Display panel and display device

Abstract

The invention relates to a display panel and a display device, and the display panel comprises a substrate which comprises a first region and a second region which is located in the first region and is close to the edge of the display panel; the driving circuit layer is located on one side of the substrate, and the driving circuit layer comprises an insulating composite layer extending from the first area to the second area and a leading-out terminal located in the second area; wherein the insulating composite layer comprises a plurality of film layers, and the edge of at least one film layer of the insulating composite layer is overlapped with the leading-out terminal; the insulating composite layer comprises a first insulating layer and a second insulating layer located on the side, away from the substrate, of the first insulating layer. At least part of the edge of the first insulating layer is located on one side of the edge of the second insulating layer close to the edge of the display panel. The problem that the yield and reliability of the display panel are reduced can be solved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of display technology, in order to improve the display effect of display panels, narrow-border or even borderless display panels have gradually become one of the development directions of display technology.

[0003] However, when the width of the border is compressed to the extreme, cutting or grinding the edges of narrow-border or even borderless display panels will lead to reduced yield and reliability of the display panels. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a display device, aiming to solve the problem that cutting or edge grinding in a narrow-frame or even frameless display panel will lead to reduced yield and reliability of the display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel,

[0006] A substrate, comprising a first area and a second area located in the first area close to an edge of a display panel;

[0007] A driving circuit layer, located on one side of the substrate, the driving circuit layer comprising an insulating composite layer extending from the first area to the second area and a lead-out terminal located in the second area;

[0008] Wherein, the insulating composite layer comprises a plurality of film layers, and an edge of at least one film layer of the insulating composite layer overlaps with the lead terminal;

[0009] The insulating composite layer comprises a first insulating layer and a second insulating layer located on a side of the first insulating layer away from the substrate;

[0010] At least part of the edge of the first insulating layer is located on a side of the edge of the second insulating layer close to the edge of the display panel.

[0011] In a second aspect, an embodiment of the present application further provides a display device, which includes the display panel provided in the first aspect.

[0012] In the embodiments of the present application, in the first aspect, the edge of at least one film layer of the insulating composite layer overlaps with the lead terminal, and the lead terminal protects at least one film layer of the insulating composite layer to prevent water, oxygen, etc. from entering the center of the display panel through the film layer whose edge overlaps with the lead terminal, or at least one film layer of the insulating composite layer protects the lead terminal, and at least one film layer of the insulating composite layer prevents the side end surface of the lead terminal from being damaged by oxidation, etc., thereby improving the reliability of the display panel; at the same time, the lead terminal can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel. In the second aspect, at least part of the edge of the first insulating layer is located on the side of the edge of the second insulating layer close to the edge of the display panel, that is, the edge of the second insulating layer is retracted toward the inside of the display panel relative to at least part of the edge of the first insulating layer, reducing the number of film layers at the cutting or grinding point, and reducing the risk of cracks. At the same time, the retraction of the edge of part of the film layer can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 A first schematic top view of a display panel provided in an embodiment of the present application.

[0015] Figure 2 A first cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0016] Figure 3 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0017] Figure 4 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0018] Figure 5 A second schematic top view of a display panel provided in an embodiment of the present application.

[0019] Figure 6 A third schematic top view of a display panel provided in an embodiment of the present application.

[0020] Figure 7 A fourth schematic top view of a display panel provided in an embodiment of the present application.

[0021] Figure 8 A fifth schematic top view of a display panel provided in an embodiment of the present application.

[0022] Fig. 9 A sixth schematic top view of a display panel provided in an embodiment of the present application.

[0023] Fig.10 A fourth cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0024] Fig.11 A schematic diagram of a display device provided in some embodiments of the present application. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0027] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there may be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly under or there may be one or more intervening elements. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there may be one or more intervening elements.

[0028] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0029] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0030] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0031] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0032] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0033] As described in the background technology section, it is necessary to provide a display panel and a display device, which aims to solve the problem that in a narrow frame or even a frameless display panel, cutting or edge grinding may cause film cracks in the display panel, resulting in a decrease in the yield and reliability of the display panel. The inventors found that the reason for the above phenomenon is that as the frame is further reduced or a frameless setting is set, the film cracks caused by cutting or edge grinding can easily spread to the display area, causing display abnormalities, thereby reducing the manufacturing yield and reliability of the display panel.

[0034] Based on the above technical problems, the inventors have found that the substrate of the display panel includes a first area and a second area located in the first area near the edge of the display panel, the display panel includes a driving circuit layer, the driving circuit layer includes an insulating composite layer extending from the first area to the second area and a lead terminal located in the second area; the insulating composite layer includes a plurality of film layers, the edge of at least one film layer of the insulating composite layer overlaps with the lead terminal, the insulating composite layer includes a first insulating layer and a second insulating layer located on the side of the first insulating layer away from the substrate; at least part of the edge of the first insulating layer is located on the side of the edge of the second insulating layer close to the edge of the display panel. The inventors have found that by setting the edge of at least one film layer of the insulating composite layer to overlap with the lead terminal, the lead terminal protects at least one film layer of the insulating composite layer, or at least one film layer of the insulating composite layer protects the lead terminal, and the second insulating layer is retracted relative to at least part of the edge of the first insulating layer toward the inside of the display panel, the number of film layers at the cutting or grinding position is reduced, and the risk of crack generation can be reduced. At the same time, the retraction of the edge of some film layers can break the path for the crack to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0035] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be described clearly and completely below in conjunction with the drawings in the embodiments of this application. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] Figure 1 A first schematic top view of a display panel provided in an embodiment of the present application. Figure 2 A first cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Figure 3 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Figure 4 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Figure 2 and Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure along the first dotted line C1-C1. Figure 4 for Figure 1 Schematic diagram of the cross-sectional structure along the second dotted line C2-C2.

