Full-automatic plate planting equipment and plate planting method

Abstract

The invention belongs to the technical field of automatic equipment, and particularly relates to full-automatic plate planting equipment and a plate planting method. The full-automatic board planting device comprises a material moving mechanism, a material storing mechanism and a conveying mechanism used for conveying a circuit mother board. The material storage mechanism comprises a display screen and a transparent plate mounted above the display screen; the display screen displays a plurality of model frames which are distributed at intervals, and a plurality of piles of circuit daughter boards which are in one-to-one correspondence with the model frames are stored on the transparent board; the material moving mechanism moves the circuit daughter boards from the transparent board one by one and places the circuit daughter boards on the circuit mother board located on the material moving mechanism. According to the full-automatic board planting equipment, the display screen can display different model frames according to the circuit daughter boards of different sizes and different specifications, so that the full-automatic board planting equipment does not need to adjust different entity storage frames according to different circuit daughter boards, the applicability and universality of the full-automatic board planting equipment are improved, the occupied space of the full-automatic board planting equipment is reduced, and the cost is reduced. And the full-automatic plate planting equipment is low in manufacturing cost and high in automation degree.

Description

Technical Field

[0001] The present invention belongs to the technical field of automation equipment, and in particular relates to a full-automatic plate planting device and a plate planting method. Background Art

[0002] A circuit board generally consists of a motherboard and multiple sub-circuit boards mounted on the motherboard. During the manufacturing process, various sub-circuit boards need to be mounted on the corresponding parts of the motherboard. With the continuous advancement of automation technology, circuit board implantation machines can grab each sub-circuit board and install it on the corresponding parts of the motherboard, which improves the manufacturing efficiency of circuit boards and reduces the manufacturing cost of circuit boards.

[0003] In the prior art, the circuit board implanting machine is equipped with multiple storage bins, each of which can hold a stack of circuit boards. The material transfer robot grabs the circuit boards from each storage bin and places them on the motherboard. When the size of the circuit board changes, different storage bins need to be configured, which has the technical problems of poor versatility and applicability; in addition, the design of multiple storage bins increases the occupied space and manufacturing cost of the circuit board implanting machine. Summary of the invention

[0004] The invention solves the technical problems of low applicability and versatility of circuit board implanting machines in the prior art, and provides a fully automatic implanting device and method.

[0005] In view of the above problems, an embodiment of the present invention provides a fully automatic board implanting device, comprising a material moving mechanism, a material storage mechanism and a conveying mechanism for conveying a circuit motherboard; the material storage mechanism comprises a display screen and a transparent plate installed above the display screen; The display screen displays a plurality of model frames that are spaced apart from each other, and the transparent plate stores a plurality of stacks of circuit sub-boards that correspond one to one with the model frames; The material transfer mechanism removes the circuit sub-boards from the transparent plate one by one and places them on the circuit mother board located on the material transfer mechanism.

[0006] Optionally, the conveying mechanism includes two guide rail assemblies spaced apart from each other; the guide rail assembly includes a support seat, a conveyor belt, a conveyor belt driving member, a lifting driving member, a clamping plate, and a limit block installed on the support seat; the conveyor belt driving member is installed on the support seat and connected to the conveyor belt, and the conveyor belt is used to transfer the circuit motherboard; The lifting drive is connected to the clamping plate and is used to drive the clamping plate to move toward or away from the limiting block, so that the clamping plate and the limiting block clamp or release the circuit motherboard on the conveyor belt.

[0007] Optionally, the conveying mechanism also includes an adjusting drive assembly, which includes an adjusting drive member, a first guide rail and two first sliders respectively installed on the two support seats, and the support seat is installed on the first guide rail through the first slider; the adjusting drive member is connected to the support seat and is used to adjust the distance between the two support seats.

[0008] Optionally, the lifting drive component includes a first motor, a first pulley, a second pulley, a first belt, a first screw rod, a first nut, a base plate and a top plate; the first motor is mounted on the base plate and connected to the first pulley, the second pulley is rotatably mounted on the base plate and connected to the first screw rod, the first belt is wound between the first pulley and the second pulley, the first nut is mounted on the top plate and threadedly connected to the first screw rod; the two clamps are installed on the top plate at intervals.

