Packaging carrier and machine

Abstract

The application provides a packaging carrier and a machine, which comprises a carrier plate, a pressing plate and a plurality of lifting pads; the carrier plate is used for carrying a substrate, the upper surface of the carrier plate is provided with a first groove, and the first groove is used for providing a deformation space for the substrate; the pressing plate is located on the upper surface of the substrate and exposes the upper surface of the part of the substrate which is in contact with a chip, and is used for providing a downward pressure to the substrate; the plurality of lifting pads are arranged in an array in the first groove, the lifting pads are movable in the vertical direction, the upper surface of the lifting pads is lower than the upper surface of the carrier plate when the lifting pads are moved to a lower limit position, and the upper surface of the lifting pads is higher than the upper surface of the carrier plate when the lifting pads are moved to an upper limit position. The packaging carrier of the application has a wide range of applications, and the warping conditions of the substrate and the chip can be made consistent by adjusting the height of the lifting pads, the adjustment is flexible, the packaging carrier is not customized, the work efficiency is greatly improved, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to the field of microelectronics, and in particular to a packaging carrier and machine. Background Technology

[0002] With the development of the microelectronics field, chips are trending towards miniaturization and high density. Among them, flip-chip technology is widely used due to its advantages such as short leads, direct connection of bumps to the substrate, and low crosstalk between signals.

[0003] However, as chip and substrate sizes increase, high warpage has become an unavoidable problem in the packaging field. To avoid issues like cold solder joints and bridging, the substrate and chip must exhibit the same warpage during reflow soldering. Therefore, custom-designed packaging carriers are often required to address the chip's warpage. In production, a suitable packaging carrier type can be selected through initial verification before customization. However, packaging carrier production is time-consuming, expensive, inconvenient to store, and difficult to clean. Consequently, a significant amount of time is spent in the initial verification phase to validate the type of packaging carrier required for chip molding, resulting in low efficiency. Therefore, there is an urgent need for a packaging carrier that ensures the substrate and chip exhibit the same warpage while improving verification efficiency.

[0004] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a packaging carrier and machine tool to solve the problem of low verification efficiency of packaging carriers in the prior art.

[0006] In a first aspect, to achieve the above and other related objectives, this application provides a packaging carrier for bonding a substrate and a chip, the chip being located on the upper surface of the substrate, the packaging carrier comprising:

[0007] A carrier plate for supporting the substrate, the upper surface of the carrier plate having a first groove for providing deformation space for the substrate;

[0008] A pressure plate, located on the upper surface of the substrate and exposing the portion of the upper surface of the substrate that contacts the chip, is used to provide downward pressure to the substrate;

[0009] Multiple lifting pads are arranged in an array within the first groove. The lifting pads move in the vertical direction. When the lifting pad is moved to the lower limit position, the upper surface of the lifting pad is lower than the upper surface of the carrier plate. When the lifting pad is moved to the higher limit position, the upper surface of the lifting pad is higher than the upper surface of the carrier plate.

[0010] In one embodiment, the lifting pad includes:

[0011] The ejector pin is located within the first groove and moves in the vertical direction;

[0012] The boss is movably / fixedly connected to the ejector pin and is used to follow the ejector pin in the vertical direction.

[0013] In one embodiment, the packaging carrier includes:

[0014] A through hole, located in the area of ​​the first groove and penetrating the carrier plate, is used to accommodate the ejector pin, and the inner surface of the through hole includes spiral patterns;

[0015] The ejector pin surface includes spiral patterns that correspond to the spiral patterns on the inner surface of the through hole.

[0016] In one embodiment, the packaging carrier further includes:

[0017] A magnetic component, located within the carrier plate, is used to attract the pressure plate.

[0018] In one embodiment, the packaging carrier further includes:

[0019] A limiting member, connected to the pressure plate, is located on the lower surface of the pressure plate surrounding the chip and protrudes from the lower surface of the pressure plate.

[0020] In one embodiment, the packaging carrier further includes:

[0021] Multiple pores are located in the area of ​​the carrier plate other than the first groove, for adsorbing the substrate.

[0022] In one embodiment, the packaging carrier further includes:

[0023] The second groove, located on the side surface of the carrier plate, is used to provide deformation space for the substrate.

