Machining method for improving bending of flexible printed circuit board (OPCOIL) product on picosecond cutting plate

Abstract

The invention discloses a processing method for improving picosecond cutting board warping of an FPCOIL product, which comprises the following steps that a circuit board containing the product and a laser carrier capable of containing the circuit board are provided, and the laser carrier comprises a lower jig and an upper jig; the lower jig is placed on a working table; the circuit board is placed in the lower jig, and then the upper jig is placed at the upper end of the lower jig; the working table board adsorbs a circuit board through a lower jig, and a plurality of exhaust holes are formed in the lower jig; and cutting the circuit board by using a picosecond laser. The structure that the lower jig and the upper jig are fixed in a magnetic attraction mode is adopted for improving warping of a product board, the lower jig is placed on the working table, the whole circuit board is placed in the lower jig, a plurality of exhaust holes distributed in the periphery of the product are formed in the lower jig, effective attraction of the working table to the circuit board is facilitated, and the follow-up laser cutting precision is improved; and the upper jig is pressed on the edge area of the circuit board, so that the warping of the product can be improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a processing method for improving the warping of FPCOIL products on picosecond cut boards. Background Technology

[0002] The description in this section provides only background information related to the disclosure of this invention and does not constitute prior art.

[0003] FPCOIL is a circuit board for coil motors. Traditional stencil cutting machines have an accuracy of ≥0.05mm, which cannot meet the cutting accuracy requirements of existing FPCOIL products. For high-precision products, existing equipment uses picosecond cutting machines with a production accuracy of ±0.03mm. When using picosecond cutting machines, the center of the product is hollowed out and cannot be effectively adsorbed on the machine's worktable, resulting in defects in the unadsorbed areas. The bending of the board due to the use of jigs leads to a processing defect rate of 2%.

[0004] It should be noted that the above description of the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of this invention. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a processing method for improving the warping of picosecond cutting plates in FPCOIL products, in view of the shortcomings of the prior art.

[0006] This application discloses a processing method for improving the warping of picosecond cutting plates in FPCOIL products, including the following steps: Provides a circuit board containing a product and a laser carrier capable of accommodating the circuit board, the laser carrier comprising a lower fixture and an upper fixture; Place the lower fixture on the workbench; Place the circuit board into the lower fixture, and then place the upper fixture on the upper end of the lower fixture; The workbench surface adsorbs the circuit board through the lower fixture, and the lower fixture is provided with multiple exhaust holes; The circuit board is cut using a picosecond laser.

[0007] Furthermore, in the above-mentioned improved processing method for picosecond cutting board warping of FPCOIL products, the circuit board includes a main circuit area and an edge area disposed around the main circuit area. Multiple products are arranged in a matrix within the main circuit area, and the upper fixture presses on the edge area.

[0008] Furthermore, in the above-mentioned improved processing method for picosecond cutting boards to prevent warping of FPCOIL products, the two ends of the vent hole are connected to the worktable and the circuit board.

[0009] Furthermore, in the above-mentioned improved processing method for picosecond cutting plate warping of FPCOIL products, each product is provided with 8 vent holes arranged in a ring array around its perimeter, and each vent hole has a diameter of 15mm.

[0010] Furthermore, in the above-mentioned improved processing method for picosecond cutting boards in FPCOIL products, the lower fixture is also provided with positioning pins at the four corners for positioning the circuit board, and the diameter of the positioning pins is 1.5mm.

[0011] Furthermore, in the above-mentioned method for improving the processing of picosecond cutting boards to prevent warping in FPCOIL products, the connection between the lower fixture and the upper fixture in the step "placing the circuit board into the lower fixture and then placing the upper fixture on the upper end of the lower fixture" is magnetic.

[0012] Furthermore, in the above-mentioned method for improving the processing of picosecond cutting boards to prevent warping in FPCOIL products, the adsorption pressure in the step "the worktable adsorbs the circuit board through the lower fixture" is above -7.5 kPa.

[0013] Furthermore, in the above-mentioned method for improving the processing of picosecond cut boards to prevent warping in FPCOIL products, in the step of "cutting the circuit board using a picosecond laser", the cutting power of the picosecond laser is 10W, the frequency is 1000KHz, the scanning speed is 1200 mm / s, and the cutting accuracy is ±30μm.

