Chip mounting machine based on uniform coating

Abstract

The invention relates to the technical field of chip mounting machines, in particular to a chip mounting machine based on uniform coating, which comprises a conveying table and a mounting unit positioned on one side of the conveying table, a deformation type gluing unit is arranged on the conveying table, the deformation type gluing unit comprises an L-shaped frame, a linkage seat is fixedly mounted on the L-shaped frame, and the linkage seat is fixedly connected with the conveying table. The linkage seat is connected with a mounting plate through a trapezoidal seat; in the invention, the conveying belt is combined with the L-shaped anti-deviation plate and the material blocking strip to realize the positioning conveying of the chip substrates with different sizes, and the glue discharging unit and the deformation type gluing unit are linked to quantitatively discharge glue, so that the deformation type gluing unit can uniformly glue the chip substrates with different sizes, and meanwhile, the deformation type gluing unit can uniformly glue the chip substrates with different sizes. The problem of waste of redundant conductive adhesive is avoided, so that the chip mounting quality is improved; in addition, adaptive gluing treatment can be carried out on a circular or square chip substrate, so that the application range of the placement machine is expanded.

Description

Technical Field

[0001] The invention relates to the technical field of chip mounting machines, and in particular to a chip mounting machine based on uniform coating. Background Art

[0002] Conductive glue is a special adhesive that has stable conductive properties after curing or drying. It is mainly composed of two key components: one is metal powder with excellent conductivity, which shoulders the task of building a conductive path and is the core element for realizing the conductive function; the other is high molecular polymer, which has excellent bonding properties to tightly connect different materials and ensure the stability of the entire structure.

[0003] When multiple conductive materials such as integrated circuit chips need to be connected, conductive adhesive can flow smoothly between the connected materials to form a complete electrical path. Therefore, in the sophisticated and complex chip packaging process of integrated circuits, conduction becomes the only choice for the mounting process.

[0004] For example, in the prior art, there is a conductive glue quantitative injection mechanism for chip packaging with a publication number of CN111613553A. By adjusting the setting of the external structure of the sleeve and cooperating with the pressure spring on the movable sleeve, when coating chips of different models and sizes, the size of the enclosed space in the inner cavity of the injection sleeve can be flexibly adjusted to stably control the extrusion coating process of the conductive glue. However, the glue is discharged by squeezing the movable connecting rod to form a point-type glue coating method, which can only achieve the effect of quantitative discharge. For the coating process of the conductive glue, it is necessary to combine the chip and substrate mounting steps. However, the extrusion coating method makes it difficult to control the flow direction of the conductive glue and achieve comprehensive and uniform distribution of the conductive glue between the chip and the substrate, which greatly affects the subsequent mounting quality.

[0005] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0006] The object of the present invention is to provide a chip mounter based on uniform coating to solve the above-mentioned technical defects.

[0007] The objective of the present invention can be achieved through the following technical solutions: a chip mounter based on uniform coating, comprising a conveyor table, a conveyor belt installed on the conveyor table, and a mounting unit located on one side of the conveyor table, the conveyor table is provided with a deformable gluing unit, the deformable gluing unit comprises two sets of L-shaped frames with adjustable spacing, and a linkage seat is fixedly installed on the L-shaped frame, the linkage seat is connected to a mounting plate through a trapezoidal seat, a gluing rotary drum is installed between the mounting plates, a plurality of protrusions are fixedly connected to the annular outer wall of the gluing rotary drum, and a gluing brush is installed on the protrusion; The mounting plate is provided with a glue discharging unit cooperating with the deformable glue coating unit, the glue discharging unit comprises a glue storage box fixedly connected to the mounting plate, and a glue discharging seat is installed at the bottom of the glue storage box, and a plurality of glue discharging ports are equidistantly provided at the bottom of the glue discharging seat.

[0008] Preferably, a square tube slidably connected to the L-shaped frame is fixedly connected to the bottom of the conveying platform, and a servo motor is installed on the square tube, a gear is installed on the output shaft of the servo motor, and a toothed plate meshing with the gear is welded on the L-shaped frame.

[0009] Preferably, a protrusion slidably connected to the corresponding linkage seat inclined surface is fixedly connected to the trapezoidal seat, and a first spring is fixedly connected between one side of the protrusion and the linkage seat, and the trapezoidal seat is fixedly connected to the mounting plate.

