A device for improving vertical warpage of a copper foil substrate

Abstract

The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil substrate processing equipment. The application discloses a vertical warping improvement device for copper foil substrates and relates to the technical field of copper foil The application discloses a vertical warping improvement device for copper foil substrates and relates to the

Description

A device for improving vertical warpage of copper foil substrate Technical Field

[0001] This invention relates to the technical field of copper foil substrate processing equipment, and in particular to a device for improving the vertical warpage of copper foil substrates. Background Technology

[0002] Currently, when copper foil substrates undergo roll curing, thermal stress is generated towards the aluminum tube. This thermal stress is difficult to release in the later stages, causing vertical warping of 5-9cm (standard warping <3cm) in the aluminum tube direction. This affects downstream customers' cutting, causes copper plating scratches, and results in low work efficiency. Therefore, it is necessary to improve the vertical warping of copper foil substrates by using an improvement device.

[0003] Existing devices for improving the vertical warpage of copper foil substrates improve the vertical warpage of copper foil substrates by pressing the surface of the copper foil substrate with a cylinder. However, during the cylinder pressing process, the uneven distribution of the pressing force leads to uneven tension on the surface of the copper foil substrate, which easily causes the surface of the copper foil substrate to be uneven. In order to ensure that the tension on the surface of the copper foil substrate changes evenly, a device for improving the vertical warpage of copper foil substrates is proposed. Summary of the Invention

[0004] This application provides a device for improving the vertical warpage of copper foil substrate, which can effectively ensure uniform tension variation on the surface of the copper foil substrate.

[0005] This application provides a device for improving the vertical warpage of copper foil substrate, which adopts the following technical solution:

[0006] A device for improving vertical warpage of copper foil substrate includes a control platform. A reinforcing frame is provided on the upper surface of the control platform. A processing channel for the copper foil substrate to pass through is provided inside the reinforcing frame. A processing path is formed within the processing channel. A plurality of fixed rollers and pressure rollers are sequentially arranged inside the reinforcing frame and along the processing path. The copper foil substrate sequentially passes through a series of alternately arranged fixed rollers and pressure rollers. A drive motor for driving the fixed rollers is provided on the reinforcing frame. A screw is provided at the top of the reinforcing frame. A handwheel is provided at one end of the screw, and a limiting frame is provided at the other end of the screw. The limiting frame is slidably disposed within the reinforcing frame, and the pressure rollers are rotatably disposed within the limiting frame.

[0007] By adopting the above technical solution, copper foil substrates often exhibit vertical warping due to internal stress or processing technology, affecting their flatness and quality. By installing fixed rollers and pressure rollers on the reinforcing frame, and having the copper foil substrate pass through a series of alternately arranged fixed rollers and pressure rollers, the screw is rotated during use to cause the pressure rollers within the limiting frame to squeeze the copper foil substrate, resulting in downward bending deformation. This corrects the vertical warping of the copper foil substrate, restoring its flatness and quickly improving its warping. The design of the pressure rollers and the way force is applied ensure that the pressure is evenly distributed on the substrate surface during the extrusion process; it avoids localized over-extrusion or under-extrusion, ensuring uniform extrusion effect on the substrate surface and effectively guaranteeing uniform tension changes on the copper foil substrate surface.

[0008] Preferably, the reinforcing frame includes a lateral support plate, the top of which is provided with a canopy, and the processing channel is formed between the lateral support plate, the canopy, and the control platform.

[0009] By adopting the above technical solution, the reinforcement frame, including the lateral support plate, the canopy and the control platform, forms a processing channel for improving the warping of the copper foil substrate, which can improve the warping of the copper foil substrate, provide processing convenience and stable support positioning, and reduce the risk of damage.

[0010] Preferably, the lateral support plate is provided with a plurality of guide wheels, which are located at the output end near the processing path.

[0011] By adopting the above technical solution, the guide wheel on the side support plate and its placement near the output end of the processing path can smoothly guide the copper foil substrate, reduce friction and damage, and improve processing accuracy and quality.

[0012] Preferably, the upper surface of the control platform is provided with a buffer assembly, which is located directly below the pressure roller.

[0013] By adopting the above technical solution, during the processing, the pressure roller will apply a certain pressure to the copper foil substrate, and the buffer component can effectively disperse and buffer this pressure to avoid excessive pressure and deformation on the copper foil substrate. By setting the buffer component on the control platform and placing it directly below the pressure roller, the pressure can be buffered and the copper foil substrate can be protected.