[0009] Optionally, the conveying mechanism further comprises two limit assemblies, and the two limit assemblies are arranged at intervals along the direction in which the conveyor belt transfers the circuit motherboard; The limiting assembly includes a limiting driving component and a limiting plate installed on the limiting driving component; the limiting driving component is used to drive the limiting plate to move so that the limiting plate limits the circuit motherboard on the conveyor belt.

[0010] Optionally, the material transfer mechanism includes a material transfer drive assembly and a suction nozzle assembly; The suction nozzle assembly comprises a sleeve assembly provided with a through hole, a shaft body provided with an inner hole, and a suction nozzle body provided with a suction hole; the suction nozzle assembly is mounted on the shaft body, and the inner hole is connected to the suction hole; the sleeve assembly is mounted on the material transfer drive assembly; The inner wall of the sleeve assembly is provided with an internal spline, the outer wall of the shaft body is provided with an external spline adapted to the internal spline, and the shaft body is slidably installed in the through hole through the internal spline and the external spline meshing with each other.

[0011] Optionally, the material transfer drive assembly includes an X-axis drive, a Y-axis drive, a Z-axis drive and a Z-axis rotation drive; the Y-axis drive is installed on the X-axis drive, the Z-axis drive is installed on the Y-axis drive, and the Z-axis rotation drive is installed on the Z-axis drive and connected to the sleeve assembly.

[0012] Optionally, the fully automatic plate planting device further comprises a first camera mounted on the material transfer drive assembly; The first camera identifies the first position information of the circuit sub-board on the transparent plate; according to the first position information, after adjusting the posture of the suction nozzle assembly through the material transfer drive assembly, the suction nozzle assembly then sucks the circuit sub-board located on the transparent plate.

[0013] Optionally, the fully automatic plate implanting device further comprises a second camera mounted on the conveying mechanism; The second camera identifies second position information of the circuit sub-board on the suction nozzle assembly; after adjusting the posture of the circuit sub-board through the material transfer drive assembly based on the second position information and the installation position information on the circuit mother board, the suction nozzle assembly places the circuit sub-board on it to the installation position of the circuit mother board.

[0014] Another embodiment of the present invention further provides a plate planting method, which is applied to the above-mentioned fully automatic plate planting device, comprising: Obtaining the model frame displayed on the display screen, placing multiple stacks of circuit sub-boards on the transparent plate, and arranging the circuit sub-boards in one-to-one correspondence with the model frame; The material moving mechanism removes the circuit sub-boards on the transparent plate one by one according to the model frame, and places the circuit sub-boards on the installation position of the circuit mother board.

[0015] In the present invention, an external mobile cart, manual labor, etc. can place multiple stacks of circuit boards on the transparent board, and the circuit boards are located directly above the model frame displayed on the display screen. The material moving mechanism can grab the circuit boards on the transparent board one by one according to the model frame, and the material moving mechanism can also place the circuit boards on it on the circuit mother board located on the conveying mechanism. After the circuit mother board is stacked with multiple circuit boards, the conveying mechanism can move the circuit mother board to the next workstation. In the present invention, the display screen can display different model frames according to circuit boards of different sizes and specifications, so that the fully automatic board planting equipment does not need to adjust different physical material storage frames according to different circuit boards, which improves the applicability and versatility of the fully automatic board planting equipment, reduces the occupied space of the fully automatic board planting equipment, and the manufacturing cost of the fully automatic board planting equipment is low and the degree of automation is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0017] Figure 1 A schematic diagram of the structure of a fully automatic plate planting device provided in one embodiment of the present invention; Figure 2 A schematic structural diagram of a circuit motherboard of a fully automatic board implanting device provided in one embodiment of the present invention being installed on a conveying mechanism; Figure 3 A schematic diagram of the structure of a conveying mechanism of a fully automatic plate planting device provided in one embodiment of the present invention; Figure 4 A schematic structural diagram of a lifting assembly of a transfer device provided in one embodiment of the present invention; Figure 5 A schematic structural diagram of a material transfer mechanism of a transfer device provided in one embodiment of the present invention; Figure 6 A cross-sectional view of a material transfer mechanism of a transfer device provided in one embodiment of the present invention; Figure 7 A schematic diagram of a partial exploded structure of a nozzle assembly of a transfer device provided in one embodiment of the present invention.

