Near space thermal management device and control method

Abstract

This invention discloses a near-space thermal management device and control method, belonging to the field of near-space thermal management. It includes: electronic equipment, a heat-conducting and diffusion structure, a radiation structure, a radiation thin film material, a thermal switch, a phase change module, a resistance wire, a fan, a controller, and a temperature sensor. This invention proposes a highly efficient and controllable thermal management device for near-space floating platforms that integrates radiative cooling / heating, phase change heat absorption / release, air cooling, and electric heating. It addresses both heat dissipation and insulation requirements, solving the thermal management challenges of electronic equipment in the variable environment of near-space.

Description

Technical Field

[0001] This invention relates to the field of near-space thermal management technology, and more specifically, to a near-space thermal management device and control method. Background Technology

[0002] Near space, with its altitude of 20km, relatively low wind speed, and stable wind direction, is suitable for large aerostated platforms to remain stationary and fly at fixed points for extended periods. These aerostated platforms have an observation radius of up to 500km for ground targets, providing a significant supplement and enhancement to satellites and aircraft in both time and space. Given the unique characteristics of the stratosphere environment—characterized by "three lows and one high" (low temperature -56℃, low pressure 5500Pa, and low density 0.089kg / m³)—further advantages are provided. 3 High radiation 1260W / m 2 The characteristics of this device, which lead to overheating and overcooling issues, directly affect the safety and reliability of electronic devices. As the power consumption of the device increases, the thermal management problem of this platform becomes increasingly prominent.

[0003] Currently, among the publicly available technologies, research on thermal management techniques for near-space is limited, and most studies primarily focus on air cooling and traditional radiative heat dissipation. These methods are characterized by focusing solely on heat dissipation without achieving insulation, passive cooling, and poor heat dissipation efficiency, falling short of actual needs. For example, invention patent CN101730436A proposes a convective-radiative heat dissipation system for temperature control of electronic equipment in near-space vehicles. This system dissipates heat from near-space electronic equipment through radiation, but suffers from weak heat dissipation performance control and lacks insulation measures. Similarly, invention patent CN101730437A proposes a heat dissipation system for near-space electronic equipment, which ultimately removes heat loss through a combination of fans and heat sinks, exhibiting similar shortcomings to the previous patent application. Therefore, it is necessary to conduct research on controllable thermal management solutions suitable for near-space that possess both heat dissipation and insulation functions. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a near-space thermal management device and control method, which can solve the problem of thermal management of electronic equipment in the variable environment of near space.

[0005] The objective of this invention is achieved through the following approach:

[0006] A near-space thermal management device, characterized in that it comprises:

[0007] Electronic equipment, heat-conducting and diffusion structures, radiation structures, radiation thin film materials, thermal switches, phase change modules, resistance wires, fans, controllers and temperature sensors;

[0008] Electronic devices are primarily functional devices and require a complete thermal management system to provide heat dissipation or insulation functions as needed.

[0009] Thermally conductive diffusion structures are used to transfer heat between electronic devices and radiating structures;

[0010] A radiation heat exchange unit is composed of a radiation structure and a radiation thin film material. The radiation structure is used to expand the radiation heat exchange area, and the radiation thin film material is used to regulate the radiation characteristics of the radiation heat exchange surface.

[0011] Thermal switches are used to control whether phase change modules, fans, and resistance wires are involved in the thermal management process.

[0012] Phase change modules are used to absorb or release heat, and adaptively switch between heat absorption and release working states according to the needs of electronic devices.

[0013] Resistance wire is used to enhance thermal insulation capabilities, compensating for insufficient thermal insulation when radiative heating and phase change exothermic heating cannot meet the insulation requirements.

[0014] Fans are used to enhance heat dissipation capacity, compensating for insufficient heat dissipation capacity when radiative cooling and phase change heat absorption cannot meet the heat dissipation requirements; when the heat dissipation capacity meets the requirements, the fans do not participate in the system operation.

[0015] The controller has input and output functions. The input function is used to collect the status information of the equipment in the device; the output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device.

