Display panel and display device

Abstract

The invention provides a display panel and a display device, and relates to the technical field of display, and the display panel comprises an array substrate which comprises a first surface and a second surface which are oppositely arranged along a direction perpendicular to a light emitting surface of the display panel, and a side surface which is connected with the first surface and the second surface; the side surfaces comprise a first side surface and a second side surface; the first bonding pad is located on the first surface, and the second bonding pad is located on the second surface; the connecting wire is at least positioned on the first side surface and is used for connecting the first bonding pad and the second bonding pad; the second side surface is not provided with a connecting wire; the packaging structures at least cover the side faces of the array substrate, and the packaging structures located on the first side faces are different from the packaging structures located on the second side faces. Therefore, the manufacturing process is simplified, and the production cost is reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] With the continuous development of science and technology, more and more display products, such as mobile phones, tablets, laptops and smart wearable devices, are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable tool for people today.

[0003] At present, how to save production costs while ensuring product quality has become one of the technical problems that need to be solved urgently at this stage. Summary of the invention

[0004] In order to solve the above technical problems, the present disclosure provides a display panel and a display device, aiming to improve the packaging reliability of display products while reducing production costs.

[0005] In a first aspect, the present disclosure provides a display panel, comprising:

[0006] An array substrate, comprising a first surface and a second surface arranged opposite to each other in a direction perpendicular to the light emitting surface of the display panel, and a side surface connecting the first surface and the second surface; the side surface comprises a first side surface and a second side surface;

[0007] A first pad and a second pad, wherein the first pad is located on the first surface, and the second pad is located on the second surface;

[0008] A connecting line, at least located on the first side, the connecting line is used to connect the first pad and the second pad; no connecting line is provided on the second side;

[0009] The packaging structure at least covers a side surface of the array substrate, and the packaging structure located on the first side surface is different from the packaging structure located on the second side surface.

[0010] In a second aspect, the present disclosure provides a display device, comprising the display panel provided in the first aspect of the present disclosure.

[0011] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0012] In the display panel and display device provided by the present disclosure, a connecting line is arranged on the first side, while a connecting line is not arranged on the second side. In view of whether the connecting line is arranged, the present disclosure performs a differentiated design on the packaging structure at the first side and the packaging structure at the second side, so that the packaging structure at the first side is different from the packaging structure at the second side. For example, for the first side where the connecting line is arranged, if the connecting line is affected by external moisture, oxygen, etc., corrosion and other problems will occur, affecting the reliability of signal transmission on the connecting line. Therefore, the first side has higher requirements for packaging. Therefore, a packaging structure with higher packaging reliability can be arranged at the position of the first side. For the second side where the connecting line is not arranged, its packaging requirement is lower than that of the first side. Therefore, there is no need to over-protect the second side. While ensuring effective packaging of the second side, it is possible to avoid introducing unnecessary packaging film layers, so as to simplify the packaging process of the second side and reduce the manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0015] Figure 1 Shown is a schematic plan view of a display panel provided by an embodiment of the present disclosure;

[0016] Figure 2 Shown is a schematic plan view of the back side of a display panel provided by an embodiment of the present disclosure;

[0017] Figure 3 Shown Figure 1 An AA cross-sectional view of the display panel;

[0018] Figure 4 Shown Figure 1 A BB cross-sectional view of the display panel;

[0019] Figure 5 Shown Figure 1 A CC cross-sectional view of the display panel;

[0020] Figure 6 Shown is a top view of an array substrate and a packaging structure located on a side of the array substrate provided by an embodiment of the present disclosure;

[0021] Figure 7 Shown Figure 1 Another BB cross-sectional view of the display panel;

[0022] Figure 8 Shown Figure 1 Another CC cross-sectional view of the display panel;

[0023] Fig. 9 Shown Figure 1 Another BB cross-sectional view of the display panel;

[0024] Fig.10 Shown Figure 1 Another CC cross-sectional view of the display panel;

[0025] Fig.11 Shown Figure 1 Another BB cross-sectional view of the display panel;

[0026] Fig.12 Shown Figure 1 Another CC cross-sectional view of the display panel;

[0027] Fig.13 Another top view of the array substrate and the packaging structure located on the side of the array substrate provided by the embodiment of the present disclosure is shown;

[0028] Fig.14 Shown Figure 1 Another BB cross-sectional view of the display panel;

[0029] Fig.15 Shown Figure 1 Another CC cross-sectional view of the display panel;

[0030] Fig.16 The figure shows a relative position relationship diagram between the first extension portion and the front surface of the display panel;

[0031] Fig.17 Another relative position relationship diagram between the first extension portion and the front surface of the display panel is shown;

[0032] Fig.18 Shown Fig.17 A DD-direction cross-sectional view of the display panel;

[0033] Fig.19 Shown Fig.17 An EE-direction cross-sectional view of the display panel;

[0034] Fig. 20 The figure shows a relative position relationship diagram of the packaging protection layer, the first extension portion and the first protection layer;

[0035] Fig.21Shown Figure 1 Another BB cross-sectional view of the display panel;

[0036] Fig. 22 Shown Figure 1 Another CC cross-sectional view of the display panel;

[0037] Fig.23 Another schematic plan view of a display panel provided by an embodiment of the present disclosure is shown;

[0038] Fig.24 Another top view of the array substrate and the packaging structure located on the side of the array substrate provided by the embodiment of the present disclosure is shown;

[0039] Fig.25 Another schematic plan view of a display panel provided by an embodiment of the present disclosure is shown;

[0040] Fig.26 Another schematic plan view of a display panel provided by an embodiment of the present disclosure is shown;

[0041] Fig. 27 Another schematic plan view of a display panel provided by an embodiment of the present disclosure is shown;

[0042] Fig.28 Another schematic plan view of a display panel provided by an embodiment of the present disclosure is shown;

[0043] Fig.29 Shown is a schematic diagram of the structure of a display device provided by an embodiment of the present disclosure;

[0044] Fig.30 Shown is another structural schematic diagram of a display device provided by an embodiment of the present disclosure;

[0045] Fig.31 Shown is another structural schematic diagram of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0047] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0048] Figure 1FIG. 1 is a schematic plan view of the front side of a display panel provided by an embodiment of the present disclosure. Figure 2 FIG. 1 is a schematic plan view of the back side of a display panel provided by an embodiment of the present disclosure. Figure 3 Shown Figure 1 An AA cross-sectional view of the display panel is shown in the figure. Figure 4 Shown Figure 1 A BB cross-section of the display panel. Figure 5 Shown Figure 1 A CC cross-sectional view of the display panel, please refer to Figure 1 , Figure 3 , Figure 4 and Figure 5 , the embodiment of the present disclosure provides a display panel 100, including:

[0049] The array substrate 10 includes a first surface S1 and a second surface S2 which are arranged opposite to each other in a direction perpendicular to the light emitting surface of the display panel, and a side surface connecting the first surface S1 and the second surface S2; the side surface includes a first side surface CM1 and a second side surface CM2; wherein the first surface S1 can be regarded as a side provided with the light emitting element LD, and the second surface S2 is a back surface (non-luminous side). Figure 4 The first side surface CM1 of the array substrate 10 is shown. The first side surface CM1 is provided with a connecting line L0. Figure 5 The second side surface CM2 of the array substrate 10 is shown, and no connecting wires are arranged on the second side surface CM2.

[0050] A first solder pad P1 and a second solder pad P2, the first solder pad P1 is located on the first surface S1, and the second solder pad P2 is located on the second surface S2; the first solder pad P1 is used to connect with the signal line in the first surface S1, for example, connected with the data line DL, and transmit the data signal to the data line DL through the first solder pad P1, and the second solder pad P2 located on the second surface S2 can be bound to the control chip or the flexible circuit board, for example, which is equivalent to setting the binding area of ​​the display panel on the back of the display panel, so that the binding area does not need to occupy the space on the front side of the display panel, which is conducive to realizing the extremely narrow frame or frameless design of the display panel and meeting the splicing requirements of large-size display products.

[0051] The connecting trace L0 is at least located on the first side surface CM1. The connecting trace L0 is used to connect the first pad P1 and the second pad P2, so that the signal line located on the first surface S1 can be electrically connected with the second pad P2 located on the second surface S2, and then the signal line on the first surface S1 can be electrically connected with the control chip or the flexible circuit board; in the present disclosure, the connecting trace L0 is not set on the second side surface CM2.

[0052] The packaging structure 90 at least covers the side surface of the array substrate 10 and is used to package the side surface of the array substrate 10 to prevent the array substrate 10 from being affected by water, oxygen, etc., wherein the packaging structure located on the first side surface CM1 is different from the packaging structure located on the second side surface CM2.

[0053] It should be noted that Figure 1 The display panel with a rectangular structure is used as an example for illustration, and the actual shape of the display panel is not limited. In some other embodiments of the present disclosure, the display panel can also be embodied in any other feasible shape such as a circle, a rounded rectangle, etc. Optionally, the display panel provided in this embodiment can be a display panel using inorganic light-emitting diode display technology, such as a Micro LED display panel, or a Mini LED display panel, etc. This type of display panel has the advantages of high brightness, low power consumption, and easy splicing, and is widely used in display products. Figure 1 In the display panel shown, only an example is given of the arrangement of the pixel circuits 80 of the light-emitting elements in the display panel, and the actual arrangement and quantity are not limited, and the present disclosure is not limited thereto. Figure 1 The light emitting elements in the display panel are not shown, and the light emitting elements may be evenly arranged on the first surface S1 of the array substrate 10 . Figure 1 The data lines DL in the display panel and the connection between the data lines DL and the first pads P1 are shown together, but the number of data lines DL and first pads P1 actually included in the display panel is not limited. In some embodiments of the present disclosure, the data lines DL can be connected to the first pads P1, or can be connected to the first pads P1 through a multiplexing unit to reduce the number of first pads P1, which is not specifically limited in the present disclosure.

