Display structure including metal layer and electronic device including the same

Abstract

An electronic device according to an embodiment of the present disclosure may include a housing and a display unit including a display panel, a protective layer, a metal layer including a first metal layer and a second metal layer, and a plurality of adhesive layers, and at least a portion of the display unit being bendable at a bending section, the first metal layer includes a first bending region and a second bending region disposed at a bending section of the display unit, and the second metal layer is disposed at one end and the other end of the first metal layer, and the one end and the other end of the first metal layer provided with the second metal layer may be located at a distance from the second bending region.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a display structure including a metal layer and an electronic device including the display structure. Background Art

[0002] The display laminate structure of the foldable electronic device may include a display panel, a protective layer, a metal layer, a waterproof layer, and an adhesive layer for bonding the layers. The metal layer included in the display laminate structure may include a metal layer for display enhancement and a metal layer for improving heat dissipation performance.

[0003] The metal layer for enhancing the display may include a grid pattern located in the curved portion of the foldable electronic device. The metal layer for display enhancement may include a material that is conducive to forming the grid pattern (e.g., stainless steel). The metal layer for improving heat dissipation performance may include a material that is conducive to heat dissipation (e.g., copper). Summary of the invention

[0004] Technical issues

[0005] The metal layer for display enhancement and the metal layer for improving heat dissipation performance may be respectively arranged in separate layers. Since each metal layer is arranged in a separate layer, the thickness of the display laminate structure may become thicker, and the process of manufacturing the display laminate structure may become complicated. Therefore, a metal layer arrangement structure capable of reducing the thickness of the display laminate structure is required.

[0006] Solution to the problem

[0007] An electronic device according to an embodiment of the present disclosure may include a housing and a display unit disposed on one surface of the housing.

[0008] A display unit according to an embodiment of the present disclosure may include: a display panel; a protective layer configured to protect the display panel; a metal layer configured to support the display panel and a plurality of adhesive layers. The display unit may be configured to be at least partially bendable in a bending section. The metal layer may include a first metal layer and a second metal layer, the first metal layer including a first bending region disposed at the bending section of the display unit and a second bending region located at an opposite end of the first bending region, the first metal layer being configured to enhance the strength of the display unit, and the second metal layer being disposed at an opposite end of the first metal layer. The opposite end of the first metal layer disposed with the second metal layer may be spaced apart from the second bending region.

[0009] According to an embodiment of the present disclosure, the metal layer may include a first metal layer including a bending area provided in a bending section of the display unit and reinforcing the strength of the display unit, and a second metal layer provided at each of opposite ends of the first metal layer. The opposite end of the first metal layer provided with the second metal layer may be spaced apart from the bending area.

[0010] Advantageous Effects of the Invention

[0011] The electronic device according to an embodiment of the present disclosure may reduce the thickness of a display laminate structure by disposing at least a portion of a metal layer for display enhancement and a metal layer for improving heat dissipation performance in the same layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a block diagram of an electronic device according to an embodiment in a network environment.

[0013] Figure 2a , Figure 2b and Figure 2c are views illustrating an electronic device in an unfolded state and a folded state according to an embodiment of the present disclosure.

[0014] Figure 3 is an exploded perspective view of a first display according to an embodiment of the present disclosure.

[0015] Figure 4a and Figure 4b is a view illustrating an electronic device including a curved section according to an embodiment of the present disclosure.

[0016] Figure 5a and Figure 5b is a view illustrating an electronic device including a first bending section and a second bending section according to an embodiment of the present disclosure.

[0017] Figure 6a and Figure 6b is a view illustrating a display unit according to an embodiment of the present disclosure.

[0018] Figure 7a and Figure 7b is a view illustrating a display unit including a plurality of bonding surfaces according to an embodiment of the present disclosure.

[0019] Figure 8a and Figure 8b is a view illustrating a display unit including two bonding surfaces according to an embodiment of the present disclosure.

[0020] Figure 9a and Figure 9b is a view illustrating a display unit including two bonding surfaces according to an embodiment of the present disclosure.

[0021] Fig.10a and Fig.10b is a view illustrating a display unit including a supporting member according to an embodiment of the present disclosure.

[0022] Fig.11a and Fig.11b is a view illustrating a display unit including a support plate according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0023] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0024] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0025] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0026] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0027] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0028] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0029] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0030] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0031] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0032] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0033] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0034] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0036] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0037] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0040] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0041] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0042] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0043] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0044] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies. Figure 2a , Figure 2b and Figure 2c 1 is a view illustrating the electronic device 101 in an unfolded state and a folded state according to an embodiment of the present disclosure.

[0045] Figure 2a is a plan view showing a front surface of an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0046] Figure 2b is a plan view showing a rear surface of an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0047] Figure 2cis a perspective view showing an electronic device in a folded state according to an embodiment of the present disclosure.

[0048] refer to Figure 2a to Figure 2c , the electronic device 101 may include a pair of housings 210 and 220 (eg, foldable housings) that are rotatably coupled to each other to pivot about a hinge module (eg, Figure 2a In some embodiments, two or more hinge modules (e.g., Figure 2a The hinge module 240 in the embodiment can be used to allow the electronic device to be folded in the same direction or in different directions.

[0049] According to an embodiment, the electronic device 101 may include a first display 300 (eg, a foldable display) provided in an area defined by a pair of housings 210 and 220 .

[0050] According to an embodiment, the first housing 210 and the second housing 220 are disposed on opposite sides of the folding axis (axis A), and may have a substantially symmetrical shape with respect to the folding axis (axis A). The first housing 210 and the second housing 220 may form an angle or distance therebetween, which may vary depending on whether the electronic device 101 is in an unfolded state or a flat state (e.g., a second state), a folded state (e.g., a first state), or an intermediate state.

[0051] According to an embodiment, a pair of housings 210 and 220 may include a hinge module (eg, Figure 2a The hinge module 240 in the embodiment of the present invention comprises a first housing 210 (eg, a first housing structure) and a hinge module 240 coupled to the ...). Figure 2a The first housing 210 may include a second housing 220 (e.g., a second housing structure) with a hinge module 240 in the folded state. In the unfolded state, the first housing 210 may include a first surface 211 facing a first direction (e.g., a forward direction) and a second surface 212 facing a second direction (e.g., a rearward direction) opposite to the first surface 211. In the folded state, the second housing 220 may include a third surface 221 facing the first direction and a fourth surface 222 facing the second direction.

[0052] According to an embodiment, the electronic device 101 can be operated so that in the unfolded state, the first surface 211 of the first shell 210 and the third surface 221 of the second shell 220 face substantially the same first direction, and in the folded state, the first surface 211 and the third surface 221 face each other.

[0053] According to an embodiment, the electronic device 101 may be operated so that in the unfolded state, the second surface 212 of the first housing 210 and the fourth surface 222 of the second housing 220 are oriented in substantially the same second direction, and in the folded state, the second surface 212 and the fourth surface 222 are oriented in opposite directions. For example, in the folded state, the second surface 212 may be oriented in the first direction, and the fourth surface 222 may be oriented in the second direction.

[0054] According to an embodiment, the first housing 210 may include a first side surface frame 213 that at least partially forms the appearance of the electronic device 101 and a first rear surface cover 214 that is coupled to the first side surface frame 213 and forms at least a portion of the second surface 212 of the electronic device 101. The first side surface frame 213 may include a first side surface 213a, a second side surface 213b extending from one end of the first side surface 213a, and a third side surface 213c extending from the other end of the first side surface 213a. The first side surface frame 213 may be configured to have a rectangular (e.g., square or rectangular) shape having the first side surface 213a, the second side surface 213b, and the third side surface 213c.

[0055] According to an embodiment, the second housing 220 may include a second side surface frame 223 that at least partially forms the appearance of the electronic device 101 and a second rear surface cover 224 that is coupled to the second side surface frame 223 and forms at least a portion of the fourth surface 222 of the electronic device 101. According to an embodiment, the second side surface frame 223 may include a fourth side surface 223a, a fifth side surface 223b extending from one end of the fourth side surface 223a, and a sixth side surface 223c extending from the other end of the fourth side surface 223a. The second side surface frame 223 may be formed in a rectangular shape having the fourth side surface 223a, the fifth side surface 223b, and the sixth side surface 223c.

[0056] According to an embodiment, a pair of housings 210 and 220 are not limited to the shapes and assemblies shown, but may be implemented by other shapes or other combinations and / or assemblies of components. For example, in some embodiments, the first side surface frame 213 and the first rear surface cover 214 may be configured integrally, and the second side surface frame 223 and the second rear surface cover 224 may be configured integrally.

[0057] According to an embodiment, when the electronic device 101 is in the unfolded state, the second side surface 213b of the first side surface frame 213 and the fifth side surface 223b of the second side surface frame 223 may be connected to each other without a gap. When the electronic device 101 is in the unfolded state, the third side surface 213c of the first side surface frame 213 and the sixth side surface 223c of the second side surface frame 223 may be connected to each other without a gap. The electronic device 101 may be configured so that in the unfolded state, the total length of the second side surface 213b and the fifth side surface 223b is longer than the length of the first side surface 213a and / or the length of the fourth side surface 223a. In addition, the electronic device 220 may be configured so that the total length of the third side surface 213c and the sixth side surface 223c is longer than the length of the first side surface 213a and / or the length of the fourth side surface 223a.

