Carrier assembly for carrying semiconductor package strips with improved warpage control

Abstract

The present disclosure provides a carrier assembly for carrying semiconductor package strips, comprising: a carrier body comprising a housing, the housing comprising side walls with support slots for carrying the semiconductor package strips inside the housing respectively, and the housing defining a front opening and a rear opening between the side walls to allow placement and displacement of the semiconductor package strips; and a pair of clamping devices for applying a clamping force to the semiconductor package strips against the support slots respectively, and each of the pair of clamping devices comprising: a locking plate; a strip contact extension extending from the locking plate and insertable through one of the front opening and the rear opening of the housing; and a locking member for moving the strip contact extension between a locked position and an unlocked position, wherein in the locked position, a semiconductor package strip is pressed by the respective strip contact extension against the support slot.

Description

Invention Field

[0001] This invention generally relates to semiconductor manufacturing, and more particularly to a carrier assembly for carrying semiconductor package strips with improved warp control (especially during transport and manufacturing). Background Technology

[0002] Semiconductor devices are commonly used in modern electronic products. They perform a wide range of functions, such as signal processing, high-speed computing, transmitting and receiving electromagnetic signals, controlling electronic devices, photoelectric conversion, and generating visual images for television displays.

[0003] A conventional semiconductor wafer typically contains multiple semiconductor dies that can be separated by corresponding saw marks. Active and passive circuitry is formed on the surface of each semiconductor die. Interconnect structures may be formed above the surface of the semiconductor dies. The semiconductor wafer is divided into individual semiconductor dies for various electronic products. Individual semiconductor dies are typically hermetically sealed within a package, i.e., packaged for electrical interconnection, structural support, and environmental protection, forming a semiconductor package. The semiconductor dies are then physically and electrically connected to a carrier or substrate to form a semiconductor strip, hereinafter referred to as a strip or package strip. An encapsulant may then be formed over the semiconductor strip. The encapsulant can be of any type, such as thermosetting overmolding or epoxy resin.

[0004] Packaging processes sometimes involve heating, such as during curing, baking, and molding. For example, when a sealant is applied via molding, pre-baking before molding (PBM) is performed before the sealing strip to remove moisture from the strip for the purpose of eliminating voids and avoiding the risk of delamination. Post-curing can also be performed after molding. For PBM, the strip can be placed inside a carrier, which is often called a magazine. Figures 1A and 1B show package strips S, each having one or more semiconductor dies C attached to a substrate strip P, all placed inside a conventional magazine 102. Magazine 102 includes a housing 103 having a support groove 106, such as a horizontally extending slot or recess, on its inner surface 104 for carrying the strip S inside the housing 103. As can be seen, in the conventional housing illustrated in Figures 1A and 1B, if housing 102 is dropped or subjected to other unexpected movement, strip S can be moved from its resting position and thus damaged during transport of housing 102 or under other circumstances. Additionally, as illustrated in Figure 1B, heating strip S can cause it to warp. Warping can be caused, for example, by a mismatch in the coefficients of thermal expansion (CTE) of the various components of the package strip (e.g., the package substrate and the semiconductor die) or different layers of the package substrate. The amount of warping is also affected by the size, thickness, and material of the package substrate and / or the semiconductor die. This warping can lead to problems later in manufacturing and processing, and can cause damage to the semiconductor die and reduce wafer yield; therefore, it is necessary to reduce warping.

[0005] However, conventional bins only hold the sealing strips during processing, without addressing strip warping issues.

[0006] US Patent Publication No. 7,172,927 discloses a carrier assembly comprising a carrier having an angled platform and a side-insertion clamping structure. The clamping structure has angled clamping fins for controlling curing-induced warping of the encapsulation strip during post-sealant curing (PEC). The angled platform and angled side-insertion clamps are used to clamp the edges of the encapsulation strip to introduce intentional deformation that counteracts warping occurring during PEC.

[0007] Korean Patent Publication No. KR10-0716418 discloses a carrier assembly having a main body with an inner wall and an outer wall. The inner wall has an inwardly projecting guide platform and a slot between a retaining platform. The carrier assembly further includes a movable plate vertically mounted between the inner and outer walls, and the movable plate has a retaining platform for insertion into the slot to support a strip. The carrier assembly is used to clamp the strip between the guide platform and the retaining platform after the plate moves upward relative to the carrier assembly body. A locking member is provided to hold the plate at the end of the upward movement.

