Picosecond laser capable of inhibiting heat effect

Abstract

The invention relates to the technical field of lasers, and discloses a picosecond laser capable of inhibiting heat effect, which comprises a shell, the inner bottom of the shell is fixedly connected with a picosecond laser, the top of the picosecond laser is fixedly provided with a top water tank, and the side wall of the picosecond laser is fixedly provided with a first side water tank and a second side water tank. Heat conduction structures are arranged between the top water tank, the first side water tank and the second side water tank and the picosecond laser, a radiator is arranged on the rear portion of the picosecond laser, a cooling fan is arranged on the rear portion of the radiator, a water passing plate is arranged in the radiator, and a water pump is arranged in the radiator. According to the picosecond laser, heat generated by the laser generating device is transmitted to the top water tank through the top copper plate, the first side copper plate and the second side copper plate, so that the problem that the working stability and reliability of the laser are reduced due to the fact that a heat effect is generated when a traditional picosecond laser works is solved.

Description

Technical Field

[0001] The invention relates to the technical field of lasers, in particular to a picosecond laser capable of suppressing thermal effects. Background Art

[0002] Picosecond laser is an advanced laser device. Its pulse duration reaches the picosecond level, 1 picosecond equals 10-12 seconds. This extremely short pulse width gives picosecond lasers unique advantages. In the field of material processing, picosecond lasers can cut and drill materials with extremely high precision. For example, in the electronics industry, it can be used for fine processing of circuit boards. Because the pulse time is short, the heat-affected area it produces on the surrounding materials is extremely small, which can effectively avoid thermal damage such as thermal deformation and microcracks in the material, greatly improving the processing quality. In the field of medical beauty, picosecond lasers also shine. It can be used to remove skin pigmentation such as tattoos and spots. Through high-energy picosecond pulse lasers, pigment particles can be instantly broken up and then naturally metabolized and excreted from the body by the human immune system. Its treatment has high precision, fast recovery, and reduces the risk of damage to normal skin tissue. The emergence of picosecond lasers has promoted the development of many fields. With the continuous advancement of technology, it is expected to play a key role in more high-tech industries and medical applications.

[0003] Traditional picosecond lasers will produce thermal effects when working, which may cause thermal deformation or thermal stress in the optical elements, laser media, etc. inside the laser, thereby affecting the output performance of the laser and further reducing the stability and reliability of the laser operation. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a picosecond laser that suppresses thermal effects, which solves the problem that traditional picosecond lasers will produce thermal effects when working. The thermal effects may cause thermal deformation or thermal stress in the optical elements, laser media, etc. inside the laser, thereby affecting the output performance of the laser, and further resulting in reduced stability and reliability of the laser operation.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: a picosecond laser for suppressing thermal effects, comprising a shell, the inner bottom of the shell is fixedly connected to the picosecond laser, the top of the picosecond laser is fixedly provided with a top water tank, the side wall of the picosecond laser is fixedly provided with a first side water tank and a second side water tank, a heat conducting structure is provided between the top water tank, the first side water tank and the second side water tank and the picosecond laser, a radiator is provided at the rear of the picosecond laser, a cooling fan is provided at the rear of the radiator, a water plate is provided inside the radiator, a water pump is provided inside the radiator, an input end of the water pump is connected to the right side of the water plate, an output end of the water pump is connected to the input end of the second side water tank through a third water pipe, the output end of the second side water tank is connected to the input end of the top water tank through a fourth water pipe, the output end of the top water tank is connected to the input end of the first side water tank through the first water pipe, and the output end of the first side water tank is connected to the input end of the radiator through the second water pipe.

[0006] Preferably, the heat-conducting structure includes a top copper plate, a first side copper plate and a second side copper plate, the top copper plate is located between the top water tank and the picosecond laser, the first side copper plate is located between the first side water tank and the picosecond laser, and the second side copper plate is located between the second side water tank and the picosecond laser.

[0007] Preferably, the position of the second water pipe is higher than that of the third water pipe.

[0008] Preferably, the side walls of the top water tank, the second side water tank and the first side water tank are all provided with first air guide grooves.

