Food processor driven by brushless motor

Abstract

The invention provides a food processor driven by a brushless motor. The food processor comprises a main machine, a crushing assembly; a heating assembly; the PCB comprises an integrated power module, an MCU (Microprogrammed Control Unit) module, a heating driving module and a switching power supply module; the integrated power module comprises a lead frame, the lead frame comprises a first side edge and a second side edge opposite to the first side edge, the first side edge and the second side edge are arranged along the long edge of the integrated power module, and a three-phase IGBT is integrated in the integrated power module; the three-phase bootstrap capacitor is arranged on the PCB and is independent of the integrated power module, and the three-phase bootstrap capacitor is respectively used for driving upper bridge arms of the three-phase IGBT; the first side edge is provided with three multiplexing pins, the three multiplexing pins are respectively connected between upper and lower bridge arms of the three-phase IGBT, and three phases of the brushless motor stator and one end of the three-phase bootstrap capacitor are respectively connected with the three multiplexing pins; and the second side edge is provided with three high-side driving suspension power supply end pins, so that the space and the heat dissipation performance of the whole machine are improved, and the cost is low.

Description

Technical Field

[0001] The invention belongs to the field of food processing machines, and in particular relates to a food processing machine driven by a brushless motor with stable performance and low cost. Background Art

[0002] Existing food processors are generally driven by series-excited motors. Since series-excited motors have carbon brushes, the working noise is relatively high, and carbon powder is easily released into the air, affecting the use environment. In addition, series-excited motors generally only have a unidirectional drive function, otherwise the life of the series-excited motor will be greatly lost. With the continuous development and innovation of food processor technology, a patent with patent number CN202120355518.2 discloses a flattened food processor, in which a motor and an air duct flowing through the motor are arranged in the base, and the air duct includes a heat dissipation cavity formed inside the motor, and the motor includes a motor shaft, a rotor wrapped around the motor shaft, a stator wrapped around the rotor, and a bracket forming the axial end face of the motor, and the bracket is located above the stator and / or below the stator. This arrangement allows the flattened, small-volume permanent magnet brushless motor to be applied to the field of food processors, thereby greatly reducing the main machine height and operating noise of the food processor. Since the power drive module used to drive the brushless motor is large in size and has a high demand for heat dissipation performance, it is necessary to perform special heat dissipation on the power drive module to solve the heat dissipation problem of the power drive module.

[0003] Since power drive modules are widely used in white appliances such as air conditioners, washing machines, and fans, and the technology is relatively mature, the first generation of food processors with brushless motors used power drive modules in the white appliance field. However, the working conditions of food processors are different from those of white appliances such as air conditioners and washing machines, and the performance requirements are completely different. This leads to unreasonable design of the power drive module function module. The functional pin distribution and spacing of the power drive module cannot be fully adapted to the food processor. In order to use the drive module in the white appliance field, more costs have to be paid to meet the use requirements of the food processor, which makes the power drive module occupy a large space, the chip volume is large, the production cost is high, and there are many electronic components, the routing is more complicated, and the heat dissipation requirements are also higher. The large chip volume of the power drive module further leads to a large space occupied on the PCB driver board. The spacing requirements between the control module, rectifier module, switching power supply module, filter module, heating control module, power drive module, etc. on the driver board and related electronic components are more complicated, and the routing and space layout are more complicated. It is also easy to cause electromagnetic signal interference and strong and weak current creepage distances that do not meet safety requirements. Furthermore, due to the compact structure and small size of the host, the heat dissipation performance of both the PCB board and the brushless motor must be taken into consideration. However, the manufacturing cost of the existing power drive module is high, and the service life of the power drive module and the brushless motor, the crushing performance of the material driven by the crushing knife, and the heat dissipation performance requirements of the power drive module itself are not matched with the food processing machine, which also leads to problems such as large deviations in performance reliability and design margin of the power drive module. Therefore, how to design a power drive module that meets the property requirements of the food processing machine and has a low manufacturing cost, design the installation and heat dissipation of the PCB board in the limited host space, so that high heat dissipation demand components such as the power drive module can effectively dissipate heat and ensure service life, is a technical problem that needs to be solved urgently for the food processing machine.

[0004] Patent number CN202223486858.2 discloses an intelligent power module. In a power conversion device using high voltage, it is usually necessary to make the high-voltage pin and the low-voltage pin meet the electrical clearance. According to safety regulations, the reasonable electrical clearance (the distance between the edges of the copper foil around the two pads) ranges from 3.05 mm and above. Therefore, in order to meet the electrical clearance, the prior art will increase the volume of the plug-in IPM module, which will lead to an increase in the cost of the module. In order to overcome the above problems, the patent connects the negative end of the three-phase DC power supply to a pin through a first conductive structure, reduces the number of pins of the intelligent power module, and thus reduces the volume of the intelligent power module. A specific internal schematic diagram of the IPM is given in the embodiment of the specification, and shows that the intelligent power module includes multiple pins, as well as the pin names and corresponding functional descriptions. The intelligent power module includes V-phase, U-phase and W-phase gate drive chips. Taking the V-phase gate drive chip as an example, one side of the V-phase gate drive chip is provided with a pin shared by the V-phase output terminal and the V-phase high-side drive suspension power supply ground terminal, and a second DC power supply positive terminal connected to the first DC power supply positive terminal, and the two DC power supply positive terminals are respectively arranged on the same side of the V-phase and U-phase gate drive chips, and a V-phase high-side drive suspension power supply terminal is also arranged on the same side, and the V-phase high-side drive suspension power supply terminal is connected to the V-phase power supply terminal on the other side of the V-phase gate drive chip. In addition, the other side of the V-phase gate drive chip is also provided with a V-phase high-side signal input terminal and an adjacent V-phase low-side signal input terminal. Although this arrangement reduces the number of pins of the intelligent power module, the pin of the V-phase high-side drive floating power supply terminal is set on the same side as the V-phase high-side drive floating power supply ground terminal. As a result, the number of pins on the high side of the chip increases, and the spacing requirement for the high-side pins is larger. The volume, especially the length, of the intelligent power module has not been reduced. Moreover, the dual-pin arrangement of the first DC power supply positive terminal and the second DC power supply positive terminal is not suitable for food processors, and pin redundancy is prone to occur. The extra pins bring about new problems of increased pin spacing and electromagnetic interference. Therefore, such an intelligent power module does not meet the use requirements of a food processor, especially when the crushing knife is driven by a brushless motor to rotate at high speed, with a wide speed range of 200RPM-20000RPM, to process high-protein hard ingredients such as grains and beans to make slurry products.

