Antenna device and antenna unit

Abstract

The antenna device can be used in a quasi-millimeter wave band or a millimeter wave band, and the window glass is not easy to break even if the antenna device is arranged to face the window glass. An antenna device connected to a digital control unit via a plurality of wires including a first wire and a second wire, the antenna device being provided with an array antenna, an analog beamformer, an up-converter, and a down-converter. An intermediate frequency signal input to the up-converter is input from the digital control unit to the antenna device via the first wiring, and an intermediate frequency signal output from the down-converter is output to the digital control unit via the second wiring. A control signal controlling the analog beamformer is input from the digital control unit to the antenna device.

Description

Technical Field

[0001] The present disclosure relates to an antenna device and an antenna unit. Background Art

[0002] An antenna unit that is installed to face a window glass of a building is known (for example, see Patent Document 1). In recent years, antennas for communication in the quasi-millimeter wave band (20 GHz to 30 GHz) and the millimeter wave band (30 GHz to 300 GHz) are required.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2019 / 026963 Summary of the invention

[0006] Problems to be solved by the invention

[0007] However, antenna units used in the quasi-millimeter wave band and the millimeter wave band may have a digital control unit with a large amount of heat generated built in. In such a case, if the antenna unit is installed facing each other near the window glass, the window glass may be broken by the heat.

[0008] The present disclosure provides an antenna device and an antenna unit that can be used in a quasi-millimeter wave band or a millimeter wave band, and the window glass is not easily broken even if the antenna device is arranged to face the window glass.

[0009] Technical solutions to solve problems

[0010] In one embodiment of the present disclosure,

[0011] An antenna device is provided, which is connected to a digital control unit via a plurality of wirings including a first wiring and a second wiring, wherein:

[0012] The antenna device comprises an array antenna, an analog beamformer, an upconverter and a downconverter.

[0013] The intermediate frequency signal input to the up-converter is input from the digital control unit to the antenna device via the first wiring.

[0014] The intermediate frequency signal output from the down converter is output to the digital control unit via the second wiring.

[0015] A control signal for controlling the analog beamformer is input from the digital control unit to the antenna device.

[0016] In one embodiment of the present disclosure,

[0017] An antenna device is provided, which is connected to a digital control unit via a plurality of wirings including a first wiring, a second wiring and a third wiring, wherein:

[0018] The antenna device comprises an array antenna, an analog beamformer, an upconverter and a downconverter.

[0019] The intermediate frequency signal input to the up-converter is input from the digital control unit to the antenna device via the first wiring.

[0020] The intermediate frequency signal output from the down converter is output to the digital control unit via the second wiring.

[0021] A control signal for controlling the analog beamformer is input from the digital control unit to the antenna device via the third wiring.

[0022] In another embodiment of the present disclosure,

[0023] An antenna unit is provided, comprising:

[0024] the antenna device;

[0025] a digital control unit, configured separately from the window glass; and

[0026] The plurality of wiring lines.

[0027] In another embodiment of the present disclosure,

[0028] An antenna unit is provided, comprising:

[0029] Antenna device;

[0030] A digital control unit is disposed separately from the window glass facing the antenna device; and

[0031] Multiple wiring,

[0032] The antenna device is connected to the digital control unit via the plurality of wirings including the first wiring and the second wiring.

[0033] The antenna device comprises an array antenna and an analog beamformer.

[0034] The analog signal input to the analog beamformer is input from the digital control unit to the antenna device via the first wiring.

[0035] The analog signal output from the analog beamformer is output to the digital control unit via the second wiring,

[0036] A control signal for controlling the analog beamformer is input from the digital control unit to the antenna device,

[0037] The first wiring and the second wiring are optical cables that transmit the analog signal.

[0038] Effects of the Invention

[0039] According to the present disclosure, it is possible to provide an antenna device and an antenna unit that can be used in a quasi-millimeter wave band or a millimeter wave band, and the window glass is unlikely to break even if the antenna device is disposed facing the window glass. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a diagram showing an example of arrangement of antenna units according to one embodiment of the present invention.

[0041] Figure 2 This is a diagram showing an antenna device according to an embodiment of the present invention in a front view.

[0042] Figure 3 This is a cross-sectional view schematically showing an example in which the antenna device according to one embodiment of the present invention is installed on a window glass.

[0043] Figure 4 It is a block diagram showing a configuration example of the antenna unit 10 according to one embodiment of the present invention. DETAILED DESCRIPTION

[0044] Hereinafter, the implementation mode will be described with reference to the accompanying drawings. In addition, for ease of understanding, the scales of the components in the accompanying drawings are sometimes different from the actual ones. In this specification, a three-dimensional orthogonal coordinate system of three-axis directions (X-axis direction, Y-axis direction, and Z-axis direction) is used, and the width direction of the window glass is set as the Y-axis direction, the thickness direction of the window glass is set as the Z-axis direction, and the height direction of the window glass is set as the X-axis direction. The direction from the bottom to the top of the window glass is set as the +X-axis direction, and the opposite direction is set as the -X-axis direction. In the following description, the +X-axis direction is sometimes referred to as the top, and the -X-axis direction is sometimes referred to as the bottom.

[0045] The X-axis direction, the Y-axis direction, and the Z-axis direction respectively represent a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis. The X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other. The XY plane, the YZ plane, and the ZX plane respectively represent an imaginary plane parallel to the X-axis direction and the Y-axis direction, an imaginary plane parallel to the Y-axis direction and the Z-axis direction, and an imaginary plane parallel to the Z-axis direction and the X-axis direction.

[0046] For example, the Y-axis direction and the Z-axis direction are substantially parallel to the direction parallel to the horizontal plane (horizontal direction), and the X-axis direction is substantially parallel to the vertical direction perpendicular to the horizontal plane.

[0047] Figure 1It is a diagram showing an example of arrangement of the antenna unit 10 according to one embodiment of the present invention. Figure 1 The antenna unit 10 shown includes an antenna device 100, a digital control unit 150 disposed away from the window glass 21, and a plurality of wirings 160 connecting the antenna device 100 and the digital control unit 150. The antenna device 100 can be installed facing the surface of the window glass 21 of the building 40 on the indoor side.

[0048] The window glass 21 is a glass plate used for windows of buildings, vehicles, etc. The window glass 21 is formed into a rectangle when viewed from the front in the Z-axis direction, for example, and has a first glass surface and a second glass surface on the side opposite to the first glass surface. The thickness of the window glass 21 is set according to the required specifications of the building, etc. It should be noted that the first glass surface or the second glass surface is sometimes referred to as the main surface. In the present embodiment, the so-called rectangle includes, in addition to a rectangle and a square, a shape obtained by chamfering the corners of a rectangle or a square. The shape of the window glass when viewed from the front is not limited to a rectangle, and may also be other shapes such as a circle. The window glass 21 may also be mounted on a window frame 22 that holds the outer edge of the window glass 21.