[0058] According to an embodiment, the first side surface frame 213 and / or the second side surface frame 223 may be made of metal, or may also include a polymer injection molded onto the metal. According to an embodiment, the first side surface frame 213 and / or the second side surface frame 223 may include at least one conductive portion 216 and / or 226 electrically isolated by one or more polymer-based segmentation portions 2161 and 2162 and / or 2261 and 2262. In this case, at least one conductive portion may be used as an antenna operating in at least one predetermined frequency band (e.g., a conventional frequency band) by being electrically connected to a wireless communication circuit included in the electronic device 101.

[0059] According to an embodiment, the first rear surface cover 214 and / or the second rear surface cover 224 may be made of, for example, at least one of coated or colored glass, ceramic, polymer or metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of these materials.

[0060] According to an embodiment, the first display 300 may be provided across the hinge module (eg, Figure 2a The hinge module 240 in the first housing 210 extends from the first surface 211 of the first housing 210 to at least a portion of the third surface 221 of the second housing 220. For example, the first display 300 may basically include a first area 230a corresponding to the first surface 211, a second area 230b corresponding to the second surface 221, and a hinge module (e.g., Figure 2a According to an embodiment, the first display 300 may include a flexible display, at least a portion of which may be deformed into a flat shape or a curved shape. The area division of the first display 300 is only a function of a pair of housings 210 and 220 and a hinge device (e.g., Figure 2aThe first display 300 may be physically divided by a pair of housings 210 and 220 and a hinge device (eg, Figure 2a The hinge module 240 in the first and second areas 230a and 230b may display a seamless single entire screen. According to an embodiment, the first area 230a and the second area 230b may have an overall symmetrical shape or a partially asymmetrical shape relative to the third area 230c. According to an embodiment, the electronic device 101 may include a first protective cover 215 (e.g., a first protective frame or a first decorative member) coupled along the periphery of the first shell 210. The electronic device 101 may include a second protective cover 225 (e.g., a second protective frame or a second decorative member) coupled along the periphery of the second shell 220. According to an embodiment, the first protective cover 215 and / or the second protective cover 225 may be made of a metal or polymer material. The first protective cover 215 and / or the second protective cover 225 may be used as a decorative member.

[0061] According to an embodiment, the first display 300 may be positioned so that the periphery of the first area 230a is interposed between the first housing 210 and the first protective cover 215. The first display 300 may be positioned so that the periphery of the second area 230b is interposed between the second housing 220 and the second protective cover 225.

[0062] According to an embodiment, the first display 300 may be positioned to allow a periphery of the first display 300 corresponding to the protective cover to be disposed on the hinge module (eg, Figure 2a The protective cover 235 in the area corresponding to the hinge module 240 in the first display 300 is protected. Therefore, the periphery of the first display 300 can be substantially protected from external influences. According to an embodiment, the electronic device 101 may include a device configured to support the hinge module (for example, Figure 2a The hinge housing 241 (e.g., hinge cover) of the hinge module 240 in the electronic device 101 is provided. When the electronic device 101 is in the folded state, the hinge housing 241 is provided to be exposed to the outside, and when the electronic device 300 is in the unfolded state, the hinge housing 241 is provided to be invisible from the outside by being introduced into the first space (e.g., the internal space of the first housing 210) and the second space (e.g., the internal space of the second housing 220). In some embodiments, the first display 300 may be provided to extend from at least a portion of the second surface 212 to at least a portion of the fourth surface 222. In this case, the electronic device 101 may be folded to expose the first display 300 to the outside (outward folding type).

[0063] According to an embodiment, the electronic device 101 may include a second display 231 that is provided separately from the first display 300. The second display 231 may be provided on the second surface 212 of the first housing 210 to be at least partially exposed, thereby displaying the state information of the electronic device 101 in the folded state, replacing the display function of the first display 300. According to an embodiment, the second display 231 may be provided to be visible from the outside through at least a portion of the first rear surface cover 214. In some embodiments, the second display 231 may be provided on the fourth surface 222 of the second housing 220. In this case, the second display 231 may be provided to be visible from the outside through at least a portion of the second rear surface cover 224. According to an embodiment, the second display 231 may include a touch panel including a touch sensor configured to detect a touch. According to an embodiment, the second display 231 may include any one of an organic light emitting diode (OLED) display, a light emitting diode (LED) display, and a liquid crystal display (LCD). According to an embodiment, the second display 231 may include a flexible display.

[0064] According to an embodiment, the electronic device 101 may include at least one of an input device 203 (e.g., a microphone), sound output devices 201 and 202, a sensor module 204, camera devices 205 and 208, a key input device 206, or a connector port 207. In the illustrated embodiment, the input device 203 (e.g., a microphone), the sound output devices 201 and 202, the sensor modules 204, the camera devices 205 and 208, the key input device 206, or the connector port 207 is indicated as a hole or shape provided in the first housing 210 or the second housing 220, but may be defined as including an actual electronic component (e.g., an input device, a sound output device, a sensor module, or a camera device) that is arranged inside the electronic device 101 and operated through the hole or shape.

[0065] According to an embodiment, the input device 203 may include at least one microphone 203 disposed in the second housing 220. In some embodiments, the input device 203 may include a plurality of microphones 203 arranged to detect the direction of sound. In some embodiments, the plurality of microphones 203 may be disposed at appropriate positions in the first housing 210 and / or the second housing 220. The sound output devices 201 and 202 may include speakers 201 and 202. The speakers 201 and 202 may include a phone call receiver 201 disposed in the first housing 210 and a speaker 202 disposed in the second housing 220. In some embodiments, the input device 203, the sound output devices 201 and 202, and the connector port 207 may be disposed in a space disposed in the first housing 210 of the electronic device 101 and / or in a space disposed in the second housing 220, and may be exposed to the external environment through one or more holes disposed in the first housing 210 and / or the second housing 220. At least one connector port 207 may be used to transmit power and / or data to / receive power and / or data from an external electronic device. In some embodiments, at least one connector port (e.g., headphone jack) may accommodate a connector (e.g., headphone jack) for transmitting / receiving audio signals to / from an external electronic device. In some embodiments, holes provided in the first housing 210 and / or the second housing 220 may be used in common for the input device 203 and the sound output devices 201 and 202. In some embodiments, the sound output devices 201 and 202 may include speakers (e.g., piezoelectric speakers) that operate without holes provided in the first housing 210 and / or the second housing 220.

[0066] According to an embodiment, the sensor module 204 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The sensor module 204 may detect the external environment through, for example, the first surface 211 of the first housing 210. In some embodiments, the electronic device 101 may further include at least one sensor module configured to detect the external environment through the second surface 212 of the first housing 210. At least one sensor module disposed on the second surface 212 of the first housing 210 may be configured to detect the external environment through at least some of the camera devices 205 and 208 and / or the second display 231. At least one sensor module disposed on the second surface 212 may include an illumination sensor. The sensor module 204 (e.g., an illumination sensor) may be disposed below the first display 300 to detect the external environment through the first display 300. The sensor module 204 may include at least one of an angle sensor, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an illumination sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an illumination sensor 204.

[0067] According to an embodiment, the camera devices 205 and 208 may include a first camera device 205 (e.g., a front camera device) disposed on a first surface 211 of the first housing 210 and a second camera device 208 disposed on a second surface 212 of the first housing 210. The electronic device 101 may further include a flash 209 disposed near the second camera device 208.

[0068] According to an embodiment, the camera devices 205 and 208 may include one or more lenses, image sensors and / or image signal processors. The flash 209 may include, for example, a light emitting diode or a xenon lamp. According to an embodiment, the camera devices 205 and 208 may be configured so that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and an image sensor are located on one surface (e.g., the first surface 211, the second surface 212, the third surface 221, or the fourth surface 222) of the electronic device 101. In some embodiments, the camera devices 205 and 208 may each include a time-of-flight (TOF) lens and / or an image sensor.

[0069] According to an embodiment, the key input device 206 (e.g., a key) may be provided on the third side surface 213c of the first side surface frame 213 of the first housing 210. In some embodiments, the key input device 206 may be provided on at least one of the other side surfaces 213a and 213b of the first housing 210 and / or the side surfaces 223a, 223b, and 223c of the second housing 220. In some embodiments, the electronic device 101 may not include some or all of the key input devices 206, and the key input device 206 not included in the electronic device 100 may be implemented in another form (such as a soft key on the first display 300). In some embodiments, the key input device 206 may be implemented by using a pressure sensor included in the first display 300.

[0070] According to an embodiment, some of the camera devices 205 and 208 (e.g., the first camera device 205) or the sensor module 204 may be arranged to be exposed through the first display 300. For example, the first camera device 205 or the sensor module 204 may be provided in the internal space of the electronic device 101 to contact the external environment through an opening (e.g., a through hole) at least partially provided in the first display 300. In an embodiment, some of the sensor modules 204 may be provided to perform their functions in the internal space of the electronic device 101 without being visually exposed through the first display 300. For example, in this case, an opening in the area of ​​the sensor module facing the first display 300 may be unnecessary.

[0071] Figure 3 is an exploded perspective view of the first display 300 according to an embodiment of the present disclosure.

[0072] According to an exemplary embodiment of the present disclosure, a display (e.g., the first display 300) may include an unbreakable (UB) type OLED display (e.g., a curved display). However, the present disclosure is not limited thereto, and the first display 300 may include an on-cell touch active matrix organic light emitting diode (AMOLED) (OCTA) type flat display.