[0009] Preferably, a heat dissipation opening is provided on the side wall of the shell.

[0010] Preferably, an air guide bowl is provided on the side of the inner wall of the shell away from the cooling fan, a through hole is provided on the side of the inner wall of the shell away from the cooling fan, the through hole is located at the center of the air guide bowl, a light guide is fixedly connected to the side wall of the picosecond laser, the light guide passes through the through hole, the diameter of the light guide is smaller than the diameter of the through hole, the outer wall of the shell is fixedly connected to one end of a conduit, the conduit is located at the center of the air guide bowl, and the light guide is located inside the conduit.

[0011] Preferably, the other end of the conduit is fixedly connected to the rear part of the protective shell through a connecting seat, a through hole is provided at the rear part of the protective shell, the light guide passes through the through hole and passes through a connector to be connected to the light output head, the diameter of the through hole is larger than the diameter of the light guide, and a ventilation duct is provided inside the connector.

[0012] Preferably, a cooling strip is provided on the outer wall of the light guide line, a second air guide groove is opened on the outer wall of the cooling strip, and the cooling strip is located inside the protective shell.

[0013] Preferably, a handle is fixedly connected to the top of the shell.

[0014] Preferably, a water delivery valve is fixedly connected to the top of the radiator.

[0015] Working principle: When the laser is working, the first side copper plate, the second side copper plate and the top copper plate quickly conduct the heat generated by the laser generating device to the top water tank, the first side water tank and the second side water tank, start the cooling fan to transport the low-temperature air to the inside of the shell and the surface of the heat exchanger, thereby reducing the coolant temperature inside the water plate, start the water pump to transport the low-temperature coolant from the third water pipe to the inside of the second side water tank, and then through the fourth water pipe to transport the coolant to the inside of the top water tank, and then through the first water pipe to the inside of the first side water tank, and then through the second water pipe to transport the coolant that has absorbed the heat to the inside of the heat exchanger, and then flow through the water plate and cool through the cooling fan, thereby forming a cycle, part of the airflow generated by the cooling fan flows through the first air guide groove to the middle of the guide light, and then through the inside of the duct to the inside of the protective shell, when the airflow flows through the surface of the cooling strip, it will exchange heat for the end section of the guide light, and finally the airflow will be sprayed to the surface of the processed object through the ventilation duct in the middle of the connector, thereby cooling the processing position.

[0016] The present invention provides a picosecond laser that suppresses thermal effects. It has the following beneficial effects:

[0017] 1. In the present invention, the heat generated by the laser generating device is transported to the top water tank, the first side water tank and the second side water tank through the top copper plate, the first side copper plate and the second side copper plate, the external low-temperature air is transported to the surface of the water plate through the cooling fan to reduce the temperature of the coolant inside the heat exchanger, the low-temperature coolant is transported to the inside of the second side water tank through the water pump, and the coolant is transported to the top water tank and the first side water tank through the fourth water pipe and the first water pipe, thereby taking away the heat transferred by the top copper plate, the first side copper plate and the second side copper plate, thereby improving the thermal effect generated by the traditional picosecond laser during operation. The thermal effect may cause thermal deformation or thermal stress of the optical elements, laser media, etc. inside the laser, thereby affecting the output performance of the laser, and then causing the problem of reduced stability and reliability of the laser operation.

[0018] 2. In the present invention, the air flow is gathered to the center of the circle through the air guide bowl, and then the air flow is transported to the inside of the protective shell through the duct, and then the air flow is blown to the surface of the processed object through the ventilation duct opened inside the connector, thereby reducing the temperature of the processed part of the object, thereby reducing the thermal effect generated by the object.

[0019] 3. In the present invention, the heat dissipation fan can simultaneously dissipate heat for the heat exchanger to reduce the thermal effect generated by the laser generating device. At the same time, the airflow can be guided to the inside of the protective shell through the duct and then blown out from the ventilation duct to reduce the thermal effect on the surface of the object. In this way, the heat dissipation fan can be efficiently utilized to save energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the rear three-dimensional structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the cross-section internal structure of the shell of the present invention;

[0022] Figure 3 It is a schematic diagram of the local installation structure of the top water tank and the second side water tank of the present invention;

[0023] Figure 4 It is a schematic diagram of the local structure of the top water tank of the present invention;

[0024] Figure 5 It is a schematic diagram of the partial three-dimensional structure of the protective shell of the present invention;

[0025] Figure 6 It is a schematic diagram of the cross-section internal structure of the protective shell of the present invention.

