Circuit for transmitting radio frequency signals by using loudspeaker cable

Abstract

Various embodiments described herein support or provide for radio frequency signal transmission using speaker cables, including generating a differential audio signal by an audio hardware component included in a circuit; generating a radio frequency signal through a radio frequency hardware component contained in the circuit; and outputting the differential audio signal and the radio frequency signal through a speaker cable communicatively coupled with the circuitry, the speaker cable configured to operate as a planar inverted F antenna (PIFA) or a monopole antenna.

Description

Technical Field

[0001] The present disclosure relates to circuits, systems, and methods for using speaker cables as radio frequency signal transmission. Background Art

[0002] There are challenges when using speaker cables (or audio cables) for RF signal transmission. Speaker twisted-pair cables are generally not suitable for handling the high-frequency characteristics of RF signals, and the impedance adaptation space is low. Using audio cables for RF signal transmission can lead to inefficient antennas, which indirectly leads to insufficient isolation between audio signals and RF signals. This needs to be improved. Summary of the invention

[0003] The present application discloses a circuit, comprising:

[0004] an audio hardware component configured to output a differential audio signal;

[0005] A radio frequency hardware component configured to output a radio frequency signal;

[0006] an audio power amplifier output matching network communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor communicatively coupled to the negative signal output pad and a second capacitor;

[0007] a radio frequency matching network communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor; and

[0008] A speaker is communicatively coupled to a speaker cable, the speaker cable comprising a plurality of conductors communicatively coupled to the positive audio signal output pad and the negative signal output pad.

[0009] In a preferred example, the audio power amplifier output matching network includes a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor and a third inductor, the fourth capacitor is communicatively coupled to the first resistor and the second inductor, and the fifth capacitor is communicatively coupled to the second resistor and the third inductor.

[0010] In a preferred example, the first resistor and the second resistor are coupled in communication with ground.

[0011] In a preferred example, the frequency range of the RF signal is between 2.4 GHz and 2.5 GHz, wherein the audio power amplifier output matching network includes a hardware component that matches the impedance of the audio hardware component to the impedance of the speaker, and wherein the RF matching network includes a hardware component that matches the impedance of the RF hardware component to the impedance of the speaker. In other embodiments, the frequency range of the RF signal can also be other communication frequency bands, and the relevant device values ​​can be modified.

[0012] In a preferred example, the positive audio signal output pad is communicatively coupled to a positive conductor included in the speaker cable, and the negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

[0013] In a preferred embodiment, the speaker cable acts as an antenna for radio frequency signal transmission during operation.

[0014] In a preferred example, the energy of the radio frequency signal is transferred through the first capacitor, and no or almost no energy is transferred through the first inductor, resulting in the speaker cable acting as an antenna for radio frequency signal transmission.

[0015] In a preferred example, the antenna used for radio frequency signal transmission is a planar inverted F antenna (PIFA) or a monopole antenna.

[0016] In a preferred example, the first inductor is communicatively coupled to the negative signal output pad and directly coupled to ground without including the second capacitor.

[0017] In a preferred embodiment, the speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

[0018] The present application also discloses a method, comprising:

[0019] generating a differential audio signal via audio hardware components included in the circuit;

[0020] generating a radio frequency signal by means of a radio frequency hardware component included in the circuit; and

[0021] The differential audio signal and the radio frequency signal are output via a speaker cable communicatively coupled to the circuit, the speaker cable being configured to function as a planar inverted-F antenna (PIFA) or a monopole antenna.

[0022] In a preferred example, the circuit includes an audio power amplifier output matching network and a radio frequency matching network, wherein the audio power amplifier output matching network is communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor, wherein the first inductor is communicatively coupled to a negative signal output pad and a second capacitor, the radio frequency matching network is communicatively coupled to the radio frequency hardware component and a third capacitor, and the third capacitor is communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor.

[0023] In a preferred example, the audio power amplifier output matching network includes a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor, and a third inductor, the fourth capacitor is communicatively coupled to the first resistor and the second inductor, and the fifth capacitor is communicatively coupled to the second resistor and the third inductor.

[0024] In a preferred example, the positive audio signal output pad is communicatively coupled to a positive conductor included in the speaker cable, wherein the negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

[0025] In a preferred embodiment, the energy of the RF signal is transferred through the first capacitor, and no or almost no energy is transferred through the first inductor, so that the speaker cable acts as an antenna for RF signal transmission. In other words, the speaker twisted pair is used to achieve unidirectional transmission from power feed to ground feed, which is used for antenna radiation of RF signal.

[0026] In a preferred example, the first inductor is communicatively coupled to the negative signal output pad and directly coupled to ground without the second capacitor.

[0027] In a preferred embodiment, the speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

[0028] In a preferred example, the frequency range of the radio frequency signal is between 2.4 GHz and 2.5 GHz.