[0049] The window glass 21 is not limited to a single plate. The window glass 21 may also be laminated glass, multi-layer glass, Low-E glass, dimming glass or glass containing linear components. Low-E glass is also called low-emissivity glass, and may be glass in which a coating (transparent conductive film) having a heat-reflecting function is coated on the surface of the indoor side of the window glass. In the case where the window glass is multi-layer glass, it may be glass in which a transparent conductive film is coated on the surface of the hollow layer side of the indoor side glass. In order to suppress the reduction of radio wave transmission performance, an opening may also be provided in the coating. The opening of the coating is preferably located at a position opposite to at least a part of the multiple radiating elements described later. The opening of the coating may be patterned. The so-called patterning is, for example, leaving the coating in a grid shape or removing the coating in a grid shape. It is also possible to pattern only a part of the opening of the coating. In addition, the glass containing linear components is provided with linear components such as metal inside the glass. The linear components may be mesh-shaped. The glass containing linear components is also called mesh-containing glass.

[0050] Examples of the material of the window glass 21 include soda-lime-silica glass, borosilicate glass, aluminosilicate glass, and alkali-free glass.

[0051] The thickness of the window glass 21 is preferably 1.0 to 20 mm. If the thickness of the window glass 21 is 1.0 mm or more, it has sufficient strength for mounting the antenna device 100. In addition, if the thickness of the window glass 21 is 20 mm or less, the radio wave transmission performance is good. The thickness of the window glass 21 is more preferably 3.0 to 15 mm, and further preferably 6.0 to 12 mm.

[0052] exist Figure 1 In the example shown, the antenna device 100 is a device used by being installed facing the surface of the indoor side of the window glass 21 for the building. The antenna device 100 transmits and receives radio waves in the quasi-millimeter wave band (20 GHz to 30 GHz), the millimeter wave band (30 GHz to 300 GHz), or the 7 GHz to 25 GHz band considered to be the main frequency band of the sixth-generation mobile communication system (so-called 6G) ​​through the window glass 21. The antenna device 100 is configured, for example, to be able to transmit and receive radio waves corresponding to wireless communication standards such as the fifth-generation mobile communication system (so-called 5G) or 6G, and wireless LAN (Local Area Network) standards such as IEEE802.11ax and IEEE802.11ay. It should be noted that the antenna device 100 can also be configured to be able to transmit and receive electromagnetic waves corresponding to standards other than these, and can also be configured to be able to transmit and receive electromagnetic waves of multiple different frequencies. The antenna device 100 can be used, for example, as a wireless base station used opposite to the window glass 21.

[0053] Figure 1 The illustrated antenna device 100 can transmit a beam from a relatively low place toward the ground by facing the window glass 21 installed in the building 40. Therefore, the antenna device 100 can form a communication area with the ground that can obtain a relatively high throughput. In addition, the antenna device 100 can easily transmit a beam by avoiding obstacles between the antenna device 100 and the ground by facing the window glass 21 installed in the building 40. Therefore, the antenna device 100 can form a communication area with the ground that can obtain a relatively high throughput.

[0054] exist Figure 1 In the example shown, the antenna device 100 is installed on the indoor side of the building 40 with respect to the window glass 21. Thus, the antenna device 100 can be installed by indoor construction, and the installation work becomes easy.

[0055] The plurality of wirings 160 may include multiple types of wirings. Specific examples of the wirings 160 include coaxial cables, optical cables (also called optical fiber cables), differential transmission cables, Ethernet cables, flexible wiring substrates, and the like. The antenna device 100 is connected to the digital control unit 150 via the plurality of wirings 160. The digital control unit 150 is a device that performs communication control and consumes several hundred watts of power, so it generates a large amount of heat. For example, the heat generated by the digital control unit 150 is greater than the heat generated by the antenna device 100. The digital control unit 150 is configured separately from the window glass 21. In Figure 1In the example shown, the digital control unit 150 is installed on the back side of the ceiling 20 in a manner hidden by the ceiling 20. The digital control unit 150 may be installed on a wall or a floor, or may be installed on the back side of a wall or under a floor. If the digital control unit 150 is arranged on the back side of the ceiling 20, the back side of a wall, or under a floor, the digital control unit 150 becomes inconspicuous and has a good appearance design.

[0056] The digital control unit 150 is preferably arranged at a position where the heat generated by the digital control unit 150 is not transferred to the window glass 21, and is preferably separated from the window glass by more than 100 mm. The distance between the digital control unit 150 and the window glass 21 is preferably more than 300 mm, more preferably more than 1000 mm, and further preferably more than 2000 mm. The distance between the digital control unit 150 and the window glass 21 may be more than 20 m, or more than 30 m. The distance between the digital control unit 150 and the window glass 21 may also be more than 5000 mm. There is no particular upper limit to the distance between the digital control unit 150 and the window glass 21, but in order to suppress the loss caused by the wiring 160, it is preferably less than 100 m, more preferably less than 50 m, further preferably less than 40 m, and particularly preferably less than 10000 mm.

[0057] The length of the wiring 160 is preferably 100 mm or more, more preferably 300 mm or more, further preferably 1000 mm or more, and particularly preferably 2000 mm or more. The length of the wiring 160 may be 20 m or more, or 30 m or more. If the length of the wiring 160 is 100 mm or more, the heat generated by the digital control unit 150 is not easily transferred to the window glass 21. The upper limit of the length of the wiring 160 is not particularly limited, but in order to suppress the loss caused by the wiring 160, it is preferably 100 m or less, more preferably 50 m or less, and further preferably 40 m or less.

[0058] The digital control unit 150 may also be connected to a communication network (not shown) via wiring such as an optical cable. For example, in the case of 5G, the digital control unit 150 is connected to a distributed unit or a central unit, and is also connected to a 5G core network.

[0059] When the window glass 21 is attached to the window frame 22, the antenna device 100 is preferably provided at a position separated from the inner frame of the window frame 22 by 20 mm or more. If the antenna device 100 is provided at a position separated from the window frame 22 by 20 mm or more, the temperature gradient between the portion of the window glass 21 facing the antenna device 100 and the portion of the window glass 21 located in the window frame 22 can be reduced. In this way, the thermal strain generated in the window glass 21 can be reduced, so that the window glass 21 is not easily broken. In addition, if the antenna device 100 is provided at a position separated from the inner frame of the window frame 22 by 20 mm or more, the antenna device 100 is easy to construct.

[0060] Figure 2 The antenna device 100 according to one embodiment of the present invention is shown in a front view. The antenna device 100 has an antenna opening 102 .