[0024] In one embodiment, the packaging carrier further includes:

[0025] The heat dissipation groove is located in the area of ​​the carrier plate not covered by the substrate and is used for heat dissipation.

[0026] In one embodiment, the packaging carrier further includes:

[0027] The first positioning groove is located at the edge of the carrier plate;

[0028] The second positioning groove is located on the edge of the pressure plate and is correspondingly provided with the first positioning groove. When the pressure plate and the carrier plate are pressed together, the first positioning groove and the second positioning groove coincide in the vertical direction.

[0029] Secondly, this application provides a machine tool, including: the packaging carrier described in any one of the embodiments of this application.

[0030] As described above, the packaging carrier and machine tool of this application have the following beneficial effects:

[0031] The packaging carrier and machine of this application include a carrier plate, a pressure plate, and a plurality of lifting pads; wherein, the carrier plate is used to support the substrate, and the upper surface of the carrier plate has a first groove for providing deformation space for the substrate; the pressure plate is located on the upper surface of the substrate and exposes the upper surface of the substrate that contacts the chip, for providing downward pressure to the substrate; the plurality of lifting pads are arranged in an array within the first groove, and the lifting pads move in the vertical direction. When the lifting pads are moved to the lower limit position, the upper surface of the lifting pads is lower than the upper surface of the carrier plate, and when the lifting pads are moved to the higher limit position, the upper surface of the lifting pads is higher than the upper surface of the carrier plate. In one scenario, when the upper surface of the lifting pad is lower than the upper surface of the carrier board, the pressure plate applies downward pressure to the substrate, causing the area in the substrate corresponding to the position of the first groove to bend downwards, thus changing the warping of the substrate into a "smiley face" shape, matching the warping of the "smiley face" chip. In another scenario, when the upper surface of the lifting pad is higher than the upper surface of the carrier board, the pressure plate applies downward pressure to the substrate, causing the area in the substrate corresponding to the position of the first groove to bend upwards, thus changing the warping of the substrate into a "crying face" shape, matching the warping of the "crying face" chip. Furthermore, by adjusting the height of the lifting pads, the warpage curvature of the substrate can be improved, better adapting to the warpage of the chip. Moreover, since the lifting pads in this application are arranged in an array, they can also be used when multiple chips are soldered to the substrate at the same time, and the warpage of each chip can be different. The packaging carrier of this application is not limited to the warpage of multiple chips, has a wide range of applications, and the warpage of the substrate and the chip can be made consistent by adjusting the height of the lifting pads. The adjustment is flexible, avoids the need for customized packaging carriers, greatly improves work efficiency, and reduces production costs. Attached Figure Description

[0032] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the embodiments of this application and to illustrate the implementation of this application, together with the textual description, to explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application.

[0033] Figure 1 This is a schematic diagram of the structure of the packaging carrier provided in one embodiment;

[0034] Figure 2 This is a schematic diagram of the structure of the lifting gasket in a packaging carrier provided in one embodiment;

[0035] Figure 3 This is a schematic diagram of the packaging carrier provided in another embodiment;

[0036] Figure 4 This is a schematic diagram of the packaging carrier provided in yet another embodiment;

[0037] Figure 5 This is a schematic diagram of the carrier board of the packaging structure provided in one embodiment;

[0038] Figure 6 This is a schematic diagram of the pressure plate of the encapsulation structure provided in one embodiment;

[0039] Figure 7a This is a schematic diagram of the pressure plate of the encapsulation structure provided in another embodiment;

[0040] Figure 7b This is a schematic diagram of the carrier board of the packaging structure provided in another embodiment.

[0041] Component designation explanation

[0042] 10 carrier boards

[0043] 20 pressure plate

[0044] 301 thimble

[0045] 302 convex surface

[0046] 30 Lifting Gasket

[0047] 40 First Groove

[0048] 50 substrate

[0049] 60 chips

[0050] 70 Second Groove

[0051] 80 Magnetic components

[0052] 90 Limiting component

[0053] 110 pores

[0054] 120 heat sink

[0055] 130 First positioning slot

[0056] 210 Second positioning groove

[0057] 220 Openwork area Detailed Implementation

[0058] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0059] It should be emphasized that the term "including / comprises" as used herein refers to the presence of a feature, whole, step, or component, but does not exclude the presence or addition of one or more other features, wholes, steps, or components.