[0014] Preferably, the buffer assembly includes a buffer box, the buffer box has an internal telescopic groove, the telescopic groove of the buffer box has a telescopic support column, and a first spring is provided between the telescopic support column and the buffer box.

[0015] By adopting the above technical solution, during the lifting and lowering process of the pressure roller, the contact between the pressure roller and the telescopic support column can be buffered and dispersed onto the telescopic support column by the action of the first spring; this can reduce the impact force of the pressure roller on the telescopic support column and avoid damage to the copper foil substrate or instability caused by excessive impact force.

[0016] Preferably, the upper surface of the telescopic support column is provided with an arc-shaped surface that matches the surface of the pressure roller, and a smooth guide portion extends along one side of the arc-shaped surface of the telescopic support column.

[0017] By adopting the above technical solution, good alignment can be achieved through the matching of the arc-shaped surface on the telescopic support with the surface of the pressure roller. This means that during the lifting and lowering process of the pressure roller, it can move smoothly on the telescopic support, reducing friction and unnecessary deviation, and improving the stability and processing accuracy of the equipment. Furthermore, the smooth guide portion formed by the extension of one side of the arc-shaped surface of the telescopic support can reduce friction and wear between the pressure roller and the support. When the pressure roller is lifting and lowering, the smooth guide portion can provide a smooth surface, reducing friction, reducing wear, and extending the service life of the telescopic support and the pressure roller. Moreover, the design of the arc-shaped surface and the smooth guide portion can improve the stability and balance of the equipment. The smooth guide portion of the telescopic support can ensure that the pressure roller maintains a smooth movement trajectory during the lifting and lowering process, reducing swaying and shaking, and improving the stability of the equipment.

[0018] Preferably, a fixing block is provided on the other side of the arc-shaped surface of the telescopic support, and a flip plate is provided inside the fixing block. The flip plate and the fixing block are rotatably connected by a rotating shaft, and a torsion spring is provided between the rotating shaft and the fixing block.

[0019] By adopting the above technical solution, a fixed block is provided on the other side of the arc surface of the telescopic support, and the flip plate is rotated on the fixed block through the rotating shaft, so that the flip plate fits the surface of the copper foil substrate and is used to press against the surface of the copper foil substrate, which has a certain promoting effect on improving the flatness of the copper foil substrate surface.

[0020] Preferably, the upper surface of the flip plate is provided with scraper strips, and there are several scraper strips, which are made of flexible material.

[0021] By rotating the flip plate, the scraper adheres to the surface of the copper foil substrate, effectively cleaning impurities from the surface of the copper foil substrate. The cleaning effect is good and it is not easy to damage the surface of the copper foil substrate.

[0022] Preferably, sponge strips are evenly distributed on both the arc-shaped surface and the smooth guide portion of the telescopic support.

[0023] By adopting the above technical solution, the sponge strips are evenly arranged on the arc-shaped surface and smooth guide part of the telescopic support column, which has the advantages of removing dirt, smoothing the surface, improving cleaning effect and making it convenient to use for cleaning the surface of copper foil substrate.

[0024] Preferably, the upper surface of the control platform is provided with an oil supply tank for storing maintenance oil. The oil supply tank and the buffer tank are connected by an output pipe. The expansion groove of the buffer tank is provided with a sponge block. The sponge block is located on the lower side of the expansion support. The expansion support is provided with an oil overflow hole. One end of the oil overflow hole faces the lower surface of the sponge strip, and the other end of the oil overflow hole faces the upper surface of the sponge block.

[0025] By adopting the above technical solution, the maintenance oil is injected into the interior of the buffer box through the oil supply tank. The maintenance oil fills the internal pores of the sponge block. With the extension and contraction of the telescopic support, the sponge block is squeezed, and the maintenance oil in the sponge block enters the interior of the sponge strip through the oil overflow hole. The sponge strip comes into contact with the surface of the copper foil substrate, and the maintenance oil forms a lubricating film between the sponge strip and the copper foil substrate, reducing friction and wear.