[0061] exist Figure 2 In the embodiment, the antenna device 100 is a planar antenna having at least one array antenna 110. The array antenna 110 is, for example, a microstrip array antenna having a substrate 112 between a plurality of radiating elements 114 arranged in a plane and a conductor 116. In a front view, the plurality of radiating elements 114 are contained in the antenna opening 102. In order to perform large-scale MIMO communication, the number of radiating elements 114 constituting the array antenna 110 is preferably 16 elements or more, and more preferably 32 elements or more. If the array antenna 110 is light-transmitting, when it is arranged to face the window glass, a field of view through the window glass can be ensured. The array antenna 110 may also be a slot array antenna.

[0062] exist Figure 2 In the embodiment, the radiating element 114 is an antenna conductor formed to be able to transmit and receive radio waves of a desired frequency band. Examples of the desired frequency band include a quasi-millimeter wave band of 20 to 30 GHz and a millimeter wave band of 30 to 300 GHz. The radiating element 114 functions as a radiator.

[0063] The radiating element 114 is provided on the first main surface of the substrate 112 on the exterior side. The radiating element 114 may be formed by placing a metal material on the first main surface of the substrate 112.

[0064] The radiating element 114 is, for example, a conductor formed in a planar shape. As a metal material forming the radiating element 114, a conductive material such as gold, silver, copper, aluminum, chromium, lead, zinc, nickel, or platinum can be used. The conductive material may also be an alloy, such as an alloy of copper and zinc (brass), an alloy of silver and copper, an alloy of silver and aluminum, etc. The radiating element 114 may also be a thin film. The shape of the radiating element 114 may be rectangular or circular, but is not limited to these shapes. The shape of the radiating element 114 may also be a linear or plate-like shape represented by a dipole antenna.

[0065] As other materials for forming the radiating element 114, fluorine-doped tin oxide (FTO), indium tin oxide (ITO), and the like can be cited.

[0066] In this embodiment, the radiating element 114 is provided on the first main surface of the substrate 112, but may be provided inside the substrate 112. In this case, the radiating element 114 may be formed into a coil shape and provided inside the substrate 112, for example.

[0067] When the substrate 112 is a laminated glass including a pair of glass plates and a resin layer provided between the pair of glass plates, the radiating element 114 may be provided between the glass plates and the resin layer constituting the laminated glass.

[0068] In addition, the radiating element 114 itself may be formed in a flat plate shape. In this case, the flat plate-shaped radiating element 114 may be directly attached to the support portion without using the base material 112 .

[0069] The radiating element 114 may be disposed inside the storage container in addition to being disposed on the substrate 112. In this case, the radiating element 114 may be, for example, a flat plate-shaped radiating element 114 disposed inside the storage container. The shape of the storage container is not particularly limited and may be rectangular. The substrate 112 may be a part of the storage container.

[0070] The radiating element 114 may be light-transmissive. If the radiating element 114 is light-transmissive, the antenna device 100 can not only improve the design but also reduce the average solar absorption rate. In this case, the visible light transmittance of the radiating element 114 is preferably 40% or more, and is preferably 60% or more from the perspective of transparency and maintaining the function as window glass. It should be noted that the visible light transmittance can be obtained according to JIS R 3106:1998.

[0071] The radiating element 114 may be formed in a mesh shape to have light transmittance. It should be noted that the so-called mesh means that mesh-like through holes are opened on the plane of the radiating element 114.

[0072] When the radiating element 114 is formed in a mesh shape, the mesh openings of the mesh may be square, rhombus, or polygonal. The line width of the mesh is preferably 0.1 to 30 μm, more preferably 0.2 to 15 μm. The line spacing of the mesh is preferably 5 to 500 μm, more preferably 10 to 300 μm.

[0073] The aperture ratio of the radiating element 114 is preferably 80% or more, and more preferably 90% or more. The aperture ratio of the radiating element 114 is the ratio of the area of ​​the opening formed in the radiating element 114 to the total area of ​​the radiating element 114. The larger the aperture ratio of the radiating element 114, the higher the visible light transmittance of the radiating element 114.

[0074] The thickness of the radiating element 114 is preferably greater than the skin depth of the conductor formed on a plane. For example, in the quasi-millimeter wave band with a frequency of 20 to 30 GHz, it is preferably greater than 1 μm, and more preferably greater than 10 μm. The upper limit of the thickness of the radiating element 114 is not particularly limited, but in order to maintain the dimensional accuracy of the conductor within a preferred range, it may be less than 5 μm, less than 10 μm, or less than 40 μm.

[0075] In addition, when the radiating element 114 is formed in a mesh shape, the thickness of the radiating element 114 may be 1 to 40 μm. By forming the radiating element 114 in a mesh shape, the visible light transmittance can be increased even if the radiating element 114 is thick.

[0076] The substrate 112 is, for example, a substrate arranged parallel to the window glass. The substrate 112 is, for example, formed in a rectangular shape in a plan view and has a first main surface and a second main surface. The first main surface of the substrate 112 is arranged to face the outside of the house, and in the first embodiment, is arranged to face the surface of the inside of the house of the window glass. The second main surface of the substrate 112 is arranged to face the inside of the house, and in the first embodiment, is arranged to face the same direction as the surface of the inside of the house of the window glass.

[0077] The substrate 112 may be provided at a predetermined angle with respect to the window glass. The antenna device 100 may radiate electromagnetic waves in a state where (the normal direction of) the substrate 112 on which the radiating element 114 is provided is tilted with respect to (the normal direction of) the window glass.

[0078] The material forming the substrate 112 is designed according to the antenna performance such as power and directivity required by the radiating element 114, and for example, a dielectric such as glass or resin can be used. The substrate 112 can be formed of a dielectric such as glass or resin so as to have light transmittance. By forming the substrate 112 with a light transmittance material, it is possible to reduce the situation where the substrate 112 blocks the view through the window glass.

[0079] When glass is used as the substrate 112 , examples of the material of the glass include soda-lime-silica glass, borosilicate glass, aluminosilicate glass, quartz glass, and alkali-free glass.

[0080] The glass plate used as the substrate 112 can be produced by a known production method such as a float process, a fusion process, a redraw process, a press forming process, or a Czochralski process. As a production method for a glass plate, a float process is preferably used from the viewpoint of excellent productivity and cost.

[0081] The glass plate is formed into a rectangular shape in a plan view. As a method for cutting the glass plate, for example, there can be cited a method of cutting by irradiating a laser onto the surface of the glass plate and moving the irradiation area of ​​the laser on the surface of the glass plate, or a method of mechanically cutting using a cutter wheel or the like.