[0054] It should be noted that Figure 4 and Figure 5 The array layer 01 in the array substrate 10 is not illustrated in detail, wherein the connection relationship between the array layer 01 and the light emitting element LD can be appropriately referred to in FIG. Figure 3The film layer structure of the array substrate 10 and the connection between the array substrate 10 and the light-emitting element LD are illustrated, but the actual number and size of the film layers of the array substrate are not limited. The array substrate 10 includes a substrate 00 and an array layer 01 disposed on the substrate 00. A plurality of transistors are disposed in the array layer 01. Optionally, the gate of the transistor is disposed on the first metal layer m1, and the source and drain of the transistor are disposed on the second metal layer m2. The array substrate 10 also includes a semiconductor layer poly disposed on the side of the first metal layer m1 facing the substrate 00 and an auxiliary metal layer m0 disposed on the side of the semiconductor layer poly facing the substrate 00. It should be noted that the display panel may include a transistor with a single gate structure, in which case the gate may be located in the first metal layer m1, or the gate may be located in the auxiliary metal layer m0; the display panel may also include a transistor with a dual gate structure, in which case one of the gates of the transistor may be located in the first metal layer m1, and the other gate may be located in the auxiliary metal layer m0. In the direction perpendicular to the plane where the substrate 00 is located, the first metal layer m1 and the auxiliary metal layer m0 overlap with the semiconductor layer poly, and the auxiliary metal layer m0 also has a light shielding function to prevent light from affecting the semiconductor layer poly. Optionally, a capacitor metal layer mc is further included between the first metal layer m1 and the second metal layer m2, and the capacitor metal layer mc can form a capacitor structure with the second metal layer m2. Optionally, a third metal layer m3 and a fourth metal layer m4 are also included on the side of the second metal layer m2 away from the substrate 00. The third metal layer m3 and the fourth metal layer m4 can both be used to lay signal lines. In this embodiment, the electrodes P01 and P02 connected to the light-emitting element LD on the array substrate 10 are located on the fourth metal layer m4, and the first pad P1 is also located on the fourth metal layer m4. Optionally, an inorganic film layer can be provided on the side of the fourth metal layer m4 away from the substrate 00 as needed to protect the connection electrode, and this is not specifically limited in the present disclosure.

[0055] Figure 4 The film layer and packaging structure at the position of the first side surface CM1 of the array substrate 10, Figure 5The film layer and packaging structure at the position of the second side surface CM2 of the corresponding array substrate 10, the main difference between the two is that the first side surface CM1 is provided with a connecting line L0, the second side surface CM2 is not provided with a connecting line, and the packaging structure corresponding to the first side surface CM1 is different from the packaging structure corresponding to the second side surface CM2. In this embodiment, the packaging structure of the first side surface CM1 refers to a packaging structure arranged on the first side surface CM1 along a direction parallel to the first surface S1 and the second surface S2 and perpendicular to the side surface of the substrate 00, and in a direction from the substrate 00 to the outside. The packaging structure of the second side surface CM2 refers to a packaging structure arranged on the second side surface CM2 along a direction parallel to the first surface S1 and the second surface S2 and perpendicular to the side surface of the substrate 00, and in a direction from the substrate 00 to the outside. In the embodiment of the present disclosure, a connecting line L0 is provided on the first side surface CM1, while a connecting line L0 is not provided on the second side surface CM2. With respect to whether the connecting line L0 is provided, the present disclosure performs differentiated design on the packaging structure at the position of the first side surface CM1 and the packaging structure 90 at the position of the second side surface CM2, so that the packaging structure at the position of the first side surface CM1 is different from the packaging structure 90 at the position of the second side surface CM2. For example, for the first side surface CM1 provided with the connecting line L0, if the connecting line L0 is affected by external moisture, oxygen, etc., corrosion and other problems will occur, affecting the reliability of signal transmission on the connecting line L0. Therefore, the first side surface CM1 has higher requirements for packaging. Therefore, a packaging structure with higher packaging reliability can be provided at the position of the first side surface CM1. For the second side surface CM2 where the connecting line L0 is not provided, its packaging requirement is lower than that of the first side surface CM1. Therefore, there is no need to over-protect the second side surface CM2. While ensuring effective packaging of the second side surface CM2, it is possible to avoid introducing unnecessary packaging film layers, thereby simplifying the packaging process of the second side surface CM2 and reducing the manufacturing cost.

[0056] The differentiated design solutions of the packaging structures of the first side surface CM1 and the second side surface CM2 will be described below.

[0057] Please continue to refer to Figure 4 and Figure 5 In an optional embodiment of the present disclosure, the encapsulation structure includes a first encapsulation structure 91 located on the first side CM1 and a second encapsulation structure 92 located on the second side CM2. The number of encapsulation layers included in the first encapsulation structure 91 is greater than the number of encapsulation layers included in the second encapsulation structure 92. Figure 1 , Figure 2 and Figure 3In this embodiment, the number of encapsulation layers included in the first encapsulation structure 91 refers to the number of insulating layers provided on the first side surface CM1 along a direction parallel to the first surface S1 and the second surface S2 and perpendicular to the side surface of the substrate 00, and in a direction from the substrate 00 to the outside. The number of encapsulation layers included in the second encapsulation structure 92 refers to the number of insulating layers provided on the second side surface CM2 along a direction parallel to the first surface S1 and the second surface S2 and perpendicular to the side surface of the substrate 00, and in a direction from the substrate 00 to the outside.

[0058] Optionally, the first encapsulation structure 91 of the first side surface CM1 and the second encapsulation structure 92 of the second side surface CM2 both include at least one encapsulation layer, and at least the side surface of the array substrate 10 is encapsulated by the encapsulation layer in the encapsulation structure. In this embodiment, the first encapsulation structure 91 and the second encapsulation structure 92 are differentially designed by setting the number of encapsulation layers included in the first encapsulation structure 91 and the second encapsulation structure 92 to be different. Specifically, for the first encapsulation structure 91 corresponding to the first side surface CM1 provided with the connection line L0, the number of encapsulation layers included is greater than the number of encapsulation layers included in the second encapsulation structure 92 corresponding to the second side surface CM2 without the connection line L0. The area corresponding to the first side surface CM1 is encapsulated by using a larger number of encapsulation layers, which is more conducive to isolating the connection line L0 of the first side surface CM1 from the outside, reducing or avoiding the influence of external moisture or oxygen on the connection line L0, and is conducive to improving the encapsulation effect of the first side surface CM1 provided with the connection line L0. For the second side surface CM2 on which the connecting line L0 is not set, the present embodiment reduces the number of packaging layers included in the corresponding second packaging structure 92, making it less than the number of packaging layers included in the first packaging structure 91. This is beneficial to reducing the number of steps in manufacturing the packaging structure on the second side surface CM2, and is also beneficial to saving packaging materials required for the second packaging structure 92, thereby simplifying the overall manufacturing process of the display panel and reducing production costs.

[0059] Please continue to refer to Figure 4 and Figure 5 In an optional embodiment of the present disclosure, the first encapsulation structure 91 includes M encapsulation layers stacked, and the second encapsulation structure 92 includes N encapsulation layers, MN≥1, M≥2, N≥1, that is, the number of encapsulation layers included in the first encapsulation structure 91 is at least one more than the number of encapsulation layers included in the second encapsulation structure 92. Specifically, Figure 4The illustrated embodiment is described by taking the example that the first packaging structure 91 includes two packaging layers and the second packaging structure 92 includes one packaging layer, but the present disclosure is not limited to this. In some other embodiments of the present disclosure, the number of packaging layers included in the first packaging structure 91 and the number of packaging layers included in the second packaging structure 92 can also be reflected as other, and the difference in the number of packaging layers between the two can also be reflected as other.

[0060] Figure 6 The figure shows a top view of the array substrate 10 and the packaging structure located on the side of the array substrate 10 provided by the embodiment of the present disclosure. The embodiment is described by taking the first side CM1 of the array substrate 10 as an example in which two packaging layers (a routing packaging layer 21 and a filling packaging layer 22 respectively) are provided, the second side CM2 is provided with a packaging layer (filling packaging layer 22), and the array substrate 10 has a first side CM1 and three second side CM2. When the packaging structure is actually manufactured, a packaging layer can be first manufactured on the first side CM1, and then another packaging layer can be formed on the first side CM1 and the second side CM2, so that the first packaging structure 91 and the second packaging structure 92 form a closed structure as a whole to package the side of the array substrate 10 as a whole, thereby improving the overall packaging performance of the display panel. It should be noted that after one packaging layer is produced on the first side CM1, another packaging layer can be formed on the first side CM1 and the second side CM2 using a unified process. That is to say, part of the packaging layers in the first packaging structure 91 and the second packaging structure 92 can be produced in the same process, and there is no need to introduce different packaging processes for the first side CM1 and the second side CM2, respectively. This is beneficial to simplify the packaging process and improve the overall production efficiency of the display panel. It should be noted that the routing packaging layer 21 and the filling packaging layer 22 at least partially overlap, and there is no restriction as to whether the filling packaging layer completely covers the routing packaging layer 21. In order to clearly describe the relative positional relationship between the routing packaging 21 and the filling packaging layer 22, Figure 6 The trace encapsulation layer 21 is shown partially uncovered by the filling encapsulation layer 22 .

[0061] Figure 7 Shown Figure 1 Another BB cross-sectional view of the display panel, Figure 4 The difference between the embodiments is that the number of encapsulation layers included in the first encapsulation structure 91 is different. Figure 7 Take the first packaging structure 91 including three packaging layers as an example for explanation. Figure 4 The first packaging structure 91 includes two packaging layers. Figure 4 , Figure 7 The illustrated embodiment increases the number of packaging layers included in the first packaging structure 91 , which is more conducive to improving the packaging reliability of the first side surface CM1 of the array substrate 10 .

[0062] Please refer to Figure 4 and Figure 7 In an optional embodiment of the present disclosure, the first packaging structure 91 includes a routing packaging layer 21 and a filling packaging layer 22. On the side of the first side CM1 facing away from the array substrate 10, the routing packaging layer 21 is in direct contact with the connecting routing L0 and the filling packaging layer 22, and at least part of the routing packaging layer 21 is located between the connecting routing L0 and the filling packaging layer 22.

