Liquid cooling heat dissipation microwave solid state source

Abstract

The invention discloses a liquid cooling heat dissipation microwave solid-state source, and relates to the technical field of microwave solid-state sources, the liquid cooling heat dissipation microwave solid-state source comprises a microwave solid-state source host, the microwave solid-state source host comprises an outer layer shell and an inner layer shell, the outer layer shell is arranged on the outer side of the inner layer shell, a cooling interlayer is arranged between the outer layer shell and the inner layer shell, and the inner layer shell is arranged in the cooling interlayer. The cooling interlayer is communicated with the two ends of a circulating pipe, a cooling medium circulates in the circulating pipe, a circulating pump and a heat exchanger are arranged on the circulating pipe, and the heat exchanger can cool the cooling medium in the circulating pipe. The microwave solid-state source host is cooled in a liquid cooling mode, the manufacturing cost is low, no large noise exists, and the size and the weight of the microwave solid-state source host cannot be excessively increased.

Description

Technical Field

[0001] The invention relates to the technical field of microwave solid-state sources, and in particular to a liquid-cooled heat-dissipating microwave solid-state source. Background Art

[0002] The microwave generators currently placed in microwave ablation equipment are divided into two types: magnetrons and solid-state sources. Vacuum tube devices such as magnetrons have problems such as low efficiency, large size, high-voltage drive, and severe power fluctuations. Solid-state sources refer to devices that convert low-power signals into microwave power of corresponding frequencies through a power amplifier chain by cooperating between resonant circuits and microwave semiconductor devices. Compared with vacuum tube devices, microwave solid-state sources are gradually replacing magnetrons and becoming a research hotspot and focus for major medical device companies due to their high efficiency, small size, long service life, and good stability.

[0003] Existing microwave solid-state sources will inevitably generate heat during actual use, and higher temperatures will affect their service life. For this reason, existing microwave solid-state sources are also equipped with corresponding heat dissipation components. As shown in "A solid-state microwave source" disclosed in patent number CN119277639A, it includes a circuit board and a radio frequency connector connected to the circuit board, a heating element is provided on the circuit board, the heating element is connected to a first heat dissipation component through a heat sink, a cover plate is detachably connected to the side of the circuit board away from the first heat dissipation component, a mounting step is provided on the surface of the first heat dissipation component, the mounting step extends to at least one side edge of the first heat dissipation component, a heat sink is provided in the mounting step, and a second heat dissipation component is fixedly connected inside the mounting step and outside the side edge of the heat sink.

[0004] The above patent uses a heat dissipation component to dissipate heat from the heat source, and the prior art will further install a fan based on the above technical features to blow away the heat from the heat dissipation component by air cooling. However, the traditional air cooling method relies on fans to dissipate heat, and the heat dissipation effect is poor; and a large amount of alloy materials must be used as heat conduction media, resulting in a larger volume and weight of the solid microwave source due to heat dissipation problems, and the fan will also generate relatively loud noise during operation.

[0005] Therefore, there is an urgent need in the art for a liquid-cooled heat-dissipating microwave solid-state source to solve the above-mentioned problems. Summary of the invention

[0006] The purpose of the present invention is to provide a liquid-cooled microwave solid-state source to solve the problems existing in the above-mentioned prior art. Liquid cooling is used to cool the microwave solid-state source host, which has good heat dissipation effect, small volume and mass, and good silent performance.

[0007] To achieve the above object, the present invention provides the following solutions:

[0008] The present invention discloses a liquid-cooled heat dissipation microwave solid-state source, comprising a microwave solid-state source host, wherein the microwave solid-state source host comprises an outer shell and an inner shell, wherein the outer shell is arranged on the outside of the inner shell, and a cooling interlayer is provided between the outer shell and the inner shell, wherein the cooling interlayer is connected to both ends of a circulation pipe, wherein a cooling medium flows in the circulation pipe, and a circulation pump and a heat exchanger are provided on the circulation pipe, wherein the heat exchanger can cool down the cooling medium in the circulation pipe.

[0009] Preferably, the heat exchanger is a tubular heat exchanger.

[0010] Preferably, the cooling medium is an ethylene glycol aqueous solution.

[0011] Preferably, the heat exchange medium in the heat exchanger is water or gas.

