UVC LED and preparation method thereof

Abstract

The invention relates to a UVC LED and a preparation method thereof. The UVC LED comprises: a packaging substrate; the light-emitting chip is arranged on the packaging substrate; the lens is arranged on one side, deviating from the packaging substrate, of the light-emitting chip; the filling layer is arranged between the light-emitting chip and the lens, the two sides of the filling layer are attached to the light-emitting chip and the lens respectively, and the filling layer is made of fluororesin and quartz. According to the application, the filling layer is arranged between the light-emitting chip and the lens, the material of the filling layer comprises the fluororesin and the quartz, and the two sides of the filling layer are respectively attached to the light-emitting chip and the lens, so that the refractive index between the light-emitting chip and the lens can be improved, the light conduction loss between the light-emitting chip and the lens is further reduced, and the light extraction rate is improved.

Description

Technical Field

[0001] The present application relates to the technical field of light emitting diodes, and in particular to a UVC LED and a preparation method thereof. Background Art

[0002] UVC LED is a light-emitting diode that can emit ultraviolet C spectrum. Ultraviolet C refers to ultraviolet rays with a wavelength between 200nm and 280nm. Ultraviolet rays in this band have strong sterilization and disinfection capabilities. UVC LED has the characteristics of high efficiency, long life, and low energy consumption, and is suitable for various scenarios that require efficient sterilization and disinfection. The light output rate of UVC LED in related technologies needs to be improved. Summary of the invention

[0003] In view of this, the present application provides a UVC LED and a preparation method thereof, aiming to improve the light output efficiency of existing UVC LEDs.

[0004] In order to achieve the above objectives, the present application provides a UVC LED, comprising: Package substrate; A light emitting chip is disposed on the packaging substrate; A lens is disposed on a side of the light emitting chip away from the packaging substrate; The filling layer is arranged between the light emitting chip and the lens, and two sides of the filling layer are respectively attached to the light emitting chip and the lens, and the material of the filling layer includes fluororesin and quartz.

[0005] In one embodiment, the mass ratio of the fluororesin to the quartz is (5-20): (3-10); and / or The particle size of the quartz is 2 μm-4 μm; and / or The lens is a quartz lens.

[0006] In one embodiment, the filling layer has a thickness of 70 μm-110 μm.

[0007] In one embodiment, the lens is bonded to the packaging substrate.

[0008] Accordingly, the present application provides a method for preparing a UVC LED, comprising the following steps: Providing a preform and a filling layer liquid, wherein the preform comprises a packaging substrate and a light-emitting chip, wherein the light-emitting chip is disposed on the packaging substrate, and the filling layer liquid comprises a fluororesin and quartz dispersed in a solvent, and the filling layer liquid is disposed on a surface of the light-emitting chip on a side away from the packaging substrate; A lens is provided, and the lens is arranged on a side of the filling layer liquid away from the light-emitting chip. The filling layer liquid is heated and cured to form a filling layer. Both sides of the filling layer are respectively bonded to the light-emitting chip and the lens to obtain a UVC LED.

[0009] In one embodiment, the particle size of the quartz is 2 μm-4 μm; and / or The lens is a quartz lens.

[0010] In one embodiment, the mass ratio of the fluororesin, the quartz and the solvent is (5-20):(3-10):100.

[0011] In one embodiment, the temperature of the heating and curing is 100° C.-120° C., and the time of the heating and curing is 8 min-10 min.

[0012] In one embodiment, the step of disposing the filling layer liquid on the surface of the light emitting chip on a side facing away from the packaging substrate comprises: The filling layer liquid is applied to the central area of ​​the surface of the light emitting chip on a side away from the packaging substrate.

[0013] In one embodiment, the step of arranging the lens on a side of the filling layer liquid facing away from the light-emitting chip comprises: The lens is arranged on a side of the filling layer liquid facing away from the light emitting chip, and the lens is in contact with a side of the filling layer liquid facing away from the light emitting chip.