[0063] In the first packaging structure 91 provided by the present disclosure, the packaging layer that is in direct contact with the connection trace L0 located on the first side surface CM1 is the trace packaging layer 21. Optionally, the trace packaging layer 21 is an insulating adhesive layer, which has good adhesion to the connection trace L0. The trace packaging layer 21 can reliably cover the connection trace L0 and the first side surface CM1 to isolate the connection trace L0 from moisture and oxygen in the outside. Optionally, the trace packaging layer 21 is a black or gray light-shielding material, which can avoid or reduce the problem of light leakage on the side of the array substrate 10. The present disclosure further introduces a filling encapsulation layer 22 on the outside of the routing encapsulation layer 21. Laterally to the first side CM1, the surface of the routing encapsulation layer 21 facing the first side CM1 is in direct contact with the connecting routing L0, and the surface of the routing encapsulation layer 21 away from the first side CM1 is in direct contact with the filling encapsulation layer 22, which is equivalent to further encapsulating the routing encapsulation layer 21 with the filling encapsulation layer 22. The double encapsulation of the routing encapsulation layer 21 and the filling encapsulation layer 22 is more conducive to improving the encapsulation reliability of the first side CM1. Optionally, the filling encapsulation layer 22 can also be embodied as a material with a light-absorbing effect such as black or gray.

[0064] Figure 8 Shown Figure 1 Another CC cross-sectional view of the display panel, Figure 5 The difference between the embodiments is that the second encapsulation structure 92 includes different numbers of encapsulation layers. Figure 5 Take the first packaging structure 91 including one packaging layer as an example for description. Figure 8 The first packaging structure 91 includes two packaging layers. Figure 5 , Figure 8 The illustrated embodiment increases the number of packaging layers included in the second packaging structure 92 , which is more conducive to improving the packaging reliability of the second side surface CM2 of the array substrate 10 .

[0065] Please refer to Figure 5 and Figure 8In an optional embodiment of the present disclosure, the second encapsulation structure 92 includes a filling encapsulation layer 22, and the filling encapsulation layer 22 is in direct contact with the second side CM2 on the side of the second side CM2 away from the array substrate 10. For the second side CM2 where the connecting wiring L0 is not provided, the present disclosure does not introduce the wiring encapsulation layer 21, but introduces the filling encapsulation layer 22 in direct contact with the second side CM2, which is equivalent to eliminating the process and materials for making the wiring encapsulation layer 21 on the second side CM2, which is beneficial to improving the encapsulation production efficiency and reducing the production cost. Optionally, the filling encapsulation layer 22 located on the second side CM2 and the filling encapsulation layer 22 located on the first side CM1 are made of the same material and in the same process, and there is no need to introduce the manufacturing process of the filling encapsulation layer 22 for the first side CM1 and the second side CM2 respectively, which is beneficial to further simplify the production process of the display panel. In actual production, the routing encapsulation layer 21 may be first introduced into the first side CM1, but not introduced into the second side CM2. The first side CM1 is first encapsulated using the routing encapsulation layer 21, and then a filling encapsulation layer 22 is formed on the first side CM1 and the second side CM2. The filling encapsulation layer 22 of the first side CM1 and the second side CM2 may be made of the same material in the same process. Optionally, the routing encapsulation layer 21 and the filling encapsulation layer 22 may be embodied as a material with a light-absorbing effect such as black or gray.

[0066] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 7 In the embodiment of the present disclosure, when the routing encapsulation layer 21 is introduced on the first side surface CM1, the routing encapsulation layer 21 may be extended from the first side surface CM1 to the first surface S1 and the second surface S2 in addition to being located on the first side surface CM1. In this way, the routing encapsulation layer 21 may encapsulate at least part of the connecting routing L0 located on the first side surface CM1 as well as the first surface S1 and the second surface S2. A continuous routing encapsulation layer 21 is formed on the first surface S1, the first side surface CM1 and the second surface S2, which is beneficial to prevent moisture and oxygen from penetrating into the array substrate 10 from the connecting position between the first surface S1 and the first side surface CM1, and the connecting position between the second surface S2 and the first side surface CM1.

[0067] Please refer to Figure 3 , Figure 7 and Figure 8In an optional embodiment of the present disclosure, the display panel further includes a light emitting element LD electrically connected to the array substrate 10 and located on the first surface S1. An electrode for electrically connecting to the light emitting element LD is provided on the first surface S1 of the array substrate 10. The light emitting element LD is bound to the electrode and then electrically connected to the circuit in the array substrate 10. At least a portion of the filling encapsulation layer 22 is located on the side of the first surface S1 away from the second surface S2; the distance between the surface of the light emitting element LD away from the first surface S1 and the second surface S2 is H0, and the distance between the surface of the filling encapsulation layer 22 away from the first surface S1 and the second surface S2 is H1, and H1>H0.

[0068] This embodiment illustrates the relative positional relationship between the first packaging structure 91 and other film layers in the display panel. In addition to being arranged on the lateral sides of the first side surface CM1 and the second side surface CM2, the filling packaging layer 22 further extends to the side of the first surface S1 of the array substrate 10 away from the second surface S2. In this embodiment, the upper surface of the filling packaging layer 22 located on the side of the first surface S1 away from the second surface S2 is higher than the upper surface of the light-emitting element LD. In other words, the distance H1 between the upper surface of the filling packaging layer 22 (the surface away from the first surface S1 and parallel to the first surface S1) and the first surface S1 is greater than the distance H0 between the upper surface of the light-emitting element LD (the surface away from the first surface S1) and the first surface S1, which is equivalent to increasing the total height of the filling packaging layer 22 in the direction perpendicular to the first surface S1. In this way, the packaging area of ​​the filling packaging layer 22 on the side of the display panel will be increased, which is beneficial to improving the packaging effect of the filling packaging layer 22 on the side of the display panel. Optionally, the filling encapsulation layer 22 corresponding to the first side surface CM1 and the filling encapsulation layer 22 corresponding to the second side surface CM2 have the same relative positional relationship with the height of the light-emitting element LD, that is, the total height of the filling encapsulation layer 22 located in different areas of the display panel in the direction perpendicular to the first surface S1 is consistent, which is conducive to simplifying the manufacturing process.

[0069] Please continue to refer to Figure 7 and Figure 8 In an optional embodiment of the present disclosure, the display panel also includes a first light-shielding layer 30 and a light-transmitting layer 40 located on the first surface S1, the first light-shielding layer 30 is at least partially located between adjacent light-emitting elements LD, and the light-transmitting layer 40 is located on the side of the first light-shielding layer 30 away from the first surface S1 and covers the light-emitting element LD and at least part of the first light-shielding layer 30; the filling encapsulation layer 22 contacts the side surfaces of the first light-shielding layer 30 and the light-transmitting layer 40.

[0070] The first light shielding layer 30 introduced in the display panel of this embodiment can be used to shield the metal film layer on the array substrate 10 to avoid the problem of metal reflection. It should be noted that the first light shielding layer 30 can be located not only in the area between adjacent light emitting elements LD, but also directly below the light emitting element LD to cover the electrode of the light emitting element LD to avoid the problem of metal reflection of the electrode of the light emitting element LD. When the first light shielding layer 30 is introduced, the first light shielding layer 30 does not cover the upper surface of the light emitting element LD to avoid affecting the light output of the light emitting element LD. The upper surface of the first light shielding layer 30 can be lower than the upper surface of the light emitting element LD, or the upper surface of the first light shielding layer 30 is flush with the upper surface of the light emitting element LD. In the display panel, a light-transmitting layer 40 is introduced on the side of the light emitting element LD and the first light shielding layer 30 away from the first surface S1. The light-transmitting layer 40 can be used to encapsulate the light emitting element LD to prevent moisture and oxygen from entering, and can also form a flat surface on the side of the light emitting element LD away from the first surface S1. When the height of the upper surface of the filling encapsulation layer 22 is greater than the height of the upper surface of the light-emitting element LD, the filling encapsulation layer 22 can contact the sides of the first light-shielding layer 30 and the light-transmitting layer 40 respectively, and can cover the side interface area of ​​the first light-shielding layer 30 and the light-transmitting layer 40 to prevent external moisture and oxygen from infiltrating from the interface area between the two, thereby helping to improve the overall encapsulation effect of the filling encapsulation layer 22 on the display panel.

[0071] The above embodiment shows a solution in which the upper surface of the filling encapsulation layer 22 is higher than the upper surface of the light-emitting element LD. In some other embodiments of the present disclosure, the upper surface of the filling encapsulation layer 22 may also be flush with or lower than the upper surface of the light-emitting element LD. Fig. 9 Shown Figure 1 Another BB cross-sectional view of the display panel. Fig.10 Shown Figure 1 Another CC cross-sectional view of the display panel, please refer to Fig. 9 and Fig.10 In an optional embodiment of the present disclosure, the display panel also includes a light-emitting element LD and a first shading layer 30 electrically connected to the array substrate 10 and located on the first surface S1, and the first shading layer 30 is at least partially located between adjacent light-emitting elements LD; the distance between the surface of the light-emitting element LD facing away from the first surface S1 and the second surface S2 is H0, the distance between the surface of the first shading layer 30 facing away from the first surface S1 and the second surface S2 is H2, and the distance between the surface of the filling encapsulation layer 22 facing away from the first surface S1 and the second surface S2 is H1, wherein H0≥H2≥H1.

[0072] The first light shielding layer 30 introduced in the display panel of this embodiment can be used to shield the metal film layer on the array substrate 10 to avoid the problem of metal reflection. It should be noted that the first light shielding layer 30 can be located not only in the area between adjacent light emitting elements LD, but also directly below the light emitting element LD to cover the electrode of the light emitting element LD to avoid the problem of metal reflection of the electrode of the light emitting element LD. When the first light shielding layer 30 is introduced, the first light shielding layer 30 does not cover the upper surface of the light emitting element LD to avoid affecting the light output of the light emitting element LD. In this embodiment, the height relationship between the light emitting element LD, the first light shielding layer 30 and the filling encapsulation layer 22 is that the upper surface of the light emitting element LD is higher than the upper surface of the first light shielding layer 30 or is flush with the upper surface of the first light shielding layer 30, and the upper surface of the first light shielding layer 30 is higher than the upper surface of the filling encapsulation layer 22 or is flush with the upper surface of the filling encapsulation layer 22. In this embodiment, the upper surface of the first light shielding layer 30 is set not to exceed the upper surface of the light emitting element LD, which is beneficial to avoid the first light shielding layer 30 affecting the forward light emission of the light emitting element LD. In actual production, the filling and encapsulation layer 22 is produced after the first light shielding layer 30 is produced. When the upper surface of the encapsulation filling layer does not exceed the upper surface of the first light shielding layer 30, the first light shielding layer 30 can be used as a positioning reference for producing the filling and encapsulation layer 22, which is beneficial to simplify the difficulty of producing the filling and encapsulation layer 22 and simplify the overall production process of the display panel.

