Display screen packaging structure, display screen and manufacturing method of display screen packaging structure

Abstract

The invention provides a display screen packaging structure, a display screen and a manufacturing method of the display screen packaging structure. The display screen packaging structure comprises a driving substrate, a plurality of light-emitting devices, a transparent layer, a shading layer and a packaging layer, and the driving substrate is provided with a display area and a non-display area surrounding the display area; the light-emitting devices are arranged in the display area at intervals. The transparent layer wraps the light-emitting devices, and is filled in interval areas and peripheral areas among the plurality of light-emitting devices; the shading layer covers the transparent layer in the interval area and covers the transparent layer in the peripheral area, and the surface, away from the driving substrate, of the shading layer is not higher than the light emitting surface of the light emitting device; the encapsulation layer covers the light shielding layer and the transparent layer above the light emitting device. Planarization of the driving substrate is realized, and the side light emitting rate of the light emitting device is improved; patterning of the shading layer is achieved, and large-view-angle color cast caused by position deviation of the light-emitting device or inconsistent distance between the shading layer and the light-emitting device is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display screen packaging structure, a display screen, and a method for manufacturing the display screen packaging structure. Background Art

[0002] Micro LED is a new type of light-emitting diode. It is very small, usually only a few microns to a few millimeters, but its brightness and color saturation are very high. Compared with traditional display devices such as LCD and OLED, Micro LED devices have greater performance advantages, such as high brightness, high response rate, low power consumption, and long life. Therefore, they have great market application prospects in the field of optical display technology.

[0003] For non-transparent Micro LED displays, achieving better image quality requires relatively high ambient contrast and relatively low reflectivity. However, in the prior art, the packaging method of the Micro LED display is to make a patterned BM on the upper cover, make a light hole on the top surface of the light-emitting device, and then combine the side of the upper cover with the patterned BM with the top surface of the light-emitting device. This packaging method will hardly reduce the formal light output angle, but it cannot utilize the light from the side of the light-emitting device, and the position of the light-emitting device is easily offset, resulting in a large visual color deviation.

[0004] In order to improve the light energy utilization rate of the light-emitting device and reduce the color deviation of the large viewing angle, the present application provides a display screen packaging structure, a display screen, and a method for manufacturing the display screen packaging structure. Summary of the invention

[0005] In view of the above problems and deficiencies of Micro LED display screens in the prior art, the present application provides a display screen packaging structure, a display screen, and a method for manufacturing a display screen packaging structure. In the display screen packaging structure, a transparent layer wraps the light-emitting device and fills the spacing area and the peripheral area between the multiple light-emitting devices to achieve the flattening of the driving substrate; the light-shielding layer covers the transparent layer above the spacing area and the peripheral area, and the surface of the light-shielding layer away from the driving substrate is not higher than the thickness of the light-emitting device, thereby improving the light energy utilization rate of the light-emitting device and avoiding the large visual angle deviation caused by the displacement of the light-emitting device position or the inconsistent distance between the light-shielding layer and the light-emitting device.

[0006] According to one embodiment of the present application, a display screen packaging structure is provided, including:

[0007] a driving substrate, wherein the driving substrate has a display area and a non-display area surrounding the display area;

[0008] A plurality of light emitting devices, wherein the plurality of light emitting devices are arranged at intervals in the display area of ​​the driving substrate, and a side of the light emitting device away from the driving substrate is a light emitting surface;

[0009] A transparent layer, the transparent layer wraps the light emitting device and fills the spacing area and the peripheral area between the plurality of light emitting devices;

[0010] a light shielding layer, the light shielding layer covering the transparent layer in the spacing area and the transparent layer in the peripheral area, wherein a surface of the light shielding layer away from the driving substrate is not higher than a light emitting surface of the light emitting device;

[0011] An encapsulation layer covers the light-shielding layer and the transparent layer above the light-emitting device.

[0012] In some embodiments, the display screen packaging structure further includes a dam, which is disposed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer and the packaging layer.

[0013] In some embodiments, in the light emitting direction of the light emitting device, the sum of the thickness of the light shading layer and the thickness of the transparent layer covered by the light shading layer is less than the thickness of the light emitting device.