[0005] Patent No. CN201220739541.2 discloses a DC brushless motor drive circuit. By adding a power-on bootstrap circuit, when the DC brushless motor does not rotate when powered on or when it is blocked, the blocking protection module outputs a blocking signal to the rotation monitoring indication node. The power-on bootstrap circuit pulls up the level of the low-side input end of the drive unit, and the low-side output end of the drive unit controls the conduction of the lower MOS tube, so that the bootstrap capacitor is charged. After charging, the high-side output end of the drive unit is in a state of preparing to conduct the upper MOS tube. When the drive unit receives a motor rotation signal, the high-side output end of the drive unit conducts the upper MOS tube, so that the three-phase bridge arm unit outputs a driving signal to drive the DC brushless motor. This setting is equivalent to setting a bootstrap circuit on the upper bridge arm of the three-phase bridge arm unit, which is used to conduct the upper bridge arm, thereby driving the DC brushless motor to run smoothly. Since each phase upper bridge arm needs to be equipped with an independent bootstrap circuit, each phase bootstrap circuit needs to be connected to the pins of the power driver module, which results in the power driver module having many pins and the need to meet the safety spacing. The long side and the short side are too long, which affects the layout space of the power driver module on the PCB. Therefore, how to concentrate and optimize the power driver module's own space, the space occupied and heat dissipation space integrated on the PCB board, and the heat dissipation space of the PCB relative to the host under the working conditions suitable for the food processing machine and reduce the use noise to ensure reliable life is an urgent problem to be solved. Summary of the invention

[0006] The object of the present invention is to provide a food processor driven by a brushless motor, which has high space utilization, good heat dissipation performance of an integrated power module, high heat dissipation efficiency of a PCB board in a main machine, high processing efficiency and low noise.

[0007] In order to solve the above technical problems, the present invention provides a food processing machine driven by a brushless motor, which includes: a main machine; a crushing assembly, including a cup body and a crushing device driven by a brushless motor; a heating assembly, used to heat the material in the cup body; a PCB board, including an integrated power module, an MCU module, a heating drive module and a switching power supply module; the integrated power module includes a lead frame, the lead frame includes a first side and a second side oppositely arranged, the first side and the second side are arranged along the long side of the integrated power module, and the integrated power module is integrated with a three-phase IGBT, the long side of the integrated power module is not greater than 50mm; the three-phase bootstrap capacitor is arranged on the PCB board independently of the integrated power module, and is respectively used to drive the upper bridge arm of the three-phase IGBT; the first side is provided with three multiplexed pins, and the three multiplexed pins are respectively connected between the upper and lower bridge arms of the three-phase IGBT, and the three phases of the brushless motor stator and one end of the three-phase bootstrap capacitor are respectively connected to the three multiplexed pins; the second side is provided with three high-side drive suspension power supply end pins, and the other ends of the three-phase bootstrap capacitors are respectively connected to the three high-side drive suspension power supply end pins.

[0008] Furthermore, the integrated power module is arranged on a first side of the PCB board, and the three-phase bootstrap capacitor is arranged on a second side of the PCB board.

[0009] Furthermore, the three-phase bootstrap capacitor is arranged between the pins on the first side and the pins on the second side, and within the projection of the integrated power module on the PCB board.

[0010] Furthermore, the second side is provided with a three-phase low-side drive power supply pin, and the low-side drive power supply pin and the high-side drive floating power supply pin are arranged adjacent to each other; a diode is provided in the integrated power module, and the positive electrode of the diode is connected to the low-side drive power supply pin, and the negative electrode is connected to the high-side drive floating power supply pin.

[0011] Furthermore, the second side is provided with three input shutdown pins corresponding to the three-phase IGBT respectively, and the integrated power module also includes a fault output terminal and a temperature output terminal, and the fault output terminal and the temperature output terminal are both connected to one of the input shutdown pins, and the temperature output terminal is connected to a pull-up resistor, and the resistance of the pull-up resistor is R, 4kΩ≤R≤7kΩ.

[0012] Furthermore, the first side is also provided with three DC negative terminal pins corresponding to the three-phase IGBTs respectively, the three DC negative terminal pins are arranged adjacent to the corresponding phases of the three multiplexed pins in pairs, and the DC negative terminal pins are externally connected to sampling resistors.