[0018] The reference numerals in the specification are as follows: 1. Material transfer mechanism; 11. Material transfer drive assembly; 111. X-axis drive member; 112. Y-axis drive member; 113. Z-axis drive member; 114. Z-axis rotation drive member; 12. Suction nozzle assembly; 121. Sleeve assembly; 1211. Through hole; 1212. Internal spline; 122. Shaft body; 1221. Internal hole; 1222. External spline; 123. Suction nozzle body; 1231. Suction hole; 124. Elastic member; 2. Material storage mechanism; 21. Display screen; 22. Transparent plate; 3. Conveying mechanism; 3 1. Guide rail assembly; 311. Support seat; 312. Conveyor belt; 313. Conveyor belt drive; 314. Lifting drive; 3143. Second pulley; 3144. First belt; 3145. First screw rod; 3147. Bottom plate; 3148. Top plate; 315. Clamp; 316. Limit block; 32. Adjustment drive assembly; 321. Adjustment drive; 322. First guide rail; 323. First slider; 33. Limitation assembly; 4. First camera; 5. Second camera; 6. Circuit board. DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0020] It should be understood that the directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "front", "back", and "middle" are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation of the present invention.

[0021] like Figure 1 As shown, an embodiment of the present invention provides a fully automatic board planting device, including a material moving mechanism 1, a material storage mechanism 2 and a conveying mechanism 3 for conveying a circuit motherboard 6; the material storage mechanism 2 includes a display screen 21 and a transparent plate 22 installed above the display screen 21; it can be understood that the transparent plate 22 includes but is not limited to a glass plate, etc.

[0022] The display screen 21 displays a plurality of model frames (not shown in the figure) distributed at intervals, and the transparent plate 22 stores a plurality of stacks of circuit sub-boards (not shown in the figure) corresponding to the model frames one by one; it can be understood that the circuit sub-board is located directly above the model frame, and the model frame is the outer contour of the circuit sub-board, and the size or shape of different circuit sub-boards may be different.

[0023] The material transfer mechanism 1 removes the circuit sub-boards one by one from the transparent plate 22 and places them on the circuit mother board 6 located on the material transfer mechanism 1 .

[0024] In the present invention, an external mobile cart, manual labor, etc. can place multiple stacks of circuit boards on the transparent plate 22, and the circuit boards are located directly above the model frame displayed on the display screen 21. The material moving mechanism 1 can grab the circuit boards on the transparent plate 22 one by one according to the model frame, and the material moving mechanism 1 can also place the circuit boards thereon on the circuit mother board 6 located on the conveying mechanism 3. After the circuit mother board 6 is stacked with multiple circuit boards, the conveying mechanism 3 can move the circuit mother board 6 to the next workstation. In the present invention, the display screen 21 can display different model frames according to circuit boards of different sizes and specifications, so that the fully automatic board planting equipment does not need to adjust different physical material storage frames according to different circuit boards, which improves the applicability and versatility of the fully automatic board planting equipment, reduces the occupied space of the fully automatic board planting equipment, and the manufacturing cost of the fully automatic board planting equipment is low and the degree of automation is high.

[0025] In one embodiment, if Figures 2 to 4 As shown, the conveying mechanism 3 includes two guide rail assemblies 31 distributed at intervals; each of the guide rail assemblies 31 includes a support seat 311, a conveyor belt 312, a conveyor belt driving member 313, a jacking driving member 314, a clamping plate 315 and a limit block 316 installed on the support seat 311; the conveyor belt driving member 313 is installed on the support seat 311 and connected to the conveyor belt 312, and the conveyor belt 312 is used to move the circuit motherboard 6; it can be understood that the conveyor belt driving member 313 includes a second motor and a third pulley and a fourth pulley installed on the support seat 311 for rotation at intervals, and the conveyor belt 312 is wound between the third pulley and the fourth pulley; the second motor is installed on the support seat 311 and connected to the third pulley; the limit block 316 is installed on the top of the support seat 311, and the clamping plate 315 is located below the support seat 311.