[0014] In one embodiment, the filling layer has a thickness of 70 μm-110 μm.

[0015] In the present application, a filling layer is provided between the light-emitting chip and the lens, the filling layer material includes fluororesin and quartz, and the two sides of the filling layer are respectively bonded to the light-emitting chip and the lens, so that the refractive index between the light-emitting chip and the lens can be improved, thereby reducing the light conduction loss between the light-emitting chip and the lens and improving the light output rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 is a schematic diagram of the structure of a UVC LED provided in an embodiment of the present application; Figure 2This is a schematic diagram of the structure of the UVC LED provided in the embodiment of the present application after a filling layer of liquid is provided (without a lens); Figure 3 It is a schematic diagram of the structure of the UVC LED provided in Comparative Example 1 of the present application.

[0018] Attached figures are as follows: packaging substrate-1; light-emitting chip-2; filling layer-3; lens-4; edge sealing glue-5. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0021] In this application, unless otherwise stated, directional words such as "upper" and "lower" generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device. In addition, in the description of this application, the term "including" means "including but not limited to". The terms first, second, third, etc. are used only as labels and do not impose numerical requirements or establish an order.

[0022] In this application, "and / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural.

[0023] In this application, "at least one" means one or more, and "plurality" means two or more. "One or more", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e. a and b), ac, bc or abc, where a, b, c can be single or multiple.

[0024] Various embodiments of the present application may be presented in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be understood as a rigid limitation on the scope of the present application; therefore, the range description should be considered to have specifically disclosed all possible sub-ranges and single numerical values ​​within the range. For example, the range description from 1 to 6 should be considered to have specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which apply regardless of the range. In addition, whenever a numerical range is indicated herein, it is meant to include any cited number (fractional or integer) within the indicated range.

[0025] The technical solution of this application is as follows: In a first aspect, the present application provides a UVC LED, comprising: Packaging substrate 1; A light emitting chip 2 is disposed on the packaging substrate 1; A lens 4 is arranged on a side of the light emitting chip 2 away from the packaging substrate 1; The filling layer 3 is disposed between the light emitting chip 2 and the lens 4, and two sides of the filling layer 3 are respectively attached to the light emitting chip 2 and the lens 4. The material of the filling layer 3 includes fluororesin and quartz.

[0026] In the present application, a filling layer 3 is provided between the light emitting chip 2 and the lens 4. The material of the filling layer 3 includes fluororesin and quartz, and the two sides of the filling layer 3 are respectively attached to the light emitting chip 2 and the lens 4, so that the refractive index between the light emitting chip 2 and the lens 4 can be increased, thereby reducing the light conduction loss between the light emitting chip 2 and the lens 4 and improving the light extraction rate. At the same time, quartz and fluororesin are both materials that can withstand UVC light, and the attenuation degree of 1000H is low under the continuous irradiation of UV light, so that the attenuation ratio under UVC light irradiation can be reduced.

[0027] It can be understood that the two sides of the filling layer 3 are respectively attached to the light emitting chip 2 and the lens 4, so that the light emitted by the light emitting chip 2 can be changed from the original path: chip to air, then to lens 4, to chip to filling layer 3, then to lens 4. The refractive index of the filling layer 3 is higher than that of air, so that the loss of light caused by refraction of the air in the gap between the light emitting chip 2 and the lens 4 can be reduced, and the light output rate can be improved. The attenuation of quartz and fluororesin under continuous irradiation of UVC light for 1000H is less than 3%.

[0028] In one embodiment, the mass ratio of the fluororesin to the quartz is (5-20): (3-10), for example, 5:3, 5:6, 5:10, 10:3, 10:6, 10:10, 15:3, 15:6, 15:10, 20:3, 20:6, 20:10, etc. In this way, the refractive index of the filling layer 3 can be close to that of the lens 4, and the filling layer 3 can be bonded to the light-emitting chip 2 and the lens 4, thereby effectively improving the light extraction rate of the UVC LED.