[0073] refer to Figure 3, the first display 300 may include a window layer 310, a polarizer (POL) (320) (e.g., a polarizing film) sequentially arranged on the rear surface of the window layer 310, a display panel 330, a polymer layer 340, a metal sheet layer 350, and a digitizer 360. In some embodiments, the display may further include a metal reinforcing plate 370 disposed below the metal sheet layer 350. According to an embodiment, the window layer 310 may include a glass layer. According to an embodiment, the window layer 310 may include an ultra-thin glass (UTG). In some embodiments, the window layer 310 may include a polymer. In this case, the window layer 310 may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, a plurality of window layers 310 may be provided. In some embodiments, the window layer 310 may be provided with an adhesive having a weaker adhesive strength or a thinner thickness than the adhesives of other layers, so that the window layer 310 may be well separated from the other layers. In some embodiments, the window 310 may also include various coatings disposed on at least a portion of at least one of its top surface, bottom surface, and / or side surface.

[0074] According to an embodiment, the window layer 310, the polarizer 320, the display panel 330, the polymer layer 340, the metal sheet layer 350, and the digital tablet 360 may be disposed with the first housing (eg, Figure 2a The first surface of the first housing 110 (eg, Figure 2a The first surface 111 in the housing and the second housing (eg, Figure 2a The third surface of the second housing 120 (eg, Figure 2a The window layer 310, the polarizer 320, the display panel 330, the polymer layer 340, the metal sheet layer 350 and the digital tablet 360 may be attached to each other via adhesives P1, P2, P3 and P4 (or bonding agents). For example, the adhesives P1, P2, P3 and P4 may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat sensitive adhesive, a general adhesive and a double-sided tape.

[0075] According to an embodiment, the display panel 330 may include a plurality of pixels. The polarizer 320 may selectively allow light generated from a light source of the display panel 330 and vibrating in a predetermined direction to pass. The display panel 330 and the polarizer 320 may be integrally formed. The first display 300 may include a touch panel (not shown). Although not shown, the display panel 330 may further include a control circuit. The control circuit may include a display driver IC (DDI) and / or a touch display driver IC (TDDI) arranged in a chip on panel (COP) or chip on film (COF) type.

[0076] According to an embodiment, the polymer layer 340 may be disposed under the display panel 330 to provide a dark background for ensuring visibility of the display panel 330 , and may be made of a buffer material for buffering action.

[0077] According to an embodiment, the metal sheet layer 350 may provide a bending property to the first display 300. For example, the metal sheet layer 350 may include a first housing (eg, Figure 2a The first surface of the first housing 110 (eg, Figure 2a The first plane portion 451 corresponding to the first surface 111 in the embodiment of the present invention and the second shell (eg, Figure 2a The third surface of the second housing 120 (eg, Figure 2a The second plane portion 452 corresponding to the third surface 121 in FIG. 1 and the hinge module (eg, Figure 2a The bendable portion 453 of the hinge module 140 corresponds to and connects the first planar portion 451 and the second planar portion 452.

[0078] According to an embodiment, the metal sheet layer 350 may be formed so that the tablet 360 disposed thereunder has a structure for recognizing an external electronic pen through the metal sheet layer 350. The metal sheet layer 350 may have a structure capable of passing a magnetic field to detect when the tablet 360 disposed thereunder is removed from a foldable electronic device (e.g., Figure 2a The metal sheet layer 350 may include at least one of stainless steel for steel (SUS) (e.g., stainless steel (STS)), Cu, Al, or metal CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). In some embodiments, the metal sheet layer 350 may include other alloy materials. According to some embodiments, the metal sheet layer 350 may help to enhance the electronic device (e.g., Figure 1 a) and can be used to shield ambient noise and dissipate heat emitted from surrounding heat-generating components.

[0079] According to an embodiment, the digitizer 360 may be disposed below the metal sheet layer 350 and may include a detection member that receives input from an electronic pen (e.g., a stylus pen). For example, the digitizer 360 is a detection member and may include a coil member arranged on a dielectric substrate to detect an electromagnetic induction type resonant frequency applied from the electronic pen. For example, when an AC voltage is applied through the coil member of the digitizer 360, a magnetic field may be formed, inducing a current in an internal coil of a nearby electronic pen according to the principle of electromagnetic induction. The current forms a resonant frequency through the internal circuit of the pen, and the resonant frequency can be detected by the digitizer 360.

[0080] According to an embodiment, the first display 300 may include one or more functional components (not shown) disposed between the polymer layer 340 and the metal sheet layer 350, between the digitizer 360 and the metal sheet layer 350, and / or below the metal sheet layer 350. According to an embodiment, the functional component may include a graphite sheet for heat dissipation, an additional display, a force touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, a conductive / non-conductive tape, or an open-pore sponge.

[0081] According to an embodiment, when the functional component is not bendable, the functional component may be separately provided on the first housing (eg, Figure 2a The first housing 110 and the second housing (eg, Figure 2a The functional component (if bendable) may span the hinge module (eg, Figure 2a The hinge module 140 in the embodiment of the present invention is connected to the hinge module 140 in the embodiment of the present invention from the first housing (eg, Figure 2a The first housing 110 in the embodiment is provided to the second housing (eg, Figure 2a At least a portion of the second shell 120).

[0082] According to an embodiment, an electronic device (e.g., Figure 2a The electronic device 100 in the embodiment may include a camera device (eg, Figure 2a In some embodiments, the electronic device (e.g., Figure 2a The electronic device 100 in the embodiment may further include at least one sensor module (eg, Figure 2a ) (e.g., an illumination sensor, a proximity sensor, or a TOF sensor).

[0083] According to an embodiment, the polarizer 320, the display panel 330, the polymer layer 340, the tablet 360, and the metal sheet layer 350 may include through holes 3201, 3301, 3401, 3501, and 3601 formed at corresponding positions to allow a camera device (e.g., Figure 2a The first camera device 105) detects the external environment.

[0084] In an embodiment, the display panel 330 and / or the polarizer 320 may make the through holes 3201 and 3301 unnecessary by controlling the transmittance of the corresponding area. The size of the through holes 3201, 3301, 3401, 3501, and 3601 may be based on the camera device (e.g., Figure 2a The size of the first camera device 105 in FIG. 1 and / or the camera device (eg, Figure 2aThe through holes 3201, 3301, 3401, 3501 and 3601 may be formed according to the viewing angle of the first camera device 105), and the sizes of the respective through holes 3201, 3301, 3401, 3501 and 3601 may be different from each other.

[0085] According to an embodiment, the reinforcement plate 370 may be formed of a metal material, and may include a first reinforcement plate 471 facing the first planar portion 451 of the metal sheet layer 350 and a second reinforcement plate 472 facing the second planar portion 452 of the metal sheet layer 350 .

[0086] Figure 4a and Figure 4b is a view showing an electronic device 400 including a bending section B1 according to an embodiment of the present disclosure.

[0087] Figure 4a A state of the electronic device 400 according to the embodiment before being bent is shown.

[0088] Figure 4b The electronic device 400 is shown after being bent according to an embodiment.

[0089] When describing the electronic device 400 according to an embodiment of the present disclosure, a length direction of the electronic device 400 may refer to an X-axis direction, and a width direction of the electronic device 400 may refer to a Y-axis direction.

[0090] Figure 4a and Figure 4b The electronic device 400 shown in FIG. Figure 2a The electronic device 101 shown in FIG. 1 may include Figure 2a At least a portion of the electronic device 101 shown in .

[0091] refer to Figure 4a and Figure 4b According to an embodiment of the present disclosure, the electronic device 400 may include a display unit 410. The display unit 410 may be disposed on a housing (eg, Figure 2a The display unit 410 may be arranged on one surface of the housing 210 and 220 in the electronic device 400. The display unit 410 may extend along a length direction (eg, an X-axis direction) and a width direction (eg, a Y-axis direction) of the electronic device 400.

[0092] In one embodiment, the display unit 410 may include a bent portion 411 and / or a straight extension 412. The bent portion 411 may be a bendable region of the display unit 410. At least a portion of the bent portion 411 may include a configuration (e.g., a grid pattern) that allows the display unit 410 to be easily bent.

[0093] In one embodiment, the straight extensions 412 may be respectively disposed at opposite ends of the bent portion 411. For example, the straight extensions 412 may extend from one end (e.g., an end facing the -X-axis direction) of the bent portion 411 and the other end located opposite to the one end along the length direction (e.g., in the X-axis direction) of the electronic device 400.

[0094] Figure 4a An enlarged view of a region A is shown, in which the bent portion 411 and the straight extension 412 of the display unit 410 are in contact.

[0095] refer to Figure 4a and Figure 4b , the display unit 410 may include a curved section B1 and / or a straight section S1. The curved section B1 may refer to a section where the curved portion 411 of the display unit 410 is located and the display unit 410 is to be bent. The straight section S1 may refer to a section where the display unit 410 is not bent and extends in a straight line. The straight sections S1 of the display unit 410 may be located at the ends of the curved section B1, respectively.

[0096] refer to Figure 4b The display unit 410 may be bent toward the Z axis perpendicular to the X axis direction in the curved section B1. The display unit 410 may extend from an end of the curved section B1 in a direction parallel to the end of the curved section B1 in the straight section S1.

