Up-down conversion and frequency synthesizer integrated millimeter wave assembly

Abstract

The invention discloses an up-down conversion and frequency synthesizer integrated millimeter wave assembly, which belongs to the technical field of wireless transceiving of millimeter wave transceiving assemblies, and comprises an up-down conversion unit, a frequency conversion power supply control board, a frequency synthesizer unit and a frequency synthesizer power supply control board, the up-down frequency conversion unit and the frequency conversion power supply control board are integrated on the first sub-module, the frequency synthesizer unit and the frequency synthesizer power supply control board are integrated on the second sub-module, the frequency conversion power supply control board and the frequency synthesizer power supply control board are internally interconnected, and a radio frequency interface in the frequency synthesizer unit is vertically interconnected with a corresponding radio frequency interface in the up-down frequency conversion unit; the frequency synthesizer power supply control board is used for receiving an external power supply and a control signal; the up-down conversion unit adopts a cavity-divided structure to accommodate internal elements, and the frequency synthesizer unit adopts a cavity-divided structure to accommodate internal elements; the integrated design is adopted, the size is reduced, and the space utilization rate is increased.

Description

Technical Field

[0001] The invention relates to an up-down frequency conversion and frequency synthesis integrated millimeter wave component, belonging to the technical field of wireless transceiver of millimeter wave transceiver components. Background Art

[0002] Broadband up-down conversion components have broad application prospects in the fields of radar measurement, satellite communication, wireless communication, electronic reconnaissance and jamming. Broadband up-down conversion components used in conjunction with radar systems can greatly improve detection and target recognition capabilities. In communication systems, broadband up-down conversion components can provide faster and more reliable wireless signal transmission and reception, meeting the high requirements for wireless communication. At present, the domestic up-down conversion integrated microwave components designed in the range of 0.8GHz-18GHz are relatively mature, but the existing technology of 18GHz-40GHz integrated millimeter wave components still has the defect of low integration. Summary of the invention

[0003] The object of the present invention is to provide an integrated millimeter wave component for up and down frequency conversion and frequency synthesis, so as to solve the problem of low integration in the prior art.

[0004] To achieve the above objectives, the present invention is implemented by adopting the following technical solutions: The present invention provides an integrated millimeter wave component for up and down frequency conversion and frequency synthesis, including: an up and down frequency conversion unit, a frequency conversion power supply control board, a frequency synthesis unit and a frequency synthesis power supply control board; The up-down frequency conversion unit and the frequency conversion power supply control board are integrated on the first submodule, the frequency synthesis unit and the frequency synthesis power supply control board are integrated on the second submodule, the frequency conversion power supply control board and the frequency synthesis power supply control board are internally interconnected, and the radio frequency interface in the frequency synthesis unit and the corresponding radio frequency interface in the up-down frequency conversion unit are vertically interconnected; The frequency synthesis power supply control board is used to receive external power supply and control signals and distribute them to the up and down frequency conversion units, the frequency conversion power supply control board and the frequency synthesis unit; The up-down conversion unit adopts a cavity structure to accommodate various internal components in different cavities on the first submodule, and the frequency synthesizer unit adopts a cavity structure to accommodate various internal components in different cavities on the second submodule.

