Electric connection structure, display backboard and display device

Abstract

The invention provides an electric connection structure display backboard and a display device. The electrical connection structure includes: a substrate; the first conductive layer is arranged on one side of the substrate; the first insulating layer is arranged on one side of the substrate and covers the first conductive layer; the second conductive layer is arranged on the side, away from the substrate, of the first insulating layer, and the second insulating layer is arranged on the side, away from the substrate, of the first insulating layer and covers the second conductive layer; the conductive structure comprises a third conductive layer and a conductive column, the third conductive layer is arranged on the side, away from the substrate, of the second insulating layer, the conductive column is in contact with the surface, away from the substrate, of the first conductive layer through a via hole, the conductive column penetrates through the second conductive layer, or the conductive column is in contact with at least part of the surface of at least one side face of the second conductive layer. The layout arrangement area of the first conducting layer and the second conducting layer can be effectively reduced through the lap joint mode of the first conducting layer and the second conducting layer in the electric connection structure, and then the arrangement density of the circuit is further improved.

Description

Technical Field

[0001] The present invention relates to the display field, and in particular to an electrical connection structure, a display back panel and a display device. Background Art

[0002] In the driving circuit of the display panel, there are multiple layers of electrical connections between different conductive film layers, and this electrical connection is basically achieved through vias. For example, in the LTPO driving pixel circuit, the P-Si active layer, Gate1, and Gate2 film layers form LTPS TFTs, and Gate2, IGZO active layer, and Gate3 film layers form oxide TFTs. At the same time, Gate1, Gate2, and Gate3 are used as metal routings for each signal line, and SD metal connects and conducts each film layer through etched holes of different depths. Since the driving pixel circuits of OLED and LED are relatively complex, such as LED pixel circuits, the LTPO connection scheme in the current technical solution has as many as 22 etched holes connecting different film layers. In the conventional LTPO connection scheme, the holes and the overlapping film layer holes need to maintain a certain wrapping distance to ensure connectivity, and the non-overlapping metals need to maintain a certain avoidance distance to prevent short circuits between different signals, resulting in restrictions on further improving the display PPI. However, the above-mentioned hole overlap method requires a larger layout area. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one object of the present invention is to provide an electrical connection structure that can reduce the layout area of ​​the connection between different conductive layers and further increase the layout density of the circuit.

[0004] In one aspect of the present invention, the present invention provides an electrical connection structure. According to an embodiment of the present invention, the electrical connection structure includes: a substrate; a first conductive layer, the first conductive layer is arranged on one side of the substrate; a first insulating layer, the first insulating layer is arranged on one side of the substrate and covers the first conductive layer; a second conductive layer, the second conductive layer is arranged on the side of the first insulating layer away from the substrate, and the second insulating layer is arranged on the side of the first insulating layer away from the substrate and covers the second conductive layer; a conductive structure, the conductive structure includes a third conductive layer and a conductive column, the third conductive layer is arranged on the side of the second insulating layer away from the substrate, the conductive column contacts the surface of the first conductive layer away from the substrate through a via, and the conductive column passes through the second conductive layer or the conductive column contacts at least part of the surface of at least one side of the second conductive layer. Therefore, the overlapping method of the first conductive layer and the second conductive layer in the above-mentioned electrical connection structure can effectively reduce the layout area of ​​the first conductive layer and the second conductive layer, thereby further improving the layout density of the circuit.

[0005] According to an embodiment of the present invention, the conductive pillar passes through the second conductive layer, and the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate.

[0006] According to an embodiment of the present invention, one side end of the second conductive layer has a groove, the conductive column passes through the groove and contacts the surface of the first conductive layer, and the conductive column is arranged in contact with at least one wall surface of the groove. Preferably, the conductive column is arranged in contact with three walls of the groove.

[0007] According to an embodiment of the present invention, an orthographic projection of an edge line of the first conductive layer on the substrate, an orthographic projection of an edge line of the second conductive layer on the substrate, and an orthographic projection of an edge line of the conductive column on the substrate are located on the same straight line.

[0008] According to an embodiment of the present invention, the conductive pillar contacts at least a portion of the surface of one side surface of the second conductive layer, the orthographic projection of the second conductive layer on the substrate at least partially overlaps with the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the side surface of the second conductive layer in contact with the conductive pillar on the substrate is located within the orthographic projection of the first conductive layer on the substrate.