[0008] US Patent Publication No. US20220392795 discloses a semiconductor manufacturing apparatus comprising: a lower shell extension fixed in a suitable position within the outer shell to support a semiconductor plate, and an inner shell having an upper shell extension disposed within the outer shell and adjacent to the lower shell extension. The apparatus includes a cam assembly disposed above the inner shell and operable by a handle to rotate the cam assembly and apply pressure to the inner shell and the upper shell extension to lock the semiconductor plate in a suitable position between the upper and lower shell extensions. A spring or other elastic mechanism is disposed below the inner shell to load the pressure.

[0009] There is a need for further improvement and enhancement of conventional storage boxes. Summary of the Invention

[0010] One object of this application is to provide a semiconductor carrier assembly for carrying semiconductor package strips for, for example, transportation and manufacturing processes.

[0011] According to one aspect of this application, a carrier assembly for carrying semiconductor package strips is provided. The carrier assembly includes: a carrier body comprising a housing having sidewalls having support grooves for respectively carrying semiconductor package strips within the housing, and the housing defining a front opening and a rear opening between the sidewalls to allow placement and displacement of the semiconductor package strips; and a pair of clamping devices for applying clamping forces against the support grooves to the semiconductor package strips, each of the pair of clamping devices including: a locking plate; a strip contact extension extending from the locking plate and insertable through one of the front and rear openings of the housing; and a locking member for moving the strip contact extension between a locked position and an unlocked position, wherein in the locked position, the semiconductor package strip is pressed against the support groove by the corresponding strip contact extension.

[0012] By compressing each encapsulation strip between the strip contact extension and the corresponding support groove, the present invention allows for reduced strip warpage, especially during the strip encapsulation process, such as during PBM.

[0013] The carrier body according to the present invention can be a conventional container. In this way, the present invention provides a simple and cost-effective way to improve conventional containers so as to securely carry packaging strips within the container and reduce warping during strip handling.

[0014] According to another aspect of this application, a clamping device is provided for a housing including a casing, the casing including sidewalls having support grooves for carrying packaging strips inside the casing, each strip being carried by a corresponding support groove. The clamping device includes: a strip contact extension configured to insert through a front opening or a rear opening of the casing; and a locking member for holding the strip contact extension in a predetermined position, the strip contact extension being configured to press each strip toward the corresponding support groove that supports the packaging strip in the predetermined position.

[0015] According to another aspect of this application, a method for carrying semiconductor package strips with a carrier assembly is provided, wherein the carrier assembly includes a carrier body and a pair of clamping devices. The method includes: placing the semiconductor package strips through one of a front opening and a rear opening of a housing of the carrier body and inside the housing, wherein each of the semiconductor package strips is carried between a pair of support grooves on a pair of sidewalls of the housing; attaching the pair of clamping devices to the carrier body at the front and rear openings respectively, such that a strip contact extension extending from a locking plate of each clamping device can be inserted through one of the front and rear openings of the housing to a distance above the semiconductor package strip; and moving the strip contact extensions to a locked position, such that clamping forces are applied to the semiconductor package strips by the strip contact extensions abutting against the support grooves.

[0016] This invention allows for improvement of warpage problems by applying a clamping device to existing cartridges, and thus provides a cost-effective solution for strip warpage. If warpage improvement is required in the case of strips, the method of this invention can be used before splitting. This invention can reduce warpage problems in heating processes (e.g., in pre-baking and post-curing processes), for example, in the case of double-sided molding. In cases where severe warpage occurs after top molding, this invention allows for improvement of warpage by utilizing a pre-baking step of the cartridge before bottom molding.

[0017] It should be understood that the foregoing general description and the following detailed description are merely illustrative and explanatory and do not limit the invention. Furthermore, the accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. Attached Figure Description

[0018] The accompanying drawings cited herein form part of the specification. Unless otherwise expressly stated, the features shown in the drawings illustrate only some embodiments of this application and not all embodiments of this application, and the reader of the specification should not imply the contrary.

[0019] Figures 1A and 1B show conventional semiconductor carriers in the form of a cassette in the front view and side view, respectively.