[0005] Furthermore, the up-down frequency conversion unit includes a first microwave band, a first millimeter wave band, a first cavity and a second cavity, the first microwave band is located in the first cavity, the first millimeter wave band is located in the second cavity, the first cavity and the second cavity are both cavities dug out of the first submodule, and the up-down frequency conversion unit supports 18GHz~40GHz frequency conversion; The up / down conversion unit further includes a first inner cover plate, the first inner cover plate covers the second cavity, the thickness of the first inner cover plate plus the depth of the second cavity is equal to the depth of the first cavity, and the first inner cover plate is fixedly connected to the first submodule; The up / down conversion unit further includes a first outer cover plate, the first outer cover plate covers both the first cavity and the second cavity, and the first outer cover plate is fixedly connected to the first submodule; The frequency synthesis unit includes a second microwave band, a second millimeter wave band, a third cavity and a fourth cavity, the second microwave band is located in the fourth cavity, the second millimeter wave band is located in the third cavity, and the third cavity and the fourth cavity are both cavities dug out of the second submodule; The frequency synthesizer unit further includes a second inner cover plate, the second inner cover plate covers the third cavity, the thickness of the second inner cover plate plus the depth of the third cavity is equal to the depth of the fourth cavity, and the second inner cover plate is fixedly connected to the second submodule; The frequency synthesizer unit further includes a second outer cover plate, which covers both the third cavity and the fourth cavity, and the second outer cover plate is fixedly connected to the second submodule.

[0006] Furthermore, the depth of the first cavity is 2.9-3.1 mm, and the depth of the second cavity is 1.4-1.6 mm.

[0007] Furthermore, the up-down frequency conversion unit further includes a wave absorbing layer, and the wave absorbing layer is attached to the inner surface of the first inner cover plate; The up-down frequency conversion unit further comprises aluminum foil, and the aluminum foil is attached to the inner surface of the first outer cover.

[0008] Furthermore, a connection between the first inner cover plate and the first submodule is coated with conductive paint, and a conductive gasket is provided between the first inner cover plate and the first submodule; a connection between the first outer cover plate and the first submodule is coated with conductive paint, and a conductive gasket is provided between the first outer cover plate and the first submodule.

[0009] Furthermore, the frequency synthesis power supply control board includes a power conversion module and a voltage stabilizing module. The power conversion modules are provided with multiple and connected in sequence. The first power conversion module is connected to the power supply, and the voltage provided by the power supply is transformed multiple times through multiple power conversion modules. The voltage stabilizing modules are provided with multiple and each is connected to the output end of each power conversion module. The voltage stabilizing module stabilizes the voltage transmitted from each power conversion module and transmits it to the upper and lower frequency conversion units, the frequency conversion power supply control board and the frequency synthesis unit. The voltage drop of each voltage stabilizing module is different.

[0010] Furthermore, the power supply is a DC28V power supply, the power conversion module is a DCDC module, and the voltage stabilization module is an LDO module; The DCDC module includes a 28V to 13V DCDC module and a 13V to 6V DCDC module connected in sequence, and the input end of the 28V to 13V DCDC module is connected to the DC28V power supply; The LDO modules are provided with two, which stabilize the 13V voltage output by the 28V to 13V DCDC module into a 12V voltage, and stabilize the 6V voltage output by the 13V to 6V DCDC module into a 5V voltage.

[0011] Furthermore, the frequency synthesis power supply control board also includes a differential mode suppression circuit and a common mode suppression circuit, both of which are connected between the power supply and the first power conversion module, and are used to filter the power supply ripple and the inherent switching frequency of the switching power supply.

[0012] Furthermore, it also includes a millimeter wave connector, through which the radio frequency interface in the frequency synthesis unit and the radio frequency interface in the up and down conversion unit are vertically interconnected.

[0013] Furthermore, the up-down conversion unit adopts a secondary mixing architecture.

[0014] Compared with the prior art, the beneficial effects achieved by the present invention are: The invention provides an integrated millimeter wave component for up / down conversion and frequency synthesis, which can significantly reduce the volume and improve the space utilization by adopting an integrated design; the up / down conversion unit and the frequency synthesis unit are vertically interconnected, the interface is simple, the number of connecting cables is reduced, the system maintenance is convenient, and the miniaturization of the system is easy to achieve; The wide-band millimeter-wave up-down conversion unit can be applied to a variety of scenarios and has strong versatility. The electromagnetic compatibility design of the module has been improved to facilitate integration with the power amplifier system. The module power supply and control ground loop have been re-optimized to improve the quality of the microwave output signal, making it easier to promote and upgrade the product. While achieving miniaturization, low power consumption and ultra-wideband, this component has the advantages of large receiving dynamic range, high spurious suppression index, excellent signal flatness and excellent electromagnetic compatibility. It can be applied to a variety of microwave systems to meet the needs of modern electronic warfare. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of an integrated millimeter wave component for up and down frequency conversion and frequency synthesis provided by an embodiment of the present invention; Figure 2 It is a side schematic diagram of an up-down frequency conversion unit and a frequency synthesizer unit provided by an embodiment of the present invention; Figure 3It is a connection diagram of an up-down frequency conversion unit and a frequency synthesizer unit provided in an embodiment of the present invention.

