Optical assembly, preparation method of optical assembly and electronic equipment

Abstract

The embodiment of the invention provides an optical assembly, a preparation method of the optical assembly and electronic equipment, the optical assembly comprises an optical device and an optical cover plate, the optical cover plate comprises an optical body layer, and the optical body layer shields a light incident surface of the optical device and is provided with a light transmitting area opposite to the optical device; the optical cover plate further comprises a hydrophobic film layer, and the hydrophobic film layer is light-transmitting, is located on the side, facing the optical device, of the optical body layer and covers the light-transmitting area. And one surface, facing the optical device, of the hydrophobic film layer is a hydrophobic rough surface with a first micro-nano structure. According to the optical assembly, the proportion of fog-shaped dirt appearing on the optical cover plate can be effectively reduced.

Description

Optical component, method for preparing optical component, and electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 29, 2022, with application number 202211202910.9 and application name “Optical component, method for preparing optical component and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to an optical component, a method for preparing an optical component, and an electronic device. Background Art

[0003] Camera modules have become an indispensable functional module in electronic devices such as mobile phones, tablets, laptops, and wearable devices. With the continuous development of electronic devices, people's demand for camera modules' shooting effects has gradually improved.

[0004] The camera module usually includes a module body and an optical cover. The module body is arranged in the housing of the electronic device, and the optical cover can be arranged on the housing and cover the lens of the module body. The peripheral edge of the module body can be bonded to the optical cover by foam glue or the like, and there is a distance between the optical cover and the module body, so as to achieve the zoom function of the camera module while achieving the fixation of the module body in the housing. The optical cover is provided with a light-transmitting area at a position relative to the lens, so that light outside the electronic device can pass through the light-transmitting area into the module body. After the entire electronic device is coated, the original molecules, water vapor and some small molecules of the foam glue in the film layer will condense in the light-transmitting area, generating mist-like dirt.

[0005] Therefore, how to solve the problem of haze-like dirt on the optical cover has become a technical problem to be solved.

[0006] Summary of the Invention

[0007] The present application provides an optical component, a method for preparing an optical component, and an electronic device, which can effectively reduce the proportion of haze-like dirt appearing on the optical cover of the optical component.

[0008] A first aspect of an embodiment of the present application provides an optical assembly, the optical assembly comprising:

[0009] Optical devices;

[0010] An optical cover plate, wherein the optical cover plate comprises an optical body layer, the optical body layer shields the light incident surface of the optical device and has a light-transmitting area arranged opposite to the optical device;

[0011] The optical cover also includes a hydrophobic film layer, which is light-transmissive and located on the side of the optical body layer facing the optical device and covers the light-transmissive area; wherein,

[0012] The side of the hydrophobic film layer facing the optical device is a hydrophobic rough surface having a first micro-nano structure.

[0013] The present application provides a hydrophobic film layer in the optical cover. Since the hydrophobic film layer is light-transmissive and is located on the side of the optical body layer facing the optical device and covers the light-transmissive area, not only does the optical cover have hydrophobic properties in the light-transmissive area to reduce the adhesion of liquids (such as water droplets) on the hydrophobic rough surface, but also, due to the presence of the first micro-nano structure, the hydrophobic rough surface presents a rough morphology with a surface structure of micron-scale and / or nano-scale dimensions, and forms an undulating micro-nano structure on the hydrophobic rough surface. Since the hydrophobic rough surface has a low surface energy and a large surface tension between air and liquid, the droplets condensed on the first micro-nano structure will have a large water drop angle and a very small rolling angle on the hydrophobic rough surface, thereby reducing the proportion of haze-like dirt appearing in the light-transmissive area of ​​the optical cover facing the optical device (the inner surface of the optical cover).

[0014] In an optional embodiment, the optical device is a camera module, which includes a lens, wherein the optical body layer blocks the light incident surface of the lens; and the position of the light-transmitting area in the optical body layer is opposite to the position of the lens, so as to reduce the proportion of haze-like dirt on the inner surface of the optical cover in the light-transmitting area.

[0015] In an optional embodiment, the camera module also includes a module body, and the lens is located on the side of the module body facing the optical cover, wherein the non-light-transmitting area in the optical body layer is surrounded by the peripheral edge of the light-transmitting area, and the non-light-transmitting area is blocked on the module body, so as to realize the combination of the camera module and the optical cover, ensure the amount of light entering the light-transmitting area, and also facilitate the blocking of more camera modules by the optical cover.

[0016] In an optional embodiment, the hydrophobic film layer of the optical cover includes a hydrophobic layer, which is located on the side of the optical body layer facing the optical device and covers the light-transmitting area. The side of the hydrophobic layer facing the optical device is a hydrophobic rough surface, so that a hydrophobic rough surface is formed by the provision of the hydrophobic layer, thereby increasing the water drop angle of the inner surface of the optical cover in the light-transmitting area.

[0017] In an optional embodiment, the optical body layer of the optical cover includes a substrate and a first anti-reflection layer, the first anti-reflection layer covers the side of the substrate facing the hydrophobic film layer, and the side of the first anti-reflection layer facing the hydrophobic film layer is a rough surface having a second micro-nano structure, wherein the first micro-nano structure is adhered to and covers the second micro-nano structure.

[0018] In this way, by setting the first anti-reflection layer, not only can the reflectivity of the inner surface of the optical cover be reduced, and the intensity of ghost images in photos taken in general scenes and high-contrast environments be weakened, but also due to the presence of the second micro-nano structure, it can also help the formation of the first micro-nano structure.

[0019] In an optional embodiment, the shape of the first micro-nanostructure matches the shape of the second micro-nanostructure, so that the surface of the hydrophobic layer can form a first micro-nanostructure that is compatible with the second micro-nanostructure, without affecting the anti-reflection effect of the first anti-reflection layer. At the same time, the inner surface of the optical cover plate can also have the anti-reflection effect of the first anti-reflection layer in the light-transmitting area.

[0020] In an optional embodiment, the refractive index of the first anti-reflection layer is configured to gradually change from the refractive index corresponding to the first anti-reflection layer to the refractive index corresponding to the air along the direction from the substrate to the hydrophobic film layer, so that the first anti-reflection layer forms a gradient film layer with a gradually changing refractive index along the direction from the substrate to the hydrophobic film layer, which reduces the reflectivity of the inner surface of the optical cover while absorbing the light reflected by the lens to the first anti-reflection layer, thereby weakening the intensity of ghost images in the captured photos.

[0021] In an optional embodiment, the second micro-nano structure includes a plurality of protrusions, wherein the bottom end of the protrusion is connected to the substrate, the top end of the protrusion is arranged toward the hydrophobic film layer, and the protrusion gradually becomes thinner from the bottom end to the top end, so as to form the above-mentioned first anti-reflection layer, thereby reducing the multi-level reflection of light in the optical cover and the lens, weakening the intensity of ghost images in photos taken in a strong contrast environment, and forming a light trap effect on the surface of the first anti-reflection layer, absorbing the light reflected by the lens to the first anti-reflection layer, thereby further weakening the intensity of ghost images in photos taken in a strong contrast environment.

[0022] In an optional embodiment, the bottom ends of the plurality of protrusions are connected to each other, so as to increase the density of the protrusions on the surface of the first anti-reflection layer and enhance the light trapping effect.

[0023] In an optional embodiment, the protrusions are micron-scale and / or nanometer-scale protrusions, wherein the height of the protrusions is greater than or 50 nm and less than or equal to 200 nm, and the size of the bottom end is greater than or 150 nm and less than or equal to 500 nm, so as not to affect the transmittance of light on the optical cover plate and reduce the reflectivity of the inner surface of the optical cover plate, while being able to cooperate with the first micro-nano structure to increase the water drop angle and oil drop angle of the inner surface of the optical cover plate.

[0024] In an optional embodiment, the thickness of the hydrophobic layer is greater than or equal to 5 nm and less than or equal to 30 nm, so as to reduce the influence of the thickness of the hydrophobic layer on the height of the first micro-nanostructure without affecting the formation of the hydrophobic layer and the hydrophobic properties of the hydrophobic layer.

[0025] In an optional embodiment, the plurality of protrusions are arranged in an array, so that the arrangement of the plurality of protrusions on the inner surface of the optical body layer has a certain regularity, which is beneficial to the release of the stress of the film layer and the reduction of the stress deformation of the optical body layer.

[0026] In an optional embodiment, the second micro-nano structure includes a plurality of depressions, wherein the depressions are micrometer-scale and / or nanometer-scale depressions, and the plurality of depressions are evenly arranged on the optical body layer, so as to change the microscopic morphology of the surface of the first anti-reflection layer through the plurality of depressions, reduce the reflectivity of the inner surface of the optical cover plate, and weaken the intensity of ghost images taken in a strong contrast environment. At the same time, it can increase the water drop angle of the inner surface of the optical cover plate and reduce the rolling angle of the inner surface of the large optical cover plate in the light-transmitting area.

[0027] In an optional embodiment, the first anti-reflection layer is a light trap layer or a porous coating, so as to reduce the reflectivity of the inner surface of the optical cover plate, weaken the intensity of ghost images in photos taken in a high-contrast environment, and make the structure of the first anti-reflection layer more diversified.

[0028] In an optional embodiment, the hydrophobic film layer also includes a primer layer, which is attached to the light-transmitting area of ​​the optical body layer on the side facing the optical device, and the hydrophobic layer covers the primer layer so as to increase the adhesion strength of the hydrophobic layer on the surface of the first anti-reflection layer through the primer layer, thereby enhancing the stability of the performance of the inner surface of the optical cover.

[0029] In an optional embodiment, the side of the hydrophobic layer of the base layer facing the hydrophobic film layer has a third micro-nano structure, wherein the third micro-nano structure covers the second micro-nano structure in the optical body layer and is attached between the second micro-nano structure and the first micro-nano structure; and the shape of the third micro-nano structure matches the shape of the second micro-nano structure.

[0030] In this way, while the adhesion of the hydrophobic layer on the first anti-reflection layer is enhanced by the primer layer, the provision of the third micro-nano structure can help ensure the consistency of the first micro-nano structure and the second micro-nano structure.

[0031] In an optional embodiment, the thickness of the primer layer is smaller than the thickness of the hydrophobic layer in the hydrophobic film layer.

[0032] In this way, while ensuring the stable adsorption of the hydrophobic layer on the first reflective layer, the influence of the thickness of the base layer on the height of the first micro-nano structure can be reduced.

[0033] In an optional embodiment, the primer layer is an active primer layer that is the same as the substrate of the first anti-reflection layer in the optical body layer, so that the primer layer and the first anti-reflection layer can achieve better bonding strength.

[0034] In an optional embodiment, the substrate of the first anti-reflection layer is silicon dioxide, and the active primer layer is a silicon dioxide layer. This ensures that the primer layer has good bonding strength to the first anti-reflection layer while also providing the primer layer with high surface activity, thereby attracting the hydrophobic layer to the first anti-reflection layer and increasing its adhesion to the first anti-reflection layer.

[0035] In an optional embodiment, the hydrophobic layer in the hydrophobic film layer is a perfluoropolyether coating, so that the hydrophobic rough surface of the hydrophobic layer has good hydrophobic and oleophobic properties while not affecting the light transmission efficiency in the light-transmitting area.

[0036] In an optional embodiment, the water drop angle of the optical cover at the hydrophobic film layer is greater than 150°, and / or the rolling angle of the optical cover at the hydrophobic film layer is less than 40°, so that the optical cover has better hydrophobic properties at the hydrophobic film layer (i.e., the light-transmitting area).

[0037] In an optional embodiment, the optical body layer further includes a second anti-reflection layer, wherein the second anti-reflection layer is light-transmissive and is located on the side of the substrate of the optical body layer facing away from the hydrophobic film layer to reduce the reflection of light on the outer surface of the optical cover plate and protect the outer surface of the optical cover plate from being scratched.

[0038] A second aspect of the embodiments of the present application further provides a method for preparing an optical component, the method being used to manufacture any of the above optical components, the method comprising:

[0039] preparing an optical stack, wherein the optical cover plate comprises an optical body layer and a hydrophobic film layer, and the optical body layer comprises an optical stack;

[0040] forming a hydrophobic film layer on one side of the optical stack, wherein the hydrophobic film layer covers the light-transmitting area of ​​the optical stack corresponding to the optical body layer, and the side of the hydrophobic film layer facing away from the optical stack is a hydrophobic rough surface having a first micro-nano structure;

[0041] The optical cover plate including the optical stack is combined with an optical device to form an optical assembly, with the hydrophobic rough surface facing the optical device.

[0042] In this way, by setting the hydrophobic film layer, the side of the optical stack provided with the hydrophobic rough surface can have hydrophobic properties in the light-transmitting area. Since the hydrophobic rough surface is arranged toward the optical device, the side of the optical stack provided with the hydrophobic rough surface can be used as the inner surface of the optical cover plate, and the light-transmitting area of ​​the optical stack can be used as the light-transmitting area of ​​the optical cover plate, so that when the optical cover plate and the optical device are combined to form an optical component, the water drop angle of the inner surface of the optical cover plate in the light-transmitting area can be increased, thereby effectively avoiding the proportion of haze-like dirt on the optical cover plate after the entire electronic device is coated.

[0043] In an optional embodiment, preparing an optical stack specifically includes:

[0044] treating one side of a plate to be treated to form an optical stack, wherein the plate to be treated is an untreated glass plate;

[0045] The optical stack includes a substrate and a first anti-reflection layer, wherein the first anti-reflection layer covers the side of the substrate facing the hydrophobic film layer, and the side of the first anti-reflection layer facing the hydrophobic film layer is a rough surface having a second micro-nano structure; the hydrophobic film layer is located on the first anti-reflection layer and covers the light-transmitting area of ​​the first anti-reflection layer corresponding to the optical body layer.

[0046] By setting the first anti-reflection layer, due to the presence of the second micro-nano structure on the first anti-reflection layer, not only can the formation of the first micro-nano structure on the hydrophobic film layer be facilitated, reducing the proportion of haze-like dirt appearing in the light-transmitting area of ​​the optical cover, but also the reflectivity of the surface of the hydrophobic film layer can be reduced, weakening the intensity of ghost images in photos taken in general scenes and high-contrast environments.

[0047] In an optional embodiment, forming a hydrophobic film layer on one side of the optical stack specifically includes:

[0048] forming a hydrophobic layer having a first micro-nano structure on a side of the substrate having a second micro-nano structure;

[0049] The first micro-nano structure is located on the second micro-nano structure and covers the light-transmitting area of ​​the first anti-reflection layer corresponding to the optical body layer. The side of the hydrophobic layer facing the optical device is a hydrophobic rough surface, and the hydrophobic film layer includes a hydrophobic layer.