[0020] Figure 2A and Figure 2BThe carrier assembly according to an embodiment of the invention, preceding the locking clamping device, is shown in the front view and side view, respectively.

[0021] Figure 3A and Figure 3B The rear of the locking clamping device is shown in both the front and side views. Figure 2A and Figure 2B The carrier component.

[0022] Figure 4A and Figure 4B Examples of clamping devices are shown in the front and side views, before and after the locking clamping device. Figure 4C The locking process is shown.

[0023] Figure 5 A variation of an embodiment of the clamping device is shown in the side view.

[0024] The same reference numerals will be used throughout the drawings to refer to the same or similar parts. Detailed Implementation

[0025] The following detailed description of exemplary embodiments of this application takes into account the accompanying drawings, which form part of this specification. The drawings illustrate specific exemplary embodiments of this application in which they may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art can further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader should not interpret this specification in a limiting sense, and only the appended claims define the scope of embodiments of this application.

[0026] In this application, unless otherwise expressly stated, the singular includes the plural. In this application, unless otherwise stated, the use of “or” means “and / or”. Furthermore, the use of the term “comprising” and other forms such as “including” and “containing” are not limiting. Furthermore, unless otherwise expressly stated, terms such as “element” or “component” cover elements and components comprising one unit, as well as elements and components comprising more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0027] As used herein, spatially relative terms such as “below,” “under,” “above,” “over,” “upper,” “upper side,” “lower side,” “left side,” “right side,” “vertical,” “horizontal,” “side,” etc., may be used herein to describe the relationship between one element or feature and another element or feature as shown in the accompanying figures. In addition to the orientations depicted in the figures, spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, it may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0028] As mentioned above, warpage of the package strip can occur during manufacturing, particularly during heat treatment. Warpage can damage the semiconductor die and reduce wafer yield, therefore minimizing warpage is necessary. Furthermore, if the strip warpage problem is mitigated, for example, when the strip warpage is less than 3.0 mm, it becomes possible to automate the process during molding, which would reduce manufacturing costs. To address these issues, this application provides a clamping device for clamping the package strip inside a cartridge in a locked position.

[0029] Figure 2A and Figure 2B The illustrations include a front view and a side view of a carrier assembly 200 comprising a carrier body 202 and a clamping device 210 prior to an embodiment of the present invention. The carrier body 202 may be a conventional cartridge, which may require additional tools to improve the security of the semiconductor package strips carried therein and control warping.

[0030] like Figure 2A and Figure 2B As shown, the carrier body 202 includes a housing 203 having a top wall 221, a bottom wall 222, and side walls 223, the side walls connecting the top wall 221 and the bottom wall 222. The side walls 223 may include support grooves 206 on their inner surface 204 for carrying packaging strips 300. Each strip 300 rests on a corresponding support groove 206. The support grooves 206 are, for example, in the form of ribs or recesses extending horizontally along the inner surface 204 of the side walls 223. The support grooves 206 are preferably positioned at regular intervals between the top wall 221 and the bottom wall 222 of the housing 203. The housing 203 further includes a front opening 224 and a rear opening 225 on its front and rear ends, respectively, between the side walls 222 and 223. The packaging strip S can be introduced into the housing 203 from either the front opening 224 or the rear opening 225. The housing 203 is preferably substantially parallelepiped. The front and rear openings preferably have the same dimensions.

[0031] In such Figure 2B In the illustrated embodiment, once the strip 300 warps, it rests in the support groove via the central region 301 of the strip S. The two edges 302 of the strip S, located near the front and rear ends of the housing 203, are raised compared to the central region 301 of the strip 300. More specifically, regarding the support groove 206 in which the strip 300 rests, the edges 302 of the strip 300 located near the front or rear end of the housing 203 (i.e., the front or rear edge 302 of the strip 300) may become higher compared to the central region 301 of the strip 300. During encapsulation, such as during pre-baking or post-curing before the molding process, the deviation of the edges 302 may become even greater if measurements for controlling strip warping are not performed.