[0037] Figure 5 A second schematic top view of a display panel provided in an embodiment of the present application. Figure 6 A third schematic top view of a display panel provided in an embodiment of the present application. Figure 7 A fourth schematic top view of a display panel provided in an embodiment of the present application. Figure 8 A fifth schematic top view of a display panel provided in an embodiment of the present application. Fig. 9 A sixth schematic top view of a display panel provided in an embodiment of the present application.

[0038] Compared to Figure 1 , Figure 6 , Figure 7 and Figure 8 , Figure 5 and Fig. 9 The figure shows the state before cutting and before edge grinding. Figure 5 and Fig. 9 The boundaries (edges) of multiple film layers in the insulating composite layer, as well as the ground edges and cut edges are indicated by dotted lines. Fig. 9 for Figure 8 Schematic diagram showing the panel before cutting and before edge grinding.

[0039] Compared to Figure 1 and Figure 5 , Figures 6 to 9 The 10w slot is also shown.

[0040] In a first aspect, the present application provides a display panel 100, which includes a substrate 11 and a driving circuit layer, wherein the substrate 11 includes a first area A1 and a second area A2 located in the first area A1 near an edge D1 of the display panel; the driving circuit layer is located on one side of the substrate 11, and the driving circuit layer includes an insulating composite layer J10 extending from the first area A1 to the second area A2 and a lead terminal Pa located in the second area A2; wherein the insulating composite layer J10 includes a plurality of film layers, and an edge of at least one film layer of the insulating composite layer J10 overlaps with the lead terminal Pa; the insulating composite layer J10 includes a first insulating layer J1 and a second insulating layer J2 located on a side of the first insulating layer J1 away from the substrate 11; at least a portion of an edge of the first insulating layer J1 is located on a side of an edge of the second insulating layer J2 close to the edge D1 of the display panel.

[0041] For example, the driving circuit layer may include an insulating composite layer J10, a plurality of thin film transistors T1, and driving wiring structures.

[0042] For example, the first area A1 may display an image. In some embodiments, the second area A2 may also display an image.

[0043] For example, the display panel edge D1 is a cutting edge, a grinding edge, or a chamfered edge. For example, when the substrate 11 of the display panel 100 has no grinding edge, the display panel edge D1 is a cutting edge. For example, when the substrate 11 of the display panel 100 has a grinding edge, the display panel edge D1 is a grinding edge.

[0044] For example, in some embodiments, the lead-out terminal Pa is located in the second area A2, and the lead-out terminal Pa may be electrically connected to a driving chip or a circuit board.

[0045] For example, in some embodiments, in the spliced ​​display panel, the lead terminal Pa is located in the second area A2, and the lead terminal Pa may be electrically connected to another adjacent display panel.

[0046] For example, the edge of at least one film layer of the insulating composite layer J10 overlaps with the lead terminal Pa, and the lead terminal Pa protects at least one film layer of the insulating composite layer J10, preventing water, oxygen, etc. from entering the center of the display panel 100 through the film layer whose edge overlaps with the lead terminal Pa, or at least one film layer of the insulating composite layer J10 protects the lead terminal Pa, and at least one film layer of the insulating composite layer J10 prevents the side end surface of the lead terminal Pa from being damaged by oxidation, etc., thereby improving the reliability of the display panel. At the same time, the lead terminal Pa can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0047] For example, at least part of the edge of the first insulating layer J1 is located on the side of the edge of the second insulating layer J2 close to the edge D1 of the display panel, that is, the edge of the second insulating layer J2 is retracted toward the inside of the display panel 100 relative to at least part of the edge of the first insulating layer J1, thereby reducing the number of film layers at the cutting or grinding points and reducing the risk of crack generation. At the same time, the retracted edge of part of the film layer can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0048] In an embodiment of the present application, on the first aspect, an edge of at least one film layer of the insulating composite layer J10 overlaps with the lead terminal Pa, and the lead terminal Pa protects at least one film layer of the insulating composite layer J10 to prevent water, oxygen, and the like from entering the center of the display panel 100 through the film layer whose edge overlaps with the lead terminal Pa, or at least one film layer of the insulating composite layer J10 protects the lead terminal Pa, and at least one film layer of the insulating composite layer J10 prevents the side end surface of the lead terminal Pa from being damaged by oxidation, etc., thereby improving the reliability of the display panel; at the same time, the lead terminal Pa can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel. Secondly, at least part of the edge of the first insulating layer J1 is located on the side of the edge of the second insulating layer J2 close to the edge D1 of the display panel, that is, the edge of the second insulating layer J2 is retracted toward the inside of the display panel 100 relative to at least part of the edge of the first insulating layer J1, thereby reducing the number of film layers at the cutting or grinding points and reducing the risk of crack generation. At the same time, the retracted edge of part of the film layer can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0049] In some embodiments, the first insulating layer J1 is an organic material, and the second insulating layer J2 is an inorganic material.

[0050] For example, inorganic materials are prone to cracks during cutting or edge grinding. The first insulating layer J1 is an organic material, and the second insulating layer J2 is an inorganic material. That is, the edge of the second insulating layer J2 of the inorganic material is retracted relative to the edge of the first insulating layer J1 of the organic material, thereby reducing the number of film layers of the inorganic material at the cutting or edge grinding location, thereby reducing the risk of crack generation. At the same time, the retracted edge of the second insulating layer J2 of the inorganic material can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0051] In some embodiments, an edge of the first insulating layer J1 and an edge of the second insulating layer J2 both overlap with the lead-out terminal Pa.