[0050] In this way, by setting the hydrophobic layer, a hydrophobic rough surface can be formed on the side of the hydrophobic layer facing the optical device, so as to combine with the first micro-nano structure, increase the water drop angle of the substrate in the light-transmitting area, and reduce the proportion of mist-like dirt formed in the light-transmitting area.

[0051] In an optional embodiment, before forming the hydrophobic layer having the first micro-nanostructure on the side of the substrate having the second micro-nanostructure, the preparation method further includes:

[0052] forming a base layer having a third micro-nano structure on a side of the substrate having the second micro-nano structure;

[0053] The third micro-nano structure covers the second micro-nano structure and is attached between the second micro-nano structure and the first micro-nano structure. The hydrophobic film layer also includes a base layer.

[0054] In this way, by providing the base layer, the adhesion of the hydrophobic layer on the first anti-reflection layer is increased.

[0055] In an optional embodiment, one side of the plate to be processed is processed to form an optical stack, specifically comprising:

[0056] forming a metal film on a plate to be processed under vacuum conditions, and subjecting the metal film to heat treatment to shrink the metal film and obtain a particle template having a plurality of particles;

[0057] performing plasma etching on the particle template to form a second micro-nano structure on the particle surface of the particle template;

[0058] The particle template is cleaned to obtain an optical stack, wherein the second micro-nano structure portion is the first anti-reflection layer, and the portion of the optical stack excluding the first anti-reflection layer is the substrate.

[0059] The provision of the metal film in this way can selectively etch the surface of the plate to be processed to form a second micro-nano structure.

[0060] In an optional embodiment, one side of the plate to be processed is processed to form an optical stack, specifically comprising:

[0061] Chemically etching the substrate to be processed to form a second micro-nano structure on one side of the substrate to be processed to obtain an optical stack;

[0062] The second micro-nano structure portion is the first anti-reflection layer, and the portion of the optical stack except the first anti-reflection layer is the substrate.

[0063] In this way, while forming the first anti-reflection layer, the processing technology and structure of the first anti-reflection layer can be made more diversified.

[0064] In an optional embodiment, after forming the hydrophobic film layer on one side of the optical stack and before combining the optical cover plate containing the optical stack with the optical device to form the optical assembly, the preparation method further includes:

[0065] A second anti-reflection layer is formed on a side of the optical stack away from the hydrophobic film layer, and the optical body layer further comprises the second anti-reflection layer.

[0066] In this way, by setting the second anti-reflection layer, the reflectivity of the optical body layer facing away from the hydrophobic film layer (the outer surface of the optical cover) can be reduced to below 0.3%, effectively preventing the generation of ghost images when electronic devices take pictures in general scenes and high-contrast scenes.

[0067] A third aspect of an embodiment of the present application further provides an electronic device, comprising a housing and any one of the above-mentioned optical components, wherein the optical device in the optical component is located in a receiving space of the housing, and the optical cover is located on the housing and covers the light incident surface of the optical device.

[0068] In this way, by protecting the optical device through the optical cover, the water drop angle in the light-transmitting area of ​​the optical cover facing the optical device can be increased, effectively reducing the proportion of mist-like dirt generated on the optical cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] FIG1 is a schematic diagram of a water drop angle of a water drop;

[0070] FIG2 is a schematic diagram of the rolling angle of a water droplet on a solid surface;

[0071] FIG3 is a schematic structural diagram of the front side of an electronic device provided in an embodiment of the present application;

[0072] FIG4 is a schematic diagram of disassembly of an electronic device according to an embodiment of the present application;

[0073] FIG5 is a schematic structural diagram of the back side of an electronic device provided in an embodiment of the present application;

[0074] FIG6 is a schematic structural diagram of an optical cover plate on the back of an electronic device provided in an embodiment of the present application;

[0075] FIG7 is a cross-sectional view of the electronic device in FIG6 taken along the AA direction;

[0076] FIG8 is a partial schematic diagram of an optical cover after coating of an electronic device in the related art;

[0077] FIG9 is a schematic structural diagram of an optical assembly provided in an embodiment of the present application;

[0078] FIG10 is a schematic diagram of a partial disassembly of the optical cover plate of the camera module in FIG9 in the light-transmitting area;

[0079] FIG11 is a partial schematic diagram of the optical cover provided in an embodiment of the present application after coating of the entire electronic device;

[0080] FIG12 is a schematic diagram of light transmission of an optical cover in the related art;

[0081] FIG13 is another structural schematic diagram of an optical cover in the related art;

[0082] FIG14 is a schematic diagram of another structure of an optical cover plate in the related art;

[0083] FIG15 is a schematic structural diagram of the optical body layer in FIG10 ;

[0084] FIG16 is a schematic diagram of a partial disassembly of an optical cover plate provided in an embodiment of the present application;

[0085] FIG17 is a schematic diagram of the layered structure of the second anti-reflection layer provided in an embodiment of the present application;

[0086] FIG18 is a schematic diagram showing structural changes of an optical cover plate during the preparation process according to an embodiment of the present application;

[0087] FIG19 is a flow chart of a method for preparing an optical cover plate provided in an embodiment of the present application;

[0088] FIG20 is a flow chart of a method for preparing a hydrophobic film layer in an optical cover plate provided in an embodiment of the present application.

[0089] Description of reference numerals:

[0090] 100 - electronic device; 1 - display screen; 2 - housing; 21 - middle frame; 211 - frame; 212 - middle plate; 22 - back cover; 221 - opening; 222 - support portion; 3 - camera module; 31 - module body; 311 - drive device; 312 - filter assembly; 313 - image sensor assembly; 32 - lens; 321 - light incident surface;

[0091] 4-optical cover plate; 41-optical body layer; 411-substrate; 4111-plate to be processed; 412-first anti-reflection layer; 4121-second micro-nanostructure; 4122-protrusion; 4123-bottom end; 4124-top end; 4125-particles; 413-second anti-reflection layer; 4131-first film layer; 4132-second film layer; 414-transparent area; 415-non-transparent area; 4151-bonding area; 4152-shielded area;

[0092] 42-hydrophobic film layer; 421-hydrophobic layer; 4211-first micro-nanostructure; 422-bottom layer; 4221-third micro-nanostructure; 43-haze-like dirt; 44-AR coating layer; 45-light trapping layer;

[0093] 5-battery; 6-motherboard;

[0094] 200-solid phase; 300-liquid phase. DETAILED DESCRIPTION

[0095] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0096] The water drop angle, also known as the water contact angle, is a type of contact angle. It is generally defined as the angle between the gas-liquid 300 interface and the solid 200-liquid 300 interface at the interface of the solid phase 200, liquid phase 300, and gas phase (not shown in Figure 1). As shown in Figure 1, angle a represents the water drop angle. Generally, the water drop angle is used to measure the mutual wettability of the solid phase 200 and liquid phase 300, as well as the hydrophilicity or hydrophobicity exhibited.

[0097] A low (e.g., less than 90°) water drop angle indicates that the surface humidity of the solid phase 200 is high (hydrophilic), exhibiting low energy and easy adhesion. A high water drop angle (e.g., greater than or equal to 90°) indicates that the surface of the solid phase 200 is hydrophobic and has poor surface adhesion. Generally, materials with a water drop angle exceeding 150° are called superhydrophobic materials. The water drop angle can also be used to measure the anti-fouling (e.g., anti-fingerprint) effect of the solid phase 200. To achieve the anti-fingerprint effect, the water drop angle is generally required to be greater than 120°.

[0098] Hexadecane contact angle: also known as the oil contact angle (or oil drop angle for short). Similar to the water drop angle, this is also a type of contact angle. Similarly, when the oil drop angle is less than 90°, it indicates that the surface of solid phase 200 is highly oleophilic. When the oil drop angle is greater than or equal to 90°, it indicates that the surface of solid phase 200 is highly oleophobic, and the oil droplet has poor adhesion to the surface of solid phase 200.

[0099] The droplet angle generally describes the behavior of a water droplet on a horizontal surface. However, in reality, flat surfaces are often inclined. Liquids (such as water droplets) on inclined surfaces can roll or stagnate. The droplet's roll angle can be used to characterize these states.

[0100] As shown in Figure 2, the rolling angle refers to the critical surface tilt angle at which a liquid (such as a water droplet) begins to roll on the surface of solid phase 200. Angle b in Figure 2 represents the rolling angle. The smaller the rolling angle, the more hydrophobic the surface of solid phase 200 is.

[0101] It can be seen that the larger the water drop angle and the smaller the rolling angle, the stronger the hydrophobicity of the material surface.

[0102] Micro-nano structure: It can be understood that the surface of the material has a surface structure with micron and / or nanometer dimensions. The micro-nano structure is a morphology of the microscopic structure on the surface of the material.

[0103] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer (i.e., a pad), a virtual reality (VR) device, a laptop computer, a personal computer (PC), an ultra-mobile personal computer (UMPC), a handheld computer, a smart wearable device, a point of sales (POS), and other electronic devices.

[0104] The structure of the electronic device in the embodiment of the present application is further explained below using a mobile phone as an example.

[0105] Figure 3 is a schematic diagram of the three-dimensional structure of the electronic device, and Figure 4 is a schematic diagram of the electronic device disassembled. Referring to Figure 3, the electronic device 100 provided in the embodiment of the present application may include a housing 2, which includes a middle frame 21 and a back cover 22. The back cover 22 is connected to one side of the middle frame 21 and, together with the middle frame 21, constitutes the housing 2 of the electronic device 100, providing a structural framework for the electronic device 100.

[0106] Referring to FIG4 in conjunction with FIG3 , in some embodiments, the middle frame 21 includes a middle plate 212 and a frame 211 that are connected to each other. The frame 211 is disposed around the peripheral edge of the middle plate 212 and, together with the middle plate 212, forms the middle frame 21. The frame 211 is a square ring structure formed by connecting multiple side frames 211 end to end.

[0107] Referring to Figure 4, in some embodiments, when the electronic device 100 has a display function, the electronic device 100 also includes a display screen 1, which is installed on the side of the frame 211 opposite to the back cover 22. The back cover 22 is provided on one side of the middle frame 21, and together with the middle frame 21 and the back cover 22, it encloses a storage space for the electronic device 100 (not shown in the figure).

[0108] The housing space may contain components such as the motherboard 6, battery 5, microphone, speaker, and receiver of the electronic device 100. As shown in FIG4 , the motherboard 6 and the battery 5 may be disposed together on the side of the middle plate 212 facing the rear cover 22 to facilitate electrical connection between the motherboard 6 and the battery 5. The motherboard 6 may be understood as a printed circuit board 6 carrying electronic components. The electronic components in the motherboard may include, but are not limited to, a system on a chip (SoC), an antenna module, a Bluetooth module, a wireless communication module (such as a WiFi module), a positioning module, a radio frequency (RF) chip, a radio frequency power amplifier (RFPA), a storage module (such as a double data rate (DDR) memory), a power management module, a charging module, and a screen display and operation module.

[0109] 4 , the side where the display screen 1 is located constitutes the front side of the electronic device 100, and the side where the back cover 22 is located constitutes the back side of the electronic device 100. The display screen 1 is electrically connected to the mainboard 6 so that the display screen 1 can realize display or operation functions.

[0110] As shown in reference figure 4, in some embodiments, the electronic device 100 also includes a camera module 3, which can be set in the receiving space and electrically connected to the main board 6, so that when the user inputs a shooting command, the camera module 3 can be controlled by the main board 6 to capture images.

[0111] Figure 4 shows that the electronic device 100 is equipped with a camera module 3. It should be noted that in actual applications, the number of camera modules 3 is not limited to one, and the number of camera modules 3 can also be two or more. To enhance the shooting performance of the electronic device 100, the electronic device 100 is typically equipped with multiple (for example, three, four, or five) camera modules 3. Among them, some camera modules 3 can be arranged on the side of the middle frame 21 facing the display screen 1 to form a front camera module.

[0112] As shown in Figure 3, the front camera module (not shown) is schematically arranged in the area near the edge of the middle frame 21 toward the top of the electronic device 100. It is understandable that the position of the camera module 3 is not limited to the position shown in Figure 3, and can also be located in other parts of the electronic device 100.

[0113] 4 , a certain number of camera modules 3 may also be provided on the side of the middle frame 21 facing the rear cover 22 to form a rear camera module (not shown). The structure of the electronic device 100 will be further described below using the rear camera module as an example.

[0114] Continuing with reference to Figure 4, the rear camera module can be set on the middle frame 21 in an area near the edge of the top of the electronic device 100. When there are multiple rear camera modules, the rear camera modules can be arranged arbitrarily in the XY plane of the electronic device 100. For example, multiple rear camera modules can be arranged along the X direction, or multiple rear camera modules can be arranged along the Y direction. Among them, the XY plane can be understood as a plane formed by the X direction and the Y direction, which is parallel to the display surface of the display screen 1 (not shown in the figure).

[0115] The rear camera module may include, but is not limited to, an auto focus (AF) module, a fixed focus (FF) module, a wide-angle camera module, a telephoto camera module, a color camera module, or a black and white camera module. For example, the telephoto camera module may include, but is not limited to, a periscope telephoto camera module (periscope camera module for short). The electronic device 100 may include any of the above-mentioned camera modules 3, or may include two or more of the above-mentioned camera modules 3.

[0116] FIG5 is a schematic structural diagram of the back side of the electronic device, FIG6 is a schematic structural diagram of the optical cover plate on the back side of the electronic device, and FIG7 is a cross-sectional view of the electronic device in FIG6 along the AA direction.

[0117] To facilitate the entry of light from outside the electronic device 100 into the camera modules 3, as shown in Figures 5 to 7 , the electronic device 100 further includes an optical cover 4a. An opening 221 is provided at a position where the rear cover 22 is located relative to the camera modules 3, and the optical cover 4a is adapted to the structure of the optical cover 4a. The optical cover 4a is provided at the opening 221 and covers the plurality of camera modules 3 to shield and protect the camera modules 3. In this case, the optical cover 4 may also be referred to as a lens cover.

[0118] As shown in Figure 7, the camera module 3 may include a module body 31 and a lens 32, the module body 31 includes a driving device 311, a portion of the lens 32 is installed in the driving device 311, and the other portion is exposed to the outside of the driving device 311. The lens 32 is generally composed of one or more stacked lenses (such as lenses). The driving device 311 is used to drive the lens 32 to move. For example, the driving device 311 can also drive the lens 32 to move along the optical axis toward the back cover 22 or away from the back cover 22 to achieve the zoom or focus function of the camera module 3. Among them, the periscope camera module can provide 5x, 10x or other multiples of optical zoom).