[0073] It should be noted that, in some other embodiments of the present disclosure, the upper surface height of the filling encapsulation layer 22 may also be flush with the upper surface height of the light emitting element LD, for example, please refer to Fig.11 and Fig.12 , Fig.11 Shown Figure 1 Another BB cross-sectional view of the display panel. Fig.12 Shown Figure 1 Another CC cross-sectional view of the display panel. At this time, the upper surface of the light-emitting element LD, the upper surface of the first light-shielding layer 30 and the upper surface of the filling encapsulation layer 22 can be arranged on the same plane. Similarly, the first light-shielding layer 30 can be used as a positioning reference when making the filling encapsulation layer 22 to simplify the difficulty of making the filling encapsulation layer 22.

[0074] Please refer to Fig. 9 , Fig.10 , Fig.11 and Fig.12 In an optional embodiment of the present disclosure, the display panel also includes a light-transmitting layer 40, which is located on the side of the first light-shielding layer 30 away from the first surface S1 and covers the light-emitting element LD and at least part of the first light-shielding layer 30; the filling encapsulation layer 22 is in contact with the side of the first light-shielding layer 30.

[0075] In this embodiment, a light-transmitting layer 40 is introduced on the side of the light-emitting element LD away from the first surface S1, and the light-transmitting layer 40 covers the light-emitting element LD. The light-transmitting layer can be used to encapsulate the light-emitting element LD to prevent the external moisture and oxygen from affecting the light-emitting element LD. At the same time, the light-transmitting layer 40 also covers at least part of the first light-shielding layer 30. The upper surface of the filling encapsulation layer 22 does not exceed the upper surface of the first light-shielding layer 30, that is, the filling encapsulation layer 22 will not contact the side of the light-transmitting layer 40. At this time, a transparent adhesive layer 60 can be introduced on the side of the light-transmitting layer 40 and the filling encapsulation layer 22 away from the array substrate 10, so that the transparent adhesive layer 60 covers the upper surfaces of the light-transmitting layer 40, the first light-shielding layer 30 and the filling encapsulation layer 22, so as to realize the encapsulation and fixation of these film layers, and at the same time, the surface of the transparent adhesive layer 60 away from the array substrate 10 forms a flat surface to achieve seamless bonding with the cover plate or other film materials.

[0076] Fig.13 FIG. 1 is another top view of the array substrate 10 and the packaging structure located on the side of the array substrate 10 provided in the embodiment of the present disclosure. Fig.14 Shown Figure 1 Another BB cross-sectional view of the display panel. Fig.15 Shown Figure 1 Another CC cross-sectional view of the display panel; please refer to Fig.13 , Fig.14 and Fig.15 ,as well as Fig.11 and Fig.12 , Fig.11 and Fig.12 The scheme shown is similar to Fig.14 and Fig.15 In the illustrated solution, the coverage of the light shielding encapsulation layer 23 is different. In an optional embodiment of the present disclosure, the first encapsulation structure 91 and the second encapsulation structure 92 include a light shielding encapsulation layer 23, which is at least partially located on a side of the filling encapsulation layer 22 away from the side.

[0077] This embodiment shows a solution in which the packaging structure further includes a light-shielding packaging layer 23, and the light-shielding packaging layer 23 is at least located on the periphery of the side of the filling packaging layer 22. Optionally, the light-shielding packaging layer 23 is a black material or a material with high light absorption or high grayscale. On the one hand, the light-shielding packaging layer 23 can prevent the light from leaking sideways from the display panel. On the other hand, the light-shielding packaging layer 23 can also serve as a packaging layer to improve the packaging reliability of the display panel, and serve as the first line of defense to prevent moisture and oxygen from entering the side of the display panel. Fig.11 and Fig.12 In the illustrated embodiment, the light shielding encapsulation layer 23 extends from the side to the front of the display panel. Fig.14 and Fig.15In the illustrated solution, the light-shielding encapsulation layer 23 does not extend toward the front of the display panel. Both can achieve lateral encapsulation of the display panel and shield lateral light leakage.

[0078] Please continue to refer to Fig.11 and Fig.12 In an optional embodiment of the present disclosure, the display panel also includes a light-emitting element LD electrically connected to the array substrate 10 and located on the first surface S1, and a first light-shielding layer 30, and the first light-shielding layer 30 is at least partially located between adjacent light-emitting elements LD; the light-shielding packaging layer 23 includes a main body and a first extension portion 231 connected to the main body, the main body is located on the side of the filling and packaging layer away from the side, the first extension portion 231 is located on the light-emitting side of the light-emitting element LD, and along the direction perpendicular to the plane where the array substrate 10 is located, the first extension portion 231 does not overlap with the light-emitting element LD.

[0079] This embodiment shows a solution in which the light-shielding encapsulation layer 23 is not only located on the side of the display panel (including the side of the array substrate 10), but also extends from the side of the display panel to the front (light-emitting surface) of the display panel. The portion of the light-shielding encapsulation layer 23 located on the side of the display panel is the main body, and the portion extending to the front of the display panel is the first extension portion 231, and the main body and the first extension portion 231 are seamlessly connected. When the light-shielding encapsulation layer 23 is introduced only on the side of the display panel, considering that if the side of the display panel is a vertical surface or a steep surface close to the vertical surface relative to the light-emitting surface of the display surface, when the light-shielding encapsulation layer 23 is formed on the vertical surface or the steep surface, the adhesion reliability of the light-shielding encapsulation layer 23 is not high, and there is a risk of peeling off from the side of the display panel, which affects the overall encapsulation reliability of the display panel. Therefore, when the light-shielding encapsulation layer 23 is extended to the front of the display panel to form the first extension portion 231 located on the front, the adhesion between the first extension portion 231 and the front of the display panel is relatively large, and the first extension portion 231 is connected to the main body 230, which can fix the first extension portion 231 and prevent the first extension portion 231 from peeling off from the side of the display panel, thereby facilitating the improvement of the fixing reliability and encapsulation reliability of the light-shielding encapsulation layer 23. In addition, when the front of the display panel is introduced into the first extension portion 231 of the light-shielding encapsulation layer 23, the first extension portion 231 will not extend to the top of the light-emitting element LD, that is, along the direction perpendicular to the plane where the array substrate 10 is located, the first extension portion 231 and the light-emitting element LD do not overlap, which helps to prevent the first extension portion 231 from affecting the forward light emission of the light-emitting element LD.

[0080] Please continue to refer to Fig.11 and Fig.12In an optional embodiment of the present disclosure, along a direction perpendicular to the plane where the array substrate 10 is located, a distance D0 between the surface of the light emitting element LD away from the array substrate 10 and the first extension portion 231 is greater than 0. At this time, a distance between the surface of the first extension portion 231 away from the array substrate 10 and the first surface S1 of the array substrate 10 is greater than a distance between the surface of the light emitting element LD away from the array substrate 10 and the first surface S1 of the array substrate 10. Fig.11 For example, at least two insulating film layers are spaced between the upper surface of the light-emitting element LD and the first extension portion 231. This is beneficial to increasing the height of the first extension portion 231 in the light-shielding packaging layer 23. The main body of the light-shielding packaging layer 23 can encapsulate and cover the side surfaces of all film layers above the upper surface of the light-emitting element LD, thereby avoiding lateral light leakage of the display panel and ensuring the reliability of the packaging effect.

[0081] Please continue to refer to Fig.11 In an optional embodiment of the present disclosure, the first extension portion 231 overlaps the first pad P1 along a direction perpendicular to the plane where the array substrate 10 is located. Optionally, the first extension portion 231 covers the first pad P1. In the display panel, the first pad P1 is disposed on the first surface S1 of the array substrate 10 and is located on the side of the light emitting element LD facing the first side surface CM1. The first pad P1 is usually a metal pad. When the first extension portion 231 is used to fully or partially cover the first pad P1 along a direction perpendicular to the plane where the array substrate 10 is located, the edge of the display panel can also be blackened to prevent light leakage from the edge of the display panel.

[0082] Please refer to Fig.11 and Fig.12 In an optional embodiment of the present disclosure, the first extension 231 overlaps with the first light shielding layer 30 in a direction perpendicular to the plane where the array substrate 10 is located. The first light shielding layer 30 is at least located between adjacent light emitting elements LD and directly below the light emitting element LD. The first light shielding layer 30 is also provided on the side of the light emitting element LD facing the first side surface CM1 and the second side surface CM2 of the array substrate 10. This part of the first light shielding layer 30 may at least partially overlap with the first pad P1 to block the reflection of the pad. When the first extension 231 is introduced on the front of the display panel so that the first extension 231 overlaps with the first light shielding layer 30, the first extension 231 and the first light shielding layer 30 form a light shielding structure as a whole on the side of the light emitting element LD facing the first side surface CM1 of the array substrate 10, which can effectively shield the edge area of ​​the display panel and avoid the problem of edge light leakage or visible edge metal of the display panel.

[0083] Please continue to refer to Fig.11In an optional embodiment of the present disclosure, along the direction of the first surface S1 pointing to the side, the width of the first extension portion 231 is D01, the width of the filling encapsulation layer 22 is D02, and D01≥D02.

[0084] In this embodiment, on the front of the display panel, the extension width of the first extension portion 231 is greater than the extension width of the filling encapsulation layer 22. In some other embodiments of the present disclosure, the extension width of the first extension portion 231 may also be equal to the extension width of the filling encapsulation layer 22, and the present disclosure does not specifically limit this. Since the light-shielding encapsulation layer 23 is located at the outermost part of the display panel, along the direction perpendicular to the plane where the array substrate 10 is located, the filling encapsulation layer 22 and the first extension portion 231 of the light-shielding encapsulation layer 23 are separated by other transparent insulating film layers. If, on the front of the display panel, the extension width of the filling encapsulation layer 22 is greater than the extension width of the first extension portion 231, the filling encapsulation layer 22 is exposed outside the first extension portion 231. If the filling encapsulation layer 22 and the first light-shielding layer 30 are made of different materials, it will cause the problem of inconsistent black state effects in the edge area of ​​the display panel, affecting the black state uniformity of the edge area of ​​the display panel. Therefore, on the front side of the display panel, when the width of the first extension portion 231 is set to be greater than the width of the filling encapsulation layer 22 , the first extension portion 231 can cover the filling encapsulation layer 22 , which is beneficial to ensure the consistency of the black state effect at the edge of the display panel.

