Optical module rigid-flexible combined board, manufacturing method of rigid-flexible combined board and welding jig

Abstract

The invention relates to an optical module rigid-flexible combined board, a manufacturing method of the rigid-flexible combined board and a welding jig. According to the technical scheme, the method is characterized by comprising the steps that a PCB jointed board is placed in a containing groove of a patch carrier; putting the patch carrier into a placement groove of a printing base, and pasting a high-temperature adhesive tape covering the golden finger area on the printing base; the printing base is put into an automatic printing machine for operation; after solder paste printing is completed, the surface mounting carrier is taken out of the containing groove, the automatic surface mounting machine adsorbs the flexible FPC device from the flexible part placing jig, and the flexible FPC device is placed at the corresponding position of the PCB jointed board; the backflow pressing assembly is used for pressing the flexible FPC device and the PCB jointed board; putting the patch carrier into reflow soldering equipment for reflow soldering; after reflow soldering is completed, the reflow pressing assembly is detached from the patch carrier, and the PCB jointed board is taken out of the containing groove; the PCB golden finger position can be conveniently protected, the production efficiency is improved, and large-scale production of products can be conveniently realized.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB manufacturing, and more specifically, to an optical module rigid-flexible board, a manufacturing method of the rigid-flexible board, and a welding jig. Background Art

[0002] With the advancement of the national "Broadband China, Optical Network City" project, the information capacity of optical networks has increased dramatically, and high-speed broadband optical modules have become a major research hotspot in the current optical communication field. With the development of 5G technology, the demand for optical modules is increasing, but the cost requirements for optical modules are also increasing.

[0003] The production and manufacturing of optical modules involves the patching of PCB boards and flexible boards. The patching of PCBs uses the mature SMT process, and the commonly used methods for welding between the flexible board and the PCB are manual welding, hotbar (pulse hot pressing welding), laser welding and SMT. The first three methods have obvious disadvantages. Manual welding has the problem of inconsistent welding and increased labor costs. Hotbar has the problem of space limitation (high-density small-size optical modules cannot be used), and laser welding has the problem of too high equipment costs. For the SMT process, using the same patching method as optical devices to weld the flexible board is the most ideal way to reduce costs.

[0004] The existing invention patent with the patent publication number CN 101083878 A discloses a welding method for FPC board and PCB board and its special fixture, which includes the following steps: the first step is to print solder paste on a large PCB board connected by multiple PCB small boards; the second step is to perform SMT mounting of components on the PCB board; the third step is to fix the PCB board in the card slot of the lower template of the fixture for positioning; the fourth step is to align the pads of the FPC board and the PCB board; the fifth step is to cover the upper template of the fixture on the upper surface of the PCB board, the pad area is 50% to 80%, the lower bottom surface of the upper template must be kept horizontal, and the buckle of the lower template is rotated to lock the upper template; the sixth step is to put the locked fixture into a closed reflow furnace for reflow soldering; the seventh step is to demould and take out to check the welding condition of the FPC board and the PCB board. The special fixture provided by the invention includes an upper template and a lower template.

[0005] Since the above welding method and its special fixture do not protect the gold finger part of the PCB, it is easy to cause gold finger contamination. Usually, in order to prevent the gold finger part from being contaminated, high-temperature protective glue is pasted on the gold finger part of each PCB before printing and circulated with the PCB. Before shipment, the high-temperature glue of the gold finger part of the PCBA is removed and the finished product is shipped. The operation is troublesome and wastes manpower and materials, which is not suitable for batch operation. Summary of the invention

[0006] In view of the deficiencies in the prior art, an object of the present invention is to provide an optical module rigid-flexible board, a method for manufacturing the rigid-flexible board, and a welding jig to solve the above technical problems.

[0007] The above technical purpose of the present invention is achieved through the following technical solutions: a welding jig, comprising: a printing base, a patch carrier, a flexible material swinging jig, and a reflow pressing assembly; a placement groove is opened on the printing base; the patch carrier is detachably arranged in the placement groove; a receiving groove corresponding to the PCB is arranged on the patch carrier; the reflow pressing assembly is detachably connected to the patch carrier.

[0008] Specifically, when welding the flexible FPC device to the PCB, first place the PCB panel in the receiving slot, then place the patch carrier on the printed base, and paste high-temperature tape on the printed base and the gold finger area of ​​each PCB board in the PCB panel, so that the tape completely overlaps the gold finger part of the PCB board. Among them, multiple PCB boards are arranged on the PCB panel, and the multiple PCB boards are arranged in one row or multiple rows of arrays on the PCB panel; when pasting the high-temperature tape, the gold finger part on one row of PCB boards can be protected at a time, so as to realize batch operation of the gold fingers on the PCB boards.

[0009] After completing the pasting protection of the gold finger, put the printing base into the automatic printing machine for operation, and print the solder paste on each PCB board. After the printing of the solder paste is completed, the printing base is output, and when the patch carrier is removed from the printing base, the high temperature resistant tape is separated from the patch carrier, and the high temperature resistant tape on the PCB panel can be quickly torn off. Then, the pre-placed flexible FPC device is adsorbed on the flexible material swing fixture, and the flexible FPC device is placed on the PCB panel accordingly; then the reflow pressing assembly is installed on the patch carrier, and the flexible FPC device is pressed on the PCB panel through the reflow pressing assembly, and the patch carrier is placed flat in the reflow furnace for automatic reflow soldering, so that the solder paste between the flexible FPC device and the PCB panel is melted, and the welding of the flexible FPC device and the PCB panel is completed. After the welding of the flexible FPC device and the PCB panel is completed, the reflow pressing assembly is removed from the patch carrier, and the welded PCB panel can be taken out from the patch carrier for the post-process.