[0119] Alternatively, in some embodiments, the driving device 311 can also drive the lens 32 to move (such as translate or rotate) within its own plane to compensate for the amount of hand shake when the user is shooting, so as to realize the anti-shake function of the camera module 3.

[0120] In some embodiments, as shown in Figures 6 and 7, the optical cover 4a can cover the light incident surface 321 of the lens 32. A light-transmitting area 414a is provided on the optical cover 4a and at the position of the covered camera module 3, so that light outside the electronic device 100 can pass through the light-transmitting area 414a and enter the lens 32, thereby realizing the shooting function of the camera module 3. Among them, the light-transmitting area 414a can also be called a camera hole area. The shape of the light-transmitting area 414a is adapted to the shape of the lens 32. Generally, in order to increase the amount of light entering the lens 32, the shape of the light-transmitting area 414a can be larger than the shape of the lens 32.

[0121] As shown in Figures 6 and 7, the optical cover plate 4a may further include a non-light-transmitting area 415a, which is disposed around the peripheral edge of the light-transmitting area 414a. The non-light-transmitting area 415a includes a shielding area 4152a and a bonding area 4151a, which is disposed around the peripheral edge of the light-transmitting area 414a. The shielding area 4152a is disposed around the side of the bonding area 4151a away from the light-transmitting area 414a. The driving device 311 may be bonded to the bonding area 4151a (not shown) on the inner surface of the optical cover plate 4a using a buffering adhesive such as foam adhesive to secure the camera module 3 to the optical cover plate 4a and the rear cover 22. When the optical cover plate 4a covers multiple camera modules 3 simultaneously, the bonding areas 4151a corresponding to the multiple camera modules 3 can be connected to each other through the bonding area 4151a to form the non-light-transmitting area 415a.

[0122] The inner surface of the optical cover plate 4a can be understood as the side of the optical cover plate 4a facing the camera module 3 , and the outer surface of the optical cover plate 4a can be understood as the side of the optical cover plate 4a facing away from the camera module 3 .

[0123] Continuing with reference to FIG7 , the module body 31 further includes a filter assembly 312 and an image sensor assembly 313. The filter assembly 312 and the image sensor assembly 313 are sequentially arranged on the light-emitting side of the lens 32. The filter assembly 312 may include a filter, and the image sensor assembly 313 may include an image sensor electrically connected to the mainboard. In this way, light from the outside of the electronic device 100 enters the lens 32 through the light-transmitting area 414a, and after being emitted through the lens 32, it can sequentially pass through the filter assembly 312 and the image sensor assembly 313, and after being processed by the image sensor, form an image, thereby realizing the shooting function of the camera module 3.

[0124] Continuing with Figure 7 , the optical cover plate 4a includes a substrate 411a. The substrate 411a is the only light-transmitting optical element in the optical cover plate 4a and is typically made of glass. Glass can include, but is not limited to, ordinary glass, tempered glass, and the like. Ordinary glass can be understood as unmodified glass with a smooth surface. Tempered glass is chemically strengthened glass obtained by subjecting ordinary glass to chemical strengthening treatments such as ion exchange. Both the light-transmitting region 414a and the non-light-transmitting region 415a are located on the substrate's optical body layer.

[0125] Since the surface (such as the inner surface) of the existing optical cover plate 4a is generally a smooth planar structure, when a liquid such as water drops onto the inner surface of the optical cover plate 4a, it will be pressed on the optical cover plate 4a under the action of its own weight, causing the water drop to be flattened and thus adhere to the optical cover plate 4a.

[0126] After assembly, the various components of an electronic device 100, such as a mobile phone, are typically coated to enhance the waterproof performance of the electronic device 100. Figure 8 illustrates a schematic diagram of the structure of one of the light-transmitting areas 414a of the optical cover plate 4a after coating the entire electronic device 100, as described in related art. Referring to Figure 8 , after coating the entire device, the applicant discovered that haze-like dirt 43 was present on the light-transmitting area 414a on the inner surface of the optical cover plate 4a, corresponding to the camera module 3.

[0127] The presence of the haze-like dirt 43 will affect the cleanliness of the optical cover plate 4 a and the transmission of light within the optical cover plate 4 a and the camera module 3 .

[0128] Research has found that the cause of the haze-like dirt 43 is that, to facilitate the movement of the lens 32 relative to the optical cover plate 4a along the optical axis under the drive device 311, the lens 32 is fixed to the optical cover plate 4, leaving a gap between the lens 32 and the optical cover plate 4a. During the coating process of the electronic device 100, air is removed from the electronic device 100, as well as the air between the lens 32 and the optical cover plate 4a. During the degassing process after the coating is completed, the original molecules of the coating layer, water vapor, and some small molecules of the foam adhesive adhere to and condense on the inner surface of the optical cover plate 4a along with water droplets in the air flow during the vacuum break. After the water droplets evaporate, the original molecules of the coating layer and some small molecules of the foam adhesive remain on the inner surface of the optical cover plate 4a, resulting in the haze-like dirt 43 on the inner surface of the optical cover plate 4a in the light-transmitting area 414a corresponding to the camera module 3.

[0129] Since the periscope camera module needs to move a larger distance, the distance between the lens 32 of the periscope camera module and the optical cover 4a is larger than that of other rear camera modules. Therefore, after the entire machine is coated, the mist-like dirt 43 at the relative position of the optical cover 4a and the periscope camera module is more serious.

[0130] In view of this, an embodiment of the present application provides an optical component so that the original optical cover 4a in the electronic device 100 can be replaced by the optical cover in the optical component to cover the light incident surface of the optical device, which can effectively avoid the proportion of haze-like dirt on the optical cover after the entire electronic device 100 is coated.

[0131] FIG9 is a schematic structural diagram of an optical cover plate according to an embodiment of the present application, and FIG10 is a schematic diagram of a partial disassembly of the optical cover plate in the light-transmitting area of ​​the camera module in FIG9 , so as to facilitate observation of the layered structure in the optical cover plate 4 .

[0132] 9 and 10 , the optical assembly includes an optical cover plate and an optical device. The optical cover plate 4 includes an optical body layer 41 . The optical body layer 41 blocks a light incident surface 321 of the optical device (not shown in the figures).

[0133] Continuing with reference to Figures 9 and 10, the optical body layer 41 has a light-transmitting area 414 disposed opposite the optical device. The optical cover plate 4 also includes a hydrophobic film layer 42, which is light-transmitting and is located on the side of the optical body layer 41 facing the optical device, covering the light-transmitting area 414. The side of the hydrophobic film layer 42 facing the optical device is a hydrophobic rough surface (not shown in the figures) having a first micro-nanostructure 4211. The side of the hydrophobic film layer 42 facing the optical device is the inner surface of the hydrophobic film layer 42. The side of the hydrophobic film layer 42 facing away from the optical device can be understood as the outer surface of the hydrophobic film layer 42. The locations of the inner and outer surfaces of the optical cover plate 4 and its internal layers can be referred to in the description of the hydrophobic film layer 42. Since the optical body layer 41 is part of the optical cover plate 4, the light-transmitting area 414 of the optical body layer 41 can also be understood as the light-transmitting area 414 of the optical cover plate 4.

[0134] Due to the presence of the hydrophobic rough surface, the inner surface of the hydrophobic film layer 42 has hydrophobic properties, which will result in low mutual wettability between the hydrophobic rough surface and the liquid phase 300, and poor adhesion of the liquid (such as water droplets) on the hydrophobic rough surface. This is to prevent the original molecules of the coating film layer and some small molecules of the foam glue from adhering to and condensing on the hydrophobic rough surface with the liquid (such as oil droplets or water droplets in the air flow) after the electronic device 100 is completely coated, thereby reducing the proportion of haze-like dirt 43 appearing in the light-transmitting area 414 of the optical cover plate 4 facing the optical device (the inner surface of the optical cover plate).

[0135] Due to the presence of the first micro-nanostructure 4211, the hydrophobic rough surface exhibits a rough morphology with a surface structure of micron-scale and / or nano-scale dimensions, and forms an undulating micro-nanostructure on the hydrophobic rough surface. Due to the low surface energy on the hydrophobic rough surface and the large surface tension between air and liquid, when the original molecules of the coating film layer and some small molecules of the foam adhesive adhere to the liquid (such as oil droplets or water droplets in the air flow) and fall on the first micro-nanostructure 4211 with the liquid, the liquid condenses into droplets and stands on the first micro-nanostructure 4211, resulting in the droplets (such as water droplets) having a large water drop angle on the hydrophobic rough surface.

[0136] When the hydrophobic and oleophobic properties of the hydrophobic rough surface are combined with the first micro-nanostructure 4211, liquids such as water droplets and oil droplets can have an extremely small rolling angle on the hydrophobic rough surface, making it easier for the liquid condensed on the hydrophobic rough surface to slide out of the light-transmitting area 414, thereby further reducing the proportion of mist-like dirt 43 on the light-transmitting area 414 corresponding to the camera module 3 (such as a periscope camera module 3) on the inner surface of the optical cover 4, so that the side of the optical cover 4 facing the optical device has anti-fouling properties, ensuring the cleanliness of the optical cover 4 while facilitating the transmission of light in the light-transmitting area 414 and the optical device, ensuring that the use of the optical device is not affected.

[0137] In some embodiments, the optical device may be a camera module 3, which includes a lens 32. The optical body layer 41 blocks the light incident surface 321 of the lens 32. The light-transmitting area 414 is positioned opposite the lens 32. This allows the optical cover 4 to block the light incident surface 321 of the lens 32 to protect the lens 32 while also reducing the proportion of haze-like dirt 43 on the inner surface of the optical cover 4 in the light-transmitting area 414.

[0138] Taking the camera module 3 as an example, referring to FIG10 and in combination with FIG7 , the optical body layer 41 can be located at the opening 221 of the rear cover 22 and fixed to the rear cover 22 by bonding or other means to achieve the fixation of the optical body layer 41 to the rear cover 22. For example, as shown in FIG7 , the rear cover 22 can be provided with a support portion 222 on the wall of the opening 221, and the optical body layer 41 can be supported on the support portion 222 and fixed to the support portion 222 by bonding or other means (as shown in FIG7 ). Exemplarily, the support portion 222 can include, but is not limited to, a support step.

[0139] The optical body layer 41 may cover one camera module 3, or the optical body layer 41 may also cover two or more camera modules 3 at the same time. In this application, the structure of the camera module 3 covered by the optical body layer 41 is not further limited.

[0140] The optical body layer 41 is provided with light-transmitting areas 414 at the lens 32 of the camera module 3 it covers. This allows light from the electronic device 100 to pass through different light-transmitting areas 414 and enter the corresponding lens 32 of the camera module 3, thereby realizing the camera function of the camera module 3. It should be noted that the shape and size of the light-transmitting areas 414 can be referred to the relevant description of the optical cover 4 in the related art and will not be further described here.

[0141] Alternatively, in some embodiments, when the electronic device 100 is a smart wearable device, the optical cover plate 4 of the present application can also serve as a cover plate for a bio-tracking optical sensor (PPG) in the smart wearable device, covering the light incident surface of the bio-tracking optical sensor. The configuration of the optical cover plate 4 in a smart wearable device can be found in the description of PPG cover plates in the related art and is not further limited here.

[0142] The structure of the optical cover plate 4 will be further described below by taking the camera module 3 as an example.

[0143] The optical cover plate 4 of the present application can have a water drop angle greater than 150° and an oil drop angle greater than 95° at the hydrophobic film layer 42, so that the inner surface of the optical cover plate 4 has good hydrophobic and oleophobic properties in the light-transmitting area 414. The rolling angle of the inner surface of the optical cover plate 4 of the present application at the hydrophobic film layer 42 can be less than 40°, so that droplets condensed on the first micro-nanostructure 4211 can slide out of the light-transmitting area 414.

[0144] Figure 11 illustrates a partial schematic diagram of the optical cover plate 4 of the present application after coating the entire electronic device 100. As can be seen from Figure 11, due to the provision of the hydrophobic film layer 42, after the entire electronic device 100 is coated, the light-transmitting area 414 on the inner surface of the optical cover plate 4 is almost free of haze-like dirt 43. This shows that the present application can effectively reduce the proportion of haze-like dirt 43 appearing in the light-transmitting area 414 on the inner surface of the optical cover plate 4 corresponding to the camera module 3, and can even prevent the appearance of haze-like dirt 43 on the light-transmitting area 414 on the inner surface of the optical cover plate 4.

[0145] 10 and in combination with FIG9 , the camera module 3 further includes a module body 31 , and a lens 32 is located on the side of the module body 31 facing the optical cover 4 so that light outside the electronic device 100 can pass through the light-transmitting area 414 and enter the corresponding lens 32 .

[0146] As shown in FIG9 , the optical body layer 41 has a non-transparent region 415, which is arranged around the peripheral edge of the translucent region 414. The non-translucent region 415 blocks the module body 31 so that when the camera module 3 is combined with the optical cover plate 4, while ensuring the amount of light entering the translucent region 414, the area of ​​the translucent region 414 can be reduced, so that a larger number of camera modules 3 can be blocked by the optical cover plate 4.

[0147] In some embodiments, the module body 31 can also be attached to the non-light-transmitting area. For example, the module body 31 can be fixed to the non-light-transmitting area 415 by a buffer glue such as foam glue. The area on the non-light-transmitting area 415 of the present application where the module body 31 is attached is the attachment area 4151. Among them, the non-light-transmitting area 415 also includes a shielding area 4152, and the shielding area 4152 is surrounded on the side of the attachment area 4151 away from the light-transmitting area 414. The non-light-transmitting area 415 of the optical body layer 41 can also be understood as the non-light-transmitting area 415 of the optical cover 4. Among them, when the optical body layer 41 covers multiple camera modules 3 at the same time, the formation of the non-light-transmitting area 415 can refer to the relevant description of the optical cover 4 in the relevant technology, and will not be further elaborated here.

[0148] It should be noted that the optical body layer 41 can be shielded by a light-shielding material around the edges of the bonding areas 4151 corresponding to the covered lenses 32, forming shielded areas 4152. Continuing with FIG10 , the hydrophobic film layer 42 includes a hydrophobic layer 421, which is located on the side of the optical body layer 41 facing the optical device (e.g., the camera module 3) and covers the light-transmitting area 414. The side of the hydrophobic layer 421 facing the optical device is a hydrophobic rough surface. In this way, the hydrophobic layer 421 can be used to form a hydrophobic rough surface, and the hydrophobic film layer 42 can have certain hydrophobic and oleophobic properties on the hydrophobic rough surface, so as to prevent the original molecules of the coating film layer and some small molecules of the foam glue from adhering to and condensing on the hydrophobic rough surface with the liquid (such as oil droplets or water droplets in the air flow). This not only reduces the proportion of mist-like dirt 43 appearing in the light-transmitting area 414 corresponding to the camera module 3 on the inner surface of the optical cover 4, but also ensures the anti-fouling performance of the hydrophobic film layer 42 on the hydrophobic rough surface.