[0016] In the figure: 1. Up and down frequency conversion unit; 2. Frequency conversion power supply control board; 3. First cavity; 4. Second cavity; 5. First inner cover plate; 6. First outer cover plate; 7. Frequency synthesis unit; 8. Frequency synthesis power supply control board; 9. Third cavity; 10. Fourth cavity. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention and are not intended to limit the protection scope of the present invention.

[0018] Example 1.

[0019] The present invention provides an integrated millimeter wave component for up and down frequency conversion and frequency synthesis, including: an up and down frequency conversion unit, a frequency conversion power supply control board, a frequency synthesis unit and a frequency synthesis power supply control board; The up-down frequency conversion unit and the frequency conversion power supply control board are integrated on the first submodule, the frequency synthesis unit and the frequency synthesis power supply control board are integrated on the second submodule, the frequency conversion power supply control board and the frequency synthesis power supply control board are internally interconnected, and the radio frequency interface in the frequency synthesis unit and the corresponding radio frequency interface in the up-down frequency conversion unit are vertically interconnected; The frequency synthesis power supply control board is used to receive external power supply and control signals and distribute them to the up and down frequency conversion units, the frequency conversion power supply control board and the frequency synthesis unit; The up-down conversion unit adopts a cavity structure to accommodate various internal components in different cavities on the first submodule, and the frequency synthesizer unit adopts a cavity structure to accommodate various internal components in different cavities on the second submodule.

[0020] The present invention can significantly reduce the volume and improve space utilization by adopting an integrated design; the up and down frequency conversion units and the frequency synthesis unit are vertically interconnected, the interface is simple, the number of connecting cables is reduced, the system maintenance is convenient, and the miniaturization of the system is easy to achieve.

[0021] Example 2.

[0022] like Figure 1 As shown, the present invention provides an up-down frequency conversion and frequency synthesis integrated millimeter wave component, including: an up-down frequency conversion unit, a frequency conversion power supply control board, a frequency synthesis unit and a frequency synthesis power supply control board.

[0023] The up / down conversion unit realizes the signal reception and transmission, and the frequency synthesis unit provides the mixed local oscillator signal for the up / down conversion unit and provides the reference and clock signals for the signal processing unit (the signal processing unit connected to the up / down conversion and frequency synthesis integrated millimeter wave component provided in this embodiment). The frequency synthesis power supply control board and the frequency conversion power supply control board provide the power supply and corresponding control signals for each device of the up / down conversion unit and the frequency synthesis unit. The control signals are transmitted as follows: Figure 1 The RF part between the components uses SMP connector (high frequency connector) for external connection, and the control and power supply part uses J63A micro rectangular connector for external connection.

[0024] The connection relationship between the up and down frequency conversion unit and the frequency synthesis unit is as follows: Figure 2 and Figure 3 As shown, from Figure 2 and Figure 3 It can be seen that the up and down frequency conversion unit 1 and the frequency conversion power supply control board 2 adopt an integrated design and are integrated on the first sub-module. The front is the circuit of the up and down frequency conversion unit 1, and the back is the frequency conversion power supply control board 2; the frequency synthesis unit 7 and the frequency synthesis power supply control board 8 adopt an integrated design and are integrated on the second sub-module. The front is the circuit of the frequency synthesis unit 7, and the back is the frequency synthesis power supply control board 8.