[0032] In this invention, a pair of clamping devices 210 are respectively arranged at the front and rear ends of the housing 203. The two clamping devices 210 are preferably identical. Each clamping device 210 includes a locking plate 213 adapted to be placed against a front opening 224 or a rear opening 225 of the housing 203. As described, the locking plate 213 includes a strip contact extension 216 on an inwardly oriented surface 214 facing the carrier body 202, which preferably takes the form of a fin projecting vertically from the locking plate 213. The strip contact extensions 216 preferably extend parallel to each other. Each strip contact extension 216 can be inserted a certain distance above a corresponding support groove 206 to contact the front or rear edge 302 of the semiconductor package strip 300 carried by the corresponding support groove 206. In particular, each strip contact extension 216 is inserted above the front or rear edge 302 of the strip 300. Each strip contact extension 216 is preferably inserted near and above the front or rear edge 302 of the strip 300 for a distance, said distance depending, for example, on the degree of warping of the strip before insertion of the strip contact extension 216. In one embodiment, the strip contact extension 216 may have a rounded end. Preferably, the strip contact extension 216 extends along the entire width W of the locking plate 213. The strip contact extensions 216 are preferably arranged at equal intervals on the inwardly oriented surface 214 of the clamping device 210. For example, the distance between adjacent strip contact extensions 216 is equal to the distance between adjacent support slots 206 of the housing 203.

[0033] The locking plate 213 is configured to move vertically relative to the assembly body 202 after the insertion bar contact extension 216 and before the locking bar contact extension 216. This movement of the locking plate 213 thus allows vertical movement of the bar contact extension 216 relative to the housing 203. (As in...) Figure 3BAs can be seen, the downward movement of the strip contact extension 216 relative to the housing 203 causes the strip contact extension 216 to press against the front and rear edges 302 of the strip 300. The force exerted by the strip contact extension 216 on the front and rear edges 302 of the strip 300 tends to compress the strip 300, and thus counteracts the deviation of the edge 302 of the strip 300 relative to the center region 301 of the strip 300, thereby controlling or reducing the warping of the strip 300.

[0034] Once the desired movement of the strip contact extension 216 is achieved, the strip contact extension 216 is held in a locked position via the locking member 218 of the clamping device 210. The locking member 218 may include a first locking element 217 and a second locking element 219, which may engage or further disengage from each other. The first locking element 217 is, for example, fixed to a locking plate 213 and movable with the locking plate 213. The locking element 219 is, for example, fixed to another part of the clamping device and cannot move vertically relative to the assembly body 202 after the strip contact extension 216 is inserted. The first locking element 217 and the second locking element 219 may engage with each other to lock the locking plate 213 relative to the housing 203 in a predetermined locked position. In one embodiment, the locking plate 213 may be locked in several different predetermined locked positions via the locking member 218, thus allowing different degrees of control over the warping of the strip 300. For example, the vertical position of the second locking element 219 can be adjusted to allow the first locking element 217 to engage with the second locking element 219 at different heights of the housing 203, thus locking the locking plate 213 and the strip contact extension 216 thereon in different positions. In one embodiment, the locking plate 213 may include a biasing element, for example, in the form of a spring. The biasing force of the biasing element can be adjusted to move the strip contact extension 216 to a corresponding locked position. The movement of the locking plate 213 can thus be controlled by the biasing element. For example, the locking plate 213 is configured to remain in its topmost position when unlocked to facilitate insertion of the strip contact extension in the unlocked position of the clamping device. In some embodiments, a force-detecting member may be deployed on the locking member 218 to detect, for example, a rebound force from the strip, to avoid applying a considerable force or pressure to the strip that could damage it.

[0035] Figure 4A and Figure 4B Examples of the locking component 218 in the unlocked and locked positions are shown respectively. Figure 4CThe locking process is illustrated with an enlarged view of the first locking element 217 and the second locking element 219. As shown, the second locking element 219 includes a rotatable plate 231 that can rotate horizontally about a hinge or other similar structure and a rod 232 inserted through an opening in the rotatable plate 231. The rod 232 includes a rod body 238, and translation of the rod body 238 within the opening can be blocked at a first end 241 of the rod by a blocking element 233 of the rod, for example, in the form of a screw fixed near the first end 241. The second end 242 of the rod 232 may include a protrusion extending perpendicular to the longitudinal direction of the rod 232. The first locking element 217 includes a corresponding groove 251 or slot for receiving the second end 242 of the rod 232 when the rod is in the locked position. The groove 251 includes a hole 252 for allowing the rod 232 to pass through. To lock the locking member 218, the second locking element 219 rotates upward to allow the second end 242 of the rod 232 to engage in the groove 251. Then, the rotatable plate 231 rotates downward to block the upward movement of the second end 242 of the rod 232.