[0010] Preferably, turntables rotatably connected to the mounting plates are installed on both sides of the gluing drum, a driving motor for driving the corresponding turntable to rotate is installed on one side of the mounting plate, a plurality of elastic rods are installed on the side wall of the gluing drum, and a plurality of support rods are hinged between the inner side wall of the gluing drum and the turntable.

[0011] Preferably, a glue outlet is slidably connected to the glue outlet, and a glue coating wheel that rolls with the glue coating drum is rotatably installed at the bottom opening end of the glue outlet.

[0012] Preferably, a one-way valve 1 communicating with the glue storage box is installed at the top of the glue outlet, a one-way valve 2 communicating with the glue outlet is installed at the top closed end of the glue outlet pipe, and a second spring is fixedly connected between the two sides of the glue outlet pipe and the glue outlet seat.

[0013] Preferably, a U-shaped frame is fixedly connected to one side of the glue outlet seat, and a hook plate cooperating with the glue outlet pipe is rotatably connected inside the U-shaped frame.

[0014] Preferably, a plurality of material blocking strips are equidistantly installed on the surface of the conveyor belt, and L-shaped anti-deflection plates are symmetrically arranged on both sides of the top of the conveyor belt, the L-shaped anti-deflection plates are connected to guide rods that slide with the conveyor platform, and an electric push rod is installed between the conveyor platform and the L-shaped anti-deflection plates.

[0015] Preferably, the mounting unit includes a base, and the top of the base is fixedly connected to a fixed cylinder, a lifting rod is slidably connected inside the fixed cylinder, the top of the lifting rod is fixedly connected to a cross plate, and suction pressure plates are symmetrically installed on both sides of the bottom of the cross plate, a screw rod is rotatably installed on the base, and a lifting block that rotates with the lifting rod is threadedly connected to the screw rod, and a lifting motor that drives the screw rod to rotate is installed on the base.

[0016] Preferably, vertical grooves are symmetrically provided on the inner walls on both sides of the fixed cylinder, and an oblique groove is provided between the tops of the vertical grooves, a guide block is fixedly connected in the vertical groove above the bottom of the oblique groove, and a spring pin cooperating with the vertical groove is installed on the lifting rod.

[0017] The beneficial effects of the present invention are as follows: (1) In the present invention, the positioning and conveying effect of chip substrates of different sizes is first achieved by combining a conveyor belt with an L-shaped anti-deflection plate and a material stopper strip with adjustable spacing. Then, the glue outlet pipe is prompted to move back and forth by the rotation of the glue coating drum and the plurality of protrusions on its outer wall. The protrusions abut against the glue coating wheel to cause it to rotate, thereby achieving quantitative discharge of the conductive glue. The discharged conductive glue is then applied to the glue coating brush. The conductive glue is evenly applied to the chip substrate by rotating the glue coating drum in the opposite direction to the conveyor belt. This can effectively avoid the problem in the prior art that the conductive glue is first applied in a point-type manner and then extruded through the mounting and pressing process, which makes it difficult for the conductive glue to be evenly distributed between the chip and the chip substrate, thereby affecting the mounting quality. (2) The present invention uses a servo motor to constantly adjust the distance between the two groups of L-shaped frames, squeeze the two sides of the glue coating drum, and cause the glue coating drum to first deform into a drum-shaped structure and then reset, so that the glue coating range of the glue coating brush can form a circular shape, thereby realizing the glue coating treatment of circular or square chip substrates, and further improving the application range of the chip mounting machine; and through the sliding of the relative inclined surfaces of the trapezoidal block and the linkage block, the glue coating drum is caused to synchronously rise when it is squeezed into a drum shape, thereby avoiding excessive squeezing of the chip substrate and the difficulty in automatically adjusting the glue coating range. When it is reset to a columnar shape, it is caused to synchronously descend, thereby avoiding the problem that the glue coating brush is difficult to effectively contact the chip substrate and cannot be glued; in addition, when the hook plate is engaged with the corresponding glue outlet pipe, the width of the glue coating on the glue coating drum can be adjusted, thereby realizing the glue coating treatment of chip substrates of different sizes and avoiding the problem of causing excess waste of conductive glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings; Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a schematic diagram of the cooperation between the deformation type glue coating unit and the glue discharging unit of the present invention; Figure 3 It is a structural schematic diagram of the deformation type glue coating unit of the present invention; Figure 4 The structure of the glue coating drum of the present invention is shown in FIG. Figure 1 ; Figure 5 The structure of the glue coating drum of the present invention is shown in FIG. Figure 2 ; Figure 6It is a structural schematic diagram of the glue discharging unit of the present invention; Figure 7 It is a schematic diagram of the cooperation between the glue outlet seat and the glue outlet pipe of the present invention; Figure 8 It is a structural schematic diagram of the mounting unit of the present invention.