[0097] In an embodiment, the display unit 410 may include a first metal region 4121 and / or a second metal region 4122. The first metal region 4121 may be a region where metal is provided to support the display panel 620 (see Figure 6a ). The first metal region 4121 may be a region extending while including the bent portion 411. The second metal region 4122 may be a region in which a heat dissipation metal is disposed.

[0098] In an embodiment, a portion of each of first metal regions 4121 may be located in curved section B1 of display unit 410, and the remaining portion of each of first metal regions 4121 may be located in a corresponding one of straight sections S1 of display unit 410. For example, each first metal region 4121 may include at least a portion of a bendable configuration (e.g., a grid pattern), and the bendable configuration of first metal regions 4121 may be provided in curved section B1.

[0099] In an embodiment, each second metal region 4122 may be located in a corresponding one of the straight segments S1 of the display unit 410 .

[0100] Figure 5a and Figure 5bis a view showing an electronic device 400 including a first bending section B2 and a second bending section B3 according to an embodiment of the present disclosure.

[0101] Figure 5a An electronic device 400 including a second bending section B3 is shown before being bent according to one embodiment.

[0102] Figure 5b The electronic device 400 including the second bending section B3 after being bent according to one embodiment is shown.

[0103] Figure 5a and Figure 5b The electronic device 400 shown in FIG. Figure 2a The electronic device 101 shown in FIG. 1 may include Figure 2a At least a portion of the electronic device 101 shown in FIG.

[0104] refer to Figure 5a and Figure 5b According to an embodiment of the present disclosure, the electronic device 400 may include a display unit 410. The display unit 410 may be disposed on a housing (eg, Figure 2a The display unit 410 may be arranged on one surface of the housing 210 and 220 in the electronic device 400. The display unit 410 may extend along a length direction (eg, an X-axis direction) and a width direction (eg, a Y-axis direction) of the electronic device 400.

[0105] In an embodiment, the display unit 410 may include a bent portion 411 and / or a straight extension 412 .

[0106] In an embodiment, the straight extension portions 412 may be respectively provided at opposite ends of the bent portion 411. For example, the straight extension portion 412 may extend from one end (e.g., an end facing the -X-axis direction) of the bent portion 411 and the other end located opposite to the one end along the length direction (e.g., in the X-axis direction) of the electronic device 400.

[0107] Figure 5a An enlarged view of a region B is shown, in which the bent portion 411 and the straight extension 412 of the display unit 410 are in contact.

[0108] refer to Figure 5a and Figure 5b, the display unit 410 may include a first curved section B2, a second curved section B3 and / or a straight section S2. The first curved section B1 may refer to a section where the curved portion 411 is located and the display unit 410 is to bend. The second curved section B3 may refer to a section where the display unit 410 is bent in the opposite direction of the first curved section B2. The second curved section B3 may be spaced apart from the first curved section B2. The straight section S2 may refer to a section where the display unit 410 is not bent and extends in a straight line. The straight section S2 of the display unit 410 may be located at the end of the second curved section B3.

[0109] refer to Figure 5b The display unit 410 may be bent toward the Z axis perpendicular to the X axis direction in the first bending section B2. The display unit 410 may be at least partially bent in a direction toward the center line MM of the display unit 410 in the first bending section B2.

[0110] refer to Figure 5b , the display unit 410 may be bent in the second bending section B2 in a direction opposite to the direction in the first bending section B1. For example, the display unit 410 may be bent in the second bending section B2 in a direction opposite to the direction toward the center line MM.

[0111] refer to Figure 5b , the display unit 410 may extend from an end of the second curved section B3 in a direction parallel to the end of the curved section B3 in the straight section S2.

[0112] In an embodiment, the display unit 410 may include a first metal region 4121 and / or a second metal region 4122. The first metal region 4121 may be a region where metal is provided to support the display panel 620 (see Figure 6a ). The first metal region 4121 may be a region extending while including the bent portion 411. The second metal region 4122 may be a region in which a heat dissipation metal is disposed.

[0113] In an embodiment, the first metal region 4121 may be at least partially located in the first curved segment B2, the second curved segment B3, and / or the straight segment S2. For example, the first metal region 4121 may include a portion of the first metal region 4121 that allows the first metal region 4121 to be moved in the direction of Figure 5b The configuration that allows bending toward the center line MM or away from the center line MM in the first metal region 4121 may be set in the first bending section B2. The configuration that allows bending away from the center line MM in the first metal region 4121 may be set in the second bending section B3.

[0114] In an embodiment, each second metal region 4122 may be located in a corresponding one of the straight segments S2 of the display unit 410 .

[0115] Figure 6a and Figure 6b is a view showing a display unit 600 according to an embodiment of the present disclosure.

[0116] Figure 6a is a view showing a metal layer 640 including a first bending region 6411 according to an embodiment of the present disclosure.

[0117] Figure 6b is a view showing a metal layer 640 including a first bending region 6411 and a second bending region 6412 according to an embodiment of the present disclosure.

[0118] Figure 6a It can be taken along line A-A' Figure 4a 4 is a cross-sectional view of a display unit 410.

[0119] Figure 6b It can be taken along the line B-B' Figure 5a 4 is a cross-sectional view of a display unit 410.

[0120] When explaining the display unit 600 according to an embodiment of the present disclosure, a height direction of the display unit 600 may refer to a Z-axis direction, and a length direction of the display unit 600 may refer to an X-axis direction.

[0121] Figure 6a and Figure 6b The display unit 600 shown in FIG. Figure 3 The first display 300 shown in FIG. 1 may include Figure 3 At least a portion of the first display 300 shown in .

[0122] The display unit 600 according to an embodiment of the present disclosure may include an adhesive layer 610, a display panel 620, a protective layer 630, a metal layer 640, a resin layer 650, an anti-foreign matter layer 660, and / or a waterproof layer 670. The adhesive layer 610, the display panel 620, the protective layer 630, the metal layer 640, the resin layer 650, the anti-foreign matter layer 660, and the waterproof layer 670 may extend in a length direction (e.g., an X-axis direction) of the display unit 600.

[0123] In embodiments, respective layers included in the display unit 600 (eg, the display panel 620 and the metal layer 640 ) may be laminated in a height direction (eg, a Z-axis direction) of the display unit 600 .

[0124] Figure 6a The display panel 620 shown in FIG. Figure 3 The display panel 330 may include Figure 3 at least a portion of the display panel 330.

[0125] In embodiments, the protection layer 630 may include a first protection layer 631 , a second protection layer 632 , a third protection layer 633 , and / or a fourth protection layer 634 .

[0126] In an embodiment, the first protection layer 631 may be Figure 3 The first protective layer 631 may be used to provide a dark background for ensuring visibility of the display panel 620, and may include a buffer material. The second protective layer 632 may be Figure 3 The second protective layer 632 may selectively transmit light generated from the light source of the display panel 620. The third protective layer 633 may be an ultra-thin glass (UTG) including a tempered glass material for protecting the display panel 620. The fourth protective layer 634 may be a Figure 3 The window layer 310 is shown. The fourth protective layer 634 may serve as a protective layer for protecting the display panel 620, and may further include a coating layer on at least a portion thereof.

[0127] In an embodiment, the adhesive layer 610 may include a first adhesive layer 611, a second adhesive layer 612, a third adhesive layer 613, and / or a fourth adhesive layer 614. The adhesive layer 610 may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat reactive adhesive, a general adhesive, or a double-sided tape.

[0128] In an embodiment, the adhesive layer 610 may be located between the various layers (e.g., the display panel 620, the protective layer 630, the metal layer 640) included in the display unit 600, and may be used to bond and connect the various layers. For example, the first adhesive layer 611 may be disposed between the metal layer 640 and the first protective layer 631. The second adhesive layer 612 may be disposed between the display panel 620 and the second protective layer 632. The third adhesive layer 613 may be disposed between the second protective layer 632 and the third protective layer 633. The fourth adhesive layer 614 may be disposed between the third protective layer 633 and the fourth protective layer 634.

[0129] In an embodiment, the metal layer 640 may include a first metal layer 641 and / or a second metal layer 642. The first metal layer 641 may be used to enhance the display unit 600. For example, the first metal layer 641 may be used to enhance the display unit 600 in the curved sections B1 or B2 and B3 of the display unit 600 (see Figure 4a and 5a ) and straight section S1 or S2 (see Figure 4a and 5a ) in intensity.

[0130] In an embodiment, the second metal layer 642 may include heat dissipation metal to improve the heat dissipation performance of the display unit 600 .

[0131] In an embodiment, the first metal layer 641 may include a material having a greater hardness than the second metal layer 642. For example, the first metal layer 641 may include stainless steel or a titanium (Ti) material.

[0132] In an embodiment, the second metal layer 642 may include a material having greater heat dissipation performance than the first metal layer 641. For example, the second metal layer 642 may include a metal having heat dissipation performance, such as copper (Cu), aluminum (Al), or graphite.

[0133] refer to Figure 6a , the first metal layer 641 according to the embodiment may include a first bending area 6411. The first bending area 6411 may be formed in a mesh pattern shape to allow the display unit 600 to bend. For example, the first bending area 6411 may be formed in a mesh pattern shape at least partially including an empty space to allow the display unit 600 to be easily bent. The first bending area 6411 may be formed in a manner such as Figure 4a The first metal layer 641 including a material having a greater hardness than the second metal layer 642 may facilitate the formation of a mesh pattern.

