Silicon controlled rectifier module with high heat dissipation performance and working method thereof

Abstract

The invention belongs to the technical field of printed circuits, and particularly relates to a silicon controlled rectifier module with high heat dissipation performance and a working method thereof, and the silicon controlled rectifier module with high heat dissipation performance comprises a silicon controlled rectifier array unit which comprises a plurality of silicon controlled rectifier device groups; wherein each silicon controlled device group comprises nine silicon controlled devices which are arranged in a matrix, and an axis ring, an inner ring and an outer ring are formed; the plurality of water cooling head units are respectively attached to the corresponding silicon controlled device groups, and each water cooling head unit comprises an upper chamber, a lower chamber, a jet nozzle and a trigger block group; according to the silicon controlled rectifier module with the high heat dissipation performance and the working method thereof, the jetting speed of the jet flow nozzle is changed through the trigger block group, so that the jet flow nozzle can clean bubbles and floccules in corresponding areas of the inner ring and the outer ring in the lower cavity, and the heat dissipation effect is improved; meanwhile, in order to enable the cleaning effect of the outer ring to be close to that of the inner ring, rotation is reduced when the jet nozzle faces the silicon controlled rectifier device of the outer ring through cooperation of the trigger block set, and the cleaning time is prolonged.

Description

Technical Field

[0001] The present invention belongs to the technical field related to the housing or structural parts of electrical equipment, and specifically relates to improvements that facilitate cooling, ventilation or heating, and more particularly to a thyristor module with high heat dissipation performance and a working method thereof. Background Art

[0002] A thyristor array is a circuit structure formed by combining multiple thyristor devices in a certain way. In scenarios where ultra-high power loads need to be controlled, such as speed regulation of large industrial motors, high-voltage direct current transmission systems, and large power conversion devices, the current and voltage handling capabilities of a single thyristor are often difficult to meet the requirements. By combining multiple thyristors into an array, higher power handling capabilities can be achieved, and they can jointly bear large currents and high voltages, thereby effectively controlling high-power loads.

[0003] In the related art, liquid cooling is generally used to dissipate heat from thyristor modules; however, when controlling ultra-large power loads, the heat generated by a single thyristor chip can reach up to 125 degrees. During the liquid cooling process, the temperature of the water coolant rises, and the air originally dissolved in the water may form bubbles at the contact point between the water cooling head and the chip, thereby affecting the heat dissipation effect. Even some additives or corrosion inhibitors in the water cooling liquid may oxidize and decompose at high temperatures to form flocs that adhere to the contact point between the water cooling head and the chip.

[0004] Therefore, how to solve the technical problem that when liquid cooling is used, the position where the water cooling head contacts the chip will produce bubbles and flocs due to high temperature, which will affect the heat dissipation effect is urgently needed to be solved by technical personnel in this field.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a thyristor module with high heat dissipation performance and a working method thereof.

[0007] In a first aspect, an embodiment of the present disclosure provides a thyristor module with high heat dissipation performance, comprising: a thyristor array unit, comprising: a plurality of thyristor device groups; wherein each of the thyristor device groups comprises: nine thyristor devices arranged in a matrix, and forming an axial ring, an inner ring and an outer ring; a plurality of water-cooled head units, which are respectively fitted with the corresponding thyristor device groups, and comprise: an upper chamber, a lower chamber, a jet nozzle and a trigger block group; wherein the jet nozzle is rotatably arranged between the upper chamber and the lower chamber to introduce the cooling medium in the upper chamber into the lower chamber; the jet nozzle is configured to clean the area corresponding to the inner ring on the lower chamber during rotation; and the jet nozzle is also configured to change the injection speed through the extrusion of the trigger block group during rotation to clean the area corresponding to the outer ring on the lower chamber.

[0008] In an optional embodiment, the inlet end of the jet nozzle is located in the upper chamber, and the first outlet end is located in the lower chamber; wherein an impeller is provided at the inlet end, and the impeller is configured to drive the first outlet end of the jet nozzle to revolve by flushing the medium in the water-cooling tube.

[0009] In an optional embodiment, the inclination angle of the first outlet end is adapted to the inner ring, and the first outlet end is configured to clean the area corresponding to the inner ring on the lower chamber during revolution; and a lower pressure plate is rotatably provided on the end side wall of the first outlet end, and a coil spring is provided on the hinged part of the lower pressure plate. The first outlet end is also configured to change the injection speed by squeezing the lower pressure plate by the trigger block group during revolution, so as to clean the area corresponding to the outer ring on the lower chamber.