[0014] In some embodiments, the thickness of the transparent layer filled in the spacer area and the peripheral area is between 1 μm and 7 μm; the thickness of the light shielding layer is between 1 μm and 7 μm.

[0015] In some embodiments, the thickness of the encapsulation layer is between 10 μm and 200 μm.

[0016] In some embodiments, the refractive index of the light emitting surface of the light emitting device is greater than the refractive index of the transparent layer, and the refractive index of the transparent layer is greater than the refractive index of the encapsulation layer.

[0017] In some embodiments, the refractive index of the transparent layer is between 1.47 and 1.7; and the refractive index of the encapsulation layer is between 1.3 and 1.52.

[0018] In some embodiments, the refractive index of the light shielding layer is between 1.3 and 1.52.

[0019] In some embodiments, scattering particles are dispersed in the encapsulation layer.

[0020] In some embodiments, a lens array is disposed on a side of the encapsulation layer away from the driving substrate, and the lens array includes at least one microlens.

[0021] According to another embodiment of the present application, a method for manufacturing a display screen packaging structure is provided, comprising:

[0022] Providing a driving substrate, the driving substrate having a display area and a non-display area surrounding the display area;

[0023] Providing a plurality of light emitting devices, and arranging the plurality of light emitting devices at intervals in the display area of ​​the driving substrate, wherein a side of the light emitting device away from the driving substrate is a light emitting surface;

[0024] forming a transparent layer, wherein the transparent layer wraps the light emitting device and fills the spacing area and the peripheral area between the plurality of light emitting devices;

[0025] forming a light shielding layer, wherein the light shielding layer covers the transparent layer in the spacing area and the transparent layer in the peripheral area, and the surface of the light shielding layer away from the driving substrate is not higher than the light emitting surface of the light emitting device;

[0026] An encapsulation layer is formed, where the encapsulation layer covers the light shielding layer and the transparent layer above the light emitting device.

[0027] In some embodiments, the method further includes forming a dam, wherein the dam is formed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer and the encapsulation layer.

[0028] According to yet another embodiment of the present application, a display screen is provided, including a housing and at least one display unit disposed in the housing, wherein the display unit includes the display screen packaging structure provided in the present application.

[0029] As described above, the display screen packaging structure, display screen, and display packaging structure manufacturing method of the present application have the following characteristics:

[0030] Beneficial effects:

[0031] The display screen packaging structure of the present application wraps the light-emitting device with a transparent layer, and fills the spacing area and the peripheral area between the multiple light-emitting devices, so as to achieve the flattening of the driving substrate and improve the side light output rate of the light-emitting device; a shading layer is arranged above the transparent layer filled in the spacing area and the peripheral area to achieve patterning of the shading layer, and at the same time, the surface of the shading layer away from the driving substrate is not higher than the light output surface of the light-emitting device, thereby avoiding the large visual angle deviation caused by the displacement of the position of the light-emitting device or the inconsistent distance between the shading layer and the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 Shown is a schematic cross-sectional structure diagram of a Micro LED display packaging structure in the prior art.

[0033] Figure 2Shown is a schematic cross-sectional structure diagram of a display screen packaging structure provided in Embodiment 1 of the present application.

[0034] Figure 3 Shown is a top view structural schematic diagram of the display screen packaging structure provided in Example 1 of the present application.

[0035] Figure 4 Shown is a schematic cross-sectional structure diagram of another display screen packaging structure provided in the first embodiment of the present application.

[0036] Figure 5 Shown is a schematic cross-sectional structure diagram of yet another display screen packaging structure provided in the first embodiment of the present application.

[0037] Figure 6 Shown is a schematic cross-sectional structure diagram of a display screen packaging structure provided in the second embodiment of the present application.

[0038] Figure 7 Shown is a schematic cross-sectional structure diagram of a display screen packaging structure provided in Example 3 of the present application.

[0039] Figure 8 Shown is a schematic cross-sectional structure diagram of another display screen packaging structure provided in Example 3 of the present application.