[0012] Preferably, a liquid reservoir is provided on the circulation pipe.

[0013] Preferably, the microwave solid-state source host is connected to a control device.

[0014] Preferably, the control device includes a controller and a control mainboard, the controller is electrically connected to the control mainboard, and the control mainboard is electrically connected to the microwave solid-state source host.

[0015] Preferably, the controller is a touch screen.

[0016] Preferably, a circuit board is installed in the microwave solid-state source host, and a plurality of groups of microwave generating units are installed on the circuit board.

[0017] Preferably, the microwave generating unit includes an oscillator, an amplifier, an antenna and an output connector, the oscillator and the amplifier are both mounted on the circuit board, two ends of the antenna are electrically connected to the circuit board and the output connector respectively, and the output connector is mounted on the outer shell.

[0018] Compared with the prior art, the present invention has achieved the following technical effects:

[0019] The present invention adopts liquid cooling to cool down the microwave solid-state source host, and has good heat dissipation effect. The overall modification of the microwave solid-state source host is relatively small, so that the volume and mass of the microwave solid-state source host will not change too much. In addition, during the heat dissipation process of liquid cooling, since no fan is provided, the noise is relatively small. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of a cooling cycle of a liquid-cooled heat-dissipating microwave solid-state source according to an embodiment of the present invention;

[0022] In the figure: 1-microwave solid state source host; 2-heat exchanger; 3-liquid storage tank; 4-circulation pump. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] The purpose of the present invention is to provide a liquid-cooled microwave solid-state source to solve the problems existing in the above-mentioned prior art. Liquid cooling is used to cool the microwave solid-state source host, which has good heat dissipation effect, small volume and mass, and good silent performance.

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] like Figure 1 As shown, this embodiment provides a liquid-cooled heat dissipation microwave solid-state source, including a microwave solid-state source host 1, which is basically the same as the existing microwave solid-state source device. The difference is that the shell of the microwave solid-state source host 1 is different from the shell of the existing microwave solid-state source device. The microwave solid-state source host 1 includes an outer shell and an inner shell, and the outer shell is arranged on the outside of the inner shell. There is a cooling interlayer between the outer shell and the inner shell, and a cooling medium is arranged in the cooling interlayer, which is used to exchange heat and cool the internal heat source. The cooling interlayer is connected to both ends of the circulation pipe, and a cooling medium circulates in the circulation pipe. A circulation pump 4 and a heat exchanger 2 are provided on the circulation pipe, and the heat exchanger 2 can cool the cooling medium in the circulation pipe.

[0027] In actual use, it is only necessary to start the circulation pump 4 to drive the circulation pipe and the cooling medium in the cooling interlayer to flow. The cooling medium in the cooling interlayer will exchange heat with the heat source inside the microwave solid-state source host 1, absorb the heat inside the microwave solid-state source host 1, and increase the temperature of the cooling medium. The cooling medium with increased temperature flows out of the cooling interlayer and enters the inlet end of the circulation pipe. When passing through the heat exchanger 2, the cooling medium with a higher temperature will exchange heat with the heat exchange medium in the heat exchanger 2, thereby dissipating heat and cooling, and becoming a cooling medium with a lower temperature. Then, the cooling medium with a lower temperature will flow out of the outlet end of the circulation pipe and enter the cooling interlayer again to cool and dissipate heat for the microwave solid-state source host 1, thus forming a complete cooling cycle process.

[0028] In this embodiment, the heat exchanger 2 is an existing tubular heat exchanger, which has two paths, shell side and tube side, inside which the cooling medium and the heat exchange medium flow through any path, so as to achieve the purpose of heat exchange between the cooling medium and the heat exchange medium. Of course, those skilled in the art can also use other types of heat exchangers 2, such as existing plate heat exchangers, etc., as long as they can cool the cooling medium.

[0029] In this embodiment, the cooling medium is ethylene glycol aqueous solution. The reason why ethylene glycol aqueous solution is used is that it has high thermal conductivity and can perform heat exchange better and faster. Of course, those skilled in the art can also replace the cooling medium with regular water. Although the heat exchange effect is not as good as that of ethylene glycol aqueous solution, it has the advantage of lower cost.

[0030] In this embodiment, the heat exchange medium in the heat exchanger 2 is water or gas. The gas can generally be air, which has low cost.