[0134] refer to Figure 6a , the second metal layer 642 according to the embodiment may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0135] refer to Figure 6a According to an embodiment, the second metal layer 642 may be disposed at a predetermined distance from the first bending region 6411 of the first metal layer 641. For example, the bonding surface 640a where the first metal layer 641 and the second metal layer 642 contact may be spaced apart from the first bending region 6411 of the first metal layer 641 in the -X axis direction or the +X axis direction.

[0136] refer to Figure 6b , the first metal layer 641 according to the embodiment may include a first bending area 6411 and / or a second bending area 6412. The first bending area 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. The first bending area 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. Figure 5a In the first curved section B2 of the display unit 410 shown in .

[0137] refer to Figure 6b , the second bending region 6412 may be spaced apart from the first bending region 6411. For example, the second bending region 6412 may be spaced apart from the first bending region 6411 in the -X axis direction and the +X axis direction.

[0138] In an embodiment, the second bending regions 6412 may include bending grooves 6412a, respectively. The bending grooves 6412a may be formed by partially etching the second bending regions 6412. The bending grooves 6412a may be used to enable the display unit 600 to be easily bent in the second bending regions 6412. The second bending regions 6412 may be formed as follows. Figure 5a In the second curved section B3 of the display unit 410 shown in .

[0139] refer to Figure 6b , the second metal layer 642 according to the embodiment may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0140] refer to Figure 6b , the second metal layer 642 according to the embodiment may be disposed at a predetermined distance from the second bending region 6412 of the first metal layer 641. For example, the bonding surface 640a where the first metal layer 641 and the second metal layer 642 contact may be spaced apart from the second bending region 6412 of the first metal layer 641 in the -X axis direction or the +X axis direction.

[0141] In an embodiment, the first metal layer 641 may be bonded to the second metal layer 642 at the bonding surface 640a via an adhesive member. The adhesive member may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat reactive adhesive, a general adhesive, or a double-sided tape. Alternatively, the first metal layer 641 may be bonded to the second metal layer 642 by welding at the bonding surface 640a.

[0142] In an embodiment, the first adhesive layer 611 may include a bending space 6111 in at least a portion thereof. The bending space 6111 may be formed at a position overlapping a position where the first bending region 6411 of the first metal layer 641 is formed.

[0143] In an embodiment, the first adhesive layer 611 may be disposed at a position where at least a portion thereof overlaps with the bonding surface 640a of the metal layer 640. Figure 6a and Figure 6b , the first adhesive layer 611 may be formed such that at least a portion thereof is disposed at the X-axis position where the bonding surface 640a is disposed, and further extends in the -X-axis direction and the +X-axis direction based on the X-axis position of the bonding surface 640a.

[0144] In an embodiment, the first adhesive layer 611 may be disposed such that at least a portion thereof overlaps the bonding surface 640 a of the metal layer 640 , and may serve to prevent the bonding surface 640 a of the metal layer 640 from being recognized from the outside of the display unit 600 .

[0145] In an embodiment, the resin layer 650 may be disposed on one surface of the metal layer 640. For example, the resin layer 650 may be disposed on a surface of the metal layer 640 that faces the +Z axis direction.

[0146] In an embodiment, the resin layer 650 may include an adhesive material and may be used to prevent the metal layer 640 from being corroded due to water flowing in from the outside. The resin layer 650 may include a polyethylene terephthalate (PET) material.

[0147] In an embodiment, the resin layer 650 may be disposed at a position where at least a portion thereof overlaps with the bonding surface 640a of the metal layer 640. Figure 6a and Figure 6b , the resin layer 650 may be formed such that at least a portion thereof is disposed at the X-axis position where the bonding surface 640a is disposed, and further extends in the -X-axis direction and the +X-axis direction based on the X-axis position of the bonding surface 640a.

[0148] In an embodiment, the foreign substance prevention layer 660 may be disposed on one surface of the metal layer 640. For example, the foreign substance prevention layer 660 may be disposed on a surface of the first bending region 6411 of the first metal layer 641 facing the -Z axis direction.

[0149] In an embodiment, the foreign matter prevention layer 660 can be used to prevent foreign matter from entering the metal layer 640. For example, referring to Figure 6a and Figure 6b The foreign matter prevention layer 660 may be used to prevent foreign matter from entering the first bending region 6411 of the first metal layer 641. The foreign matter prevention layer 660 may include a thermoplastic polyurethane (TPU) material.

[0150] In an embodiment, the waterproof layer 670 may be disposed on one surface of the resin layer 650. For example, the waterproof layer 670 may be disposed on a surface of the resin layer 650 facing the -Z axis direction. The waterproof layer 670 may be used to prevent water from entering the display unit 600 or reduce the inflow of water. The waterproof layer 670 may include a waterproof material.

[0151] Figure 7a and Figure 7b is a view illustrating a display unit 600 including a plurality of bonding surfaces 640 a according to an embodiment of the present disclosure.

[0152] Figure 7a is a view showing a metal layer 640 including a plurality of bonding surfaces 640 a and a first bending region 6411 according to an embodiment of the present disclosure.

[0153] Figure 7bis a view showing a metal layer 640 including a plurality of bonding surfaces 640 a , a first bending region 6411 , and a second bending region 6412 according to an embodiment of the present disclosure.

[0154] Figure 7a It can be taken along line A-A' Figure 4a 4 is a cross-sectional view of a display unit 410.

[0155] FIG. 7B may be taken along line BB'. Figure 5a 4 is a cross-sectional view of a display unit 410.

[0156] refer to Figure 7a and Figure 7b , the display unit 600 may include an adhesive layer 610 , a display panel 620 , a protective layer 630 , a metal layer 640 , a resin layer 650 , a foreign matter prevention layer 660 and / or a waterproof layer 670 . Figure 7a and Figure 7b The functions and arrangements of the adhesive layer 610, the display panel 620, the protective layer 630, the resin layer 650, the foreign matter prevention layer 660 and / or the waterproof layer 670 shown in FIG. Figure 6a and Figure 6b The functions and arrangements of the various layers shown in FIG. 1 are basically the same.

[0157] In an embodiment, the metal layer 640 may include a first metal layer 641 and / or a second metal layer 642. The first metal layer 641 may be used to enhance the display unit 600. The second metal layer 642 may include a heat dissipation metal to improve the heat dissipation performance of the display unit 600.

[0158] Figure 7a and 7b The metal layer 640 shown in FIG. Figure 6a and 6b The metal layer 640 shown in FIG. 6 has the same function and material.

[0159] refer to Figure 7a and Figure 7b , the second metal layer 642 may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0160] refer to Figure 7a and Figure 7b , the first metal layer 641 may include an extension region 6413. For example, the first metal layer 641 may include an extension region 6413, wherein opposite ends of the first metal layer 641 extend further in the −X axis direction and the +X axis direction than other regions in the extension region 6413. The first metal layer 641 may contact the second metal layer 642 in the extension region 6413.

[0161] refer to Figure 7a , the first metal layer 641 according to the embodiment may include a first bending region 6411. The first bending region 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. The first bending region 6411 may be formed in a mesh pattern shape. Figure 4a In the curved section B1 of the display unit 410 shown in .

[0162] refer to Figure 7b , the first metal layer 641 according to the embodiment may include a first bending area 6411 and / or a second bending area 6412. The first bending area 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. The first bending area 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. Figure 5a The second bending area 6412 may be formed in the first bending section B2 of the display unit 410 shown in FIG. Figure 5a In the second curved section B3 of the display unit 410 shown in .

[0163] refer to Figure 7b , the second bending region 6412 may be spaced apart from the first bending region 6411. For example, the second bending region 6412 may be located in the -X axis direction and the +X axis direction relative to the first bending region 6411. The second bending regions 6412 may include bending grooves 6412a, respectively. The bending grooves 6412a may be formed by partially etching the second bending region 6412. The bending grooves 6412a may be used to enable the display unit 600 to be easily bent in the second bending region 6412.

[0164] refer to Figure 7a and Figure 7b , the metal layer 640 according to the embodiment may include a plurality of bonding surfaces 640a at which the first metal layer 641 and the second metal layer 642 contact. The first bonding surface 640a1 may be a surface formed parallel to the height direction (e.g., the Z-axis direction) of the display unit 600. The second bonding surface 640a2 may be a surface connected to the first bonding surface 640a1 and extending in a direction perpendicular to the first bonding surface 640a1. The third bonding surface 640a3 may be a surface connected to the second bonding surface 640a2 and extending in a direction perpendicular to the second bonding surface 640a2.

[0165] refer to Figure 7a , the first bonding surface 640a1, the second bonding surface 640a2, and the third bonding surface 640a3 according to the embodiment may be spaced apart from the first bending region 6411 of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0166] refer to Figure 7b, the first bonding surface 640a1, the second bonding surface 640a2, and the third bonding surface 640a3 according to the embodiment may be spaced apart from the second bending region 6412 of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0167] exist Figure 7a and Figure 7b In the figure, each of the plurality of joint surfaces 640a is shown to extend substantially perpendicularly to the joint surface 640a adjacent thereto, but this is exemplary, and the extension direction of each of the joint surfaces 640a may not be limited thereto. For example, the second joint surface 640a2 may extend in a direction inclined relative to the first joint surface 640a1, rather than extending in a direction perpendicular to the first joint surface 640a1.

[0168] In an embodiment, when the metal layer 640 includes a plurality of bonding surfaces 640 a , bonding between the first metal layer 641 and the second metal layer 642 may be more firmly formed than when the metal layer 640 includes a single bonding surface 640 a .