[0040] Fig. 9 Shown is a flow chart of a method for manufacturing a display screen packaging structure provided in Embodiment 4 of the present application.

[0041] Figures 10 to 12 Shown is a schematic diagram of an intermediate structure of the display screen packaging structure formation process provided in the fourth embodiment of the present application.

[0042] Fig.13 Shown is a schematic diagram of the top view structure of the display screen provided in Example 5 of the present application.

[0043] Component number description

[0044] 11. driving substrate; 12. LED chip; 13. packaging layer; 14. upper substrate; 15. light-transmitting layer; 16. light-shielding layer; 100. driving substrate; 101. non-display area; 102. display area; 110. light-emitting device; 120. transparent layer; 130. light-shielding layer; 140. packaging layer; 150. dam; 160. lens array; 201. housing; 202. display unit; 1101. light-emitting surface; 1021. spacing area; 1022. peripheral area. DETAILED DESCRIPTION

[0045] The following describes the implementation of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application.

[0046] like Figure 1 As shown, in the prior art, the Micro LED display includes a driving substrate 11 and an upper substrate 14 that are arranged opposite to each other, a plurality of LED chips 12 are arranged at intervals on a side of the driving substrate 11 close to the upper substrate 14, and a side of the LED chip 12 away from the driving substrate 11 is a light emitting surface, and a packaging layer 13 wraps the plurality of LED chips 12 and covers the spacing area and the peripheral area of ​​the plurality of LED chips 12; a plurality of light-transmitting layers 15 are arranged at intervals on a side of the upper substrate 14 close to the driving substrate 11, and a light-shielding layer 16 is filled between the light-transmitting layers 15 and in the peripheral area of ​​the light-transmitting layers 15, and a patterned BM is formed on the upper cover plate 14; the driving substrate 11 is combined with the upper substrate 14, wherein the light-transmitting layer 15 corresponds one-to-one to the light emitting surface of the LED chip 12, and the light-shielding layer 16 corresponds to the packaging layer 13 in the spacing area and the peripheral area between the plurality of LED chips 12. The Micro LED display screen hardly reduces the formal light output angle. However, since the light from the side of the LED chip 12 is reflected and absorbed by the light shielding layer 16, the light from the side of the LED chip 12 cannot be emitted, and the light utilization rate is low. In addition, the position of the LED chip 12 is prone to deviation relative to the position of the light shielding layer 16, resulting in a large visual angle deviation. At the same time, the existing Micro LED display screen packaging requires hard pasting and hard precision alignment, resulting in high process costs.

[0047] In view of the above defects, the present application provides a display screen packaging structure, which is now described in detail through the following embodiments.

[0048] Embodiment 1

[0049] This embodiment provides a display screen packaging structure, such as Figure 2As shown, the display screen packaging structure of this embodiment includes a driving substrate 100, a plurality of light-emitting devices 110, a transparent layer 120, a light-shielding layer 130, a packaging layer 140 and a dam 150. The driving substrate 100 has a display area 102 and a non-display area 101 surrounding the display area 102, and the plurality of light-emitting devices 110 are arranged at intervals in the display area 102, and the side of the light-emitting device 102 away from the driving substrate 100 is a light-emitting surface 1101. The driving substrate 100 is used to drive the above-mentioned light-emitting devices 110 to emit light, and the light-emitting device 110 is an LED chip. Optionally, the LED chip is a Micro-LED chip. The LED chip can be a vertical structure LED chip or a flip-chip structure LED chip.

[0050] like Figure 2 and Figure 3 As shown, the transparent layer 120 wraps the light emitting device 110 and fills the spacing area 1021 and the peripheral area 1022 between the plurality of light emitting devices 110. Figure 2 , Figure 4 , Figure 5 As shown, the transparent layer 120 covering the light emitting surface 1101 of the light emitting device can be formed into different shapes according to actual needs, such as an arc shape (such as Figure 2 As shown), it can also form a rectangle. When forming a rectangle, the two corners of the rectangle away from the light emitting surface of the light emitting device 110 can be right angles (such as Figure 4 ), or rounded corners (as shown Figure 5 The transparent layer 120 fills the spacing area 1021 and the peripheral area 1022 between the light emitting devices 110 , which is beneficial to achieve the planarization of the driving substrate 100 .