[0060] Features described and / or illustrated for one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0061] In the detailed description of embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged and not to scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0062] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0063] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0064] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0065] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated features, wholes, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0066] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. Where applicable, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the invention. Therefore, the illustrations only show components relevant to the invention and are not drawn according to the actual number, shape, and size of components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex.

[0067] In general technology, a packaging carrier can be used to weld a substrate and a chip. The substrate can be placed inside the packaging carrier, and the packaging carrier exposes at least the upper surface of the substrate that is used for welding with the chip. The chip can be flipped and placed on the upper surface of the substrate so that the bumps, solder points, etc. on the chip come into contact with the substrate, thereby welding the substrate and the chip.

[0068] As described in the background section, with the increasing size of chips and substrates, high warpage has become an unavoidable problem in the packaging field. To avoid issues such as cold solder joints and bridging, the substrate and chip must exhibit the same warpage during reflow soldering. Therefore, it is often necessary to customize packaging carriers specifically for the chip's warpage. In production, the appropriate type of packaging carrier can be selected through early verification before customization. However, the production cycle of packaging carriers is long, the cost is high, storage is inconvenient, and cleaning is difficult. Consequently, a significant amount of time must be spent in the early verification stage to verify the type of packaging carrier required for the chip molding process, resulting in low work efficiency. Therefore, there is an urgent need to provide a packaging carrier that can ensure the substrate and chip exhibit the same warpage and improve verification efficiency.

[0069] For the reasons mentioned above, please refer to Figure 1 This application provides a packaging carrier, which includes a carrier plate 10, a pressure plate 20, and a plurality of lifting gaskets 30.

[0070] The carrier plate 10 is used to support the substrate 50. The upper surface of the carrier plate 10 has a first groove 40, which is used to provide deformation space for the substrate 50.

[0071] As an example, the carrier plate 10 includes a support region for supporting the substrate 50, and a first groove 40 may be located at the center of the support region. The projection of the first groove 40 toward the upper surface of the carrier plate 10 lies within the support region, and the support region includes an area that does not overlap with the projection of the first groove 40 toward the upper surface of the carrier plate.

[0072] As an example, the shape of the first groove 40 is the same as the shape of the substrate 50, thereby better dispersing the force generated by the contact between the substrate 50 and the carrier plate 10. For example, the shape of the first groove 40 may include a circle, a rectangle, etc.

[0073] The pressure plate 20 is located on the upper surface of the substrate 50 and exposes the portion of the upper surface of the substrate 50 that contacts the chip 60, and is used to provide downward pressure to the substrate 50.

[0074] As an example, the pressure plate 20 may include an annular pressure plate disposed around the outer edge of the substrate 50, or the pressure plate 20 may include a plurality of sub-pressure plates, each sub-pressure plate being symmetrically disposed with the center of the exposed upper surface of the substrate 50 as a symmetry point. In addition, the pressure plate 20 may also include a movable pressure plate, which can adjust the size of the area of ​​the exposed upper surface of the substrate 50.

[0075] As an example, the pressure plate 20 can be connected to a drive component, such as a cylinder, to provide downward pressure on the substrate 50.

[0076] Multiple lifting pads 30 are arranged in an array within the first groove 40. The lifting pads 30 move in the vertical direction. When the lifting pads 30 are moved to the lower limit position, the upper surface of the lifting pads 30 is lower than the upper surface of the carrier plate 10. When the lifting pads 30 are moved to the higher limit position, the upper surface of the lifting pads 30 is higher than the upper surface of the carrier plate 10.

[0077] The lower limit position is the lowest position that the lifting pad 30 can move to in the vertical direction, and the higher limit position is the highest position that the lifting pad 30 can move to in the vertical direction. The upper surface of the carrier plate 10 is the surface that directly contacts the substrate 50.