[0010] In an optional embodiment, the trigger block group includes: a plurality of trigger blocks, the trigger block includes: an installation chamber, a lifting block and a first return spring; wherein the stiffness of the first return spring is greater than the stiffness of the coil spring; the lifting block is slidably arranged in the installation chamber, the first return spring is located in the installation chamber, and the two ends are respectively abutted against the installation chamber and the lifting block to make the lifting block protrude from the installation chamber; the first outlet end is configured to change the injection speed of the first outlet end by the extrusion of the lifting block during revolution.

[0011] In an optional embodiment, the lifting blocks in each of the trigger blocks have the same length so as to clean the area corresponding to the outer ring of the lower chamber.

[0012] In an optional embodiment, a valve plate is provided in the water-cooling tube, one end of the valve plate extends into the pressure chamber, and the other end is connected to the second return spring; the valve plate is configured to adjust the extension length according to the air pressure in the pressure chamber, that is, the flow rate of the medium in the water-cooling tube is adjusted by the extension length of the valve plate to change the revolution speed of the first outlet end.

[0013] In an optional embodiment, each of the installation chambers is connected to the pressure chamber through an air duct; a protrusion is provided on the rotating side of the first outlet end; the protrusion is configured to pressurize the installation chamber by squeezing the lifting block during the rotation of the first outlet end, that is, to increase the air pressure in the pressure chamber to make the valve plate retreat, thereby reducing the orbital speed of the first outlet end by reducing the flow rate of the medium in the water-cooling tube.

[0014] In an optional embodiment, the jet nozzle further includes: a second outlet end located in the lower chamber; the second outlet end cleans the area corresponding to the upper shaft ring of the lower chamber.

[0015] In a second aspect, the embodiments of the present disclosure also provide a working method of a thyristor module with high heat dissipation performance, which includes: flushing the impeller with the medium in the water-cooling tube to rotate the jet nozzle; through the rotation of the jet nozzle, the first outlet end cooperates with the trigger block group to clean the areas corresponding to each thyristor device on the lower chamber.

[0016] In an optional embodiment, the method of using the rotation of the jet nozzle to enable the first outlet end to clean the area corresponding to each thyristor device on the lower chamber includes: cleaning the area corresponding to the inner circle on the lower chamber through the first outlet end in an unpressurized state; changing the injection speed of the first outlet end through the extrusion of the trigger block group so that the first outlet end cleans the area corresponding to the outer circle on the lower chamber.

[0017] The beneficial effect of the present invention is that the thyristor module with high heat dissipation performance and its working method change the injection speed of the jet nozzle through the trigger block group, so that the jet nozzle can clean the bubbles and flocs in the areas corresponding to the inner ring and the outer ring in the lower chamber, thereby improving the heat dissipation effect; at the same time, in order to make the outer ring have a cleaning effect close to that of the inner ring, the trigger block group is used to reduce the rotation of the jet nozzle when it is facing the thyristor device of the outer ring, thereby increasing the cleaning time.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of the structure of a thyristor array unit provided in an embodiment of the present disclosure; Figure 2 A schematic diagram of the structure of a water cooling head unit provided in an embodiment of the present disclosure; Figure 3 A schematic diagram of the structure of a jet nozzle provided in an embodiment of the present disclosure; Figure 4 A schematic diagram of the structure of a lower pressing plate provided in an embodiment of the present disclosure; Figure 5 A schematic diagram of the structure of a trigger block provided in an embodiment of the present disclosure; Figure 6 A schematic diagram of the structure of a water cooling tube provided in an embodiment of the present disclosure.

[0022] In the figure: 1. thyristor array unit; 10. thyristor device group; 11. thyristor device; 111. axis ring; 112. inner ring; 113. outer ring; 2. Water cooling head unit; 21. Upper chamber; 22. Lower chamber; 23. Jet nozzle; 231. Inlet end; 232. First outlet end; 233. Impeller; 234. Lower pressure plate; 235. Coil spring; 236. Bump; 2237. Second outlet end; 4. Trigger block group; 240. Trigger block; 241. Mounting chamber; 242. Lifting block; 243. First return spring; 244. Airway; 3. Water cooling pipe; 31. Valve plate; 32. Pressure chamber; 33. Second return spring. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, in the drawings, the thickness of the components may be exaggerated or reduced in order to effectively describe the technical content.

[0025] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0026] like Figure 1 , Figure 2 As shown, at least one embodiment provides a thyristor module with high heat dissipation performance, including: a thyristor array unit 1 and a plurality of water cooling head units 2, each water cooling head unit 2 dissipates heat for a corresponding thyristor device group 10 in the thyristor array unit 1.