[0052] For example, the edge of the first insulating layer J1 overlaps with the lead terminal Pa, and the first insulating layer J1 is an organic material. The lead terminal Pa protects the first insulating layer J1 and prevents water, oxygen, etc. from entering the center of the display panel 100 through the first insulating layer J1, thereby improving the reliability of the display panel.

[0053] For example, the edge of the second insulating layer J2 overlaps with the lead terminal Pa. The second insulating layer J2 is an inorganic material and can cover the edge of the lead terminal Pa to prevent the side end surface of the lead terminal Pa from being damaged by oxidation, thereby improving the reliability of the display panel.

[0054] In some embodiments, the first insulating layer J1 is a planar layer, and the second insulating layer J2 is a first passivation layer 27 .

[0055] By way of example, the first insulating layer J1 is a planar layer, and the first insulating layer J1 may be the first planar layer 23 and / or the second planar layer 25 .

[0056] In some embodiments, Figure 1 and 4 As shown, between two adjacent lead terminals Pa, the first passivation layer 27 covers the edge of the planar layer.

[0057] For example, the first passivation layer 27 is an inorganic material. When the display panel 100 includes only the first flat layer 23, the first passivation layer 27 covers the edge of the first flat layer 23, which can prevent water, oxygen, etc. from entering the center of the display panel 100 through the first flat layer 23. For example, the first passivation layer 27 is an inorganic material. When the display panel 100 includes the first flat layer 23 and the second flat layer 25, the first passivation layer 27 covers the edge of the first flat layer 23 and the edge of the second flat layer 25, which can prevent water, oxygen, etc. from entering the center of the display panel 100 through the first flat layer 23 and the second flat layer 25.

[0058] In some embodiments, the first insulating layer J1 includes a first planar layer 23 and a second planar layer 25 , and the distance from the orthographic projection of the edge of the first planar layer 23 on the substrate 11 to the orthographic projection of the edge of the second planar layer 25 on the substrate 11 is 3 μm to 50 μm.

[0059] For example, Figure 2 As shown, the first insulating layer J1 includes a first flat layer 23 and a second flat layer 25. The distance from the orthographic projection of the edge of the first flat layer 23 on the substrate 11 to the orthographic projection of the edge of the second flat layer 25 on the substrate 11 is a second distance d2. The second distance d2 is 3 microns to 50 microns. For example, the second distance d2 can be any value of 3 microns, 5 microns, 10 microns, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns and 50 microns.

[0060] For example, the edge of the second flat layer 25 is located on the side of the edge of the first flat layer 23 close to the edge D1 of the display panel, and on the plane parallel to the substrate 11, the second distance d2 is 3 microns to 50 microns, so that a relatively flat slope is formed, so that the film layer of the second flat layer 25 away from the substrate 11 can be well placed on the edge of the second flat layer 25 and the edge of the first flat layer 23 without being easily broken.

[0061] In some embodiments, the insulating composite layer J10 further includes a third insulating layer J3 located on the side of the first insulating layer J1 facing the substrate 11, the third insulating layer J3 is an inorganic material, and an edge of the third insulating layer J3 is located on the side of the lead-out terminal Pa close to the display panel edge D1.

[0062] For example, Figure 2 As shown, the third insulating layer J3 is the second passivation layer 22. The third insulating layer J3 can be located on the side of the partial sub-lead-out pattern Pa1 of the lead-out terminal Pa close to the substrate 11. At this time, the edge of the third insulating layer J3 is located on the side of the partial sub-lead-out pattern Pa1 of the lead-out terminal Pa close to the edge D1 of the display panel. The third insulating layer J3 can carry the partial sub-lead-out pattern Pa1 of the lead-out terminal Pa. The third insulating layer J3 can protect the film layer of the third insulating layer J3 close to the substrate 11, thereby preventing water and oxygen from entering the center of the display panel.

[0063] In some embodiments, the distance between the edge of the third insulating layer J3 and the edge D1 of the display panel is greater than zero.

[0064] For example, Figure 2As shown, the distance between the edge of the third insulating layer J3 and the edge D1 of the display panel is a fourth distance d4, and the fourth distance d4 is greater than 0. The edge of the third insulating layer J3 is retracted relative to the edge D1 of the display panel, thereby reducing the number of film layers at the cutting or grinding points, and reducing the risk of crack generation. At the same time, the retracted edge of the third insulating layer J3 can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0065] For example, Figure 2 As shown, the third insulating layer J3 is the second passivation layer 22, the edge of the third insulating layer J3 is located on the side of the lead terminal Pa close to the display panel edge D1, the distance between the edge of the third insulating layer J3 and the lead terminal Pa is the third distance d3, and the third distance d3 is greater than or equal to 1 micron.

[0066] In some embodiments, the end surface of the substrate 11 includes a first end surface D10, the first end surface D10 includes a first sub-end surface D11 and a second sub-end surface D12, the first area A1, the second area A2, the first sub-end surface D11 and the second sub-end surface D12 are connected in sequence, the first sub-end surface D11 is inclined relative to the second area A2, and the angle between the first sub-end surface D11 and the surface of the second area A2 is an obtuse angle; the distance from the edge of the third insulating layer J3 to the first sub-end surface D11 is greater than 0.

[0067] For example, in some implementations, the embodiments of the present application focus on setting a display panel edge D1 at the lead terminal Pa, and the display panel edge D1 at the lead terminal Pa includes a first end surface D10, and the first end surface D10 includes a first sub-end surface D11 and a second sub-end surface D12.

[0068] For example, in some embodiments, Figure 2 As shown, the substrate 11 forms a first sub-end surface D11 and a second sub-end surface D12 by grinding or chamfering. The angle between the first sub-end surface D11 and the surface of the second area A2 is a first angle α, which is an obtuse angle and can prevent the film layer on one side of the second area A2 from collapsing.