[0031] In this embodiment, a liquid reservoir 3 is provided on the circulation pipe, and the liquid reservoir 3 is a container. It has two functions: first, it increases the residence time of the cooling medium outside the microwave solid source host 1, so that the cooling medium can be fully cooled; second, the cooling medium may be lost during the circulation process, and the staff can add a certain amount of cooling medium to the circulation pipe through the liquid reservoir 3.

[0032] In this embodiment, the microwave solid-state source host 1 is connected to a control device, and a staff member remotely monitors the operation of the microwave solid-state source host 1 through the control device.

[0033] In this embodiment, the control device includes a controller and a control mainboard, the controller is electrically connected to the control mainboard, and the control mainboard is electrically connected to the microwave solid-state source host 1. In the actual working process, the staff can issue a working instruction to the controller, and the controller transmits the corresponding control instruction to the control mainboard, and then the control mainboard controls the microwave solid-state source host 1 to perform the corresponding work.

[0034] In this embodiment, the controller may be a common touch screen.

[0035] In this embodiment, a circuit board is installed in the microwave solid-state source host 1, and a plurality of microwave generating units are installed on the circuit board. As for the specific number of microwave generating units, those skilled in the art can select it according to actual needs.

[0036] Through the controller, the sub-control or master control signal is transmitted to the control mainboard, and the control mainboard controls the output of each microwave generating unit according to the received signal. Each microwave generating unit is controlled by the control mainboard, so that when multiple channels are required, one microwave solid-state source host 1 can meet the requirements.

[0037] In this embodiment, the microwave generating unit is a common component on the circuit board in the microwave solid-state source host 1. Specifically, the microwave generating unit includes an oscillator, an amplifier, an antenna and an output connector, wherein the oscillator can use an existing high-frequency oscillator, and the amplifier can use an existing power amplifier. The oscillator and the amplifier are both installed on the circuit board, and the two ends of the antenna are electrically connected to the circuit board and the output connector respectively, and the output connector is installed on the outer shell. In actual use, a microwave signal is generated by a high-frequency oscillator, amplified by a power amplifier, and then radiated through the antenna.

[0038] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A liquid-cooled microwave solid-state source, characterized in that: It includes a microwave solid-state source host, which includes an outer shell and an inner shell. The outer shell is arranged on the outside of the inner shell. A cooling interlayer is provided between the outer shell and the inner shell. The cooling interlayer is connected to both ends of a circulation pipe. A cooling medium flows in the circulation pipe. A circulation pump and a heat exchanger are provided on the circulation pipe. The heat exchanger can cool the cooling medium in the circulation pipe.

2. The liquid-cooled heat dissipation microwave solid-state source according to claim 1, characterized in that: The heat exchanger is a tubular heat exchanger.

3. The liquid-cooled heat dissipation microwave solid-state source according to claim 1, characterized in that: The cooling medium is an ethylene glycol aqueous solution.

4. The liquid-cooled heat dissipation microwave solid-state source according to claim 1, characterized in that: The heat exchange medium in the heat exchanger is water or gas.

5. The liquid-cooled heat dissipation microwave solid-state source according to claim 1, characterized in that: A liquid storage device is arranged on the circulation pipe.

6. The liquid-cooled heat dissipation microwave solid-state source according to claim 1, characterized in that: The microwave solid-state source host is connected with a control device.

7. The liquid-cooled heat dissipation microwave solid-state source according to claim 6, characterized in that: The control device comprises a controller and a control mainboard, wherein the controller is electrically connected to the control mainboard, and the control mainboard is electrically connected to the microwave solid-state source host.

8. The liquid-cooled heat dissipation microwave solid-state source according to claim 7, characterized in that: The controller is a touch screen.

9. The liquid-cooled heat dissipation microwave solid-state source according to claim 1, characterized in that: A circuit board is installed in the microwave solid-state source host, and a plurality of groups of microwave generating units are installed on the circuit board.

10. The liquid-cooled heat dissipation microwave solid-state source according to claim 9, characterized in that: The microwave generating unit comprises an oscillator, an amplifier, an antenna and an output connector. The oscillator and the amplifier are both mounted on the circuit board. Two ends of the antenna are electrically connected to the circuit board and the output connector respectively. The output connector is mounted on the outer shell.

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