Board line switching structure, high-speed connecting device and vehicle machine system

Abstract

The embodiment of the invention relates to the technical field of automotive electronics, in particular to a board line switching structure, a high-speed connecting device and a vehicle machine system. According to the invention, the compensation blocks are arranged in the signal line and the anti-pad area, so that the problems of impedance mismatch and energy loss of a transmission link are solved, the impedance mismatch of the pin of the high-speed connector can be effectively controlled within a set range, and meanwhile, the performance requirements of signal integrity and electromagnetic compatibility of the signal link of the high-speed connector are ensured; a good solution is provided for high-speed connector PCB impedance control and signal integrity requirements.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of automotive electronic technology, and specifically to a board-to-line switching structure, a high-speed connection device, and a vehicle computer system. Background Art

[0002] As the frequency of digital signals and RF systems continues to rise, high-speed connectors are increasingly used in RF transmission, antenna access, and high-speed signal transmission. However, when high-speed connectors are used on PCB boards, it is very difficult and uncontrollable to control the transmission characteristic impedance of signal pins, which causes impedance mismatch in the transmission link, resulting in energy loss and the risk of affecting signal integrity and electromagnetic compatibility. As the frequency of high-frequency antennas and high-frequency digital signals increases, the problems caused by this mismatch will become more obvious. Summary of the invention

[0003] In view of the above problems, the embodiments of the present invention provide a board-to-line switching structure, a high-speed connection device and a vehicle-mounted system, which solve the problem that when a high-speed connector is used on a PCB board, the transmission characteristic impedance control of the signal pin is very difficult and uncontrollable, causing impedance mismatch in the transmission link, thereby causing energy loss and the risk of affecting signal integrity and electromagnetic compatibility. As the frequency of high-frequency antennas and high-frequency digital signals increases, the problem caused by the mismatch will become more obvious.

[0004] In a first aspect, the present invention provides a board-line transfer structure, comprising a board body, the board body is provided with a signal hole, a signal line, and an anti-pad, the anti-pad is provided on the outer peripheral side of the signal hole, the signal line is provided with a first line end, a second line end, and a line body connecting the first line end and the second line end; the first line end passes through the anti-pad and is communicatively connected with the signal hole; Wherein, the board body is further provided with a compensating member, the compensating member is located on the anti-pad, and the compensating member covers the line body of the signal line.

[0005] In some optional embodiments, the cross-section of the compensating member is defined as a first surface, the first surface is a polygonal structure, and the first surface is symmetrical along a line.

[0006] In some optional embodiments, the first surface has a first connecting line and a second connecting line, the first connecting line is arranged adjacent to the first line end, and the second connecting line is arranged far away from the second line segment; the width of the first connecting line is greater than or equal to three times the width of the line body, the width of the second connecting line is greater than or equal to three times the width of the first connecting line, and the distance between the first connecting line and the second connecting line is the radius of the anti-pad minus the length of the first line end.

[0007] In some optional embodiments, the compensating member is copper.

[0008] In some optional embodiments, the anti-pad includes a main area and an extended area, the extended area is coaxially arranged with the main area, and the extended area is connected and arranged on the outer peripheral side of the main area.

[0009] In some optional embodiments, the board body is provided with at least one fixing pad, and the fixing pad is arranged outside the anti-pad.

[0010] In some optional embodiments, the number of the fixed pads is 4, and the 4 fixed pads are equidistantly distributed on the outer peripheral side of the anti-pad.

[0011] In a second aspect, the present invention provides a high-speed connection device, including a PCB board and a connector, wherein the PCB board is provided with the above-mentioned board-line transfer structure, the signal pin of the connector is connected to the signal hole of the board-line transfer structure, and the fixed pin of the connector is connected to the fixed pad of the board-line transfer structure.

[0012] In some optional embodiments, the connector is fixed to the board-line transition structure by welding.

[0013] In a third aspect, the present invention provides a vehicle system, including a microcontroller and the above-mentioned high-speed connection device, wherein the microcontroller is arranged on the PCB board, and the microcontroller is connected to the connector at high speed via a signal line.