[0027] like Figure 1 As shown, in some embodiments, the thyristor array unit 1 includes: a plurality of thyristor device groups 10, each thyristor device group 10 includes nine thyristor devices 11 arranged in a matrix, and the nine thyristor devices 11 form an axial ring 111, an inner ring 112 and an outer ring 113.

[0028] like Figure 2 As shown, in some embodiments, each thyristor device group 10 corresponds to a water cooling head unit 2, and the water cooling head unit 2 includes: an upper chamber 21, a lower chamber 22, a jet nozzle 23 and a trigger block group 24, and the outer surface of the lower chamber 22 is in contact with all the thyristor devices 11 in the thyristor device group 10 to dissipate heat.

[0029] Specifically, the jet nozzle 23 is rotatably arranged, with one end located in the upper chamber 21 and the other end located in the lower chamber 22 , so as to guide the cooling medium in the upper chamber 21 into the lower chamber 22 , thereby dissipating the heat of the thyristor device 11 .

[0030] In this embodiment, in order to clean the bubbles and flocs attached to the corresponding areas of each thyristor device 11 in the lower chamber 22, the jet nozzle 23 is set toward the area where the inner ring 112 is located, so that during the rotation of the jet nozzle 23, the sprayed cooling medium can impact the area corresponding to the inner ring 112 on the lower chamber 22; at the same time, during the rotation of the jet nozzle 23, the cross-sectional area of ​​the outlet of the jet nozzle 23 is changed by the pressurization of the trigger block group 24, thereby increasing the flow rate of the medium sprayed from the jet nozzle 23, so that the medium can clean the area corresponding to the outer ring 113 on the lower chamber 22.

[0031] like Figure 3As shown, in some embodiments, the inlet end 231 of the jet nozzle 23 is located in the upper chamber 21, and the first outlet end 232 of the jet nozzle 23 is located in the lower chamber 22. The cooling medium enters from the inlet end 231 and is ejected from the first outlet end 232. In order to make the jet nozzle 23 rotate, an impeller 233 is arranged at the inlet end 231, so that the impeller 233 rotates when being flushed by the medium in the water-cooling tube 3, thereby driving the first outlet end 232 to revolve.

[0032] like Figure 4 As shown, in some embodiments, in order to clean the area corresponding to the inner ring 112 on the lower chamber 22, the inclination angle of the first outlet end 232 is set toward the area where the inner ring 112 is located; in order to clean the area corresponding to the outer ring 113 on the lower chamber 22, the end side wall of the first outlet end 232 is set as a rotatable lower pressure plate 234, and the hinged part of the lower pressure plate 234 is provided with a coil spring 235, so that when the first outlet end 232 revolves, the lower pressure plate 234 can be rotated by squeezing the trigger block group 24, thereby changing the injection speed of the first outlet end 232.

[0033] like Figure 5 As shown, in some embodiments, the trigger block group 24 includes: a plurality of trigger blocks 240 , and the trigger block 240 includes: a mounting chamber 241 , a lifting block 242 and a first return spring 243 .

[0034] Specifically, the lifting block 242 is slidably disposed in the installation chamber 241 , the first return spring 243 is located in the installation chamber 241 , and two ends thereof respectively abut against the installation chamber 241 and the lifting block 242 to make the lifting block 242 protrude from the installation chamber 241 .

[0035] In this embodiment, the stiffness of the first return spring 243 is greater than the stiffness of the coil spring 235, so that when the lifting block 242 presses the lower pressing plate 234, only the lower pressing plate 234 rotates, and the lifting block 242 does not rise or fall.

[0036] In some embodiments, the lifting blocks 242 in each trigger block 240 have the same length so as to clean the area corresponding to the outer ring 113 on the lower chamber 22 .

[0037] In this embodiment, by setting the lengths of the lifting blocks 242 to be the same, the rotation angles of the lower pressing plate 234 can be kept consistent, so that the medium can be sprayed at the same distance under the premise of the same flow rate.

[0038] like Figure 6As shown, in some embodiments, a valve plate 31 is provided in the water-cooling tube 3, one end of the valve plate 31 extends into the pressure chamber 32, and the other end is connected to the second return spring 33; the valve plate 31 is configured to adjust the extension length according to the air pressure in the pressure chamber 32, that is, the flow rate of the medium in the water-cooling tube 3 is adjusted by the extension length of the valve plate 31 to change the revolution speed of the first outlet port 232.