[0029] In one embodiment, the fluororesin includes polytetrafluoroethylene.

[0030] In one embodiment, the particle size of the quartz is 2 μm-4 μm, for example, 2 μm, 2.2 μm, 2.4 μm, 2.6 μm, 2.8 μm, 3 μm, 3.2 μm, 3.4 μm, 3.6 μm, 3.8 μm, 4 μm, etc.

[0031] In one embodiment, the lens 4 is a quartz lens, so that the refractive index of the quartz lens and the filling layer 3 can be close to each other, and the light transmission loss caused by the different refractive indexes of the filling layer 3 and the lens 4 can be reduced.

[0032] In one embodiment, the thickness of the filling layer 3 is 70 μm-110 μm, for example, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, etc.

[0033] In one embodiment, the lens 4 is bonded to the packaging substrate 1 .

[0034] Accordingly, the present application provides a method for preparing a UVC LED, comprising the following steps: Providing a preform and a filling layer liquid, wherein the preform comprises a packaging substrate 1 and a light-emitting chip 2, wherein the light-emitting chip 2 is disposed on the packaging substrate 1, and the filling layer liquid comprises a fluororesin and quartz dispersed in a solvent, and the filling layer liquid is disposed on a surface of the light-emitting chip 2 on a side away from the packaging substrate 1; A lens 4 is provided, and the lens 4 is arranged on the side of the filling layer liquid away from the light-emitting chip 2. The filling layer liquid is heated and cured to form a filling layer 3. The two sides of the filling layer 3 are respectively bonded to the light-emitting chip 2 and the lens 4 to obtain a UVC LED.

[0035] In the present application, by dispersing fluororesin and quartz in a solvent, the fluororesin and quartz can be evenly mixed, and by setting a filling layer liquid between the light-emitting chip 2 and the lens 4, and then heating and curing, the formed filling layer 3 can be bonded to the light-emitting chip 2 and the lens 4. The filling layer liquid is set on the surface of the light-emitting chip 2 away from the packaging substrate 1 by applying the filling layer liquid to the surface of the light-emitting chip 2 with a dispensing machine.

[0036] In one embodiment, the particle size of the quartz is 2 μm-4 μm, for example, 2 μm, 2.2 μm, 2.4 μm, 2.6 μm, 2.8 μm, 3 μm, 3.2 μm, 3.4 μm, 3.6 μm, 3.8 μm, 4 μm, etc. In this way, the quartz and the fluororesin can be fully mixed.

[0037] In one embodiment, the lens 4 is a quartz lens.

[0038] In one embodiment, the mass ratio of the fluororesin, the quartz and the solvent is (5-20): (3-10): 100, for example, 5:3:100, 6:6:100, 7:10:100, 8:3:100, 9:6:100, 10:10:100, 11:3:100, 12:6:100, 13:10:100, 14:3:100, 15:6:100, 16:10:100, 17:3:100, 18:6:100, 19:10:100, 20:5:100, etc. In this way, the concentration of the filling layer liquid can be controlled so that it can be dispensed by a dispensing machine.

[0039] In one embodiment, the temperature of the heating and curing is 100°C-120°C, for example, 100°C, 102°C, 105°C, 107°C, 110°C, 112°C, 115°C, 117°C, 120°C, etc., and the time of the heating and curing is 8min-10min, for example, 8min, 8min, etc. In this way, the solvent can be fully volatilized, the filling layer liquid forms the filling layer 3, and is fully bonded to the light emitting chip 2 and the lens 4.

[0040] In one embodiment, the step of disposing the filling layer liquid on the surface of the light emitting chip 2 facing away from the packaging substrate 1 includes: The filling layer liquid is applied to the central area of ​​the surface of the light emitting chip 2 which is away from the packaging substrate 1 .

[0041] In the present application, the filling layer liquid is disposed on the surface of the light emitting chip 2 on the side away from the packaging substrate 1 by applying the filling layer liquid to the central area of ​​the light emitting chip 2 using a dispensing machine.