[0078] As an example, when the upper surface of the lifting pad 30 is lower than the upper surface of the carrier plate 10, the pressure plate 20 provides downward pressure to the substrate 50, and the area in the substrate 50 corresponding to the position of the first groove 40 can bend downward, thereby making the warping of the substrate 50 into a "smiley face" that matches the warping of the "smiley face" chip 60; when the upper surface of the lifting pad 30 is higher than the upper surface of the carrier plate 10, the pressure plate 20 provides downward pressure to the substrate 50, and the area in the substrate 50 corresponding to the position of the first groove 40 can bend upward, thereby making the warping of the substrate 50 into a "crying face" that matches the warping of the "crying face" chip 60.

[0079] As an example, chip 60 may include multiple chips 60 to be soldered, and substrate 50 may be soldered to multiple chips 60 simultaneously. For example, when chip 60 includes a first warped chip and a second warped chip, the warping of the first warped chip is a "crying face" and the warping of the second warped chip is a "smiling face". After flipping the first warped chip and the second warped chip and placing them on the surface of substrate 50, by adjusting the height of the lifting pads 30 corresponding to the positions of the first warped chip and the second warped chip, the warping of the areas in substrate 50 corresponding to the warping of the first warped chip and the second warped chip is made to correspond to the warping of the first warped chip and the second warped chip respectively, thereby realizing the simultaneous soldering of multiple chips 60.

[0080] In the above embodiments, the packaging carrier includes a carrier plate, a pressure plate, and a plurality of lifting pads. The carrier plate is used to support the substrate, and the upper surface of the carrier plate has a first groove for providing deformation space for the substrate. The pressure plate is located on the upper surface of the substrate and exposes the upper surface of the substrate that contacts the chip, for providing downward pressure to the substrate. The plurality of lifting pads are arranged in an array within the first groove. The lifting pads move in the vertical direction. When the lifting pads are moved to the lower limit position, the upper surface of the lifting pads is lower than the upper surface of the carrier plate. When the lifting pads are moved to the higher limit position, the upper surface of the lifting pads is higher than the upper surface of the carrier plate. By adjusting the height of the lifting pads, the warpage curvature of the substrate can be improved, better adapting to the warpage of the chip. Furthermore, since the lifting pads in this application are arranged in an array, they can also be used when multiple chips are soldered to the substrate at the same time, and the warpage of each chip can be different. The packaging carrier of this application is not limited to the warpage of multiple chips, has a wide range of applications, and the warpage of the substrate and the chip can be made consistent by adjusting the height of the lifting pads. The adjustment is flexible, avoids the need for customized packaging carriers, greatly improves work efficiency, and reduces production costs.

[0081] In some embodiments, please refer to Figure 1 The lifting gasket 30 includes: a pin 301 and a boss 302.

[0082] The ejector pin 301 is located in the first groove 40 and moves in the vertical direction.

[0083] The boss 302 is fixedly connected to the ejector pin 301 and is used to follow the ejector pin 301 in the vertical direction.

[0084] As an example, the boss 302 can be glued to the ejector pin 301 or integrally formed with the ejector pin 301 to improve the stability of the boss 302.

[0085] In some embodiments, the lifting pad 30 includes a pin 301 and a boss 302.

[0086] The ejector pin 301 is located in the first groove 40 and moves in the vertical direction.

[0087] The boss 302 is movably connected to the ejector pin 301 and is used to follow the ejector pin 301 in the vertical direction.

[0088] As an example, the ejector pin 301 can be snapped into the boss 302, which facilitates the disassembly and replacement of the boss 302. The boss 302 can correspond one-to-one with the ejector pin 301, or one boss 302 can be connected to multiple ejector pins 301. This allows the size of the boss 302 to be adjusted according to the soldering requirements of the chip 60 or the substrate 50, thereby increasing the applicability of the packaging carrier.

[0089] In some embodiments, please refer to Figure 2 The packaging carrier includes: a through hole located in the area of ​​the first groove 40 and penetrating the carrier plate 10, for accommodating the ejector pin 301, the inner surface of the through hole including spiral patterns; wherein, the surface of the ejector pin 301 includes spiral patterns corresponding to the spiral patterns on the inner surface of the through hole.

[0090] As an example, the movement of the ejector pin 301 in the vertical direction can be controlled by rotating the ejector pin.

