Vertical electronic equipment

Abstract

The invention provides vertical electronic equipment, and relates to the field of high-density assembly of electronic equipment, the equipment comprises a first frame body and a second frame body, the height size of the first frame body is at least more than five times of the width size of the first frame body, and the height size of the second frame body is at least more than five times of the width size of the second frame body; an interface board card and a processing board card are fixedly arranged in the first frame body, and a power supply board card is fixedly arranged in the second frame body. The first frame body comprises two fixing points, the second frame body comprises two fixing points, and the fixing points of the first frame body and the fixing points of the second frame body are combined to be connected with external equipment. The first frame body and the second frame body comprise vibration reduction function devices, and the vibration reduction effect on the electronic equipment is achieved. According to the vertical electronic equipment provided by the invention, the narrow and high space utilization rate in an aircraft or a missile body can be remarkably improved, the vibration resistance of the aircraft or the missile can be remarkably improved, and the reliability of the aircraft or the missile is improved.

Description

Technical Field

[0001] The invention relates to the technical field of high-density assembly of electronic equipment, and in particular to a vertical electronic equipment. Background Art

[0002] Since the internal space of an aircraft or missile is limited and narrow and tall, electronic equipment must be able to be reliably installed in this space. Electronic equipment installed in a narrow and tall space must have corresponding electrical functions, must contain various functional boards and support frames, must withstand harsh environments such as humidity, heat, salt spray, mold, and must withstand vibration and impact. However, the prior art lacks such vertical electronic equipment that can be reliably installed in a narrow space and meet external installation conditions. Summary of the invention

[0003] In view of this, an embodiment of the present application provides a vertical electronic device to solve the technical problem in the prior art that there is a lack of vertical electronic devices that can be reliably installed in the narrow and high space inside an aircraft or a missile body and meet external installation conditions.

[0004] The embodiment of the present application provides the following technical solution: a vertical electronic device, comprising:

[0005] A first frame, wherein the height of the first frame is at least 5 times greater than the width thereof; the first frame comprises an interface board and a processing board, wherein the interface board and the processing board are fixedly connected to the first frame via a pad column or an integrated frame; and the normal direction of the interface board and the processing board is the same as the width direction of the first frame;

[0006] A second frame, wherein the height dimension of the second frame is at least 5 times of its width dimension; the second frame comprises a power board and a functional connector, wherein the power board and the functional connector are installed inside the second frame; the first frame and the second frame are fixedly connected in cooperation, and the normal direction of the power board is the same as the width direction of the second frame.

[0007] According to an embodiment of the present application, the first frame also includes a first external interface, a second external interface and a third external interface, and the first external interface, the second external interface and the third external interface are respectively mechanically connected to the interface board through fasteners and electrically connected through wires.

[0008] According to an embodiment of the present application, the bottom of the first frame body and the bottom of the second frame body are respectively provided with a connection plane extending outward, and a fixing point is provided on the connection plane for connecting with an external device through the fixing point.

[0009] According to an embodiment of the present application, a vibration reduction device is provided on the connection plane.

[0010] According to an embodiment of the present application, a concave groove is provided at the joint surface of the first frame body and the second frame body, and a soft material or a soft conductive material is installed in the concave groove for waterproofing, dustproofing and electromagnetic shielding.

[0011] According to an embodiment of the present application, both the first frame and the second frame are made of lightweight conductive material.

[0012] According to an embodiment of the present application, the first frame body and the second frame body are both made of high thermal conductivity materials.

[0013] According to an embodiment of the present application, heat dissipation bosses are provided on both the first frame body and the second frame body for dissipating heat from the electronic device.