[0149] Among them, the hydrophobic layer 421 can be a perfluoropolyether coating. Alternatively, in some embodiments, the hydrophobic layer 421 can also be made of other transparent materials with hydrophobic and oleophobic properties. In the present application, the hydrophobic layer 421 adopts a perfluoropolyether coating. Perfluoropolyether is a kind of lubricant that is smooth and transparent. Since perfluoropolyether has good hydrophobic and oleophobic properties, a perfluoropolyether coating is formed by perfluoropolyether to serve as the hydrophobic layer 421. While satisfying the requirement that the hydrophobic rough surface of the hydrophobic layer 421 has good hydrophobic and oleophobic properties, the hydrophobic layer 421 has a good anti-fouling effect, and at the same time, it will not affect the light transmission efficiency in the light-transmitting area 414.

[0150] Based on the contrast of the shooting environment, the shooting environment of the camera module 3 in the electronic device 100 is generally divided into a general shooting environment and a high-contrast environment. Among them, the general shooting environment can include shooting objects in normal light during the day, shooting objects in a well-lit room, or other shooting environments with low contrast. The high-contrast environment can include shooting in backlit or high-contrast environments such as shooting at sunrise in the morning, shooting at the sun in the evening, and shooting at street lights at night.

[0151] Figure 12 illustrates a schematic diagram of light transmission through the optical cover plate 4a in Figure 8. Taking a mobile phone as an example, when the electronic device 100 in the related art uses the optical cover plate 4a shown in Figure 8, since the optical cover plate 4a only includes a substrate 411a, which is made of ordinary glass, as shown in Figure 12, when light enters the optical cover plate 4a, it has a high (e.g., 4.2%) reflection rate on both the inner and outer surfaces of the optical cover plate 4a. The transmittance of light through the optical cover plate 4a is generally 90%, resulting in obvious ghosting when the camera module 3 in the electronic device 100 takes photos under normal shooting conditions and in the photos taken.

[0152] The reason for this is mainly because the optical cover 4a (especially the inner surface of the optical cover 4a) has a high reflectivity. The optical cover 4a is covered on the lens 32, and will form a group of lenses with the multiple lenses in the lens 32. There will be reflection between two adjacent lenses. When the light passes through the optical cover 4a and the lens 32, it will produce multiple levels of reflection at the interface between the glass and the air. Some of the reflected light reaches the image sensor and is received by the image sensor, causing the camera module 3 to separate the object being photographed from its image during the shooting process, resulting in more obvious ghost images when taking pictures in general shooting environments and in the photos taken.

[0153] In order to reduce the severity of ghosting, FIG13 illustrates a schematic structural diagram of another optical cover 4b proposed in the related art. Referring to FIG13 , the optical cover 4b includes a substrate 411a and an AR (Anti-Reflection) coating layer. The AR coating layer 44 is located on two opposite sides of the substrate 411a and forms an AR-coated glass together with the substrate 411a. AR-coated glass can also be called enhanced transmittance glass or anti-reflection glass. Due to the presence of the AR coating layer 44, the AR-coated glass has a lower reflectivity than that of the optical cover 4a alone. The reflectivity of the inner and outer surfaces of the optical cover 4b can be reduced from 4.2% to 0.5%.

[0154] Due to the significantly reduced reflectivity of the inner and outer surfaces of the optical cover plate 4b, the electronic device 100 equipped with this optical cover plate 4b exhibits virtually no ghosting when photographing in typical scenes. However, the inner and outer surfaces of the optical cover plate 4b still have a reflectivity of 0.5%, so noticeable ghosting may still occur when photographing the electronic device 100 in high-contrast environments.

[0155] Since the inner surface of the optical cover plate 4 b is coated with an AR coating layer 44 , the inner surface of the optical cover plate 4 b has strong hydrophilicity and lipophilicity, and water vapor and small organic molecules are easily attached to it, generating mist-like dirt 43 .

[0156] Figure 14 illustrates another structural schematic diagram of an optical cover plate 4c in the related art. Referring to Figure 14 , the optical cover plate 4c includes a substrate 411a, an AR coating layer 44, and a light trapping layer 45. The AR coating layer 44 and the light trapping layer 45 are disposed on opposite sides of the substrate 411a. The side where the AR coating layer 44 is located forms the outer surface of the optical cover plate 4c, while the side where the light trapping layer 45 is located forms the inner surface of the optical cover plate 4c.

[0157] The light trapping layer 45 includes a plurality of protrusions 4122a, the bottoms of which are connected to the substrate 411a, and the tops of which are located at the end of the substrate 411a facing away from the AR coating layer 44. The plurality of protrusions 4122a are arranged continuously on the substrate 411a to form the light trapping layer 45. The surface of the light trapping layer 45 exhibits a surface topography of a plurality of convex points (not shown) and concave points (not shown) alternatingly arranged continuously, thereby creating a light trapping effect and altering the reflectivity of the surface of the light trapping layer 45 to light. The convex points are the vertices of the protrusions 4122, and the concave points are located between adjacent protrusions 4122.

[0158] Due to the different refractive indices between air and the material (such as glass) of the film layer forming the light trap layer 45, as well as the surface morphology in which multiple protrusions and concave points are arranged alternately and continuously, the proportion of the material of the film layer in the light trap layer 45 gradually decreases from the bottom of the protrusion 4122a to the top of the protrusion 4122a, so that the light trap layer 45 forms a gradient film layer with a gradually changing refractive index. In the direction from the substrate 411a to the side away from the AR coating layer 44, the refractive index of the light trap layer 45 to light gradually changes from the refractive index corresponding to the film layer to the refractive index corresponding to air.

[0159] By providing the light trap layer 45, the reflectivity of the inner surface of the optical cover plate 4c can be further reduced from 0.5% to below 0.03%, and the intensity of ghosting when shooting in high-contrast environments can be reduced by half compared to AR-coated glass. However, the presence of the light trap layer 45 makes the inner surface of the optical cover plate 4c rougher than AR-coated glass. Due to the higher surface energy at the bumps of the optical cover plate 4c, when liquid falls on the inner surface of the optical cover plate 4c, it is easy to condense on the bumps to form droplets. Due to the hydrophilic surface of the light trap layer 45, the droplets condensed on the bumps will be pulled apart by the siphon effect, adhering to the bumps and pits. This easily causes the original molecules of the coating layer and some small molecules of the foam glue to adhere and condense on the inner surface of the optical cover plate 4c, forming a haze-like dirt 43 in the light-transmitting area 414.

[0160] Figure 15 illustrates a schematic structural diagram of the optical body layer 41 in Figure 10 . Referring to Figure 15 and in conjunction with Figure 10 , the optical body layer 41 includes a substrate 411 and a first anti-reflection layer 412. The substrate 411 may be a glass substrate, such as ordinary glass or tempered glass. The first anti-reflection layer 412 covers the side of the substrate 411 facing the hydrophobic film layer 42. The side of the first anti-reflection layer 412 facing the hydrophobic film layer 42 is a rough surface having a second micro-nanostructure 4121. The side of the first anti-reflection layer 412 facing the hydrophobic film layer 42 forms the inner surface of the optical body layer 41; in other words, the inner surface of the optical body layer 41 is a rough surface having the second micro-nanostructure 4121. The first micro-nanostructure 4211 is bonded to and covers the second micro-nanostructure 4121.

[0161] In this way, the hydrophobic film layer 42 is located on the rough surface of the first anti-reflection layer 412, so that the reflectivity of the inner surface of the optical cover 4 is reduced by the first anti-reflection layer 412, thereby achieving an optical trap effect on the internal lens of the covered lens 32 and the reflection of the outer surface of the lens 32, thereby weakening the intensity of ghost images in photos taken in general scenes and high-contrast environments, and improving the shooting effect of the camera module 3.

[0162] Moreover, due to the presence of the second micro-nano structure 4121, the hydrophobic rough surface presents a rough morphology with a surface structure of micron and / or nanometer size, so that the hydrophobic film layer 42 can cover the rough surface of the first anti-reflection layer 412, so that the hydrophobic film layer 42 can be combined with the second micro-nano structure 4121 to form a first micro-nano structure 4211 on the surface of the hydrophobic layer 421, thereby increasing the drop angle of the liquid (such as water droplets) on the hydrophobic rough surface through the second micro-nano structure 4121, while making the droplets have an extremely small rolling angle on the hydrophobic rough surface, making it easier for the droplets condensed on the first micro-nano structure 4211 to slide out of the light-transmitting area 414, thereby reducing the proportion of mist-like dirt 43 formed in the light-transmitting area 414.

[0163] The shape of the first micro-nanostructure 4211 matches the shape of the second micro-nanostructure 4121, so that the surface of the hydrophobic layer 421 can form the first micro-nanostructure 4211 that is compatible with the second micro-nanostructure 4121. While not affecting the anti-reflection effect of the first anti-reflection layer 412, the hydrophobic rough surface of the hydrophobic film layer 42 can also have the anti-reflection effect of the first anti-reflection layer 412. Because the hydrophobic rough surface is located in the light-transmitting area 414 of the inner surface of the optical cover plate 4, the shape of the first micro-nanostructure 4211 and the second micro-nanostructure 4121 cooperate to increase the water drop angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414 while also ensuring that the inner surface of the optical cover plate 4 also has the anti-reflection effect of the first anti-reflection layer 412 in the light-transmitting area 414.

[0164] In some embodiments, the refractive index of the first anti-reflection layer 412 is configured to gradually change from the refractive index corresponding to the first anti-reflection layer to the refractive index corresponding to air along the direction from the substrate 411 to the hydrophobic film layer 42, so that the first anti-reflection layer 412 is a gradient film layer with a continuously changing refractive index along the direction from the substrate 411 to the hydrophobic film layer 42. In this way, while the first anti-reflection layer 412 reduces the reflectivity of light on the inner surface of the optical cover 4 in the light-transmitting area 414, it can also form an optical trap effect to absorb light reflected from the lens 32 to the first anti-reflection layer 412 (optical trap effect), thereby reducing the intensity of ghost images in photos taken in general scenes and high-contrast environments.

[0165] Continuing with reference to FIG. 15 , in some embodiments, the second micro-nanostructure 4121 may include a plurality of protrusions 4122 . The bottom end 4123 of the protrusion 4122 is connected to the substrate 411 , and the top end 4124 of the protrusion 4122 is disposed toward the hydrophobic film layer 42 , with the protrusion 4122 gradually tapering from the bottom end 4123 to the top end 4124 . The protrusion 4122 may be a pyramid, a steamed bun, or other shapes that meet the above requirements. For example, the pyramid may include, but is not limited to, a triangular pyramid, a quadrangular pyramid, or a pyramid formed by other numbers of polygons. The triangular pyramid may be considered a pyramid. The shape of the protrusion 4122 is not further limited herein.

[0166] The present application defines the shape of the plurality of protrusions 4122 and can form a concave point (not shown in the figure) between two adjacent protrusions 4122, so as to form a surface morphology in which a plurality of protrusions (not shown in the figure) and concave points are alternately stacked on the inner surface of the optical body layer 41, which not only makes the proportion of the base material of the first anti-reflection layer 412 gradually decrease in the direction from the substrate 411 to the hydrophobic film layer 42, but also gradually increases the proportion of the air (the air at the concave point) in the first anti-reflection layer 412, thereby making the first anti-reflection layer 412 have a smooth surface. The refractive index of the light gradually changes from the refractive index corresponding to the first anti-reflection layer to the refractive index corresponding to the air, reducing the reflectivity of the inner surface of the optical body layer 41 and the inner surface of the optical cover 4 to the light in the light-transmitting area 414, thereby reducing the multi-level reflection of the light in the optical cover 4 and the lens 32, weakening the intensity of ghost images in photos taken in a strong contrast environment, and forming a light trap effect on the side of the first anti-reflection layer 412 facing the hydrophobic film layer 42 to absorb the light reflected from the lens 32 to the first anti-reflection layer 412, thereby further weakening the intensity of ghost images in photos taken in a strong contrast environment.

[0167] Furthermore, a second micro-nano structure 4121 can be formed by the plurality of protrusions 4122 , so as to increase the water drop angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414 and reduce the rolling angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414 through the second micro-nano structure.

[0168] Continuing to refer to FIG. 15 , the bottom ends 4123 of the plurality of protrusions 4122 are interconnected, which can increase the density of the protrusions 4122 on the surface of the first anti-reflection layer 412 and form a surface morphology in which a plurality of protrusions and concave points are alternately and continuously arranged on the inner surface of the optical body layer 41. When forming the first anti-reflection layer 412 with a continuously changing refractive index, the light trapping effect is enhanced, and the intensity of ghost images in photos taken in a strong contrast environment is further weakened.

[0169] Continuing to refer to FIG. 15 , in some embodiments, the first anti-reflection layer 412 may be a light trap layer.

[0170] Taking the protrusions 4122 as an example, the protrusions 4122 on the surface of the light trap layer can be formed by coating a metal film on the plate to be processed 4111 and then etching after the metal film shrinks. The plate to be processed 4111 can be understood as an untreated (etched or corroded) glass plate. This reduces the reflectivity of the inner surface of the optical body layer 41 and the inner surface of the optical cover 4 in the light-transmitting area 414, weakening the intensity of ghost images in photos taken in general scenes and high-contrast environments, while also making the structure of the first anti-reflection layer 412 more diverse.

[0171] When the first anti-reflection layer 412 is a light trap layer, it is the same as the light trap layer 45 in the related art. The first anti-reflection layer 412 can reduce the reflectivity of the inner surface of the optical cover 4 to below 0.03%, and can also achieve an optical trapping effect on the internal lens of the covered lens 32 and the outer surface of the lens 32, thereby achieving basically ghost-free shooting in general scenes and weakening the intensity of ghosts in photos taken in a strong contrast environment.

[0172] In some embodiments, the second micro-nanostructure 4121 may further include a plurality of depressions, wherein the depressions are micrometer-scale and / or nanometer-scale depressions, and the plurality of depressions are evenly distributed on the optical body layer 41 to form the first anti-reflection layer 412. For example, the depressions may include, but are not limited to, holes or grooves on the surface of the first anti-reflection layer 412. Accordingly, the first micro-nanostructure 4211 is also a hole or groove that matches the shape of the second micro-nanostructure 4121.