[0016] Furthermore, the heat-conducting and diffusion structure includes an aluminum plate, a copper plate, a heat pipe, a heat spreader, or a combination thereof.

[0017] Furthermore, the radiation thin film material includes a dynamic radiation thin film material.

[0018] Furthermore, the dynamic radiation thin film material, in the default state without an electrical excitation signal input, has an absorptivity ≤0.1 in the infrared band (0.3-2.5μm) and an emissivity ≥0.9 in the atmospheric transmission band (8-13μm); when an electrical excitation signal is input, the material has an absorptivity ≥0.9 in the infrared band (0.3-2.5μm) and an emissivity ≤0.1 in the atmospheric transmission band (8-13μm).

[0019] Furthermore, the thermal switch specifically comprises a material with controllable thermal conductivity, and the thermal switch has high thermal conductivity and low thermal conductivity characteristics in the on and off states, respectively, with an on / off ratio ≥50.

[0020] Furthermore, the latent heat of phase change of the phase change module is ≥200kJ / kg, and the phase change temperature requirement is close to the optimal operating temperature of electronic device 1 within the range of engineering experience.

[0021] Furthermore, the air-cooling capacity of the fan is dynamically adjusted by regulating the fan speed.

[0022] Furthermore, the device status information includes the heating power and temperature of the electronic device at the next moment.

[0023] Furthermore, the adjustable parameters of the thermal management system include the electrical excitation signal of the radiation thin film material, the thermal switch on / off signal, the fan speed signal, and the resistance wire heating power signal.

[0024] A near-space thermal management method, based on the near-space thermal management device as described in any of the preceding claims, includes the following steps:

[0025] S1. Preset parameters: Based on the actual situation of the electronic device, set the maximum heat dissipation power Q0, the optimal operating temperature T0, and the maximum operating temperature T of the electronic device. max Minimum operating temperature T of electronic equipment min ;

[0026] S2. Obtain system status parameters: Obtain the real-time heat generation power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor;

[0027] S3, Determination of heat dissipation and heat preservation working modes:

[0028] a) If T1≥T0, the thermal management device enters the heat dissipation working mode;

[0029] b) If T1 < T0, the thermal management device enters the heat preservation working mode;

[0030] S4. Determining the specific working mode:

[0031] a) Cooling operation mode:

[0032] 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiative cooling heat dissipation working mode;

[0033] 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and dissipation working mode;

[0034] 3) If a2T max -Q1 / A<T1≤T max The thermal management device enters the working mode of radiation cooling, phase change heat absorption and air cooling. In this working mode, the fan speed is controlled according to the change of T1. When the temperature rises, the fan speed is increased, and when the temperature drops, the fan speed is decreased to maintain the temperature stable within the range.

[0035] b) In heat preservation mode:

[0036] 1) If b1T min When +Q1 / A≤T1<T0, the thermal management device enters the pure radiative heating and insulation working mode.

[0037] 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release insulation working mode;

[0038] 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating, phase change heat release, and electric heating insulation working mode; in this working mode, according to the change of T1, the electric heating power is controlled, the heating power is reduced when the temperature rises, and the heating power is increased when the temperature falls, so as to maintain the temperature stable within the range.

[0039] S5. End the control process of the near-space thermal management device.

[0040] Furthermore, in step S4, a2 > a1, b2 > b1, and a2, a1, b2, b1 ∈ (0, 1).

[0041] Furthermore, in step S4, A is a heat capacity parameter related to the device, which increases with the increase of the device's own heat capacity and is determined according to the actual situation.

[0042] The beneficial effects of this invention include:

[0043] This invention addresses the overheating and overcooling problems faced by electronic equipment on near-space floating platforms. It proposes a highly efficient and controllable thermal management device that integrates radiative cooling / heating, phase change heat absorption / release, air cooling, and electric heating, primarily using passive cooling and secondarily using active cooling. By collecting the temperature of key nodes within the device through a controller, it controls parameters such as the characteristics of radiative cooling materials, thermal switching status, fan speed, and electric heating power, ensuring that heat dissipation or insulation performance matches real-time requirements. This allows the electronic equipment to operate within a suitable temperature range, thereby supporting the long-term stable operation of electronic equipment on near-space floating platforms.