[0039] In this embodiment, the valve plate 31 is used to open and close the water cooling pipe 3 , and the flow rate of the medium is changed by changing the cross-sectional area in the water cooling pipe 3 , thereby adjusting the rotation speed of the impeller 233 .

[0040] like Figure 5 , Figure 6 As shown, in some embodiments, each installation chamber 241 is connected to the pressure chamber 32 through an air duct 244; a protrusion 236 is provided on the rotating side of the first outlet end 232; the protrusion 236 is configured to pressurize the installation chamber 241 by squeezing the lifting block 242 during the rotation of the first outlet end 232, that is, to increase the air pressure in the pressure chamber 32 to make the valve plate 31 retreat, thereby reducing the orbital speed of the first outlet end 232 by reducing the flow rate of the medium in the water-cooling tube 3.

[0041] In this embodiment, when the protrusion 236 squeezes the lifting block 242, the lifting block 242 retreats and squeezes the installation chamber 241. Since the installation chamber 241 is connected to the pressure chamber 32 through the air channel 244, the air pressure in the pressure chamber 32 increases, thereby pushing the valve plate 31 backward to increase the cross-sectional area in the water-cooling pipe 3. At this time, the flow rate of the medium will decrease, thereby reducing the rotation speed of the first outlet port 232.

[0042] In some embodiments, since the thyristor device 11 in the outer ring 113 is farther away from the first outlet end 232, the impact force received by the area where the outer ring 113 is located is smaller than that of the inner ring 112; therefore, the protrusion 236 is set on the rotating side of the first outlet end 232, so that the first outlet end 232 is decelerated in advance before it rotates to the thyristor device 11 in the outer ring 113, thereby increasing the cleaning time.

[0043] like Figure 3 As shown, in some embodiments, the jet nozzle 23 further includes: a second outlet end 237 located in the lower chamber 22; the second outlet end 237 cleans the area corresponding to the upper shaft ring 111 of the lower chamber 22.

[0044] At least one embodiment also provides a working method of a thyristor module with high heat dissipation performance, which includes: flushing the impeller 233 with the medium in the water-cooling tube 3 to rotate the jet nozzle 23; through the rotation of the jet nozzle 23, the first outlet end 232 cooperates with the trigger block group 24 to clean the area corresponding to each thyristor device 11 on the lower chamber 22.

[0045] In some embodiments, the method of cleaning the area corresponding to each thyristor device 11 on the lower chamber 22 by rotating the jet nozzle 23 so that the first outlet end 232 includes: cleaning the area corresponding to the inner ring 112 on the lower chamber 22 through the first outlet end 232 in an unpressurized state; changing the injection speed of the first outlet end 232 through the extrusion of the trigger block group 24, so that the first outlet end 232 cleans the area corresponding to the outer ring 113 on the lower chamber 22.

[0046] For the specific structure and implementation process of the thyristor module with high heat dissipation performance, please refer to the relevant discussion in the above embodiments, which will not be repeated here.

[0047] In summary, the thyristor module with high heat dissipation performance and its working method change the injection speed of the jet nozzle 23 through the trigger block group 24, so that the jet nozzle 23 can clean the bubbles and flocs in the area corresponding to the inner ring 112 and the outer ring 113 in the lower chamber 22, thereby improving the heat dissipation effect; at the same time, in order to make the outer ring 113 have a cleaning effect close to that of the inner ring 112, the trigger block group 24 is used to reduce the rotation of the jet nozzle 23 when it is facing the thyristor device 11 of the outer ring 113, thereby increasing the cleaning time.

[0048] Herein, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or a third component may be interposed between the first component and the second component.

[0049] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0051] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0052] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0053] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0055] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0056] In the above discussion, unless otherwise stated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0057] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A thyristor module with high heat dissipation performance, characterized in that: include: A thyristor array unit (1) comprises: a plurality of thyristor device groups (10); wherein Each of the thyristor device groups (10) comprises: nine thyristor devices (11) arranged in a matrix, forming an axial center ring (111), an inner ring (112) and an outer ring (113); A plurality of water cooling head units (2) are respectively fitted with corresponding thyristor device groups (10), and comprise: an upper chamber (21), a lower chamber (22), a jet nozzle (23) and a trigger block group (24); wherein The jet nozzle (23) is rotatably disposed between the upper chamber (21) and the lower chamber (22) to guide the cooling medium in the upper chamber (21) into the lower chamber (22); The jet nozzle (23) is configured to clean the area corresponding to the upper inner ring (112) of the lower chamber (22) during the rotation process; and The jet nozzle (23) is also configured to change the jet speed during the rotation process by squeezing the trigger block group (24) to clean the area corresponding to the upper outer ring (113) of the lower chamber (22).