[0173] Due to the presence of multiple depressions, the microscopic morphology of the surface of the first anti-reflection layer 412 can also be changed, and a light trap layer can be formed, thereby reducing the reflectivity of the inner surface of the optical cover plate 4 to below 0.03%. While weakening the intensity of ghost images taken in a strong contrast environment, the connecting area between two adjacent depressions can form a relatively protruding bump, so that the water droplet angle and oil droplet angle of the inner surface of the optical cover plate 4 at the light-transmitting area 414 can be increased through the first micro-nano structure 4211, and the rolling angle of the inner surface of the large optical cover plate 4 at the light-transmitting area 414 is reduced.

[0174] In some embodiments, the first anti-reflection layer 412 may also be a porous coating, making the structure of the first anti-reflection layer 412 more diverse. When the first anti-reflection layer 412 is a porous coating, the second micro-nanostructure 4121 may also include multiple micron-scale and / or nano-scale depressions.

[0175] The structure of the optical cover plate 4 of the present application will be further described below by taking the protrusion 4122 as an example.

[0176] In some embodiments, the protrusions 4122 are micrometer-scale and / or nanometer-scale protrusions, so as to form the first anti-reflection layer 412 with a microscopic morphology and reduce the thickness of the optical cover plate 4 .

[0177] Continuing with reference to FIG. 15 , the height H of the protrusion 4122 can be greater than or equal to 50 nm and less than or equal to 200 nm, and the size of the bottom end 4123 can be greater than or equal to 150 nm and less than or equal to 500 nm. Furthermore, the height H of the protrusion 4122 can also be greater than or equal to 50 nm and less than or equal to 120 nm, and the size of the bottom end 4123 can also be greater than or equal to 170 nm and less than or equal to 500 nm. For example, the height H of the protrusion 4122 can be 50 nm, 120 nm, or 200 nm, and the size of the bottom end 4123 can be 170 nm, 220 nm, or 500 nm. While not affecting the transmittance of light through the optical cover plate 4 and reducing the reflectivity of the inner surface of the optical cover plate 4, the protrusion 4122 can cooperate with the first micro-nanostructure 4211 to increase the water drop angle and oil drop angle of the inner surface of the optical cover plate 4 at the light-transmitting region 414 and reduce the roll angle of the inner surface of the optical cover plate 4 at the light-transmitting region 414.

[0178] The size of base 4123 can be understood as the maximum dimension or distal dimension of base 4123 of protrusion 4122 along the aforementioned XY plane. Depending on the shape of protrusion 4122, the size of base 4123 will also vary. For example, if protrusion 4122 is a triangular pyramid, the size of base 4123 can be understood as the maximum side length of base 4123 of the triangular pyramid. If protrusion 4122 is a quadrangular pyramid, the size of base 4123 can be understood as the diagonal of base 4123 of the quadrangular pyramid. If protrusion 4122 is in the shape of a steamed bun and the projection of the base of protrusion 4122 in the XY plane is a circle, the size of base 4123 can be understood as the diameter of the circle. If protrusion 4122 is in the shape of a steamed bun and the projection of the base of protrusion 4122 in the XY plane is an ellipse, the size of base 4123 can be understood as the diameter of the major axis of the ellipse.

[0179] As shown in FIG10 , the thickness D1 of the hydrophobic layer 421 can be greater than or equal to 5 nm and less than or equal to 30 nm. In some embodiments, the thickness D1 of the hydrophobic layer 421 can also be greater than or equal to 10 nm and less than or equal to 30 nm. By limiting the thickness D1 of the hydrophobic layer in this way, without affecting the formation of the hydrophobic layer 421 and the hydrophobic performance, it is possible not only to reduce the effect of the thickness of the hydrophobic layer 421 on the height of the first micro-nanostructure 4211, thereby ensuring that the provision of the first micro-nanostructure 4211 can increase the water drop angle and oil drop angle of the inner surface of the optical cover plate 4, but also to facilitate light transmission through the optical cover plate 4.

[0180] The multiple protrusions 4122 are arranged in an array to form the second micro-nanostructure 4121. This arrangement of the multiple protrusions 4122 on the inner surface of the optical layer 41 is regular, facilitating the release of film stress and reducing stress deformation in the optical layer 41. Alternatively, the multiple protrusions 4122 can be arranged irregularly on the inner surface of the optical layer 41. This application does not further limit the arrangement of the protrusions 4122.

[0181] FIG16 illustrates a partially disassembled schematic diagram of the optical cover plate 4 provided in an embodiment of the present application, to facilitate observation of the layered structure within the optical cover plate 4. To enhance the adhesion of the hydrophobic layer 421 to the surface of the first anti-reflection layer 412, in some embodiments, as shown in FIG16 , the hydrophobic film layer 42 may further include a primer layer 422. The primer layer 422 is attached to the light-transmitting region 414 on the side of the optical body layer 41 facing the optical device (e.g., the camera module 3). The hydrophobic layer 421 covers the primer layer 422. The primer layer 422 increases the adhesion strength of the hydrophobic layer 421 to the surface of the first anti-reflection layer 412, thereby enhancing the stability of the performance of the inner surface of the optical cover plate 4.

[0182] Continuing with Figure 16 , the base layer 422 is an active base layer, identical to the substrate of the first anti-reflection layer 412. Because the active base layer and the first anti-reflection layer 412 share the same substrate, they exhibit strong bonding strength. Furthermore, the active base layer's high surface activity allows it to attract the hydrophobic layer 421 to the first anti-reflection layer 412, increasing its adhesion to the first anti-reflection layer 412 and ensuring stable adhesion of the hydrophobic layer 421 to the first anti-reflection layer 412, preventing it from falling off.

[0183] In some embodiments, the substrate of the first anti-reflection layer 412 can be silicon dioxide or other light-transmitting optical substrates. For example, if the substrate of the first anti-reflection layer 412 is silicon dioxide, the base layer 422 can be a silicon dioxide layer. Because the silicon dioxide layer and the first anti-reflection layer 412 have the same substrate, silicon dioxide, the base layer 422 can be compatible with the substrate of the first anti-reflection layer 412. This allows the base layer 422 to achieve good bonding strength with the first anti-reflection layer 412 while also providing the base layer 422 with high surface activity, thereby attracting the hydrophobic layer 421 to the first anti-reflection layer 412 and increasing the adhesion of the hydrophobic layer 421 to the first anti-reflection layer 412.

[0184] Continuing with FIG. 16 , the surface of the base layer 422 facing the hydrophobic layer 421 includes a third micro-nanostructure 4221. The third micro-nanostructure 4221 covers the second micro-nanostructure 4121 and is bonded between the second micro-nanostructure 4121 and the first micro-nanostructure 4211. The shape of the third micro-nanostructure 4221 matches the shape of the second micro-nanostructure 4121. While the base layer 422 enhances the adhesion of the hydrophobic layer 421 to the first anti-reflection layer 412, the third micro-nanostructure 4221 ensures consistency between the first micro-nanostructure 4211 and the second micro-nanostructure 4121. This increases the water droplet angle and oil droplet angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414 while preventing the first micro-nanostructure 4211 from affecting light transmission within the optical cover plate 4, thereby ensuring the capture effect of the camera module 3.

[0185] Continuing with reference to FIG. 16 and in conjunction with FIG. 15 , the thickness D2 of the base layer 422 can be less than the thickness D1 of the hydrophobic layer 421. Specifically, the thickness D2 of the base layer 422 can be greater than or equal to 8 nm and less than or equal to 13 nm. Alternatively, in some embodiments, the thickness D2 of the base layer 422 can be greater than or equal to 3 nm and less than or equal to 13 nm. By limiting the thickness D2 of the base layer 422 in this manner, the adhesion of the hydrophobic layer 421 to the first anti-reflection layer 412 can be ensured while preventing the base layer 422 from being too thick, which would affect the height of the first micro-nanostructure 4211 and the thickness of the optical cover 4.

[0186] Building on the above, and referring again to FIG. 16 , in some embodiments, the optical body layer 41 further includes a second anti-reflection layer 413. The second anti-reflection layer 413 is light-transmissive and is located on the side of the substrate 411 facing away from the hydrophobic film layer 42. The side of the second anti-reflection layer 413 facing away from the substrate 411 forms the outer surface of the optical body layer 41 and the optical cover plate 4. The outer surface of the optical cover plate 4 serves as the incident surface for light. The provision of the second anti-reflection layer 413 reduces reflection of light from the outer surface of the optical cover plate 4, protecting the outer surface of the optical cover plate 4 from scratches.

[0187] The second anti-reflection layer 413 can be an optical anti-reflection film system, which can include but is not limited to an ordinary optical AR film system, a hard AR film system, and an anti-scratch AR film system. The ordinary optical AR film system can be understood as an AR film system that only has optical properties such as anti-reflection. Since the ordinary optical AR film system, the hard AR film system, and the anti-scratch AR film system can be regarded as the AR coating layer 44, the provision of the second anti-reflection layer 413 can reduce the reflectivity of the outer surface of the optical cover plate 4 from 0.5% to below 0.3%. Therefore, the reflectivity of the inner surface of the optical cover plate 4 of the present application can be reduced to below 0.03%, and the reflectivity of the outer surface can be reduced to below 0.3%, which can effectively prevent the electronic device 100 from generating ghost images when taking pictures in general scenes and strong contrast scenes.

[0188] FIG17 shows a schematic diagram of the layers of the second anti-reflection layer 413 , which does not limit the number of layers of the second anti-reflection layer 413 .

[0189] As shown in FIG17 , the second anti-reflection layer 413 includes a first film layer 4131 and a second film layer 4132 having a greater refractive index than the first film layer 4131. The first film layers 4131 and the second film layers 4132 are alternately stacked on the substrate 411 of the optical body layer 41 to form the second anti-reflection layer 413. In the thickness direction of the second anti-reflection layer 413, the first film layer 4131 is located on the surface of the second anti-reflection layer 413. This ensures a low reflectivity on the outer surface of the optical cover plate 4 while effectively preventing ghosting when the electronic device 100 is used to take photos in both normal and high-contrast scenes.

[0190] Continuing with FIG. 17 , the second anti-reflection layer 413 utilizes a film stack 2H (two film materials). To enhance the scratch resistance of the outer surface of the optical cover plate 4, the first film layer 4131 can be made of a film material with high hardness and a relatively low refractive index, such as silicon dioxide, and the second film layer 4132 can be made of a film material with a higher refractive index than the first film layer 4131, such as silicon nitride. This ensures that the outer surface of the optical cover plate 4 has a relatively low reflectivity while also providing a certain degree of hardness to protect the outer surface of the optical cover plate 4 from scratches.

[0191] To verify the optical performance of the optical cover plate 4, the optical performance (such as reflectivity and transmittance) of the optical cover plate 4 was tested using a spectrophotometer. Taking the wavelength of light in the range of 380nm-780nm as an example, the reflectivity of the optical cover plate 4 was less than 0.3%, and the transmittance was greater than 98%.

[0192] According to the International Commission on Illumination, under normal incidence conditions, a colorimeter is used to test the chromaticity of the reflected light and the transmitted light of the optical cover plate 4 in the (L*, a*, b*) colorimetric system. L* represents lightness, a* represents red and green, and b* represents yellow and blue. The test results show that the deviation of the a value in the color value of the reflected light is within ±2, the deviation of the b value is within ±2, and the deviation of the a value in the color value of the transmitted light is within ±2, and the deviation of the b value is within ±2. This shows that the color of the visible light passing through the optical cover plate 4 and after being reflected by the optical cover plate 4 will not be affected, and the original color will be retained, thereby ensuring the accuracy of the camera module 3 in photographing the object.

[0193] Based on the above, the present invention also provides a method for preparing an optical assembly, which is applicable to the above-mentioned optical assembly. Figure 18 illustrates a schematic diagram of the structural changes of the optical cover plate 4 in the optical assembly during the preparation process, and Figure 19 illustrates a flow chart of a method for preparing the optical cover plate 4.

[0194] 18 and 19 , the method for preparing an optical component includes:

[0195] Step S100: preparing an optical stack, wherein the optical cover plate includes an optical body layer and a hydrophobic film layer, and the optical body layer includes an optical stack.

[0196] Step S200: forming a hydrophobic film layer on one side of the optical stack, wherein the hydrophobic film layer covers the light-transmitting area of ​​the optical stack corresponding to the optical body layer, and a side of the hydrophobic film layer facing away from the optical stack is a hydrophobic rough surface having a first micro-nano structure;

[0197] Step S300: Assembling an optical cover plate including an optical stack with an optical device to form an optical assembly, with the hydrophobic rough surface facing the optical device.

[0198] It should be noted that, by providing the hydrophobic film layer 42 and the hydrophobic rough surface, the side of the optical stack provided with the hydrophobic rough surface is hydrophobic at the light-transmitting area 414 of the optical body layer 41. Since the hydrophobic rough surface is disposed toward the optical device, the side of the optical stack provided with the hydrophobic rough surface can serve as the inner surface of the optical cover plate 4, and the light-transmitting area 414 of the optical body layer 41 can serve as the light-transmitting area 414 of the optical cover plate 4. The light-transmitting area of ​​the optical stack is located relative to the optical device (e.g., the camera module 3) to be blocked, so that ambient light can pass through the light-transmitting area of ​​the optical stack and enter the optical device.

[0199] In this way, when the optical cover plate 4 is combined with the optical device to form an optical assembly, when the inner surface of the optical cover plate 4 is facing the optical device, the water drop angle and the oil drop angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414 can be increased, and the rolling angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414 can be reduced, thereby effectively avoiding the proportion of haze-like dirt on the optical cover plate 4 after the entire electronic device 100 is coated.

[0200] The description of the light-transmitting region 414 and the first micro-nanostructure 4211 may refer to the above-mentioned related descriptions, and will not be further elaborated here.

[0201] The optical stack is prepared in step S100, which may specifically include:

[0202] Treating one side of a plate to be treated 4111 to form an optical stack, wherein the plate to be treated is an untreated glass plate;

[0203] In which, the optical stack may include a substrate 411 and a first anti-reflection layer 412, the first anti-reflection layer 412 covers the side of the substrate 411 facing the hydrophobic film layer 42, the side of the first anti-reflection layer 412 facing the hydrophobic film layer 42 is a rough surface having a second micro-nano structure 4121, the hydrophobic film layer 42 is located on the first anti-reflection layer 412, and covers the light-transmitting area 414 on the first anti-reflection layer 412 corresponding to the optical body layer 41.