[0013] Furthermore, the side edge of the integrated power module is arranged along the short side of the PCB board, the motor drive module includes a PCB board and a heat sink covering the integrated power module, the heat sink includes a plurality of heat sink fins, a heat sink channel is formed between the plurality of heat sink fins, the heat sink channel is arranged along the short side direction of the PCB board, an air duct is arranged in the host, and no PCB board components are arranged in the air duct upstream and downstream of the heat sink channel passing through the PCB board.

[0014] Furthermore, the shell of the host is provided with a first air inlet and a first air outlet, the brushless motor includes an upper end cover and a lower end cover, a brushless motor heat dissipation cavity is formed between the upper end cover and the lower end cover, the heat dissipation cavity is provided with a second air inlet and a second air outlet, and the air duct is discharged in sequence through the first air inlet, the heat dissipation channel, the second air inlet, the heat dissipation cavity, the second air outlet and the first air outlet.

[0015] Furthermore, the host is provided with an operation panel and a control board located below the operation panel, the PCB board is horizontally arranged below the control board, an air guide cover is provided between the first air inlet and the second air inlet, the air guide cover at least covers the integrated power module of the PCB board and separates the integrated power module from the control board.

[0016] Furthermore, the PCB board also includes an EMC module, the three-phase output end of the brushless motor stator is provided with a first magnetic ring, and the food processor includes an output power line, and the power line is provided with a second magnetic ring.

[0017] The beneficial effects of the present invention are:

[0018] 1. The food processor is driven by a brushless motor, and the PCB board electrically connected to the brushless motor includes an integrated power module, which is used to drive the brushless motor. The integrated power module includes a first side and a second side for setting pins, and two connection ends of the three-phase bootstrap capacitor are arranged across the pins of the first side and the pins of the second side. The first side is provided with a reused pin, which is used to connect between the upper and lower bridge arms of the IGBT, so that the three-phase bootstrap capacitor is respectively connected to the emitter of the upper bridge arm of the IGBT, and is respectively used to turn on the three-phase upper bridge arm of the IGBT. The three reused pins are also used to connect the output end of each phase and the high-side drive suspension power supply ground end, so as to make full use of the space of the reused pins, not only saving manufacturing materials, but also intensively integrating the internal space of the integrated power module, reducing the wiring layout inside the chip and the size specifications outside the chip, thereby greatly reducing the occupied area on the PCB board, and the reduction in occupied area also correspondingly reduces the heat dissipation demand, thereby reducing the manufacturing cost, processing technology cost and heat dissipation cost of the integrated power module. One end of the three-phase bootstrap capacitor is respectively connected to three reused pins, and the other end is respectively connected to three high-side drive suspension power supply pins, so that the bootstrap capacitor can be more reasonably set on the PCB board independently of the integrated power module, which greatly saves the installation space of the bootstrap capacitor and avoids all high-side drive pins being installed on the first side. A large safety gap is required between the high-side pins, which leads to the problem that the distance between the first side and the second side on the opposite side is too large and the PCB board is occupied too much. In addition, setting the three high-side drive suspension power supply pins on the second side also makes the space utilization rate of the second side higher, and the setting space of the three-phase bootstrap capacitor is reused with the integrated power module on the PCB board, thereby greatly concentrating the PCB board space and reducing the area of ​​the entire PCB board and the occupied volume and heat dissipation duct area in the host.

[0019] 2. The integrated power module is arranged on the first side of the PCB board, and the three-phase bootstrap capacitor is arranged on the second side of the PCB board. This arrangement allows the bootstrap capacitor to have enough space to reuse the position of the second side of the PCB board corresponding to the first side with the integrated power module, thereby reducing the routing distance between the bootstrap capacitor and the connecting pins of the integrated power module.

[0020] 3. The three-phase bootstrap capacitor is arranged between the pins on the first side and the pins on the second side, and within the projection of the integrated power module on the PCB board, so as to shorten the connection distance between the bootstrap capacitor and the reused pins and the high-side drive floating power supply pins on the integrated power module to the greatest extent, and the three-phase bootstrap capacitor is arranged in a vertical column along the first side and the second side of the integrated power module, and the long axis center line of the bootstrap capacitor is parallel to the short side of the integrated power module, so as to make full use of the space layout between the first side and the second side, reduce the space occupied by the bootstrap capacitor on the PCB board, and fully meet the requirements of the safety spacing between the pins on the first side and the second side.

[0021] 4. The second side is provided with a three-phase low-side drive power supply pin, and the low-side drive power supply pin and the high-side drive suspension power supply pin are arranged adjacent to each other, so that the pin space distribution of the second side is adapted to the internal wiring of the integrated power module, saving the external pin space and spacing, and at the same time facilitating the internal layout of the integrated power module, so that the temperature range inside the integrated power module during the operation of the food processor tends to be stable, and does not suddenly jump to the upper and lower limit temperatures, and at the same time makes the heat dissipation of the integrated power module more efficient. The diode is arranged in the integrated power module, and the positive and negative poles of the diode are both connected to the second side, shortening the wiring distance of the diode, and further optimizing the wiring and space layout in the integrated power module.

[0022] 5. The second side is also provided with three input shutdown pins corresponding to the three-phase IGBTs respectively. The fault output terminal and the temperature output terminal are both connected to one of the input shutdown pins, thereby further realizing pin multiplexing, reducing the number of pins on the second side, and further shortening the long side distance of the integrated power module.

