both sides of the tail support block, and the groove structures on both sides are arranged in a staggered manner, and the bent conductive wires are arranged in the grooves.

10. A method for assembling a connector cable assembly, characterized in that: The connector cable assembly is a connector cable assembly as described in claim 6, and the specific assembly method is as follows: Step 1: The high-speed terminal and the wafer body are made into an integrated structure by injection molding to form a first high-speed terminal wafer and a second high-speed terminal wafer; Step 2: Use laser welding to weld the protrusion on the inner shielding sheet and the ground PIN in the high-speed terminal together; Step 3: Install the first high-speed terminal wafer and the second high-speed terminal wafer on the insulating mounting plate; Step 4: Install the tail support block on the insulating mounting plate and weld the wires; Step 5: Use UV glue to cure the welded wires; Step 6: Use low-pressure injection molding hot melt adhesive to form a wire-wrapped plastic package.

Images