[0044] This invention proposes a highly efficient and controllable thermal management device for near-space floating platforms that integrates radiative cooling / heating, phase change heat absorption / release, air cooling, and electric heating. It addresses both heat dissipation and insulation needs and can solve the thermal management problem of electronic equipment in the variable environment of near space.

[0045] This invention introduces a dynamic radiation thin film material, whose emissivity and absorptivity can be adjusted according to actual heat dissipation or heat preservation requirements, thereby dynamically adjusting the cooling or heating effect.

[0046] This invention introduces a thermal switch to control whether the phase change module, fan, and resistance wire are involved in the thermal management process, and can dynamically match the heat dissipation and heat preservation requirements of electronic equipment in real time according to the needs.

[0047] This invention proposes a control strategy for a thermal management device, which can adjust the device's operating mode according to the device's status to achieve real-time matching of the electronic device's heat dissipation and heat preservation requirements, thereby maintaining the device's operation within a suitable temperature range and possessing strong adjustment and control capabilities. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of a near-space thermal management device according to an embodiment of the present invention;

[0050] Figure 2 This is a flowchart illustrating the control strategy of the near-space thermal management device according to an embodiment of the present invention.

[0051] In the diagram, 1-electronic device, 2-thermal diffusion structure, 3-radiation structure, 4-radiation thin film material, 5-thermal switch, 6-phase change module, 7-resistance wire, 8-fan, 9-controller, 10-temperature sensor. Detailed Implementation

[0052] All features disclosed in all embodiments of this specification, or steps in all methods or processes implied in the disclosure, may be combined and / or extended or replaced in any way, except for mutually exclusive features and / or steps.

[0053] The specific implementation process of this invention is as follows:

[0054] This invention provides a near-space thermal management device, such as... Figure 1 As shown, the device includes electronic equipment 1, a heat-conducting and diffusion structure 2, a radiation structure 3, a radiation thin film material 4, a thermal switch 5, a phase change module 6, a resistance wire 7, a fan 8, a controller 9, and a temperature sensor 10.

[0055] Among them, electronic device 1 is the main functional device, which requires a complete set of thermal management devices to provide heat dissipation or heat preservation functions as needed.

[0056] Among them, the heat-conducting and diffusion structure 2 plays the role of transferring heat between electronic devices and radiation structures, and can be one of a variety of efficient heat conduction structures such as aluminum plate, copper plate, heat pipe, heat spreader, or a combination of the above.

[0057] Among them, the radiation structure 3 and the radiation thin film material 4 constitute the radiation heat exchange unit. The radiation structure 3 plays the role of expanding the radiation heat exchange area, while the radiation thin film material 4 plays the role of regulating the radiation characteristics of the radiation heat exchange surface.

[0058] Among them, the radiation thin film material 4 is a dynamic radiation thin film material (electrochromic), meaning that the absorptivity and emissivity of this material change when the electrical excitation signal input is changed. Specifically, in the default state without an electrical excitation signal input, the absorptivity of this material is ≤0.1 in the infrared band (0.3-2.5μm) and the emissivity is ≥0.9 in the atmospheric transmission band (8-13μm); when an electrical excitation signal is input, the absorptivity of this material is ≥0.9 in the infrared band (0.3-2.5μm) and the emissivity is ≤0.1 in the atmospheric transmission band (8-13μm).

[0059] The function of the thermal switch 5 is to control whether the phase change module 6, the fan 8 and the resistance wire 7 are involved in the thermal management process. It is a special material with controllable thermal conductivity. The thermal switch has high thermal conductivity and low thermal conductivity in the on and off states, respectively, and the on / off ratio is ≥50.

[0060] The phase change module 6 functions as both heat absorption and release, and can adaptively switch between heat absorption and release modes according to the needs of the electronic equipment. Its latent heat of phase change is ≥200kJ / kg, and the phase change temperature requirement is close to the optimal operating temperature of the electronic equipment 1.