[0023] 6. The integrated power module is arranged along the short side of the PCB board, and the heat dissipation channel is also arranged along the short side of the PCB board, so that the wind can cover the integrated power module to the maximum extent when passing through the heat dissipation channel to effectively dissipate heat, and no PCB board components are arranged upstream and downstream of the heat dissipation channel of the PCB board, so as to avoid interference with the temperature of the air medium and affect the heat dissipation effect of the integrated power module, and make the heat dissipation channel flow through the top of the integrated power module. Fast flow velocity, fast thermal interaction, and high heat dissipation efficiency.

[0024] 7. The air medium enters the main unit through the first air inlet, dissipates the heat of the integrated power module through the heat dissipation channel, enters the heat dissipation cavity through the second air inlet to dissipate the heat of the brushless motor, and then takes the hot air out through the second air outlet, and finally exits the heat dissipation cavity from the second air outlet and is discharged to the outside of the main unit through the first air outlet.

[0025] 8. The air guide separates the control board and the PCB board to prevent the temperature from transferring upwards, and is also more conducive to the focusing of the heat dissipation channel and the stability of the air medium flow path. In addition, the first magnetic ring and the second magnetic ring can further reduce the anti-electromagnetic interference performance, so that the PCB board meets the safety requirements and the performance of the food processor and the applicability of processing various foods, while minimizing the area of ​​the PCB board and the space occupied in the host, so that the whole food processor is more miniaturized, compact in structure, small in space and easy to store in the kitchen environment.

[0026] 9. Magnetic rings are also provided on the three-phase wires and power lines of the brushless motor. The above-mentioned settings are equivalent to the three-level space optimization of the food processing machine. The first-level space optimization reduces the space of the integrated power module, leaving no extra space for integrating the bootstrap capacitor, and no extra space for distributing other lead pins. When the pins are reused and the chip size of the integrated driver module is reduced, the pin spacing is reduced and the number is small, and the performance of the heat dissipation wind is further optimized. The second-level space optimizes the space of the PCB board. Since there are many components on the PCB board used for the food processing machine, there is not enough space to meet the requirements of anti-electromagnetic interference. Magnetic rings are provided on the three-phase lead wires and power lines of the brushless motor to meet the anti-electromagnetic interference standards while reducing the area of ​​the PCB board. The third-level space optimizes the internal space of the food processing machine host. The space inside the host is limited, and a brushless motor, a motor heat dissipation cavity, an air duct, a control board corresponding to the operation panel, and a PCB board are provided. Therefore, the heat dissipation space of the PCB board is reduced, and the PCB board needs to be placed horizontally in a small space, and the integrated power module must be set on the path of the air duct, thereby optimizing the use of the internal space of the host. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 The figure is a schematic diagram of the overall structure of the food processing machine of the present invention.

[0029] Figure 2 This is a schematic diagram of the integrated power module of the food processing machine according to the present invention.

[0030] Figure 3 This is a schematic diagram of peripheral circuit connections of the integrated power module of the food processor of the present invention.

[0031] Figure 4 The figure is a schematic diagram of the air duct structure in the main body of the food processing machine of the present invention.

[0032] Figure 5 This is a schematic diagram of the structure of the PCB board and the air guide cover of the food processing machine of the present invention.

[0033] The names of the components marked in the figure are as follows: 100, main unit; 101, first air inlet; 102, first air outlet; 103, control board; 200, crushing assembly; 201, cup body; 202, crushing device; 300, heating assembly; 400, PCB board; 500, integrated power module; 501, first side; 502, second side; 503, heat dissipation fin; 504, heat dissipation channel; 505, first multiplexed pin; 506, second multiplexed pin; 507, third multiplexed pin; 600, air guide cover; 700, second air inlet; 800, second air outlet; 900, brushless motor. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0035] like Figures 1 to 5 As shown, this embodiment provides a food processing machine driven by a brushless motor 900, which includes: a main machine 100; a crushing assembly 200, including a cup body 201 and a crushing device 202 driven by the brushless motor 900; a heating assembly 300, used to heat the material in the cup body 201; a PCB board 400, including an integrated power module 500, an MCU module, a heating drive module and a switching power supply module; the integrated power module 500 includes a lead frame, the lead frame includes a first side 501 and a second side 502 arranged oppositely, the first side 501 and the second side 502 are arranged along the long side of the integrated power module 500, and the integrated A three-phase IGBT is integrated in the power module 500, and the long side of the integrated power module 500 is not greater than 50 mm; the three-phase bootstrap capacitor is independently arranged on the PCB board 400 from the integrated power module 500, and is respectively used to drive the upper bridge arm of the three-phase IGBT; the first side 501 is provided with three multiplexed pins, and the three multiplexed pins are respectively connected between the upper and lower bridge arms of the three-phase IGBT, and the three phases of the stator of the brushless motor 900 and one end of the three-phase bootstrap capacitor are respectively connected to the three multiplexed pins; the second side 502 is provided with three high-side drive floating power supply end pins, and the other end of the three-phase bootstrap capacitor is respectively connected to the three high-side drive floating power supply end pins.