[0091] In some embodiments, the packaging carrier includes: a through hole located in the area of ​​the first groove and penetrating the carrier plate for accommodating a ejector pin; the inner surface of the through hole includes a groove, and the sidewall of the groove includes a plurality of limiting ports; wherein, the ejector pin surface includes a slider, which can slide in the groove, and when the slider moves to the limiting port, it can be fixed in position.

[0092] In some embodiments, please refer to Figure 3 The packaging carrier also includes a second groove 70, which is located on the side surface of the carrier plate 10 and is used to provide deformation space for the substrate 50.

[0093] In the above embodiments, by providing a second groove on the side surface of the carrier plate, the substrate can be further provided with deformation space, increasing the warpage curvature of the substrate so as to fit with the chip.

[0094] In some embodiments, please refer to Figure 2 The packaging carrier also includes a magnetic component 80, located within the carrier plate 10, for adsorbing the pressure plate 20.

[0095] As an example, the material of the pressure plate 20 may include a ferromagnetic material, and the magnetic element 80 may generate an attractive force on the pressure plate 20, thereby enabling the pressure plate 20 to provide downward pressure to the substrate 50.

[0096] As an example, the magnetic element 80 may include a plurality of magnetic beads, the positions of which within the carrier plate 10 correspond to the positions of the pressure plate 20.

[0097] In some embodiments, please refer to Figure 4 The packaging carrier also includes a limiting member 90, which is connected to the pressure plate 20, located on the lower surface of the pressure plate 20 around the chip 60, and protrudes from the lower surface of the pressure plate 20.

[0098] In the above embodiments, by including the limiting member 90 in the packaging carrier, the warpage of the substrate 50 can be further increased in order to better fit the chip 60.

[0099] In some embodiments, please refer to Figure 5 The packaging carrier also includes a plurality of vents 110 located in the area of ​​the carrier plate 10 other than the first groove, for adsorbing the substrate 50.

[0100] As an example, the vent 110 is located in the carrier area of ​​the carrier plate 10 for supporting the substrate. The vent 110 can be connected to an air source. By allowing airflow to pass through the vent 110, an adsorption force can be generated, thereby adsorbing the substrate and preventing the substrate 50 from shifting during the welding process, thus improving the accuracy of welding.

[0101] In some embodiments, please refer to Figure 5 The packaging carrier also includes a heat sink 120, located in the area of ​​the carrier 10 not covered by the substrate 50, for heat dissipation.

[0102] In the above embodiments, by setting heat dissipation grooves, heat can be dissipated during the welding process, avoiding heat concentration that could cause components on the substrate to fail.

[0103] In some embodiments, please refer to Figure 5 and Figure 6 The packaging carrier also includes: a first positioning groove 130 and a second positioning groove 210.

[0104] The first positioning groove 130 is located at the edge of the carrier plate 10;

[0105] The second positioning groove 210 is located at the edge of the pressure plate 20 and is correspondingly set to the first positioning groove 130. When the pressure plate 20 and the carrier plate 10 are pressed together, the first positioning groove 130 and the second positioning groove 320 coincide in the vertical direction.

[0106] In the above embodiments, by setting the first positioning groove and the second positioning groove, the positioning of the carrier plate and the pressure plate can be realized, and misalignment of the carrier plate and the pressure plate can be avoided.

[0107] In some embodiments, this application also provides a packaging verification carrier, which may include multiple packaging carriers to simultaneously verify multiple substrates and chips, thereby improving the efficiency of verification work.

[0108] For example, please refer to Figure 7a and Figure 7bThe packaging carrier may include a pressure plate 20 and a carrier plate 10. The pressure plate 20 includes a plurality of cutout areas 220, which expose the upper surface of each substrate 50 in contact with the chip 60. The carrier plate 10 includes a plurality of support areas for supporting the substrate 50. Each support area includes a first groove 40 and a plurality of pores 110 for adsorbing the substrate 50.

[0109] In some embodiments, this application also provides a machine tool, including a packaging carrier.

[0110] The packaging carrier includes a carrier plate, a pressure plate, and multiple lifting pads.