[0014] In summary, the structure adopted in the embodiments of the present invention has the following advantages: The present invention describes a method for improving the warping of FPCOIL products during picosecond laser cutting. This method employs a magnetic fixation mechanism using a lower and upper fixture to address the warping issue. The lower fixture is placed on the worktable, and the entire circuit board is placed inside it. Multiple 1.5mm diameter vent holes are created on the lower fixture. These vent holes facilitate effective adhesion of the circuit board to the worktable. The lower fixture effectively supports the product, improving the subsequent laser cutting accuracy. Each product has eight vent holes around its outer edge, which adhere to the product's perimeter, maintaining good adhesion. The system provides additional benefits without affecting the laser cutting process. The lower fixture has positioning pins at the four corners, allowing the entire circuit board to be hung on them. These pins prevent incorrect product orientation, which could lead to laser defects. The upper fixture is then pressed onto the edge of the circuit board. The combined effect of the upper and lower fixtures improves product warping, reduces circuit board movement, lowers processing defects, and enhances dimensional accuracy in subsequent cutting processes. Cutting accuracy is improved from ±40μm to ±30μm, reducing the defect rate due to fixture use from 2% to 0%.

[0015] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments or prior art of this specification, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart illustrating the method for improving the processing of FPCOIL products to prevent warping of picosecond cutting plates in an embodiment of the present invention. Figure 2 This is a schematic diagram of the lower fixture in an embodiment of the present invention; Figure 3 This is a schematic diagram of the upper fixture in an embodiment of the present invention; Figure 4 This is a schematic diagram showing the distribution of exhaust holes in an embodiment of the present invention; The reference numerals in the above figures are as follows: 1. Circuit board; 2. Lower fixture; 3. Upper fixture; 4. Vent hole; 5. Edge area; 6. Positioning pin; 7. Product. Detailed Implementation

[0018] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0019] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Furthermore, the accompanying drawings of the present invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.

[0020] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0021] Reference Figures 1 to 4 As shown in the figure, this application discloses a processing method to improve the warping of picosecond cutting plates in FPCOIL products, including the following steps: A circuit board 1 containing products 7 is provided, and a laser carrier capable of accommodating the circuit board 1 is provided. The laser carrier includes a lower fixture 2 and an upper fixture 3. A single circuit board contains multiple products 7 arranged in a rectangular array. Place the lower fixture 2 on the workbench; Place the circuit board 1 into the lower fixture 2, and then place the upper fixture 3 on the upper end of the lower fixture 2; The workbench surface adsorbs the circuit board 1 through the lower fixture 2, and the lower fixture 2 is provided with multiple exhaust holes 4; The circuit board 1 is cut using a picosecond laser.

[0022] Specifically, in this embodiment, the circuit board 1 includes a main circuit area and an edge area 5 disposed around the main circuit area. The main circuit area is provided with a plurality of products 7 arranged in a matrix, and the upper fixture 3 presses on the edge area 5.

[0023] Specifically, in this embodiment, the two ends of the exhaust hole 4 are connected to the workbench surface and the circuit board 1.

[0024] Specifically, refer to Figure 4 In this embodiment, each product 7 has eight vent holes 4 arranged in a circular array around its perimeter, each vent hole 4 having a diameter of 15 mm. The vent holes 4 adhere to the perimeter of the product 7, maintaining a good adhesion effect, while not affecting the laser cutting process of the product 7.

[0025] Specifically, refer to Figure 2 In this embodiment, the lower fixture 2 is further provided with positioning pins 6 at the four corners for positioning the circuit board 1. The diameter of the positioning pins 6 is 1.5mm. One of the four positioning pins 6 is a foolproof pin. The edge area 5 of the circuit board 1 is provided with a foolproof hole. The circuit board 1 is mounted on the lower fixture 2 through the positioning pins 6. The foolproof hole passes through the positioning pin 6. The positioning pins 6 can prevent the product 7 from being laser-cut due to incorrect orientation.