[0051] like Figure 2 and Figure 3As shown, the light shielding layer 130 covers the transparent layer 120 in the spacing area 1021 and the transparent layer 120 in the peripheral area 1022, so as to realize the patterning of the light shielding layer 130. In addition, the surface of the light shielding layer 130 away from the driving substrate 100 is not higher than the light emitting surface 1101 of the light emitting device 110, so as to avoid the position deviation of the light emitting device 110 or the inconsistent distance between the light shielding layer 130 and the light emitting device 110, thereby avoiding the large viewing angle deviation. The light shielding layer 130 can be a light absorbing material layer, such as a black glue layer. Since the transparent layer 120 wraps around the light emitting device 110, that is, there is a transparent layer 120 of a certain thickness around the light emitting device 110, the formed light shielding layer 130 and the light emitting device 110 have a certain gap in the horizontal direction. Due to the existence of the gap between the two, the light shielding layer 130 can reflect part of the light emitted from the side of the light emitting device 110 into the transparent layer 120 through the light shielding layer 130, and emit from the transparent layer 120 (the light emitting surface of the light emitting device 110), and at the same time, part of the light is directly emitted from the gap between the light shielding layer 130 and the light emitting device 110, thereby improving the utilization rate of the light on the side of the light emitting device 110; and the light shielding layer 130 also has the function of preventing crosstalk between the light of adjacent light emitting devices 110. The width of the gap between the light shielding layer 130 and the light emitting device 110 in the horizontal direction can range from 0.1μm to 3μm, for example. Specifically, the gap width may be, for example, 0.1 μm, 0.5 μm, 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, or the like.

[0052] like Figure 2 As shown, the encapsulation layer 140 covers the light shielding layer 130 and the transparent layer 120 above the light emitting device 110. The encapsulation layer 140 encapsulates the light shielding layer 130 and the transparent layer 120 to achieve the sealing of the display screen, and can be waterproof, dustproof, anti-corrosion, etc., to extend the service life of the display screen. The dam 150 is arranged in the non-display area 101 of the driving substrate 100, and surrounds the transparent layer 120, the light shielding layer 130 and the encapsulation layer 140. The dam 150 can prevent the fluid from overflowing during the formation of the transparent layer 120 and the light shielding layer 130, which is beneficial to the flattening of the driving substrate 100 and the patterning of the light shielding layer 130; at the same time, it can also reflect the light emitted from the side of the light emitting device 110 to improve the brightness of the light emitting device 110. It can be understood that the thickness of the dam 150 is greater than the sum of the thickness of the light emitting device 110 and the transparent layer 120 above the light emitting surface 1101 of the light emitting device. The material of the dam 150 can be silicone, etc. The encapsulation layer 140 encapsulates the display area 102 surrounded by the dam 150 and the side surface of the dam 150 close to the display area 102 .

[0053] In an optional embodiment, the transparent layer 120 and the light shielding layer 130 can be completed by rapid inkjet printing, without the need for hard-sticking and hard-precision vacuum alignment equipment, thereby reducing process costs and improving process efficiency.

[0054] In an optional embodiment, if Figure 2 As shown, in the light emitting direction of the light emitting device 110, the sum of the thickness of the light shielding layer 130 and the thickness of the transparent layer 120 covered by the light shielding layer 130 is less than the thickness of the light emitting device 110, which is beneficial to avoid the positional displacement of the light emitting device 110 or the inconsistent distance between the light shielding layer 130 and the light emitting device 110, thereby avoiding large color deviation of the viewing angle, and is beneficial to the flattening of the driving substrate 100. Optionally, the thickness of the transparent layer 120 filled in the spacing area 1021 and the peripheral area 1022 is between 1 and 7 μm. Specifically, for example, the thickness of the transparent layer 120 filled in the spacing area 1021 and the peripheral area 1022 can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm and 7 μm. Optionally, the thickness of the light shielding layer 130 is between 1 and 7 μm. Specifically, the thickness of the light shielding layer 130 can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm and 7 μm. Optionally, the thickness of the light emitting device 110 is between 6 and 14 μm. Specifically, the thickness of the light emitting device 110 may be 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, etc. Optionally, the thickness of the encapsulation layer 140 is between 10 and 200 μm. Specifically, the thickness of the encapsulation layer 140 may be 10 μm, 30 μm, 50 μm, 70 μm, 90 μm, 110 μm, 130 μm, 150 μm, 170 μm, 200 μm, etc.