[0042] In one embodiment, the step of arranging the lens 4 on a side of the filling layer liquid facing away from the light emitting chip 2 includes: The lens 4 is disposed on a side of the filling layer liquid facing away from the light emitting chip 2 , and the lens 4 is in contact with a side of the filling layer liquid facing away from the light emitting chip 2 .

[0043] In the present application, the filling layer liquid will be affected by the gravity of the lens 4 , so that the formed filling layer 3 is fully fitted with the light emitting chip 2 and the lens 4 .

[0044] In one embodiment, the thickness of the filling layer 3 is 70 μm-110 μm, for example, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, etc.

[0045] Embodiment 1: A UVC LED and a method for preparing the same, comprising the following steps: (1) Add polytetrafluoroethylene to perfluorotributylamine (CAS No.: 311-89-7), mix well, then add quartz, stir well to obtain a filling layer liquid, in which the mass ratio of fluororesin and quartz (3μm) to solvent is 5:5:100; (2) providing a preform (the preform includes a ceramic packaging substrate 1 and a light-emitting chip 2, and the light-emitting chip 2 is disposed on the packaging substrate 1), and applying a filling layer liquid to the central area of ​​the surface of the light-emitting chip 2 on the side away from the packaging substrate 1 by using a dispensing machine, and covering the surface of the light-emitting chip 2 on the side away from the packaging substrate 1; (3) An edge-sealing glue 5 is provided on the surface of the packaging substrate 1 provided with the light-emitting chip 2, and a quartz lens 4 is attached to the side of the filling layer liquid facing away from the light-emitting chip 2, and the lens 4 is in contact with the side of the filling layer liquid facing away from the light-emitting chip 2, and the edge-sealing glue 5 is located between the lens 4 and the packaging substrate 1, and heated and cured at 110° C. for 9 min to form a filling layer 3 (with a thickness of 100 μm), thereby obtaining a UVC LED.

[0046] Example 2: This example is basically the same as Example 1, except that the mass ratio of fluororesin, quartz and solvent in this example is 12:3:100.

[0047] Example 3: This example is basically the same as Example 1, except that the mass ratio of fluororesin, quartz and solvent in this example is 20:10:100.

[0048] Example 4: This example is basically the same as Example 1, except that the temperature for heating and curing in this example is 100°C.

[0049] Example 5: This example is basically the same as Example 1, except that the temperature for heating and curing in this example is 120°C.

[0050] Embodiment 6: This embodiment is substantially the same as Embodiment 1, except that the thickness of the filling layer 3 in this embodiment is 70 μm.

[0051] Embodiment 7: This embodiment is substantially the same as Embodiment 1, except that in this embodiment, the thickness of the filling layer 3 is 110 μm.

[0052] Comparative Example 1 This comparative example is basically the same as Example 1, except that no filling layer 3 liquid is provided in this comparative example.

[0053] Comparative Example 2 This comparative example is basically the same as Example 1, except that in this comparative example, the fluororesin and quartz in the filling layer liquid are replaced with silica gel (purchased from Shenzhen Knowles Technology, model KLS-3319-9).

[0054] Test Case The UVC LEDs obtained in the embodiments and comparative examples were subjected to an initial power test, a power test after 1000 hours (1000H) of normal temperature lighting, and an aging attenuation test after 1000 hours (1000H) of normal temperature lighting. The test data are shown in Table 1.

[0055] Initial power test: The test was performed using an Avantis spectrometer. The test data is shown in Table 1.

[0056] Power test after 1000 hours (1000H) lighting at room temperature: The test was carried out using an Avantis spectrometer, and the test data is shown in Table 1.