[0014] Compared with the prior art, the beneficial effect of the present invention is that the present invention solves the problems of impedance mismatch and energy loss in the transmission link by setting compensation blocks in the signal line and anti-pad area, and can effectively control the impedance mismatch of the high-speed connector pin within a set range, while also ensuring the signal integrity and electromagnetic compatibility performance requirements of its signal link, providing a good solution for high-speed connector PCB impedance control and its signal integrity requirements.

[0015] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings: Figure 1 The schematic diagram of the structure of the plate-line switching structure provided in Example 1 of the present invention is shown; Figure 2An enlarged schematic diagram of a signal hole, a signal line, and an anti-pad according to Embodiment 1 of the present invention is shown; Figure 3 A schematic diagram of the region of the anti-pad according to Embodiment 1 of the present invention is shown; Figure 4 A schematic structural diagram of a high-speed connection device according to Embodiment 2 of the present invention is shown; Figure 5 The TDR test curve diagram of Example 2 provided by the present invention is shown; Figure 6 A schematic structural diagram of a vehicle system according to Embodiment 3 of the present invention is shown.

[0017] 1. Main board; 2. Signal hole; 3. Signal line; 4. Anti-pad; 5. Compensation part; 6. Fixed pad; 41. Main area; 42. Extension area; 100. Board-line transfer structure; 200. Connector; 210. Signal pin; 220. Fixed pin; 300. PCB board. DETAILED DESCRIPTION

[0018] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0019] For high-speed signals and radio frequency signals, it is necessary to ensure the continuity of impedance on the signal transmission path to avoid large reflections of the signal. The impedance control of high-speed connectors generally requires that the impedance be adapted within 50 ohms ± 10 ohms at the connector and PCB welding interface, which can be considered to have good transmission performance. In order to ensure that the high-speed connector pins of this patent invention reach the target impedance of 50 ± 10Ω at the PCB board end, this patent uses transmission line theory to analyze the high-speed connector pin pads, and uses electromagnetic simulation tools such as ANSYS HFSS (High Frequency Structure Simulator) to assist in simulation design and verification of its characteristic impedance, transmission and reflection coefficients.

[0020] The principle of TDR testing characteristic impedance is that when a signal is transmitted along a certain transmission path and impedance changes occur in the transmission path, part of the signal will be reflected and the other part will continue to be transmitted along the transmission path. TDR calculates the impedance change by measuring the voltage amplitude of the reflected wave. At the same time, the position of the impedance change point in the transmission path is calculated based on the time from the reflection point to the incident point of the test.

[0021] The board-line switching structure, high-speed connection device and vehicle-mounted system of the present invention are specifically described in the following embodiments: Embodiment 1: Figure 1-3 The present invention shows an embodiment of a board-line transfer structure 100, which can be a part of a PCB board 300 or can be combined with the PCB board 300 by an electrical connection. The board-line transfer structure 100 can realize a high-speed connection between the PCB board 300 and the connector 200. Specifically, the board-line transfer structure 100 includes a board body, on which a signal hole 2, a signal line 3, and an anti-welding pad 4 are provided, the anti-welding pad 4 is provided on the outer peripheral side of the signal hole 2, the signal line 3 is provided with a first line end, a second line end, and a line body connecting the first line end and the second line end; the first line end passes through the anti-welding pad 4 and is communicatively connected with the signal hole 2; in this embodiment, the first line end of the signal line 3 is connected to the signal hole 2 and is communicatively connected with the external connector 200 through the signal hole 2, and the second line end of the signal line 3 is connected to a functional area on the PCB board 300, wherein the functional area can be a microcontroller.

[0022] In the above scheme, the present application specifically provides a compensating member 5 on the board, the compensating member 5 is located on the anti-pad 4, and the compensating member 5 covers the line body of the signal line 3. The problem of impedance mismatch and energy loss in the transmission link is solved, and the impedance mismatch of the pin of the high-speed connector 200 can be effectively controlled within the set range. At the same time, the signal integrity and electromagnetic compatibility performance requirements of its signal link are also guaranteed, providing a good solution for the impedance control of the high-speed connector 200 PCB and its signal integrity requirements.