[0085] Fig.16 FIG. 2 is a diagram showing a relative position relationship between the first extension portion 231 and the front surface of the display panel. Fig.16 , and combined with Fig.11 and Fig.12 In an optional embodiment of the present disclosure, the first extension portion 231 includes a first sub-extension portion 2311 corresponding to the first packaging structure 91 and a second sub-extension portion 2312 corresponding to the second packaging structure 92; along the direction pointing to the side of the first surface S1, the width of the first sub-extension portion is D011, and the width of the second sub-extension portion is D012, wherein D011>D012.

[0086] In this embodiment, the display panel includes a first side surface CM1 and three second side surfaces CM2 as an example for explanation. The first extension portion 231 extending from the first side surface CM1 to the front of the display panel is the first sub-extension portion 2311, and the first extension portion 231 extending from the second side surface CM2 to the front of the display panel is the second sub-extension portion 2312. Considering that in the first surface S1 of the array substrate 10, the region adjacent to the first side surface CM1 is provided with the first pad P1, while the region adjacent to the second side surface CM2 is not provided with the pad, the width of the first sub-extension portion 2311 and the width of the second sub-extension portion 2312 can be designed differently, so that the width of the first sub-extension portion 2311 is greater than the width of the second sub-extension portion 2312, so as to ensure that the first sub-extension portion 2311 can fully cover the first pad P1 and avoid the problem of metal reflection. At the same time, reducing the width of the second sub-extension portion 2312 is also conducive to saving material usage and production costs.

[0087] Of course, in some other embodiments of the present disclosure, the widths of the first sub-extension portion 2311 and the second sub-extension portion 2312 may be set to be the same to improve the coverage uniformity of the light-shielding encapsulation layer 23 in the edge region of the display panel.

[0088] In an optional embodiment of the present disclosure, along the direction of the first surface S1 pointing to the side, the width of the first extension portion 231 is D01, 0<D01≤100μm. If the width of the first extension portion 231 is set to be larger, it will cause the display panel to be unable to achieve an extremely narrow frame or a frameless design, so it is necessary to reduce the width of the first extension portion 231 as much as possible. When the width of the first extension portion 231 is set to not more than 100μm in the present disclosure, it is difficult for the human eye to perceive the width of the first extension portion 231, so it is conducive to achieving an extremely narrow frame or a frameless design of the display panel.

[0089] Please refer to Fig.11 and Fig.12 In an optional embodiment of the present disclosure, the first extension portion 231 and the main body 230 in the light-shielding encapsulation layer 23 are integrally formed, and the two can be made of the same material in the same manufacturing process, and there is no need to introduce different manufacturing processes and materials for the first extension portion 231 and the main body 230, respectively, which is conducive to simplifying the manufacturing process of the light-shielding encapsulation layer 23. In addition, when the first extension portion 231 and the main body 230 are integrally formed, the adhesion between the first extension portion 231 and the front of the display panel is stronger, and the first extension portion 231 can play a certain pulling role on the main body, thereby avoiding the problem that the main body is peeled off from the side of the display panel and affects the packaging reliability of the display panel.

[0090] Please refer to Figure 7 and Figure 8 , Fig.11 and Fig.12In an optional embodiment of the present disclosure, along a direction perpendicular to the plane where the array substrate 10 is located, the distance between the first extension portion 231 and the filling encapsulation layer 22 is greater than 0. On the front of the display panel, at least one other insulating film layer is provided between the first extension portion 231 and the filling encapsulation layer 22, for example, a first protective layer 50 (for example, which can be embodied as a transparent cover plate) is provided, or a first protective layer 50 and a transparent adhesive layer 60 are provided, that is, on the front of the display panel, the film layers provided on the side of the light emitting element LD away from the array substrate 10 are all located below the first extension portion 231, and the main body of the light-shielding encapsulation layer 23 can fully cover the side of the filling encapsulation layer 22 and the side of the film layer between the filling encapsulation layer 22 and the first light-shielding layer 30, which is conducive to improving the overall encapsulation effect and light-shielding effect of the light-shielding encapsulation layer 23 on the side of the display panel.

[0091] Optionally, please continue to refer to Figure 7 and Figure 8 , Fig.11 and Fig.12 The display panel also includes a light-transmitting layer 40 and a first protective layer 50. The light-transmitting layer 40 is located on the side of the first light-shielding layer 30 and the light-emitting element LD away from the first surface S1, and the first protective layer 50 is located on the side of the light-transmitting layer 40 away from the first surface S1; the first extension portion 231 is located on the surface of the first protective layer 50 away from the light-transmitting layer 40, and the filling encapsulation layer 22 is located on the side of the first protective layer 50 facing the array substrate 10.

[0092] Optionally, the light-transmitting layer 40 may be, for example, a transparent adhesive layer, which may be used to encapsulate the front of the light-emitting element LD to prevent external moisture and oxygen from affecting the light-emitting element LD, and the surface of the light-transmitting layer 40 away from the array substrate 10 is a flat surface. The first protective layer 50 may be, for example, a transparent cover plate of a display panel. In the packaging structure of the disclosed embodiment, along a direction perpendicular to the plane where the array substrate 10 is located, the first extension portion 231 in the light-shielding packaging layer 23 is located on the upper surface of the first protective layer 50, that is, the light-shielding packaging layer 23 extends from the side of the display panel to the upper surface of the display panel, and the light-shielding packaging layer 23 located on the side of the display panel fully covers the side of the array substrate 10, the side of the light-transmitting layer 40, and the side of the first protective layer 50, thereby increasing the coverage area of ​​the light-shielding packaging layer 23, thereby facilitating the light-shielding reliability of the light-shielding packaging layer 23 on the side of the display panel, preventing lateral light leakage of the display panel, and facilitating the packaging reliability of the overall side of the display panel.

[0093] Fig.17 FIG. 2 is another relative position relationship diagram between the first extension portion 231 and the front surface of the display panel. Fig.18 Shown Fig.17 A DD-direction cross-section of the display panel. Fig.19 Shown Fig.17 An EE cross-sectional view of the display panel, please refer to Figures 17 to 19 In an optional embodiment of the present disclosure, the display panel further includes an encapsulation protective layer 70, which is located on the side of the first surface S1 away from the second surface S2, and the encapsulation protective layer 70 is located on the side of the first extension portion 231 and the first protective layer 50 away from the first surface S1; along a direction perpendicular to the plane where the array substrate 10 is located, the encapsulation protective layer 70 at least overlaps with the edge of the first extension portion 231.

[0094] This embodiment shows a scheme of introducing an encapsulation protection layer 70 into a display panel. In actual production, after the light-shielding encapsulation layer 23 is produced, an encapsulation protection layer 70 is produced on the front of the display panel, so that the encapsulation protection layer 70 covers at least part of the first extension 231 and overlaps with the edge of the first extension 231. The edge of the first extension 231 refers to the edge of the first extension 231 away from the main body. In a direction perpendicular to the plane where the array substrate 10 is located, the encapsulation protection layer 70 does not overlap with the light-emitting element LD, so as to avoid affecting the forward light emission of the light-emitting element LD. When the light-shielding encapsulation layer 23 includes the first extension 231 located on the front of the display panel, in order to achieve an extremely narrow frame or a frameless design of the display panel, the width of the first extension 231 is usually designed to be small, so the edge of the first extension 231 is very likely to be warped, affecting the visual effect. Therefore, in this embodiment, an encapsulation protection layer 70 is introduced on the side of the first extension portion 231 away from the substrate 00, and the encapsulation protection layer 70 at least overlaps with the edge of the first extension portion 231. The encapsulation protection layer 70 can fix the edge of the first extension portion 231 to prevent the edge of the first extension portion 231 from warping. It should be noted that the adhesion of the encapsulation protection layer 70 is greater than the adhesion of the first extension portion 231, part of the encapsulation protection layer 70 is in direct contact with the first protection layer 50, and part of the encapsulation protection layer 70 is in direct contact with the edge of the first extension portion 231, and the edge of the first extension portion 231 is reliably fixed by a strong adhesion effect. Optionally, the encapsulation protection layer 70 includes a black light-shielding material.

[0095] Fig. 20 FIG. 2 is a diagram showing a relative position relationship between the encapsulation protection layer 70, the first extension portion 231 and the first protection layer 50. Please refer to FIG. Fig. 20In an optional embodiment of the present disclosure, the encapsulation protection layer 70 includes a plurality of microstructures 71 arranged along the edge of the first extension portion 231, and the projection of the microstructure 71 on the first surface S1 includes an arc-shaped edge. The microstructure 71 of the encapsulation protection layer 70 can be regarded as a dot-shaped structure, and the plurality of dot-shaped structures are densely arranged along the edge of the first extension portion 231, forming a uniform wave-like structure on the side of the edge of the first extension portion 231 away from the side of the display panel, so that the edge of the encapsulation protection layer 70 toward the center of the display panel is more symmetrical, which is conducive to reducing the abruptness of the visual effect of the boundary of the display panel.

[0096] Please refer to Fig.18 and Fig.19 In an optional embodiment of the present disclosure, along a direction perpendicular to the plane where the array substrate 10 is located, the projection of the microstructure 71 on the first surface S1 covers at least part of the side surface of the first extension portion 231. In this way, the edge of the first extension portion 231 is covered by the microstructure 71, and the microstructure 71 is in direct contact with the side surface of the first extension portion 231, which is conducive to increasing the contact area between the microstructure 71 and the side surface of the first extension portion 231, and is conducive to improving the fixing reliability of the microstructure 71 to the edge of the first extension portion 231, so as to be more conducive to avoiding the problem of warping of the edge of the first extension portion 231.