[0036] The crushing device 202 of the food processor has a crushing knife, which is driven by a brushless motor 900. Preferably, the brushless motor 900 is arranged in the host 100, and the cup body 201 is detachably connected to the host 100. The heating device is preferably a heating plate with a heating tube. The PCB board 400 electrically connected to the brushless motor 900 includes an integrated power module 500, which is used to drive the brushless motor 900. The integrated power module 500 includes a first side 501 and a second side 502 for setting pins. The two connection ends of the three-phase bootstrap capacitor are arranged across the pins of the first side 501 and the pins of the second side 502. The first side 501 is provided with a multiplexing pin, which is used to connect between the upper and lower bridge arms of the IGBT, so that the three-phase bootstrap capacitor is respectively connected to the emitter of the upper bridge arm of the IGBT, and is used to turn on the three-phase upper bridge arm of the IGBT. The three reused pins are also used to connect the output end of each phase and the high-side drive suspension power supply ground end, so as to make full use of the space of the reused pins, not only saving manufacturing materials, but also concentrating the internal space of the integrated power module 500, reducing the wiring layout inside the chip and the size specifications outside the chip, thereby greatly reducing the occupied area on the PCB board 400, and the reduction in occupied area also correspondingly reduces the heat dissipation demand, thereby reducing the manufacturing cost, processing cost and heat dissipation cost of the integrated power module 500. One end of the three-phase bootstrap capacitor is respectively connected to the three reused pins, and the other end is respectively connected to the three high-side drive suspension power supply pins, so that the bootstrap capacitor can be more reasonably independent of the integrated power module 500 and set on the PCB board 400, greatly saving the installation space of the bootstrap capacitor, and at the same time avoiding that all the high-side drive pins are installed on the first side 501, and a large safety gap is required between the high-side pins, resulting in the problem that the distance between the first side 501 and the second side 502 on the opposite side is too large and the PCB board 400 is occupied too much. Moreover, the three high-side drive floating power supply pins are arranged on the second side 502, so that the space utilization rate of the second side 502 is higher, and the setting space of the three-phase bootstrap capacitor is reused with the integrated power module 500 on the PCB board 400, thereby greatly concentrating the space of the PCB board 400, reducing the area of ​​the entire PCB board 400 and the occupied volume and heat dissipation duct area in the host 100.

[0037] The integrated power module 500 is arranged on the first side of the PCB board 400, and the three-phase bootstrap capacitor is arranged on the second side of the PCB board 400. The three-phase bootstrap capacitor is arranged between the pins of the first side 501 and the pins of the second side 502, and within the projection of the integrated power module 500 on the PCB board 400. This arrangement allows the bootstrap capacitor to have enough space to reuse the position of the second side of the PCB board 400 corresponding to the first side with the integrated power module 500, thereby reducing the wiring distance between the bootstrap capacitor and the connection pins of the integrated power module 500. Preferably, the bootstrap capacitor is a chip capacitor with a small size and low height, which is suitable for being arranged on the second side. In addition, the three-phase bootstrap capacitor is arranged between the pin of the first side 501 and the pin of the second side 502, and within the projection of the integrated power module 500 on the PCB board 400, the connection distance between the bootstrap capacitor and the reused pin and the high-side drive floating power supply end pin on the integrated power module 500 can be shortened to the greatest extent, and the three-phase bootstrap capacitor is arranged in a vertical column along the direction of the first side 501 and the second side 502 of the integrated power module 500, and the long axis center line of the bootstrap capacitor is parallel or approximately parallel to the short side of the integrated power module 500, thereby making full use of the spatial layout between the first side 501 and the second side 502, reducing the space occupied by the bootstrap capacitor on the PCB board 400, and fully meeting the requirements for the safe spacing between the pins of the first side 501 and the second side 502.

[0038] The second side 502 is provided with a three-phase low-side drive power supply pin, and the low-side drive power supply pin and the high-side drive suspension power supply pin are arranged adjacently, so that the pin space distribution of the second side 502 is adapted to the internal wiring of the integrated power module 500, saving the external pin space and spacing, and at the same time facilitating the internal layout of the integrated power module 500, so that the temperature range inside the integrated power module 500 during the operation of the food processor tends to be stable, and does not suddenly jump to the upper and lower limit temperatures, and at the same time makes the heat dissipation of the integrated power module 500 more efficient. A diode is provided in the integrated power module 500, and the positive electrode of the diode is connected to the low-side drive power supply pin, and the negative electrode is connected to the high-side drive suspension power supply pin. That is to say, the diode is arranged in the integrated power module 500 and the positive and negative electrodes of the diode are both connected to the second side 502, shortening the wiring distance of the diode, and further optimizing the wiring and spatial layout in the integrated power module 500.

[0039] like Figure 2 and Figure 3As shown, the second side 502 is provided with three input shutdown pins ( / SDW, / SDV, / SDU) corresponding to the three-phase IGBT respectively, and the integrated power module 500 also includes a fault output terminal ( / FO) and a temperature output terminal ( / VTS), and the fault output terminal and the temperature output terminal are both connected to one of the input shutdown pins, and this embodiment is multiplexed with the W-phase input shutdown pin / SDW. Thereby further realizing pin multiplexing, reducing the number of pins on the second side 502, and further reducing the long side distance of the integrated power module 500, specifically, the three input shutdown pins include the U-phase input shutdown pin, the V-phase input shutdown pin, and the W-phase input shutdown pin. As a preferred embodiment, in this embodiment, the fault output terminal and the temperature output terminal are multiplexed and connected with the W-phase input shutdown pin, and the temperature output terminal is connected to the pull-up resistor R407, and the resistance value of the pull-up resistor is R, 4kΩ≤R≤7kΩ. The first side 501 is also provided with three DC negative terminal pins corresponding to the three-phase IGBTs respectively. The three DC negative terminal pins are arranged adjacent to the corresponding phases of the three multiplexed pins in pairs. The DC negative terminal pins are externally connected to a sampling resistor to detect the working state of the brushless motor 900, such as speed, direction, current and voltage, so as to timely identify abnormal problems such as stall, load, overcurrent, phase loss, etc. of the brushless motor 900, and feed back to the MCU, thereby detecting and protecting the brushless motor 900.