[0026] Among them, 1. protective shell; 2. duct; 3. handle; 4. shell; 5. heat dissipation port; 6. cooling fan; 7. air guide bowl; 8. light guide line; 9. top water tank; 10. first side water tank; 11. picosecond laser; 12. radiator; 13. first water pipe; 14. top copper plate; 15. first side copper plate; 16. second water pipe; 17. water valve; 18. water pass plate; 19. third water pipe; 20. first air guide slot; 21. second side copper plate; 22. ventilation duct; 23. connector; 24. light outlet; 25. connector seat; 26. cooling strip; 27. second air guide slot; 28. second side water tank; 29. ​​fourth water pipe. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Embodiment 1:

[0029] Please see attached Figure 1 -Attached Figure 6The embodiment of the present invention provides a picosecond laser for suppressing thermal effects, including a housing 4, a picosecond laser 11 is fixedly connected to the inner bottom of the housing 4, a top water tank 9 is fixedly arranged on the top of the picosecond laser 11, a first side water tank 10 and a second side water tank 28 are fixedly arranged on the side wall of the picosecond laser 11, a heat conducting structure is arranged between the top water tank 9, the first side water tank 10 and the second side water tank 28 and the picosecond laser 11, a radiator 12 is arranged at the rear of the picosecond laser 11, and a cooling fan 6 is arranged at the rear of the radiator 12, A water pass plate 18 is provided inside the radiator 12, and a water pump is provided inside the radiator 12. The input end of the water pump is connected to the right side of the water pass plate 18, and the output end of the water pump is connected to the input end of the second side water tank 28 through the third water pipe 19. The output end of the second side water tank 28 is connected to the input end of the top water tank 9 through the fourth water pipe 29. The output end of the top water tank 9 is connected to the input end of the first side water tank 10 through the first water pipe 13, and the output end of the first side water tank 10 is connected to the input end of the radiator 12 through the second water pipe 16.

[0030] Specifically, the shell 4 can protect the internal structure, the picosecond laser 11 can generate a laser beam, the top water tank 9 can take away the heat from the top of the picosecond laser 11, the first side water tank 10 and the second side water tank 28 can take away the heat from the side wall of the picosecond laser 11, the radiator 12 can reduce the temperature of the coolant, the cooling fan 6 can blow the external low-temperature air to the radiator 12, the water plate 18 can allow the coolant to flow, and then the low-temperature air passes through the large-area water plate 18 to reduce the temperature of the coolant, the water pump can promote the flow of the coolant, and the third water pipe 19 can cool the coolant. The cooling liquid can be transported to the inside of the second side water tank 28, and the heat on the right side of the picosecond laser 11 can be taken away through the second side water tank 28. The cooling liquid can be transported to the inside of the top water tank 9 through the fourth water pipe 29, and the heat on the top of the picosecond laser 11 can be taken away through the top water tank 9. The cooling liquid can be transported to the inside of the first side water tank 10 through the first water pipe 13, and the heat on the left side of the picosecond laser 11 can be taken away through the first side water tank 10. The cooling liquid in the first side water tank 10 can be transported back to the inside of the radiator 12 through the second water pipe 16, thereby continuously reducing the heat of the picosecond laser 11 through the cooling liquid, thereby effectively suppressing the generation of thermal effects.

[0031] Please see attached Figure 2 -Attached Figure 4The heat-conducting structure includes a top copper plate 14, a first side copper plate 15 and a second side copper plate 21. The top copper plate 14 is located between the top water tank 9 and the picosecond laser 11, the first side copper plate 15 is located between the first side water tank 10 and the picosecond laser 11, and the second side copper plate 21 is located between the second side water tank 28 and the picosecond laser 11.