[0082] In this embodiment, the so-called rectangle includes shapes with rounded corners in addition to rectangles and squares. The shape of the glass plate in a plan view is not limited to a rectangle, but may also be a circle, etc. In addition, the glass plate is not limited to a single plate, but may also be a laminated glass or a multi-layer glass.

[0083] When a resin is used as the substrate 112, examples of the resin include liquid crystal polymer (LCP), polyphenylene ether (PPE), polycarbonate, and fluororesin. Fluororesin is preferred from the viewpoint of low dielectric constant and low dielectric loss.

[0084] As fluororesin, ethylene-tetrafluoroethylene copolymer (hereinafter also referred to as "ETFE"), hexafluoropropylene-tetrafluoroethylene copolymer (hereinafter also referred to as "FEP"), tetrafluoroethylene-propylene copolymer, tetrafluoroethylene-hexafluoropropylene-propylene copolymer, perfluoro (alkyl vinyl ether)-tetrafluoroethylene copolymer (hereinafter also referred to as "PFA"), tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (hereinafter also referred to as "THV"), polyvinylidene fluoride (hereinafter also referred to as "PVDF"), vinylidene fluoride-hexafluoropropylene copolymer, polyvinyl fluoride, chlorotrifluoroethylene polymer, ethylene-chlorotrifluoroethylene copolymer (hereinafter also referred to as "ECTFE") or polytetrafluoroethylene etc. can be enumerated. Any one of them can be used alone, or two or more can be used in combination.

[0085] The fluororesin is preferably at least one selected from ETFE, FEP, PFA, PVDF, ECTFE, and THV. Among these, ETFE is particularly preferred from the viewpoint of excellent transparency, processability, and weather resistance.

[0086] The thickness h of the substrate 112 is preferably 25 μm to 10 mm. The thickness h of the substrate 112 can be designed according to the relative dielectric constant of the substrate 112, the frequency band used, and the required bandwidth.

[0087] When the substrate 112 is a resin, the resin is preferably formed into a film or sheet. From the viewpoint of maintaining excellent antenna strength, the thickness h of the film or sheet is preferably 25 to 1000 μm, more preferably 50 to 800 μm.

[0088] When the substrate 112 is made of glass, the thickness h of the substrate 112 is preferably 0.5 to 10 mm from the viewpoint of maintaining the strength of the antenna.

[0089] The arithmetic mean roughness Ra of the first main surface on the outside of the substrate 112 is preferably 1.2 μm or less. This is because if the arithmetic mean roughness Ra of the first main surface is 1.2 μm or less, air easily flows in the space formed between the substrate 112 and the window glass. The arithmetic mean roughness Ra of the first main surface is more preferably 0.6 μm or less, and further preferably 0.3 μm or less. The lower limit of the arithmetic mean roughness Ra is not particularly limited, and is, for example, 0.001 μm or more.

[0090] In addition, the arithmetic mean roughness Ra can be measured based on Japanese Industrial Standard JIS B0601:2001.

[0091] The area of ​​the substrate 112 is preferably 0.001 to 4 m 2 If the area of ​​the substrate 112 is 0.001 m 2 The above configuration makes it easy to form the radiating element 114, the conductor 116, etc. In addition, if the area of ​​the substrate 112 is 4 m 2 The area of ​​the substrate 112 is more preferably 0.05 to 2 m2. 2 .

[0092] The conductor 116 may be provided on the second main surface of the substrate 112 on the side opposite to the window glass. The conductor 116 is provided on the indoor side relative to the radiating element 114. The conductor 116 may also be a portion that functions as an electromagnetic shielding layer that can reduce electromagnetic wave interference between electromagnetic waves radiated from the radiating element 114 and electromagnetic waves generated from electronic devices in the room. The conductor 116 may be formed of a single layer or a plurality of layers. As the conductor 116, a known material may be used, for example, a metal film of copper, tungsten, or the like, or a transparent substrate using a transparent conductive film, or the like.

[0093] As a transparent conductive film, for example, a light-transmitting conductive material such as indium tin oxide (ITO), fluorine-added tin oxide (FTO), indium zinc oxide (IZO), indium tin oxide added with silicon oxide (ITSO), zinc oxide (ZnO), or Si compounds containing P and B can be used.

[0094] The conductor 116 is, for example, a conductor plane formed in a planar shape. The shape of the conductor 116 may be a rectangle or a circle, but is not limited to these shapes.

[0095] The conductor 116 may also be formed into a mesh to have light transmittance. Here, the so-called mesh refers to a state in which mesh-like through holes are opened in the plane of the conductor 116. When the conductor 116 is formed into a mesh, the mesh of the mesh may be square, rhombus, or polygonal. The line width of the mesh is preferably 0.1 to 30 μm, more preferably 0.2 to 15 μm. The line spacing of the mesh is preferably 5 to 500 μm, more preferably 10 to 300 μm.

[0096] As a method for forming the conductor 116 , a known method such as a sputtering method or a vapor deposition method can be used.

[0097] The surface resistivity of the conductor 116 is preferably 20Ω / □ or less, more preferably 10Ω / □ or less, and further preferably 5Ω / □ or less. The conductor 116 is preferably wider than the substrate 112, but may be narrower than the substrate 112. By providing the conductor 116 on the second main surface side of the substrate 112 on the indoor side, the transmission of radio waves into the indoor can be suppressed. The surface resistivity of the conductor 116 can be determined according to the thickness, material, and aperture ratio of the conductor 116. The aperture ratio is the ratio of the area of ​​the opening formed in the conductor 116 to the total area of ​​the conductor 116.

[0098] From the viewpoint of improving the appearance design, the visible light transmittance of the conductor 116 is preferably 40% or more, more preferably 60% or more. In addition, in order to suppress the transmission of radio waves into the house, the visible light transmittance of the conductor 116 is preferably 90% or less, more preferably 80% or less.

[0099] In addition, the larger the opening ratio of the conductor 116, the higher the visible light transmittance. The opening ratio of the conductor 116 is preferably 80% or more, and more preferably 90% or more. In addition, in order to suppress the transmission of radio waves into the house, the opening ratio of the conductor 116 is preferably 95% or less.

[0100] The thickness of the conductor 116 is preferably greater than the skin depth of the conductor formed on a plane, for example. For example, in the quasi-millimeter wave band with a frequency of 20 to 30 GHz, it is preferably greater than 1 μm, and more preferably greater than 10 μm. The upper limit of the thickness of the conductor 116 is not particularly limited, but in order to maintain the dimensional accuracy of the conductor within a preferred range, it can be less than 5 μm, less than 10 μm, or less than 40 μm.

[0101] In addition, when the conductor 116 is formed in a mesh shape, the thickness of the conductor 116 may be 1 to 40 μm. By forming the conductor 116 in a mesh shape, the visible light transmittance can be improved even if the conductor 116 is thick.