[0010] By setting up the printing base to cooperate with the patch carrier, the PCB panel can be placed on the patch carrier and then placed in the printing base, so as to facilitate the treatment of the gold finger positions of all PCB small boards on the PCB panel with high-temperature resistant tape, and the printing base can be adapted to the automatic printing machine to quickly print solder paste on the corresponding positions of the PCB small boards. After the printing is completed, when the patch carrier is only removed from the printing base, the high temperature resistant tape is separated from the patch carrier, and the high temperature resistant tape on the PCB panel can be quickly torn off, and the flexible FPC device is adsorbed from the flexible material jig by the automatic patch machine and the corresponding flexible FPC device is mounted on the patch carrier, so that the flexible FPC device and the PCB small board are correspondingly fitted, and then the flexible FPC device is pressed on the PCB small board through the reflow pressing assembly, wherein the reflow pressing assembly can press all the flexible FPC devices to avoid the position of the flexible FPC device being offset; the reflow pressing assembly is positioned by the pressing block positioning column and the pressing block positioning hole, so that the reflow pressing assembly is more stable during pressing, and the reflow pressing assembly is avoided from being offset. Then the patch carrier is directly placed on the steel mesh of the reflow furnace, and the flexible FPC device on the patch carrier and the PCB small board can be reflow soldered, so as to improve the welding consistency and reliability of the flexible FPC device and the PCB small board, and facilitate the mass production of the product.

[0011] Optionally, the patch carrier includes: a carrier body; a receiving groove corresponding to the PCB panel is opened on the carrier body; a plurality of panel positioning columns corresponding to the positioning holes of the PCB panel are arranged in the receiving groove; a plurality of carrier positioning holes are arranged on the carrier body; and carrier positioning columns corresponding to the plurality of carrier positioning holes are arranged on the printing base.

[0012] Specifically, the size of the receiving groove is consistent with the size of the PCB panel. By setting a panel positioning column in the receiving groove that corresponds to the positioning hole on the PCB panel, the position of the PCB panel can be prevented from being offset when the PCB panel is placed in the receiving groove. A carrier positioning column is set on the printing base. When the patch carrier is installed in the placement groove, the position of the patch carrier on the printing base can be restricted through the cooperation of the carrier positioning column and the carrier positioning hole, ensuring that the patch carrier is always in the specified position to avoid the patch carrier offset.

[0013] Optionally, a plurality of first magnetic blocks are disposed on the carrier body; a plurality of second magnetic blocks corresponding to the plurality of first magnetic blocks are disposed on the printing base; and the first magnetic blocks are attracted to the second magnetic blocks correspondingly.

[0014] Specifically, the carrier body can be adsorbed on the printing base through the first magnetic block and the second magnetic block, thereby further improving the connection stability between the carrier body and the printing base.

[0015] Optionally, at least one double-sided high-temperature resistant adhesive is arranged in the receiving groove; a plurality of ventilation holes are opened in the receiving groove; at least one picking and placing groove is opened on the carrier body and located on the side of the receiving groove; the picking and placing groove is connected to the receiving groove; and a picking and placing opening is opened on the side of the carrier body.

[0016] Specifically, a number of ventilation holes of the same number and corresponding position as the PCB sub-board are provided at the bottom of the receiving groove. The ventilation holes can facilitate the heat dissipation of the PCB sub-board to avoid heat accumulation on the PCB sub-board. Double-sided high-temperature resistant glue is provided in the receiving groove. After the PCB panel is placed, the double-sided high-temperature resistant glue can further limit the position of the PCB panel to avoid the horizontal shaking of the PCB panel after being placed in the receiving groove. In practical applications, three double-sided high-temperature resistant glues are provided, two of which are symmetrically arranged on the left and right sides, and the other is arranged horizontally in the middle of the receiving groove; and a pasting groove is provided on the receiving groove, and the double-sided high-temperature resistant glue is arranged in the pasting groove to ensure that the surface of the double-sided high-temperature resistant glue is flush with the surface of the receiving groove. The inner wall of the pick-and-place groove is arc-shaped. Preferably, two pick-and-place grooves are provided, which are symmetrically arranged on both sides of the receiving groove. After completing the welding of the flexible FPC device and the PCB sub-board, inserting a hand into the pick-and-place groove can directly contact the side of the PCB panel to facilitate the removal of the PCB panel. Two access openings are symmetrically arranged on both sides of the carrier body; the access openings are arc-shaped through grooves directed inwards. The force effect of the carrier body can be improved by setting the access openings, so that the carrier body can be easily removed from the fixture base.

[0017] Optionally, the printing base includes: a jig base and a jig cover; the jig base and the jig cover are rotatably connected; a placement groove corresponding to the patch carrier is opened on the jig cover; the carrier positioning column is arranged on the jig base and located in the placement groove.

[0018] Specifically, when the patch carrier is installed on the printing base, the printing base can be directly placed in the placement groove on the jig cover. When removing the patch carrier from the printing base, since the size of the placement groove is similar to the outer size of the patch carrier, the jig cover is rotated at this time to separate the jig cover from the jig base, and the patch carrier is freed from the restriction of the placement groove of the jig cover, so that the patch carrier can be easily removed from the printing base. And when the jig cover is rotated, the high-temperature tape attached to the jig cover to cover the gold finger position on the PCB panel moves with the jig cover, so that the high-temperature tape is separated from the patch carrier.

[0019] Optionally, a plurality of base positioning columns are provided on the fixture base; and a plurality of upper cover positioning holes corresponding one-to-one to the plurality of base positioning columns are provided on the fixture upper cover.

[0020] The upper cover positioning holes and the base positioning columns can ensure the positioning accuracy of the jig upper cover and the jig base, thereby preventing the offset between the jig upper cover and the jig base from causing the chip carrier to offset.

[0021] Optionally, a plurality of third magnetic blocks are arranged on the fixture base; a plurality of fourth magnetic blocks corresponding to the third magnetic blocks are arranged on the fixture upper cover; the third magnetic blocks and the fourth magnetic blocks are attracted correspondingly; and a clearance groove is opened on the fixture base.

[0022] Specifically, by setting a third magnetic block on the jig base and a fourth magnetic block on the jig cover, it is possible to ensure that the positions of the jig cover and the jig base are constant during printing, and prevent the jig cover from detaching from the jig base. Only by applying external force to the jig cover and the jig base can the third magnetic block and the fourth magnetic block be separated, and then the jig cover can be rotated to open. And by providing a clearance groove on the jig base, a gap is provided between the jig base and the jig cover, so that it is convenient to insert fingers or other tools into the clearance groove and separate the jig base and the jig cover.