[0036] The clamping device 210 may further include a support element, for example, in the form of a bracket 220, which cannot move vertically relative to the assembly body 202 after the insertion bar contacts the extension 216. A locking plate 213 may be translatably movable relative to the bracket 220, for example. For instance, the locking plate 213 may be vertically movable relative to the bracket 220, and the strip contact extension 216 may also be vertically movable. A second locking element 219 may be secured to the bracket 220. The locking plate 213 is at least partially housed within the bracket 220, while also being vertically movable within the bracket 220.

[0037] The clamping device 210 may further include an upper fixing element 211 and a lower fixing element 212 for positioning and optionally securing the clamping device 210 to the housing 203. Preferably, the distance between the upper fixing element 211 and the lower fixing element 212 is adjustable, allowing the user to adjust the distance according to the height of the carrier body 202. In one embodiment, the upper fixing element 211 is integrally formed with the support 220 of the clamping device 210. Each clamping device 210 may include two upper fixing elements 211 and two lower fixing elements 212.

[0038] In one embodiment, the clamping device 210 can be added sequentially to the carrier body 202. In one embodiment, the bracket 220 and locking plate 213 are horizontally movable relative to the lower fixing element 212. To place the clamping device 210 onto the carrier body 202, the carrier body 202 can first be placed on the lower fixing element 212. Subsequently, the bracket 220 and locking plate 213 are pushed horizontally toward the carrier body 202, for example via translational movement, to insert the strip contact extension 216 over the strip 300 via the front opening 224 and rear opening 225 of the housing 203. The horizontal movement of the bracket 220 can ensure alignment between the clamping device 210 and the carrier body 202, and the vertical movement of the bracket 220 is restricted or prohibited. The clamping device 210 can be configured such that when the strip contact extension 216 is fully inserted into the housing 203, the clamping device 210 (e.g., locking plate 213 or bracket 220) abuts the front opening 224 and rear opening 225 of the housing 203.

[0039] The clamping device 210 can be secured to the carrier body 202, for example, by screwing. For example, the upper fixing element 211 and the housing 203 may include screw holes that allow the clamping device 210 to be connected to the housing 203 by screwing. Other fixing members for connecting the clamping device 210 to the carrier body 202 do not extend beyond the scope of the invention.

[0040] In one embodiment, the lower fixing element 212 of the clamping device 210 is connected before the carrier body 202 is placed on the lower fixing element 212, in order to facilitate positioning the clamping device 210 on the carrier body 202. Figure 5 In one embodiment described herein, the lower fixing element 212 of the clamping device 210, placed in the front and rear portions of the carrier body 202, is integral. In this case, the clamping device of the embodiment of the present invention includes a front clamping portion and a rear clamping portion, each clamping portion corresponding to the clamping device 210 as previously described.

[0041] Example

[0042] During pre-baking (PBM) prior to the molding process, the clamping device according to the invention is added to the front and rear ends of a conventional cartridge. The warpage of the strip is compared with the warpage obtained with the same cartridge without the clamping device.

[0043] As can be seen from Table I below, compared with conventional bins, the present invention demonstrates better effectiveness in strip warpage control and improves strip warpage.

[0044] Furthermore, in the case of this invention, the strip warpage is less than 3.0 mm. In this case, the molding of the sealant can be automated, which further improves the efficiency and cost of the strip manufacturing process.

[0045]

[0046] Table I

[0047] The discussion herein includes numerous illustrative figures illustrating various portions of a carrier assembly used to carry semiconductor package strips. For clarity, these figures do not show all aspects of each example component. Any example components and / or methods provided herein may share any or all features with any or all other components and / or methods provided herein.

[0048] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made thereto, and other embodiments can be implemented without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of the practice of one or more embodiments of the invention disclosed herein. Therefore, the examples in this application and herein are intended to be considered exemplary only, and the true scope and spirit of the invention are indicated by the list of exemplary claims appended.