2. The thyristor module with high heat dissipation performance according to claim 1, characterized in that: The inlet end (231) of the jet nozzle (23) is located in the upper chamber (21), and the first outlet end (232) is located in the lower chamber (22); wherein An impeller (233) is sleeved at the inlet end (231), and the impeller (233) is configured to drive the first outlet end (232) of the jet nozzle (23) to revolve by flushing the medium in the water-cooling tube (3).

3. The thyristor module with high heat dissipation performance as claimed in claim 2, characterized in that: The inclination angle of the first outlet end (232) is adapted to the inner ring (112), and the first outlet end (232) is configured to clean the area corresponding to the inner ring (112) on the lower chamber (22) during revolution; and A lower pressure plate (234) is rotatably provided on the end side wall of the first outlet end (232), and a coil spring (235) is provided on the hinged portion of the lower pressure plate (234). The first outlet end (232) is also configured to change the injection speed by squeezing the lower pressure plate (234) through the trigger block group (24) during revolution, so as to clean the area corresponding to the upper outer ring (113) of the lower chamber (22).

4. The thyristor module with high heat dissipation performance as claimed in claim 3, characterized in that: The trigger block group (24) comprises: a plurality of trigger blocks (240), wherein the trigger block (240) comprises: an installation chamber (241), a lifting block (242) and a first return spring (243); wherein The stiffness of the first return spring (243) is greater than the stiffness of the coil spring (235); The lifting block (242) is slidably disposed in the installation chamber (241); the first return spring (243) is located in the installation chamber (241), and two ends thereof are respectively abutted against the installation chamber (241) and the lifting block (242) so that the lifting block (242) protrudes out of the installation chamber (241); The first outlet end (232) is configured to change the injection speed of the first outlet end (232) through the squeezing of the lifting block (242) during revolution.

5. The thyristor module with high heat dissipation performance as claimed in claim 4, characterized in that: The lifting blocks (242) in each of the trigger blocks (240) have the same length so as to clean the area corresponding to the upper outer ring (113) of the lower chamber (22).

6. The thyristor module with high heat dissipation performance as claimed in claim 5, characterized in that: A valve plate (31) is provided in the water cooling tube (3), one end of the valve plate (31) extends into the pressure chamber (32), and the other end is connected to the second return spring (33); The valve plate (31) is configured to adjust the extension length according to the air pressure in the pressure chamber (32), that is, the flow rate of the medium in the water cooling tube (3) is adjusted by the extension length of the valve plate (31) to change the revolution speed of the first outlet end (232).

7. The thyristor module with high heat dissipation performance as claimed in claim 6, characterized in that: Each of the installation chambers (241) is in communication with the pressure chamber (32) via an air passage (244); A protrusion (236) is provided on the rotating side of the first outlet end (232); The protrusion (236) is configured to pressurize the installation chamber (241) by squeezing the lifting block (242) during the rotation of the first outlet end (232), that is, to increase the air pressure in the pressure chamber (32) to cause the valve plate (31) to retreat, thereby reducing the orbital speed of the first outlet end (232) by reducing the flow rate of the medium in the water-cooling pipe (3).

8. The thyristor module with high heat dissipation performance as claimed in claim 7, characterized in that: The jet nozzle (23) further comprises: a second outlet end (237) located in the lower chamber (22); The second outlet end (237) cleans the area corresponding to the upper shaft center ring (111) of the lower chamber (22).

9. A method for operating a thyristor module with high heat dissipation performance according to any one of claims 1 to 8, characterized in that: include: The impeller (233) is flushed by the medium in the water cooling tube (3) so as to rotate the jet nozzle (23); The first outlet end (232) cooperates with the trigger block group (24) by rotating the jet nozzle (23) to clean the area corresponding to each thyristor device (11) on the lower chamber (22).

10. The operating method of the thyristor module with high heat dissipation performance according to claim 9, characterized in that: The method of cleaning the area corresponding to each thyristor device (11) on the lower chamber (22) by rotating the jet nozzle (23) so that the first outlet end (232) cleans the area corresponding to each thyristor device (11) on the lower chamber (22) comprises: Cleaning the area corresponding to the upper inner ring (112) of the lower chamber (22) through the first outlet end (232) in an unpressurized state; The injection speed of the first outlet end (232) is changed by squeezing the trigger block group (24), so that the first outlet end (232) cleans the area corresponding to the upper outer ring (113) of the lower chamber (22).

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