[0026] In summary, this application has the following beneficial effects:

[0027] 1. By setting fixed wheels and pressure rollers on the reinforced frame, and having the copper foil substrate pass through a series of alternately arranged fixed wheels and pressure rollers in sequence, the screw is rotated during use to cause the pressure rollers in the limiting frame to squeeze the copper foil substrate, causing the copper foil substrate to bend downwards, thereby correcting the vertical warping of the copper foil substrate and restoring it to flatness. This quickly improves the warping of the copper foil substrate. The design of the pressure rollers and the way the force is applied ensure that the pressure is evenly distributed on the surface of the substrate during the extrusion process; it can avoid local over-extrusion or under-extrusion, ensuring a uniform extrusion effect on the surface of the substrate and effectively ensuring uniform tension change on the surface of the copper foil substrate. Attached Figure Description

[0028] Figure 1 is a schematic diagram of the overall structure of the vertical warp improvement device in this embodiment;

[0029] Figure 2 is a schematic diagram of the overall structure of the connection between the screw and the limiting frame in this embodiment;

[0030] Figure 3 is a schematic diagram of the exploded structure between the pressure roller and the buffer assembly in this embodiment;

[0031] Figure 4 is a front view cross-sectional view of the buffer box in this embodiment;

[0032] Figure 5 is a front view cross-sectional view of the telescopic support structure in this embodiment;

[0033] Figure 6 is an enlarged structural diagram of point A in Figure 5 in this embodiment;

[0034] Figure 7 is a schematic diagram of the overall structure of the connection between the buffer tank and the fuel supply tank in this embodiment;

[0035] Explanation of reference numerals in the attached drawings: 1. Control platform; 2. Reinforced frame; 3. Processing channel; 4. Fixed wheel; 5. Pressure roller; 6. Screw; 7. Handwheel; 8. Limiting frame; 9. Guide wheel; 10. Buffer assembly; 1001. Buffer box; 1002. Telescopic groove; 1003. Telescopic support column; 1004. First spring; 1005. Arc-shaped surface; 1006. Smooth guide part; 1007. Fixed block; 1008. Flipping plate; 1009. Scraper; 10010. Sponge strip; 10011. Ball bearing; 10012. Second spring; 11. Oil supply tank; 12. Output pipe; 13. Sponge block; 14. Overflow hole; Detailed Implementation

[0036] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0037] This invention discloses a device for improving the vertical warpage of copper foil substrates, as shown in Figure 1. It includes a control platform 1, with a reinforcing frame 2 on the upper surface of the control platform 1. The reinforcing frame 2 includes a lateral support plate, and a canopy is provided on the top of the lateral support plate. A processing channel 3 is formed between the lateral support plate, the canopy, and the control platform 1. The existence of the processing channel 3 facilitates the handling and manipulation of the copper foil substrate by the operator. The operator can enter the area between the lateral support plate, the canopy, and the control platform 1 through the processing channel 3 to implement corresponding correction and processing techniques, improving the convenience and efficiency of processing. Furthermore, the structure of the lateral support plate and the canopy allows for... To maintain a relatively fixed position and orientation of the copper foil substrate during processing, improving processing accuracy and stability, and the setting of processing channel 3 can reduce the potential risk of damage to the copper foil substrate; during processing, the copper foil substrate may be subjected to unnecessary collisions or friction, and processing channel 3 can provide a certain degree of protection, reducing these risks and preventing damage to the copper foil substrate; in summary, the processing channel 3 formed between the reinforcing frame 2, including the lateral support plate, the canopy, and the control platform 1, can improve the warping of the copper foil substrate, provide convenient processing and stable support positioning, and reduce the risk of damage.