[0023] Optionally, the reflow pressing assembly includes: a pressing strip; two pressing block positioning posts symmetrically arranged on the pressing strip; and two pressing block positioning holes corresponding to and matching the two pressing block positioning posts are opened on the patch carrier.

[0024] Specifically, the width of the pressing strip is consistent with the distance between the solders of two rows of PCB panels in the PCB panel. Therefore, when the pressing strip is placed on the patch carrier and the pressing block positioning column is inserted into the corresponding pressing block positioning hole, the pressing strip can completely cover the solder area of ​​the flexible FPC device and the PCB panel, thereby avoiding the offset of the solder area of ​​the flexible FPC device and the PCB panel.

[0025] The present application also provides a method for manufacturing a rigid-flexible board, comprising:

[0026] Place the PCB panel in the receiving slot of the patch carrier;

[0027] Place the patch carrier in the placement slot of the printed base, and stick high-temperature tape covering the gold finger area of ​​the PCB panel on the printed base;

[0028] Place the printing base into the automatic printing press for operation;

[0029] After the solder paste is printed, the chip carrier is taken out from the receiving slot, and the automatic chip mounter absorbs the flexible FPC device from the flexible material fixture and places the flexible FPC device at the corresponding position of the PCB panel;

[0030] Install the reflow press-fit assembly on the patch carrier and press-fit the flexible FPC device and the PCB panel;

[0031] Place the chip carrier into the reflow soldering equipment, and perform reflow soldering on the flexible FPC components and PCB panels on the chip carrier;

[0032] After the reflow soldering is completed, the reflow pressing assembly is removed from the patch carrier and the PCB panel is taken out of the receiving slot.

[0033] Specifically, first place the PCB panel into the receiving slot, and position the PCB panel through the panel positioning column. Then, open the jig cover, and place the patch carrier carrying the PCB panel on the jig base, so that the carrier positioning column is inserted into the carrier positioning hole, and at the same time, the first magnetic block and the second magnetic block are attracted to fix the patch carrier on the jig base, and then rotate the jig cover so that the jig cover is covered on the jig base. At this time, the base positioning column is inserted into the base positioning hole, and the third magnetic block and the fourth magnetic block are attracted. Paste high-temperature tape covering the gold finger area of ​​the PCB panel on the printing base so that the tape completely overlaps the PCB gold finger area; then send the printing base into the automatic printing machine for printing, and print solder paste on each PCB board. After the automatic printing machine completes printing, it outputs the printed base and opens the jig cover. Since the high-temperature tape is attached to the jig cover, the high-temperature tape is separated from the patch carrier as the jig cover and the jig base are separated, so that the high-temperature tape is separated from the PCB panel and the patch carrier is removed from the jig base. The printed base can return to the previous process to perform the next PCB panel operation. The patch carrier is placed in the automatic patch machine, which absorbs the pre-placed flexible FPC devices from the flexible parts swing jig and places the flexible FPC devices at the corresponding positions of the multiple PCB panels of the PCB panel, which is convenient for batch patching of products and realizes the automatic patching of bulk flexible FPC devices. After the patch is completed, the reflow pressing assembly is installed on the patch carrier so that the pressure block positioning column is inserted into the corresponding pressure block positioning hole. At this time, the pressing block can completely cover the flexible FPC device and the soldering area of ​​the PCB panel. Then place the chip carrier flatly into the reflow soldering equipment, and perform reflow soldering on the flexible FPC components and PCB panels on the chip carrier. After the reflow soldering is completed, lift the pressing block flatly upward, remove the reflow pressing assembly, and take the soldered PCB panels out of the receiving slot through the pick-and-place slot to complete the welding of the flexible FPC components and the PCB panels.

[0034] The present application also provides an optical module rigid-flexible board, which is manufactured using the method described above.

[0035] The optical module rigid-flexible board made by the above method has a flexible FPC device connected to the PCB panel by reflow soldering, which improves the consistency and reliability of flexible board welding and effectively solves the problem of the prior art that the printing contamination of the gold finger part and the consistency and reliability of flexible board welding cannot be guaranteed.

[0036] In summary, the present invention has the following beneficial effects:

[0037] By setting up the printing base to cooperate with the patch carrier, the PCB panel can be placed on the patch carrier and then placed in the printing base, so as to facilitate the treatment of the gold finger positions of all PCB small boards on the PCB panel with high-temperature resistant tape, and the printing base can be adapted to the automatic printing machine to quickly print solder paste on the corresponding positions of the PCB small boards. After the printing is completed, when the patch carrier is only removed from the printing base, the high temperature resistant tape is separated from the patch carrier, and the high temperature resistant tape on the PCB panel can be quickly torn off, and the flexible FPC device is adsorbed from the flexible material jig by the automatic patch machine and the corresponding flexible FPC device is mounted on the patch carrier, so that the flexible FPC device and the PCB small board are correspondingly fitted, and then the flexible FPC device is pressed on the PCB small board through the reflow pressing assembly, wherein the reflow pressing assembly can press all the flexible FPC devices to avoid the position of the flexible FPC device being offset; the reflow pressing assembly is positioned by the pressing block positioning column and the pressing block positioning hole, so that the reflow pressing assembly is more stable during pressing, and the reflow pressing assembly is avoided from being offset. Then the patch carrier is directly placed on the steel mesh of the reflow furnace, and the flexible FPC device on the patch carrier and the PCB small board can be reflow soldered, so as to improve the welding consistency and reliability of the flexible FPC device and the PCB small board, and facilitate the mass production of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic diagram of the structure in which the patch carrier is installed on the printing base in the present invention;

[0039] Figure 2 It is a structural schematic diagram of the patch carrier in the present invention;

[0040] Figure 3 It is a schematic diagram of the structure of the printing base in the present invention;

[0041] Figure 4 It is a structural schematic diagram of the fixture base in the present invention;

[0042] Figure 5 It is a schematic diagram of the structure of the upper cover of the fixture in the present invention;

[0043] Figure 6 It is a structural schematic diagram of the reflux pressing assembly in the present invention;

[0044] Figure 7 It is a schematic diagram of the structure in which the reflow pressing assembly in the present invention is installed on a patch carrier;

[0045] Figure 8 It is a structural schematic diagram of the flexible material swinging fixture in the present invention;

[0046] Fig. 9 It is a method flow chart of the method for manufacturing the rigid-flexible board of the present invention.