[0029] The present application also discloses a system, comprising:

[0030] an audio hardware component for outputting a differential audio signal;

[0031] A radio frequency hardware component for outputting a radio frequency signal;

[0032] an audio power amplifier output matching network communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor, the first inductor being communicatively coupled to a negative signal output pad and a second capacitor; a radio frequency matching network communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor being communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor; and a speaker communicatively coupled to a speaker cable, the speaker cable comprising a plurality of conductors communicatively coupled to the positive audio signal output pad and the negative signal output pad, the speaker cable being configured to act as a planar inverted-F antenna (PIFA) or a monopole antenna for radio frequency signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In the accompanying drawings, which are not necessarily drawn to scale, like numbers may describe similar components in different views. To facilitate identification of discussions of any particular element or behavior, the most significant digit in a reference numeral refers to the reference numeral in which the element is first introduced. Some embodiments are illustrated in the accompanying drawings by way of example and not limitation.

[0034] Figure 1 is a block diagram illustrating an example circuit configured for radio frequency signal transmission using a speaker cable in accordance with various embodiments.

[0035] Figure 2 is a flow chart illustrating an example method of using a speaker cable for radio frequency signal transmission in accordance with various embodiments.

[0036] Figure 3 is a block diagram illustrating a representative software architecture according to various embodiments, which can be used in conjunction with the various hardware architectures described herein.

[0037] Figure 4 is a block diagram illustrating machine components capable of reading instructions from a machine storage medium and performing any one or more of the methodologies discussed herein in accordance with various embodiments. DETAILED DESCRIPTION

[0038] The following description includes systems, methods, techniques, instruction sequences, and computer program products that embody the exemplary embodiments of the present disclosure. In the following description, for the purpose of explanation, a large number of specific details are provided to fully understand the embodiments. However, it will be apparent to those skilled in the art that the subject matter of the present invention can be practiced without these specific details.

[0039] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the subject matter. Thus, the phrases "in one embodiment" or "in an embodiment" that appear in various places throughout the specification do not necessarily all refer to the same embodiment.

[0040] For the purpose of explanation, specific configurations and details are provided so that the subject matter is fully understood. However, it will be apparent to one of ordinary skill in the art that the subject matter described can be practiced with the specific details set forth herein, or in various combinations. In addition, well-known features may be omitted or simplified in order not to complicate the described embodiments. Various embodiments may be given in this description, which are merely descriptions of specific embodiments. The scope or meaning of the claims is not limited to the embodiments given.

[0041] To reduce production costs, systems and / or circuits can be designed to use speaker cables (also known as audio cables) as antennas for radio frequency (RF) signal transmission. However, audio cables are generally not designed to handle the high frequencies and low impedance levels associated with RF signals. In different applications, RF signals can range from a few thousand Hertz (KHz) to multiple Gigahertz (GHz). Cables that handle RF signals are designed with specific impedance values ​​and shielding to minimize signal loss and interference and maintain signal integrity over long distances. Further, factors such as the run length and overall length of the audio cable can affect the quality of RF signal transmission. Other than changing the overall length of the speaker cable, there are not many options to improve the quality of RF signal transmission. Improvements are needed.

[0042] Various embodiments of the present invention include circuits, methods, and systems for radio frequency signal transmission. In particular, a circuit includes an audio hardware component, a radio frequency hardware component, an audio power amplifier output matching network, a radio frequency matching network, and a speaker cable communicatively coupled to a speaker. The speaker can refer to any audio speaker designed with different sizes, shapes, and sound quality characteristics. The audio hardware component is configured to output an audio signal (e.g., a differential audio signal). The radio frequency hardware component is configured to output a radio frequency signal. The audio power amplifier output matching network is communicatively coupled to the audio hardware component and a first capacitor, a positive audio signal output pad, and a first inductor, and the first inductor is communicatively coupled to the negative signal output pad and a second capacitor.

[0043] In various embodiments, a matching network may refer to a hardware component that matches the impedance of a source to the impedance of a load. For example, an audio power amplifier output matching network refers to a hardware component that matches the impedance of an audio hardware component to the impedance of a speaker. A radio frequency matching network refers to a hardware component that matches the impedance of a radio frequency hardware component to the impedance of a speaker.

[0044] In various embodiments, the RF matching network is communicatively coupled to the RF hardware component and the third capacitor, the third capacitor is communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor. The speaker is communicatively coupled to a speaker cable, the speaker cable comprising a plurality of conductors communicatively coupled to a positive audio signal output pad and a negative signal output pad. In various embodiments, the positive audio signal output pad is communicatively coupled to a positive conductor included in the speaker cable. The negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

[0045] In various embodiments, the audio power amplifier output matching network includes a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor, and a third inductor. The fourth capacitor is communicatively coupled to the first resistor and the second inductor. The fifth capacitor is communicatively coupled to the second resistor and the third inductor.