Claims

1. A carrier assembly for carrying semiconductor package strips, characterized in that, The carrier component includes: The carrier body includes a housing, the housing including sidewalls having support grooves for respectively carrying the semiconductor package strips inside the housing, and the housing defining a front opening and a rear opening between the sidewalls to allow placement and displacement of the semiconductor package strips. A pair of clamping devices for applying clamping forces to the semiconductor package strip against the support groove, and each of the pair of clamping devices includes: support Locking plate, A strip contact extension, extending from the locking plate and insertable through one of the front opening and the rear opening of the housing, and A locking member is provided for moving the strip contact extension between a locked position and an unlocked position, wherein in the locked position, a semiconductor package strip is pressed against the support groove by the corresponding strip contact extension. The locking member includes a first locking element and a second locking element configured to hold the strip contact extension in the locked position when the first locking element and the second locking element are engaged. A locking plate is configured to move vertically relative to the housing after the strip contact extension is inserted and before the strip contact extension is locked. The locking plate is also configured to move vertically relative to the support.

2. The carrier assembly according to claim 1, characterized in that, The pair of clamping devices are respectively arranged at the front opening and the rear opening of the housing of the carrier body.

3. The carrier assembly according to claim 1, characterized in that, Each contact extension can be inserted a distance above the corresponding support groove to contact the front or rear edge of the semiconductor package strip supported by the corresponding support groove.

4. The carrier assembly according to claim 1, characterized in that, The first locking element is fixed to the locking plate.

5. The carrier assembly according to claim 1, characterized in that, The second locking element is fixed to the bracket.

6. The carrier assembly according to claim 1, characterized in that, The clamping device and the housing include screw holes that allow the pair of clamping devices to be secured to the housing.

7. The carrier assembly according to claim 1, characterized in that, The contact extensions are in the form of fins that project vertically from the support and are parallel to each other.

8. A clamping device for applying clamping force to a semiconductor package strip in a housing, characterized in that, The housing includes sidewalls having support grooves for respectively carrying the semiconductor package strips inside the housing, and the housing defines a front opening and a rear opening between the sidewalls to allow placement and displacement of the semiconductor package strips, the clamping device including: support; Locking plate; A strip contact extension extending from the locking plate and insertable through one of the front opening and the rear opening of the housing; and A locking member is provided for moving the strip contact extension between a locked position and an unlocked position, wherein in the locked position, the semiconductor package strip is pressed against the support groove by the corresponding strip contact extension, the locking member including a first locking element and a second locking element configured to hold the strip contact extension in the locked position when the first locking element and the second locking element are engaged, a locking plate configured to move vertically relative to the housing after the strip contact extension is inserted and before the strip contact extension is locked, the locking plate also being configured to move vertically relative to the support.

9. The clamping device according to claim 8, characterized in that, The vertical position of the second locking element is adjustable so that the first locking element can engage with the second locking element at different heights of the housing.

10. A method for carrying a semiconductor package strip with a carrier assembly, characterized in that, The carrier assembly includes a carrier body and a pair of clamping devices, each of the pair of clamping devices including: a locking plate, a strip contact extension, a locking member, and a bracket, wherein the locking member includes a first locking element and a second locking element, the locking plate is configured to move vertically relative to the bracket, and the method includes: The semiconductor packaging strip is passed through one of the front and rear openings of the housing of the carrier body and placed inside the housing, wherein each of the semiconductor packaging strips is supported between a pair of support grooves on a pair of sidewalls of the housing; The pair of clamping devices are attached to the carrier body at the front opening and the rear opening, respectively, such that the strip contact extensions extending from the bracket of each clamping device can be inserted through one of the front opening and the rear opening of the housing to a distance above the semiconductor package strip. The locking plate is moved vertically relative to the housing; and The strip contact extension is moved to the locking position such that clamping forces are applied to the semiconductor package strip by the strip contact extension abutting against the support groove, wherein the first locking element and the second locking element engage with each other to hold the strip contact extension in the locking position.

11. The method according to claim 10, characterized in that, The method further includes: When the strip contact extension is in the locked position, a predetermined process is applied to the semiconductor package strip.

12. The method according to claim 11, characterized in that, The predetermined process is pre-baking before the molding process.

13. The method according to claim 10, characterized in that, The method includes securing the clamping device to the housing by screwing.

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