[0047] In the figure: 1. Printing base; 110. Jig base; 120. Jig cover; 2. SMD carrier; 3. Flexible material placement jig; 4. Reflow pressing assembly; 5. Placement slot; 6. Accommodation slot; 7. Panel positioning column; 8. Carrier positioning hole; 9. Carrier positioning column; 10. First magnetic block; 11. Second magnetic block; 12. Double-sided high temperature resistant glue; 13. Ventilation hole; 14. Pick-up and release slot; 15. Pick-up and release port; 16. Base positioning column; 17. Top cover positioning hole; 18. Third magnetic block; 19. Fourth magnetic block; 20. Give way slot; 21. Press block positioning column; 22. Press block positioning hole; 23. Device placement slot; 24. Flexible FPC device. DETAILED DESCRIPTION

[0048] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings. Several embodiments of the present invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0050] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments.

[0051] Embodiment 1

[0052] This embodiment provides a welding jig, such as Figure 1-8 As shown, it includes: a printing base 1, a patch carrier 2, a flexible material swinging fixture 3, and a reflow pressing component 4; a placement groove 5 is opened on the printing base 1; the patch carrier 2 is detachably arranged in the placement groove 5; a receiving groove 6 corresponding to the PCB is arranged on the patch carrier 2; the reflow pressing component 4 is detachably connected to the patch carrier 2.

[0053] Specifically, when welding the flexible FPC device 24 to the PCB, first place the PCB panel in the receiving groove 6, then place the patch carrier 2 on the printing base 1, and paste high-temperature tape on the printing base 1 and the gold finger area of ​​each PCB board in the PCB panel, so that the tape completely overlaps the gold finger part of the PCB board. Among them, multiple PCB boards are arranged on the PCB panel, and the multiple PCB boards are arranged in one row or multiple rows of arrays on the PCB panel; when pasting the high-temperature tape, the gold finger part on one row of PCB boards can be protected at a time, so as to realize batch operation of the gold fingers on the PCB boards.

[0054] After completing the pasting protection of the gold finger, put the printing base 1 into the automatic printing machine for operation, and print the solder paste on each PCB board. After completing the printing of the solder paste, output the printing base 1, and when the patch carrier 2 is removed from the printing base 1, the high temperature resistant tape is separated from the patch carrier 2, and the high temperature resistant tape on the PCB panel can be quickly torn off. Then, by adsorbing the pre-placed flexible FPC device 24 on the flexible material swing fixture 3, and placing the flexible FPC device 24 on the PCB panel; then install the reflow pressing component 4 on the patch carrier 2, press the flexible FPC device 24 on the PCB panel through the reflow pressing component 4, and place the patch carrier 2 flat in the reflow furnace for automatic reflow soldering, so that the solder paste between the flexible FPC device 24 and the PCB panel is melted, and the welding of the flexible FPC device 24 and the PCB panel is completed. After completing the welding of the flexible FPC device 24 and the PCB panel, the reflow pressing assembly 4 is removed from the patch carrier 2, and the welded PCB panel can be taken out of the patch carrier 2 for the post-process.

[0055] By setting up the printing base 1 to cooperate with the patch carrier 2, the PCB panel can be placed on the patch carrier 2 and then placed in the printing base 1, so as to facilitate the treatment of the gold finger positions of all PCB small boards on the PCB panel with high-temperature resistant tape, and the printing base 1 can be adapted to the automatic printing machine to quickly print solder paste on the corresponding positions of the PCB small boards. After printing is completed, when the patch carrier 2 is only removed from the printing base 1, the high-temperature resistant tape is separated from the patch carrier 2, and the high-temperature resistant tape on the PCB panel can be quickly torn off, and the flexible FPC device 24 is adsorbed from the flexible material fixture 3 by the automatic patch machine and the corresponding flexible FPC device 24 is mounted on the patch carrier 2, so that the flexible FPC device 24 is correspondingly fitted with the PCB small board, and then the flexible FPC device 24 is pressed on the PCB small board through the reflow pressing component 4, wherein the reflow pressing component 4 can press all the flexible FPC devices 24 to avoid the position of the flexible FPC device 24 from being offset; the reflow pressing component 4 is positioned by the pressing block positioning column 21 and the pressing block positioning hole 22, so that the reflow pressing component 4 is more stable during pressing to avoid the reflow pressing component 4 from being offset. Then, the chip carrier 2 is directly placed on the steel net of the reflow furnace, and the flexible FPC device 24 and the PCB board on the chip carrier 2 can be reflow-soldered to improve the welding consistency and reliability of the flexible FPC device 24 and the PCB board, thereby facilitating mass production of the product.

[0056] Optionally, the patch carrier 2 includes: a carrier body; a receiving groove 6 corresponding to the PCB panel is opened on the carrier body; a plurality of panel positioning columns 7 corresponding to the positioning holes of the PCB panel are arranged in the receiving groove 6; a plurality of carrier positioning holes 8 are arranged on the carrier body; and carrier positioning columns 9 corresponding to the plurality of carrier positioning holes 8 are arranged on the printing base 1.

[0057] Specifically, the size of the receiving groove 6 is consistent with the size of the PCB panel. By providing a panel positioning column 7 in the receiving groove 6 that corresponds to the positioning hole on the PCB panel, the position of the PCB panel can be prevented from being offset when the PCB panel is placed in the receiving groove 6. A carrier positioning column 9 is provided on the printing base 1. When the patch carrier 2 is installed in the placement groove 5, the position of the patch carrier 2 on the printing base 1 can be limited by the cooperation of the carrier positioning column 9 and the carrier positioning hole 8, ensuring that the patch carrier 2 is always in the specified position to avoid the patch carrier 2 from being offset.