[0046] In various embodiments, the first capacitor, the first inductor, the third capacitor, and the second capacitor may be replaced by any number of RF one-way transmission electronic components. Such components may transmit RF signals in one direction while completely isolating or attenuating in another direction, thereby controlling and protecting the RF signals. RF one-way transmission electronic components may include one-way couplers, one-way amplifiers, one-way filters, and the like.

[0047] In various embodiments, the values ​​of the first capacitor, the first inductor, the third capacitor, and the second capacitor can be adjusted to match the impedance of the antenna to the output impedance of the receiver or transmitter. In various embodiments, the first capacitor, the first inductor, the third capacitor, and the second capacitor act as a tuned antenna matching network to optimize the match between the antenna and the receiver or transmitter. The tuned antenna matching network can adjust the impedance of the antenna to match the output impedance of the receiver or transmitter to maximize the efficiency of the RF signal transmission.

[0048] In some embodiments, the frequency range of the radio frequency signal is between 2.4 GHz and 2.5 GHz. In other embodiments, other frequency bands are also applicable, and the values ​​of related components can be modified.

[0049] In various embodiments, the speaker cable acts as an antenna for RF signal transmission during operation. The energy of the RF signal can pass through the first capacitor, while little or no energy passes through the first inductor, so that the speaker cable acts as an antenna for RF signal transmission, such as a planar inverted F antenna (PIFA) or a monopole antenna.

[0050] In various embodiments, the first inductor is communicatively coupled to the negative signal output pad and directly to ground without including a second capacitor.The speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

[0051] The circuits described herein can be implemented in various electronic devices. For example, the circuits can be implemented in a device that includes Figure 4 Some or all of the features, components, and peripherals of machine 400 shown in FIG.

[0052] Reference will now be made in detail to the embodiments illustrated in the accompanying drawings. However, the present disclosure may take many different forms and should not be construed as limited to the embodiments set forth herein.

[0053] Figure 1 is a block diagram illustrating an example circuit configured for radio frequency signal transmission using a speaker cable according to various embodiments. To avoid obscuring the inventive subject matter with unnecessary detail, various functional components (e.g., modules, mechanisms, devices, nodes, etc.) that are not relevant to conveying an understanding of the inventive subject matter have been removed from the description. Figure 1 However, those skilled in the art will readily recognize that various additional functional components may be supported to facilitate additional functions not specifically described herein. Circuit 100 may be implemented in various electronic devices. For example, circuit 100 may be implemented in a device that includes Figure 4 Some or all of the features, components, and peripherals of machine 400 shown in FIG.

[0054] As shown, circuit 100 includes a wireless audio system 102 including an audio hardware component 104 and an RF hardware component 106. Circuit 100 also includes an audio power amplifier output matching network 108, an RF matching network 110, and a speaker cable 112 communicatively coupled to a speaker 114.

[0055] The audio hardware component 104 is configured to output an audio signal (e.g., a differential audio signal). The RF hardware component 106 is configured to output an RF signal. The audio power amplifier output matching network is communicatively coupled to the audio hardware component 104, the first capacitor C1, and the positive audio signal output pad 116, and the first inductor L1 is communicatively coupled to the negative signal output pad 118 and the second capacitor C2. The pads (e.g., pads 116, pads 118) may be metal exposed areas on a circuit board to which component leads are soldered.

[0056] As shown, the RF matching network 110 is communicatively coupled to the RF hardware component 106 and the third capacitor C3. The third capacitor C3 is communicatively coupled to the audio power amplifier output matching network 108, the first capacitor C1, and the first inductor L1. The speaker 114 is communicatively coupled to the speaker cable 112, which includes a plurality of wires communicatively coupled to the positive audio signal output pad 116 and the negative signal output pad 118. In various embodiments, the positive audio signal output pad 116 is communicatively coupled to the positive wire included in the speaker cable. The negative signal output pad 118 is communicatively coupled to the negative wire included in the speaker cable. The positive wire and the negative wire included in the speaker cable can be twisted into a twisted pair cable.

[0057] In various embodiments, the audio power amplifier output matching network 108 includes a fourth capacitor C4, a fifth capacitor C5, a first resistor R1, a second resistor R2, a second inductor L2, and a third inductor L3. The fourth capacitor C4 is communicatively coupled to the first resistor R1 and the second inductor L2. The fifth capacitor C5 is communicatively coupled to the second resistor R2 and the third inductor L3.

[0058] In various embodiments, the first capacitor C1, the first inductor L1, the third capacitor C3, and the second capacitor C2 can be replaced by any number of RF unidirectional transmission electronic components. Such components can transmit RF signals in one direction while completely isolating or attenuating in the other direction, thereby controlling and protecting RF signals.