[0019] Legend: 1. Conveyor platform; 11. Conveyor belt; 12. Square tube; 13. Servo motor; 14. Gear; 15. Tooth plate; 16. Material stopper; 17. L-shaped anti-deflection plate; 18. Electric push rod; 2. Mounting unit; 21. Fixed cylinder; 22. Lifting rod; 23. Suction plate; 24. Screw rod; 25. Lifting block; 26. Lifting motor; 3. Deformable glue coating unit; 31. L-shaped frame; 32. Linkage seat; 33. Trapezoidal seat; 34. Mounting plate; 35. Glue coating drum; 36. Raised portion; 37. Glue coating brush; 38. First spring; 39. Driving motor; 4. Glue discharging unit; 41. Glue storage box; 42. Glue discharging seat; 43. Glue discharging port; 44. Glue discharging pipe; 45. Glue coating wheel; 46. Second spring; 47. Hook plate. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figure 1 , Figure 2 and Figure 4-Figure 8 As shown, the problem that it is difficult to achieve comprehensive and uniform distribution of the conductive adhesive between the chip and the substrate in the prior art, which greatly affects the subsequent mounting quality, can be solved by the following solution; In this embodiment, a chip mounter based on uniform coating includes a conveyor table 1, and a conveyor belt 11 is installed on the conveyor table 1, and the conveyor belt 11 is used to automatically load and unload the chip substrate, and a mounting unit 2 located on one side of the conveyor table 1, and a deformable glue coating unit 3 is arranged on the conveyor table 1, and the deformable glue coating unit 3 includes two sets of L-shaped frames 31 with adjustable spacing, and a linkage seat 32 is fixedly installed on the L-shaped frame 31, and a mounting plate 34 is connected to the linkage seat 32 through a trapezoidal seat 33, and a glue coating rotary drum 35 is installed between the mounting plates 34, and a plurality of protrusions 36 are fixedly connected to the annular outer wall of the glue coating rotary drum 35, and a glue coating brush 37 is installed on the protrusion 36; The glue coating drum 35 rotates in a direction opposite to the conveyor belt 11, so that the glue coating brush 37 coated with the conductive glue on the glue coating drum 35 is in contact with the conveyed chip substrate, thereby achieving comprehensive and uniform glue coating of the chip substrate, effectively avoiding the problem in the prior art of using point-type glue coating and then extruding glue coating through the mounting and pressing process, which makes it difficult for the conductive glue to be evenly distributed between the chip and the chip substrate, greatly affecting the mounting quality; A glue discharging unit 4 cooperating with the deformable glue coating unit 3 is arranged on the mounting plate 34, and the glue discharging unit 4 includes a glue storage box 41 fixedly connected to the mounting plate 34, a glue injection port is provided on the top of the glue storage box 41, and a glue discharging seat 42 is installed at the bottom of the glue storage box 41, and a plurality of glue discharging ports 43 are equidistantly provided at the bottom of the glue discharging seat 42, and the conductive glue in the glue storage box 41 is discharged through the arranged glue discharging seat 42 and the glue discharging port 43, and then the glue coating brush 37 on the glue coating drum 35 is subjected to glue coating treatment.