[0055] In an optional embodiment, the refractive index of the light emitting surface 1101 of the light emitting device 110 is greater than the refractive index of the transparent layer 120, and the refractive index of the transparent layer 120 is greater than the refractive index of the encapsulation layer 140, which is beneficial to improving the light emitting effect of the light emitting device 110. Optionally, the refractive index of the transparent layer 120 is between 1.47 and 1.7. Specifically, the refractive index of the transparent layer 120 can be 1.47, 1.5, 1.6, 1.7, etc. Optionally, the refractive index of the encapsulation layer 140 is between 1.3 and 1.52. Specifically, the refractive index of the encapsulation layer 140 can be 1.3, 1.4, 1.5, 1.52, etc. Optionally, the material of the transparent layer 120 may be transparent organic silicone, epoxy resin, etc.; the material of the encapsulation layer 140 may be silicone, or epoxy resin doped with an antioxidant, and the antioxidant may be one or more of antioxidant 168, antioxidant 245, antioxidant 816, antioxidant 1010, antioxidant 1076, antioxidant 1135, or antioxidant 1130, to achieve an anti-oxidation effect. Optionally, the refractive index of the light shielding layer 130 is between 1.3 and 1.52. Specifically, the refractive index of the light shielding layer may be 1.3, 1.4, 1.5, 1.52, etc. Since the refractive index of the light emitting surface 1101 of the light emitting device 110 is greater than the refractive index of the transparent layer 120, and the refractive index of the transparent layer 120 is greater than the refractive index of the light shielding layer 130, part of the light emitted from the side of the light emitting device 110 can be reflected by the light shielding layer 130 and emitted from the light emitting surface of the light emitting device 110.

[0056] In an optional embodiment, scattering particles are dispersed in the encapsulation layer 140, which can correct the light type and improve the brightness of the normal viewing angle. Different types of scattering particles can scatter light of different target wavelengths, and the different sizes of the scattering particles will also affect the scattering effect, so scattering particles can be selected according to actual needs. Optionally, the proportion of scattering particles in the encapsulation layer is between 1% and 20%. Specifically, the proportion of scattering particles in the encapsulation layer can be 1%, 5%, 10%, 15%, 20%, etc.

[0057] Embodiment 2

[0058] This embodiment also provides a display screen packaging structure, such as Figure 6 As shown, the display screen packaging structure of this embodiment also includes the display screen packaging structure of this embodiment including a driving substrate 100, a plurality of light-emitting devices 110, a transparent layer 120, a light-shielding layer 130, a packaging layer 140 and a dam 150. The similarities with the light-emitting module of the first embodiment are not repeated here, and the differences are as follows:

[0059] like Figure 6As shown, the transparent layer 120 only wraps the light-emitting device 110, and the shading layer 130 fills the spacing area 1021 and the peripheral area 1022 between the multiple light-emitting devices 110, and the surface of the shading layer 130 away from the driving substrate 100 is not higher than the light-emitting surface 1101 of the light-emitting device 110, which can avoid large visual color deviation caused by positional displacement of the light-emitting device 110 or inconsistent distance between the shading layer 130 and the light-emitting device 110.

[0060] Since the transparent layer 120 wraps around the light emitting device 110, there is a certain gap between the light shielding layer 130 and the light emitting device 110. Specifically, in the horizontal direction, the width of the gap is determined by the width of the transparent layer 120 wrapping the light emitting device 110 (here, the width of the transparent layer 120 refers to the width of the transparent layer 120 filled on one side of the light shielding layer 130 and the light emitting device 110 in the horizontal direction). Since there is a certain gap between the light emitting device 110 and the light shielding layer 130, the side of the light emitting device 110 can emit light from the transparent layer 120 in the gap after being reflected by the light shielding layer 130, so the utilization rate of the light on the side of the light emitting device 110 can be improved.