[0059] like Figure 1 As shown, arrows illustrate an example of an RF signal transmission path of the example circuit 100 during operation. Specifically, in various embodiments, after the RF hardware component 106 generates an RF signal, the RF signal is transmitted through the RF matching network 110, the third capacitor C3, the first capacitor C1, PAD116, PAD118, the second capacitor C2 and the ground in an example order. Arrow (with a cross mark) 120 indicates that the RF signal does not pass through the first inductor L1 because the first inductor L1 acts as a barrier, allowing little or no energy of the RF signal to pass through. In this method, the speaker cable acts as a planar inverted F antenna (PIFA) antenna or a monopole antenna for RF signal transmission.

[0060] In various embodiments, the values ​​of the first capacitor C1, the first inductor L1, the third capacitor C3, and the second capacitor C2 can be adjusted to match the impedance of the antenna described herein with the output impedance of the receiver or transmitter. In various embodiments, the first capacitor C1, the first inductor L1, the third capacitor C3, and the second capacitor C2 act as a tuned antenna matching network to optimize the match between the antenna and the receiver or transmitter. The tuned antenna matching network can adjust the impedance of the antenna to match the output impedance of the receiver or transmitter to maximize the efficiency of the RF signal transmission.

[0061] In some embodiments, the frequency range of the radio frequency signal may be between 2.4 GHz and 2.5 GHz. In other embodiments, the frequency range of the radio frequency signal may also be other frequency bands, and the relevant component values ​​may be modified.

[0062] In various embodiments, the speaker cable 112 acts as an antenna for RF signal transmission during operation. The energy of the RF signal can pass through the first capacitor C1, while almost no energy passes through the first inductor L1, so that the speaker cable 112 operates as an antenna for RF signal transmission, such as a planar inverted F antenna (PIFA) or a monopole antenna.

[0063] In various embodiments, the first inductor L1 is communicatively coupled to the negative signal output pad 118 and directly to the ground GND without including the second capacitor C2. The speaker cable 112 acts as a monopole antenna for radio frequency signal transmission during operation.

[0064] Figure 2 is a flow chart illustrating an example method 200 for radio frequency signal transmission using a speaker cable according to various embodiments. According to examples, the operations of the example methods described herein may be repeated in different ways or involve intervening operations that are not shown. Although the operations of the example methods may be depicted and described in a particular order, the order in which the operations are performed may vary in embodiments, including performing certain operations in parallel.

[0065] In operation 202 , a circuit generates one or more audio signals (eg, differential audio signals).

[0066] In operation 204 , the circuit generates one or more radio frequency signals.

[0067] In operation 206, the circuit outputs one or more differential audio signals and one or more radio frequency signals via a speaker cable communicatively coupled to the circuit. The speaker cable is configured to operate as a planar inverted-F antenna (PIFA) or a monopole antenna.

[0068] In various embodiments, although operations 204 and 206 are described and depicted in a certain order, operations 204 and 206 may be performed simultaneously or in parallel.

[0069] In various embodiments, the circuit includes an audio hardware component, a radio frequency hardware component, an audio power amplifier output matching network, a radio frequency matching network, and a speaker cable communicatively coupled to a speaker. The speaker may refer to any type of audio speaker having different characteristics in terms of size, shape, and sound quality. The audio hardware component is configured to output an audio signal (e.g., a differential audio signal). The radio frequency hardware component is configured to output a radio frequency signal. The audio power amplifier output matching network is communicatively coupled to the audio hardware component and a first capacitor, a positive audio signal output pad, and a first inductor is communicatively coupled to a negative signal output pad and a second capacitor. The radio frequency matching network is communicatively coupled to the radio frequency hardware component and a third capacitor, which is communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor.

[0070] Figure 3 is a block diagram illustrating an example of a software architecture 300 that may be installed on a machine of certain embodiments. Figure 3 This is only a non-limiting example of a software architecture, and it should be understood that many other architectures may be implemented to achieve the functionality described herein. The software architecture 302 may be implemented in a system such as Figure 4 400, which includes, but is not limited to, a processor 410, a memory 430, and an input / output (I / O) component 450. A representative hardware layer 304 is shown and may represent, for example, Figure 4 4. The representative hardware layer 304 includes one or more processing units 306 having associated executable instructions 308. The executable instructions 308 represent executable instructions of the software architecture 302. The hardware layer 304 also includes a memory or storage module 310, which also has executable instructions 308. The hardware layer 304 can also include other hardware 312, which represents any other hardware of the hardware layer 304, such as other hardware shown as part of the machine 400.