[0022] Turntables rotatably connected to the mounting plates 34 are installed on both sides of the gluing drum 35. A driving motor 39 for driving the corresponding turntable to rotate is installed on one side of the mounting plate 34. The driving motor 39 drives the gluing drum 35 to rotate, and the rotation direction is opposite to the rotation direction of the conveyor belt 11. A plurality of elastic rods are installed on the side wall of the gluing drum 35, and a plurality of support rods are hinged between the inner side wall of the gluing drum 35 and the turntable. The plurality of support rods are arranged to cause the two groups of turntables to rotate synchronously, thereby preventing the gluing drum 35 from twisting and deformation.

[0023] A glue outlet pipe 44 is slidably connected to the glue outlet 43, and a glue coating wheel 45 that rolls with the glue coating drum 35 is rotatably installed at the bottom open end of the glue outlet pipe 44. During the rotation of the glue coating drum 35, the multiple protrusions 36 on its outer wall contact the glue coating wheels 45 on the multiple glue outlet pipes 44 one by one, which can push the glue outlet pipes 44 to move upward, and with the help of the rotation of the protrusions 36, the rotation of the glue coating wheel 45 is carried out, so that the conductive glue on the glue coating wheel 45 is applied to the glue coating brush 37 on the protrusions 36, thereby realizing the glue coating process of the chip substrate.

[0024] A one-way valve 1 in communication with the glue storage box 41 is installed at the top of the glue outlet 43, and a one-way valve 2 in communication with the glue outlet 43 is installed at the top closed end of the glue outlet pipe 44. A second spring 46 is fixedly connected between the two sides of the glue outlet pipe 44 and the glue outlet seat 42. When the plurality of protrusions 36 push the glue outlet pipe 44 to move upward one by one, the second spring 46 is compressed synchronously, and the conductive glue in the corresponding glue outlet 43 is squeezed into the glue outlet pipe 44 in combination with the one-way valve 1, and then discharged through the gap between the glue outlet pipe 44 and the glue coating wheel 45, so that the glue coating wheel 45 applies the quantitatively discharged conductive glue to the glue coating brush 37 on the protrusion 36; When the protrusion 36 is separated from the glue coating wheel 45, under the compression of the second spring 46, the glue outlet pipe 44 moves downward, and the conductive glue in the glue storage box 41 is extracted in combination with the one-way valve 2, and the conductive glue discharged from the glue outlet 43 is automatically replenished, and then with the rotation of the glue coating drum 35, the connected automatic and quantitative glue discharging process is realized. After the square chip substrate moves to the bottom of the glue coating drum 35, the glue coating brush 37 coated with conductive glue on the protrusion 36 contacts the square chip substrate, and the surface of the square chip substrate is evenly coated.

[0025] A U-shaped frame is fixedly connected to one side of the glue outlet seat 42, and a hook plate 47 cooperating with the glue outlet tube 44 is rotatably connected inside the U-shaped frame. Protrusions are set on both sides of the glue outlet tube 44, and a second spring 46 connects the protrusion and the glue outlet seat 42. According to the size of the chip substrate, the contact amount of the glue coating wheels 45 on the two groups of glue outlet seats 42 and the glue coating drum 35 is adjusted, and the excess glue outlet tube 44 is moved upward so that the hook plate 47 on the glue outlet seat 42 is engaged with the protrusion on the glue outlet tube 44, limiting the contact between the corresponding glue coating wheel 45 and the glue coating drum 35, controlling the width of the glue coating on the glue coating drum 35, and completing the glue coating processing of chip substrates of different sizes while avoiding the waste of excess conductive glue.

[0026] A plurality of blocking strips 16 are installed at equal intervals on the surface of the conveyor belt 11, and L-shaped anti-deflection plates 17 are symmetrically arranged on both sides of the top of the conveyor belt 11. The L-shaped anti-deflection plates 17 are connected to guide rods that slide with the conveyor platform 1 to increase the installation stability of the L-shaped anti-deflection plates 17. An electric push rod 18 is installed between the conveyor platform 1 and the L-shaped anti-deflection plates 17. A plurality of square chip substrates are placed on the conveyor belt 11 between two adjacent stopper strips 16, and the electric push rod 18 drives the two groups of L-shaped anti-deflection plates 17 to adjust the distance according to the width of the square chip substrates to adapt to the anti-deflection conveying of chip substrates of different sizes. The conveyor belt 11 rotates to carry out anti-deflection conveying of a plurality of square chip substrates, and during the conveying process, the two groups of L-shaped anti-deflection plates 17 carry out anti-deflection conveying on both sides of the square chip substrates on the conveying route, and combined with the sliding friction contact between the square chip substrates and the L-shaped anti-deflection plates 17 on both sides, the square chip substrates are prompted to produce relative movement on the conveyor belt 11 and initially contact with the stopper strip 16 on the retreating side thereof, and then the square chip substrates are further prompted to fit with the corresponding stopper strips 16 through the rotation of the glue coating drum 35 and the sliding friction contact between the raised portion 36 and the square chip substrate, and the square chip substrates are prompted to conflict with the stopper strip 16 on one side through the sliding contact between the square chip substrates and the L-shaped anti-deflection plates 17 on both sides, thereby completing the positioning and conveying of the square chip substrates.