[0061] Among them, the function of resistance wire 7 is to enhance the heat preservation capacity, mainly to make up for the lack of heat preservation capacity when radiative heating and phase change heat release cannot meet the heat preservation requirements.

[0062] The function of fan 8 is to enhance heat dissipation capacity, primarily to compensate for insufficient heat dissipation when radiative cooling and phase change heat absorption cannot meet the heat dissipation requirements. The air-cooling capacity can be dynamically adjusted by regulating the fan speed. Furthermore, when the heat dissipation capacity meets the requirements, the fan does not participate in system operation.

[0063] The controller 9 has input and output functions. The input function is used to collect the status information of the equipment within the device, including the heating power and temperature of the electronic equipment at the next moment. The output function is used to control the adjustable parameters of the thermal management system, adjust the working mode and performance of the device, including the electrical excitation signal of the radiation thin film material, the thermal switch on / off signal, the fan speed signal, and the resistance wire heating power signal.

[0064] The device includes two operating modes: heat dissipation and heat preservation. Among them:

[0065] The heat dissipation operation mode adjusts the combination of heat dissipation components according to differences in external environment and internal requirements. There are three modes: pure radiative cooling, radiative cooling + phase change heat absorption, and radiative cooling + phase change heat absorption + air cooling, corresponding to low-power, medium-power, and high-power heat dissipation needs, respectively. Switching from pure radiative cooling mode to radiative cooling + phase change heat absorption mode is achieved by controlling the thermal switch from off to on via the controller. Switching from radiative cooling + phase change heat absorption mode to radiative cooling + phase change heat absorption + air cooling mode is achieved by controlling the fan to turn on via the controller.

[0066] The thermal insulation operation mode adjusts the combination of heat dissipation components according to differences in external environment and internal requirements, and can be divided into three modes: pure radiative heating, radiative heating + phase change heat release, and radiative heating + phase change heat release + electric heating. These correspond to low-power, medium-power, and high-power thermal insulation requirements, respectively. Switching from the pure radiative heating mode to the radiative heating + phase change heat release mode is achieved by controlling the thermal switch from off to on via the controller. Switching from the radiative heating + phase change heat release mode to the radiative heating + phase change heat release + electric heating mode is achieved by controlling the heating of the resistance wire via the controller.

[0067] On the other hand, such as Figure 2 As shown, this invention provides a control strategy for a critical space thermal management device, specifically for real-time matching of heat dissipation and insulation requirements of electronic equipment on critical space floating platforms, thereby achieving equipment temperature control requirements. The specific steps of this control strategy are as follows:

[0068] S1. Preset parameters: Based on the actual situation of the electronic device, set the maximum heat dissipation power Q0, the optimal operating temperature T0, and the maximum operating temperature T of the electronic device. max Minimum operating temperature T of electronic equipment min ;

[0069] S2. Obtain system status parameters: Obtain the real-time heat generation power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor;

[0070] S3, Determination of heat dissipation and heat preservation working modes:

[0071] a) If T1≥T0, the thermal management device enters the heat dissipation working mode;

[0072] b) If T1 < T0, the thermal management device enters the heat preservation working mode.

[0073] S4. Determining the specific working mode:

[0074] a) Cooling operation mode:

[0075] 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiative cooling heat dissipation working mode;

[0076] 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and dissipation working mode;

[0077] 3) If a2T max -Q1 / A<T1≤T max The thermal management device enters the working mode of radiation cooling + phase change heat absorption + air cooling. In this working mode, the fan speed is controlled according to the change of T1. That is, when the temperature rises, the fan speed is increased, and when the temperature drops, the fan speed is decreased to maintain the temperature stable within the range.

[0078] b) In heat preservation mode:

[0079] 1) If b1T min When +Q1 / A≤T1<T0, the thermal management device enters the pure radiative heating and insulation working mode.

[0080] 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release insulation working mode;

[0081] 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release + electric heating and heat preservation working mode; in this working mode, the electric heating power is controlled according to the change of T1, that is, when the temperature rises, the heating power is reduced, and when the temperature falls, the heating power is increased, so as to maintain the temperature stable within the range.