[0069] For example, in some embodiments, the first end surface D10 includes a first sub-end surface D11, a second sub-end surface D12 and a third sub-end surface D13, and the first area A1, the second area A2, the first sub-end surface D11, the third sub-end surface D13 and the second sub-end surface D12 are connected in sequence.

[0070] For example, in some embodiments, Figure 2 As shown, the width of the first sub-end surface D11 may be different from the width of the third sub-end surface D13. Figure 3As shown, the width of the first sub-end surface D11 may be equal to the width of the third sub-end surface D13.

[0071] For example, the distance from the edge of the third insulating layer J3 to the first sub-end surface D11 is greater than 0 (the distance from the edge of the second passivation layer 22 to the first sub-end surface D11 is greater than 0), that is, the fourth distance d4 is greater than 0, thereby avoiding edge grinding or chamfering to cause cracks in the third insulating layer J3, thereby improving the manufacturing yield and reliability of the display panel 100.

[0072] In some embodiments, Figure 1 and Figure 2 As shown, the driving circuit layer also includes a first conductive layer 26, which is arranged between the second insulating layer J2 and the first insulating layer J1; the display panel 100 also includes a plurality of light-emitting elements F1, which are arranged on a side of the driving circuit layer away from the substrate 11; wherein the first conductive layer 26 includes a plurality of first connecting electrodes 261 at least located in the first area A1, the second insulating layer J2 includes a plurality of first insulating openings 271, the first insulating openings 271 expose at least part of the corresponding first connecting electrodes 261, and the light-emitting elements F1 are electrically connected to the corresponding first connecting electrodes 261.

[0073] For example, Figure 3 As shown, the light emitting element F1 may be a light emitting diode (LED), a micro light emitting diode (MicroLED), or a mini light emitting diode (Min LED), but is not limited thereto. The light emitting element F1 may also be other types of light emitting units.

[0074] For example, Figure 1 and Figure 2 As shown, the second insulating layer J2 is a first passivation layer 27, and the second insulating layer J2 includes a plurality of first insulating openings 271, which expose at least a portion of the corresponding first connecting electrodes 261, and the light-emitting element F1 can be electrically connected to the first connecting electrodes 261 through bonding metal or the like.

[0075] For example, Figure 3 As shown, the light-emitting element F1 may include an anode and a cathode, and the anode and the cathode may be electrically connected to the corresponding first connection electrode 261 respectively through a bonding metal, etc., and at least one of the anode and the cathode may be electrically connected to the thin film transistor T1 in the corresponding pixel driving circuit through the corresponding first connection electrode 261, which is not limited here.

[0076] In some embodiments, the first conductive layer 26 includes a first sub-lead-out pattern 262 located in the second area A2 , and the lead-out terminal Pa is at least constituted by the first sub-lead-out pattern 262 .

[0077] For example, Figure 2As shown, the distance from the edge of the first passivation layer 27 to the edge of the first sub-lead-out pattern 262 close to the first area A1 is a first distance d1, and the first distance d1 is greater than or equal to 0.5 micrometers.

[0078] In some embodiments, the driving circuit layer includes at least one sub-lead-out pattern Pa1 constituting a lead-out terminal Pa, and in a direction perpendicular to the plane of the substrate 11, the sub-lead-out pattern Pa1 farthest from the substrate 11 is away from an edge of the first area A1, and the distance to the second area A2 away from the edge of the first area A1 is 30 to 200 microns.

[0079] For example, Figure 2 For example, the first sub-leading pattern 262 is the sub-leading pattern Pa1 farthest from the substrate 11, and the sub-leading pattern Pa1 farthest from the substrate 11 is far away from the edge of the first area A1, and the distance from the second area A2 far away from the edge of the first area A1 is 30 to 200 microns ( Figure 2 The sum of the third distance d3 and the fourth distance d4 is 30 to 200 microns), which can avoid cutting or grinding to damage the integrity of the sub-lead pattern Pa1 farthest from the substrate 11, and avoid poor electrical connection between the lead terminal Pa and the driver chip, circuit board or other display panels involved in the splicing.

[0080] In some embodiments, the driving circuit layer includes a thin film transistor layer 10, a first flat layer 23, a first conductive layer 26, and a first passivation layer 27. The thin film transistor layer 10 includes a plurality of thin film transistors; the first flat layer 23 is disposed on a side of the thin film transistor layer 10 away from the substrate 11, and the first insulating layer J1 is the first flat layer 23; the first conductive layer 26 is disposed on a side of the first flat layer 23 away from the substrate 11, and the first conductive layer 26 includes a first connection electrode 261; and the first passivation layer 27 is disposed on a side of the first conductive layer 26 away from the substrate 11.

[0081] For example, Figure 2 As shown, the thin film transistor layer 10 includes a source electrode 212 and a drain electrode 211 , and a film layer between the source electrode 212 and the substrate 11 .

[0082] For example, in some embodiments, the driving circuit layer only includes the first planar layer 23 (excluding the second planar layer 25), and the first planar layer 23 is an organic material. The thin film transistor layer 10, the first planar layer 23, the first conductive layer 26 and the first passivation layer 27 are sequentially stacked on one side of the substrate 11.

[0083] For example, the first insulating layer J1 is the first flat layer 23, the second insulating layer J2 is the first passivation layer 27, the edges of the first flat layer 23 and the edges of the second insulating layer J2 are both retracted, reducing the number of film layers at the cutting or edge grinding locations, and reducing the risk of cracks. At the same time, the retraction of the edges of some film layers can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel. At the same time, there is no organic material at the cutting or edge grinding locations, preventing external water and oxygen from entering the interior of the display panel through the organic materials, and improving the reliability of the display panel.