[0111] A carrier plate is used to support a substrate. The upper surface of the carrier plate has a first groove, which provides space for deformation of the substrate.

[0112] A pressure plate, located on the upper surface of the substrate and exposing the portion of the upper surface where the substrate contacts the chip, is used to apply downward pressure to the substrate.

[0113] Multiple lifting pads are arranged in an array within the first groove. The lifting pads move vertically. When the lifting pads are moved to the lower limit position, the upper surface of the lifting pads is lower than the upper surface of the carrier plate. When the lifting pads are moved to the higher limit position, the upper surface of the lifting pads is higher than the upper surface of the carrier plate.

[0114] The lower limit position is the lowest position that the lifting pad can move to in the vertical direction, and the higher limit position is the highest position that the lifting pad can move to in the vertical direction. The upper surface of the carrier plate is the surface that directly contacts the substrate.

[0115] As an example, when the upper surface of the lifting pad is lower than the upper surface of the carrier board, the pressure plate applies downward pressure to the substrate, and the area in the substrate corresponding to the position of the first groove can bend downward, thereby making the warping of the substrate into a "smiley face" that matches the warping of the "smiley face" chip; when the upper surface of the lifting pad is higher than the upper surface of the carrier board, the pressure plate applies downward pressure to the substrate, and the area in the substrate corresponding to the position of the first groove can bend upward, thereby making the warping of the substrate into a "crying face" that matches the warping of the "crying face" chip.

[0116] As an example, a chip may include multiple chips to be soldered, and a substrate may be soldered to multiple chips simultaneously. For instance, when the chip includes a first warped chip and a second warped chip, the warping of the first warped chip is a "crying face," and the warping of the second warped chip is a "smiling face." The first and second warped chips are flipped and placed on the surface of the substrate. By adjusting the height of the lifting pads corresponding to the positions of the first and second warped chips, the warping of the areas on the substrate corresponding to the first and second warped chips corresponds to the warping of the first and second warped chips, respectively, thereby enabling the simultaneous soldering of multiple chips.

[0117] In some embodiments, the lifting pad includes a pin and a boss.

[0118] The ejector pin is located in the first groove and moves in the vertical direction.

[0119] The boss is fixedly connected to the ejector pin and is used to follow the ejector pin in the vertical direction.

[0120] In some embodiments, the lifting pad includes a pin and a boss.

[0121] The ejector pin is located in the first groove and moves in the vertical direction.

[0122] The boss is movably connected to the ejector pin and is used to follow the ejector pin in the vertical direction.

[0123] In some embodiments, the packaging carrier includes: a through hole located in the region of the first groove and penetrating the carrier plate for accommodating a ejector pin, wherein the inner surface of the through hole includes a spiral pattern; wherein the ejector pin surface includes a spiral pattern corresponding to the spiral pattern on the inner surface of the through hole.

[0124] In some embodiments, the packaging carrier includes: a through hole located in the area of ​​the first groove and penetrating the carrier plate for accommodating a ejector pin; the inner surface of the through hole includes a groove, and the sidewall of the groove includes a plurality of limiting ports; wherein, the ejector pin surface includes a slider, which can slide in the groove, and when the slider moves to the limiting port, it can be fixed in position.

[0125] In some embodiments, the packaging carrier further includes a second groove located on the side surface of the carrier plate for providing deformation space for the substrate.

[0126] In some embodiments, the packaging carrier further includes a magnetic element located within the carrier plate for adsorbing the pressure plate.

[0127] In some embodiments, the packaging carrier further includes a limiting member connected to the pressure plate, located on the lower surface of the pressure plate surrounding the chip, and protruding from the lower surface of the pressure plate.

[0128] In some embodiments, the packaging carrier further includes a plurality of pores located in the area of ​​the carrier plate other than the first groove, for adsorbing the substrate.

[0129] In some embodiments, the packaging carrier further includes a heat sink located in an area of ​​the carrier that is not covered by the substrate, for heat dissipation.

[0130] In some embodiments, the packaging carrier further includes a first positioning groove and a second positioning groove.