[0023] Specifically, firstly, the impedance control of the board-line switching structure 100 must increase the design of the anti-pad 4, that is, the clearance processing in the anti-pad 4 area of ​​all layers of the PCB, so the existence of the anti-pad 4 area also causes the routing area to lose the ground reference layer, which will increase the corresponding characteristic impedance; by designing the reference layer compensation block of the anti-pad 4 of the present invention, this impedance mismatch problem can be effectively improved. The compensation component 5 can be set in the reference layer of the anti-pad 4 routing, or the compensation component 5 and the signal line 3 are set in the same layer.

[0024] Since the compensating member 5 is located in the plate structure, the cross section of the compensating member 5 can be defined as a first surface, and the first surface is a polygonal structure and the first surface is symmetrical along the line body. The first surface can be a multi-deformation structure such as a trapezoid, a triangle, a square, a prism, a hexagon, a combination of figures, etc. The first surface can be symmetrically arranged along the line body with the line body as the center line. The compensating member 5 is copper.

[0025] In the above embodiment, the first surface can be a combination of a square and a trapezoidal structure, see the attached drawings. The first surface has a first connecting line and a second connecting line, the first connecting line is adjacent to the first line end, the second connecting line is far away from the second line segment, and the first connecting line and the second connecting line are connected and enclosed to form a compensation member 5 to improve this impedance mismatch problem. In a specific example, the width of the first connecting line is greater than or equal to three times the width of the line body, the width of the second connecting line is greater than or equal to three times the width of the first connecting line, and the distance between the first connecting line and the second connecting line is the radius of the anti-pad 4 minus the length of the first line end. For details, see Figure 2 , the minimum width of the compensation part 5 is the width B of the first connecting line. The width B of the first connecting line is ≥ 3 times the width of the signal line 3. For example, if the width of the line is 0.2mm, 50Ω corresponds to the width of the first connecting line = 0.6mm; the width A of the second connecting line is ≥ 3 times the width B of the first connecting line, and the width of the second connecting line is 1.8mm. The length of the first line end can be 0.125mm, and the length C of the first line end is the minimum safe distance from the signal line 3 to the hole ring, that is, the minimum distance of the PCB process capability. The distance D between the first connecting line and the second connecting line is the radius of the anti-pad 4 minus the length of the first line end, that is, when the radius of the anti-pad 4 is 1.6mm, the distance between the first connecting line and the second connecting line is 1.6mm-0.125mm=4.75mm.

[0026] In some optional embodiments, see Figure 3 , the anti-pad 4 includes a main area 41 and an extended area 42, the extended area 42 is coaxially arranged with the main area 41, and the extended area 42 is connected and arranged on the outer peripheral side of the main area 41. In this embodiment, the present application adds an anti-pad 4 design, that is, the anti-pad 4 area of ​​all layers of PCB is cleared, and the extended area 42 is added. By adding the extended area 42, it is avoided that the impedance of the board-to-line switching structure 100 will be too small after adding the compensation member 5, and the board-to-line switching structure 100 is pre-compensated by the extended area 42, so that the final impedance is close to the target impedance.

[0027] In some optional embodiments, the board body is provided with at least one fixed pad 6, and the fixed pad 6 is provided outside the anti-pad 4. The number of the fixed pads 6 is 4, and the 4 fixed pads 6 are equidistantly distributed on the outer peripheral side of the anti-pad 4. In this embodiment, the fixed pad 6 is used to fix the connector 200, and the 4 pads can be equidistantly arranged at the four corners of the anti-pad 4, and fixed by welding with the fixed pin 220.

[0028] Embodiment 2: Figure 4-5The present invention shows an embodiment of a high-speed connection device, which specifically includes a PCB board 300 and a connector 200. The PCB board 300 is provided with the board-line transfer structure 100 of Example 1, the signal pin 210 of the connector 200 is connected to the signal hole 2 of the board-line transfer structure 100, and the fixed pin 220 of the connector 200 is connected to the fixed pad 6 of the board-line transfer structure 100. The connector 200 is fixed to the board-line transfer structure 100 by welding.