[0084] In some embodiments, the driving circuit layer also includes a second flat layer 25 and a second conductive layer 24, the second flat layer 25 is arranged between the first flat layer 23 and the first conductive layer 26, the edge of the first flat layer 23 is located on the side of the edge of the second flat layer 25 close to the edge of the display panel 100, and the second flat layer 25 is an organic material; the second conductive layer 24 is arranged between the first flat layer 23 and the second flat layer 25, the second conductive layer 24 includes a plurality of second connecting electrodes 241, and the first connecting electrode 261 is electrically connected to the corresponding thin film transistor T1 through the second connecting electrode 241; wherein the edge of the first flat layer 23 and the edge of the second flat layer 25 both overlap with the lead-out terminal Pa.

[0085] For example, in some embodiments, the driving circuit layer includes a first flat layer 23 and a second flat layer 25, both of which are organic materials. The thin film transistor layer 10, the first flat layer 23, the second conductive layer 24, the second flat layer 25, the first conductive layer 26 and the first passivation layer 27 are sequentially stacked on one side of the substrate 11.

[0086] For example, the edge of the first flat layer 23 and the edge of the second flat layer 25 overlap with the lead-out terminal Pa, and the edge of the first flat layer 23 and the edge of the second flat layer 25 are both retracted relative to the edge D1 of the display panel at the cutting or grinding part, so that there is no organic material at the cutting or grinding part, which prevents external water and oxygen from entering the interior of the display panel through the organic material, thereby improving the reliability of the display panel. At the same time, at least part of the sub-lead-out pattern Pa1 of the lead-out terminal Pa covers the edge of the first flat layer 23 and the edge of the second flat layer 25, so that the lead-out terminal Pa has a protective effect on the edge of the first flat layer 23 and the edge of the second flat layer 25, and can prevent water and oxygen from entering the center of the display panel through the edge of the first flat layer 23 and the edge of the second flat layer 25.

[0087] It should be noted that when the substrate 11 is not edged or chamfered, the first end surface D10 of the substrate 11 is the display panel edge D1. When the substrate 11 is edged or chamfered, the edge of the first sub-end surface D11 close to the second area A2 is the display panel edge D1.

[0088] It should be noted that, in the display panel 100, at least the edge area on the side where the lead-out terminal Pa is provided is as follows: Figures 2 to 4 Cross-sectional structure.

[0089] In some embodiments, the first conductive layer 26 includes a first sub-lead-out pattern 262 located in the second area A2, the second conductive layer 24 includes a second sub-lead-out pattern 242 located in the second area A2, the lead-out terminal Pa is composed of at least the first sub-lead-out pattern 262 and the second sub-lead-out pattern 242, and the first sub-lead-out pattern 262 and the second sub-lead-out pattern 242 are stacked in direct contact.

[0090] For example, the lead-out terminal Pa is composed of at least the first sub-lead-out pattern 262 and the second sub-lead-out pattern 242 , which can increase the thickness of the lead-out terminal Pa and reduce the resistance of the lead-out terminal Pa in transmitting electrical signals.

[0091] For example, the film layer between the first conductive layer 26 and the second conductive layer 24 is the second flat layer 25, the second flat layer 25 is an organic material, and the edge of the second flat layer 25 is retracted relative to the edge D1 of the display panel, so that the first sub-lead-out pattern 262 and the second sub-lead-out pattern 242 are stacked in direct contact.

[0092] In some embodiments, the thin film transistor layer 10 includes: a semiconductor layer 14, located between the substrate 11 and the first flat layer 23; a first gate insulating layer 15, located between the semiconductor layer 14 and the first flat layer 23; a first metal layer 16, located between the first gate insulating layer 15 and the first flat layer 23; a first interlayer insulating layer 17, located between the first metal layer 16 and the first flat layer 23; a second metal layer 18, located between the first interlayer insulating layer 17 and the first flat layer 23; a second interlayer insulating layer 19, located between the second metal layer 18 and the first flat layer 23; a third metal layer 21, located between the second interlayer insulating layer 19 and the first flat layer 23; wherein the semiconductor layer 14 includes a semiconductor portion 141 of the thin film transistor T1, the first metal layer 16 includes a first gate 161 of the thin film transistor T1, the second metal layer 18 includes a capacitor electrode 181, and the third metal layer 21 includes a source 212 and a drain 211 of the thin film transistor T1.

[0093] For example, Figure 2As shown, at least in the first area A1, the film structure of the display panel 100 includes a semiconductor layer 14, a first gate insulating layer 15, a first metal layer 16, a first interlayer insulating layer 17, a second metal layer 18, a second interlayer insulating layer 19, a third metal layer 21, a second passivation layer 22, a first flat layer 23, a second conductive layer 24, a second flat layer 25, a first conductive layer 26 and a first passivation layer 27, which are sequentially arranged on one side of the substrate. The semiconductor layer 14 includes a semiconductor portion 141, the first metal layer 16 includes a first gate 161, the second metal layer 18 includes a capacitor electrode 181, the third metal layer 21 includes a source 212 and a drain 211 of the thin film transistor T1, the second conductive layer 24 includes a second connection electrode 241 and a second sub-lead-out pattern 242, and the first conductive layer 26 includes a first connection electrode 261 and a first sub-lead-out pattern 262.

[0094] It should be noted that in Figure 2 In an example, in some embodiments, the display panel 100 may include only one of the first planar layer 23 and the second planar layer 25 .

[0095] It should be noted that in Figure 2 In the example, in some embodiments, the film structure of the display panel 100 may further include a fourth metal layer 12 and a second gate insulating layer 13, the fourth metal layer 12 is disposed between the semiconductor layer 14 and the substrate 11, and the second gate insulating layer 13 is disposed between the fourth metal layer 12 and the semiconductor layer 14. The fourth metal layer 12 may include a second gate 121, and the thin film transistor T1 may be a dual-gate thin film transistor, and the thin film transistor T1 includes a first gate 161, a first gate insulating layer 15, a second gate 121, a second gate insulating layer 13, a source 212, and a drain 211.