[0032] Specifically, the top copper plate 14 , the first side copper plate 15 and the second side copper plate 21 can play a role in rapid heat conduction, so that the heat generated by the picosecond laser 11 can be efficiently transported to the top water tank 9 , the first side water tank 10 and the second side water tank 28 .

[0033] Please see attached Figure 1 -Attached Figure 3 , the position of the second water pipe 16 is higher than the position of the third water pipe 19.

[0034] Specifically, since the density of hot water is greater than that of cold water, the second water pipe 16 is positioned higher than the third water pipe 19, thereby being able to output low-temperature coolant.

[0035] Please see attached Figure 1 -Attached Figure 3 The side walls of the top water tank 9 , the second side water tank 28 and the first side water tank 10 are all provided with first air guide grooves 20 .

[0036] Specifically, the first air guide groove 20 can increase the surface areas of the top water tank 9 , the second side water tank 28 and the first side water tank 10 , while allowing excess air to smoothly reach the interior of the air guide bowl 7 .

[0037] Please see attached Figure 1 -Attached Figure 3 A heat dissipation port 5 is provided on the side wall of the shell 4 .

[0038] Specifically, the heat accumulated in the inner space of the housing 4 can be effectively discharged through the heat dissipation opening 5 .

[0039] Please see attached Figure 1 -Attached Figure 5 An air guide bowl 7 is provided on the inner wall of the shell 4 on the side away from the cooling fan 6, a through hole is provided on the inner wall of the shell 4 on the side away from the cooling fan 6, the through hole is located at the center of the air guide bowl 7, a light guide 8 is fixedly connected to the side wall of the picosecond laser 11, the light guide 8 passes through the through hole, the diameter of the light guide 8 is smaller than the diameter of the through hole, the outer wall of the shell 4 is fixedly connected to one end of the conduit 2, the conduit 2 is located at the center of the air guide bowl 7, and the light guide 8 is located inside the conduit 2.

[0040] Specifically, the low-temperature airflow blown by the cooling fan 6 can be concentrated in the middle of the air guide bowl 7 through the air guide bowl 7, and the through hole opened on the side of the inner wall of the shell 4 away from the cooling fan 6 can play the role of outputting the guide light 8. The guide light 8 can play the role of outputting the laser over a long distance. The diameter of the guide light 8 is smaller than the diameter of the through hole, so that the airflow concentrated in the middle of the air guide bowl 7 can pass through. The duct 2 can protect the guide light 8 and at the same time can play the role of conveying the airflow.

[0041] Please see attached Figure 1 -Attached Figure 5 The other end of the conduit 2 is fixedly connected to the rear end of the protective shell 1 through a connecting seat 25. A through hole is provided at the rear end of the protective shell 1. The light guide 8 passes through the through hole and passes through a connector 23 to be connected to a light output head 24. The diameter of the through hole is larger than the diameter of the light guide 8. A ventilation duct 22 is provided inside the connector 23.

[0042] Specifically, the connecting seat 25 serves to connect the conduit 2 and the protective shell 1, the protective shell 1 can accommodate the airflow and related structures, the connecting head 23 serves to fix the light guide 8 and install the light output head 24, the light output head 24 can output the laser to the target position, and the ventilation duct 22 can output the airflow to the surface of the laser processed object, thereby reducing the heat generated by the laser and the surface of the processed object, thereby ensuring the quality of the object processing.

[0043] Please see attached Figure 1 -Attached Figure 3 The outer wall of the light guide 8 is provided with a cooling strip 26 , and the outer wall of the cooling strip 26 is provided with a second air guide groove 27 . The cooling strip 26 is located inside the protective shell 1 .

[0044] Specifically, the cooling strip 26 can be used to exchange the internal heat of the light guide line 8, and the second air guide groove 27 can be used to increase the surface area of ​​the cooling strip 26, thereby further improving the heat exchange efficiency.

[0045] Please see attached Figure 1 -Attached Figure 3 A handle 3 is fixedly connected to the top of the shell 4.

[0046] Specifically, the handle 3 can facilitate carrying of the device.