[0029] In a specific example, the transmission performance of the impedance of the high-speed connector 200 on the PCB board 300 is affected by many factors such as the size of the pad and the anti-pad 4, the type of the transfer transmission line, the stacking design, the drilling process and the dielectric coefficient of the PCB substrate. This patent does not elaborate on the conventional and foreseeable processing methods in the industry, but only explains the invention points that are different from the current ones in the industry, and uses the typical single-PIN Fakra video connector 200 as an example to explain. The application design methods of other multi-PIN connectors 200 are similar, see Figure 1 It is the basic information of the layout and routing of the pins of the corresponding PCB stack and connector 200. The test value of the transmission signal frequency of the connector 200 can be 1 GHz.

[0030] Analysis of impedance mismatch points at the PCB 300 end of Fakra video connector 200: After using simulation software to analyze the local area TDR impedance test from connector 200 to PCB 300, the first impedance mismatch point between PCB 300 and connector 200 is the impedance value of signal pin 210 of connector 200, which is close to 60Ω, exceeding the target impedance of 50Ω. The second impedance mismatch point between PCB 300 and connector 200 is the line body of signal line 3 in the anti-pad 4 of signal pin 210 of connector 200, with an impedance value of close to 35Ω, which is lower than the target impedance of 50Ω.

[0031] The present invention firstly increases the design of the anti-pad 4 for the impedance control of the signal pin 210 of the connector 200, and performs ground clearance processing on the anti-pad 4 area of ​​all layers of the PCB. Therefore, the existence of the anti-pad 4 area also causes the routing area to lose the ground reference layer, thereby increasing the corresponding characteristic impedance.

[0032] See also Figure 5, Part 1 is the impedance curve of the existing PCB trace, and Part 2 is the impedance curve of the PCB trace of the present invention. The impedance mismatch of the existing PCB trace is 60.32Ω after simulated TDR testing. By designing the compensation block of the reference layer of the anti-pad 4 of the present invention, this impedance mismatch problem can be effectively improved. The impedance of the present invention is controlled at 52.51Ω. The specific design parameter requirements of the reference layer compensation block are: the width of the first connecting line is greater than or equal to three times the width of the line body, the width of the second connecting line is greater than or equal to three times the width of the first connecting line, and the distance between the first connecting line and the second connecting line is the radius of the anti-pad 4 minus the length of the first line end. Specifically, the minimum width of the compensation part 5 is the width of the first connecting line, and the width of the first connecting line is ≥3 times the line body width of the signal line 3. For example, if the line body width is 0.2mm, 50Ω corresponds to the width of the first connecting line = 0.6mm; the width of the second connecting line is ≥3 times the width of the first connecting line, and the width of the second connecting line is 1.8mm. The length of the first wire end can be 0.125mm, and the length of the first wire end is the minimum safe distance from the signal wire 3 to the hole ring, that is, the minimum distance of the PCB process capability. The distance between the first connecting wire and the second connecting wire is the radius of the anti-pad 4 minus the length of the first wire end, that is, when the radius of the anti-pad 4 is 1.6mm, the distance between the first connecting wire and the second connecting wire is 1.6mm-0.125mm=4.75mm.

[0033] In the early stage of the present invention, in order to meet the target impedance of the anti-pad 4 routing, a reference layer compensation block was added, so the existence of this compensation block will reduce the impedance of the connector 200 signal pin 210 by about 2Ω. At this time, if the anti-pad 4 diameter D=3mm is designed with a target impedance of 50Ω, the final impedance will be 50Ω smaller, about 48Ω. Therefore, when the present invention designs the impedance model for the connector 200 pin, it is necessary to pre-compensate the reference layer compensation block for impedance. When the TDR impedance simulation pre-compensation value is 52Ω, the anti-pad 4 diameter D=3.2mm is added with a reference layer compensation block, and the final impedance is close to the target impedance of 50Ω. It meets the impedance matching requirements.