[0071] exist Figure 3 In the example architecture of , software architecture 302 can be conceptualized as a stack of layers, each of which provides specific functionality. For example, software architecture 302 may include layers such as operating system 314, library 316, framework / middleware 318, application 320, and presentation layer 344.

[0072] The operating system 314 may manage hardware resources and provide common services. The operating system 314 may include, for example, a kernel 328, services 330, and drivers 332. The kernel 328 may act as an abstraction layer between the hardware and other software layers. The driver 332 may be responsible for controlling or interfacing with the underlying hardware.

[0073] Libraries 316 may provide a common infrastructure that may be utilized by applications 320 and / or other components and / or layers. Libraries 316 generally provide functionality that allows other software modules to perform tasks in an easier manner than by directly interfacing with underlying operating system 314 functionality (e.g., kernel 328, services 330, or drivers 332). Libraries 316 may include system libraries 334 (e.g., C standard libraries) that may provide functionality such as memory allocation functions, string manipulation functions, mathematical functions, and the like.

[0074] Framework 318 (sometimes also referred to as middleware) can provide a higher-level common infrastructure that can be used by application 320 or other software components / modules. For example, framework 318 can provide various graphical user interface functions, advanced resource management, advanced location services, etc.

[0075] The applications 320 include built-in applications 340 and / or third-party applications 342. The third-party applications 342 may include any of the built-in applications 340, as well as a wide range of other applications.

[0076] Application 320 may utilize built-in operating system functionality (e.g., kernel 328, service 330, or driver 332), libraries (e.g., system library 334, API library 336, and other libraries 338), or framework / middleware 318 to create a user interface that interacts with system users.

[0077] Some software architectures make use of virtual machines. Figure 3 In the example of FIG. 340 , this is illustrated by virtual machine 348. Virtual machine 348 creates a software environment in which applications / modules can execute as if they were executed on a hardware machine (e.g., Figure 4 Machine 400 in).

[0078] Figure 4 A diagrammatic representation of a machine 400 in the form of a computer system is shown within which a set of instructions may be executed to cause the machine 400 to perform any one or more of the methodologies discussed herein, according to one example. Figure 4 A diagrammatic representation of a machine 400 in the example form of a computer system is shown in which instructions 416 (e.g., software, programs, applications, applet, application programs, or other executable code) are executable to cause the machine 400 to perform one or more of the methodologies discussed herein. For example, the instructions 416 may cause the machine 400, or one or more of the machines 400, to perform Figure 2The instructions 416 transform a generic, unprogrammed machine 400 into a machine 400 that is programmed to perform the functions described and illustrated. In certain embodiments, the machine 400 may operate as a standalone device or may be connected to other machines (e.g., via a network). The machine 400 may include, but is not limited to, a server computer, a client computer, a personal computer (PC), a tablet computer, a laptop computer, a netbook, a personal digital assistant (PDA), an entertainment media system, a cellular phone, a smart phone, a mobile device, a headset, a headset, or any machine capable of executing the instructions 416, whether sequentially or otherwise, that specify the operations to be performed by the machine 400. Further, although only one machine 400 is shown, the term "machine" shall also include a group of machines 400 that individually or jointly execute the instructions 416 to perform any one or more of the methods discussed herein.

[0079] Machine 400 may include processor 410, memory 430, and I / O components 450, which may be configured to communicate with each other via, for example, bus 402. For example, processor 410 (e.g., a hardware processor such as a central processing unit (CPU), a reduced instruction set computing (RISC) processor, a complex instruction set computing (CISC) processor, a graphics processing unit (GPU), a digital signal processor (DSP), an application specific integrated circuit (ASIC), a radio frequency integrated circuit (RFIC), other processors, or any suitable combination) may include, for example, processor 412 and processor 414, which may execute instructions 416. The term "processor" is intended to include a multi-core processor, which may include two or more independent processors (sometimes referred to as "cores") that may execute instructions simultaneously. Although Figure 4 Multiple processors 410 are shown, and machine 400 may include a single processor with a single core, a single processor with multiple cores (eg, a multi-core processor), multiple processors with a single core, multiple processors with multiple cores, or any combination.

[0080] The memory 430 may include a main memory 432, a static memory 434, and a storage unit 436 including a readable machine medium 438, each of which may be accessible to the processor 410 via, for example, the bus 402. The main memory 432, the static memory 434, and the storage unit 436 store instructions 416 that embody any one or more of the methods or functions described herein. During execution by the machine 400, the instructions 416 may also be located, in whole or in part, within the main memory 432, within the static memory 434, within the storage unit 436, within at least one processor 410 (e.g., within a cache memory of a processor), or within any suitable combination.

[0081] I / O components 450 may include a variety of components to receive input, provide output, generate output, transmit information, exchange information, capture measurements, etc. The specific I / O components 450 included in a particular machine will depend on the type of machine. For example, a portable machine such as a mobile phone will likely include a touch input device or other such input mechanism, while a headless server machine will likely not include such a touch input device.