[0038] As shown in Figures 1 and 2, the reinforcing frame 2 has a processing channel 3 inside for the copper foil substrate to pass through. A processing path is formed within the processing channel 3 of the reinforcing frame 2. Several fixed wheels 4 and pressure rollers 5 are sequentially arranged inside the reinforcing frame 2 along the processing path. The copper foil substrate passes through a series of alternating fixed wheels 4 and pressure rollers 5. A drive motor is provided on the reinforcing frame 2 to drive the fixed wheels 4. A screw 6 is provided at the top of the reinforcing frame 2. One end of the screw 6 has a handwheel 7, and the other end has a limiting frame 8. The limiting frame 8 slides within the reinforcing frame 2, and the pressure rollers 5 rotate within the limiting frame 8. Copper foil substrates often experience vertical warping due to internal stress or processing techniques, affecting their flatness and quality. By providing fixed wheels 4 and pressure rollers 5 on the reinforcing frame 2, and having the copper foil substrate pass through a series of alternating fixed wheels 4 and pressure rollers 5, the screw 6 is rotated during use, causing the pressure rollers 5 within the limiting frame 8 to compress the copper foil substrate. This process causes the copper foil substrate to bend downwards, correcting its vertical warping and restoring it to flatness. This quickly improves warping on the copper foil substrate, increasing production efficiency and processing speed. It's worth noting that the force applied by the pressure roller 5 flattens the surface of the copper foil substrate and distributes it evenly along the axial direction of the roller 5. This reduces surface unevenness and undulations, making it smoother. The design of the pressure roller 5 and the way it applies force ensure that the pressure is evenly distributed on the surface of the copper foil substrate during extrusion. This avoids localized over-extrusion or under-extrusion, ensuring a uniform extrusion effect on the copper foil substrate surface. Furthermore, during extrusion, the copper foil substrate undergoes elastic deformation. When the pressure applied by the pressure roller 5 is released, the copper foil substrate springs back to a certain degree of its initial state. This elastic recovery helps adjust the tension distribution on the surface of the copper foil substrate, making the surface more uniform.

[0039] As shown in Figure 2, several guide wheels 9 are provided on the lateral support plate, and the guide wheels 9 are located near the output end of the processing path. The presence of the guide wheels 9 helps to smoothly guide the copper foil substrate, preventing it from shifting or shaking during processing. The guide wheels 9 provide guidance and support, ensuring that the copper foil substrate moves along the correct path during processing and maintains a stable position and orientation. The design of the guide wheels 9 reduces friction between the copper foil substrate and the lateral support plate, avoiding excessive friction that could damage the copper foil substrate. The smooth surface of the guide wheels 9 reduces the contact area with the copper foil substrate, thereby reducing friction and minimizing damage and wear to the copper foil substrate. Furthermore, the placement of the guide wheels 9 ensures that the copper foil substrate maintains a stable position and orientation during processing, avoiding shifting and shaking. This helps to improve processing accuracy and quality, ensuring the consistency and accuracy of the copper foil substrate during processing. In summary, the guide wheels 9 on the lateral support plate, located near the output end of the processing path, can smoothly guide the copper foil substrate, reduce friction and damage, and improve processing accuracy and quality.

[0040] As shown in Figure 3, a buffer assembly 10 is provided on the upper surface of the control platform 1, located directly below the pressure roller 5. During processing, the pressure roller 5 applies a certain pressure to the copper foil substrate, and the buffer assembly 10 can effectively disperse and buffer this pressure, preventing excessive pressure and deformation on the copper foil substrate. Furthermore, the buffer assembly 10 protects the copper foil substrate from excessive pressure and damage. Additionally, during processing, the copper foil substrate may deform, scratch, or suffer other damage due to excessive pressure, and the presence of the buffer assembly 10 reduces these risks, protecting the integrity and quality of the copper foil substrate. Moreover, the buffer assembly 10... The buffer assembly 10 can improve processing accuracy; by reducing the pressure and deformation applied to the copper foil substrate, the buffer assembly 10 can help maintain the flatness and consistency of the copper foil substrate, thereby improving processing accuracy and quality; the softness of the buffer assembly 10 can reduce friction and wear between the pressure roller 5 and the copper foil substrate; during processing, friction and wear may cause damage and quality problems to the copper foil substrate, while the presence of the buffer assembly 10 can reduce the occurrence of these problems and extend the service life of the pressure roller 5 and the copper foil substrate; in summary, by providing the buffer assembly 10 on the control platform 1 and placing it directly below the pressure roller 5, pressure can be buffered and the copper foil substrate can be protected.

[0041] As shown in Figures 3 and 4, the buffer assembly 10 includes a buffer box 1001. The buffer box 1001 has an internal telescopic groove 1002, and a telescopic support column 1003 is located within the telescopic groove 1002. A first spring 1004 is provided between the telescopic support column 1003 and the buffer box 1001. During the lifting and lowering of the pressure roller 5, the contact between the pressure roller 5 and the telescopic support column 1003 can be buffered and dispersed onto the telescopic support column 1003 by the action of the first spring 1004. This reduces the impact force of the pressure roller 5 on the telescopic support column 1003, preventing damage to the copper foil substrate or instability due to excessive impact force. Furthermore, through the telescopic action of the telescopic support column 1003, the buffer box 1001 can protect the copper foil substrate. During the lifting and lowering of the pressure roller 5, the telescopic support column 1003 can absorb and buffer the impact force, reducing the impact and vibration on the copper foil substrate.