[0026] The lifting drive 314 is connected to the clamping plate 315 and is used to drive the clamping plate 315 to move toward or away from the limit block 316, so that the clamping plate 315 and the limit block 316 clamp or release the circuit motherboard 6 on the conveyor belt 312. It can be understood that the lifting drive 314 includes but is not limited to a pneumatic cylinder, a hydraulic cylinder, and a linear motor.

[0027] Specifically, when the conveyor belt 312 conveys the circuit mother board 6 to the mounting station, the lifting drive component 314 drives the clamping plate 315 to move toward the limit block 316 until the clamping plate 315 and the limit block 316 clamp the circuit mother board 6 from the upper and lower ends; the material transfer mechanism 1 then places the circuit sub-board on it on the circuit mother board 6; when enough circuit sub-boards are placed on the circuit mother board 6, the lifting drive component 314 drives the clamping plate 315 away from the limit block 316, and after the clamping plate 315 and the limit block 316 release the circuit mother board 6, the conveyor belt 312 conveys the circuit mother board 6 on it to the next station.

[0028] In one embodiment, if Figure 2 As shown, the conveying mechanism 3 also includes an adjusting drive assembly 32, and the adjusting drive assembly 32 includes an adjusting drive member 321, a first guide rail 322, and two first sliders 323 respectively mounted on the two support seats 311, and the support seat 311 is mounted on the first guide rail 322 through the first slider 323; the adjusting drive member 321 is connected to the support seat 311, and is used to adjust the distance between the two support seats 311. It can be understood that the adjusting drive member 321 includes but is not limited to a screw nut mechanism and the like. In this embodiment, the adjusting drive member 321 can adjust the distance between the two support seats 311, so that the conveying mechanism 3 can support and transport circuit motherboards 6 of different widths, thereby improving the applicability and versatility of the fully automatic board planting equipment. In addition, the support seat 311 moves on the first guide rail 322 through the first slider 323, thereby ensuring the stability of the movement of the support seat 311.

[0029] In a specific embodiment, if Figure 4As shown, the lifting drive member 314 includes a first motor (not shown in the figure), a first pulley (not shown in the figure), a second pulley 3143, a first belt 3144, a first screw rod 3145, a first nut (not shown in the figure), a base plate 3147 and a top plate 3148; the first motor is mounted on the base plate 3147 and connected to the first pulley, the second pulley 3143 is rotatably mounted on the base plate 3147 and connected to the first screw rod 3145, the first belt 3144 is wound between the first pulley and the second pulley 3143, the first nut is mounted on the top plate 3148 and is threadedly connected to the first screw rod 3145; the two clamps 315 are installed on the top plate 3148 at intervals.

[0030] Specifically, the first motor drives the first pulley to rotate, the first pulley drives the second pulley 3143 to rotate through the first belt 3144, the second pulley 3143 drives the first screw rod 3145 to rotate, and the first screw rod 3145 drives the top plate 3148 and its upper clamping plate 315 to rise and fall through the first nut. In this embodiment, the lifting drive member 314 has a compact structure and occupies a small space.

[0031] In a specific embodiment, if Figure 3 As shown, the conveying mechanism 3 also includes two limit assemblies 33, and the two limit assemblies 33 are arranged at intervals along the direction in which the conveyor belt 312 transfers the circuit motherboard 6; the limit assemblies 33 include a limit driving member and a limit plate installed on the limit driving member; the limit driving member is used to drive the limit plate to move so that the limit plate limits the circuit motherboard 6 on the conveyor belt 312. It can be understood that the limit driving member includes but is not limited to a pneumatic cylinder, a hydraulic cylinder, and a screw nut mechanism; the limit driving member can drive the limit plate to move up and down, so that the two limit plates can limit the circuit motherboard 6 on the conveyor belt 312 to the mounting station, and the clamping block and the limit block 316 clamp the circuit motherboard 6. In this embodiment, the design of the limit assembly 33 improves the automation level of the conveying mechanism 3.