[0082] In further examples, the I / O component 450 may include a biometric component 456, a motion component 458, an environmental component 460, or a position component 462, as well as various combinations of various other components.

[0083] Communication can be achieved through a variety of technologies. I / O components 450 may include communication components 464 for connecting machine 400 to network 480 or device 470 via connection 482 and connection 472, respectively. For example, communication components 464 may include a network interface component or other appropriate device to interface with network 480.

[0084] Certain examples described herein include logical or multiple components, modules, elements, or mechanisms. These modules can be software modules (e.g., code embedded on a machine-readable medium or in a transmission signal) or hardware modules. A "hardware module" or "hardware component" is a tangible unit that is capable of performing certain operations and can be configured or arranged in a certain physical manner. In various embodiments, one or more computer systems (e.g., stand-alone computer systems, client computer systems, or server computer systems) or one or more hardware modules of a computer system (e.g., a processor or a group of processors) are configured as a hardware module through software (e.g., an application or an application portion), and the hardware module operates to perform certain operations described herein.

[0085] In various embodiments, the hardware module can be implemented mechanically, electronically, or in any suitable combination. For example, the hardware module may include a dedicated circuit or logic that is permanently configured to perform certain operations. For example, the hardware module may be a special-purpose processor, such as a field programmable gate array (FPGA) or an ASIC. The hardware module may also include programmable logic or circuits that are temporarily configured by software to perform certain operations. For example, the hardware module may include software contained in a general-purpose processor or other programmable processor. It is understood that the decision to implement the hardware module mechanically, in a dedicated and permanently configured circuit, or in a temporarily configured circuit (e.g., configured by software) may be driven by considerations of cost and time.

[0086] Therefore, the term "module" should be understood to include a tangible entity, whether physically constructed, permanently configured (e.g., hardwired), or temporarily configured (e.g., programmed), that operates or performs certain operations described herein in a certain manner. Considering that hardware modules are examples of temporarily configured (e.g., programmed), each hardware module does not need to be configured or instantiated at any one point in time.

[0087] A hardware module or hardware component can provide information to other hardware modules or components and receive information from other hardware modules or components. Therefore, the hardware module (or hardware component) can be regarded as having communicatively coupled properties. In the case where multiple hardware modules exist simultaneously, communication can be achieved between or among two or more hardware modules by signal transmission (e.g., through appropriate circuits and buses). In examples where multiple hardware modules are configured or instantiated at different times, communication between or among such hardware modules can be achieved, for example, by storing and retrieving information in a memory structure accessible to multiple hardware modules.

[0088] The various operations of the example methods described herein may be performed, at least in part, by one or more processors that are temporarily configured (e.g., by software) or permanently configured to perform the relevant operations. Such processors, whether temporarily or permanently configured, constitute processor-implemented modules that operate to perform one or more operations or functions described in this application. As used herein, "processor-implemented module" refers to a hardware module implemented using one or more processors.

[0089] Similarly, the methods described herein may be implemented at least in part by a processor, where a particular processor or processors are examples of hardware. For example, at least some of the operations of the method may be performed by one or more processors or processor-implemented modules. In addition, one or more processors may also operate to support the execution of related operations in a "cloud computing" environment or as a "software as a service" (SaaS). For example, at least some of the operations may be performed by a group of computers (as an example of a machine 400 including a processor 410), which are accessible via a network (e.g., the Internet) and one or more appropriate interfaces (e.g., APIs). In some examples, a client device may relay or communicate with a cloud computing system and may access circuit design information in a cloud environment.

[0090] The execution of certain operations may be distributed among processors, not only within a single machine 400, but also deployed among multiple machines 400. In some examples, the processor 410 or a processor-implemented module may be located in a single geographic location (e.g., in a home environment, an office environment, or a server farm). In other examples, the processor or a processor-implemented module may be distributed in multiple geographic locations.

[0091] Example

[0092] The following examples describe various embodiment methods, machine-readable media, and systems (eg, machines, devices, or other apparatus) discussed herein.

[0093] 1. A circuit comprising:

[0094] an audio hardware component configured to output a differential audio signal;

[0095] A radio frequency hardware component configured to output a radio frequency signal;

[0096] an audio power amplifier output matching network communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor communicatively coupled to the negative signal output pad and a second capacitor;

[0097] a radio frequency matching network communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor;

[0098] A speaker is communicatively coupled to a speaker cable, the speaker cable comprising a plurality of conductors communicatively coupled to the positive audio signal output pad and the negative signal output pad.