[0027] The mounting unit 2 includes a base, and a fixed cylinder 21 is fixedly connected to the top of the base, a lifting rod 22 is slidably connected in the fixed cylinder 21, a cross plate is fixedly connected to the top of the lifting rod 22, and suction platens 23 are symmetrically installed on both sides of the bottom of the cross plate, a screw rod 24 is rotatably installed on the base, and a lifting block 25 that rotates with the lifting rod 22 is threadedly connected to the screw rod 24; Guide blocks are symmetrically connected to both sides of the lifting block 25. A guide groove that slides with the guide block is opened inside the fixed cylinder 21 to limit the rotation of the lifting block 25. A lifting motor 26 that drives the screw rod 24 to rotate is installed on the base. The chips are transported through an external conveyor belt (not shown). The lifting motor 26 drives the screw rod 24 to rotate. The screw rod 24 combines with the lifting block 25 to drive the lifting rod 22 to move downward, and the chip is adsorbed and grabbed through a suction pressure plate 23 on one side.

[0028] Vertical grooves are symmetrically provided on the inner walls of both sides of the fixed cylinder 21, and the tops of the vertical grooves are connected to the oblique grooves, and a guide block is fixedly connected to the vertical grooves above the bottom of the oblique grooves, and a spring pin that cooperates with the vertical grooves is installed on the lifting rod 22; The lifting motor 26 drives the screw rod 24 to reverse, and the lifting rod 22 moves upward. The spring pin first slides in the vertical groove, and then enters the oblique groove under the guidance of the guide block, thereby driving the cross plate to rotate 180°, and the suction plate 23 that is adsorbed and grabbed is placed above the conveyor belt 11. The screw rod 24 rotates forward again, and a group of suction platens 23 grabs the next chip. A group of suction platens 23 carries the chip downward, and the square chip substrate after glue coating moves to the bottom of the chip. The mounting process is completed as the suction platen 23 descends, and the next chip is grabbed at the same time, thereby improving the chip mounting efficiency.

[0029] Example 2: Please refer to Figure 2-Figure 5 and Figure 7 As shown, the problem of difficulty in anti-waste glue coating on chip substrates of various shapes can be solved by the following solution; In this embodiment, a square tube 12 slidably connected to the L-shaped frame 31 is fixedly connected to the bottom of the conveying platform 1, and a servo motor 13 is installed on the square tube 12, and a gear 14 is installed on the output shaft of the servo motor 13. A tooth plate 15 meshing with the gear 14 is welded on the L-shaped frame 31. When the circular chip substrate is glued, the servo motor 13 drives the gear 14 to rotate, and the gear 14 meshes with the tooth plates 15 on both sides to drive the two sets of L-shaped frames 31 to move relative to each other; The glue coating drum 35 is caused to deform into a drum-shaped structure to reduce the glue coating area. The edge of the circular chip substrate in the moving direction is first coated with glue. Then, as the circular chip moves, the servo motor 13 drives the gear 14 to reverse, and the two sets of L-shaped frames 31 move away from each other. The glue coating drum 35 is reset to increase the glue coating area. Then, the servo motor 13 drives the L-shaped frame 31 to move relative to each other, and the coating range is reduced again, thereby completing the glue coating process of the circular chip substrate. When the glue coating drum 35 forms a drum shape, it causes the ends of the glue coating wheels 45 on the several glue outlet pipes 44 in contact with it to form a matching arc structure. With this as contact, the multiple protrusions 36 on the outer wall of the glue coating drum 35 are then carried to rotate, causing the multiple protrusions 36 to contact the glue coating wheels 45 in turn, causing the multiple glue outlet pipes 44 to move back and forth at equal distances, and then combined with the one-way valve, the effect of applying equal amounts of glue to the glue coating brushes in each area is achieved.