[0032] In a specific embodiment, if Figures 5 to 7As shown, the material moving mechanism 1 includes a material moving drive assembly 11 and a suction nozzle assembly 12; the suction nozzle assembly 12 includes a sleeve assembly 121 provided with a through hole 1211, a shaft body 122 provided with an inner hole 1221 and a suction nozzle body 123 provided with a suction hole 1231; the suction nozzle assembly 12 is installed on the shaft body 122, and the inner hole 1221 is connected to the suction hole 1231; the sleeve assembly 121 is installed on the material moving drive assembly 11; the inner wall of the sleeve assembly 121 is provided with an internal spline 1212, and the outer wall of the shaft body 122 is provided with an external spline 1222 adapted to the internal spline 1212, and the shaft body 122 is slidably installed in the through hole 1211 by the internal spline 1212 and the external spline 1222 that are engaged with each other. It can be understood that the internal spline 1212 is arranged on the inner wall of the through hole 1211; the internal spline 1212 is an elongated internal tooth, and the external spline 1222 is an elongated external tooth.

[0033] In the present embodiment, during the process in which the material transfer drive assembly 11 drives the shaft body 122 to drive the nozzle assembly 12 to absorb or place the circuit board, the shaft body 122 slides in the through hole 1211, and the internal spline 1212 and the external spline 1222 remain in a meshing state. The internal splines 1212 and the external splines 1222 that are meshed with each other prevent the shaft body 122 and the sleeve assembly 121 from being offset, thereby ensuring the position accuracy of the nozzle assembly 12 in absorbing the circuit board, and the shaft sleeve and the nozzle assembly 12 will not shake, thereby ensuring the stability of the nozzle assembly 12 in absorbing the workpiece.

[0034] In one embodiment, if Figure 6 As shown, the nozzle assembly 12 further includes an elastic member 124, and opposite ends of the elastic member 124 are respectively connected to the nozzle body 123 and the sleeve assembly 121. It can be understood that the elastic member 124 includes but is not limited to a spring, and the elastic member 124 is sleeved between the shaft 122 and the nozzle body 123. Specifically, during the process of the shaft 122 driving the nozzle body 123 to adsorb the circuit sub-board, the nozzle body 123 will move toward the sleeve assembly 121 and compress the elastic member 124, ensuring that the nozzle body 123 and the circuit sub-board are in flexible contact, thereby avoiding the accident of damaging the circuit sub-board during the process of the nozzle body 123 adsorbing the circuit sub-board.

[0035] In one embodiment, if Figure 1 and Figure 5As shown, the material moving drive assembly 11 includes an X-direction drive member 111, a Y-direction drive member 112, a Z-direction drive member 113, and a Z-direction rotation drive member 114; the Y-direction drive member 112 is mounted on the X-direction drive member 111, the Z-direction drive member 113 is mounted on the Y-direction drive member 112, and the Z-direction rotation drive member 114 is mounted on the Z-direction drive member 113 and connected to the sleeve assembly 121. It can be understood that the X-direction drive member 111, the Y-direction drive member 112, and the Z-direction drive member 113 all include but are not limited to pneumatic cylinders, hydraulic cylinders, screw nut mechanisms, etc.

[0036] Specifically, the X-direction driving member 111 can drive the Y-direction driving member 112 to move along the X-direction, the Y-direction driving member 112 can drive the Z-direction driving member 113 to move along the Y-direction, the Z-direction driving member 113 can drive the Z-direction rotating driving member 114 to move along the Z-direction, and the Z-direction rotating driving member 114 can drive the suction nozzle assembly 12 to rotate along the Z-direction. In this embodiment, the material transfer driving assembly 11 can drive the suction nozzle assembly 12 to move along the X-direction, the Y-direction, and the Z-direction, and can also drive the suction nozzle assembly 12 to rotate around the Z-direction, so that the material transfer mechanism 1 can transfer the circuit daughter board between the transparent plate 22 and the circuit mother board 6.