[0102] The radiating element 114 shown in the figure is a patch element (patch antenna), but may be another element such as a dipole element (dipole antenna) or a slot element (slot antenna).

[0103] Figure 3 It is a cross-sectional view schematically showing an example in which the antenna device 100 according to one embodiment of the present invention is installed on the window glass 21 . Figure 3 The antenna device 100 shown is disposed to face the surface of the window glass 21 of the building 40 on the indoor side. Figure 4 As shown, the antenna device 100 includes an array antenna 110, an analog beamformer 130, an upconverter 134, and a downconverter 136. Figure 4 The details of the illustrated structure will be described later.

[0104] exist Figure 3 In the illustrated example, the array antenna 110 , the analog beamformer 130 , the upconverter 134 , and the downconverter 136 are housed in the housing 120 . That is, the antenna device 100 is housed in the housing 120 .

[0105] The antenna device 100 may be fixed to the window glass 21. Figure 3 In the example shown, the box 120 storing the antenna device 100 is fixed to the window glass 21 by the fixture 200. The fixture 200 fixes the antenna device 100 in a manner that forms a space between the window glass 21 and the antenna device 100. By forming a space between the window glass 21 and the antenna device 100, convection is generated in the space due to the chimney effect, and the heat dissipation of the antenna device 100, especially the analog beam former 130, can be improved, and the breakage of the window glass 21 caused by heat can be prevented. The fixture 200 can also be a spacer that ensures the space between the window glass 21 and the antenna device 100. The fixture 200 can be formed of a dielectric base material. As the material of the fixture 200, for example, a known resin such as polycarbonate resin, polyphenylene ether resin, polybutylene terephthalate, ABS resin, silicone resin, polysulfide resin, or acrylic resin can be used. In addition, metals such as aluminum can also be used.

[0106] The antenna device 100 may include a heat sink 140 for dissipating heat from the antenna device 100. The heat sink 140 can prevent the antenna device 100 from being overheated. Figure 3In the illustrated example, the heat sink 140 is in contact with the surface of the antenna device 100 on the indoor side so as to be able to transfer the heat of the antenna device 100 .

[0107] If the distance D1 between the antenna device 100 and the window glass 21 is 3 mm or more and 20 mm or less, it is possible to achieve both suppression of cracking of the window glass 21 due to heat and transmission of radio waves through the window glass 21, and the effectiveness of the installation of the antenna device 100 is improved. If the distance D1 is 3 mm or more, the heat dissipation is improved, so the window glass 21 is less likely to be broken by heat. If the distance D1 is 5 mm or more, the heat dissipation of the antenna device 100 is further improved, and the window glass 21 is less likely to be broken. In addition, if the distance D1 is 20 mm or less, it is possible to suppress the decrease in the intensity of the beam radiated through the window glass 21. If the distance D1 is 8 mm or less, it is possible to further suppress the decrease in the intensity of the beam radiated through the window glass 21. In addition, when the wavelength at the operating frequency of the radiating element 114 is λg, the distance D1 can be 0.28λg or more and 0.93λg or less.

[0108] It should be noted that the components in the housing 120 (for example, at least one of the analog beamformer 130, the upconverter 134, and the downconverter 136) may be arranged in a region that does not overlap with the radiating element 114 when the array antenna 110 is viewed from the front. This can improve the appearance design.

[0109] Figure 4 It is a block diagram showing a configuration example of the antenna unit 10 according to one embodiment of the present invention.

[0110] The analog beamformer 130 is connected to the array antenna 110. The analog beamformer 130 transmits a transmission signal to the array antenna 110 and receives a reception signal from the array antenna 110. The analog beamformer 130 mainly performs functions such as amplifying the transmission signal and the reception signal, adjusting the phase of the transmission signal and the reception signal, adjusting the amplitude of the transmission signal and the reception signal, and switching the path of the transmission signal and the reception signal. The analog beamformer 130 changes the amplitude and phase of the transmission signal and the reception signal applied to the plurality of radiating elements 114 in the array antenna 110 according to the control signal CS for controlling the analog beamformer 130. In addition, by applying the change of amplitude and phase to all the radiating elements 114 of the array antenna 110, the beam can be directed to various angles. The analog beamformer 130 is supplied with power by a power supply not shown. The analog beamformer 130 may use an electronic circuit or a liquid crystal, for example.

[0111] The analog beamformer 130 may include n beamforming ICs (Integrated Circuits) that perform beamforming using the array antenna 110. n is an integer greater than or equal to 1. Figure 4n beamforming ICs 1301, 1302, ..., 130 n . The n beamforming ICs control the phase and amplitude of the plurality of transmission signals supplied to the plurality of radiation elements 114 assigned to them among the plurality of radiation elements 114, respectively, according to the control signal CS. In addition, the n beamforming ICs control the phase and amplitude of the plurality of reception signals received from the plurality of radiation elements 114 assigned to them among the plurality of radiation elements 114, respectively, according to the control signal CS. The n beamforming ICs each have a first phase shifter for adjusting the phase of the transmission signal, a first amplitude adjuster for adjusting the amplitude of the transmission signal, a second phase shifter for adjusting the phase of the reception signal, and a second amplitude adjuster for adjusting the amplitude of the reception signal. The first phase shifter and the second phase shifter may not be different phase shifters, but phase shifters commonly used in transmission and reception. The first amplitude adjuster and the second amplitude adjuster may not be different amplitude adjusters, but amplitude adjusters commonly used in transmission and reception. The amplitude adjuster may be an attenuator that attenuates the amplitude of the transmission signal or the reception signal, or a gain variable amplifier that amplifies the amplitude of the transmission signal or the reception signal, or a combination of an attenuator and a gain variable amplifier.

[0112] The analog beamformer 130 is connected to the upconverter 134 and the downconverter 136 via the distribution / synthesis circuit 132. The distribution / synthesis circuit 132 operates as a distributor during transmission and as a synthesizer during reception. The distribution / synthesis circuit 132 distributes one or more transmission high-frequency signals output from the upconverter 134 to n beamforming ICs. Figure 4 Two transmission high frequency signals RF1 and RF3 are shown as examples. The distribution / synthesis circuit 132 synthesizes a plurality of reception high frequency signals output from n beamforming ICs, and outputs the synthesized one or more reception high frequency signals to the down converter 136 . Figure 4 Two received high frequency signals RF2 and RF4 are shown as examples. It should be noted that high frequency signals are also called RF signals. RF is the abbreviation of Radio Frequency.