[0096] It should be noted that in Figure 2 In the example, in some embodiments, the thin film transistor T1 may also be other structures, for example, the thin film transistor T1 may be a bottom gate transistor or a top gate transistor, for example, the thin film transistor T1 may be a single gate design or a double gate design, which is not limited here.

[0097] In some embodiments, the first conductive layer 26 includes a first sub-lead-out pattern 262 located in the second area A2, the third metal layer 21 includes a third sub-lead-out pattern 213 located in the second area A2, and the first metal layer 16 includes a fourth sub-lead-out pattern 162 located in the second area A2; the lead-out terminal Pa is composed of at least the first sub-lead-out pattern 262, the third sub-lead-out pattern 213 and the fourth sub-lead-out pattern 162.

[0098] For example, the lead terminal Pa is composed of at least the first sub-lead pattern 262, the third sub-lead pattern 213 and the fourth sub-lead pattern 162, which can increase the thickness of the lead terminal Pa and reduce the resistance of the lead terminal Pa in transmitting electrical signals.

[0099] For example, Figure 2 As shown, the lead-out terminal Pa may be composed of a first sub-lead-out pattern 262 , a second sub-lead-out pattern 242 , a third sub-lead-out pattern 213 and a fourth sub-lead-out pattern 162 .

[0100] It should be noted that, in some embodiments, Figure 2 As shown, at least one sub-leading pattern Pa1 is exposed at an edge D1 of the display panel, for example Figure 2 The edge of the fourth sub-lead-out pattern 162 is exposed at the edge D1 of the display panel. This design is used to lead the signal to the periphery of the display panel 100 for monitoring during the manufacturing process. However, in actual products, the pattern that exceeds the boundary of cutting or grinding is no longer retained on the display panel 100.

[0101] In some embodiments, Figure 6 and Figure 7 As shown, the display panel 100 further includes a plurality of trenches 10 w , which are located at least in the second area A2 and between two adjacent lead terminals Pa. The trenches 10 w penetrate the first gate insulating layer 15 , the first interlayer insulating layer 17 and the second interlayer insulating layer 19 .

[0102] For example, Figure 6 As shown, when the groove 10w is not connected to the edge D1 of the display panel, the groove 10w is located in the second area A2 and between two adjacent lead terminals Pa, which reduces the number of inorganic material film layers at the groove 10w and interrupts the path for the crack to propagate to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0103] For example, Figure 2 As shown, the drain 211 is connected to the semiconductor portion 141 through a through hole th1 penetrating the first gate insulating layer 15, the first interlayer insulating layer 17 and the second interlayer insulating layer 19. The through hole th1 and the trench 10w can be formed in the same manufacturing process, thereby simplifying the manufacturing process.

[0104] In some embodiments, Figure 7 As shown, a groove 10w is dug in parallel with the plane where the substrate 11 is located to connect to the edge D1 of the display panel.

[0105] For example, Figure 7As shown, the groove 10w is connected to the edge D1 of the display panel, that is, at the groove 10w, at the cutting or grinding point, the number of inorganic material film layers at the cutting or grinding point is reduced, which can reduce the risk of cracks, thereby improving the yield and reliability of the display panel.

[0106] It should be noted that in Figure 5 and Fig. 9 In the figure, the first boundary 27bj represents the edge of the first passivation layer 27, the second boundary 22bj represents the edge of the second passivation layer 22, the display panel edge D1 represents the edge grinding edge, the first sub-end surface D11 represents the edge grinding area, and the second sub-end surface D12 represents the cutting line. The portion of the cutting line or the edge grinding edge away from the first sub-leading pattern 262 is the portion removed from the display panel 100. For example, Figure 8 and Fig. 9 , Figure 8 for Fig. 9 Schematic diagram of the display panel after removing the parts other than the edge grinding edges.

[0107] It should be noted that please combine Figure 2 , Figure 3 and Figure 5 As shown, in some embodiments, by comparing with the plane parallel to the substrate 11 or the orthographic projection on the substrate 11, before cutting and edge grinding, the second passivation layer 22 and the first passivation layer 27 are grooved to remove the film layer of some parts; the second passivation layer 22 is grooved, and the upper boundary (second boundary 22bj) of the groove is located at the lower edge of the side signal lead-out terminal (first sub-lead-out pattern 262), that is, after cutting, the second boundary 22bj of the second passivation layer 22 is located on the side of the first sub-lead-out pattern 262 close to the edge D1 of the display panel; the first passivation layer 27 is grooved, and the large groove of the first passivation layer 27 exposes most of the side lead-out terminal (first sub-lead-out pattern 262). Sub-lead-out pattern 262), at this time, the distance between the upper boundary of the first passivation layer 27 (first boundary 27bj) and the edge of the side signal lead-out terminal (first sub-lead-out pattern 262) away from the edge D1 of the display panel is a first distance d1. At this time, it can be seen that the size relationship between the groove of the second passivation layer 22 and the groove of the first passivation layer 27 is larger. It should also be noted that at this time, there is a metal lead-out line (fourth sub-lead-out pattern 162) on the grounded edge. This design is used to lead the signal to the periphery of the screen for monitoring during the manufacturing process, but in actual products, the graphics exceeding the grounded edge are no longer retained on the display panel.