[0040] The integrated power module 500 includes a W-phase upper bridge arm IGBT, a V-phase upper bridge arm IGBT, and a U-phase upper bridge arm IGBT, a W-phase lower bridge arm IGBT, a V-phase lower bridge arm IGBT, and a U-phase lower bridge arm IGBT, and a node electrically connected to the brushless motor 900 is provided between the upper bridge arm IGBT and the lower bridge arm IGBT of each phase, and the node between the upper bridge arm IGBT and the lower bridge arm IGBT of each phase has and has only one multiplexing pin on the integrated power module 500, and the node includes a first node between the W-phase upper bridge arm IGBT and the W-phase lower bridge arm IGBT, a second node between the V-phase upper bridge arm IGBT and the V-phase lower bridge arm IGBT, and a third node between the U-phase upper bridge arm IGBT and the U-phase lower bridge arm IGBT, and the multiplexing pin includes a first multiplexing pin 505 connected to the first node, a second multiplexing pin connected to the second node, and a third multiplexing pin connected to the third node. The three multiplexing pins are all arranged on the first side 501.

[0041] like Figure 3As shown, the three-phase bootstrap capacitor includes a W-phase bootstrap capacitor C412, a V-phase bootstrap capacitor C407 and a U-phase bootstrap capacitor C402 for driving the U-phase upper bridge arm of the IGBT, and the three phases of the stator of the brushless motor 900 include a W-phase output terminal connected to the first node, a V-phase output terminal connected to the second node, and a U-phase output terminal connected to the third node, the first end of the W-phase bootstrap capacitor and the W-phase output terminal are both connected to the first multiplexed pin 505, the V-phase output terminal and the first end of the V-phase bootstrap capacitor are both connected to the second multiplexed pin, and the U-phase output terminal and the first end of the U-phase bootstrap capacitor are both connected to the third multiplexed pin. The second end of the W-phase bootstrap capacitor is connected to the W-phase high-side drive floating power supply terminal pin of the second side 502, the second end of the V-phase bootstrap capacitor is connected to the V-phase high-side drive floating power supply terminal pin of the second side 502, and the second end of the U-phase bootstrap capacitor is connected to the U-phase high-side drive floating power supply terminal pin of the second side 502. The three high-side drive floating power supply terminal pins provide a 15V voltage for the three-phase bootstrap capacitors respectively.

[0042] Specifically, Figure 2 As shown, the three phases of the stator of the brushless motor 900 are specifically W phase, V phase and U phase, which are respectively connected to the first multiplexed pin 505, the second multiplexed pin 506 and the third multiplexed pin 507.

[0043] The bootstrap capacitor includes a W-phase bootstrap capacitor for driving the W-phase upper bridge arm of the IGBT, one end of the W-phase bootstrap capacitor is connected to the W-phase high-side driving floating power supply ground terminal VSW, and the other end is connected to the W-phase high-side driving floating power supply terminal VBW, the W-phase high-side driving floating power supply ground terminal VSW and the W-phase output terminal are both connected to the first multiplexing pin, and the pin of the W-phase high-side driving floating power supply terminal VBW is set on the second side 502. The second side 502 is also provided with a W-phase low-side driving power supply terminal VCCW pin, a diode is connected between the W-phase low-side driving power supply terminal VCCW pin and the W-phase high-side driving floating power supply terminal VBW, and the W-phase low-side driving power supply terminal VCCW pin is adjacent to the first multiplexing pin, that is, the W-phase high-side driving floating power supply terminal VBW pin. The first side 501 is also provided with a DC negative terminal pin NW, the DC negative terminal pin NW is adjacent to the W-phase output pin, and the DC negative terminal pin NW is externally connected to the sampling resistor R409. The second side 502 is provided with a W-phase low-side signal input pin INWL and an adjacent W-phase high-side signal input pin INWH.

[0044] The bootstrap capacitor includes a V-phase bootstrap capacitor for driving the V-phase upper bridge arm of the IGBT, one end of the V-phase bootstrap capacitor is connected to the V-phase high-side driving floating power supply ground terminal VSV, and the other end is connected to the V-phase high-side driving floating power supply terminal VBV, the V-phase high-side driving floating power supply ground terminal VSV and the V-phase output terminal are both connected to the second pin multiplexing, and the V-phase high-side driving floating power supply terminal VBV pin is set on the second side 502. The second side 502 is also provided with a V-phase low-side driving power supply pin VCCV, a diode is connected between the V-phase low-side driving power supply pin VCCV and the V-phase high-side driving floating power supply terminal VBV, and the V-phase high-side driving floating power supply pin VBV is adjacent to the second multiplexing pin, that is, the V-phase low-side driving power supply pin VCCV. The first side 501 is also provided with a DC negative terminal pin NV, the DC negative terminal pin NV is adjacent to the V-phase output pin, and the DC negative terminal pin NV is externally connected to the sampling resistor R409. The second side 502 is provided with a V-phase low-side signal input pin INVL and an adjacent V-phase high-side signal input pin INVH.