[0037] In one embodiment, if Figure 1 As shown, the fully automatic plate implanting device further includes a first camera 4 mounted on the material transfer drive assembly 11; it can be understood that the material transfer drive assembly 11 can drive the first camera 4 to move along the X direction and the Y direction.

[0038] The first camera 4 identifies the first position information of the circuit board on the transparent plate 22 ; based on the first position information, after adjusting the posture of the suction nozzle assembly 12 through the material transfer drive assembly 11 , the suction nozzle assembly 12 then sucks the circuit board located on the transparent plate 22 .

[0039] Specifically, after the first camera 4 obtains the first position information of the circuit sub-board on the transparent plate 22, the material transfer drive component 11 adjusts the posture of the suction nozzle component 12 according to the first position information, so that the suction nozzle component 12 can accurately suck the circuit sub-board, thereby ensuring the accuracy of the suction nozzle component 12 in sucking the circuit sub-board.

[0040] In one embodiment, if Figure 1 and Figure 2 As shown, the fully automatic plate planting device further includes a second camera 5 installed on the conveying mechanism 3; The second camera 5 identifies the second position information of the circuit sub-board on the suction nozzle assembly 12; after adjusting the posture of the circuit sub-board through the material transfer drive assembly 11 according to the second position information and the installation position information on the circuit mother board 6, the suction nozzle assembly 12 places the circuit sub-board thereon to the installation position of the circuit mother board 6.

[0041] Specifically, the material transfer drive assembly 11 drives the circuit sub-board to move to the top of the second camera 5 through the suction nozzle assembly 12. The second camera 5 takes a picture of the circuit sub-board on the suction nozzle assembly 12. The controller obtains the second position information of the circuit sub-board and adjusts the posture of the circuit sub-board according to the second position information so that the position of the circuit sub-board corresponds to the installation position on the circuit mother board 6. The suction nozzle assembly 12 then places the circuit sub-board on it to the installation position of the circuit mother board 6, thereby ensuring the position accuracy of the circuit sub-board placed on the circuit mother board 6.

[0042] Another embodiment of the present invention further provides a plate planting method, which is applied to the above-mentioned fully automatic plate planting device, comprising: Obtain the model frame displayed on the display screen 21, place multiple stacks of circuit boards on the transparent plate 22, and the circuit boards are arranged in a one-to-one correspondence with the model frame; it can be understood that an external mobile vehicle, manual labor, etc. can place multiple stacks of circuit boards on the transparent plate 22, and the circuit boards are located directly above the model frame displayed on the display screen 21.

[0043] The material moving mechanism 1 removes the circuit sub-boards on the transparent plate 22 one by one according to the model frame, and places the circuit sub-boards on the mounting position of the circuit mother board 6. It can be understood that the material moving mechanism 1 can grab the circuit sub-boards on the transparent plate 22 one by one according to the model frame, and the material moving mechanism 1 can also place the circuit sub-boards on the transparent plate 22 on the circuit mother board 6 located on the conveying mechanism 3. After the circuit mother board 6 is stacked with multiple circuit sub-boards, the conveying mechanism 3 can move the circuit mother board 6 to the next station.

[0044] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic plate planting device, characterized in that: It includes a material moving mechanism, a material storing mechanism and a conveying mechanism for conveying a circuit motherboard; the material storing mechanism includes a display screen and a transparent plate installed above the display screen; The display screen displays a plurality of model frames that are spaced apart from each other, and the transparent plate stores a plurality of stacks of circuit sub-boards that correspond one to one with the model frames; The material transfer mechanism removes the circuit sub-boards from the transparent plate one by one and places them on the circuit mother board located on the material transfer mechanism.