[0108] Please note that, please compare Figure 7 and Figure 8 and Fig. 9At the same time, considering the existence of the metal lead wire (the fourth sub-lead pattern 162), in order to further reduce the film layer stacking structure (reduce the number of film layers) in the side edge grinding area, a groove 10w is opened between adjacent metal lead wires (the fourth sub-lead pattern 162), that is, Figure 8 and Fig. 9 The middle trench 10w is disposed between two adjacent fourth sub-lead-out patterns 162 to reduce the risk of cracks and film peeling during the edge grinding process. The through hole th1 and the trench 10w can be formed in the same manufacturing process, thereby simplifying the manufacturing process.

[0109] It should be noted that Figure 7 and Fig. 9 The fourth sub-lead-out pattern 162 is illustrated as a metal lead-out line, and patterns of other conductive layers or metal layers may also be used as metal lead-out lines.

[0110] Fig.10 A fourth cross-sectional schematic diagram of a display panel provided in an embodiment of the present application. Fig.10 for Figure 1 Schematic diagram of the cross-sectional structure along the first dotted line C1-C1.

[0111] In some embodiments, Fig.10 As shown, the first insulating layer J1 is an inorganic material, and the second insulating layer J2 is an organic material.

[0112] For example, Fig.10 As shown, at least part of the edge of the first insulating layer J1 is located on the side of the edge of the second insulating layer J2 close to the edge D1 of the display panel, the first insulating layer J1 is an inorganic material, the second insulating layer J2 is an organic material, the edge of the second insulating layer J2 is retracted relative to the edge D1 of the display panel, and the edge of the second insulating layer J2 overlaps with the lead-out terminal Pa, which can prevent water, oxygen, etc. from entering the center of the display panel 100 through the second insulating layer J2.

[0113] In some embodiments, Fig.10 As shown, the edge of the second insulating layer J2 overlaps the lead-out terminal Pa, and the edge of the first insulating layer J1 is located on the side of the lead-out terminal Pa close to the edge D1 of the display panel.

[0114] For example, Fig.10 As shown, the edge of the first insulating layer J1 is located on the side of the lead-out terminal Pa close to the edge D1 of the display panel. The first insulating layer J1 is an inorganic material. The first insulating layer J1 can carry a partial sub-lead-out pattern of the lead-out terminal Pa. The first insulating layer J1 can protect the film layer of the first insulating layer J1 close to the substrate 11, thereby preventing water and oxygen from entering the center of the display panel.

[0115] In some embodiments, Fig.10As shown, the driving circuit layer includes a thin film transistor layer 10, a second passivation layer 22 and a first planar layer 23. The thin film transistor layer 10 includes a plurality of thin film transistors T1; the second passivation layer 22 is disposed on a side of the thin film transistor layer 10 away from the substrate 11, and the first insulating layer J1 is the second passivation layer 22; the first planar layer 23 is disposed on a side of the second passivation layer away from the substrate 11, and the second insulating layer J2 is the first planar layer 23.

[0116] It should be noted that in Fig.10 In the illustrated implementation, the distance between the edge of the second passivation layer 22 and the edge D1 of the display panel is a fourth distance d4, and the fourth distance d4 is greater than 0. The edge of the second passivation layer 22 is retracted relative to the edge D1 of the display panel, thereby reducing the number of film layers at the cutting or grinding points, and reducing the risk of crack generation. At the same time, the retracted edge of the second passivation layer 22 can break the path for the cracks to be transmitted to the center of the display panel, thereby improving the yield and reliability of the display panel.

[0117] It should be noted that in Fig.10 In the illustrated implementation, the following may also be included: Figures 2 to 9 The same or similar features in the examples have the same or similar effects and will not be described in detail here.

[0118] See also Fig.11 , Fig.11 A schematic diagram of a display device provided in some embodiments of the present application.

[0119] On the second aspect, based on the same application concept, the present application also provides a display device 200, the display device 200 includes any one of the display panels 100 described above, or the display device 200 includes a display panel 100 that combines any several of the features described above.

[0120] For example, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiment. The similarities can be understood by referring to the above explanation of the display panel 100 and will not be described in detail below.

[0121] For example, the display device 200 provided in the embodiment of the present application can be Fig.11 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptops, desktop displays, tablet computers, digital cameras, smart bracelets, smart glasses, car displays, industrial control equipment, medical display screens, touch interactive terminals, etc. The embodiments of the present application do not specifically limit this.

[0122] For example, the display device 200 may be a spliced ​​display device, and the display device 200 may include a spliced ​​display panel, and the spliced ​​display panel includes any one of the display panels 100 described above, and the display panel 100 may be a narrow-frame display panel or a frameless display panel.

[0123] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0124] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a first area and a second area located in the first area close to an edge of a display panel; A driving circuit layer, located on one side of the substrate, the driving circuit layer comprising an insulating composite layer extending from the first area to the second area and a lead-out terminal located in the second area; Wherein, the insulating composite layer comprises a plurality of film layers, and an edge of at least one film layer of the insulating composite layer overlaps with the lead terminal; The insulating composite layer comprises a first insulating layer and a second insulating layer located on a side of the first insulating layer away from the substrate; At least part of the edge of the first insulating layer is located on a side of the edge of the second insulating layer close to the edge of the display panel.

2. The display panel according to claim 1, characterized in that: The first insulating layer is made of an organic material, and the second insulating layer is made of an inorganic material.

3. The display panel according to claim 2, characterized in that: The edge of the first insulating layer and the edge of the second insulating layer both overlap with the lead terminal.

4. The display panel according to claim 2, characterized in that: The first insulating layer is a planar layer, and the second insulating layer is a first passivation layer.

5. The display panel according to claim 4, characterized in that: Between two adjacent lead terminals, the first passivation layer covers an edge of the planar layer.

6. The display panel according to claim 4, characterized in that: The first insulating layer includes a first flat layer and a second flat layer, and the distance from the orthographic projection of the edge of the first flat layer on the substrate to the orthographic projection of the edge of the second flat layer on the substrate is 3 micrometers to 50 micrometers.