[0045] The bootstrap capacitor includes a U-phase bootstrap capacitor for driving the U-phase upper bridge arm of the IGBT, one end of the U-phase bootstrap capacitor is connected to the U-phase high-side driving suspension power supply ground terminal VSU, and the other end is connected to the U-phase high-side driving suspension power supply pin VBU, the U-phase high-side driving suspension power supply ground terminal VSU and the U-phase output terminal are both connected to the third multiplexed pin, and the U-phase high-side driving suspension power supply pin VBU is arranged on the second side 502. The second side 502 is also provided with a U-phase low-side driving power supply pin VCCU, a diode is connected between the U-phase low-side driving power supply pin VCCU and the U-phase high-side driving suspension power supply pin VBU, and the U-phase high-side driving suspension power supply pin VBU is arranged adjacent to the second multiplexed pin, that is, the U-phase low-side driving power supply pin VCCU. The first side 501 is also provided with a DC negative terminal pin NU, the DC negative terminal pin NU is arranged adjacent to the U-phase output pin, and the DC negative terminal pin NU is externally connected to the sampling resistor R409. The second side 502 is provided with a U-phase low-side signal input pin INUL and an adjacently arranged U-phase high-side signal input pin INUH. Other pins not shown may refer to the prior art.

[0046] like Figure 4 and Figure 5As shown, the side of the integrated power module 500 is arranged along the short side of the PCB board 400, the motor drive module includes a PCB board 400 and a heat sink covering the integrated power module 500, the heat sink includes a plurality of heat dissipation fins 503, a heat dissipation channel 504 is formed between the plurality of heat dissipation fins 503, the heat dissipation channel 504 is arranged along the short side direction of the PCB board 400, an air duct is arranged in the host 100, and no PCB board 400 components are arranged in the air duct upstream and downstream of the heat dissipation channel 504 passing through the PCB board 400. The integrated power module 500 is arranged along the short side of the PCB board 400, and the heat dissipation channel 504 is also arranged along the short side of the PCB board 400, so that when the wind passes through the heat dissipation channel 504, it can cover the integrated power module 500 to the greatest extent and effectively dissipate heat. No PCB board 400 components are arranged upstream and downstream of the heat dissipation channel 504 of the PCB board 400, so as to avoid interference with the temperature of the air medium and affect the heat dissipation effect of the integrated power module 500, and the heat dissipation channel 504 has a fast flow rate when flowing over the integrated power module 500, fast thermal interaction, and high heat dissipation efficiency.

[0047] The shell of the host 100 is provided with a first air inlet 101 and a first air outlet 102, the brushless motor 900 includes an upper end cover and a lower end cover, a heat dissipation cavity of the brushless motor 900 is formed between the upper end cover and the lower end cover, the heat dissipation cavity is provided with a brushless motor 900 and a fan, a second air inlet 700 and a second air outlet 800 are provided on the cavity wall of the heat dissipation cavity, and the air duct passes through the first air inlet 101, the heat dissipation channel 504, the second air inlet 700, the heat dissipation cavity, the second air outlet 800 and the first air outlet 102 in sequence. Specifically, under the negative pressure of the fan, the air medium enters the main unit 100 through the first air inlet 101, centrally dissipates heat to the integrated power module 500 through the heat dissipation channel 504, enters the heat dissipation cavity through the second air inlet 700 to dissipate heat to the brushless motor 900, and then takes the hot air out through the second air outlet 800, and finally discharges the heat dissipation cavity from the second air outlet, and is discharged to the outside of the main unit 100 through the first air outlet 102. The air flow direction is stable and the air flow speed is fast in accordance with the air duct, and the heat in the heat dissipation fins 503 and the heat dissipation cavity can be quickly taken away.

[0048] The host 100 is provided with an operation panel and a control board 103 located below the operation panel, the PCB board 400 is horizontally arranged below the control board 103, and an air guide cover 600 is arranged between the first air inlet 101 and the second air inlet 700, and the air guide cover 600 at least covers the integrated power module 500 of the PCB board 400 and separates the integrated power module 500 from the control board 103. The air guide cover 600 separates the control board 103 from the PCB board 400 to prevent the temperature from being transferred upward, and is also more conducive to the focusing of the heat dissipation channel 504 and the stability of the air medium flow path.

[0049] The PCB board 400 also includes an EMC module, the three-phase output end of the stator of the brushless motor 900 is provided with a first magnetic ring, the food processor includes an output power line, and the power line is provided with a second magnetic ring, and the first magnetic ring and the second magnetic ring can further reduce the anti-electromagnetic interference performance, so that the PCB board 400 meets the safety requirements and the performance of the food processor and the applicability of processing various foods, while minimizing the area of ​​the PCB board 400 and the space occupied in the host 100, so that the whole food processor is more miniaturized, compact in structure, small in space and easy to store in the kitchen environment. In addition, the brushless motor 900 driven by the optimized integrated power module 500 also enables the food processor to have a wide speed range and large starting torque, low operating noise, stable operation and long life, good anti-electromagnetic interference effect, and the temperature rise of the power device is continuously within a controllable range.

[0050] The above is equivalent to a three-level space optimization of the food processor. The first-level space optimization reduces the space of the integrated power module 500, leaving no extra space for integrating the bootstrap capacitor, and no extra space for distributing other lead pins. When the pins are reused and the chip size of the integrated drive module is reduced, the pin spacing is reduced and the number is reduced, and the heat dissipation performance is further optimized. The second-level space optimizes the space of the PCB board 400. Since there are many components on the PCB board 400 used for the food processor, there is not enough space to meet the requirements of anti-electromagnetic interference. A magnetic ring is set on the three-phase lead wires and power lines of the brushless motor 900, and the anti-electromagnetic interference standard is met while the area of ​​the PCB board 400 is reduced. The three-level space optimizes the internal space of the food processing machine host 100. The space inside the host 100 is limited, and a brushless motor 900, a motor heat dissipation cavity, an air duct, a control board 103 corresponding to the operation panel, and a PCB board 400 are provided. Therefore, the heat dissipation space of the PCB board 400 is reduced, and the PCB board 400 needs to be placed horizontally in a small space, and the integrated power module 500 must be set on the path of the air duct, thereby optimizing the use of the internal space of the host 100.