[0058] In this embodiment, there are four panel positioning posts 7, which are respectively arranged at the four ends of the receiving groove 6. There are four carrier positioning posts 9, which are respectively arranged at the four corners of the placement groove 5 of the printing base 1.

[0059] Optionally, a plurality of first magnetic blocks 10 are disposed on the carrier body; a plurality of second magnetic blocks 11 corresponding to the plurality of first magnetic blocks 10 are disposed on the printing base 1; and the first magnetic blocks 10 and the second magnetic blocks 11 are attracted to each other correspondingly.

[0060] Specifically, the first magnetic block 10 and the second magnetic block 11 can adsorb the carrier body to the printing base 1, further improving the connection stability between the carrier body and the printing base 1. In this embodiment, four first magnetic blocks 10 and four second magnetic blocks 11 are provided, and they are centrally symmetrically arranged.

[0061] Optionally, at least one double-sided high temperature resistant adhesive 12 is arranged in the receiving groove 6; a plurality of ventilation holes 13 are opened in the receiving groove 6; at least one picking and placing groove 14 is opened on the carrier body and located on the side of the receiving groove 6; the picking and placing groove 14 is connected to the receiving groove 6; and a picking and placing port 15 is opened on the side of the carrier body.

[0062] Specifically, a plurality of ventilation holes 13 are provided at the bottom of the receiving groove 6, the number of which is the same as that of the PCB sub-board and the position of which is corresponding. The ventilation holes 13 can facilitate the heat dissipation of the PCB sub-board to avoid the accumulation of heat on the PCB sub-board. A double-sided high temperature resistant glue 12 is provided in the receiving groove 6. After the PCB panel is placed, the double-sided high temperature resistant glue 12 can further limit the position of the PCB panel to avoid the horizontal shaking of the PCB panel after being placed in the receiving groove 6. In practical applications, three double-sided high temperature resistant glues 12 are provided, two of which are symmetrically arranged on the left and right sides, and the other is arranged horizontally in the middle of the receiving groove 6; and an adhesive groove is provided on the receiving groove 6, and the double-sided high temperature resistant glue 12 is arranged in the adhesive groove to ensure that the surface of the double-sided high temperature resistant glue 12 is flush with the surface of the receiving groove 6. The inner wall of the pick-up and place groove 14 is arc-shaped. Preferably, two pick-up and place grooves 14 are provided, which are symmetrically arranged on both sides of the receiving groove 6. After the flexible FPC device 24 is welded to the PCB sub-board, the hand can be inserted into the pick-and-place groove 14 to directly contact the side of the PCB panel, so as to facilitate the removal of the PCB panel. Two pick-and-place openings 15 are symmetrically arranged on both sides of the carrier body; the pick-and-place openings 15 are arc-shaped through grooves that are guided inward. By providing the pick-and-place openings 15, the force effect of the carrier body can be improved, so that the carrier body can be easily removed from the fixture base 110.

[0063] In this embodiment, ten PCB sub-boards are arranged on the PCB panel, and the ten PCB sub-boards are divided into two rows and symmetrically arranged on the PCB panel; ten ventilation holes 13 are provided, and the positions are consistent with those of the PCB sub-boards.

[0064] Embodiment 2

[0065] This embodiment provides a welding jig, such as Figure 1-8As shown, it includes: a printing base 1, a patch carrier 2, a flexible material swinging fixture 3, and a reflow pressing component 4; a placement groove 5 is opened on the printing base 1; the patch carrier 2 is detachably arranged in the placement groove 5; a receiving groove 6 corresponding to the PCB is arranged on the patch carrier 2; the reflow pressing component 4 is detachably connected to the patch carrier 2.

[0066] Specifically, when welding the flexible FPC device 24 to the PCB, first place the PCB panel in the receiving groove 6, then place the patch carrier 2 on the printing base 1, and paste high-temperature tape on the printing base 1 and the gold finger area of ​​each PCB board in the PCB panel, so that the tape completely overlaps the gold finger part of the PCB board. Among them, multiple PCB boards are arranged on the PCB panel, and the multiple PCB boards are arranged in one row or multiple rows of arrays on the PCB panel; when pasting the high-temperature tape, the gold finger part on one row of PCB boards can be protected at a time, so as to realize batch operation of the gold fingers on the PCB boards.

[0067] After completing the pasting protection of the gold finger, put the printing base 1 into the automatic printing machine for operation, and print the solder paste on each PCB board. After completing the printing of the solder paste, output the printing base 1, and when the patch carrier 2 is removed from the printing base 1, the high temperature resistant tape is separated from the patch carrier 2, and the high temperature resistant tape on the PCB panel can be quickly torn off. Then, by adsorbing the pre-placed flexible FPC device 24 on the flexible material swing fixture 3, and placing the flexible FPC device 24 on the PCB panel; then install the reflow pressing component 4 on the patch carrier 2, press the flexible FPC device 24 on the PCB panel through the reflow pressing component 4, and place the patch carrier 2 flat in the reflow furnace for automatic reflow soldering, so that the solder paste between the flexible FPC device 24 and the PCB panel is melted, and the welding of the flexible FPC device 24 and the PCB panel is completed. After completing the welding of the flexible FPC device 24 and the PCB panel, the reflow pressing assembly 4 is removed from the patch carrier 2, and the welded PCB panel can be taken out of the patch carrier 2 for the post-process.