[0113] The up-converter 134 is connected to the analog beamformer 130. In this example, the up-converter 134 is connected to n beamforming ICs in the analog beamformer 130 via the distribution / synthesis circuit 132. The up-converter 134 mainly performs the function of mixing the transmission intermediate frequency signal and the local oscillation signal to generate a transmission high frequency signal. Figure 4In the case of, the up-converter 134 mixes the transmission intermediate frequency signal IF1 and the local oscillation signal LO to generate the transmission high frequency signal RF1, and mixes the transmission intermediate frequency signal IF3 and the local oscillation signal LO to generate the transmission high frequency signal RF3. In addition, the intermediate frequency signal is also called the IF signal. IF is the abbreviation of Intermediate Frequency, and LO is the abbreviation of Local Oscillator.

[0114] The frequency of sending high-frequency signals RF1 and RF3 (transmitting RF frequency f RFT ) than the frequency of the intermediate frequency signals IF1 and IF3 (the frequency of the intermediate frequency signals IF1 and IF3) IFT ) is high. The frequency of the local oscillation signal LO is set to the local oscillation frequency f LO At this time, in f RFT >f LO In the case of transmitting RF frequency f RFT Equal to the transmit IF frequency f IFT With the local oscillator frequency f LO The sum (f RFT =f IFT +f LO ). On the other hand, in f RFT <f LO In the case of transmitting RF frequency f RFT Equal to the local oscillator frequency f LO Subtract the transmit IF frequency f IFT The difference (f RFT =f LO -f IFT ).

[0115] Send IF frequency f IFT For example, it is below 12 GHz. IFT It can also be below 8 GHz, or below 6 GHz. The transmission IF frequency f IFT The lower limit of is not particularly limited as long as the required bandwidth is ensured, and is, for example, 500 MHz.

[0116] The down converter 136 is connected to the analog beamformer 130. In this example, the down converter 136 is connected to n beamforming ICs in the analog beamformer 130 via the distribution / synthesis circuit 132. The down converter 136 mainly performs the function of mixing the received high frequency signal and the local oscillation signal to generate a received intermediate frequency signal. Figure 4 In this case, the down converter 136 mixes the received high frequency signal RF2 and the local oscillation signal LO to generate a received intermediate frequency signal IF2, and mixes the received high frequency signal RF4 and the local oscillation signal LO to generate a received intermediate frequency signal IF4.

[0117] The frequency of the intermediate frequency signals IF2 and IF4 is received (the receiving IF frequency f IFR ) than the frequency of the received high frequency signal (received RF frequency f RFR ) is low. The frequency of the local oscillation signal LO is set to the local oscillation frequency f LO At this time, in f RFR >f LO In the case of receiving IF frequency f IFR Equal to the received RF frequency f RFR Subtract the local oscillator frequency f LO The difference (f IFR =f RFR -f LO ). On the other hand, in f RFR <f LO In the case of receiving IF frequency f IFR Equal to the local oscillator frequency f LO Subtract the received RF frequency f RFR The difference (f IFR =f LO -f RFR ).

[0118] Receive IF frequency f IFR For example, it is below 12 GHz. The receiving IF frequency f IFR It can also be below 8 GHz, or below 6 GHz. The receiving IF frequency f IFR The lower limit of is not particularly limited as long as the required bandwidth is ensured, and is, for example, 500 MHz.

[0119] The up-converter 134 and the down-converter 136 can exchange signals with the digital control unit 150 by performing frequency conversion from a high-frequency RF signal such as a quasi-millimeter wave to a millimeter wave and an intermediate frequency IF signal that is relatively easy to process. It should be noted that in the orthogonal modulation and demodulation method, the RF signal during transmission or reception is orthogonally modulated and demodulated into an I / Q signal, but the up-converter 134 and the down-converter 136 may also be a transceiver whose mixing unit is a direct I / Q orthogonal modem.

[0120] Power is supplied to the up-converter 134 and the down-converter 136 by a power supply not shown. The wiring for the power supply may exist separately. Alternatively, the following method may be adopted: in the digital control unit 150, the power is superimposed on the wiring of the intermediate frequency signal as an analog signal and the local transmission signal, such as a coaxial cable, and the power is transmitted to the antenna device 100, and in the antenna device 100, these signals are separated from the power again by using a choke coil or the like. Alternatively, it may be a method of transmitting power simultaneously with the control signal through the wiring of the control signal as a digital signal, such as a flat cable, a differential transmission cable, or an Ethernet cable. For example, the technology of supplying digital signal data and power simultaneously through Ethernet wiring is well known as the PoE (Power-over-Ethernet: Power over Ethernet) standard. Moreover, in the case of using a method of transmitting power using an optical cable, the optical cable for power supply may exist separately, or the power may be transmitted while transmitting the analog signal through the wiring 161 to 164 or the optical cable with a reduced number of them, and the power may be supplied while supplying the control signal through the wiring 165.

[0121] exist Figure 4 In the case of , the high frequency signal obtained by receiving the first polarized wave (for example, the horizontal polarized wave) by the radiating element 114 is converted into the reception intermediate frequency signal IF2 by the down converter 136, and is transmitted to the digital control unit 150 via the wiring 162. Similarly, the high frequency signal obtained by receiving the second polarized wave (for example, the vertical polarized wave) by the radiating element 114 is converted into the reception intermediate frequency signal IF4 by the down converter 136, and is transmitted to the digital control unit 150 via the wiring 164. On the contrary, the transmission intermediate frequency signal IF1 transmitted from the digital control unit 150 via the wiring 161 in order to transmit the first polarized wave is converted into a high frequency signal by the up converter 134, and the first polarized wave is transmitted from the radiating element 114. Similarly, the transmission intermediate frequency signal IF3 transmitted from the digital control unit 150 via the wiring 163 in order to transmit the second polarized wave is converted into a high frequency signal by the up converter 134, and the second polarized wave is transmitted from the radiating element 114. The intermediate frequency can be set to the same frequency as the frequency band used in the fourth generation mobile communication system (so-called 4G) (e.g., 3.4 GHz to 3.6 GHz) and the frequency band called Sub6 in 5G (e.g., 3.6 GHz to 4.6 GHz). If the intermediate frequency is 12 GHz or less, the transmission path loss caused by the wiring 161, 162, 163, and 164 will not be a significant disadvantage compared to the quasi-millimeter wave band and the millimeter wave band.

[0122] The antenna device 100 is separated from the digital control unit 150 which generates a large amount of heat via a plurality of wirings 160, and the power consumption of the antenna device 100 is as low as several tens of W, and the heat generation is small. Therefore, even if the antenna device 100 is placed facing the window glass 21, the window glass 21 is not easily broken.