[0131] The first positioning groove is located at the edge of the carrier plate;

[0132] The second positioning groove is located on the edge of the pressure plate and is set in correspondence with the first positioning groove. When the pressure plate and the carrier plate are pressed together, the first positioning groove and the second positioning groove coincide in the vertical direction.

[0133] In summary, the packaging carrier and machine of this application include a carrier plate, a pressure plate, and a plurality of lifting pads. The carrier plate is used to support a substrate, and the upper surface of the carrier plate has a first groove for providing deformation space for the substrate. The pressure plate is located on the upper surface of the substrate and exposes the upper surface of the substrate that contacts the chip, for providing downward pressure to the substrate. The plurality of lifting pads are arranged in an array within the first groove. The lifting pads move in the vertical direction. When the lifting pads are moved to the lower limit position, the upper surface of the lifting pads is lower than the upper surface of the carrier plate. When the lifting pads are moved to the higher limit position, the upper surface of the lifting pads is higher than the upper surface of the carrier plate. By adjusting the height of the lifting pads, the warpage curvature of the substrate can be improved, better adapting to the warpage of the chip. Furthermore, since the lifting pads in this application are arranged in an array, they can also be used when multiple chips are soldered to the substrate at the same time, and the warpage of each chip can be different. The packaging carrier of this application is not limited to the warpage of multiple chips, has a wide range of applications, and the warpage of the substrate and the chip can be made consistent by adjusting the height of the lifting pads. The adjustment is flexible, avoids the need for customized packaging carriers, greatly improves work efficiency, and reduces production costs.

[0134] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A packaging carrier, characterized in that, The packaging carrier is used for bonding a substrate and a chip, the chip being located on the upper surface of the substrate, the packaging carrier comprising: A carrier plate for supporting the substrate, the upper surface of the carrier plate having a first groove for providing deformation space for the substrate; A pressure plate, located on the upper surface of the substrate and exposing the portion of the upper surface of the substrate that contacts the chip, is used to provide downward pressure to the substrate; Multiple lifting pads are arranged in an array within the first groove. The lifting pads move in the vertical direction. When the lifting pad is moved to the lower limit position, the upper surface of the lifting pad is lower than the upper surface of the carrier plate. When the lifting pad is moved to the higher limit position, the upper surface of the lifting pad is higher than the upper surface of the carrier plate.

2. The packaging carrier according to claim 1, characterized in that, The lifting pad includes: The ejector pin is located within the first groove and moves in the vertical direction; The boss is movably / fixedly connected to the ejector pin and is used to follow the ejector pin in the vertical direction.

3. The packaging carrier according to claim 2, characterized in that, The packaging carrier includes: A through hole, located in the area of ​​the first groove and penetrating the carrier plate, is used to accommodate the ejector pin, and the inner surface of the through hole includes spiral patterns; The ejector pin surface includes spiral patterns that correspond to the spiral patterns on the inner surface of the through hole.

4. The packaging carrier according to claim 1, characterized in that, The packaging carrier further includes: A magnetic component, located within the carrier plate, is used to attract the pressure plate.

5. The packaging carrier according to claim 1, characterized in that, The packaging carrier further includes: A limiting member, connected to the pressure plate, is located on the lower surface of the pressure plate surrounding the chip and protrudes from the lower surface of the pressure plate.

6. The packaging carrier according to claim 1, characterized in that, The packaging carrier further includes: Multiple pores are located in the area of ​​the carrier plate other than the first groove, for adsorbing the substrate.

7. The packaging carrier according to claim 1, characterized in that, The packaging carrier further includes: The second groove, located on the side surface of the carrier plate, is used to provide deformation space for the substrate.

8. The packaging carrier according to claim 1, characterized in that, The packaging carrier further includes: The heat dissipation groove is located in the area of ​​the carrier plate not covered by the substrate and is used for heat dissipation.

9. The packaging carrier according to claim 1, characterized in that, The packaging carrier further includes: The first positioning groove is located at the edge of the carrier plate; The second positioning groove is located on the edge of the pressure plate and is correspondingly provided with the first positioning groove. When the pressure plate and the carrier plate are pressed together, the first positioning groove and the second positioning groove coincide in the vertical direction.

10. A machine tool, characterized in that, include: The packaging carrier according to any one of claims 1-9.

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