[0009] According to an embodiment of the present invention, the conductive pillar contacts at least a portion of the surface of multiple side surfaces of the second conductive layer, the orthographic projection of the second conductive layer on the substrate is located inside the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the conductive pillar on the substrate is located inside the orthographic projection of the first conductive layer on the substrate.

[0010] According to an embodiment of the present invention, the electrical connection structure also includes: a fourth conductive layer, which is arranged on a side of the second insulating layer away from the substrate and is located between the second insulating layer and the third conductive layer; a third insulating layer, which is arranged on a side of the second insulating layer away from the substrate and covers the fourth conductive layer, and the third conductive layer is located on a side of the third insulating layer away from the substrate, wherein the conductive column passes through the fourth conductive layer or the conductive column contacts at least a portion of the surface of at least one side of the fourth conductive layer.

[0011] According to an embodiment of the present invention, a side structure where the fourth conductive layer contacts the conductive pillar is the same as a side structure where the second conductive layer contacts the conductive pillar.

[0012] In another aspect of the present invention, the present invention provides a display backplane. According to an embodiment of the present invention, the display backplane includes a pixel driving circuit, and the pixel driving circuit has the electrical connection structure described above. Thus, the display backplane has a pixel driving circuit with a higher PPI.

[0013] According to an embodiment of the present invention, the electrical connection structure satisfies one of the following conditions: the first conductive layer is a first gate, and the second conductive layer is a first active layer; or, the first conductive layer is a second active layer, the second conductive layer is a second gate, and the fourth conductive layer is a third active layer.

[0014] In another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the display backplane described above. Thus, the display device can achieve higher PPI requirements. Those skilled in the art can understand that the display device has all the features and advantages of the display backplane described above, and no further elaboration is given here. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 It is a structural schematic diagram of an electrical connection structure in the prior art;

[0017] Figure 2 yes Figure 1 A schematic diagram of a superimposed plane of the first conductive layer, the second conductive layer and the conductive pillar;

[0018] Figure 3 is a schematic structural diagram of an electrical connection structure in one embodiment of the present invention;

[0019] Figure 4 yes Figure 3 A schematic diagram of a superimposed plane of the first conductive layer, the second conductive layer and the conductive pillar;

[0020] Figure 5 yes Figure 4 A plan view of a first conductive layer, a second conductive layer and a conductive column;

[0021] Figure 6 yes Figure 3 A schematic diagram of a superimposed plane of the first conductive layer, the second conductive layer and the conductive pillar;

[0022] Figure 7 yes Figure 6 A plan view of a first conductive layer, a second conductive layer and a conductive column;

[0023] Figure 8is a schematic structural diagram of an electrical connection structure in another embodiment of the present invention;

[0024] Fig. 9 yes Figure 8 A schematic diagram of a superimposed plane of the first conductive layer, the second conductive layer and the conductive pillar;

[0025] Fig.10 yes Fig. 9 A plan view of the first conductive layer, the second conductive layer and the conductive column;

[0026] Fig.11 is a structural schematic diagram of an electrical connection structure in another embodiment of the present invention;

[0027] Fig.12 yes Fig.11 A schematic diagram of a superimposed plane of the first conductive layer, the second conductive layer and the conductive pillar;

[0028] Fig.13 yes Fig.12 A plan view of the first conductive layer, the second conductive layer and the conductive column;

[0029] Fig.14 is a structural schematic diagram of an electrical connection structure in another embodiment of the present invention;

[0030] Fig.15 yes Fig.14 A schematic diagram of a superimposed plane of the first conductive layer, the second conductive layer and the conductive pillar;

[0031] Fig.16 yes Fig.15 A plan view of the first conductive layer, the second conductive layer and the conductive column;

[0032] Fig.17 is a structural schematic diagram of an electrical connection structure in another embodiment of the present invention;

[0033] Fig.18 is a structural schematic diagram of an electrical connection structure in another embodiment of the present invention;

[0034] Fig.19 It is a structural schematic diagram of an electrical connection structure in another embodiment of the present invention. DETAILED DESCRIPTION

[0035] The scheme of the present invention will be explained below in conjunction with embodiments. It will be appreciated by those skilled in the art that the following embodiments are only used to illustrate the present invention and should not be considered as limiting the scope of the present invention. Where specific techniques or conditions are not indicated in the embodiments, the techniques or conditions described in the literature in this area or the product specifications are followed.