[0097] Please continue to refer to Fig. 20 In an optional embodiment of the present disclosure, the projections of adjacent microstructures 71 overlap along a direction perpendicular to the plane where the array substrate 10 is located. Taking the projection of the microstructure 71 on the plane where the array substrate 10 is located as a circle with the same diameter as an example, when the projections of adjacent microstructures 71 overlap, the distance between the centers of the two adjacent circular microstructures 71 will be smaller than the diameter of a single microstructure 71, and at this time, the adjacent microstructures 71 can be ensured to be closely arranged, so as to improve the reliability of fixing the microstructure 71 to the edge of the first extension portion 231.

[0098] In an optional embodiment of the present disclosure, the diameter of the microstructure 71 is 1 μm ≤ d ≤ 100 μm. If the diameter of the microstructure 71 is set to be smaller, for example, less than 1 μm, the microstructure 71 will not be sufficient to directly contact the upper surface of the first extension portion 231, the side of the first extension portion 231 and part of the first protective layer 50 at the same time, which will affect the fixation reliability of the microstructure 71 to the first extension portion 231. Therefore, in this embodiment, when the diameter of the microstructure 71 is set to be greater than or equal to 1 μm, at least part of the microstructure 71 can be directly in contact with the upper surface of the first extension portion 231, part of the microstructure 71 can be directly in contact with the side of the first extension portion 231, and part of the microstructure 71 can be directly in contact with the first protective layer 50 on the side of the first extension portion 231, thereby facilitating the fixation reliability of the microstructure 71 to the edge of the first extension portion 231 and preventing the edge of the first extension portion 231 from warping. In addition, considering that the width of the first extension portion 231 is less than or equal to 100 μm, when the diameter of the microstructure 71 is set to be less than or equal to 100 μm, when the microstructure 71 is formed, the microstructure 71 can be controlled to be in direct contact with the upper surface and side surfaces of the first extension portion 231 and in direct contact with at least a portion of the first protective layer 50, while at the same time, it is possible to avoid the diameter of the microstructure 71 being too large and exceeding the size of the first extension portion 231, thereby affecting the design of the narrow frame or ultra-narrow frame of the display panel.

[0099] Optionally, the diameter of the microstructure 71 is 10 μm≤d≤90 μm, or 20 μm≤d≤80 μm, or 30 μm≤d≤60 μm, or 40 μm≤d≤50 μm, which is not specifically limited in the present disclosure.

[0100] Fig.21 Shown Figure 1 Another BB cross-sectional view of the display panel. Fig. 22 Shown Figure 1 Another CC cross-sectional view of the display panel, please refer to Fig.21 and Fig. 22 In an optional embodiment of the present disclosure, at least one of the first side surface CM1 and the second side surface CM2 is perpendicular to the second surface S2. That is, the first side surface CM1 and the second side surface CM2 of the array substrate 10 are planar structures perpendicular to the first surface S1 of the array substrate 10. In this way, the first side surface CM1 and the second side surface CM2 can be formed by conventional cutting, which is conducive to simplifying the manufacturing process of the display panel.

[0101] Please refer to Figure 4 and Figure 5In an optional embodiment of the present disclosure, at least one of the first side surface CM1 and the second side surface CM2 includes a first sub-side surface 81, a second sub-side surface 82, and a first connecting surface 83 connecting the first sub-side surface 81 and the second sub-side surface 82, wherein the first sub-side surface 81 is connected to the first surface S1, the second sub-side surface 82 is connected to the second surface S2, the angle between the first sub-side surface 81 and the first surface S1 is an obtuse angle, the angle between the second sub-side surface 82 and the second surface S2 is an obtuse angle, and the first connecting surface 83 is perpendicular to the light emitting surface of the display panel.

[0102] This embodiment shows a solution in which the first side surface CM1 and the second side surface CM2 of the array substrate 10 are non-planar structures. The first side surface CM1 and the second side surface CM2 both include a first connecting surface 83 that is perpendicular to the first surface S1 and the second surface S2. A first sub-side surface 81 for connecting the first connecting surface 83 and the first surface S1, and a second sub-side surface 82 for connecting the first connecting surface 83 and the second surface S2 are respectively provided on both sides of the first connecting surface 83. The first sub-side surface 81 and the second sub-side surface 82 are both inclined surfaces. The first sub-side surface 81 and the second sub-side surface 82 can be regarded as being obtained by chamfering the edges of the rectangular structure. When the first side surface CM1 is set to a structure composed of a vertical surface and an inclined surface, when the connecting line L0 extends from the first surface S1 through the first side surface CM1 to the second surface S2, it will pass through the inclined first sub-side surface 81, the vertical first connecting surface 83, and the inclined second sub-side surface 82 in sequence. The first sub-side surface 81 can be used as an inclined transition surface between the first surface S1 and the first connecting surface 83, and the second sub-side surface 82 can be used as an inclined transition surface between the first surface S1 and the first connecting surface 83. The angle between the first sub-side surface 81 and the first surface S1 and the angle between the first sub-side surface 81 and the first connecting surface 83 are both obtuse angles, and the angle between the second sub-side surface 82 and the first connecting surface 83 and the angle between the second sub-side surface 82 and the second surface S2 are both obtuse angles. In this way, when laying out the connecting line L0, the connecting line L0 is avoided from passing through a relatively sharp right-angle area, and is instead routed in an obtuse angle area or a plane area with a gentler slope, which is beneficial to improving the adhesion reliability of the connecting line L0 on the first side surface CM1, and is also beneficial to avoiding the problem of possible disconnection of the connecting line L0 when passing through a sharp right-angle area. In addition, when the first side surface CM1 and the second side surface CM2 are both set to a combination structure of an inclined surface and a vertical surface, when a packaging structure is formed on the first side surface CM1 and the second side surface CM2, it is beneficial to improve the adhesion reliability of the packaging structure on the first side surface CM1 and the second side surface CM2, and further helps to improve the packaging reliability of the packaging structure to the array substrate 10.

[0103] Please refer to Figure 4In an optional embodiment of the present disclosure, the angle between the first sub-side surface 81 and the first surface S1 is α, and the angle between the second sub-side surface 82 and the second surface S2 is β, wherein α=β. In this way, the wiring condition of the obtuse-angle region passed by the connecting line L0 when extending from the first surface S1 to the first sub-side surface 81 is the same as the wiring condition of the obtuse-angle region passed by the connecting line L0 when extending from the second sub-side surface 82 to the second surface S2, and the force condition of the connecting line L0 is the same, which is conducive to improving the overall force uniformity of the connecting line L0 and improving the stability of the signal transmitted by the connecting line L0.

[0104] Optionally, the angle between the first sub-side surface 81 and the first connecting surface 83, the angle between the second sub-side surface 82 and the first connecting surface 83, the angle between the first sub-side surface 81 and the first surface S1, and the angle between the second sub-side surface 82 and the second surface S2 are all the same. In this way, when the connecting trace L0 is laid out on the first side surface CM1 and the second side surface CM2, the angle formed by the connecting trace L0 at the corner position is consistent, which is also conducive to improving the overall force uniformity of the connecting trace L0.

[0105] Please refer to Figure 4 and Figure 5 In an optional embodiment of the present disclosure, along the direction perpendicular to the first surface S1, the height of the first sub-side surface 81 is h1, and the height of the second sub-side surface 82 is h2, and h1=h2. When the angle α between the first sub-side surface 81 and the first surface S1 is equal to the angle β between the second sub-side surface 82 and the second surface S2, the present embodiment further sets the height h1 of the first sub-side surface 81 to be the same as the height h2 of the second sub-side surface 82. According to the Pythagorean theorem, the length of the first sub-side surface 81 will be the same as the length of the second sub-side surface 82. The first sub-side surface 81 and the second sub-side surface 82 are equivalent to being symmetrically distributed on both sides of the first connecting surface 83. The symmetrical setting is also conducive to improving the force uniformity of the connecting line L0 when the connecting line L0 is laid out on the first side surface CM1 and the second side surface CM2. At the same time, the first sub-side surface 81 and the second sub-side surface 82 can also be formed by a cutting process, which is conducive to simplifying the cutting process and improving production efficiency.

[0106] Optionally, refer to Figure 6 and Fig.13 , the above embodiment shows a solution in which the display panel includes a first side surface CM1 and three second side surfaces CM2, the first side surface CM1 and the second side surface CM2 are adjacent, and the connection line L0 is introduced from a first side surface CM1 to the back of the display panel. At this time, the packaging structure corresponding to a single first side surface CM1 can refer to the above embodiment, and the packaging structure corresponding to each second side surface CM2 can also refer to the above embodiment. In addition, in some other embodiments of the present disclosure, please refer to Fig.23 and Fig.24The display panel includes two first side surfaces CM1 and two second side surfaces CM2. The two first side surfaces CM1 are arranged opposite to each other, and the first side surface CM1 is adjacent to the second side surface CM2. Fig.23 FIG. 1 is another schematic plan view of a display panel provided by an embodiment of the present disclosure. Fig.24 Another top view of the array substrate 10 and the packaging structure located on the side of the array substrate 10 provided by the embodiment of the present disclosure is shown. When two first side surfaces CM1 are introduced into the display panel, the two first side surfaces CM1 are arranged opposite to each other in this embodiment, and the connection line L0 can be routed from the two first side surfaces CM1 arranged opposite to each other. The two first side surfaces CM1 arranged opposite to each other use the same first packaging structure 91, and the two second side surfaces CM2 arranged opposite to each other use the same second packaging structure 92, which is conducive to achieving the symmetry of the packaging structure in the display panel and improving the overall visual effect of the display panel.

[0107] Fig.25 and Fig.26 Another schematic diagram of a display panel provided by the embodiment of the present disclosure is shown in FIG. Figures 1 to 3 In an optional embodiment of the present disclosure, the side surface of the array substrate 10 also includes a transition surface CM0, and the transition surface CM0 is used to connect the adjacent first side surface CM1 and the second side surface CM2, and / or the transition surface CM0 is used to connect the adjacent second side surface CM2; along the direction perpendicular to the first surface S1, the angle between the orthographic projection of the transition surface CM0 and the orthographic projection of the side surface connected thereto is an obtuse angle.