[0068] By setting up the printing base 1 to cooperate with the patch carrier 2, the PCB panel can be placed on the patch carrier 2 and then placed in the printing base 1, so as to facilitate the treatment of the gold finger positions of all PCB small boards on the PCB panel with high-temperature resistant tape, and the printing base 1 can be adapted to the automatic printing machine to quickly print solder paste on the corresponding positions of the PCB small boards. After printing is completed, when the patch carrier 2 is only removed from the printing base 1, the high-temperature resistant tape is separated from the patch carrier 2, and the high-temperature resistant tape on the PCB panel can be quickly torn off, and the flexible FPC device 24 is adsorbed from the flexible material fixture 3 by the automatic patch machine and the corresponding flexible FPC device 24 is mounted on the patch carrier 2, so that the flexible FPC device 24 is correspondingly fitted with the PCB small board, and then the flexible FPC device 24 is pressed on the PCB small board through the reflow pressing component 4, wherein the reflow pressing component 4 can press all the flexible FPC devices 24 to avoid the position of the flexible FPC device 24 from being offset; the reflow pressing component 4 is positioned by the pressing block positioning column 21 and the pressing block positioning hole 22, so that the reflow pressing component 4 is more stable during pressing to avoid the reflow pressing component 4 from being offset. Then, the chip carrier 2 is directly placed on the steel net of the reflow furnace, and the flexible FPC device 24 and the PCB board on the chip carrier 2 can be reflow-soldered to improve the welding consistency and reliability of the flexible FPC device 24 and the PCB board, thereby facilitating mass production of the product.

[0069] Optionally, the patch carrier 2 includes: a carrier body; a receiving groove 6 corresponding to the PCB panel is opened on the carrier body; a plurality of panel positioning columns 7 corresponding to the positioning holes of the PCB panel are arranged in the receiving groove 6; a plurality of carrier positioning holes 8 are arranged on the carrier body; and carrier positioning columns 9 corresponding to the plurality of carrier positioning holes 8 are arranged on the printing base 1.

[0070] Specifically, the size of the receiving groove 6 is consistent with the size of the PCB panel. By providing a panel positioning column 7 in the receiving groove 6 that corresponds to the positioning hole on the PCB panel, the position of the PCB panel can be prevented from being offset when the PCB panel is placed in the receiving groove 6. A carrier positioning column 9 is provided on the printing base 1. When the patch carrier 2 is installed in the placement groove 5, the position of the patch carrier 2 on the printing base 1 can be limited by the cooperation of the carrier positioning column 9 and the carrier positioning hole 8, ensuring that the patch carrier 2 is always in the specified position to avoid the patch carrier 2 from being offset.

[0071] In this embodiment, there are four panel positioning posts 7, which are respectively arranged at the four ends of the receiving groove 6. There are four carrier positioning posts 9, which are respectively arranged at the four corners of the placement groove 5 of the printing base 1.

[0072] Optionally, a plurality of first magnetic blocks 10 are disposed on the carrier body; a plurality of second magnetic blocks 11 corresponding to the plurality of first magnetic blocks 10 are disposed on the printing base 1; and the first magnetic blocks 10 and the second magnetic blocks 11 are attracted to each other correspondingly.

[0073] Specifically, the first magnetic block 10 and the second magnetic block 11 can adsorb the carrier body to the printing base 1, further improving the connection stability between the carrier body and the printing base 1. In this embodiment, four first magnetic blocks 10 and four second magnetic blocks 11 are provided, and they are centrally symmetrically arranged.

[0074] Optionally, at least one double-sided high temperature resistant adhesive 12 is arranged in the receiving groove 6; a plurality of ventilation holes 13 are opened in the receiving groove 6; at least one picking and placing groove 14 is opened on the carrier body and located on the side of the receiving groove 6; the picking and placing groove 14 is connected to the receiving groove 6; and a picking and placing port 15 is opened on the side of the carrier body.

[0075] Specifically, a plurality of ventilation holes 13 are provided at the bottom of the receiving groove 6, the number of which is the same as that of the PCB sub-board and the position of which is corresponding. The ventilation holes 13 can facilitate the heat dissipation of the PCB sub-board to avoid the accumulation of heat on the PCB sub-board. A double-sided high temperature resistant glue 12 is provided in the receiving groove 6. After the PCB panel is placed, the double-sided high temperature resistant glue 12 can further limit the position of the PCB panel to avoid the horizontal shaking of the PCB panel after being placed in the receiving groove 6. In practical applications, three double-sided high temperature resistant glues 12 are provided, two of which are symmetrically arranged on the left and right sides, and the other is arranged horizontally in the middle of the receiving groove 6; and an adhesive groove is provided on the receiving groove 6, and the double-sided high temperature resistant glue 12 is arranged in the adhesive groove to ensure that the surface of the double-sided high temperature resistant glue 12 is flush with the surface of the receiving groove 6. The inner wall of the pick-up and place groove 14 is arc-shaped. Preferably, two pick-up and place grooves 14 are provided, which are symmetrically arranged on both sides of the receiving groove 6. After the flexible FPC device 24 is welded to the PCB sub-board, the hand can be inserted into the pick-and-place groove 14 to directly contact the side of the PCB panel, so as to facilitate the removal of the PCB panel. Two pick-and-place openings 15 are symmetrically arranged on both sides of the carrier body; the pick-and-place openings 15 are arc-shaped through grooves that are guided inward. By providing the pick-and-place openings 15, the force effect of the carrier body can be improved, so that the carrier body can be easily removed from the fixture base 110.

[0076] In this embodiment, ten PCB sub-boards are arranged on the PCB panel, and the ten PCB sub-boards are divided into two rows and symmetrically arranged on the PCB panel; ten ventilation holes 13 are provided, and the positions are consistent with those of the PCB sub-boards.

[0077] Optionally, the printing base 1 includes: a jig base 110 and a jig cover 120; the jig base 110 and the jig cover 120 are rotatably connected; a placement groove 5 corresponding to the patch carrier 2 is opened on the jig cover 120; the carrier positioning column 9 is arranged on the jig base 110 and is located in the placement groove 5.

[0078] Specifically, when the patch carrier 2 is installed on the printing base 1, the printing base 1 can be directly placed in the placement groove 5 on the jig cover 120. When the patch carrier 2 is removed from the printing base 1, since the size of the placement groove 5 is close to the outer size of the patch carrier 2, the jig cover 120 is rotated at this time to separate the jig cover 120 from the jig base 110, and the patch carrier 2 is freed from the restriction of the placement groove 5 of the jig cover 120, so that the patch carrier 2 can be easily removed from the printing base 1. When the jig cover 120 is rotated, the high-temperature tape attached to the jig cover 120 for covering the gold finger position on the PCB panel moves with the jig cover 120, so that the high-temperature tape is separated from the patch carrier 2.