[0025] The frequency synthesizer power control board provides the required power and control signals to the frequency conversion power control board through distribution. The up and down frequency conversion units and the frequency synthesizer unit are interconnected, and the RF signals such as the local oscillator and the frequency synthesizer are vertically interconnected using SMP-KK (RF connector).

[0026] To improve the spatial isolation of signals between systems, the up and down conversion units adopt a split cavity design, such as Figure 2 As shown, the up and down conversion unit 1 includes a first microwave band, a first millimeter wave band, a first cavity 3 and a second cavity 4. The first microwave band is located in the first cavity 3, and the first millimeter wave band is located in the second cavity 4. The first cavity 3 and the second cavity 4 are both cavities dug out on the first submodule. The up and down conversion unit 1 supports 18GHz~40GHz frequency conversion; the depth of the first cavity 3 is 3mm, and the depth of the second cavity 4 is 1.5mm.

[0027] like Figure 2 As shown, the up-down frequency conversion unit also includes a first inner cover plate 5, which covers the second cavity 4, the thickness of the first inner cover plate 5 plus the depth of the second cavity 4 is equal to the depth of the first cavity 3, and the first inner cover plate 5 is fixedly connected to the first submodule; the up-down frequency conversion unit 1 also includes a first outer cover plate 6, which covers both the first cavity 3 and the second cavity 4, and the first outer cover plate 6 is fixedly connected to the first submodule.

[0028] In summary, the first millimeter wave band adopts a separate first inner cover plate design, and then adds a first outer cover plate on the outside. Since the design of the inner and outer covers has an additional attenuation process, the shielding performance can be improved. At the same time, the contact resistance between the cover plate and the integrated board should be minimized. The surface of the cover plate and the integrated board should be chemically conductively oxidized in advance. Before assembly, the oil and dust on the contact surface should be removed with alcohol to ensure good contact.

[0029] In order to further improve the spatial crosstalk problem of millimeter wave signals, a thin layer of absorbing material (absorbing layer) is attached to the inner surface of the first inner cover of the up and down conversion unit, and a layer of aluminum foil is attached to the inner surface of the first outer cover to improve the spatial leakage of millimeter wave signals. Taking into account the operating frequency, especially the high-frequency operating area, the higher the frequency, the greater the impact of gap leakage. Therefore, the higher the frequency of the shielded field frequency, the more the gap of the shielding body should be reduced. In the specific design, the number of gaps in the shielding body is minimized, the depth of the gap is increased, and the width and length of the gap are reduced. In addition, shortening the spacing between the screw holes on the cover is also a way to reduce the gap and increase the shielding effect. If necessary, conductive paint should be applied to the joints, and conductive pads should be added to the joints to further increase the shielding effect.

[0030] The up-down conversion unit adopts the classic structure of secondary mixing. Considering that the local oscillator signal and the main signal are in the same frequency band, in order to improve the spurious index of the output signal, this scheme adopts the form of switch filter group implementation, which can effectively improve the spurious components of the output signal. The highly integrated design of the module combined with system simulation can significantly improve the performance indicators of microwave signals while meeting the miniaturization of the system.

[0031] The frequency synthesis unit is also designed with a divided cavity, including the clock power division part, the point frequency source part, the wideband synthesis part and the frequency doubling filter part, which are respectively located in different cavities of the second submodule. The conductor compartment design can prevent the power lines generated by the interference source inside the shield from leaking to the outside, and can also prevent the power lines outside the shield from entering the shield cavity. The frequency doubling filter part uses RO5880 plate, and the other parts use RO4350B plate. In actual engineering design, considering factors such as volume, weight, and process, the cover plate is 1.5mm thick and the shield cavity is 4.5mm thick.