[0036] The present invention is described below with reference to specific embodiments. It should be noted that these embodiments are merely illustrative and do not limit the present invention in any way.

[0037] The current electrical connection methods between different conductive layers can refer to Figure 1 and Figure 2 As shown, the conductive structure in the structure includes a plurality of conductive pillars 232 passing through the vias, and different conductive pillars respectively contact the surfaces of the first conductive layer 21 and the second conductive layer 22, and are located inside the surface of the first conductive layer 21 and the surface of the second conductive layer 22, that is, the conductive pillars maintain a certain wrapping distance from the conductive layer to be overlapped, or a certain area needs to be reserved on the surface of the conductive layer to overlap with the conductive pillars, and a certain avoidance distance needs to be maintained between the conductive pillars and the non-overlapping conductive layers to prevent short circuits between different signals. The above-mentioned setting requirements greatly increase the arrangement area of ​​the electrical connection structure.

[0038] Based on the above problems, in one aspect of the present invention, the present invention provides an electrical connection structure. According to an embodiment of the present invention, referring to Figures 3 to 16 , the electrical connection structure includes: a substrate 10; a first conductive layer 21, the first conductive layer 21 is arranged on one side of the substrate 10; a first insulating layer 31, the first insulating layer 31 is arranged on one side of the substrate 10 and covers the first conductive layer 21; a second conductive layer 22, the second conductive layer 22 is arranged on the side of the first insulating layer 31 away from the substrate 10, and a second insulating layer 32, the second insulating layer 32 is arranged on the side of the first insulating layer 31 away from the substrate 10 and covers the second conductive layer 22; a conductive structure 23, the conductive structure 23 includes a third conductive layer 231 and a conductive column 232, the third conductive layer 231 is arranged on the side of the second insulating layer 32 away from the substrate 10, the conductive column 232 is in contact with the surface of the first conductive layer 21 away from the substrate 10 through the via 01, and the conductive column 232 passes through the second conductive layer 22 (such as Figure 3 , Figure 4 and Figure 5 ), or the conductive pillar 232 is in contact with at least a portion of the surface of at least one side of the second conductive layer 22. Therefore, the overlapping manner of the first conductive layer and the second conductive layer in the above-mentioned electrical connection structure can effectively reduce the layout area of ​​the first conductive layer and the second conductive layer, thereby further improving the layout density of the circuit.

[0039] According to the embodiment of the present invention, there is no special requirement for the shape of the via hole, and those skilled in the art can flexibly select the shape according to the actual situation, such as circular, square, etc. Those skilled in the art can understand that the conductive column is located in the via hole, that is, the formation of the via hole is consistent with that of the conductive column.

[0040] According to some embodiments of the present invention, referring to Figure 3 , Figure 4 and Figure 5 , the conductive column 232 passes through the second conductive layer 22, and the orthographic projection of the second conductive layer 22 on the substrate 10 covers the orthographic projection of the first conductive layer 21 on the substrate 10. In this structure, the orthographic projection of the conductive column is located inside the second conductive layer, and there is no need to reserve an additional area for the conductive column. At the same time, the area of ​​the third conductive layer can be reduced, thereby effectively reducing the arrangement area of ​​the electrical connection structure. In some embodiments, the orthographic projection of the first conductive layer 21 on the substrate 10 can be located in the middle area of ​​the orthographic projection of the second conductive layer 22 on the substrate 10, such as Figure 5 As shown, or, an edge line of the orthographic projection of the first conductive layer 21 on the substrate 10 and an edge line of the orthographic projection of the second conductive layer 22 on the substrate 10 are located on the same straight line, and at this time, the area of ​​the first conductive layer is smaller than the area of ​​the second conductive layer; in other embodiments, the orthographic projection of the second conductive layer 22 on the substrate 10 overlaps with the orthographic projection of the first conductive layer 21 on the substrate 10, that is, the area of ​​the first conductive layer is equal to the area of ​​the second conductive layer.