[0061] Embodiment 3

[0062] This embodiment also provides a display screen packaging structure, such as Figure 7 and Figure 8 As shown, the display screen packaging structure of this embodiment also includes the display screen packaging structure of this embodiment including a driving substrate 100, a plurality of light-emitting devices 110, a transparent layer 120, a light-shielding layer 130, a packaging layer 140 and a dam 150. The similarities with the light-emitting module of the first embodiment are not repeated here, and the differences are as follows:

[0063] A lens array 160 is disposed on one side of the encapsulation layer 140 away from the driving substrate 100. The lens array 160 includes at least one micro lens. The lens array has a light-collecting function and can collect light with a large viewing angle.

[0064] like Figure 7 As shown, the shape of the lenses in the lens array 160 may be a hemispherical structure; Figure 8 As shown, it can also be a pyramid structure; it can also be a bun-like structure, etc. The size of each lens can be 1-10 μm.

[0065] Embodiment 4

[0066] This embodiment provides a method for manufacturing a display screen packaging structure, which can be used to form the display screen packaging structure provided in Embodiments 1 to 3. Fig. 9 As shown, the manufacturing method may include the following steps:

[0067] Step 001 : Provide a driving substrate 100 , wherein the driving substrate 100 has a display area 102 and a non-display area 101 surrounding the display area 102 .

[0068] In an optional embodiment, if Fig.10 As shown, in order to prevent the materials forming the transparent layer 120 and the light-shielding layer 130 from flowing to the non-display area and the peripheral area of ​​the non-display area, before forming the transparent layer 120 and the light-shielding layer 130, a dam 150 surrounding the driving substrate 100 is first set at the edge of the driving substrate 100. The area of ​​the dam 150 on the driving substrate 100 is defined as the non-display area 101, and the area surrounded by the dam 150 is defined as the display area 102.

[0069] Step 002 : providing a plurality of light emitting devices 110 , wherein the plurality of light emitting devices 110 are disposed at intervals in the display area 102 of the driving substrate 100 , and a side of the light emitting device 110 away from the driving substrate 100 is a light emitting surface 1101 .

[0070] Specifically, a plurality of light emitting devices 110 are arranged at intervals in the display area 102 of the driving substrate 100, the area formed between the light emitting devices 110 is defined as the interval area 1021, and the area between the dam 150 and the light emitting devices 110 arranged at the periphery of the driving substrate 100 is defined as the peripheral area 1022. The side of the light emitting device 110 away from the driving substrate 100 is defined as the light emitting surface 1101.

[0071] Step 003 : forming a transparent layer 120 , wherein the transparent layer 120 wraps the light emitting devices 110 and fills the spacing regions 1021 and the peripheral regions 1022 between the plurality of light emitting devices 110 .

[0072] Specifically, Fig.11As shown, a transparent layer 120 is coated on the light-emitting surface 1101 and the side of the plurality of light-emitting devices 110, so that the transparent layer 120 completely wraps the light-emitting device 110, and the transparent layer 120 is filled in the spacing area 1021 and the peripheral area 1022, and the thickness of the transparent layer 120 filled in the spacing area 1021 and the peripheral area 1022 is less than the thickness of the light-emitting device 110. The transparent layer 120 can realize the planarization of the driving substrate 100. The formation of the transparent layer 120 can be completed by fast inkjet printing. Optionally, the thickness of the light-emitting device 110 is between 6 and 14 μm. Specifically, the thickness of the light-emitting device 110 can be, for example, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, etc. The thickness of the transparent layer 120 filled in the spacing area 1021 and the peripheral area 1022 is between 1 and 7 μm. Specifically, the thickness of the transparent layer 120 filling the spacing region 1021 and the peripheral region 1022 may be, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, etc.