[0051] It can be understood that the cup body 201 can also be integrally arranged with the host 100, and the host 100 can also be arranged to include a water tank. The crushing device 202 is arranged at the upper end of the output shaft of the brushless motor 900, and no connecting head is required. The brushless motor 900 directly drives the crushing device 202 to rotate.

[0052] It can be understood that the PCB board can also be set in the cup holder under the cup body together with the brushless motor, without being set in the main unit, so that the food processor cup body has better integration. Of course, the PCB board and the brushless motor can also be respectively set in the cup holder of the cup body and the main unit, and connected by electrical coupling, so as to optimize the installation space.

[0053] It can be understood that the heating device can also be configured as a heating film or a steam generator, etc.

[0054] In addition to the above preferred embodiments, the technical solutions protected by the present invention are not limited to the above embodiments. It should be pointed out that the combination of multiple technical solutions in any one embodiment, and the combination of the technical solution of any one embodiment with the technical solutions in one or more other embodiments, are within the protection scope of the present invention. Although the present invention has been described in detail above with general descriptions and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to it based on the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A food processor driven by a brushless motor, characterized in that: include: Host; A crushing assembly, including a cup body and a crushing device driven by a brushless motor; A heating component, used for heating the material in the cup body; PCB board, including integrated power module, MCU module, heating drive module and switching power supply module; The integrated power module comprises a lead frame, the lead frame comprises a first side and a second side arranged opposite to each other, the first side and the second side are arranged along the long side of the integrated power module, a three-phase IGBT is integrated in the integrated power module, and the long side of the integrated power module is not greater than 50 mm; Three-phase bootstrap capacitors are arranged on the PCB independently from the integrated power module and are used to drive the upper bridge arms of the three-phase IGBTs respectively; The first side is provided with three multiplexed pins, the three multiplexed pins are respectively connected between the upper and lower bridge arms of the three-phase IGBT, and the three phases of the brushless motor stator and one end of the three-phase bootstrap capacitor are respectively connected to the three multiplexed pins; The second side is provided with three high-side driving suspension power supply pins, and the other ends of the three-phase bootstrap capacitors are respectively connected to the three high-side driving suspension power supply pins.

2. The food processor according to claim 1, characterized in that The integrated power module is arranged on a first side of the PCB board, and the three-phase bootstrap capacitor is arranged on a second side of the PCB board.

3. The food processing machine according to claim 1, characterized in that The three-phase bootstrap capacitor is arranged between the pins on the first side and the pins on the second side, and within the projection of the integrated power module on the PCB board.

4. The food processing machine according to claim 1, characterized in that The second side is provided with a three-phase low-side drive power supply end pin, and the low-side drive power supply end pin and the high-side drive suspension power supply end pin are arranged adjacent to each other; A diode is provided in the integrated power module, and the positive electrode of the diode is connected to the low-side driving power supply terminal pin, and the negative electrode of the diode is connected to the high-side driving suspension power supply terminal pin.

5. The food processor according to claim 1, characterized in that The second side is provided with three input shutdown pins corresponding to the three-phase IGBT respectively, and the integrated power module also includes a fault output terminal and a temperature output terminal, the fault output terminal and the temperature output terminal are both connected to one of the input shutdown pins, and the temperature output terminal is connected to a pull-up resistor, and the resistance of the pull-up resistor is R, 4kΩ≤R≤7kΩ.

6. The food processor according to claim 1, characterized in that The first side is also provided with three DC negative terminal pins corresponding to the three-phase IGBTs respectively, the three DC negative terminal pins are arranged adjacent to the corresponding phases of the three multiplexed pins in pairs, and the DC negative terminal pins are externally connected to a sampling resistor.

7. The food processor according to claim 1, characterized in that The side edge of the integrated power module is arranged along the short side of the PCB board, the motor drive module includes a PCB board and a heat sink covering the integrated power module, the heat sink includes a plurality of heat sink fins, a heat sink channel is formed between the plurality of heat sink fins, the heat sink channel is arranged along the short side direction of the PCB board, an air duct is arranged in the host, and no PCB board components are arranged in the air duct upstream and downstream of the heat sink channel passing through the PCB board.

8. The food processor according to claim 7, characterized in that The shell of the host is provided with a first air inlet and a first air outlet, the brushless motor includes an upper end cover and a lower end cover, a brushless motor heat dissipation cavity is formed between the upper end cover and the lower end cover, the heat dissipation cavity is provided with a second air inlet and a second air outlet, and the air duct is discharged through the first air inlet, the heat dissipation channel, the second air inlet, the heat dissipation cavity, the second air outlet and the first air outlet in sequence.

9. The food processor according to claim 8, characterized in that The host is provided with an operation panel and a control board located below the operation panel, the PCB board is horizontally arranged below the control board, an air guide cover is provided between the first air inlet and the second air inlet, the air guide cover at least covers the integrated power module of the PCB board and separates the integrated power module from the control board.

10. The food processor according to claim 1, characterized in that The PCB board also includes an EMC module, a first magnetic ring is provided at the three-phase output end of the stator of the brushless motor, and the food processor includes a power line electrically connected to the PCB board, and a second magnetic ring is provided on the power line.

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