[0204] It should be noted that the treatment of the plate to be treated 4111 may include, but is not limited to, etching or corrosion. Thus, by providing the first anti-reflection layer 412, the presence of the second micro-nanostructure 4121 not only facilitates the formation of the first micro-nanostructure 4211 on the hydrophobic film layer 42, but also increases the water droplet angle and oil droplet angle of the optical cover plate 4 on the surface of the hydrophobic film layer 42, reduces the rolling angle, and reduces the proportion of haze-like dirt on the light-transmitting area 414 of the optical cover plate 4. Furthermore, the reflectivity of the surface of the hydrophobic film layer 42 can be reduced, thereby reducing the intensity of ghosting in photos taken in general scenes and high-contrast environments.

[0205] The method for treating one side of the plate to be treated 4111 can be different depending on the structure of the second micro-nanostructure 4121. The following further describes the method for treating one side of the plate to be treated 4111 with reference to the second micro-nanostructure 4121 having different structures.

[0206] The second micro-nanostructure 4121 includes a plurality of protrusions 4122. The protrusions 4122 are micro-scale and / or nano-scale protrusions. Alternatively, the second micro-nanostructure 4121 includes a plurality of depressions, which are micro-scale and / or nano-scale depressions.

[0207] When the second micro-nanostructure 4121 includes multiple protrusions 4122, the multiple protrusions 4122 can be obtained by surface processing methods well known to those skilled in the art, such as metal mask, diamond fly cutter, chemical etching, etc., and this application has no special restrictions on this.

[0208] 19 , taking a metal mask as an example, one side of a plate to be processed 4111 is processed to form an optical stack, which may specifically include:

[0209] Under vacuum conditions, a metal film is formed on the plate to be processed 4111, and the metal film is heat-treated to shrink the metal film, thereby obtaining a particle template (not shown in the figure) having a plurality of particles 4125;

[0210] Plasma etching is performed on the particle template to form a second micro-nano structure 4121 on the particle surface of the particle template;

[0211] The particle template is cleaned to obtain an optical stack, wherein the portion of the second micro-nano structure 4121 is the first anti-reflection layer 412 , and the portion of the optical stack excluding the first anti-reflection layer 412 is the substrate 411 .

[0212] In this way, the areas on the treated plate 4111 not covered by the particles 4125 can be etched using a metal mask method to form an optical stack including a substrate and a plurality of second micro-nano structures 4121. The layered structure where the plurality of second micro-nano structures 4121 are located forms a first anti-reflection layer 412, and the points where the plurality of second micro-nano structures 4121 are located form convex points on the surface of the first anti-reflection layer 412, and the points between the second micro-nano structures 4121 form concave points on the surface of the first anti-reflection layer 412, so that the first anti-reflection layer 412 forms a gradient film layer.

[0213] The first anti-reflection layer 412 can be a light trap layer to reduce the reflectivity of the inner surface of the optical cover plate 4 and weaken the ghosting of the electronic device 100 when taking pictures. At the same time, it can cooperate with the hydrophobic film layer 42 to increase the water drop angle and oil drop angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414, reduce the rolling angle of the light-transmitting area 414 on the inner surface of the optical cover plate 4, and reduce the proportion of fog-like dirt 43 in the light-transmitting area 414.

[0214] It should be noted that the present application can form a metal film on the substrate 4111 to be processed by vacuum deposition or liquid coating. Vacuum deposition may include, but is not limited to, chemical vapor deposition, physical vapor deposition, thermal deposition, electron beam evaporation, or atomic layer deposition. Chemical vapor deposition may include, but is not limited to, vacuum evaporation, and physical vapor deposition may include, but is not limited to, sputtering. Liquid coating may include, but is not limited to, spray coating, dip coating, spin coating, and the like.

[0215] For example, the metal film may include, but is not limited to, a molybdenum film, an indium film, etc. Taking vacuum sputtering and molybdenum film as an example, the process parameters required for forming the molybdenum film can be set in the coating machine. The process parameters include, but are not limited to, film thickness, vacuum level, temperature, sputtering power, gas flow rate, time, etc. Then, the substrate 4111 to be coated is loaded onto the substrate rack and placed in the coating machine. After vacuuming to the desired level, the coating is completed.

[0216] It should be noted that after the coating is completed, the molybdenum target and the gas are turned off, and when the vacuum degree reaches the preset parameters, the molybdenum film is heat treated (such as heated). By setting the parameters in the heat treatment, such as the heating rate, the holding temperature after heating, and the holding time, a particle template of nanoparticles of a preset diameter can be obtained. After obtaining the particle template, the portion of the particle template where the particles 4125 are not provided can be etched by methods such as plasma etching to form a plurality of nano-scale protrusions 4122 (nano-protrusions) with a certain height and bottom size on the surface of the particle template covered by the particles 4125. The plurality of protrusions 4122 are interconnected to form a second micro-nano structure 4121.

[0217] The particle template is cleaned, which may include:

[0218] At room temperature, after the molybdenum film on the surface of the protrusion 4122 is cleaned with a stripping solution, an optical stack having the first anti-reflection layer 412 can be obtained.

[0219] The present invention does not specifically limit the parameters for forming the molybdenum film by vacuum sputtering, the parameters for heat treatment, and the parameters for plasma etching, and those skilled in the art may select them as needed. In order to subsequently form nanoparticles, in one embodiment, the thickness of the molybdenum film can be 3 nm to 8 nm.

[0220] To achieve a uniform distribution of nanoparticles with a diameter of 50nm to 70nm, the heat treatment is performed at a heating rate of 15°C / min to 25°C / min, heating to 100°C to 200°C and maintaining the temperature for 6 to 10 minutes. To minimize light transmission and reduce the reflectivity of the first anti-reflection layer 412, the height of the protrusions 4122 formed after etching can be 50nm to 200nm, and the size of the bottoms 4123 can be 150nm to 450nm.

[0221] Alternatively, in some embodiments, taking chemical etching as an example, processing is performed on one side of the to-be-processed plate 4111 to form an optical stack, which may specifically include:

[0222] Chemically corrode the plate to be processed 4111 to form a second micro-nano structure 4121 on one surface of the plate to be processed 4111;

[0223] The portion of the second micro-nano structure 4121 is the first anti-reflection layer 412 , and the portion of the optical stack excluding the first anti-reflection layer 412 is the substrate 411 .

[0224] In this way, chemical etching can be used to form a second micro-nanostructure 4121 on the surface of the substrate to be processed 4111, thereby reducing the reflectivity of the inner surface of the optical cover plate 4 in the light-transmitting area 414 while increasing the water droplet angle and oil droplet angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414. The first anti-reflection layer 412 formed by chemical etching can also serve as a light trapping layer.

[0225] The chemical etching of the plate to be processed 4111 may specifically include:

[0226] After cleaning the surface of the board 4111 to be processed, first, the board 4111 to be processed is placed in a corrosion tank filled with a first etching liquid, left for a first preset time, and then taken out for cleaning. Then, the board 4111 to be processed is placed in a corrosion tank filled with a second etching liquid, left for a second preset time, and then taken out for cleaning. Finally, the board 4111 to be processed is dried and cooled to obtain an optical laminate with a single-side reflectivity of less than 0.03%. This optical laminate can also be called anti-reflection glass.

[0227] The present embodiment of the present application does not specifically limit the parameters for chemical etching to form an optical stack with a single-side reflectivity of less than 0.03%, and those skilled in the art may select the parameters as needed. To achieve the desired reflectivity, the first etching solution may include a mixed solution containing 0.001% HF and 1% HCl, and the second etching solution may include a mixed solution containing 0.001% HF and 0.0001% Na2SiO3.

[0228] It should be noted that, in some embodiments, a porous coating may be applied to the plate to be processed 4111 to form an optical stack. In this case, the porous coating may be understood as the first anti-reflection layer 412 in the optical stack, and the plate to be processed 4111 may be understood as the substrate 411 in the optical stack.

[0229] FIG. 20 shows a flow chart of a method for preparing the hydrophobic film layer 42 in the optical cover plate 4 .

[0230] Referring to FIG. 20 and in combination with FIG. 18 , a hydrophobic film layer 42 is formed on one side of the optical stack, specifically comprising:

[0231] Step S210: A hydrophobic layer having a first micro-nano structure is formed on a side of the substrate having a second micro-nano structure. The first micro-nano structure is located on the second micro-nano structure and covers the light-transmitting area of ​​the first anti-reflection layer corresponding to the optical body layer. The side of the hydrophobic layer facing the optical device is a hydrophobic rough surface, and the hydrophobic film layer includes a hydrophobic layer.

[0232] By providing the hydrophobic layer 421, a hydrophobic rough surface can be formed on the side of the hydrophobic layer 421 facing the optical device. This allows the optical stack to have hydrophobic and oleophobic properties on the hydrophobic rough surface without affecting the reflectivity of the substrate 411 on the surface of the first anti-reflection layer 412. This allows the optical stack to combine with the first micro-nanostructure 4211 to increase the water droplet angle and oil droplet angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414, reduce the rolling angle of the inner surface of the optical cover plate 4 in the light-transmitting area 414, and thus reduce the proportion of haze-like dirt 43 formed on the inner surface of the optical cover plate 4. The material and thickness of the hydrophobic layer 421 can be found in the relevant description above and will not be further elaborated here.

[0233] It should be noted that, similar to the formation method of the metal film, the present application can form a hydrophobic layer 421 on the second micro-nanostructure 4121 of the substrate 411 by vacuum deposition or liquid coating. The hydrophobic layer 421 may include, but is not limited to, a perfluoropolyether layer. Taking the perfluoropolyether layer as an example, the present application can form a hydrophobic layer 421 on the second micro-nanostructure 4121 of the substrate 411 by vacuum deposition or liquid coating. The hydrophobic layer 421 may include, but is not limited to, a perfluoropolyether layer. Taking the perfluoropolyether layer as an example, the present application can form a hydrophobic layer 421 by vacuum deposition. By setting the parameters of the vacuum deposition process according to the desired thickness of the perfluoropolyether layer, the perfluoropolyether is heated and vaporized, thereby condensing on the second micro-nanostructure 4121 of the substrate 411 to form an anti-pollution hydrophobic layer 421.

[0234] The present invention does not specifically limit the thickness of the perfluoropolyether layer or the parameters for vacuum deposition of the perfluoropolyether layer, and those skilled in the art may select the desired parameters. In some embodiments, to form a perfluoropolyether layer with a good hydrophobic effect while not affecting the morphology of the first micro-nanostructure 4211, the thickness of the perfluoropolyether layer may be 10 nm to 30 nm.

[0235] Referring to FIG. 20 in combination with FIG. 18 , in some embodiments, before forming the hydrophobic layer 421 having the first micro-nanostructure 4211 on the side of the substrate 411 having the second micro-nanostructure 4121 , the preparation method may further include:

[0236] Step S201: forming a base layer having a third micro-nano structure on one side of the substrate having the second micro-nano structure, wherein the third micro-nano structure covers the second micro-nano structure and is bonded between the second micro-nano structure and the first micro-nano structure, wherein the hydrophobic film layer further comprises the base layer.

[0237] It should be noted that the provision of the primer layer 422 not only ensures good bonding strength to the first anti-reflection layer 412, but also, due to its high surface activity, it can attract the hydrophobic layer 421 to the first anti-reflection layer 412, thereby increasing the adhesion of the hydrophobic layer 421 to the first anti-reflection layer 412 and ensuring that the hydrophobic layer 421 is stably adsorbed on the first anti-reflection layer 412 and is not easily detached. The material and thickness of the primer layer 422 can be found in the relevant description above and will not be further elaborated here.

[0238] Similar to the formation of the metal film, the present application can form the base layer 422 on the first anti-reflection layer 412 by vacuum deposition or liquid coating. Taking the silicon dioxide layer as an example, the present application can form the base layer 422 by sputtering. The present embodiment of the application does not specifically limit the parameters of the sputtering coating for forming the base layer 422, and those skilled in the art can select them as needed. In some embodiments, in order to ensure that the hydrophobic layer 421 is stably adsorbed on the first anti-reflection layer 412 while not affecting the morphology of the first micro-nanostructure 4211, the thickness of the base layer 422 can be 8nm-13nm.

[0239] It should be noted that in the process of forming the base layer 422 and the hydrophobic layer 421, the fully automatic visual special-shaped placement machine is required to accurately position to ensure the accuracy of the non-transparent area 415 and prevent the base layer 422 and the hydrophobic layer 421 from being plated to the fitting area 4151 of the optical cover 4, affecting the fitting between the camera module 3 and the optical cover 4.

[0240] As shown in FIG18 , after forming the hydrophobic film layer 42 on one side of the optical stack and before combining the optical cover plate 4 including the optical stack with an optical device to form an optical assembly, the preparation method may further include:

[0241] A second anti-reflection layer 413 is formed on a side of the optical stack facing away from the hydrophobic film layer 42 . The optical body layer 41 further includes the second anti-reflection layer 413 .

[0242] It should be noted that since the optical cover plate 4 includes an optical body layer 41 and a hydrophobic film layer 42, the provision of a second anti-reflection layer 413 can reduce the reflectivity of the optical body layer 41 on the side facing away from the hydrophobic film layer 42 (the outer surface of the optical cover plate 4) to below 0.3%. This effectively prevents ghosting when the electronic device 100 is photographed in both normal and high-contrast scenes, while also protecting the outer surface of the optical cover plate 4 from scratches. The description of the second anti-reflection layer 413 can be found in the relevant description above and will not be further elaborated here.

[0243] In the film design of the second anti-reflection layer 413, film design software such as TFCALC and Macleod can be used to design the film according to optical requirements, and then deposition is performed according to the designed film structure, so that the second anti-reflection layer 413 formed after deposition can meet the single-side reflectivity average value requirement of visible light in the 380nm to 780nm band of less than 0.3%, ensuring that the visible light in this band has a high transmittance.

[0244] Since the transmittance requirements for the above-mentioned visible light band are relatively high, a film stack 2H can be used, and the second film layer 4132 is made of a film material with high hardness and relatively low refractive index. For example, the film material of the second film layer 4132 can be SiO2. The first film layer 4131 is made of a film material with a refractive index lower than that of the second film layer 4132. For example, the film material of the first film layer 4131 can be Si3N4. The initial film system is formed in the optical thin film software, thus forming a film system consisting of the first film layer 4131 and the second film layer 4132 stacked alternately. Then, the band optimization conditions are entered in the continuous target to ensure that the transmittance and reflectivity meet the requirements. Finally, the Lab value requirements are entered in the color target to ensure that the color of the transmitted light is colorless. After a series of optimization designs, the second anti-reflection layer 413 that meets the above requirements is obtained.