[0073] Step 004: forming a light shielding layer 130 , the light shielding layer 130 covers the transparent layer 120 in the spacing area 1021 and the transparent layer 120 in the peripheral area 1022 , and the surface of the light shielding layer 130 away from the driving substrate 100 is not higher than the light emitting surface 1101 of the light emitting device 110 .

[0074] Specifically, Fig.12As shown, a light shielding layer 130 is formed above the transparent layer 120 in the spacing region 1021 and the peripheral region 1022, and the sum of the thickness of the light shielding layer 130 and the thickness of the transparent layer 120 below the light shielding layer 130 is less than or equal to the thickness of the light emitting device 110. Preferably, the sum of the thickness of the light shielding layer 130 and the thickness of the transparent layer 120 below the light shielding layer 130 is less than the thickness of the light emitting device 110, thereby avoiding a large visual color deviation caused by a positional deviation of the light emitting device 110 or an inconsistent distance between the light shielding layer 130 and the light emitting device 110. Since the transparent layer 120 wrapping the side of the light emitting device 110 has a certain thickness, there is a certain gap between the formed light shielding layer 130 and the light emitting device 110 in the horizontal direction. The size of the gap can be adjusted according to actual needs. Due to the existence of the gap, part of the light emitted from the side of the light emitting device 110 is reflected by the light shielding layer 130 and emitted from the light emitting surface 1101 of the light emitting device 110, and part of the light emitted from the side of the light emitting device 110 is directly emitted from the transparent layer 120 in the gap, thereby improving the utilization rate of the light emitted from the side of the light emitting device 110. Optionally, the light shielding layer 130 is a black light shielding layer. The light shielding layer 130 can be formed by fast inkjet printing, without the need for hard-sticking hard precision vacuum alignment equipment, reducing the process cost and improving the process efficiency. Optionally, the thickness of the light shielding layer 130 is between 1 and 7 μm. Specifically, the thickness of the light shielding layer 130 can be, for example, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, etc. In an optional embodiment, in order to improve the light emitting effect of the light emitting device 110, the refractive index of the light emitting surface 1101 of the light emitting device 110 is greater than the refractive index of the transparent layer 120, and the refractive index of the transparent layer 120 is greater than the refractive index of the light shielding layer 130. Optionally, the refractive index of the transparent layer 120 is between 1.47 and 1.7. Specifically, the refractive index of the transparent layer 120 can be 1.47, 1.5, 1.6, 1.7, etc. Optionally, the refractive index of the light shielding layer 130 is between 1.3 and 1.52. Specifically, the refractive index of the light shielding layer can be 1.3, 1.4, 1.5, 1.52, etc.

[0075] Step 005 : forming an encapsulation layer 140 , wherein the encapsulation layer 140 covers the light shielding layer 130 and the transparent layer 120 above the light emitting device 110 .

[0076] In an optional embodiment, if Figure 2 , Figure 4 and Figure 5As shown, an encapsulation layer 140 is formed above the light shielding layer 130, above the transparent layer 120 of the light emitting surface 1101 of the light emitting device 110, and between the dam 150. Optionally, scattering particles can be dispersed in the encapsulation layer 140 to achieve a corrected light type. Optionally, the thickness of the encapsulation layer 140 is between 10 and 200 μm. Specifically, the thickness of the encapsulation layer 140 can be, for example, 10 μm, 30 μm, 50 μm, 70 μm, 90 μm, 110 μm, 130 μm, 150 μm, 170 μm, and 200 μm. Optionally, the refractive index of the encapsulation layer 140 is between 1.3 and 1.52. Specifically, the refractive index of the encapsulation layer 140 can be 1.3, 1.4, 1.5, and 1.52, etc.

[0077] In an optional embodiment, if Figure 7 and Figure 8 As shown, a lens array 160 is formed on the side of the encapsulation layer 140 away from the driving substrate 100, and the lens array 160 includes at least one micro lens. The lens array has a light-gathering effect and can achieve a light-collecting effect on a large viewing angle. Figure 7 As shown, the shape of the lenses in the lens array 160 may be a hemispherical structure; Figure 8 As shown, it can also be a pyramid structure; it can also be a bun-like structure, etc. The size of each lens can be 1-10 μm.