[0169] Figure 8a and Figure 8b is a view illustrating a display unit 600 including two bonding surfaces 640 a according to an embodiment of the present disclosure.

[0170] Figure 8a is a view showing a metal layer 640 including two bonding surfaces 640 a and a first bending region 6411 according to an embodiment of the present disclosure.

[0171] Figure 8b is a view showing a metal layer 640 including two bonding surfaces 640 a , a first bending region 6411 , and two second bending regions 6412 according to an embodiment of the present disclosure.

[0172] Figure 8a It can be taken along line A-A' Figure 4a 4 is a cross-sectional view of a display unit 410.

[0173] Figure 8b It can be taken along the line B-B' Figure 5a 4 is a cross-sectional view of a display unit 410.

[0174] refer to Figure 8a and Figure 8b , the display unit 600 may include an adhesive layer 610 , a display panel 620 , a protective layer 630 , a metal layer 640 , a resin layer 650 , a foreign matter prevention layer 660 and / or a waterproof layer 670 . Figure 8a and Figure 8bThe functions and arrangements of the adhesive layer 610, the display panel 620, the protective layer 630, the resin layer 650, the foreign matter prevention layer 660 and / or the waterproof layer 670 shown in FIG. Figure 6a and Figure 6b The functions and arrangements of the various layers shown in FIG. 1 are basically the same.

[0175] Figure 8a and 8b The metal layer 640 shown in FIG. Figure 6a and 6b The metal layer 640 shown in FIG. 6 has the same function and material.

[0176] refer to Figure 8a and Figure 8b , the second metal layer 642 may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0177] refer to Figure 8a and Figure 8b , the first metal layer 641 may include an extension region 6413. For example, the first metal layer 641 may include an extension region 6413, wherein opposite ends of the first metal layer 641 extend further in the −X axis direction and the +X axis direction than other regions in the extension region 6413. The first metal layer 641 may contact the second metal layer 642 in the extension region 6413.

[0178] refer to Figure 8a and Figure 8b , the extension region 6413 of the first metal layer 641 may be disposed on one surface of the second metal layer 642. For example, the extension region 6413 of the first metal layer 641 may be vertically disposed on a surface of the second metal layer 642 facing the +Z axis direction.

[0179] refer to Figure 8a , the first metal layer 641 according to the embodiment may include a first bending region 6411. The first bending region 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. The first bending region 6411 may be formed in a mesh pattern shape. Figure 4a In the curved section B1 of the display unit 410 shown in .

[0180] refer to Figure 8b , the first metal layer 641 according to the embodiment may include a first bending region 6411 and / or a second bending region 6412. The second bending region 6412 may be spaced apart from the first bending region 6411. For example, the second bending region 6412 may be located in the -X axis direction and the +X axis direction relative to the first bending region 6411. The first bending region 6411 may be formed as Figure 5aThe second bending area 6412 may be formed in the first bending section B2 of the display unit 410 shown in FIG. Figure 5a In the second curved section B3 of the display unit 410 shown in .

[0181] refer to Figure 8a and Figure 8b , the metal layer 640 according to the embodiment may include two bonding surfaces 640a where the first metal layer 641 and the second metal layer 642 contact. The first bonding surface 640a1 may be a surface formed parallel to the width direction (e.g., the X-axis direction) of the display unit 600. The second bonding surface 640a2 may be a surface connected to the first bonding surface 640a1 and extending in a direction perpendicular to the first bonding surface 640a1. With respect to the first bonding surface 640a1, the first metal layer 641 may be located in the +Z-axis direction, and the second metal layer 642 may be located in the -Z-axis direction.

[0182] refer to Figure 8a , the first bonding surface 640a1 and the second bonding surface 640a2 according to the embodiment may be spaced apart from the first bending region 6411 of the first metal layer 641 in the −X-axis direction and the +X-axis direction.

[0183] refer to Figure 8b , the first bonding surface 640a1 and the second bonding surface 640a2 according to the embodiment may be spaced apart from the second bending region 6412 of the first metal layer 641 in the −X-axis direction and the +X-axis direction.

[0184] exist Figure 8a and Figure 8b , the second joint surface 640a2 is shown as extending substantially perpendicularly to the first joint surface 640a1, but this is exemplary, and the extension direction of the second joint surface 640a may not be limited thereto. For example, the second joint surface 640a2 may extend in a direction inclined relative to the first joint surface 640a1, rather than extending in a direction perpendicular to the first joint surface 640a1.

[0185] In an embodiment, when a portion of the first metal layer 641 (e.g., the extended region 6413) is disposed on a surface of the second metal layer 642, the bonding between the first metal layer 641 and the second metal layer 642 can be more securely achieved than when the first metal layer 641 and the second metal layer 642 contact each other only on a surface parallel to the height direction (e.g., the Z-axis direction) of the display unit 600.

[0186] Figure 9a and Figure 9b is a view illustrating a display unit 600 including two bonding surfaces 640 a according to an embodiment of the present disclosure.

[0187] Figure 9a is a view showing a metal layer 640 including a first bending region 6411 according to an embodiment of the present disclosure.

[0188] Figure 9b is a view showing a metal layer 640 including a first bending region 6411 and a second bending region 6412 according to an embodiment of the present disclosure.

[0189] Figure 9a It can be taken along line A-A' Figure 4a 4 is a cross-sectional view of a display unit 410.

[0190] Figure 9b It can be taken along the line B-B' Figure 5a 4 is a cross-sectional view of a display unit 410.

[0191] refer to Figure 9a and Figure 9b , the display unit 600 according to the embodiment may include an adhesive layer 610 , a display panel 620 , a protective layer 630 , a metal layer 640 , a foreign substance prevention layer 660 and / or a waterproof layer 670 . Figure 9a and Figure 9b The functions and arrangements of the adhesive layer 610, the display panel 620, the protective layer 630, the foreign matter prevention layer 660 and / or the waterproof layer 670 shown in FIG. Figure 6a and Figure 6b The functions and arrangements of the various layers shown in FIG. 1 are basically the same.

[0192] Figure 9a and 9b The metal layer 640 shown in FIG. Figure 6a and 6b The metal layer 640 shown in FIG. 6 has the same function and material.

[0193] refer to Figure 9a and Figure 9b , the second metal layer 642 may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0194] refer to Figure 9a and Figure 9b , the first metal layer 641 may include an extension region 6413. For example, the first metal layer 641 may include an extension region 6413, wherein opposite ends of the first metal layer 641 extend further in the −X axis direction and the +X axis direction than other regions in the extension region 6413. The first metal layer 641 may contact the second metal layer 642 in the extension region 6413.

[0195] refer to Figure 9a and Figure 9b , the second metal layer 642 may be disposed on one surface of the extension region 6413 of the first metal layer 641. For example, the second metal layer 642 may be vertically disposed on the surface of the extension region 6413 of the first metal layer 641 facing the +Z axis direction.

[0196] refer to Figure 9a , the first metal layer 641 according to the embodiment may include a first bending region 6411. The first bending region 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent. The first bending region 6411 may be formed in a mesh pattern shape. Figure 4a In the curved section B1 of the display unit 410 shown in .

[0197] refer to Figure 9b , the first metal layer 641 according to the embodiment may include a first bending region 6411 and / or a second bending region 6412. The second bending region 6412 may be spaced apart from the first bending region 6411. For example, the second bending region 6412 may be located in the -X axis direction and the +X axis direction relative to the first bending region 6411. The first bending region 6411 may be formed as Figure 5a The second bending area 6412 may be formed in the first bending section B2 of the display unit 410 shown in FIG. Figure 5a In the second curved section B3 of the display unit 410 shown in .

[0198] refer to Figure 9a and Figure 9b , the metal layer 640 according to the embodiment may include two bonding surfaces 640a, wherein the first metal layer 641 and the second metal layer 642 are in contact at the two bonding surfaces 640a. The first bonding surface 640a1 may be a surface formed parallel to the width direction (e.g., the X-axis direction) of the display unit 600. The second bonding surface 640a2 may be a surface connected to the first bonding surface 640a1 and extending in a direction perpendicular to the first bonding surface 640a1. Relative to the first bonding surface 640a1, the second metal layer 642 may be located in the +Z axis direction, and the first metal layer 641 may be located in the -Z axis direction.

[0199] refer to Figure 9a , the first bonding surface 640a1 and the second bonding surface 640a2 according to the embodiment may be spaced apart from the first bending region 6411 of the first metal layer 641 in the −X-axis direction and the +X-axis direction.

[0200] refer to Figure 9b , the first bonding surface 640a1 and the second bonding surface 640a2 according to the embodiment may be spaced apart from the second bending region 6412 of the first metal layer 641 in the −X-axis direction and the +X-axis direction.

[0201] exist Figure 9a and Figure 9b , the second joint surface 640a2 is shown as extending substantially perpendicularly to the first joint surface 640a1, but this is exemplary, and the extension direction of the second joint surface 640a may not be limited thereto. For example, the second joint surface 640a2 may extend in a direction inclined relative to the first joint surface 640a1, rather than extending in a direction perpendicular to the first joint surface 640a1.

[0202] In an embodiment, when the second metal layer 642 is disposed on a portion of the first metal layer 641 (e.g., the extended region 6413), the bonding between the first metal layer 641 and the second metal layer 642 can be more securely achieved than when the first metal layer 641 and the second metal layer 642 contact each other only on a surface parallel to the height direction (e.g., the Z-axis direction) of the display unit 600.