[0099] 2. The circuit of Example 1, wherein the audio power amplifier output matching network includes a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor, and a third inductor, the fourth capacitor being communicatively coupled to the first resistor and the second inductor, and the fifth capacitor being communicatively coupled to the second resistor and the third inductor.

[0100] 3. The circuit of any of the preceding examples, wherein the first resistor and the second resistor are communicatively coupled to ground.

[0101] 4. The circuit of any of the preceding examples, wherein the frequency range of the RF signal is between 2.4 GHz and 2.5 GHz, wherein the audio power amplifier output matching network comprises a hardware component that matches the impedance of the audio hardware component to the impedance of the speaker, and wherein the RF matching network comprises a hardware component that matches the impedance of the RF hardware component to the impedance of the speaker.

[0102] 5. The circuit of any of the preceding examples, wherein the positive audio signal output pad is communicatively coupled to a positive conductor included in a speaker cable, and the negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

[0103] 6. The circuit of any of the preceding examples, wherein the speaker cable acts as an antenna for transmission of radio frequency signals during operation.

[0104] 7. The circuit of any of the preceding examples, wherein energy of the RF signal is transferred through the first capacitor and little or no energy is transferred through the first inductor, causing the speaker cable to operate as an antenna in the transmission of the RF signal.

[0105] 8. The circuit of any of the preceding examples, wherein the antenna for radio frequency signal transmission is a planar inverted-F antenna (PIFA) or a monopole antenna.

[0106] 9. The circuit of any of the preceding examples, wherein the first inductor is communicatively coupled to the negative signal output pad and directly coupled to ground without including the second capacitor.

[0107] 10. The circuit of any preceding example, wherein the speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

[0108] 11. A method comprising:

[0109] generating a differential audio signal via audio hardware components included in the circuit;

[0110] generating a radio frequency signal by a radio frequency hardware component included in the circuit;

[0111] The differential audio signal and the radio frequency signal are outputted via a speaker cable communicatively coupled to the circuit, the speaker cable being configured to operate as a planar inverted-F antenna (PIFA) or a monopole antenna.

[0112] 12. The method of Example 11, wherein the circuit includes an audio power amplifier output matching network, a radio frequency matching network, the audio power amplifier output matching network is communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor, the first inductor is communicatively coupled to a negative signal output pad and a second capacitor, the radio frequency matching network is communicatively coupled to the radio frequency hardware component and a third capacitor, and the third capacitor is communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor.

[0113] 13. The method of any of the foregoing examples, wherein the audio power amplifier output matching network comprises a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor, and a third inductor, the fourth capacitor being communicatively coupled to the first resistor and the second inductor, and the fifth capacitor being communicatively coupled to the second resistor and the third inductor.

[0114] 14. The method of any of the preceding examples, wherein the positive audio signal output pad is communicatively coupled to a positive conductor included in a speaker cable, and the negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

[0115] 15. The method of any of the preceding examples, wherein energy of the RF signal is transferred through the first capacitor and little or no energy is transferred through the first inductor, causing the speaker cable to operate as an antenna in transmitting the RF signal.

[0116] 16. The method of any preceding example, wherein the first inductor is communicatively coupled to the negative signal output pad and directly to ground without the second capacitor.

[0117] 17. The method of any preceding example, wherein the speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

[0118] 18. A system comprising:

[0119] an audio hardware component configured to output a differential audio signal;

[0120] A radio frequency hardware component configured to output a radio frequency signal;

[0121] an audio power amplifier output matching network communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor communicatively coupled to the negative signal output pad and a second capacitor;

[0122] a radio frequency matching network communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor;

[0123] A speaker is communicatively coupled to a speaker cable, the speaker cable including a plurality of conductors communicatively coupled to the positive audio signal output pad and the negative signal output pad, the speaker cable being configured to act as a planar inverted-F antenna (PIFA) or a monopole antenna for radio frequency signal transmission.

[0124] In various parts of this specification, multiple instances may be used to implement resources, components, operations, or structures described as a single instance. Although the individual operations of one or more methods are illustrated and described as separate operations, one or more of the separate operations may be performed simultaneously, and there is no requirement that the operations must be performed in the order shown. Structures and functions presented as separate components in the example configurations may be implemented as a combined structure or component. Similarly, structures and functions presented as a single component may be implemented as separate components.

[0125] The term "or" as used herein may be interpreted as having an inclusive or exclusive meaning. The term "one" or "an" should be interpreted as "at least one", "one or more" or similar meanings. In some cases, the presence of "one or more", "at least", "but not limited to" or other similar phrases should not be interpreted as intending or requiring a narrower situation where such broad phrases may be absent. In addition, the boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary, and specific operations are described in the context of specific illustrative configurations. Other allocations of functionality are conceivable and may fall within the scope of various embodiments. Therefore, the specification and drawings should be regarded as illustrative rather than restrictive.