[0014] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification include at least the following: the embodiments of the present invention can improve the assembly density of electronic equipment by providing a vertical electronic device, and significantly improve the narrow and high space utilization rate in the aircraft or missile body. In addition, the vibration resistance of electronic equipment can be improved, the application range of electronic equipment can be significantly improved, and the vibration resistance of aircraft or missiles can be significantly improved. In addition, the present invention can also improve the heat dissipation performance of electronic equipment, which can significantly increase the temperature application range of electronic equipment, thereby improving the reliability of aircraft or missiles. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is an overall structural diagram of a vertical electronic device provided by an embodiment of the present invention;

[0017] Figure 2 It is a first internal structure diagram of a vertical electronic device provided by an embodiment of the present invention;

[0018] Figure 3 is a second internal structure diagram of a vertical electronic device provided by an embodiment of the present invention;

[0019] Figure 4 is a schematic diagram of a first frame structure provided by an embodiment of the present invention;

[0020] Among them: 1. first frame; 2. second frame; 3. interface board; 4. processing board; 5. power board; 6. first external interface; 7. second external interface; 8. third external interface; 9. soft conductive / waterproof strip. DETAILED DESCRIPTION

[0021] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0022] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0023] like Figure 1-Figure 4 As shown, a vertical electronic device provided by an embodiment of the present invention includes: a first frame 1, wherein the height dimension of the first frame 1 is at least 5 times of its width dimension; the first frame 1 includes an interface board 3, a processing board 4, a first external interface 6, a second external interface 7 and a third external interface 8, wherein the interface board 3 and the processing board 4 are fixedly connected via a connector, and the interface board 3 and the processing board 4 are fixedly connected to the first frame 1 via a plurality of pads or an integrated frame, and the normal direction of the interface board 3 and the processing board 4 is the same as the width direction of the first frame 1; the first external interface 6, the second external interface 7 and the third external interface 8 are mechanically connected to the interface board 3 via fasteners, and are electrically connected via wires;

[0024] The second frame 2 has a height dimension at least 5 times greater than a width dimension thereof; it includes a power board 5 and a functional connection device, and both the functional connection device and the power board 5 are installed inside the second frame 2.

[0025] The first frame 1 and the second frame 2 are fixedly connected, and the normal direction of the power board 5 is the same as the width direction of the second frame 2. A concave groove is provided at the joint surface of the first frame 1 and the second frame 2, and a soft material or a soft conductive material is installed in the concave groove, and a soft conductive / waterproof strip 9 is added to achieve waterproof, dustproof and electromagnetic leakage prevention functions.

[0026] Furthermore, the bottom of the first frame 1 and the bottom of the second frame 2 are respectively provided with a connection plane extending outward, and a fixing point is provided on the connection plane for connecting with an external device through the fixing point. The connection planes at the bottom of the first frame 1 and the second frame 2 each include two vibration reduction function devices to achieve vibration reduction for the electronic device.

[0027] Furthermore, the first frame body 1 or the second frame body 2 comprises an external debugging cover, and the debugging cover can realize a non-falling function.

[0028] Furthermore, the first frame 1 and the second frame 2 are both made of light conductive materials. The first frame 1 and the second frame 2 are both made of high thermal conductivity materials.

[0029] Furthermore, the first frame 1 and the second frame 2 include heat dissipation bosses, on which soft interface materials can be installed to transfer heat from processing boards, interface boards, power boards, etc. to the first frame and the second frame, thereby achieving heat dissipation for the electronic equipment.

[0030] An embodiment of the present invention provides a vertical electronic device, which is suitable for a limited and narrow and high space inside an aircraft or a missile. When the installation space is a narrow and high space, a vertical electronic device is installed through the bottom to form an integral structure. The embodiment of the present invention can be fixed through any plane or curved surface and a substrate, and has good fixing characteristics. In addition, the embodiment of the present invention can improve the assembly density of electronic equipment and can significantly improve the utilization rate of the narrow and high space inside an aircraft or a missile. Moreover, the vibration resistance of electronic equipment can be improved, the application range of electronic equipment can be significantly improved, and the vibration resistance of aircraft or missiles can be significantly improved. At the same time, the embodiment of the present invention can improve the heat dissipation performance of electronic equipment, significantly improve the temperature application range of electronic equipment, and thereby improve the reliability of aircraft or missiles.