[0042] As shown in Figure 5, the upper surface of the telescopic support 1003 is provided with an arc-shaped surface 1005 that matches the surface of the pressure roller 5. A smooth guide portion 1006 extends along one side of the arc-shaped surface 1005 of the telescopic support 1003. Through the matching of the arc-shaped surface 1005 on the telescopic support 1003 with the surface of the pressure roller 5, good alignment can be achieved. This means that during the lifting and lowering process of the pressure roller 5, the pressure roller 5 can move smoothly on the telescopic support 1003, reducing friction and unnecessary deviation, and improving the stability and processing accuracy of the equipment. Furthermore, the smooth guide portion 1006 extending from one side of the arc-shaped surface 1005 of the telescopic support 1003 can reduce friction and wear between the pressure roller 5 and the support. When the pressure roller 5 is lifting and lowering, the smooth guide portion 1006 further reduces friction and wear between the pressure roller 5 and the support. The guide section 1006 provides a smooth surface, reducing friction, decreasing wear, and extending the service life of the telescopic support column 1003 and the pressure roller 5. Furthermore, the design of the arc-shaped surface 1005 and the smooth guide section 1006 improves the stability and balance of the equipment. The smooth guide section 1006 of the telescopic support column 1003 ensures that the pressure roller 5 maintains a smooth trajectory during lifting and lowering, reducing swaying and shaking, and improving equipment stability. A fixing block 1007 is provided on the other side of the arc-shaped surface 1005 of the telescopic support column 1003. A flip plate 1008 is provided inside the fixing block 1007. The flip plate 1008 is rotatably connected to the fixing block 1007 via a rotating shaft, and a torsion bar is provided between the rotating shaft and the fixing block 1007. A spring; a fixing block 1007 is provided on the other side of the arc-shaped surface 1005 of the telescopic support 1003, and the flip plate 1008 is rotatably mounted on the fixing block 1007 via a rotating shaft, so that the flip plate 1008 is in contact with the surface of the copper foil substrate. This helps to improve the flatness of the copper foil substrate surface. Automatic reset and contact are achieved through the torsion spring, improving the convenience and efficiency of operation. Operators do not need to manually reset the flip plate 1008; instead, the torsion spring automatically returns the flip plate 1008 to its initial position, ready for the next contact. This saves time and labor costs. A scraper 1009 is provided on the upper surface of the flip plate 1008, and the scraper 1009 is provided with several... Each component is made of a flexible material. The rotation of the flip plate 1008 causes the scraper 1009 to adhere to the surface of the copper foil substrate, effectively cleaning impurities with good cleaning results and minimal damage to the substrate surface. Sponge strips 10010 are evenly distributed on the arc-shaped surface 1005 and the smooth guide portion 1006 of the telescopic support column 1003. The sponge strips 10010 have good absorption properties, capable of adsorbing and absorbing dust, grease, impurities, and other dirt from the copper foil substrate surface. Through the movement of the telescopic support column 1003, the sponge strips 10010 can come into close contact with the surface and remove dirt through wiping. The soft material of the sponge strips 10010 helps to smooth the surface of the copper foil substrate.While the telescopic support column 1003 moves, the sponge strip 10010 can perform a slight polishing and smoothing process on the surface, making the copper foil substrate surface smoother. This helps improve the quality and surface uniformity of the copper foil substrate. Furthermore, the sponge strip 10010 can reduce friction and impact between the telescopic support column 1003 and the copper foil substrate, preventing scratches or damage to the substrate surface. Especially for processes requiring the preservation of substrate surface integrity, the sponge strip 10010 can provide a certain degree of protection. Through contact and friction with the copper foil substrate surface, the sponge strip 10010 can better remove... The surface dirt is removed, resulting in a more thorough cleaning effect. Furthermore, the sponge strips 10010 make the cleaning process more convenient. The sponge strips 10010 can be flexibly installed on the curved surface 1005 and smooth guide portion 1006 of the telescopic support 1003, making them easy to replace and maintain. This saves operating time and maintenance costs, improving work efficiency. In summary, the evenly distributed sponge strips 10010 on the curved surface 1005 and smooth guide portion 1006 of the telescopic support 1003 offer the advantages of removing dirt, smoothing the surface, improving cleaning effect, and providing ease of use for cleaning copper foil substrate surfaces.