[0057] Table 1. Test data Serial number Initial power (uW) Power after lighting at room temperature for 1000 hours (uW) 1000H normal temperature lighting aging attenuation ratio Example 1 32894.3 29986.1 -8.84% Example 2 32868.1 30259.7 -7.9% Example 3 34699.0 33128.2 -4.5% Example 4 32256.5 30242.3 -6.24% Example 5 32882.1 30519.6 -7.2% Example 6 34223.5 31199.7 -8.84% Example 7 32578.1 30071.7 -7.7% Comparative Example 1 24556.9 20685.1 -15.84% Comparative Example 2 24916.9 20196.4 -18.94% It can be seen from Table 1 that compared with Comparative Examples 1 and 2, the UVC LED in the embodiment has a higher initial power and a lower aging attenuation ratio after 1000H normal temperature lighting. It can be seen that the present application can increase the refractive index between the light-emitting chip and the lens by setting a filling layer composed of fluororesin and quartz between the light-emitting chip and the lens, thereby reducing the light conduction loss between the light-emitting chip and the lens and improving the light output rate.

[0058] The UVC LED and the preparation method thereof provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principle and implementation mode of the present application. The description of the above embodiments is only used to help understand the method and the core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation mode and the scope of application. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A UVC LED, characterized in that: include: Package substrate (1); A light-emitting chip (2) is arranged on the packaging substrate (1); A lens (4) is arranged on a side of the light-emitting chip (2) facing away from the packaging substrate (1); A filling layer (3) is arranged between the light-emitting chip (2) and the lens (4), and two sides of the filling layer (3) are respectively bonded to the light-emitting chip (2) and the lens (4), and the material of the filling layer (3) includes fluororesin and quartz.

2. The UVC LED according to claim 1, characterized in that The mass ratio of the fluororesin to the quartz is (5-20): (3-10); and / or The particle size of the quartz is 2 μm-4 μm; and / or The lens (4) is a quartz lens.

3. The UVC LED according to claim 1, characterized in that The thickness of the filling layer (3) is 70 μm-110 μm.

4. The UVC LED according to claim 1, characterized in that The lens (4) is bonded to the packaging substrate (1).

5. A method for preparing a UVC LED, characterized in that: The following steps are involved: Providing a preform and a filling layer liquid, the preform comprising a packaging substrate (1) and a light-emitting chip (2), the light-emitting chip (2) being arranged on the packaging substrate (1), the filling layer liquid comprising a fluororesin and quartz dispersed in a solvent, and the filling layer liquid being arranged on a surface of the light-emitting chip (2) on a side facing away from the packaging substrate (1); A lens (4) is provided, and the lens (4) is arranged on a side of the filling layer liquid facing away from the light-emitting chip (2), and the filling layer liquid is heated and solidified to form a filling layer (3), and the two sides of the filling layer (3) are respectively bonded to the light-emitting chip (2) and the lens (4), so as to obtain a UVC LED.

6. The method for preparing a UVC LED according to claim 5, characterized in that: The particle size of the quartz is 2 μm-4 μm; and / or The lens (4) is a quartz lens.

7. The method for preparing a UVC LED according to claim 6, characterized in that: The mass ratio of the fluororesin, the quartz and the solvent is (5-20):(3-10):

100.

8. The method for preparing a UVC LED according to claim 5, wherein: The temperature of the heating and curing is 100° C.-120° C., and the time of the heating and curing is 8 min-10 min.

9. The method for preparing a UVC LED according to claim 5, wherein: The step of arranging the filling layer liquid on the surface of the light-emitting chip (2) on a side facing away from the packaging substrate (1) comprises: The filling layer liquid is dotted onto the central area of ​​the surface of the light-emitting chip (2) on a side facing away from the packaging substrate (1).

10. The method for preparing a UVC LED according to claim 5, characterized in that: The step of arranging the lens (4) on a side of the filling layer liquid facing away from the light-emitting chip (2) comprises: The lens (4) is arranged on a side of the filling layer liquid facing away from the light-emitting chip (2), and the lens (4) is in contact with a side of the filling layer liquid facing away from the light-emitting chip (2).

Images