[0031] Specifically, the exterior of a vertical electronic device provided in this embodiment includes two frame structures, a first frame 1 and a second frame 2. The frame material is a lightweight conductive material or a composite conductive material. The frame has high strength and rigidity through integral processing or special processing. The two frames contain a concave-convex structure to prevent electromagnetic leakage, forming an electromagnetic shielding box to ensure electromagnetic shielding performance, and having good grounding performance to ensure electrical safety. Through the fixed connection between the first frame 1 and the second frame 2, the exterior of the vertical electronic device has the ability to resist harsh atmospheric environments such as humidity, heat, salt spray, mold, and water vapor, and has good applicability in all-weather environments. The exterior is flat or smooth, with good ergonomic features.

[0032] Furthermore, the vertical electronic device includes internal boards such as an interface board 3, a processing board 4, and a power board 5, which can complete specific electronic device functions. The internal boards are connected by a flexible or rigid connection device, which can not only realize the error-proof function of blind plugging and blind unplugging, but also realize electrical connection over a long distance, so that it meets the accuracy requirements of electrical connection.

[0033] The embodiments of the present invention achieve the following technical effects:

[0034] 1. The present invention can improve the assembly density of electronic equipment and significantly enhance the utilization rate of narrow and high spaces in aircraft or missile bodies.

[0035] 2. The present invention can improve the vibration resistance of electronic equipment, can significantly increase the application scope of electronic equipment, and can significantly improve the vibration resistance of aircraft or missiles.

[0036] 3. The present invention can improve the heat dissipation performance of electronic equipment, can significantly increase the temperature application range of electronic equipment, and can improve the reliability of aircraft or missiles.

[0037] 4. The present invention can improve the electronic equipment's ability to resist adverse environments, has the ability to resist vibration and impact, and can ensure the all-weather use of the electronic equipment.

[0038] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A vertical electronic device, characterized in that: include: A first frame (1), wherein the height of the first frame (1) is at least five times greater than its width; the first frame (1) comprises an interface board (3) and a processing board (4), wherein the interface board (3) and the processing board (4) are fixedly connected to the first frame (1) via a pad column or an integrated frame; and the normal direction of the interface board (3) and the processing board (4) is the same as the width direction of the first frame (1); A second frame (2), wherein the height of the second frame (2) is at least five times greater than its width; the second frame (2) comprises a power board (5) and a functional connector, wherein the power board (5) and the functional connector are installed inside the second frame (2); the first frame (1) and the second frame (2) are fixedly connected in cooperation, and the normal direction of the power board (5) is the same as the width direction of the second frame (2).

2. The vertical electronic device according to claim 1, characterized in that: The first frame (1) further comprises a first external interface (6), a second external interface (7) and a third external interface (8), wherein the first external interface (6), the second external interface (7) and the third external interface (8) are respectively mechanically connected to the interface board (3) via fasteners and electrically connected via wires.

3. The vertical electronic device according to claim 1, characterized in that: The bottom of the first frame (1) and the bottom of the second frame (2) are respectively provided with connection planes extending outwards, and the connection planes are provided with fixing points for connecting with external devices through the fixing points.

4. The vertical electronic device according to claim 3, characterized in that: A vibration reduction device is provided on the connecting plane.

5. The vertical electronic device according to claim 1, characterized in that: A concave groove is provided at the joint surface of the first frame body (1) and the second frame body (2), and a soft material or a soft conductive material is installed in the concave groove for waterproofing, dustproofing and electromagnetic shielding.

6. The vertical electronic device according to claim 1, characterized in that: The first frame (1) and the second frame (2) are both made of lightweight conductive material.

7. The vertical electronic device according to claim 1, characterized in that: The first frame (1) and the second frame (2) are both made of materials with high thermal conductivity.

8. The vertical electronic device according to claim 1, characterized in that: The first frame (1) and the second frame (2) are both provided with heat dissipation bosses for dissipating heat from the electronic equipment.

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