[0041] According to some embodiments of the present invention, referring to Figure 3 , Figure 6 and Figure 7 , one side end of the second conductive layer 22 has a groove 221, and the conductive column 232 passes through the groove 221 and contacts the surface of the first conductive layer 21, and the conductive column 232 is arranged in contact with at least one wall of the groove 221. In this way, it is only necessary to set a via hole for penetrating the conductive column on one side of the second conductive layer. In this structure, the positive projection of the conductive column is located inside the second conductive layer, and there is no need to reserve an additional area for the conductive column. At the same time, the area of ​​the third conductive layer can be reduced, thereby effectively reducing the arrangement area of ​​the electrical connection structure. In some embodiments, the conductive column 232 is arranged in contact with the three walls of the groove 221. In this way, the contact surface between the conductive column and the second conductive layer is larger, which better ensures the connectivity between the conductive column and the second conductive layer.

[0042] According to some embodiments of the present invention, referring to Figure 3 , Figure 6 and Figure 7 , the orthographic projection of an edge line of the first conductive layer 21 on the substrate 10, the orthographic projection of an edge line of the second conductive layer 22 on the substrate 10, and an edge line of the orthographic projection of the conductive pillar 232 on the substrate are located on the same straight line. In this way, the orthographic projection of the first conductive layer on the substrate 10 can be located within the orthographic projection of the second conductive layer on the substrate, so that the space occupied by the electrical connection structure is the same as the space occupied by the second conductive layer, which can further reduce the arrangement space of the electrical connection structure.

[0043] According to some embodiments of the present invention, referring to Figure 8 , Fig. 9 and Fig.10 , the conductive pillar 232 is in contact with at least a portion of the surface of one side surface of the second conductive layer 22 ( Figure 8 and Fig. 9 In the example of one side contact, the orthographic projection of the second conductive layer 22 on the substrate 10 at least partially overlaps with the orthographic projection of the first conductive layer 21 on the substrate 10, and the orthographic projection of the side surface of the second conductive layer 22 in contact with the conductive pillar 232 on the substrate 10 is located within the orthographic projection of the first conductive layer 21 on the substrate 10. In this structure, the orthographic projection of the conductive pillar is located inside the second conductive layer, and there is no need to reserve an additional area for the conductive pillar. At the same time, the area of ​​the third conductive layer can be reduced, thereby effectively reducing the arrangement area of ​​the electrical connection structure.

[0044] According to some embodiments of the present invention, referring to Fig.11 , Fig.12 and Fig.13 The orthographic projection of the second conductive layer 22 on the substrate 10 is located inside the orthographic projection of the first conductive layer 21 on the substrate 10. In this way, the maximum arrangement area of ​​the conductive layer in the electrical connection structure is the area of ​​the first conductive layer, and there is no need to reserve an additional area for the conductive column. At the same time, the area of ​​the third conductive layer can be reduced, and the arrangement area of ​​each conductive layer in the electrical connection structure can be further reduced.

[0045] According to some embodiments of the present invention, referring to Fig.14 , Fig.15 and Fig.16 , the conductive pillar 232 is in contact with at least part of the surface of multiple side surfaces of the second conductive layer 22, the orthographic projection of the second conductive layer 22 on the substrate 10 is located inside the orthographic projection of the first conductive layer 21 on the substrate 10, and the orthographic projection of the conductive pillar 232 on the substrate 10 is located inside the orthographic projection of the first conductive layer 21 on the substrate 10. In some specific embodiments, the conductive pillar is arranged in contact with the entire side surface of the second conductive layer, that is, Fig.14 and 15 In this way, the maximum arrangement area of ​​the conductive layer in the electrical connection structure is the area of ​​the first conductive layer, and there is no need to reserve an additional area for the conductive column. At the same time, the area of ​​the third conductive layer can be reduced, and the arrangement area of ​​each conductive layer in the electrical connection structure can be further reduced.

[0046] According to an embodiment of the present invention, the electrical connection structure may include only one of the above-mentioned multiple connection methods, or may include two or more of them. Technical personnel in this field can flexibly select any one or more combinations of the above-mentioned multiple connection methods according to the specific design requirements of the electrical connection structure, and no limitation is made here.