[0108] Fig.25 In the embodiment, the array substrate 10 includes a first side surface CM1 and three second side surfaces CM2, the first side surface CM1 is adjacent to two second side surfaces CM2 respectively, the second side surfaces CM2 arranged opposite to the first side surface CM1 are also adjacent to the other two second side surfaces CM2 respectively, a transition surface CM0 is arranged between adjacent first side surfaces CM1 and second side surfaces CM2, and a transition surface CM0 is also arranged between two adjacent second side surfaces CM2. Fig.26 In the embodiment, the array substrate 10 includes two first side surfaces CM1 and two second side surfaces CM2, the two first side surfaces CM1 are arranged opposite to each other, the two second side surfaces CM2 are arranged opposite to each other, the first side surface CM1 is adjacent to the two second side surfaces CM2, the second side surface CM2 is adjacent to the two first side surfaces CM1, and a transition surface CM0 is arranged between the adjacent first side surfaces CM1 and the second side surfaces CM2. The above transition surface CM0 can be regarded as obtained by cutting the four corners of the display panel with a rectangular structure.

[0109] In the related art, the display panel is generally embodied as a rectangular parallelepiped structure, and its four corners are right angles. For display panels without borders or with extremely narrow borders, the edges of the panel need to be processed through cutting and fine edge grinding during the manufacturing process. Since the above-mentioned right-angle area corresponds to two side surfaces, the right-angle area is an overlapping area that needs to be produced by two edge grindings. Due to the limitation of the processing technology, it is very easy to cause the four corners of the display panel to collapse, which in turn causes problems such as cracks in the substrate, affecting the reliability of the panel. In addition, the existence of the right-angle corner area is prone to corner chipping caused by bumps during the splicing process of the display panel.

[0110] In view of the above problems, the embodiment of the present disclosure performs a corner cutting design on the four corner regions of the array substrate 10, so that the side of the array substrate 10 includes a transition surface CM0 connecting the adjacent first side CM1 and the second side CM2, or connecting the adjacent second side CM2, and the angle between the orthographic projection of the transition surface CM0 and the orthographic projection of the side connected thereto is an obtuse angle, thereby avoiding the existence of sharp right-angle regions, thereby facilitating the avoidance of chipping in the four right-angle regions, and further avoiding the problem of cracks caused by chipping. After the transition surface CM0 is formed, the edge region of the display panel only has an obtuse angle, and no longer has a sharp right angle, thereby avoiding the problem of missing corners caused by bumps that are easy to occur during the splicing process of the display panel.

[0111] It should be noted that when the first side surface CM1 and the second side surface CM2 are embodied as follows Figure 4 and Figure 5 When the structure shown is a combination of the inclined surface and the vertical surface, the transition surface CM0 can also be embodied as the same structure as the first side surface CM1 and the second side surface CM2.

[0112] Please refer to Fig.25 and Fig.26 In an optional embodiment of the present disclosure, along the direction perpendicular to the first surface S1, the angles between the transition surface CM0 and the orthographic projections of the two side surfaces connected to the transition surface CM0 are the same. That is, when the angle is cut, the cut portion is an isosceles right triangle, and optionally, the sizes of the four cut isosceles right triangles are equal. This is conducive to improving the visual consistency of the area where the transition surface CM0 of the display panel is located.

[0113] Fig. 27 and Fig.28 Another schematic diagram of a display panel provided by the embodiment of the present disclosure is shown in FIG. Fig.25 and Fig.26 ,as well as Fig. 27 and Fig.28In an optional embodiment of the present disclosure, the packaging structure includes a first packaging structure 91 located on the first side CM1, the first packaging structure 91 includes a wiring packaging layer 21, and the wiring packaging layer 21 is in direct contact with the connecting wiring L0 and the first side CM1; please refer to Fig.25 and Fig.26 , along the circumferential direction of the projection of the side surface on the first surface S1, the wiring package layer 21 is only located on the first side surface CM1, or, please refer to Fig. 27 and Fig.28 The routing packaging layer 21 is located on the first side surface CM1 and the transition surface CM0 connected to the first side surface CM1.

[0114] Considering that the first side surface CM1 is provided with a connecting wire L0 , the wire encapsulation layer 21 is used to directly contact the connecting wire L0 and encapsulate the connecting wire L0 . The filling encapsulation layer 22 is provided on the entire side surface of the array substrate 10 . Fig.25 and Fig.26 The embodiment shown, with Fig. 27 and Fig.28 The difference between the embodiments shown is that the coverage of the routing encapsulation layer 21 is different. Fig.25 and Fig.26 In the illustrated embodiment, the routing encapsulation layer 21 is only located on the first side surface CM1 where the connecting routing L0 is provided. This method can encapsulate the connecting routing L0 in a targeted manner, and the transition surface CM0 connected to the first side surface CM1 can also be used as a cutoff position reference of the routing encapsulation layer 21 to simplify the manufacturing process of the routing encapsulation layer 21. Fig. 27 and Fig.28 In the illustrated embodiment, the routing encapsulation layer 21 extends from the first side surface CM1 to at least a portion of the transition surface CM0 adjacent to the first side surface CM1. This arrangement is equivalent to increasing the coverage area of ​​the routing encapsulation layer 21, while achieving full coverage of the connecting routing L0 of the first side surface CM1 and extending it to a certain extent, which is beneficial to further improve the packaging reliability of the routing encapsulation layer 21 for the connecting routing L0.

[0115] Please refer to Fig.25 and Fig.26 , Fig. 27 and Fig.28 In an optional embodiment of the present disclosure, the packaging structure also includes a filling packaging layer 22 and a light-shielding packaging layer 23 arranged corresponding to the transition surface CM0. On the transition surface CM0, the filling packaging layer 22 is located between the transition surface CM0 and the light-shielding packaging layer 23.

[0116] When a transition surface CM0 is introduced between adjacent first side surfaces CM1 and second side surfaces CM2, and between adjacent second side surfaces CM2, the embodiment of the present disclosure also introduces a filling packaging layer 22 and a light-shielding packaging layer 23 on one side of the transition surface CM0, which is beneficial to preventing external moisture and oxygen from penetrating into the display panel from the position of the transition surface CM0, thereby helping to improve the overall packaging reliability of the display panel.

[0117] Please continue to refer to Fig.25 and Fig.26 , Fig. 27 and Fig.28 In an optional embodiment of the present disclosure, the packaging structure also includes a filling packaging layer 22 and a light-shielding packaging layer 23 arranged corresponding to the first side surface CM1 and the second side surface CM2, the filling packaging layer 22 located on the first side surface CM1, the second side surface CM2 and the transition surface CM0 is made of the same material and the same process, and the light-shielding packaging layer 23 located on the first side surface CM1, the second side surface CM2 and the transition surface CM0 is made of the same material and the same process.

[0118] In actual production, the routing encapsulation layer 21 can be first formed at the position corresponding to the first side surface CM1, so that the routing encapsulation layer 21 is at least located on the first side surface CM1, at least part of the first surface S1 and at least part of the second surface S2, covering all the connecting lines L0 on the first side surface CM1, and covering at least part of the connecting lines L0 on the first surface S1 and the second surface S2. After the routing encapsulation layer 21 is completed, the filling encapsulation layer 22 is formed on the first side surface CM1, the second side surface CM2 and the transition surface CM0 in the same process, and there is no need to introduce different production processes for different side surfaces and transition surfaces CM0, which is conducive to simplifying the production process. In addition, when the filling encapsulation layer 22 on different side surfaces and transition surfaces CM0 is formed in the same process, the filling encapsulation layer 22 in the packaging structure will be able to form an integral closed structure, avoiding the problem that gaps may exist between the filling encapsulation layers 22 in different regions when different processes are used, which affects the packaging effect, so it is also conducive to improving the packaging reliability of the filling encapsulation layer 22. After completing the production of the filling packaging layer 22, the shading packaging layer 23 on different side faces and the transition surface CM0 can be formed in the same process, so that the shading packaging layer 23 forms an overall closed structure. It can also avoid the problem that when different processes are used, there may be gaps between the shading packaging layers 23 in different areas, thereby affecting the packaging effect and the shading effect. Therefore, the method of producing and forming the shading packaging layers 23 in different areas in the same process is also beneficial to improving the overall shading effect and the packaging effect of the shading packaging layer 23.

[0119] Based on the same inventive concept, the present disclosure also provides a display device, Fig.29 FIG. 1 is a schematic diagram of a structure of a display device provided in an embodiment of the present disclosure. Please refer to FIG. Fig.29 , the display device 200 includes the display panel 100 in any of the above embodiments. The display device 200 provided in the embodiment of the present disclosure can be any electronic device with display function, such as a tablet computer with touch and display functions, a display product in a display cabinet, a television, or a vehicle-mounted display device, and is particularly suitable for display devices with extremely narrow borders or no borders. The display device 200 provided in the embodiment of the present disclosure has the beneficial effects of the display panel 100 provided in the embodiment of the present disclosure. For details, please refer to the specific description of the display panel 100 in the above embodiments, and this embodiment will not be repeated here.

[0120] Understandably, Fig.29 The display device is only illustrated in a rectangular structure. In some other embodiments of the present disclosure, the display device 200 may also be circular, elliptical or any other feasible shape, and the present disclosure does not specifically limit this.

[0121] Fig.30 and Fig.31 Another schematic diagram of the structure of the display device provided in the embodiment of the present disclosure is shown respectively. Fig.30 and Fig.31 In an optional embodiment of the present disclosure, the display device includes at least two display panels spliced ​​along a first direction F1; the first side surface CM1 is located on at least one side of the display panel along a second direction F2, and the first direction F1 and the second direction F2 intersect; and / or the first side surface CM1 is located on at least one side of the display panel along the first direction F1.

[0122] It should be noted that Fig.30 and Fig.31 The illustrated embodiment is only described by taking the display device formed by splicing four display panels as an example, and does not limit the number of display panels actually included in the display device. The spliced ​​display device may include at least two display panels. Fig.30 The illustrated embodiment shows a situation in which the display panel includes only one first side surface CM1. Assuming that the display device includes an upper edge and a lower edge extending along the first direction F1 and arranged opposite to each other along the second direction F2, at this time, the first side surface CM1 of each display panel may be located on the side of the second side surface CM2 opposite to it toward the lower edge of the display panel, or, the first side surface CM1 of each display panel may be located on the side of the second side surface CM2 opposite to it toward the upper edge of the display panel. Fig.31The embodiment shown shows a case where the display panel includes two first side surfaces CM1 arranged opposite to each other. Assuming that the display device includes an upper edge and a lower edge extending along the first direction F1 and arranged opposite to each other along the second direction F2, the two first side surfaces CM1 of each display panel in the display device can be arranged opposite to each other along the second direction F2. During actual splicing, the arrangement direction of the first side surfaces CM1 in different display panels can be flexibly set according to actual conditions, and the present disclosure does not specifically limit this.