[0203] Fig.10a and Fig.10b 2 is a view illustrating a display unit 600 including a supporting member 680 according to an embodiment of the present disclosure.

[0204] Fig.10a is a view showing a display unit 600 including a support member 680 before being bent according to an embodiment.

[0205] Fig.10a It can be taken along line A-A' Figure 4a 4 is a cross-sectional view of a display unit 410.

[0206] Fig.10b is a view illustrating a display unit 600 including a support member 680 after being bent according to an embodiment.

[0207] refer to Fig.10a , the display unit 600 according to an embodiment of the present disclosure may include a first adhesive layer 611 , a display panel 620 , a metal layer 640 , a resin layer 650 , an anti-foreign substance layer 660 , a supporting part 680 and / or an adhesive member 690 .

[0208] Fig.10a The display panel 620, the metal layer 640, the resin layer 650 and the foreign matter prevention layer 660 shown in FIG. Figure 6a 6, a display panel 620, a metal layer 640, a resin layer 650 and a foreign matter prevention layer 660 are shown.

[0209] Fig.10a The first adhesive layer 611 shown in FIG. Figure 6a The first adhesive layer 611 shown in FIG. 1 may include Figure 6a At least a portion of the first adhesive layer 611 in the embodiment. For example, Fig.10a The first adhesive layer 611 may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a thermal reactive adhesive, a general adhesive, or a double-sided tape.

[0210] refer to Fig.10a , the metal layer 640 according to the embodiment may be bonded to the display panel 620 via the first adhesive layer 611. For example, the display panel 620 may be disposed on one surface of the first adhesive layer 611, and the metal layer 640 may be disposed on the other surface of the first adhesive layer 611.

[0211] In embodiments, the metal layer 640 may include a first metal layer 641 and / or a second metal layer 642 .

[0212] According to an embodiment, the first metal layer 641 may include a first bending region 6411. The first bending region 6411 may be formed in a mesh pattern shape to allow the display unit 600 to be bent.

[0213] refer to Fig.10a , the first bending region 6411 of the first metal layer 641 may be located in the section CC' (eg, Fig.10a The first bending region 6411 formed in a grid pattern may be located in the section CC' and enable the display unit 600 to be easily bent.

[0214] The second metal layer 642 according to an embodiment may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0215] In an embodiment, the adhesive member 690 may be disposed between the resin layer 650 and the support part 680, and may be used to adhere the resin layer 650 and the support part 680. The adhesive member 690 may be a general adhesive or a double-sided tape.

[0216] In an embodiment, the support member 680 may be disposed in a direction opposite to the direction in which the display panel 620 is located relative to the metal layer 640. Fig.10a , with respect to the display unit 600 , the display panel 620 may be disposed at an end portion in the +Z axis direction, and the support member 680 may be disposed at an end portion in the −Z axis direction.

[0217] In an embodiment, the support member 680 may include a bent plate 681 and / or an extension plate 682. The bent plate 681 may be disposed at a position where at least a portion thereof overlaps with the first bent region 6411 of the first metal layer 641. For example, the bent plate 681 may be disposed at a position where at least a portion thereof overlaps with the section CC' where the first bent region 6411 is located.

[0218] refer to Fig.10b , the display unit 600 may include a first region 600-1 and / or a second region 600-2. The first region 600-1 may refer to a region including a first metal layer 641, and the second region 600-2 may refer to a region including a second metal layer 642.

[0219] Fig.10b The joining surface 600a between the regions shown in FIG. 60a may indicate that there is provided Fig.10a The location of the bonding surface 640a between the metal layers 640 is shown in FIG.

[0220] refer to Fig.10a and Fig.10b , in the display unit 600 according to the embodiment, the bonding surface 600 a may be formed at a portion of the display unit 600 extending in a straight line and spaced apart from the first bending region 6411 .

[0221] refer to Fig.10b According to the embodiment, the bent plate 681 may be provided at a position where at least a portion thereof at least partially overlaps with the joint surface 600a. For example, the bent plate 681 may be formed at a position where the joint surface 600a overlaps, and may be formed to extend in a direction parallel to one direction (e.g., +Z axis direction) and in a direction parallel to another direction (e.g., -Z axis direction) relative to the joint surface 600a.

[0222] In an embodiment, the bending plate 681 may be disposed at a position overlapping the bonding surface 600a to support the first metal layer 641 and the second metal layer 642 so that the first metal layer and the second metal layer are not separated from each other at the bonding surface 600a even when the display unit 600 is bent.

[0223] In an embodiment, the extension plate 682 may be disposed at a position overlapping at least a portion of the second region 600-2. Fig.10a and Fig.10b , the extension plate 682 may be disposed at a position overlapping a portion of the second region 600 - 2 , and may extend in a direction parallel to a direction in which the second region 600 - 2 extends.

[0224] Fig.11a and Fig.11bis a view showing a display unit 600 including a support plate 683 according to an embodiment of the present disclosure.

[0225] Fig.11a is a view showing a display unit 600 including a support plate 683 before being bent according to an embodiment.

[0226] Fig.11a It can be taken along the line B-B' Figure 5a 4 is a cross-sectional view of a display unit 410.

[0227] Fig.11b is a view showing a display unit 600 including a support plate 683 after being bent according to an embodiment.

[0228] refer to Fig.11a , the display unit 600 according to an embodiment of the present disclosure may include a first adhesive layer 611 , a display panel 620 , a metal layer 640 , a resin layer 650 , an anti-foreign substance layer 660 , a supporting part 680 and / or an adhesive member 690 .

[0229] Fig.11a The display panel 620, the metal layer 640, the resin layer 650 and the foreign matter prevention layer 660 shown in FIG. Figure 6b 6, a display panel 620, a metal layer 640, a resin layer 650 and a foreign matter prevention layer 660 are shown.

[0230] Fig.11a The first adhesive layer 611 shown in FIG. Figure 6b The first adhesive layer 611 shown in FIG. 1 may include Figure 6b At least a portion of the first adhesive layer 611 in the embodiment. For example, Fig.11a The first adhesive layer 611 may include at least one of an optically clear adhesive (OCA), a pressure sensitive adhesive (PSA), a thermal reactive adhesive, a general adhesive, or a double-sided tape.

[0231] refer to Fig.11a , the metal layer 640 according to the embodiment may be bonded to the display panel 620 via the first adhesive layer 611. For example, the display panel 620 may be disposed on one surface of the first adhesive layer 611, and the metal layer 640 may be disposed on the other surface of the first adhesive layer 611.

[0232] In embodiments, the metal layer 640 may include a first metal layer 641 and / or a second metal layer 642 .

[0233] The first metal layer 641 according to the embodiment may include a first bending region 6411 and / or a second bending region 6412. The first bending region 6411 may be formed in a mesh pattern shape to allow the display unit 600 to bend. The second bending region 6412 may be spaced apart from the first bending region 6411 in the -X axis direction or the +X axis direction. The second bending region 6412 may be a region where the display unit 600 is bent in a direction opposite to the direction in the first bending region 6411.

[0234] refer to Fig.11a , the first bending region 6411 and the second bending region 6412 of the first metal layer 641 may be located in the section D-D' (eg, Fig.11a In the section between the straight line D and the straight line D' shown in FIG.

[0235] The second metal layer 642 according to an embodiment may be disposed at opposite ends of the first metal layer 641. For example, the second metal layer 642 may be disposed at ends of the first metal layer 641 in the -X axis direction and the +X axis direction.

[0236] In an embodiment, the adhesive member 690 may be disposed between the resin layer 650 and the support part 680, and may be used to adhere the resin layer 650 and the support part 680. The adhesive member 690 may be a general adhesive or a double-sided tape.

[0237] In an embodiment, the support member 680 may be disposed in a direction opposite to the direction in which the display panel 620 is located relative to the metal layer 640. Fig.11a , with respect to the display unit 600 , the display panel 620 may be disposed at an end portion in the +Z axis direction, and the support member 680 may be disposed at an end portion in the −Z axis direction.

[0238] In an embodiment, the support member 680 may include a support plate 683 and / or an extension plate 682 .

[0239] refer to Fig.11b , the display unit 600 may include a first region 600-1 and / or a second region 600-2. The first region 600-1 may refer to a region including a first metal layer 641, and the second region 600-2 may refer to a region including a second metal layer 642.

[0240] Fig.11b The joining surface 600a between the regions shown in FIG. 60a may indicate the arrangement of Fig.11a The location of the bonding surface 640a between the metal layers 640 is shown in FIG.

[0241] refer to Fig.11b, in the display unit 600 according to the embodiment, the bonding surface 600 a may be formed at a portion of the display unit 600 extending in a straight line and spaced apart from a position where the support plate 683 is provided.

[0242] refer to Fig.11b According to the embodiment, the extension plate 682 may be provided at a position where at least a portion thereof overlaps with the joint surface 600a. For example, the extension plate 682 may be formed at a position where the joint surface 600a overlaps, and may be formed to extend in a direction parallel to one direction (e.g., +Z axis direction) and in a direction parallel to another direction (e.g., -Z axis direction) relative to the joint surface 600a.

[0243] In an embodiment, the extension plate 682 may be disposed at a position where the extension plate 682 overlaps with the bonding surface 600a to support the first metal layer 641 and the second metal layer 642 so that the first metal layer and the second metal layer are not separated from each other at the bonding surface 600a even when the display unit 600 is bent.