[0043] As shown in Figure 6, the sponge strip 10010 has a ball bearing 10011 inside, and a second spring 10012 is provided at the bottom of the ball bearing 10011. The design of the ball bearing 10011 and the second spring 10012 can provide better cushioning and shock absorption. When the telescopic support column 1003 moves, the ball bearing 10011 can roll inside the sponge strip 10010, absorbing and dispersing the impact force from the telescopic movement, reducing the impact on the sponge strip 10010 and other components, thereby reducing vibration and noise. Furthermore, the rolling action of the ball bearing 10011 can reduce the friction between the telescopic support column 1003 and the sponge strip 10010, reducing movement resistance and making the movement of the telescopic support column 1003 smoother and more stable. The rolling action reduces friction between internal components of the sponge strip 10010, minimizing wear and damage. The second spring 10012 provides better support and protection, reducing deformation and breakage of the sponge strip 10010. Furthermore, the rolling action of the ball bearing 10011 increases the contact area between the sponge strip 10010 and the substrate, improving contact uniformity and thus increasing stability and precision. In summary, the sponge strip 10010 incorporates a ball bearing 10011, with a second spring 10012 at the bottom of the ball bearing 10011, providing benefits such as cushioning and shock absorption, smooth movement, increased service life, and improved stability, thereby enhancing the performance of the telescopic support column 1003 and the service life of the sponge strip 10010.

[0044] As shown in Figures 5 and 7, the upper surface of the control platform 1 is provided with an oil supply tank 11 for storing maintenance oil. The oil supply tank 11 is connected to the buffer tank 1001 through an output pipe 12. A sponge block 13 is provided in the telescopic groove 1002 of the buffer tank 1001. The sponge block 13 is located on the lower side of the telescopic support column 1003. An oil overflow hole 14 is provided inside the telescopic support column 1003. One end of the oil overflow hole 14 faces the lower surface of the sponge strip 10010, and the other end faces the upper surface of the sponge block 13. Maintenance oil is injected into the buffer tank 1001 through the oil supply tank 11. The maintenance oil fills the internal pores of the sponge block 13. With the expansion and contraction of the telescopic support column 1003, the compression of the sponge block 13 forces the maintenance oil inside to pass through the oil overflow hole 14 and enter the interior of the sponge strip 10010. Since the sponge strip 10010 contacts the surface of the copper foil substrate, the maintenance oil forms a lubricating film between the sponge strip 10010 and the copper foil substrate, reducing friction and wear. This helps improve the smoothness of the telescopic support column 1003's movement and extends the service life of the sponge strip 10010. Furthermore, the maintenance oil on the sponge strip 10010 and the copper foil substrate... The lubricating film formed between the foil substrates provides a certain degree of protection, reducing wear and scratches on the copper foil substrate surface. Especially under high-speed movement or frequent stretching, the maintenance oil effectively reduces friction with the substrate surface, preventing damage. During its entry into the sponge strip 10010, the maintenance oil removes some of the dirt and impurities adhering to it, thus cleaning it. Through the continuous circulation of the maintenance oil, the surface of the sponge strip 10010 is constantly cleaned, maintaining its cleanliness and adsorption properties. Furthermore, the maintenance oil... The lubricating film formed between the strip 10010 and the copper foil substrate can also play a role in heat dissipation and cooling. When the telescopic support 1003 moves, the maintenance oil can carry away some of the heat generated by friction, reduce heat accumulation, and thus prevent overheating and damage. In short, by injecting maintenance oil into the buffer box 1001 through the oil supply tank 11 and allowing the maintenance oil to enter the interior of the sponge strip 10010 through the overflow hole 14, the benefits of lubrication and friction reduction, protection of the substrate, cleaning effect and heat dissipation and cooling can be achieved, thereby improving the performance of the telescopic support 1003 and the service life of the sponge strip 10010.