[0123] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0124] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: An array substrate, comprising a first surface and a second surface arranged opposite to each other in a direction perpendicular to the light emitting surface of the display panel, and a side surface connecting the first surface and the second surface; the side surface comprises a first side surface and a second side surface; A first pad and a second pad, wherein the first pad is located on the first surface, and the second pad is located on the second surface; A connecting line, at least located on the first side, the connecting line is used to connect the first pad and the second pad; no connecting line is provided on the second side; The packaging structure at least covers a side surface of the array substrate, and the packaging structure located on the first side surface is different from the packaging structure located on the second side surface.

2. The display panel according to claim 1, characterized in that: The encapsulation structure includes a first encapsulation structure located on the first side and a second encapsulation structure located on the second side. The number of encapsulation layers included in the first encapsulation structure is greater than the number of encapsulation layers included in the second encapsulation structure.

3. The display panel according to claim 2, characterized in that: The first encapsulation structure includes M encapsulation layers that are stacked, and the second encapsulation structure includes N encapsulation layers, MN≥1, M≥2, and N≥1.

4. The display panel according to claim 2, characterized in that: The first packaging structure includes a routing packaging layer and a filling packaging layer. On the side of the first side facing away from the array substrate, the routing packaging layer is in direct contact with the connecting routing and the filling packaging layer, and at least part of the routing packaging layer is located between the connecting routing and the filling packaging layer.

5. The display panel according to claim 2, characterized in that: The second encapsulation structure includes a filling encapsulation layer, and the filling encapsulation layer is in direct contact with the second side surface at a side of the second side surface facing away from the array substrate.

6. The display panel according to claim 4 or 5, characterized in that: The display panel also includes a light-emitting element electrically connected to the array substrate and located on the first surface; at least part of the filling encapsulation layer is located on the side of the first surface away from the second surface; the distance between the surface of the light-emitting element away from the first surface and the second surface is H0, and the distance between the surface of the filling encapsulation layer away from the first surface and the second surface is H1, and H1>H0.

7. The display panel according to claim 6, characterized in that: The display panel further comprises a first light shielding layer and a light-transmitting layer located on the first surface, wherein the first light shielding layer is at least partially located between adjacent light-emitting elements, and the light-transmitting layer is located on a side of the first light shielding layer away from the first surface and covers the light-emitting elements and at least a portion of the first light shielding layer; The filling encapsulation layer contacts side surfaces of the first light shielding layer and the light transmitting layer.

8. The display panel according to claim 4 or 5, characterized in that: The display panel further includes a light emitting element and a first light shielding layer electrically connected to the array substrate and located on the first surface, wherein the first light shielding layer is at least partially located between adjacent light emitting elements; The distance between the surface of the light-emitting element away from the first surface and the second surface is H0, the distance between the surface of the first shading layer away from the first surface and the second surface is H2, and the distance between the surface of the filling encapsulation layer away from the first surface and the second surface is H1, wherein H0≥H2≥H1.

9. The display panel according to claim 8, characterized in that: The display panel further includes a light-transmitting layer, which is located on a side of the first light-shielding layer away from the first surface and covers the light-emitting element and at least a portion of the first light-shielding layer; The filling encapsulation layer contacts a side surface of the first light shielding layer.

10. The display panel according to claim 4 or 5, characterized in that: The first encapsulation structure and the second encapsulation structure include a light-shielding encapsulation layer, and the light-shielding encapsulation layer is at least partially located on a side of the filling encapsulation layer away from the side surface.

11. The display panel according to claim 10, characterized in that: The display panel further includes a light emitting element and a first light shielding layer electrically connected to the array substrate and located on the first surface, wherein the first light shielding layer is at least partially located between adjacent light emitting elements; The light-shielding packaging layer includes a main body and a first extension portion connected to the main body, the main body is located on the side of the filling and packaging layer away from the side surface, the first extension portion is located on the light-emitting side of the light-emitting element, and along a direction perpendicular to the plane where the array substrate is located, the first extension portion does not overlap with the light-emitting element.

12. The display panel according to claim 11, characterized in that: Along a direction perpendicular to the plane where the array substrate is located, a distance between a surface of the light emitting element that is away from the array substrate and the first extension portion is greater than 0.

13. The display panel according to claim 11, characterized in that: Along a direction perpendicular to a plane where the array substrate is located, the first extension portion overlaps the first pad.

14. The display panel according to claim 11, characterized in that: Along a direction perpendicular to the plane where the array substrate is located, the first extension portion overlaps with the first light shielding layer.

15. The display panel according to claim 11, characterized in that: Along the direction from the first surface to the side surface, the width of the first extension portion is D01, the width of the filling encapsulation layer is D02, and D01≥D02.

16. The display panel according to claim 11, characterized in that: The first extension portion includes a first sub-extension portion corresponding to the first packaging structure and a second sub-extension portion corresponding to the second packaging structure; along the direction from the first surface to the side surface, the width of the first sub-extension portion is D011, and the width of the second sub-extension portion is D012, wherein D011>D012.

17. The display panel according to claim 11, characterized in that: Along the direction from the first surface to the side surface, the width of the first extension portion is D01, and 0<D01≤100 μm.

18. The display panel according to claim 11, characterized in that: The first extension portion and the main body portion are integrally formed.

19. The display panel according to claim 11, characterized in that: Along a direction perpendicular to the plane where the array substrate is located, a distance between the first extension portion and the filling packaging layer is greater than 0.

20. The display panel according to claim 19, characterized in that: The display panel further includes a light-transmitting layer and a first protective layer, wherein the light-transmitting layer is located on a side of the first light-shielding layer and the light-emitting element away from the first surface, and the first protective layer is located on a side of the light-transmitting layer away from the first surface; The first extension portion is located on a surface of the first protection layer away from the light-transmitting layer, and the filling encapsulation layer is located on a side of the first protection layer facing the array substrate.

21. The display panel according to claim 20, characterized in that: The display panel also includes an encapsulation protective layer, which is located on the side of the first surface facing away from the second surface, and the encapsulation protective layer is located on the side of the first extension portion and the first protective layer facing away from the first surface; along a direction perpendicular to the plane where the array substrate is located, the encapsulation protective layer at least overlaps with the edge of the first extension portion.

22. The display panel according to claim 21, characterized in that: The encapsulation protection layer includes a plurality of microstructures arranged along edges of the first extension portion, and projections of the microstructures on the first surface include arc-shaped edges.

23. The display panel according to claim 22, characterized in that: Along a direction perpendicular to the plane where the array substrate is located, a projection of the microstructure on the first surface covers at least a portion of a side surface of the first extension portion.

24. The display panel according to claim 22, characterized in that: Along a direction perpendicular to the plane where the array substrate is located, projections of adjacent microstructures overlap.

25. The display panel according to claim 22, characterized in that: The diameter of the microstructure is 1 μm≤d≤100 μm.

26. The display panel according to claim 1, characterized in that: At least one of the first side surface and the second side surface is perpendicular to the second surface.

27. The display panel according to claim 1, characterized in that: At least one of the first side surface and the second side surface includes a first sub-side surface, a second sub-side surface, and a first connecting surface connecting the first sub-side surface and the second sub-side surface, wherein the first sub-side surface is connected to the first surface, the second sub-side surface is connected to the second surface, the angle between the first sub-side surface and the first surface is an obtuse angle, the angle between the second sub-side surface and the second surface is an obtuse angle, and the first connecting surface is perpendicular to the light emitting surface of the display panel.

28. The display panel according to claim 27, characterized in that: An included angle between the first sub-side surface and the first surface is α, and an included angle between the second sub-side surface and the second surface is β, wherein α=β.

29. The display panel according to claim 27, characterized in that: Along a direction perpendicular to the first surface, a height of the first sub-side surface is h1, a height of the second sub-side surface is h2, and h1=h2.

30. The display panel according to claim 1, characterized in that: The display panel includes one first side surface, and the first side surface is adjacent to the second side surface; or, the display panel includes two first side surfaces, the two first side surfaces are arranged opposite to each other, and the first side surface is adjacent to the second side surface.

31. The display panel according to claim 1, characterized in that: The side surface of the array substrate also includes a transition surface, which is used to connect the adjacent first side surface and the second side surface, and / or the transition surface is used to connect the adjacent second side surface; along the direction perpendicular to the first surface, the angle between the orthographic projection of the transition surface and the orthographic projection of the side surface connected thereto is an obtuse angle.

32. The display panel according to claim 31, characterized in that: Along a direction perpendicular to the first surface, the transition surface and the orthographic projections of two side surfaces connected to the transition surface have the same included angle.

33. The display panel according to claim 32, characterized in that: The packaging structure includes a first packaging structure located on the first side surface, the first packaging structure includes a wiring packaging layer, and the wiring packaging layer is in direct contact with the connecting wiring and the first side surface; Along the circumferential direction of the projection of the side surface on the first surface, the routing encapsulation layer is only located on the first side surface, or the routing encapsulation layer is located on the first side surface and the transition surface connected to the first side surface.

34. The display panel according to claim 33, characterized in that: The packaging structure further includes a filling packaging layer and a light-shielding packaging layer arranged corresponding to the transition surface. On the transition surface, the filling packaging layer is located between the transition surface and the light-shielding packaging layer.

35. The display panel according to claim 34, characterized in that: The packaging structure also includes a filling packaging layer and a light-shielding packaging layer arranged corresponding to the first side surface and the second side surface. The filling packaging layer located on the first side surface, the second side surface and the transition surface is made of the same material and process, and the light-shielding packaging layer located on the first side surface, the second side surface and the transition surface is made of the same material and process.

36. A display device, characterized in that: A display panel comprising any one of claims 1 to 35.

37. The display device according to claim 36, characterized in that The display device comprises at least two display panels spliced ​​along a first direction; the first side surface is located at least one side of the display panel along a second direction, and the first direction and the second direction intersect; And / or, the first side surface is located on at least one side of the display panel along the first direction.

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