[0032] like Figure 2 As shown, the frequency synthesis unit includes a second microwave band, a second millimeter wave band, a third cavity 9 and a fourth cavity 10. The second microwave band is located in the fourth cavity 10, and the second millimeter wave band is located in the third cavity 9. The third cavity 9 and the fourth cavity 10 are both cavities dug out of the second submodule; The frequency synthesizer unit further includes a second inner cover plate, which covers the third cavity 9, the thickness of the second inner cover plate plus the depth of the third cavity 9 is equal to the depth of the fourth cavity 10, and the second inner cover plate is fixedly connected to the second submodule; The frequency synthesizer unit further includes a second outer cover plate, which covers both the third cavity 9 and the fourth cavity 10, and the second outer cover plate is fixedly connected to the second submodule.

[0033] In this embodiment, the power supply is a DC28V power supply.

[0034] The frequency synthesis power supply control board includes a 28V to 13V DCDC module (DC-DC Converter) and a 13V to 6V DCDC module connected in sequence, and the input end of the 28V to 13V DCDC module is connected to a DC28V power supply; it also includes an LDO module (Low Dropout Regulator), and two LDO modules are provided to stabilize the 13V voltage output by the 28V to 13V DCDC module into a 12V voltage, and stabilize the 6V voltage output by the 13V to 6V DCDC module into a 5V voltage. It also includes a micro rectangular connector for receiving and distributing control signals. It also includes an LC filter circuit connected to each load end. At the same time, the ground layer is used for isolation at key locations as an isolator. The isolator part is used to achieve electrical isolation of signals between different boxes and improve anti-interference ability. The power conversion part converts the system power supply to meet the power supply requirements of the frequency synthesis unit. The control distribution part (micro rectangular connector) realizes the control function of the microwave device, and the filtering unit is used to suppress the switching frequency of the DCDC module.

[0035] The variable frequency power supply control board and frequency synthesizer power supply control board are designed specifically for the ground loop. The control signal ground and the RF shell ground are isolated by an isolation chip. The power ground and the shell ground are grounded at a single point. The mounting holes of the control board are not directly connected to the digital ground. The control ground and the shell ground are grounded at a single point. At the same time, high current devices and low current devices are arranged as far as possible physically.

[0036] After the components provided in this embodiment are powered on, the self-test link is used to determine whether the millimeter wave link is operating normally. Then the main control board uses the distribution control method to perform associated control of switches, CNC attenuators, modulators, etc. through signal frequencies, and tests whether the entire microwave link is operating normally through signal sources and spectrum analyzers. If the test result is abnormal, it is necessary to locate the part of the microwave where the problem occurs through various RF monitoring points. After locating the specific part, the specific fault point in this part must be relocated. Generally, the main link signal detection is performed by using RF probes. Other positioning methods include voltage and impedance measurements, as well as visual inspection of the chip surface under a microscope to determine whether there are any abnormalities. Problem location for the control part can also be performed by physical testing or software capture.

[0037] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An integrated millimeter wave component for up and down frequency conversion and frequency synthesis, characterized in that: include: Up and down frequency conversion unit, frequency conversion power supply control board, frequency synthesis unit and frequency synthesis power supply control board; The up-down frequency conversion unit and the frequency conversion power supply control board are integrated on the first submodule, the frequency synthesis unit and the frequency synthesis power supply control board are integrated on the second submodule, the frequency conversion power supply control board and the frequency synthesis power supply control board are internally interconnected, and the radio frequency interface in the frequency synthesis unit and the corresponding radio frequency interface in the up-down frequency conversion unit are vertically interconnected; The frequency synthesis power supply control board is used to receive external power supply and control signals and distribute them to the up and down frequency conversion units, the frequency conversion power supply control board and the frequency synthesis unit; The up-down conversion unit adopts a cavity structure to accommodate various internal components in different cavities on the first submodule, and the frequency synthesizer unit adopts a cavity structure to accommodate various internal components in different cavities on the second submodule.

2. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 1 is characterized in that: The up-down frequency conversion unit includes a first microwave band, a first millimeter wave band, a first cavity and a second cavity, the first microwave band is located in the first cavity, the first millimeter wave band is located in the second cavity, the first cavity and the second cavity are both cavities dug out of the first submodule, and the up-down frequency conversion unit supports 18GHz~40GHz frequency conversion; The up / down conversion unit further includes a first inner cover plate, the first inner cover plate covers the second cavity, the thickness of the first inner cover plate plus the depth of the second cavity is equal to the depth of the first cavity, and the first inner cover plate is fixedly connected to the first submodule; The up / down conversion unit further includes a first outer cover plate, the first outer cover plate covers both the first cavity and the second cavity, and the first outer cover plate is fixedly connected to the first submodule; The frequency synthesis unit includes a second microwave band, a second millimeter wave band, a third cavity and a fourth cavity, the second microwave band is located in the fourth cavity, the second millimeter wave band is located in the third cavity, and the third cavity and the fourth cavity are both cavities dug out of the second submodule; The frequency synthesizer unit further includes a second inner cover plate, the second inner cover plate covers the third cavity, the thickness of the second inner cover plate plus the depth of the third cavity is equal to the depth of the fourth cavity, and the second inner cover plate is fixedly connected to the second submodule; The frequency synthesizer unit further includes a second outer cover plate, which covers both the third cavity and the fourth cavity, and the second outer cover plate is fixedly connected to the second submodule.

3. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 2 is characterized in that: The depth of the first cavity is 2.9-3.1 mm, and the depth of the second cavity is 1.4-1.6 mm.

4. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 2, characterized in that: The up-down frequency conversion unit further includes a wave absorbing layer, and the wave absorbing layer is attached to the inner surface of the first inner cover plate; The up-down frequency conversion unit further comprises aluminum foil, and the aluminum foil is attached to the inner surface of the first outer cover.

5. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 2, characterized in that: The connection between the first inner cover plate and the first submodule is coated with conductive paint, and a conductive pad is provided between the first inner cover plate and the first submodule. The connection between the first outer cover plate and the first submodule is coated with conductive paint, and a conductive pad is provided between the first outer cover plate and the first submodule.

6. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 1, characterized in that: The frequency synthesis power supply control board includes a power conversion module and a voltage stabilizing module. There are multiple power conversion modules and they are connected in sequence. The first power conversion module is connected to the power supply. The voltage provided by the power supply is transformed multiple times through multiple power conversion modules. There are multiple voltage stabilizing modules and each of them is connected to the output end of each power conversion module. The voltage stabilizing module stabilizes the voltage transmitted from each power conversion module and transmits it to the upper and lower frequency conversion units, the frequency conversion power supply control board and the frequency synthesis unit. The voltage drop of each voltage stabilizing module is different.

7. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 6, characterized in that: The power supply is a DC28V power supply, the power conversion module is a DCDC module, and the voltage stabilization module is an LDO module; The DCDC module includes a 28V to 13V DCDC module and a 13V to 6V DCDC module connected in sequence, and the input end of the 28V to 13V DCDC module is connected to the DC28V power supply; The LDO modules are provided with two, which stabilize the 13V voltage output by the 28V to 13V DCDC module into a 12V voltage, and stabilize the 6V voltage output by the 13V to 6V DCDC module into a 5V voltage.

8. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 6, characterized in that: The frequency synthesis power supply control board also includes a differential mode suppression circuit and a common mode suppression circuit, both of which are connected between the power supply and the first power conversion module, and are used to filter the power supply ripple and the inherent switching frequency of the switching power supply.

9. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 1, characterized in that: It also includes a millimeter wave connector, through which the radio frequency interface in the frequency synthesis unit and the radio frequency interface in the up and down conversion unit are vertically interconnected.

10. The up-down conversion and frequency synthesis integrated millimeter wave component according to claim 1, characterized in that: The up-down conversion unit adopts a secondary mixing architecture.

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