[0126] It should be understood that changes and modifications can be made to the disclosed examples without departing from the scope of the present disclosure. These and other changes or modifications are intended to be included within the scope of the present disclosure.

Claims

1. A circuit, characterized in that: include: an audio hardware component configured to output a differential audio signal; A radio frequency hardware component configured to output a radio frequency signal; an audio power amplifier output matching network communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor communicatively coupled to the negative signal output pad and a second capacitor; a radio frequency matching network communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor; and a speaker communicatively coupled to a speaker cable, the speaker cable comprising a plurality of conductors communicatively coupled to the positive audio signal output pad and the negative signal output pad.

2. The circuit according to claim 1, characterized in that The audio power amplifier output matching network includes a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor and a third inductor, the fourth capacitor is communicatively coupled to the first resistor and the second inductor, and the fifth capacitor is communicatively coupled to the second resistor and the third inductor.

3. The circuit according to claim 2, characterized in that The first resistor and the second resistor are communicatively coupled to ground.

4. The circuit according to claim 1, characterized in that The frequency range of the RF signal is between 2.4 GHz and 2.5 GHz, wherein the audio power amplifier output matching network includes a hardware component that matches the impedance of the audio hardware component to the impedance of the speaker, and wherein the RF matching network includes a hardware component that matches the impedance of the RF hardware component to the impedance of the speaker.

5. The circuit according to claim 1, characterized in that The positive audio signal output pad is communicatively coupled to a positive conductor included in the speaker cable, and the negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

6. The circuit according to claim 5, characterized in that The speaker cable acts as an antenna for radio frequency signal transmission during operation.

7. The circuit according to claim 5, characterized in that The energy of the RF signal is transferred through the first capacitor, and little or no energy is transferred through the first inductor, causing the speaker cable to act as an antenna for RF signal transmission.

8. The circuit according to claim 6, characterized in that The antenna used for radio frequency signal transmission is a planar inverted F antenna (PIFA) or a monopole antenna.

9. The circuit according to claim 1, characterized in that The first inductor is communicatively coupled to the negative signal output pad and directly to ground without including the second capacitor.

10. The circuit according to claim 9, characterized in that The speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

11. A method, characterized in that include: generating a differential audio signal via audio hardware components included in the circuit; generating a radio frequency signal by a radio frequency hardware component included in the circuit; as well as The differential audio signal and the radio frequency signal are output via a speaker cable communicatively coupled to the circuit, the speaker cable being configured to function as a planar inverted-F antenna (PIFA) or a monopole antenna.

12. The method according to claim 11, characterized in that The circuit includes an audio power amplifier output matching network, a radio frequency matching network, the audio power amplifier output matching network is communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor, the first inductor is communicatively coupled to a negative signal output pad and a second capacitor, the radio frequency matching network is communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor is communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor.

13. The method according to claim 12, characterized in that The audio power amplifier output matching network includes a fourth capacitor, a fifth capacitor, a first resistor, a second resistor, a second inductor, and a third inductor, the fourth capacitor being communicatively coupled to the first resistor and the second inductor, and the fifth capacitor being communicatively coupled to the second resistor and the third inductor.

14. The method according to claim 12, characterized in that The positive audio signal output pad is communicatively coupled to a positive conductor included in the speaker cable, wherein the negative signal output pad is communicatively coupled to a negative conductor included in the speaker cable.

15. The method according to claim 12, characterized in that The energy of the RF signal is transferred through the first capacitor, and little or no energy is transferred through the first inductor, causing the speaker cable to act as an antenna for RF signal transmission.

16. The method according to claim 12, characterized in that The first inductor is communicatively coupled to the negative signal output pad and directly to ground without the second capacitor.

17. The method according to claim 16, characterized in that The speaker cable acts as a monopole antenna for radio frequency signal transmission during operation.

18. The method according to claim 11, characterized in that The frequency range of the radio frequency signal is between 2.4 GHz and 2.5 GHz.

19. A system, characterized in that: include: an audio hardware component for outputting a differential audio signal; A radio frequency hardware component for outputting a radio frequency signal; an audio power amplifier output matching network communicatively coupled to the audio hardware component, a first capacitor, a positive audio signal output pad, and a first inductor communicatively coupled to the negative signal output pad and a second capacitor; a radio frequency matching network communicatively coupled to the radio frequency hardware component and a third capacitor, the third capacitor communicatively coupled to the audio power amplifier output matching network, the first capacitor, and the first inductor; and a speaker communicatively coupled to a speaker cable, the speaker cable comprising a plurality of conductors communicatively coupled to the positive audio signal output pad and the negative signal output pad, the speaker cable being configured to act as a planar inverted-F antenna (PIFA) or a monopole antenna for radio frequency signal transmission.

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