[0079] Optionally, a plurality of base positioning posts 16 are disposed on the fixture base 110 ; and a plurality of upper cover positioning holes 17 corresponding one-to-one to the plurality of base positioning posts 16 are disposed on the fixture upper cover 120 .

[0080] The upper cover positioning holes 17 and the base positioning columns 16 can ensure the positioning accuracy of the jig upper cover 120 and the jig base 110, thereby preventing the jig upper cover 120 and the jig base 110 from shifting and causing the chip carrier 2 to shift.

[0081] In this embodiment, four base positioning columns 16 are provided, and four upper cover positioning holes 17 are also provided, and they are centrally symmetrically arranged.

[0082] Optionally, the jig base 110 is also provided with a plurality of third magnetic blocks 18; the jig upper cover 120 is provided with a plurality of fourth magnetic blocks 19 corresponding to the third magnetic blocks 18 one by one; the third magnetic blocks 18 and the fourth magnetic blocks 19 are correspondingly attracted; and a clearance groove 20 is opened on the jig base 110.

[0083] Specifically, by setting the third magnetic block 18 on the jig base 110 and the fourth magnetic block 19 on the jig cover 120, it is possible to ensure that the positions of the jig cover 120 and the jig base 110 are constant during printing, and prevent the jig cover 120 from detaching from the jig base 110. Only on the basis of applying external force to the jig cover 120 and the jig base 110, can the third magnetic block 18 and the fourth magnetic block 19 be separated, and then the jig cover 120 can be rotated to open. And by providing a clearance groove 20 on the jig base 110, a gap is provided between the jig base 110 and the jig cover 120, so as to facilitate the insertion of fingers or other tools into the clearance groove 20, and separate the jig base 110 and the jig cover 120.

[0084] In this embodiment, four third magnetic blocks 18 and four fourth magnetic blocks 19 are provided and are centrally symmetrically arranged.

[0085] Optionally, the reflow pressing assembly 4 includes: a pressing strip; two pressing block positioning posts 21 symmetrically arranged on the pressing strip; and two pressing block positioning holes 22 corresponding to and matching the two pressing block positioning posts 21 are opened on the patch carrier 2 .

[0086] Specifically, the width of the pressing strip is consistent with the distance between the solders of two rows of PCB panels in the PCB panel. Therefore, when the pressing strip is placed on the patch carrier 2 and the pressing block positioning column 21 is inserted into the corresponding pressing block positioning hole 22, the pressing strip can completely cover the flexible FPC device 24 and the solder area of ​​the PCB panel, thereby avoiding the offset of the solder area of ​​the flexible FPC device 24 and the PCB panel.

[0087] Embodiment 3

[0088] This embodiment provides a method for manufacturing a rigid-flexible board. Figure 1-9 As shown, including:

[0089] Place the PCB panel in the receiving slot 6 of the patch carrier 2;

[0090] Place the patch carrier 2 in the placement slot 5 of the printing base 1, and stick a high-temperature tape covering the gold finger area of ​​the PCB panel on the printing base 1;

[0091] The printing base 1 is placed in the automatic printing machine for operation;

[0092] After the solder paste is printed, the chip carrier 2 is taken out from the receiving slot 6, and the automatic chip mounter absorbs the flexible FPC device 24 from the flexible material fixture 3, and places the flexible FPC device 24 at the corresponding position of the PCB panel;

[0093] Install the reflow pressing assembly 4 on the patch carrier 2, and press the flexible FPC device 24 and the PCB panel together;

[0094] Place the patch carrier 2 into a reflow soldering device, and perform reflow soldering on the flexible FPC device 24 and the PCB panel on the patch carrier 2;

[0095] After the reflow soldering is completed, the reflow pressing assembly 4 is removed from the patch carrier 2 , and the PCB panel is taken out from the receiving groove 6 .

[0096] Specifically, first place the PCB panel into the receiving groove 6, and position the PCB panel through the panel positioning column 7. Then, open the jig cover 120, and place the patch carrier 2 carrying the PCB panel on the jig base 110, insert the carrier positioning column 9 into the carrier positioning hole 8, and at the same time, the first magnetic block 10 and the second magnetic block 11 are attracted to fix the patch carrier 2 on the jig base 110, and then rotate the jig cover 120 so that the jig cover 120 covers the jig base 110, at this time, the base positioning column 16 is inserted into the base positioning hole, and the third magnetic block 18 and the fourth magnetic block 19 are attracted.

[0097] Paste high-temperature tape covering the gold finger area of ​​the PCB panel on the printing base 1 so that the tape completely overlaps the gold finger area of ​​the PCB; then send the printing base 1 into the automatic printing machine for printing, and print solder paste on each PCB board. After the automatic printing machine completes printing, output the printing base 1, open the jig cover 120, and because the high-temperature tape is pasted on the jig cover 120, the high-temperature tape is separated from the patch carrier 2 as the jig cover 120 is separated from the jig base 110, thereby separating the high-temperature tape from the PCB panel and removing the patch carrier 2 from the jig base 110. The printing base 1 can return to the previous process to perform the next PCB panel operation.

[0098] Place the patch carrier 2 into the automatic patch machine, which absorbs the pre-placed flexible FPC components 24 from the flexible parts fixture 3, and places the flexible FPC components 24 at corresponding positions on multiple PCB panels of the PCB panel, so as to facilitate batch patching of products and realize automatic patching of bulk flexible FPC components 24.