[0026] Specifically, in this embodiment, in the step "placing the circuit board 1 into the lower fixture 2, and then placing the upper fixture 3 on top of the lower fixture 2", the connection between the lower fixture 2 and the upper fixture 3 is magnetic. This laser fixture is made of aluminum alloy, which is resistant to high temperatures and laser cutting. The upper fixture 3 and the lower fixture 2 are connected by magnetic attraction. The upper fixture 3 is a frame structure with a hollow center. The upper fixture 3 can press on the edge area 5 of the circuit board 1, which can improve the warping of the board.

[0027] Specifically, in this embodiment, in the step "the workbench surface adsorbs the circuit board 1 through the lower fixture 2", the adsorption pressure is above -7.5 kPa.

[0028] Specifically, in this embodiment, in the step of "cutting the circuit board 1 using a picosecond laser", the cutting power of the picosecond laser is 10W, the frequency is 1000KHz, the scanning speed is 1200 mm / s, and the cutting accuracy is ±30μm.

[0029] Using the above method, the warping problem of the product 7 board is improved by magnetically fixing the lower fixture 2 and the upper fixture 3. The lower fixture 2 is placed on the worktable, and the entire circuit board 1 is placed inside the lower fixture 2. Multiple vent holes 4 with a diameter of 1.5mm are made on the lower fixture 2. The vent holes 4 facilitate the effective adsorption of the circuit board 1 by the worktable. The lower fixture 2 plays a good role in supporting the product 7, improving the subsequent laser cutting accuracy. Each product 7 has 8 vent holes 4 on its outer ring. The vent holes 4 adsorb around the product 7, maintaining a good adsorption effect without affecting the laser cutting. During the cutting process of product 7, the lower fixture 2 is equipped with positioning pins 6 at the four corners. The entire circuit board 1 can be hung on the positioning pins 6. The positioning pins 6 can prevent product 7 from being misaligned, which would lead to laser defects in product 7. Then, the upper fixture 3 is pressed on the edge area 5 of the circuit board 1. The combined action of the upper fixture 3 and the lower fixture 2 can improve the warping of product 7, reduce the movement of circuit board 1, reduce the processing defects of product 7, and facilitate the dimensional accuracy of the subsequent cutting process. The cutting accuracy is improved from ±40μm to ±30μm, and the cutting defect rate due to the use of fixtures is reduced from 2% to 0%.

[0030] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention.

[0031] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0032] Although this application has been described by way of examples, those skilled in the art will know that this application has many modifications and variations without departing from the spirit of this application, and it is intended that the appended embodiments include these modifications and variations without departing from this application.

Claims

1. A processing method for improving the warping of picosecond cutting plates in FPCOIL products, characterized in that, Includes the following steps: Provides a circuit board containing a product and a laser carrier capable of accommodating the circuit board, the laser carrier comprising a lower fixture and an upper fixture; Place the lower fixture on the workbench; Place the circuit board into the lower fixture, and then place the upper fixture on the upper end of the lower fixture; The workbench surface adsorbs the circuit board through the lower fixture, and the lower fixture is provided with multiple exhaust holes; The circuit board is cut using a picosecond laser.

2. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, The circuit board includes a main circuit area and an edge area surrounding the main circuit area. The main circuit area contains multiple products arranged in a matrix, and the upper fixture presses against the edge area.

3. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, The two ends of the vent are connected to the workbench and the circuit board.

4. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, Each product has eight vents arranged in a circular array around its perimeter, each vent having a diameter of 15 mm.

5. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, The lower fixture is also provided with positioning pins at the four corners for positioning the circuit board, and the diameter of the positioning pins is 1.5mm.

6. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, In the step "Place the circuit board into the lower fixture, and then place the upper fixture on the upper end of the lower fixture", the connection between the lower fixture and the upper fixture is magnetic attraction.

7. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, In the step "the workbench adsorbs the circuit board through the lower fixture", the adsorption pressure is above -7.5 kPa.

8. The processing method for improving the warping of picosecond cutting plates in FPCOL products according to claim 1, characterized in that, In the step "cutting the circuit board using a picosecond laser", the cutting power of the picosecond laser is 10W, the frequency is 1000KHz, the scanning speed is 1200mm / s, and the cutting accuracy is ±30μm.

Images