7. The display panel according to claim 3, characterized in that: The insulating composite layer further includes a third insulating layer located on the side of the first insulating layer facing the substrate, the third insulating layer is an inorganic material, and an edge of the third insulating layer is located on a side of the lead-out terminal close to an edge of the display panel.

8. The display panel according to claim 7, characterized in that: The distance between the edge of the third insulating layer and the edge of the display panel is greater than 0.

9. The display panel according to claim 8, characterized in that: The end surface of the substrate includes a first end surface, the first end surface includes a first sub-end surface and a second sub-end surface, the first region, the second region, the first sub-end surface and the second sub-end surface are connected in sequence, the first sub-end surface is inclined relative to the second region, and the angle between the first sub-end surface and the surface of the second region is an obtuse angle; The distance from the edge of the third insulating layer to the first sub-end surface is greater than 0.

10. The display panel according to claim 4, characterized in that: The driving circuit layer further includes a first conductive layer, and the first conductive layer is arranged between the second insulating layer and the first insulating layer; The display panel further comprises a plurality of light emitting elements, wherein the plurality of light emitting elements are arranged on a side of the driving circuit layer away from the substrate; The first conductive layer includes a plurality of first connecting electrodes at least located in the first region, the second insulating layer includes a plurality of first insulating openings, the first insulating openings expose at least a portion of the corresponding first connecting electrodes, and the light-emitting element is electrically connected to the corresponding first connecting electrodes.

11. The display panel according to claim 10, characterized in that: The first conductive layer includes a first sub-lead-out pattern located in the second region, and the lead-out terminal is at least formed by the first sub-lead-out pattern.

12. The display panel according to claim 1, characterized in that: The driving circuit layer includes at least one sub-lead-out pattern constituting the lead-out terminal. In a direction perpendicular to the plane where the substrate is located, the sub-lead-out pattern farthest from the substrate is away from the edge of the first area, and the distance to the second area away from the edge of the first area is 30 to 200 microns.

13. The display panel according to claim 4, characterized in that: The driving circuit layer comprises: a thin film transistor layer, comprising a plurality of thin film transistors; A first planar layer is disposed on a side of the thin film transistor layer away from the substrate, and the first insulating layer is the first planar layer; A first conductive layer, disposed on a side of the first flat layer away from the substrate, the first conductive layer comprising a first connecting electrode; The first passivation layer is arranged on a side of the first conductive layer away from the substrate.

14. The display panel according to claim 13, characterized in that: The driving circuit layer also includes: a second flat layer, disposed between the first flat layer and the first conductive layer, wherein an edge of the first flat layer is located on a side of an edge of the second flat layer close to an edge of the display panel, and the second flat layer is made of an organic material; a second conductive layer, disposed between the first planar layer and the second planar layer, the second conductive layer comprising a plurality of second connecting electrodes, the first connecting electrodes being electrically connected to the corresponding thin film transistors through the second connecting electrodes; Wherein, an edge of the first flat layer and an edge of the second flat layer both overlap with the lead-out terminal.

15. The display panel according to claim 14, characterized in that: The first conductive layer includes a first sub-lead-out pattern located in the second area, the second conductive layer includes a second sub-lead-out pattern located in the second area, the lead terminal is composed of at least the first sub-lead-out pattern and the second sub-lead-out pattern, and the first sub-lead-out pattern and the second sub-lead-out pattern are stacked in direct contact.

16. The display panel according to claim 13, characterized in that: The thin film transistor layer comprises: A semiconductor layer, located between the substrate and the first planar layer; A first gate insulating layer, located between the semiconductor layer and the first planar layer; A first metal layer, located between the first gate insulating layer and the first planar layer; A first interlayer insulating layer, located between the first metal layer and the first planar layer; A second metal layer, located between the first interlayer insulating layer and the first planar layer; A second interlayer insulating layer, located between the second metal layer and the first planar layer; a third metal layer, located between the second interlayer insulating layer and the first planar layer; The semiconductor layer includes the semiconductor part of the thin film transistor, the first metal layer includes the first gate of the thin film transistor, the second metal layer includes the capacitor electrode, and the third metal layer includes the source and drain of the thin film transistor.

17. The display panel according to claim 16, characterized in that: The first conductive layer includes a first sub-leading pattern located in the second area, the third metal layer includes a third sub-leading pattern located in the second area, and the first metal layer includes a fourth sub-leading pattern located in the second area; The lead terminal is composed of at least the first sub-lead pattern, the third sub-lead pattern, and the fourth sub-lead pattern.

18. The display panel according to claim 16, characterized in that: The display panel further includes a plurality of trenches, wherein the trenches are located at least in the second region and between two adjacent lead terminals, and the trenches penetrate the first gate insulating layer, the first interlayer insulating layer, and the second interlayer insulating layer.

19. The display panel according to claim 18, characterized in that: The groove is connected to the edge of the display panel in parallel with the plane where the substrate is located.

20. The display panel according to claim 1, characterized in that: The first insulating layer is made of inorganic material, and the second insulating layer is made of organic material.

21. The display panel according to claim 20, characterized in that: The edge of the second insulating layer overlaps the lead terminal, and the edge of the first insulating layer is located on a side of the lead terminal close to an edge of the display panel.

22. The display panel according to claim 21, characterized in that: The driving circuit layer comprises: a thin film transistor layer, comprising a plurality of thin film transistors; A second passivation layer is disposed on a side of the thin film transistor layer away from the substrate, and the first insulating layer is the second passivation layer; The first planar layer is arranged on a side of the second passivation layer away from the substrate, and the second insulating layer is the first planar layer.

23. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 22.

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