[0082] S5. End the control process of the near-space thermal management device.

[0083] In one specific implementation, in step S4, a2 > a1, b2 > b1, and a2, a1, b2, b1 ∈ (0, 1).

[0084] In one specific implementation, in step S4, A is a heat capacity parameter related to the device, which increases with the increase of the device's own heat capacity and needs to be determined according to the actual situation.

[0085] In other embodiments of the present invention, a near-space thermal management device using the present invention is provided, with a structure as follows: Figure 1As shown, its working principle is as follows: During the operation of electronic equipment, heat is generated. In order to keep it working near the optimal operating temperature, the thermal management device needs to adjust the heat dissipation and heat preservation performance in real time according to the heat transfer effect of the external environment.

[0086] In heat dissipation mode:

[0087] a) Pure radiation cooling mode: When the temperature of the electronic device is higher than the optimal operating temperature and T0≤T1≤a1T max When -Q1 / A is applied, the thermal management device enters the pure radiation cooling mode. At this time, the controller does not apply electrical excitation to the radiation thin film material. The radiation thin film material has low absorption rate in the infrared band and high emissivity in the atmospheric transmission band, which reduces the absorption of external radiation heat while increasing the emission to the cosmic background, thus exerting a cooling effect and reducing the temperature of the radiation surface. In turn, it dissipates heat to the electronic equipment through the heat conduction structure.

[0088] b) Radiation cooling + phase change heat dissipation mode: When a1T max -Q1 / A<T1≤a2T max When -Q1 / A is applied, the thermal management device enters the radiation cooling + phase change heat absorption and heat dissipation working mode. At this time, the controller does not apply electrical excitation to the radiation thin film material and adjusts the thermal switch to open. Thus, under the premise of radiation cooling, phase change heat absorption is introduced to absorb the heat generated by the electronic equipment.

[0089] c) Radiation cooling + phase change heat release + air cooling operation mode: When a2T max -Q1 / A<T1≤T max When the thermal management device enters the working mode of radiation cooling + phase change heat absorption + air cooling, the controller does not apply electrical excitation to the radiation thin film material, adjusts the thermal switch to open, and controls the fan to start, so as to cool the phase change module through air cooling and maintain its ability to absorb heat from the electronic equipment.

[0090] In heat dissipation mode:

[0091] a) Pure radiant heating insulation mode: When the temperature of the electronic device is lower than the optimal operating temperature and b1T min When +Q1 / A≤T1<T0, the thermal management device enters the pure radiation heating and heat preservation working mode. At this time, the controller applies electrical excitation to the radiation thin film material. The radiation thin film material has a high absorption rate in the infrared band and a low emissivity in the atmospheric transmission band, which increases the absorption of external radiation heat while reducing the emission to the cosmic background, exerting a heating effect and raising the temperature of the radiation surface. Then, it keeps the electronic equipment warm by heat conduction through the heat-conducting diffusion structure.

[0092] b) Radiative heating + phase change heat release insulation working mode: When b2T min +Q1 / A≤T1<b1Tmin When +Q1 / A is applied, the thermal management device enters the radiation cooling + phase change heat release insulation working mode. At this time, the controller applies electrical excitation to the radiation thin film material and adjusts the thermal switch to open, thereby introducing phase change heat release to generate insulation for the electronic equipment under the premise of radiation heating.

[0093] c) Radiative heating + phase change heat release + electric heating and insulation working mode: When T min ≤T1<b1T min When +Q1 / A is applied, the thermal management device enters the radiation heating + phase change heat release + electric heating insulation working mode. At this time, the controller applies electrical excitation to the radiation thin film material, adjusts the thermal switch to open, and adjusts the electric heating power. The phase change module is heated by electric heating to maintain its ability to keep the electronic equipment warm.

[0094] It should be noted that, within the scope of protection defined in the claims of this invention, the following embodiments can be combined and / or extended or replaced in any logical manner from the above specific embodiments, such as the disclosed technical principles, disclosed technical features or implicitly disclosed technical features.