2. The fully automatic plate planting equipment according to claim 1 is characterized in that: The conveying mechanism comprises two guide rail assemblies spaced apart from each other; the guide rail assembly comprises a support seat, a conveyor belt, a conveyor belt driving member, a lifting driving member, a clamping plate and a limit block installed on the support seat; the conveyor belt driving member is installed on the support seat and connected to the conveyor belt, and the conveyor belt is used to transfer the circuit motherboard; The lifting drive is connected to the clamping plate and is used to drive the clamping plate to move toward or away from the limiting block, so that the clamping plate and the limiting block clamp or release the circuit motherboard on the conveyor belt.

3. The fully automatic plate planting equipment according to claim 2 is characterized in that: The conveying mechanism also includes an adjusting drive assembly, which includes an adjusting drive member, a first guide rail and two first sliders respectively installed on the two support seats, and the support seat is installed on the first guide rail through the first slider; the adjusting drive member is connected to the support seat and is used to adjust the distance between the two support seats.

4. The fully automatic plate planting equipment according to claim 2 is characterized in that: The lifting drive component includes a first motor, a first pulley, a second pulley, a first belt, a first screw rod, a first nut, a base plate and a top plate; the first motor is mounted on the base plate and connected to the first pulley, the second pulley is rotatably mounted on the base plate and connected to the first screw rod, the first belt is wound between the first pulley and the second pulley, the first nut is mounted on the top plate and threadedly connected to the first screw rod; the two clamps are installed on the top plate at intervals.

5. The fully automatic plate planting equipment according to claim 2 is characterized in that: The conveying mechanism further comprises two limit assemblies, which are arranged at intervals along the direction in which the conveyor belt transfers the circuit motherboard; The limiting assembly includes a limiting driving component and a limiting plate installed on the limiting driving component; the limiting driving component is used to drive the limiting plate to move so that the limiting plate limits the circuit motherboard on the conveyor belt.

6. The fully automatic plate planting equipment according to claim 1 is characterized in that: The material transfer mechanism includes a material transfer drive assembly and a suction nozzle assembly; The suction nozzle assembly comprises a sleeve assembly provided with a through hole, a shaft body provided with an inner hole, and a suction nozzle body provided with a suction hole; the suction nozzle assembly is mounted on the shaft body, and the inner hole is connected to the suction hole; the sleeve assembly is mounted on the material transfer drive assembly; The inner wall of the sleeve assembly is provided with an internal spline, the outer wall of the shaft body is provided with an external spline adapted to the internal spline, and the shaft body is slidably installed in the through hole through the internal spline and the external spline meshing with each other.

7. The fully automatic plate planting equipment according to claim 6 is characterized in that: The material transfer drive assembly includes an X-axis drive, a Y-axis drive, a Z-axis drive and a Z-axis rotation drive; the Y-axis drive is installed on the X-axis drive, the Z-axis drive is installed on the Y-axis drive, and the Z-axis rotation drive is installed on the Z-axis drive and connected to the sleeve assembly.

8. The fully automatic plate planting equipment according to claim 6 is characterized in that: The fully automatic plate planting equipment also includes a first camera installed on the material transfer drive assembly; The first camera identifies the first position information of the circuit sub-board on the transparent plate; according to the first position information, after adjusting the posture of the suction nozzle assembly through the material transfer drive assembly, the suction nozzle assembly then sucks the circuit sub-board located on the transparent plate.

9. The fully automatic plate planting equipment according to claim 8, characterized in that: The fully automatic plate planting device also includes a second camera installed on the conveying mechanism; The second camera identifies second position information of the circuit sub-board on the suction nozzle assembly; after adjusting the posture of the circuit sub-board through the material transfer drive assembly based on the second position information and the installation position information on the circuit mother board, the suction nozzle assembly places the circuit sub-board on it to the installation position of the circuit mother board.

10. A board planting method, applied to the fully automatic board planting equipment according to any one of claims 1 to 9, characterized in that: include: Obtaining the model frame displayed on the display screen, placing multiple stacks of circuit sub-boards on the transparent plate, and arranging the circuit sub-boards in one-to-one correspondence with the model frame; The material moving mechanism removes the circuit sub-boards on the transparent plate one by one according to the model frame, and places the circuit sub-boards on the installation position of the circuit mother board.

Images