[0047] Please see attached Figure 1 -Attached Figure 3 A water delivery valve 17 is fixedly connected to the top of the radiator 12 .

[0048] Specifically, the water delivery valve 17 can play a role in conveniently increasing the cooling liquid.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A picosecond laser for suppressing thermal effects, comprising a housing (4), characterized in that: A picosecond laser (11) is fixedly connected to the inner bottom of the shell (4); a top water tank (9) is fixedly arranged on the top of the picosecond laser (11); a first side water tank (10) and a second side water tank (28) are fixedly arranged on the side wall of the picosecond laser (11); a heat conducting structure is arranged between the top water tank (9), the first side water tank (10) and the second side water tank (28) and the picosecond laser (11); a radiator (12) is arranged at the rear of the picosecond laser (11); a cooling fan (6) is arranged at the rear of the radiator (12); and a heat exchanger (12) is arranged inside the radiator (12). A water plate (18), a water pump is arranged inside the radiator (12), the input end of the water pump is connected to the right side of the water plate (18), the output end of the water pump is connected to the input end of the second side water tank (28) through a third water pipe (19), the output end of the second side water tank (28) is connected to the input end of the top water tank (9) through a fourth water pipe (29), the output end of the top water tank (9) is connected to the input end of the first side water tank (10) through a first water pipe (13), and the output end of the first side water tank (10) is connected to the input end of the radiator (12) through a second water pipe (16).

2. A picosecond laser for suppressing thermal effects according to claim 1, characterized in that: The heat-conducting structure comprises a top copper plate (14), a first side copper plate (15) and a second side copper plate (21); the top copper plate (14) is located between the top water tank (9) and the picosecond laser (11); the first side copper plate (15) is located between the first side water tank (10) and the picosecond laser (11); and the second side copper plate (21) is located between the second side water tank (28) and the picosecond laser (11).

3. The picosecond laser for suppressing thermal effects according to claim 1, characterized in that: The position of the second water delivery pipe (16) is higher than the position of the third water delivery pipe (19).

4. The picosecond laser for suppressing thermal effects according to claim 1, characterized in that: The side walls of the top water tank (9), the second side water tank (28) and the first side water tank (10) are all provided with first air guide grooves (20).

5. The picosecond laser for suppressing thermal effects according to claim 1, characterized in that: A heat dissipation opening (5) is provided on the side wall of the housing (4).

6. The picosecond laser for suppressing thermal effects according to claim 1, characterized in that: An air guide bowl (7) is provided on the inner wall of the shell (4) at a side away from the heat dissipation fan (6); a through hole is provided on the inner wall of the shell (4) at a side away from the heat dissipation fan (6); the through hole is located at the center of the air guide bowl (7); a light guide (8) is fixedly connected to the side wall of the picosecond laser (11); the light guide (8) passes through the through hole; the diameter of the light guide (8) is smaller than the diameter of the through hole; the outer wall of the shell (4) is fixedly connected to one end of the conduit (2); the conduit (2) is located at the center of the air guide bowl (7); and the light guide (8) is located inside the conduit (2).

7. The picosecond laser for suppressing thermal effects according to claim 6, characterized in that: The other end of the conduit (2) is fixedly connected to the rear end of the protective shell (1) via a connecting seat (25); a through hole is provided at the rear end of the protective shell (1); the light guide (8) passes through the through hole and passes through a connector (23) to be connected to a light output head (24); the diameter of the through hole is larger than the diameter of the light guide (8); and a ventilation duct (22) is provided inside the connector (23).

8. The picosecond laser for suppressing thermal effects according to claim 7, characterized in that: The outer wall of the light guide line (8) is provided with a cooling strip (26), the outer wall of the cooling strip (26) is provided with a second air guide groove (27), and the cooling strip (26) is located inside the protective shell (1).

9. The picosecond laser for suppressing thermal effects according to claim 1, characterized in that: A handle (3) is fixedly connected to the top of the shell (4).

10. The picosecond laser for suppressing thermal effects according to claim 1, characterized in that: The top of the radiator (12) is fixedly connected with a water delivery valve (17).

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