[0123] The digital control unit 150 has a modulation and coding (MODCOD) function, a demodulation and decoding (Demodulation and decoding) function, a digital beamforming function, a local oscillation signal generation function, and the like. The modulation and coding and demodulation and decoding functions are functions for converting an analog intermediate frequency (IF) signal into digital data, and vice versa, that is, converting digital data into an analog intermediate frequency (IF) signal. The intermediate frequency signal (IF signal) may be an in-phase / quadrature phase signal (I / Q signal). The digital beamforming function is a function for generating digital control data required to direct the beam toward various angles by applying amplitude and phase changes to all radiating elements 114 of the array antenna 110. The local oscillation signal generation function generates the required signals according to the needs of mixing, such as for the up-converter 134 and the down-converter 136, or the modulation and demodulation function.

[0124] In quasi-millimeter wave to millimeter wave radio of 5G or 6G, a high-gain beam steering array is required. The antenna unit 10 has a plurality of wirings 160 (wirings 161 to 166 in this example) for transmitting signals input and output between the digital control unit 150 and the antenna device 100 to meet the above array requirements.

[0125] Transmission intermediate frequency signal IF1 input to up converter 134 is input to antenna device 100 from digital control unit 150 via wiring 161. Transmission intermediate frequency signal IF3 input to up converter 134 is input to antenna device 100 from digital control unit 150 via wiring 163. Wirings 161 and 163 are examples of first wirings.

[0126] The reception intermediate frequency signal IF2 output from the down converter 136 is output to the digital control unit 150 via the wiring 162. The reception intermediate frequency signal IF4 output from the down converter 136 is output to the digital control unit 150 via the wiring 164. The wirings 162 and 164 are examples of second wirings.

[0127] The wirings 161 and 163 and the wirings 162 and 164 are wirings for transmitting intermediate frequency signals IF1 to IF4 which are analog signals, and they are preferably coaxial cables.

[0128] Alternatively, as an implementation method for transmitting intermediate frequency signals IF1 to IF4 as analog signals, an analog RoF (Radio-over-Fiber) technology may be used. The so-called analog RoF technology is a technology that uses an analog signal to modulate the intensity of an optical signal and transmits the optical signal in the form of an analog signal through an optical fiber. If this method is used, the wiring 161, 163 and the wiring 162, 164 may be optical cables. Moreover, the intermediate frequency signals IF1 to IF4 may be multiplexed for transmission by installing a combiner on the digital control unit 150, and after transmission, a demultiplexer may be installed on the antenna device 100 for separation, thereby reducing the number of wirings 161 to 164. Multiplexing includes wavelength multiplexing, spatial multiplexing and other methods.

[0129] The control signal CS for controlling the analog beamformer 130 is input from the digital control unit 150 to the antenna device 100 via at least one wiring 166. The wiring 166 is an example of a third wiring. The control signal CS is one or more signals for controlling the amplitude and phase of the analog beamformer 130. The control signal CS is a digital or analog control signal. For example, the control signal CS may include a command signal indicating target values ​​of the amplitude and phase, a clock signal that serves as a reference for the operation timing of the analog beamformer 130, and the like.

[0130] The wiring 166 is a wiring for transmitting the control signal CS, and the wiring 166 may be an optical cable, a differential transmission cable, an Ethernet cable, or a flexible wiring substrate. The wiring 166 may not be provided. In this case, the control signal CS may be digitally modulated and the modulated control signal CS may be multiplexed to any one of the wirings 161, 163 and the wirings 162, 164 for transmitting the intermediate frequency signals IF1 to IF4 for transmission. Digital demodulation may also be performed after frequency separation in the antenna device 100.

[0131] The antenna device 100 may also include an interface circuit 138 to which the control signal CS is input. The control signal CS may be input to the analog beamformer 130 via the interface circuit 138, or may be input to the analog beamformer 130 without passing through the interface circuit 138. The interface circuit 138 may include, for example, a filter that attenuates noise superimposed on the control signal CS. The interface circuit 138 may also include a power supply circuit that generates a power supply voltage for the antenna device 100, in which case the wiring 166 may include a power supply line or a ground line.

[0132] The local oscillation signal LO is input from the digital control unit 150 to the antenna device 100 via the wiring 165. The wiring 165 is an example of a fourth wiring. The wiring 165 may also be a wiring that transmits a reference oscillation signal having a frequency lower than the local oscillation signal LO from the digital control unit 150 to the antenna device 100 instead of the local oscillation signal LO. The up-converter 134 and the down-converter 136 may also use the local oscillation signal LO input via the wiring 165 as the local oscillation signal for mixing. Alternatively, the up-converter 134 and the down-converter 136 may also use a signal obtained by integer-multiplying the frequency of the reference oscillation signal input via the wiring 165 (a signal obtained by multiplying the frequency of the reference oscillation signal) as the local oscillation signal for mixing. Alternatively, the up-converter 134 and the down-converter 136 may also use a signal generated based on the frequency of the reference oscillation signal input via the wiring 165 (a signal generated by a phase-locked oscillator PLO, etc., based on the reference oscillation signal) as the local oscillation signal for mixing. The local oscillation signal LO and the reference oscillation signal are examples of signals used for frequency mixing.

[0133] The local oscillation signal LO is an analog signal, and the wiring 165 is preferably a coaxial cable or an optical cable using the analog RoF technology, similarly to the wirings 161 , 163 and the wirings 162 , 164 .

[0134] As described above, the embodiments are described, but the above embodiments are presented as examples, and the present invention is not limited to the above embodiments. The above embodiments can be implemented in various other ways, and various combinations, omissions, substitutions, changes, etc. can be made without departing from the scope of the main purpose of the invention. These embodiments and their variations are included in the scope and main purpose of the invention, and are included in the invention described in the scope of the protection claimed and its equivalent.

[0135] For example, the antenna device 100 may not be fixed to the window glass 21. The antenna device 100 may be suspended from a ceiling or fixed to a protrusion existing around the window glass 21 (for example, a window frame or a window sash that holds the outer edge of the window glass 21) so as to be used facing the window glass 21. The antenna device 100 may be installed in contact with the window glass 21 or in a state close to the window glass 21 without contacting the window glass 21.

[0136] The antenna device 100 is not limited to being disposed inside the house so as to face the surface of the window glass 21 inside the house, but may be disposed outside the house so as to face the surface of the window glass 21 outside the house.

[0137] The antenna device 100 is not limited to the case where it is installed and used facing the surface of the interior side of the window glass 21 of the building 40, and may be installed and used facing the surface of the interior side of the window glass of a vehicle.

[0138] In addition, when the antenna device 100 uses an optical cable to transmit power, the optical cable for power supply may exist separately. In addition, the antenna device 100 may use one optical cable to form the wirings 161 to 164 as one wiring. In addition, the antenna device 100 may use one optical cable to form the optical cable for power supply and the wirings 161 to 164 as one wiring. In addition, the wirings 161 to 164 and the wiring 165 of the antenna device 100 may be formed as one wiring using one optical cable, or may be further formed as one wiring together with the optical cable for power supply, and may supply power while supplying analog signals and control signals.