[0095] Example 1

[0096] A near-space thermal management device, comprising:

[0097] Electronic equipment 1. Thermal diffusion structure 2. Radiation structure 3. Radiation thin film material 4. Thermal switch 5. Phase change module 6. Resistance wire 7. Fan 8. Controller 9. Temperature sensor 10.

[0098] Electronic device 1 is a main functional device that requires a complete thermal management system to provide heat dissipation or heat preservation functions as needed.

[0099] The heat-conducting diffusion structure 2 is used to transfer heat between electronic devices and radiating structures;

[0100] The radiation structure 3 and the radiation thin film material 4 form a radiation heat exchange unit. The radiation structure 3 is used to expand the radiation heat exchange area, and the radiation thin film material 4 is used to regulate the radiation characteristics of the radiation heat exchange surface.

[0101] The thermal switch 5 is used to control whether the phase change module 6, the fan 8, and the resistance wire 7 are involved in the thermal management process.

[0102] Phase change module 6 is used for heat absorption or release, and adaptively switches between heat absorption and release working states according to the needs of electronic equipment.

[0103] Resistance wire 7 is used to enhance the heat preservation capacity, and to make up for the lack of heat preservation capacity when radiative heating and phase change exothermic heating cannot meet the heat preservation requirements.

[0104] Fans are used to enhance heat dissipation capacity, compensating for insufficient heat dissipation capacity when radiative cooling and phase change heat absorption cannot meet the heat dissipation requirements; when the heat dissipation capacity meets the requirements, the fans do not participate in the system operation.

[0105] The controller 9 has input and output functions. The input function is used to collect the status information of the equipment in the device; the output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device.

[0106] Example 2

[0107] Based on Example 1, the heat-conducting and diffusion structure 2 includes a combination of an aluminum plate, a copper plate, a heat pipe, and a heat spreader.

[0108] Example 3

[0109] Based on Example 1, the radiation thin film material 4 includes a dynamic radiation thin film material.

[0110] Example 4

[0111] Based on Example 3, the dynamic radiation thin film material, in the default state without an electrical excitation signal input, has an absorptivity ≤0.1 in the infrared band (0.3-2.5μm) and an emissivity ≥0.9 in the atmospheric transmission band (8-13μm); when an electrical excitation signal is input, the material has an absorptivity ≥0.9 in the infrared band (0.3-2.5μm) and an emissivity ≤0.1 in the atmospheric transmission band (8-13μm).

[0112] Example 5

[0113] Based on Example 1, the thermal switch 5 specifically includes a material with controllable thermal conductivity. The thermal switch has high thermal conductivity and low thermal conductivity characteristics in the on and off states, respectively, and the on / off ratio is ≥50.

[0114] Example 6

[0115] Based on Example 1, the latent heat of phase change of the phase change module 6 is ≥200kJ / kg, and the phase change temperature requirement is close to the optimal operating temperature of the electronic device 1 within the range of engineering experience.

[0116] Example 7

[0117] Based on Example 1, the air-cooling heat dissipation capacity of the fan is dynamically adjusted by regulating the fan speed.

[0118] Example 8

[0119] Based on Example 1, the device status information includes the heating power of the electronic device and the temperature of the electronic device at the next moment.

[0120] Example 9

[0121] Based on Example 1, the adjustable parameters of the thermal management system include the electrical excitation signal of the radiation thin film material, the thermal switch on / off signal, the fan speed signal, and the resistance wire heating power signal.

[0122] Example 10

[0123] A near-space thermal management method, based on any one of Embodiments 1 to 9, includes the following steps:

[0124] S1. Preset parameters: Based on the actual situation of the electronic device, set the maximum heat dissipation power Q0, the optimal operating temperature T0, and the maximum operating temperature T of the electronic device. max Minimum operating temperature T of electronic equipment min ;

[0125] S2. Obtain system status parameters: Obtain the real-time heat generation power Q1 of the electronic device, and read the real-time temperature T1 of the electronic device through the temperature sensor;

[0126] S3, Determination of heat dissipation and heat preservation working modes:

[0127] a) If T1≥T0, the thermal management device enters the heat dissipation working mode;