[0245] In one embodiment, a vacuum sputtering coating machine can be used to coat the optical stack formed with the hydrophobic film layer 42 to form an optical cover plate 4 having a second anti-reflection layer 413. The coating parameters can be selected according to the materials of each layer of the film structure, and this application has no special restrictions on this. For example, the coating parameters of the first film layer 4131 can be: sputtering power of silicon target: 7000W~8000W, Ar flow rate: 100sccm~150sccm, N2 flow rate: 50sccm~100sccm, RadicalSource (radical ion source) power: 4000W~5000W. The coating parameters of the second film layer 4132 can be: sputtering power of silicon target: 7500W~8500W, Ar flow rate: 200sccm~300sccm, O2 flow rate: 100sccm~150sccm; RadicalSource power: 4000W~5000W.

[0246] It should be noted that in some embodiments, during the preparation process of the optical cover plate 4, after forming the optical stack, a second anti-reflection layer 413 may be formed on the side of the optical stack facing away from the first anti-reflection layer 412, and finally a hydrophobic film layer 42 may be formed on the first anti-reflection layer 412 of the optical stack.

[0247] Alternatively, in some embodiments, during the preparation of the optical cover plate 4, the second anti-reflection layer 413 may be first formed on one surface of the plate to be processed 4111, and then the first anti-reflection layer 412 and the hydrophobic film layer 42 may be sequentially formed on the other surface of the plate to be processed 4111. In the present application, the order of preparing the second anti-reflection layer 413 is not further limited.

[0248] A method for preparing the optical cover plate 4 of the present application will be further described below in conjunction with specific embodiments.

[0249] Example 1

[0250] 1. Preparation of optical stacks

[0251] Step 1: Vacuum sputtering of molybdenum film on the substrate to be processed

[0252] The thickness of the molybdenum film is set to 5nm and input into the coating machine. Then the process parameters are set: background vacuum 5.0×10 -4 Pa, the temperature was set to 80°C;

[0253] In order to strengthen the adhesion between the film layer and the substrate 4111 to be processed, radio frequency magnetron sputtering (RF) was used for pre-treatment before coating. The specific parameters were as follows: Radical Source power of 4500 W, Ar flow rate of 0 sccm, O2 flow rate of 120 sccm, N2 flow rate of 0 sccm, and time of 240 s.

[0254] In order to obtain the above 5 nm thick molybdenum film, the coating parameters were set as follows: the sputtering power of the molybdenum target was 3000 W, and the Ar flow rate was 120 sccm.

[0255] Load the plate 4111 to be coated onto the substrate rack, place it in the above-mentioned coating machine, close the door and evacuate, enter the coating program, click to start film formation (metal molybdenum coating), and complete the coating.

[0256] Step 2: Heat treatment of molybdenum film

[0257] 1) After the coating is completed, turn off the molybdenum target and gas, and wait until the vacuum reaches 5.0×10 -3 Pa, heating the molybdenum film at a heating rate of 20 ° C / min, heating to 120 ° C and keeping it warm for 7 min, obtaining a uniformly distributed nanoparticle template, the diameter of the particles 4125 on the nanoparticle template is 50-70 nm;

[0258] 2) Air intake, cooling time 5min, air intake time: 3min;

[0259] 3) Take the wafer, transfer it into the plasma etching equipment, and wait for etching.

[0260] Step 3: Plasma Etching

[0261] 1) Plasma etching parameters: reactive ion etching power of 500W, chamber pressure of plasma etching equipment of 10Pa, background vacuum of 5.0×10 -3 Pa, reactive ion etching power of 500W, argon flow rate of 40 SCCM, trifluoromethane flow rate of 5 SCCM, and etching time of 10 minutes. After etching, multiple interconnected protrusions 4122 are constructed on the surface of the optical stack. The protrusions 4122 are nanoscale protrusions. Among them, the multiple nanoscale protrusions can form a second micro-nanostructure 4121. The height of the protrusion 4122 is 120nm, and the size of the bottom 4123 is 200nm.

[0262] 2) Air intake, cooling time is 5 minutes, air intake time is 3 minutes;

[0263] 3) Take the film.

[0264] Step 4: Clean and remove the residual molybdenum film

[0265] At room temperature, the residual metal molybdenum film layer is cleaned with a stripping solution, and then the surface of the to-be-treated board 4111 is cleaned with pure water to obtain an optical laminate with low single-sided reflectivity and high transmittance.

[0266] According to tests, the transmittance of visible light in the formed optical stack is 90%, and the reflectivity on the side of the optical stack having the second micro-nano structure 4121 is reduced to below 0.03%.

[0267] 2. Preparation of hydrophobic membrane layer

[0268] Step 1: Plasma surface treatment

[0269] 1) The parameters of plasma surface treatment are: background vacuum 5.0×10 -3 Pa;

[0270] 2) To enhance the adhesion between the film layer and the substrate 411, the optical stack is subjected to an anodic plasma treatment before coating. Specific parameters are: power of 1 kW to 5 kW, Ar flow rate of 200 sccm, O2 flow rate of 80 sccm, and time of 240 s;

[0271] Step 2: Base coating

[0272] Taking the silicon dioxide layer as an example, in order to obtain the bottom layer 422, the background vacuum is 5.0×10 -3Pa, the magnetron sputtering coating parameters are set as follows: the sputtering power of the silicon target is 8KW, the Ar flow rate is 250sccm, the Ar flow rate is 250sccm, the O2 flow rate is 120sccm, and the coating time is 2min. According to the above-mentioned vacuum sputtering molybdenum film coating process on the board to be processed 4111, a base layer 422 with a thickness of 8nm-13nm is obtained.

[0273] Step 3: Hydrophobic layer coating

[0274] Taking the perfluoropolyether layer as an example, in order to obtain an anti-pollution hydrophobic layer 421, the vacuum evaporation parameters are set as follows: coating current is 260A, Ar flow rate is 220sccm, O2 flow rate is 220sccm, and coating time is 3min. Under the above vacuum evaporation parameters, perfluoropolyether can be evaporated on the base layer 422 to form a hydrophobic layer 421 with a thickness of 10nm-30nm.

[0275] 3. Preparation of the Second Anti-reflection Layer

[0276] Step 1: Membrane structure design

[0277] The film system design for the second anti-reflection layer 413 based on TFCALC requires an average single-side reflectivity of less than 0.3% from 380 to 780 nm. Due to the high transmittance requirement in the visible light band, a film stack 2H is used in the film system. The first film layer 4131 (L) is made of SiO2, which has high hardness and relatively low refractive index, and the second film layer 4132 (H) is made of Si3N4. The initial film system LH is formed in the optical thin film software, thus forming a film system composed of alternating first and second film layers 4131 and 4132. After a series of optimization designs, the film structure of the second anti-reflection layer 4133 is shown in Table 1:

[0278] Table 1 shows the film structure of the optical cover plate including the second anti-reflection layer of the first film system.

[0279] Step 2: Forming a second anti-reflection layer 413 on the substrate 411 Input the film thickness of each layer of the second anti-reflection layer 413 designed in Table 1 into the coating machine and set the process parameters: background vacuum 5.0×10 -4 , the temperature is set to 80 degrees Celsius;

[0280] In order to enhance the adhesion between the film layer and the substrate 411, RF pre-treatment is performed before coating. The specific parameters are as follows: RadicalSource power of 4500W, Ar flow of 0 sccm, O2 flow of 120 sccm, N2 flow of 0 sccm, and time of 240 s.

[0281] In order to obtain the physical thickness of Si3N4 designed above, the coating parameters were set as follows: the sputtering power of the aluminum target was 7500W, the Ar flow rate was 120sccm, the N2 flow rate was 80sccm, and the RadicalSource power was 4500W.

[0282] In order to obtain the physical thickness of SiO2 designed above, the coating parameters were set as follows: the sputtering power of the silicon target was 8000W, the Ar flow rate was 250sccm, the RadicalSource power was 4500W, the Ar flow rate was 250sccm, and the O2 flow rate was 120sccm.

[0283] After the coating is completed, a high-performance optical cover plate 4 is obtained with a transmittance of 98.45%, a reflectivity of less than 0.3% on the outer surface, a water drop angle greater than 150° at the inner surface transmission area, a reflectivity of less than 0.03% on the inner surface, an outer surface Vickers hardness of 1580HV, a hardness of 1300 grams, and a Mohs hardness of 7.

[0284] Example 2

[0285] 1. Preparation of optical stacks

[0286] Step 1: Vacuum sputtering of molybdenum film on the substrate to be processed

[0287] The thickness of the molybdenum film is set to 5nm and input into the coating machine. Then the process parameters are set: background vacuum 5.0×10 -4 Pa, the temperature was set to 80°C;

[0288] In order to strengthen the adhesion between the film layer and the substrate 4111 to be processed, radio frequency magnetron sputtering (RF) was used for pre-treatment before coating. The specific parameters were as follows: Radical Source power of 4500 W, Ar flow rate of 0 sccm, O2 flow rate of 120 sccm, N2 flow rate of 0 sccm, and time of 240 s.

[0289] In order to obtain the above 5 nm thick molybdenum film, the coating parameters were set as follows: the sputtering power of the molybdenum target was 3000 W, and the Ar flow rate was 120 sccm.

[0290] Load the plate 4111 to be coated onto the substrate rack, place it in the above-mentioned coating machine, close the door and evacuate, enter the coating program, click to start film formation (metal molybdenum coating), and complete the coating.

[0291] Step 2: Heat treatment of molybdenum film

[0292] 1) After the coating is completed, turn off the molybdenum target and gas, and wait until the vacuum reaches 5.0×10 -3Pa, heating the molybdenum film at a heating rate of 25 ° C / min, heating to 150 ° C and keeping it warm for 6 min-10 min to obtain a uniformly distributed nanoparticle template, and the diameter of the nanoparticles on the nanoparticle template is 60nm-80nm;

[0293] 2) Air intake, cooling time is 5 minutes, air intake time is 3 minutes;

[0294] 3) Take the wafer, transfer it into the plasma etching equipment, and wait for etching.

[0295] Step 3: Plasma Etching

[0296] 1) Plasma etching parameters: reactive ion etching power of 500W, chamber pressure of plasma etching equipment of 10Pa, background vacuum of 5.0×10 -3 Pa, reactive ion etching power of 500W, argon flow rate of 40SCCM, trifluoromethane flow rate of 5SCCM, and etching time of 10 minutes. After etching, multiple interconnected protrusions 4122 are constructed on the surface of the optical stack. The protrusions 4122 are nanoscale protrusions, and the multiple nanoscale protrusions form a second micro-nanostructure 4121. The height of the protrusions 4122 is 50nm-120nm, and the size of the bottom 4123 is 170nm-500nm.

[0297] 2) Air intake, cooling time is 5 minutes, air intake time is 3 minutes;

[0298] 3) Take the film.

[0299] Step 4: Clean and remove the residual molybdenum film

[0300] At room temperature, the residual metal molybdenum film layer is cleaned with a stripping solution, and then the surface of the to-be-treated board 4111 is cleaned with pure water to obtain an optical laminate with low single-sided reflectivity and high transmittance.

[0301] According to tests, the transmittance of visible light in the formed optical stack is 98.45%, and the reflectivity on the side of the optical stack having the second micro-nano structure 4121 is reduced to below 0.03%.

[0302] 2. Preparation of hydrophobic membrane layer

[0303] Step 1: Plasma surface treatment

[0304] 1) The parameters of plasma surface treatment are: background vacuum 5.0×10 -3 Pa;

[0305] 2) To enhance the adhesion between the film layer and the substrate 411, the optical stack is subjected to an anodic plasma treatment before coating. Specific parameters are: power of 1 kW to 5 kW, Ar flow rate of 200 sccm, O2 flow rate of 80 sccm, and time of 240 s;

[0306] Step 2: Base coating

[0307] Taking the silicon dioxide layer as an example, in order to obtain the bottom layer 422, the background vacuum is 5.0×10 -3 Pa, the magnetron sputtering coating parameters are set as follows: the sputtering power of the silicon target is 8KW, the Ar flow rate is 250sccm, the Ar flow rate is 250sccm, the O2 flow rate is 120sccm, and the coating time is 2min. According to the above-mentioned coating process of vacuum sputtering molybdenum film on the board to be processed 4111, a base layer 422 with a thickness of 3nm-13nm is obtained.

[0308] Step 3: Hydrophobic layer coating

[0309] Taking the perfluoropolyether layer as an example, in order to obtain an anti-pollution hydrophobic layer 421, the vacuum evaporation parameters are set as follows: coating current is 260A, Ar flow rate is 220sccm, O2 flow rate is 220sccm, and coating time is 3min. Under the above vacuum evaporation parameters, perfluoropolyether can be evaporated on the base layer 422 to form a hydrophobic layer 421 with a thickness of 5nm-30nm.

[0310] 3. Preparation of the Second Anti-reflection Layer

[0311] Step 1: Membrane structure design

[0312] The film system design for the second anti-reflection layer 413 based on TFCALC requires an average single-side reflectance of less than 0.3% from 380 to 780 nm. Due to the high transmittance requirement in the visible light band, a film stack 2H is used in the film system. The first film layer 4131 (L) is made of SiO2, which has high hardness and relatively low refractive index, and the second film layer 4132 (H) is made of Si3N4. The initial film system LH is formed in the optical thin film software, thus forming a film system consisting of alternating first and second film layers 4131 and 4132. After a series of optimization designs, the film structure of the second anti-reflection layer 413 is shown in Table 2:

[0313] Table 2 shows the film structure of the optical cover plate including the second anti-reflection layer of the second film system.

[0314] Step 2: Forming a second anti-reflection layer 413 on the substrate 411 Input the film thickness of each layer of the second anti-reflection layer 413 designed in Table 2 into the coating machine and set the process parameters: background vacuum 5.0×10 -4, the temperature is set to 80 degrees Celsius;

[0315] In order to enhance the adhesion between the film layer and the substrate 411, RF pre-treatment is performed before coating. The specific parameters are as follows: RadicalSource power of 4500W, Ar flow of 0 sccm, O2 flow of 120 sccm, N2 flow of 0 sccm, and time of 240 s.

[0316] In order to obtain the physical thickness of Si3N4 designed above, the coating parameters were set as follows: the sputtering power of the aluminum target was 7500W, the Ar flow rate was 120sccm, the N2 flow rate was 80sccm, and the RadicalSource power was 4500W.

[0317] In order to obtain the physical thickness of SiO2 designed above, the coating parameters were set as follows: the sputtering power of the silicon target was 8000W, the Ar flow rate was 250sccm, the RadicalSource power was 4500W, the Ar flow rate was 250sccm, and the O2 flow rate was 120sccm.

[0318] After coating, an optical cover plate 4 is obtained with a transmittance of 98.45%, a reflectivity of less than 0.3% on the outer surface, a water drop angle of greater than 150° at the inner surface transmission area, and a reflectivity of less than 0.03% on the inner surface.