[0139] In addition, an analog RoF technology may be used between the antenna device 100 and the digital control unit 150 to modulate the intensity of an optical signal using an analog signal of an RF frequency such as a millimeter wave band, and the optical signal in the form of an analog signal may be transmitted through an optical fiber. In this case, since it is not necessary to perform frequency conversion between the RF frequency and the IF frequency, the up-converter 134 and the down-converter 136 may not be provided. In the absence of the up-converter 134 and the down-converter 136, the transmission signal transmitted from the digital control unit 150 as an optical signal in the form of an analog signal is converted into an analog electrical signal of an RF frequency in the antenna device 100, and then output from the distribution circuit 132 and the analog beamformer 130 to the array antenna 110. In addition, the reception signal received by the array antenna 110 is converted from an analog electrical signal of an RF frequency to an optical signal in the form of an analog signal in the antenna device 100, and then transmitted to the digital control unit 150. In this way, for the transmission of analog signals between the digital control unit 150 and the antenna device 100 , the analog signals of RF frequencies such as the millimeter wave band can be directly converted into optical signals for transmission.

[0140] The transmitted signal is converted from an optical signal in the form of an analog signal to an analog electrical signal of an RF frequency, or vice versa, from an analog electrical signal of an RF frequency to an optical signal in the form of an analog signal, by a photoelectric converter. Wiring 161, 163 and wiring 162, 164 need to be optical cables that transmit optical signals in the form of analog signals. The wiring 161 to 164 can be reduced in number by multiplexing techniques such as wavelength multiplexing and space multiplexing, or wiring 161 to 164 can be formed into one wiring using one optical cable. The third wiring may or may not be present. The control signal CS may be transmitted through wiring 166, or may be transmitted by digitally modulating the control signal CS and multiplexing it to any one of wiring 161, 163 and wiring 162, 164. In the case of transmitting the control signal CS through wiring 166, wiring 166 may be an optical cable, a flat cable, a differential transmission cable, an Ethernet cable, or the like.

[0141] In addition, all contents of the specification, claims, drawings and abstract of Japanese Patent Application No. 2022-145922 filed on September 14, 2022 are cited herein and incorporated as a disclosure of the specification of the present invention.

[0142] Description of symbols

[0143] 10 antenna units;

[0144] 20 ceiling;

[0145] 21 Window glass;

[0146] 22 Window frames;

[0147] 40 buildings;

[0148] 100 antenna assembly;

[0149] 102 antenna opening;

[0150] 110 array antenna;

[0151] 112 substrate;

[0152] 114 Radiating elements;

[0153] 116 conductor;

[0154] 120 cabinet;

[0155] 130 Analog Beamformer;

[0156] 1301, 1302, ..., 130 n Beamforming IC;

[0157] 132 Distribution / Synthesis Circuits;

[0158] 134 Upconverter;

[0159] 136 Downconverter;

[0160] 138 interface circuit;

[0161] 140 Radiator;

[0162] 150 Digital Control Unit;

[0163] 160 Wiring;

[0164] 200 Fixtures.

Claims

1. An antenna device connected to a digital control unit via a plurality of wirings including a first wiring and a second wiring, wherein: The antenna device comprises an array antenna, an analog beamformer, an upconverter and a downconverter. The intermediate frequency signal input to the up-converter is input from the digital control unit to the antenna device via the first wiring. The intermediate frequency signal output from the down converter is output to the digital control unit via the second wiring. A control signal for controlling the analog beamformer is input from the digital control unit to the antenna device.

2. The antenna device according to claim 1, wherein: The plurality of wirings include a third wiring, A control signal for controlling the analog beamformer is input from the digital control unit to the antenna device via the third wiring.

3. The antenna device according to claim 1, wherein: The control signal is transmitted by being superimposed on either the first wiring or the second wiring that transmits the intermediate frequency signal.

4. The antenna device according to claim 1, wherein: The plurality of wirings include a fourth wiring, A signal for frequency mixing is input from the digital control unit to the antenna device via the fourth wiring.

5. The antenna device according to claim 1, wherein: The frequency of the intermediate frequency signal is below 12 GHz.

6. An antenna unit, comprising: The antenna device according to any one of claims 1 to 5; A digital control unit is disposed separately from the window glass facing the antenna device; and The plurality of wiring lines.

7. The antenna unit according to claim 6, wherein: The first wiring and the second wiring are coaxial cables.

8. The antenna unit according to claim 6, wherein: The first wiring and the second wiring are optical cables that transmit analog signals.

9. The antenna unit according to claim 6, wherein: The antenna device is used as a wireless base station.

10. The antenna unit according to claim 6, wherein: The antenna device faces the window glass installed in the building.

11. The antenna unit according to claim 6, wherein: The antenna device faces the window glass at a distance of 3 mm to 20 mm.

12. The antenna unit according to claim 6, wherein: The antenna device is fixed to the window glass.

13. The antenna unit according to claim 6, wherein: The window glass is mounted on the window frame. The antenna device is provided at a position separated from the window frame by 20 mm or more.

14. The antenna unit according to claim 6, wherein: The length of the plurality of wirings is greater than or equal to 100 mm and less than or equal to 100 m.

15. The antenna unit according to claim 6, wherein: The digital control unit is separated from the window glass at a distance of 100 mm or more and 100 m or less.

16. An antenna unit comprising: Antenna device; A digital control unit is disposed separately from the window glass facing the antenna device; and Wiring, The antenna device is connected to the digital control unit via the wiring, The antenna device comprises an array antenna and an analog beamformer. The analog signal input to the analog beamformer is input from the digital control unit to the antenna device via the wiring. The analog signal output from the analog beamformer is output to the digital control unit via the wiring, A control signal for controlling the analog beamformer is input from the digital control unit to the antenna device, The wiring is an optical cable that transmits the analog signal.

17. The antenna unit according to claim 16, wherein: The length of the wiring is greater than or equal to 100 mm and less than or equal to 100 m.

18. The antenna unit according to claim 16, wherein: The digital control unit is separated from the window glass at a distance of 100 mm or more and 100 m or less.

19. The antenna unit according to claim 16, wherein: The antenna device faces the window glass installed in the building.

20. The antenna unit according to claim 16, wherein: The antenna device faces the window glass at a distance of 3 mm to 20 mm.

21. The antenna unit according to claim 16, wherein: The antenna device is fixed to the window glass.

22. The antenna unit according to claim 16, wherein: The window glass is mounted on the window frame. The antenna device is provided at a position separated from the window frame by 20 mm or more.

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