[0034] Embodiment 3: Figure 6 The present invention shows an embodiment of a vehicle system, which specifically includes a microcontroller and a high-speed connection device of embodiment 2. The microcontroller is arranged on the PCB board 300, and the microcontroller is connected to the connector 200 at a high speed through a signal line 3. Figure 6The microcontroller can be a functional device fixed on the PCB board 300. The microcontroller is connected to the board-line switching structure 100 through the signal line 3 of the PCB board 300, and then performs high-speed transmission with the connector 200 through the board-line switching structure 100. The present invention solves the problems of impedance mismatch and energy loss in the transmission link by setting a compensation block in the signal line 3 and the anti-pad 4 area, and can effectively control the impedance mismatch of the high-speed connector 200 pin within a set range. At the same time, it also ensures the signal integrity and electromagnetic compatibility performance requirements of its signal link, and provides a good solution for the high-speed connector 200 PCB impedance control and signal integrity requirements.

[0035] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system or other device. In addition, the embodiments of the present invention are not directed to any particular programming language.

[0036] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0037] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0038] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A plate-line switching structure, characterized in that: The invention comprises a plate body, wherein the plate body is provided with a signal hole (2), a signal line (3), and an anti-welding pad (4), wherein the anti-welding pad (4) is provided on the outer peripheral side of the signal hole (2), and the signal line (3) is provided with a first line end, a second line end, and a line body connecting the first line end and the second line end; the first line end passes through the anti-welding pad (4) and is communicatively connected with the signal hole (2); The board body is further provided with a compensating member (5), the compensating member (5) is located on the anti-soldering pad (4), and the compensating member (5) covers the body of the signal line (3).

2. A plate-line switching structure according to claim 1, characterized in that: The cross section of the compensating member (5) is defined as a first surface, the first surface is a polygonal structure and the first surface is symmetrical along a line.

3. A plate-line switching structure according to claim 2, characterized in that: The first surface has a first connecting line and a second connecting line, the first connecting line is arranged adjacent to the first line end, and the second connecting line is arranged away from the second line segment; the width of the first connecting line is greater than or equal to three times the width of the line body, the width of the second connecting line is greater than or equal to three times the width of the first connecting line, and the distance between the first connecting line and the second connecting line is the radius of the anti-welding pad (4) minus the length of the first line end.

4. A plate-line switching structure according to claim 3, characterized in that: The compensating member (5) is made of copper.

5. A plate-line switching structure according to any one of claims 1 to 4, characterized in that: The anti-solder pad (4) comprises a main area (41) and an extended area (42), wherein the extended area (42) is coaxially arranged with the main area (41), and the extended area (42) is connected to the outer peripheral side of the main area (41).

6. A plate-line switching structure according to claim 1, characterized in that: The plate body is provided with at least one fixed pad (6), and the fixed pad (6) is arranged outside the anti-pad (4).

7. A plate-line switching structure according to claim 6, characterized in that: The number of the fixed pads (6) is four, and the four fixed pads (6) are equidistantly distributed on the outer peripheral side of the anti-pad (4).

8. A high-speed connection device, characterized in that: The invention comprises a PCB board (300) and a connector (200), wherein the PCB board is provided with a board-to-line transfer structure (100) according to any one of claims 1 to 7, a signal pin (210) of the connector (200) is connected to a signal hole of the board-to-line transfer structure (100), and a fixed pin (220) of the connector (200) is connected to a fixed pad of the board-to-line transfer structure (100).

9. A high-speed connection device according to claim 8, characterized in that: The connector (200) is fixed on the board-line switching structure (100) by welding.

10. A vehicle computer system, characterized in that: The invention comprises a microcontroller (400) and the high-speed connection device according to claim 9, wherein the microcontroller (400) is arranged on a PCB board (300) of the high-speed connection device, and the microcontroller (400) is connected to a connector (200) at high speed via a signal line.

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