[0045] Working principle: Before use, the user first passes the copper foil substrate through a series of alternating fixed rollers 4 and pressure rollers 5, and then turns the handwheel 7 by hand to make the screw 6 rotate inside the reinforcing frame 2. The user also adjusts the height of the limiting frame 8 so that the pressure rollers 5 inside the limiting frame 8 squeeze the copper foil substrate, causing the copper foil substrate to bend downwards. This corrects the vertical warping of the copper foil substrate and restores it to flatness, thereby quickly improving the warping of the copper foil substrate and increasing production efficiency and processing speed.

[0046] During the process of the pressure roller 5 extruding the copper foil substrate, the buffer component 10 is used to buffer the process, the sponge strip 10010 is used to clean the surface of the copper foil substrate, and the curing oil in the oil tank 11 is used to cure the copper foil substrate.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A device for improving vertical warpage of copper foil substrate, comprising a control platform (1), characterized in that: The upper surface of the control platform (1) is provided with a reinforcing frame (2). The interior of the reinforcing frame (2) is provided with a processing channel (3) through which the copper foil substrate passes. A processing path is formed within the processing channel (3) of the reinforcing frame (2). Several fixed wheels (4) and pressure rollers (5) are sequentially arranged within the reinforcing frame (2) and along the processing path. The copper foil substrate passes sequentially through a series of alternately arranged fixed wheels (4) and pressure rollers (5). A drive motor for driving the fixed wheels (4) is provided on the reinforcing frame (2). A screw (6) is provided at the top of the reinforcing frame (2). A handwheel (7) is provided at one end of the screw (6), and a limiting frame (8) is provided at the other end of the screw (6). The limiting frame (8) is slidably disposed within the reinforcing frame (2), and the pressure roller (5) is rotatably disposed within the limiting frame (8); the upper surface of the control platform (1) is provided with a buffer assembly (10), which is located directly below the pressure roller (5); the buffer assembly (10) includes a buffer box (1001), the buffer box (1001) is provided with a telescopic groove (1002) inside, the telescopic groove (1002) of the buffer box (1001) is provided with a telescopic support column (1003), and a first spring (1004) is provided between the telescopic support column (1003) and the buffer box (1001); the upper surface of the telescopic support column (1003) is provided with an arc shape that matches the surface of the pressure roller (5). A smooth guide portion (1006) extends along one side of the arc-shaped surface (1005) of the telescopic support column (1003); a fixing block (1007) is provided on the other side of the arc-shaped surface (1005) of the telescopic support column (1003), and a flip plate (1008) is provided inside the fixing block (1007). The flip plate (1008) and the fixing block (1007) are rotatably connected by a rotating shaft, and a torsion spring is provided between the rotating shaft and the fixing block (1007); a scraper (1009) is provided on the upper surface of the flip plate (1008), and several scrapers (1009) are provided, and the material is flexible material; the arc-shaped surface (1005) of the telescopic support column (1003) extends along one side of the arc-shaped surface (1005) of the telescopic support column (1003) to form a smooth guide portion (1006); a fixing block (1007) is provided on the other side of the arc-shaped surface (1005) of the telescopic support column (1003), and a smooth guide portion (1006) extends along one side of the arc-shaped surface (1005) of the telescopic support column (1003); a straight ... Sponge strips (10010) are evenly arranged on both the 005 and the smooth guide part (1006); the upper surface of the control platform (1) is provided with an oil supply tank (11) for storing maintenance oil. The oil supply tank (11) and the buffer tank (1001) are connected by an output pipe (12). A sponge block (13) is provided in the telescopic groove (1002) of the buffer tank (1001). The sponge block (13) is located on the lower side of the telescopic support (1003). An oil overflow hole (14) is provided inside the telescopic support (1003). One end of the oil overflow hole (14) faces the lower surface of the sponge strip (10010), and the other end of the oil overflow hole (14) faces the upper surface of the sponge block (13).

2. The device for improving vertical warpage of copper foil substrate according to claim 1, characterized in that: The reinforced frame (2) includes a lateral support plate, the top of which is provided with a canopy, and the processing channel (3) is formed between the lateral support plate, the canopy and the control platform (1).

3. The device for improving vertical warpage of copper foil substrate according to claim 2, characterized in that: The lateral support plate is provided with a number of guide wheels (9), which are located at the output end near the processing path.

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