[0099] Among them, the flexible parts swinging fixture 3 is set according to the parameters of the flexible FPC device 24 to place the flexible FPC device 24, and then the flexible FPC device 24 is sucked from the flexible parts swinging fixture by the automatic placement machine and placed at the corresponding positions of multiple PCB small boards of the PCB panel, which is convenient for batch placement of products and realizes the automatic placement of bulk flexible FPC devices 24. Specifically, due to the irregularity of the flexible FPC device 24, in order to improve the stability of the adsorption of the flexible FPC device 24, the standard suction nozzle of the automatic placement machine is replaced with a rectangular non-standard suction nozzle, and the adsorption area is increased. Its height is the same as that of the standard suction nozzle, and its suction nozzle head is a rectangular shape similar to the size of the flexible FPC device 24 to meet the stable adsorption of the flexible FPC device 24. The device placement slot 23 is sunken in the middle of the fixture, and the shape is based on the flexible FPC device 24 as a reference. The gap between the slot and the device is 0.1 mm to prevent the device from shaking when the device moves at high speed. The number of trays installed is adjusted according to the actual size of the device, and the tray can be reused and recycled. The identification parameters of the flexible FPC device 24 are set separately. For example, the welding point of the flexible FPC device 24 is used as the identification reference point. The identification mode adopts a special identification mode, and the size of the flexible FPC device 24 is set according to the actual size. The welding point can be used to realize material image sampling and complete image recognition. The PCB flexible FPC device 24 mounting position is coordinate-located, and the center point of the PCB pad is taken. The mounting equipment automatically calculates the actual motion trajectory based on the actual image collected by the camera, and mounts the originally bulk flexible FPC device 24 on the PCB. The device mounting accuracy can be controlled within 0.05mm, and the consistency can be continuously replicated, solving the problem of manual mounting offset and poor consistency of bulk materials.

[0100] After the patch is completed, the reflow pressing assembly 4 is installed on the patch carrier 2, so that the pressing block positioning column 21 is inserted into the corresponding pressing block positioning hole 22. At this time, the pressing block can completely cover the flexible FPC device 24 and the soldering area of ​​the PCB small board. Then the patch carrier 2 is placed flat in the reflow soldering equipment, and the flexible FPC device 24 and the PCB panel on the patch carrier 2 are reflow soldered. After the reflow soldering is completed, the pressing block is lifted up flat, the reflow pressing assembly 4 is removed, and the PCB panel that has been welded is taken out of the receiving slot 6 through the pick-and-place slot 14, and the welding of the flexible FPC device 24 and the PCB panel is completed.

[0101] Embodiment 4

[0102] This embodiment provides an optical module rigid-flexible board, which is manufactured using the method described above.

[0103] The optical module rigid-flexible board made by the above method has its flexible FPC device 24 connected to the PCB panel by reflow soldering, which improves the consistency and reliability of flexible board welding and effectively solves the problem of the prior art that the printing contamination of the gold finger part and the consistency and reliability of flexible board welding cannot be guaranteed.

[0104] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A welding jig, characterized in that: include: Printing base, patch carrier, flexible parts swing fixture, and reflow pressing components; A placement groove is provided on the printing base; the patch carrier is detachably arranged in the placement groove; a receiving groove corresponding to the PCB is provided on the patch carrier; and the reflow pressing component is detachably connected to the patch carrier.

2. The welding jig according to claim 1, characterized in that: The patch carrier includes: a carrier body; a receiving groove corresponding to the PCB panel is opened on the carrier body; a plurality of panel positioning columns corresponding to the positioning holes of the PCB panel are arranged in the receiving groove; a plurality of carrier positioning holes are arranged on the carrier body; and a plurality of carrier positioning columns corresponding to the carrier positioning holes are arranged on the printing base.

3. The welding jig according to claim 2, characterized in that: A plurality of first magnetic blocks are arranged on the carrier body; a plurality of second magnetic blocks corresponding to the plurality of first magnetic blocks are arranged on the printing base; and the first magnetic blocks are attracted correspondingly to the second magnetic blocks.

4. The welding jig according to claim 3, characterized in that: At least one double-sided high-temperature resistant adhesive is arranged in the receiving groove; a plurality of ventilation holes are opened in the receiving groove; at least one pick-and-place groove is opened on the carrier body and located on the side of the receiving groove; the pick-and-place groove is connected to the receiving groove; and a pick-and-place opening is opened on the side of the carrier body.

5. The welding jig according to claim 2, characterized in that: The printing base includes: a jig base and a jig cover; the jig base and the jig cover are rotatably connected; a placement groove corresponding to the patch carrier is opened on the jig cover; the carrier positioning column is arranged on the jig base and located in the placement groove.

6. The welding jig according to claim 5, characterized in that: The fixture base is provided with a plurality of base positioning columns; the fixture upper cover is provided with a plurality of upper cover positioning holes corresponding to the plurality of base positioning columns one by one.

7. The welding jig according to claim 5, characterized in that: The fixture base is also provided with a plurality of third magnetic blocks; the fixture upper cover is provided with a plurality of fourth magnetic blocks corresponding to the plurality of third magnetic blocks; the third magnetic blocks and the fourth magnetic blocks are correspondingly attracted; and a yielding groove is opened on the fixture base.

8. The welding jig according to claim 1, characterized in that: The reflow pressing assembly comprises: a pressing strip; two pressing block positioning posts are symmetrically arranged on the pressing strip; and two pressing block positioning holes corresponding to and matching the two pressing block positioning posts are opened on the patch carrier.

9. A method for manufacturing a rigid-flexible board, characterized in that: include: Place the PCB panel in the receiving slot of the patch carrier; Place the patch carrier in the placement slot of the printed base, and stick high-temperature tape covering the gold finger area of ​​the PCB panel on the printed base; Place the printing base into the automatic printing press for operation; After the solder paste is printed, the chip carrier is taken out from the receiving slot, and the automatic chip mounter absorbs the flexible FPC device from the flexible material fixture and places the flexible FPC device at the corresponding position of the PCB panel; Install the reflow press-fit assembly on the patch carrier and press-fit the flexible FPC device and the PCB panel; Place the chip carrier into the reflow soldering equipment, and perform reflow soldering on the flexible FPC components and PCB panels on the chip carrier; After the reflow soldering is completed, the reflow pressing assembly is removed from the patch carrier and the PCB panel is taken out of the receiving slot.

10. An optical module rigid-flexible board, characterized in that: The method according to claim 9 is used for manufacturing.

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