[0319] Example 3

[0320] 1. Preparation of optical stacks

[0321] Step 1:

[0322] The surface of the substrate 4111 to be processed is cleaned with a detergent and then rinsed with deionized water. The cleaned substrate 4111 to be processed is placed in an etching tank containing a first etching solution for 3 hours. After removal, the substrate is rinsed with deionized water. For example, the first etching solution is a mixed solution containing 0.001% HF and 1% HCl.

[0323] Step 2:

[0324] The cleaned board 4111 is placed in a corrosion tank containing a second etching solution for 20 hours, and then taken out and rinsed with deionized water. For example, the second etching solution is a mixed solution containing 0.001% HF and 0.0001% Na2SiO3.

[0325] Step 3:

[0326] The cleaned substrate 4111 to be processed was placed in a 300°C drying oven for 60 minutes. The oven heat switch was turned off, and when the temperature dropped to 50°C, the substrate 4111 was removed from the oven, resulting in an optical laminate with a single-side reflectivity of less than 0.03%. This optical laminate is a single-sided anti-reflective glass. The surface of the prepared optical laminate has multiple micron- and / or nanometer-scale depressions, forming a second micro- and nanostructure 4121. The second micro- and nanostructure 4121 is located in the first anti-reflection layer 412.

[0327] 2. Preparation of hydrophobic membrane layer

[0328] Step 1: Plasma surface treatment

[0329] 1) The parameters of plasma surface treatment are: background vacuum 5.0×10 -3 Pa;

[0330] 2) To enhance the adhesion between the film layer and the substrate 411, the optical stack is subjected to an anodic plasma treatment before coating. Specific parameters are: power of 1 kW to 5 kW, Ar flow rate of 200 sccm, O2 flow rate of 80 sccm, and time of 240 s;

[0331] Step 2: Base coating

[0332] Taking the silicon dioxide layer as an example, in order to obtain the bottom layer 422, the background vacuum is 5.0×10 -3 Pa, the magnetron sputtering coating parameters are set as follows: the sputtering power of the silicon target is 8KW, the Ar flow rate is 250sccm, the Ar flow rate is 250sccm, the O2 flow rate is 120sccm, and the coating time is 2min. According to the above-mentioned vacuum sputtering molybdenum film coating process on the board to be processed 4111, a base layer 422 with a thickness of 8nm-13nm is obtained.

[0333] Step 3: Hydrophobic layer coating

[0334] Taking the perfluoropolyether layer as an example, in order to obtain an anti-pollution hydrophobic layer 421, the vacuum evaporation parameters are set as follows: coating current is 260A, Ar flow rate is 220sccm, O2 flow rate is 220sccm, and coating time is 3min. Under the above vacuum evaporation parameters, perfluoropolyether can be evaporated on the base layer 422 to form a hydrophobic layer 421 with a thickness of 10nm-30nm.

[0335] 3. Preparation of the Second Anti-reflection Layer

[0336] Step 1: Membrane structure design

[0337] The film system design for the second anti-reflection layer 413 based on TFCALC requires an average single-side reflectivity of less than 0.3% from 380 to 780 nm. Due to the high transmittance requirement in the visible light band, a film stack 2H is used in the film system. The first film layer 4131 (L) is made of SiO2, which has high hardness and relatively low refractive index, and the second film layer 4132 (H) is made of Si3N4. The initial film system LH is formed in the optical thin film software, thus forming a film system composed of alternating first and second film layers 4131 and 4132. After a series of optimization designs, the film structure of the second anti-reflection layer 4133 is shown in Table 1:

[0338] Table 3 shows the film structure of the optical cover plate including the second anti-reflection layer of the third film system.

[0339] Step 2: Forming a second anti-reflection layer 413 on the substrate 411 Input the film thickness of each layer of the second anti-reflection layer 413 designed in Table 3 into the coating machine and set the process parameters: background vacuum 5.0×10 -4 , the temperature is set to 80 degrees Celsius;

[0340] In order to enhance the adhesion between the film layer and the substrate 411, RF pre-treatment is performed before coating. The specific parameters are as follows: RadicalSource power of 4500W, Ar flow of 0 sccm, O2 flow of 120 sccm, N2 flow of 0 sccm, and time of 240 s.

[0341] In order to obtain the physical thickness of Si3N4 designed above, the coating parameters were set as follows: the sputtering power of the aluminum target was 7500W, the Ar flow rate was 120sccm, the N2 flow rate was 80sccm, and the RadicalSource power was 4500W.

[0342] In order to obtain the physical thickness of SiO2 designed above, the coating parameters were set as follows: the sputtering power of the silicon target was 8000W, the Ar flow rate was 250sccm, the RadicalSource power was 4500W, the Ar flow rate was 250sccm, and the O2 flow rate was 120sccm.

[0343] After the coating is completed, a high-performance optical cover plate 4 is obtained with a transmittance of 98.45%, a reflectivity of less than 0.3% on the outer surface, a water drop angle greater than 150° at the inner surface transmission area, a reflectivity of less than 0.03% on the inner surface, an outer surface Vickers hardness of 1580HV, a hardness of 1300 grams, and a Mohs hardness of 7.

[0344] On the basis of the above, the electronic device 100 provided in the embodiment of the present application can adopt a housing and any of the above-mentioned optical components, wherein the optical device in the optical component is located in the receiving space of the housing 2, and the optical cover 4 replaces the original optical cover 4a and is located on the housing 2 and covers the light incident surface 321 of the optical device. While protecting the optical device (such as the camera module 3) and effectively preventing the intensity of ghosting in photos taken by the camera module 3 in a strong contrast environment, it can also ensure that the water drop angle of the inner surface of the optical cover 4 in the light-transmitting area 414 is greater than 150 degrees, effectively reducing the proportion of haze-like dirt 43 generated on the inner surface of the optical cover 4.

[0345] It should be noted that, taking the camera module 3 as an example, the structure of the shell 2, the formation of the receiving space and the arrangement of the optical device in the receiving space can refer to the above description of the electronic device 100 and will not be further elaborated here.

[0346] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0347] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. An optical component, characterized in that: include: Optical devices; An optical cover plate, wherein the optical cover plate comprises an optical body layer, the optical body layer shields the light incident surface of the optical device and has a light-transmitting area arranged opposite to the optical device; The optical cover plate further includes a hydrophobic film layer, which is light-transmitting and is located on the side of the optical body layer facing the optical device and covers the light-transmitting area; wherein the side of the hydrophobic film layer facing the optical device is a hydrophobic rough surface having a first micro-nano structure.

2. The optical component according to claim 1, wherein The optical device is a camera module, and the camera module includes a lens, wherein: The optical body layer blocks the light incident surface of the lens; and The position of the light-transmitting area in the optical body layer is opposite to the position of the lens.

3. The optical component according to claim 2, wherein: The camera module also includes a module body, and the lens is located on the side of the module body facing the optical cover, wherein the non-light-transmitting area in the optical body layer is surrounded by the peripheral edge of the light-transmitting area, and the non-light-transmitting area is blocked on the module body.

4. The optical component according to any one of claims 1 to 3, characterized in that The hydrophobic film layer of the optical cover plate includes a hydrophobic layer, which is located on the side of the optical body layer facing the optical device and covers the light-transmitting area. The side of the hydrophobic layer facing the optical device is the hydrophobic rough surface.

5. The optical component according to any one of claims 1 to 4, characterized in that The optical body layer of the optical cover includes a substrate and a first anti-reflection layer, wherein the first anti-reflection layer covers the side of the substrate facing the hydrophobic film layer, and the side of the first anti-reflection layer facing the hydrophobic film layer is a rough surface having a second micro-nano structure, wherein the first micro-nano structure is attached to and covers the second micro-nano structure.

6. The optical component according to claim 5, wherein: The shape of the first micro-nanostructure matches the shape of the second micro-nanostructure.

7. The optical component according to claim 5, wherein: The refractive index of the first anti-reflection layer is configured to gradually change from the refractive index corresponding to the first anti-reflection layer to the refractive index corresponding to air along the direction from the substrate to the hydrophobic film layer.

8. The optical component according to any one of claims 5 to 7, characterized in that: The second micro-nano structure includes a plurality of protrusions, wherein: The bottom end of the protrusion is connected to the substrate, the top end of the protrusion is arranged toward the hydrophobic film layer, and the protrusion gradually becomes thinner from the bottom end to the top end.

9. The optical component according to claim 8, wherein The bottom ends of the plurality of protrusions are connected to each other.

10. The optical component according to claim 8 or 9, characterized in that The protrusions are micrometer-scale and / or nanometer-scale protrusions, wherein the height of the protrusions is greater than or equal to 50 nm and less than or equal to 200 nm, and the size of the bottom end of the protrusions is greater than or equal to 150 nm and less than or equal to 500 nm.

11. The optical component according to claim 4, wherein The thickness of the hydrophobic layer is greater than or equal to 5 nm and less than or equal to 30 nm.

12. The optical component according to any one of claims 8 to 10, characterized in that: The plurality of protrusions are arranged in an array.

13. The optical component according to any one of claims 5 to 7, characterized in that: The second micro-nano structure includes a plurality of depressions, wherein the depressions are micrometer-scale and / or nanometer-scale depressions, and the plurality of depressions are evenly arranged on the optical body layer.

14. The optical component according to claim 5, wherein The first anti-reflection layer is a light trap layer or a porous coating.

15. The optical component according to any one of claims 5 to 14, characterized in that The hydrophobic film layer further includes a primer layer, which is attached to the light-transmitting area of ​​the optical body layer on the side facing the optical device, and the hydrophobic layer of the hydrophobic film layer covers the primer layer.

16. The optical component according to claim 15, wherein: The side of the bottom layer facing the hydrophobic layer of the hydrophobic film layer has a third micro-nano structure, wherein: The third micro-nanostructure covers the second micro-nanostructure in the optical body layer and is attached between the second micro-nanostructure and the first micro-nanostructure; and The shape of the third micro-nanostructure matches the shape of the second micro-nanostructure.

17. The optical assembly according to claim 15, wherein: The thickness of the primer layer is smaller than the thickness of the hydrophobic layer in the hydrophobic film layer.

18. The optical assembly according to claim 15, wherein: The primer layer is an active primer layer that is the same as the substrate of the first anti-reflection layer in the optical body layer.

19. The optical component according to claim 18, wherein The substrate of the first anti-reflection layer is silicon dioxide, and the active primer layer is a silicon dioxide layer.

20. The optical component according to any one of claims 5 to 14, characterized in that The hydrophobic layer in the hydrophobic film layer is a perfluoropolyether coating.

21. The optical component according to any one of claims 1 to 14, characterized in that The water drop angle of the optical cover plate at the hydrophobic film layer is greater than 150°, and / or the rolling angle of the optical cover plate at the hydrophobic film layer is less than 40°.

22. The optical component according to any one of claims 1 to 14, characterized in that The optical body layer further includes a second anti-reflection layer, wherein the second anti-reflection layer is light-transmissive and is located on a side of the substrate of the optical body layer away from the hydrophobic film layer.

23. A method for preparing an optical component, characterized in that: The preparation method is used to manufacture the optical component according to any one of claims 1 to 22, and the preparation method comprises: preparing an optical stack, wherein the optical cover comprises an optical body layer and a hydrophobic film layer, and the optical body layer comprises the optical stack; forming the hydrophobic film layer on one side of the optical stack, wherein the hydrophobic film layer covers the light-transmitting area of ​​the optical stack corresponding to the optical body layer, and a side of the hydrophobic film layer facing away from the optical stack is a hydrophobic rough surface having a first micro-nano structure; The optical cover plate including the optical stack is combined with an optical device to form an optical assembly, wherein the hydrophobic rough surface is arranged toward the optical device.

24. The preparation method according to claim 23, characterized in that The preparation of the optical stack specifically includes: treating one side of a plate to be treated to form an optical stack, wherein the plate to be treated is an untreated glass plate; The optical stack includes a substrate and a first anti-reflection layer, wherein the first anti-reflection layer covers the side of the substrate facing the hydrophobic film layer, and the side of the first anti-reflection layer facing the hydrophobic film layer is a rough surface having a second micro-nano structure. The hydrophobic film layer is located on the first anti-reflection layer and covers the light-transmitting area of ​​the first anti-reflection layer corresponding to the optical body layer.

25. The preparation method according to claim 24, characterized in that The step of forming the hydrophobic film layer on one side of the optical stack specifically includes: forming a hydrophobic layer having the first micro-nanostructure on a side of the substrate having the second micro-nanostructure; The first micro-nano structure is located on the second micro-nano structure and covers the light-transmitting area of ​​the first anti-reflection layer corresponding to the optical body layer. The side of the hydrophobic layer facing the optical device is the hydrophobic rough surface, and the hydrophobic film layer includes the hydrophobic layer.

26. The preparation method according to claim 25, characterized in that Before forming the hydrophobic layer having the first micro-nano structure on the side of the substrate having the second micro-nano structure, the preparation method further includes: forming a bottom layer having a third micro-nano structure on a side of the substrate having the second micro-nano structure; The third micro-nano structure covers the second micro-nano structure and is attached between the second micro-nano structure and the first micro-nano structure, and the hydrophobic film layer further includes the base layer.

27. The preparation method according to any one of claims 24 to 26, characterized in that The processing of one side of the plate to be processed to form an optical stack specifically includes: forming a metal film on the plate to be processed under vacuum conditions, and heat-treating the metal film to shrink the metal film and obtain a particle template having a plurality of particles; performing plasma etching on the particle template to form the second micro-nano structure on the particle surface of the particle template; The particle template is cleaned to obtain the optical stack, wherein the portion of the second micro-nano structure is the first anti-reflection layer, and the portion of the optical stack excluding the first anti-reflection layer is the substrate.

28. The preparation method according to any one of claims 24 to 26, characterized in that: The processing of one side of the plate to be processed to form an optical stack specifically includes: Chemically etching the plate to be processed to form the second micro-nano structure on one side of the plate to be processed to obtain the optical stack; The second micro-nano structure portion is the first anti-reflection layer, and the portion of the optical stack excluding the first anti-reflection layer is the substrate.

29. The preparation method according to any one of claims 24 to 26, characterized in that: After forming a hydrophobic film layer on one side of the optical stack and before combining the optical cover plate including the optical stack with an optical device to form the optical assembly, the preparation method further includes: A second anti-reflection layer is formed on a side of the optical stack away from the hydrophobic film layer, and the optical body layer further includes the second anti-reflection layer.

30. An electronic device, characterized in that: The optical assembly comprises a housing and the optical component according to any one of claims 1 to 22, wherein the optical device in the optical component is located in the receiving space of the housing, and the optical cover is located on the housing and covers the light incident surface of the optical device.

Images