[0128] b) If T1 < T0, the thermal management device enters the heat preservation working mode;

[0129] S4. Determining the specific working mode:

[0130] a) Cooling operation mode:

[0131] 1) If T0≤T1≤a1T max -Q1 / A, the thermal management device enters the pure radiative cooling heat dissipation working mode;

[0132] 2) If a1T max -Q1 / A<T1≤a2T max -Q1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and dissipation working mode;

[0133] 3) If a2T max -Q1 / A<T1≤T max The thermal management device enters the working mode of radiation cooling, phase change heat absorption and air cooling. In this working mode, the fan speed is controlled according to the change of T1. When the temperature rises, the fan speed is increased, and when the temperature drops, the fan speed is decreased to maintain the temperature stable within the range.

[0134] b) In heat preservation mode:

[0135] 1) If b1T minWhen +Q1 / A≤T1<T0, the thermal management device enters the pure radiative heating and insulation working mode.

[0136] 2) If b2T min +Q1 / A≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating + phase change heat release insulation working mode;

[0137] 3) If T min ≤T1<b1T min +Q1 / A, the thermal management device enters the radiation heating, phase change heat release, and electric heating insulation working mode; in this working mode, according to the change of T1, the electric heating power is controlled, the heating power is reduced when the temperature rises, and the heating power is increased when the temperature falls, so as to maintain the temperature stable within the range.

[0138] S5. End the control process of the near-space thermal management device.

[0139] Based on Example 10, in step S4, a2 > a1, b2 > b1, and a2, a1, b2, b1 ∈ (0, 1).

[0140] Based on Example 10, in step S4, A is a heat capacity parameter related to the device, which increases with the increase of the device's own heat capacity and is determined according to the actual situation.

[0141] The units described in the embodiments of the present invention can be implemented in software or hardware, and the described units can also be located in a processor. The names of these units do not necessarily limit the specific unit itself.

[0142] According to one aspect of the present invention, a computer program product or computer program is provided, the computer program product or computer program including computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and executes the computer instructions, causing the computer device to perform the methods provided in the various optional implementations described above.

[0143] In another aspect, embodiments of the present invention also provide a computer-readable medium, which may be included in the electronic device described in the above embodiments; or it may exist independently and not assembled into the electronic device. The computer-readable medium carries one or more programs, which, when executed by the electronic device, cause the electronic device to perform the methods described in the above embodiments.

Claims

1. A near-space thermal management device, characterized in that, include: Electronic equipment, heat-conducting and diffusion structures, radiation structures, radiation thin film materials, thermal switches, phase change modules, resistance wires, fans, controllers and temperature sensors; Electronic devices are primarily functional devices and require a complete thermal management system to provide heat dissipation or insulation functions as needed. Thermally conductive diffusion structures are used to transfer heat between electronic devices and radiating structures; A radiation heat exchange unit is composed of a radiation structure and a radiation thin film material. The radiation structure is used to expand the radiation heat exchange area, and the radiation thin film material is used to regulate the radiation characteristics of the radiation heat exchange surface. Thermal switches are used to control whether phase change modules, fans, and resistance wires are involved in the thermal management process. Phase change modules are used to absorb or release heat, and adaptively switch between heat absorption and release working states according to the needs of electronic devices. Resistance wire is used to enhance thermal insulation capabilities, compensating for insufficient thermal insulation when radiative heating and phase change exothermic heating cannot meet the insulation requirements. Fans are used to enhance heat dissipation capacity, compensating for insufficient heat dissipation capacity when radiative cooling and phase change heat absorption cannot meet the heat dissipation requirements; when the heat dissipation capacity meets the requirements, the fans do not participate in the system operation. The controller has input and output functions. The input function is used to collect the status information of the equipment in the device; the output function is used to control the adjustable parameters of the thermal management system and adjust the working mode and performance of the device.

2. The near-space thermal management device according to claim 1, characterized in that, The heat-conducting and diffusion structure includes an aluminum plate, a copper plate, a heat pipe, a heat spreader, or a combination thereof.