[0078] Embodiment 5

[0079] This embodiment provides a display screen such as Fig.13 As shown, the display screen includes a housing 201 and at least one display unit 202 disposed in the housing 201, and the display unit 202 includes the display screen packaging structure provided by any one of Embodiments 1 to 3. When there are multiple display units, the multiple display units can be connected to each other in series or in parallel.

[0080] Since the display screen of this embodiment may include the display screen packaging structure provided by Embodiments 1 to 3, the beneficial effects that can be achieved by the display screen packaging structure provided by this embodiment may be achieved. For details, see Embodiments 1 to 3, which will not be described again here.

[0081] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A display screen packaging structure, characterized in that: include: a driving substrate, wherein the driving substrate has a display area and a non-display area surrounding the display area; A plurality of light emitting devices, wherein the plurality of light emitting devices are arranged at intervals in the display area of ​​the driving substrate, and a side of the light emitting device away from the driving substrate is a light emitting surface; A transparent layer, the transparent layer wraps the light emitting device and fills the spacing area and the peripheral area between the plurality of light emitting devices; a light shielding layer, the light shielding layer covering the transparent layer in the spacing area and the transparent layer in the peripheral area, wherein a surface of the light shielding layer away from the driving substrate is not higher than a light emitting surface of the light emitting device; An encapsulation layer covers the light-shielding layer and the transparent layer above the light-emitting device.

2. The display screen packaging structure according to claim 1, characterized in that: The invention also includes a dam, which is arranged in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer and the encapsulation layer.

3. The display screen packaging structure according to claim 1 or 2, characterized in that: In the light emitting direction of the light emitting device, the sum of the thickness of the light shielding layer and the thickness of the transparent layer covered by the light shielding layer is smaller than the thickness of the light emitting device.

4. The display screen packaging structure according to claim 1 or 2, characterized in that: The thickness of the transparent layer filled in the spacer area and the peripheral area is between 1 μm and 7 μm; The thickness of the light shielding layer is between 1 μm and 7 μm.

5. The display screen packaging structure according to claim 1 or 2, characterized in that: The thickness of the encapsulation layer is between 10 and 200 μm.

6. The display screen packaging structure according to claim 1, characterized in that: The refractive index of the light emitting surface of the light emitting device is greater than the refractive index of the transparent layer, and the refractive index of the transparent layer is greater than the refractive index of the encapsulation layer.

7. The display screen packaging structure according to claim 1 or 6, characterized in that: The refractive index of the transparent layer is between 1.47 and 1.7; The refractive index of the encapsulation layer is between 1.3 and 1.

52.

8. The display screen packaging structure according to claim 1, characterized in that: A lens array is provided on a side of the encapsulation layer away from the driving substrate, and the lens array includes at least one microlens.

9. A method for manufacturing a display screen packaging structure, characterized in that: include: Providing a driving substrate, the driving substrate having a display area and a non-display area surrounding the display area; Providing a plurality of light emitting devices, and arranging the plurality of light emitting devices at intervals in the display area of ​​the driving substrate, wherein a side of the light emitting device away from the driving substrate is a light emitting surface; forming a transparent layer, wherein the transparent layer wraps the light emitting device and fills the spacing area and the peripheral area between the plurality of light emitting devices; forming a light shielding layer, wherein the light shielding layer covers the transparent layer in the spacing area and the transparent layer in the peripheral area, and the surface of the light shielding layer away from the driving substrate is not higher than the light emitting surface of the light emitting device; An encapsulation layer is formed, where the encapsulation layer covers the light shielding layer and the transparent layer above the light emitting device.

10. The manufacturing method according to claim 9, characterized in that: The method further includes forming a dam, wherein the dam is formed in the non-display area of ​​the driving substrate and surrounds the transparent layer, the light shielding layer and the encapsulation layer.

11. A display screen, characterized in that: The invention comprises a shell and at least one display unit arranged in the shell, wherein the display unit comprises the display screen packaging structure according to any one of claims 1 to 8.

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