[0047] According to some embodiments of the present invention, referring to Fig.17 , Fig.18 and Fig.19 , the electrical connection structure further includes: a fourth conductive layer 24, the fourth conductive layer 24 is arranged on the side of the second insulating layer 32 away from the substrate, and is located between the second insulating layer 32 and the third conductive layer 231, a third insulating layer 33, the third insulating layer 33 is arranged on the side of the second insulating layer 32 away from the substrate 10, and covers the fourth conductive layer 24, and the third conductive layer 231 is located on the side of the third insulating layer 33 away from the substrate 10, wherein the conductive column 232 passes through the fourth conductive layer 24, or the conductive column 232 contacts at least part of the surface of at least one side of the fourth conductive layer 24. In the current technology, the electrical connection of more layers of conductive layers requires more conductive columns to complete, so more areas need to be reserved for setting the electrical connection of the conductive columns, and then more area is required to arrange the conductive layers and the conductive columns. In the above scheme of the present invention, no matter whether three conductive layers or more layers are set, the required area size is not much different from the area size of the above-mentioned two conductive layers of the present invention. The setting method of the above-mentioned structure can complete the electrical connection of the multi-layer structure in a smaller area. In general, compared with the electrical connection structure of two conductive layers, the electrical connection structure including three conductive layers or even multiple conductive layers can save more reserved area areas corresponding to more conductive columns, thereby highlighting the advantage of saving layout area.

[0048] According to some embodiments of the present invention, the side structure of the fourth conductive layer 24 in contact with the conductive column 232 is the same as the side structure of the second conductive layer 22 in contact with the conductive column 232, that is, the structural setting method of the side of the fourth conductive layer that is electrically connected to the conductive column is consistent with the requirements of the structural setting method of the side of the second conductive layer that is electrically connected to the conductive column described above, that is, the positional relationship between the fourth conductive layer and the first conductive layer and the conductive column is consistent with the positional relationship between the second conductive layer and the first conductive layer and the conductive column, and no further details will be given.

[0049] According to the embodiments of the present invention, in all the above-mentioned configurations, there are no special requirements for the specific size of the third conductive layer, and those skilled in the art can flexibly select it according to the actual situation. In some specific embodiments, the orthographic projection of the third conductive layer on the substrate is located inside the orthographic projection of the second conductive layer on the substrate, or the orthographic projection of the third conductive layer on the substrate is located inside the orthographic projection of the first conductive layer on the substrate, so that the configuration of the third conductive layer will not further increase the arrangement area of ​​the electrical connection structure, that is, the above-mentioned configuration can further reduce the arrangement space area of ​​the electrical connection structure.

[0050] According to an embodiment of the present invention, the above-mentioned substrate may include a multi-layer structure, such as a glass substrate, a buffer layer and the like; the above-mentioned first insulating layer, second insulating layer and third insulating layer may be a single-layer structure, or an insulating layer structure obtained by stacking multiple sub-insulating layers. Technical personnel in this field may flexibly select according to actual needs.

[0051] In another aspect of the present invention, the present invention provides a display backplane. According to an embodiment of the present invention, the display backplane includes a pixel driving circuit, and the pixel driving circuit has the aforementioned electrical connection structure. Thus, each pixel driving circuit unit in the display backplane can occupy a smaller area, thereby enabling the display panel to have a pixel driving circuit with a higher PPI.

[0052] In some embodiments of the present invention, the pixel driving circuit may be a thin film transistor (TFT), such as an oxide TFT or an LTPS (low temperature polycrystalline silicon) TFT. For the thin film transistor of the above structure, it may include two conductive layers and a conductive structure, namely a first conductive layer and a second conductive layer and a conductive structure (including a third conductive layer and a conductive column), wherein the first conductive layer is a first gate and the second conductive layer is a first active layer, or the first conductive layer is a first active layer and the second conductive layer is a first gate, wherein the first active layer may be IGZO or low temperature polycrystalline silicon.

[0053] In some embodiments of the present invention, the pixel driving circuit can be an LTPO (low-temperature polycrystalline oxide) driving pixel circuit as a thin film transistor (TFT), and the LTPO driving pixel circuit includes three conductive layers and a conductive structure, namely a first conductive layer, a second conductive layer, a fourth conductive layer and a conductive structure (including a third conductive layer and a conductive column), wherein the first conductive layer is the second active layer, the second conductive layer is the second gate, and the fourth conductive layer is the third active layer, wherein the second active layer can be IGZO and the third active layer is low-temperature polycrystalline silicon, or the third active layer can be IGZO and the second active layer is low-temperature polycrystalline silicon.

[0054] In another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes the display backplane described above. Thus, the display device can achieve higher PPI requirements. Those skilled in the art can understand that the display device has all the features and advantages of the display backplane described above, and no further elaboration is given here.