3. The near-space thermal management device according to claim 1, characterized in that, The radiation thin film material includes dynamic radiation thin film material.

4. The near-space thermal management device according to claim 3, characterized in that, The dynamic radiation thin film material, in its default state without an electrical excitation signal input, exhibits an absorptivity ≤0.1 in the infrared band (0.3-2.5 μm) and an emissivity ≥0.9 in the atmospheric transmission band (8-13 μm); when an electrical excitation signal is input, the material exhibits an absorptivity ≥0.9 in the infrared band (0.3-2.5 μm) and an emissivity ≤0.1 in the atmospheric transmission band (8-13 μm).

5. The near-space thermal management device according to claim 1, characterized in that, The thermal switch specifically comprises a material with controllable thermal conductivity. The thermal switch has high thermal conductivity and low thermal conductivity characteristics in the on and off states, respectively, and the on / off ratio is ≥50.

6. The near-space thermal management device according to claim 1, characterized in that, The latent heat of phase change of the phase change module is ≥200kJ / kg, and the phase change temperature requirement is close to the optimal operating temperature of the electronic equipment within the range of engineering experience.

7. The near-space thermal management device according to claim 1, characterized in that, The fan's air-cooling capacity is dynamically adjusted by regulating the fan speed.

8. The near-space thermal management device according to claim 1, characterized in that, The device status information includes the heating power and temperature of the electronic device at the next moment.

9. The near-space thermal management device according to claim 1, characterized in that, The adjustable parameters of the thermal management system include the electrical excitation signal of the radiation thin film material, the thermal switch on / off signal, the fan speed signal, and the resistance wire heating power signal.

10. A near-space thermal management method, characterized in that, The near-space thermal management device based on any one of claims 1 to 9 includes the following steps: S1. Preset parameters: Set the maximum heat dissipation power of the electronic device according to its actual condition. Q 0. Optimal operating temperature of electronic equipment T 0. Maximum operating temperature of electronic equipment T max Minimum operating temperature of electronic equipment T min ; S2. Obtain system status parameters: Obtain the real-time heat generation power of electronic devices. Q 1. Read the real-time temperature of electronic devices using temperature sensors. T 1; S3, Determination of heat dissipation and heat preservation working modes: a) If T 1≥ T 0. The thermal management device enters the heat dissipation working mode; b) If T 1 < T 0. The thermal management device enters the heat preservation mode; S4. Determining the specific working mode: a) Cooling operation mode: 1) If T 0≤ T 1≤a1 T max - Q 1 / A, the thermal management device enters the pure radiative cooling heat dissipation working mode; 2) If a1 T max - Q 1 / A < T 1≤a2 T max - Q 1 / A, the thermal management device enters the radiation cooling + phase change heat absorption and dissipation working mode; 3) If a2 T max - Q 1 / A < T 1≤ T max The thermal management device enters a radiative cooling, phase change heat absorption, and air cooling operation mode; in this operation mode, according to T 1. In response to temperature changes, control the fan speed. When the temperature rises, increase the fan speed; when the temperature falls, decrease the fan speed to maintain a stable temperature within the specified range. b) In heat preservation mode: 1) If b1 T min + Q 1 / A≤ T 1 < T 0. The thermal management device enters the pure radiative heating and insulation working mode; 2) If b2 T min + Q 1 / A≤ T 1 < b1 T min + Q 1 / A, the thermal management device enters the radiation heating + phase change heat release insulation working mode; 3) If T min ≤ T 1 < b1 T min + Q 1 / A, the thermal management device enters the radiation heating, phase change heat release and electric heating heat preservation working mode; in this working mode, according to the change of T1, the electric heating power is controlled, the heating power is reduced when the temperature rises, and the heating power is increased when the temperature falls, so as to maintain the temperature stable within the range. Where a2 > a1, b2 > b1, and a2, a1, b2, b1 ∈ (0, 0, 1). ， 1]; A is a heat capacity parameter related to the device, which increases with the increase of the device's own heat capacity and is determined according to the actual situation; S5. End the control process of the near-space thermal management device.

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