[0244] In an embodiment, the support plate 683 may be disposed at a position where at least a portion thereof overlaps the first bending region 6411 and the second bending region 6412 of the first metal layer 641. Fig.11a , the support plate 681 may be at least partially disposed in a section DD' where the first bending region 6411 and the second bending region 6412 are located.

[0245] The electronic device 101 according to an embodiment of the present disclosure may include a housing 210 or 220 and a display unit 600 disposed on one surface of the housing 210 or 220 .

[0246] The display unit 600 according to an embodiment of the present disclosure may include a display panel 620, a protective layer 630 configured to protect the display panel 620, a metal layer 640 configured to support the display panel 620, and a plurality of adhesive layers 610, and may be at least partially bendable in the bending section B2 or B3.

[0247] In an embodiment, the metal layer 640 may include a first metal layer 641, which includes a first bending area 6411 arranged in a bending segment B2 or B3 of the display unit 640 and a second bending area 6412 located at an opposite end of the first bending area 6412, and the first metal layer 641 is configured to enhance the strength of the display unit 600.

[0248] In an embodiment, the metal layer 640 may include a second metal layer 642 disposed at opposite ends of the first metal layer 641 , and the opposite ends of the first metal layer 641 at which the second metal layer 642 is disposed are spaced apart from the second bending region 6412 .

[0249] In an embodiment, the first bending region 6411 may be formed in a grid pattern shape.

[0250] In an embodiment, among the plurality of adhesive layers 610 , the adhesive layer 611 disposed on one surface of the metal layer 640 may be disposed at a position where at least a portion of the adhesive layer 611 overlaps a surface where the first and second metal layers 641 and 642 are bonded.

[0251] In an embodiment, the first metal layer 641 may include a material having a greater hardness than the second metal layer 642 .

[0252] In an embodiment, the second metal layer 642 may include a material having greater heat dissipation performance than the first metal layer 641 .

[0253] In an embodiment, the metal layer 640 may include a bonding surface 640 a where the first metal layer 641 and the second metal layer 642 are in contact.

[0254] In an embodiment, the bonding surface 640a may include a first bonding surface 640a1, a second bonding surface 640a2 and / or a third bonding surface 640a3, wherein, at the first bonding surface 640a1, the first metal layer 641 contacts the second metal layer 642 at each of the opposite ends of the second metal layer 642, the second bonding surface 640a2 extends perpendicular to the first bonding surface 640a1, and the third bonding surface 640a3 is located perpendicular to the second bonding surface 640a2 and is spaced apart from the first bonding surface 640a1.

[0255] In an embodiment, the first metal layer 641 may include an extension region 6413 extending from a portion of each of opposite ends of the first metal layer 641 .

[0256] In an embodiment, the second metal layer 642 may be disposed on one surface of the extension region 6413 of the first metal layer 641 .

[0257] In an embodiment, the extension region 6413 may be disposed on one surface of the second metal layer 642 .

[0258] In an embodiment, the second bending regions 6412 may each include a bending groove 6412 a formed by etching at least a portion of the first metal layer 641 .

[0259] In an embodiment, the display unit 600 may further include an extension plate 682 disposed on a side of the metal layer 640 opposite to the display panel 620 .

[0260] In an embodiment, the extension plate 682 may be disposed at a position where at least a portion of the extension plate 682 overlaps a surface where the first metal layer 641 and the second metal layer 642 are bonded.

[0261] The display unit 600 according to an embodiment of the present disclosure may include a display panel 620, a protective layer 630 configured to protect the display panel 620, a metal layer 640 configured to support the display panel 620, and a plurality of adhesive layers 610, and the display unit 600 is configured to be at least partially bendable in the bending section B1.

[0262] In an embodiment, the metal layer 640 may include a bending region 6411 disposed in the bending section B1 of the display unit 600 and a first metal layer 641 configured to enhance the strength of the display unit 600 .

[0263] In an embodiment, the metal layer 640 may include a second metal layer 642 disposed at opposite ends of the first metal layer 641 , and the opposite ends of the first metal layer 641 at which the second metal layer 642 is disposed may be spaced apart from the bending region 6411 .

[0264] In an embodiment, the bending area 6411 may be formed in a grid pattern shape.

[0265] In an embodiment, the display unit 600 may further include a bent plate 681 disposed on a side of the metal layer 640 opposite to the display panel 620 .

[0266] In an embodiment, the bent plate 681 may be disposed at a position where at least a portion of the bent plate 681 overlaps the bent region 6411 of the first metal layer 641 and a surface where the first metal layer 641 and the second metal layer 642 are joined.

[0267] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0268] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0269] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0270] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0271] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0272] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device (101), comprising: Housing (210, 220); as well as a display unit (600) provided on one surface of the housing, Wherein, the display unit comprises: Display panel (620); A protective layer (630) configured to protect the display panel; a metal layer (640) configured to support the display panel; and a plurality of adhesive layers (610), wherein at least a portion of the display unit is configured to be bendable in the bending sections (B2, B3), Wherein, the metal layer comprises: a first metal layer (641), comprising: a first bending region (6411) disposed in the bending section of the display unit and a second bending region (6412) located at an opposite end of the first bending region, the first metal layer being configured to enhance the strength of the display unit; and a second metal layer (642) disposed at an opposite end of the first metal layer, and Wherein, the opposite end of the first metal layer provided with the second metal layer is spaced apart from the second bending area.

2. The electronic device according to claim 1, wherein: The first bending region is formed in a grid pattern shape.

3. The electronic device as claimed in one of claims 1 and 2, wherein: Among the plurality of adhesive layers, the adhesive layer (611) disposed on one surface of the metal layer is disposed at a position where at least a portion of the adhesive layer (611) overlaps with a surface where the first metal layer and the second metal layer are bonded.

4. The electronic device according to one of claims 1 to 3, wherein: The first metal layer includes a material having a greater hardness than the second metal layer.

5. The electronic device according to one of claims 1 to 4, wherein: The second metal layer includes a material having greater heat dissipation performance than the first metal layer.

6. The electronic device according to one of claims 1 to 5, wherein: The metal layer comprises a bonding surface 640a, wherein at the bonding surface 640a, the first metal layer and the second metal layer are in contact, and Wherein, the bonding surface comprises: a first bonding surface (640a1), wherein at the first bonding surface (640a1), the first metal layer contacts the second metal layer at each of the opposite ends of the first metal layer; a second engaging surface (640a2), the second engaging surface extending perpendicularly to the first engaging surface; and A third joining surface (640a3), wherein the third joining surface is located perpendicular to the second joining surface and is spaced apart from the first joining surface.

7. The electronic device according to one of claims 1 to 6, wherein: The metal layer comprises a bonding surface (640a), wherein at the bonding surface (640a), the first metal layer and the second metal layer are in contact, and Wherein, the bonding surface comprises: a first bonding surface (640a1), wherein at the first bonding surface (640a1), the first metal layer contacts the second metal layer at each of the opposite ends of the first metal layer; and A second engaging surface (640a2), the second engaging surface extending perpendicularly to the first engaging surface.

8. The electronic device according to one of claims 1 to 7, wherein: The first metal layer includes an extension region (6413) extending from a portion of each of the opposite ends of the first metal layer, and Wherein, the second metal layer is disposed on a surface of the extension region of the first metal layer.

9. The electronic device according to one of claims 1 to 8, wherein: The first metal layer includes an extension region (6413) extending from a portion of each of the opposite ends of the first metal layer, and Wherein, the extension region is arranged on a surface of the second metal layer.

10. The electronic device according to one of claims 1 to 9, wherein: The second bending regions of the first metal layer each include a bending groove (6412a) formed by etching at least a portion of the first metal layer.

11. The electronic device according to one of claims 1 to 10, wherein: The display unit further includes an extension plate (682) disposed on a side of the metal layer opposite to the display panel, and The extension plate is disposed at a position where at least a portion of the extension plate overlaps with a surface where the first metal layer and the second metal layer are bonded.

12. An electronic device comprising: Housing (210, 220); as well as a display unit (600) provided on one surface of the housing, Wherein, the display unit comprises: Display panel (620); A protective layer (630) configured to protect the display panel; a metal layer (640) configured to support the display panel; and a plurality of adhesive layers (610), wherein at least a portion of the display panel is configured to be bendable in the bending section (B1), Wherein, the metal layer comprises: a first metal layer (641) comprising a bending region (6411) disposed in the bending section of the display unit, wherein the first metal layer is configured to enhance the strength of the display unit, and a second metal layer (642) disposed at an opposite end of the first metal layer, and Wherein, the opposite end of the first metal layer where the second metal layer is disposed is spaced apart from the bending area.

13. The electronic device according to claim 12, wherein: The bending area is formed in a grid pattern shape.

14. The electronic device according to one of claims 12 to 13, wherein Among the plurality of adhesive layers, the adhesive layer (611) disposed on one surface of the metal layer is disposed at a position where at least a portion of the adhesive layer (611) overlaps with a surface where the first metal layer and the second metal layer are bonded.

15. The electronic device according to one of claims 12 to 14, wherein The display unit further comprises a bending plate (681) which is arranged on a side of the metal layer opposite to the display panel, and The bending plate is disposed at a position where at least a portion of the bending plate overlaps with a bending region of the first metal layer and a surface where the first metal layer and the second metal layer are bonded.

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