[0055] According to the embodiment of the present invention, there is no special requirement for the specific type of the display device, and technicians in this field can flexibly select it according to actual conditions. For example, the display device can be a mobile phone, computer, iPAD, kindle, game console or any other display device with display function.

[0056] Those skilled in the art will understand that, in addition to the display back panel mentioned above, the display device also includes structures or components necessary for a conventional display device. Taking a mobile phone as an example, in addition to the above-mentioned display back panel, it also includes a cover plate, a touch panel, a fingerprint film group, an audio module, a camera module, a CPU, a battery, a back cover, a middle frame and other necessary structures or components for a mobile phone.

[0057] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0059] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An electrical connection structure, characterized in that: include: substrate; a first conductive layer, wherein the first conductive layer is disposed on one side of the substrate; A first insulating layer, the first insulating layer is disposed on one side of the substrate and covers the first conductive layer; a second conductive layer, the second conductive layer being arranged on a side of the first insulating layer away from the substrate, a second insulating layer, the second insulating layer being arranged on a side of the first insulating layer away from the substrate and covering the second conductive layer; A conductive structure, the conductive structure comprising a third conductive layer and a conductive column, the third conductive layer is arranged on a side of the second insulating layer away from the substrate, the conductive column is in contact with a surface of the first conductive layer away from the substrate through a via, and the conductive column passes through the second conductive layer or the conductive column is in contact with at least a partial surface of at least one side of the second conductive layer.

2. The electrical connection structure according to claim 1, characterized in that: The conductive pillar passes through the second conductive layer, and the orthographic projection of the second conductive layer on the substrate covers the orthographic projection of the first conductive layer on the substrate.

3. The electrical connection structure according to claim 1, characterized in that: One side end of the second conductive layer has a groove, the conductive column passes through the groove and contacts the surface of the first conductive layer, and the conductive column is in contact with at least one wall of the groove. Preferably, the conductive column is in contact with three walls of the groove.

4. The electrical connection structure according to claim 3, characterized in that: An orthographic projection of an edge line of the first conductive layer on the substrate, an orthographic projection of an edge line of the second conductive layer on the substrate, and an orthographic projection of an edge line of the conductive pillar on the substrate are located on the same straight line.

5. The electrical connection structure according to claim 1, characterized in that: The conductive pillar contacts at least a portion of the surface of one side of the second conductive layer, the orthographic projection of the second conductive layer on the substrate at least partially overlaps with the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the side of the second conductive layer in contact with the conductive pillar on the substrate is located within the orthographic projection of the first conductive layer on the substrate.

6. The electrical connection structure according to claim 1, characterized in that: The conductive pillar contacts at least a portion of the surface of multiple side surfaces of the second conductive layer, the orthographic projection of the second conductive layer on the substrate is located inside the orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the conductive pillar on the substrate is located inside the orthographic projection of the first conductive layer on the substrate.

7. The electrical connection structure according to claim 1, characterized in that: Also includes: a fourth conductive layer, the fourth conductive layer being arranged on a side of the second insulating layer away from the substrate and between the second insulating layer and the third conductive layer, a third insulating layer, the third insulating layer being arranged on a side of the second insulating layer away from the substrate and covering the fourth conductive layer, the third conductive layer being arranged on a side of the third insulating layer away from the substrate, The conductive column passes through the fourth conductive layer or the conductive column contacts at least a portion of the surface of at least one side surface of the fourth conductive layer.

8. The electrical connection structure according to claim 7, characterized in that: The side structure of the fourth conductive layer in contact with the conductive pillar is the same as the side structure of the second conductive layer in contact with the conductive pillar.

9. A display backplane, characterized in that: The invention comprises a pixel driving circuit, wherein the pixel driving circuit comprises the electrical connection structure according to any one of claims 1 to 8.

10. The display backplane according to claim 9, characterized in that: The electrical connection structure further includes a fourth conductive layer, and the electrical connection structure satisfies one of the following conditions: The first conductive layer is a first gate, and the second conductive layer is a first active layer; Alternatively, the first conductive layer is a second active layer, the second conductive layer is a second gate, and the fourth conductive layer is a third active layer.

11. A display device, characterized in that: Comprising the display back panel as described in claim 9 or 10.

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