[0030] A convex block is fixedly connected to the trapezoidal seat 33 and is slidably connected to the corresponding inclined surface of the linkage seat 32, so as to realize relative sliding between the inclined surface of the trapezoidal seat 33 and the inclined surface of the linkage seat 32, and a first spring 38 is fixedly connected between one side of the convex block and the linkage seat 32. The trapezoidal seat 33 is fixedly connected to the mounting plate 34, and the two groups of L-shaped frames 31 move relative to each other. The inclined surfaces of the linkage seat 32 and the trapezoidal seat 33 slide relative to each other, and the height of the glue coating rotating drum 35 is synchronously raised to avoid excessive squeezing of the chip substrate, thereby making it difficult to automatically adjust the glue coating range. The two groups of L-shaped frames 31 move away from each other and synchronously lower the height of the glue coating drum 35 to avoid the problem that the glue coating brush 37 has difficulty in effectively contacting the chip substrate and cannot be glued. The compression elastic force of multiple first springs 38 cooperates to assist the glue coating drum 35 to deform first and then adjust the height, thereby realizing the adjustment of the coating range of chip substrates of different shapes.

[0031] Turntables rotatably connected to the mounting plate 34 are installed on both sides of the glue coating drum 35. A driving motor 39 for driving the corresponding turntable to rotate is installed on one side of the mounting plate 34. A plurality of elastic rods are installed on the side wall of the glue coating drum 35. The elastic rods are used to increase the compression deformation resistance of the glue coating drum 35, so that when the plurality of protrusions 36 rotate, they can effectively combine with the second spring 46 to push the glue outlet pipe 44 to reciprocate, so as to achieve the expected glue outlet effect. A plurality of support rods are hinged between the inner wall of the glue coating drum 35 and the turntable. The hinged support rods can assist the middle part of the glue coating drum 35 to swell when the two sets of mounting plates 34 move relative to each other, thereby further assisting in changing the glue coating range.

[0032] Example 3: Please refer to Figure 1-Figure 8 As shown, the present invention also proposes a method for using a chip mounter based on uniform coating, comprising the following steps: Step 1: Place multiple square chip substrates on the conveyor belt 11 between two adjacent stopper strips 16, and adjust the distance between the two sets of L-shaped anti-deflection plates 17 driven by the electric push rod 18 according to the width of the square chip substrates. The conveyor belt 11 rotates to prevent the multiple square chip substrates from deflecting. During the conveying process, the square chip substrates are in sliding contact with the L-shaped anti-deflection plates 17 on both sides, so that the square chip substrates are in contact with the stopper strip 16 on one side, thereby completing the positioning and conveying of the square chip substrates. Step 2: The driving motor 39 drives the glue coating drum 35 to rotate, and the rotation direction is opposite to the rotation direction of the conveyor belt 11. During the rotation of the glue coating drum 35, the multiple protrusions 36 on the outer wall thereof contact the glue coating wheels 45 on the multiple glue outlet pipes 44 one by one, and push the glue outlet pipes 44 to move upward, compress the second spring 46, and in combination with the one-way valve 1, squeeze the conductive glue in the corresponding glue outlet 43 into the glue outlet pipe 44, and then discharge it through the gap between the glue outlet pipe 44 and the glue coating wheel 45. With the help of the rotation of the protrusion 36 and the rotation of the glue coating wheel 45, the conductive glue is applied to the glue coating brush 37 on the protrusion 36. After the protrusion 36 is separated from the glue coating wheel 45, under the compression of the second spring 46, the glue outlet pipe 44 moves downward, and in combination with the one-way valve 2, the conductive glue in the glue storage box 41 is extracted, and the conductive glue discharged from the glue outlet 43 is replenished; Step 3: After the square chip substrate moves to the bottom of the glue coating drum 35, the glue coating brush 37 coated with conductive glue on the protrusion 36 contacts the square chip substrate, and then the surface of the square chip substrate is fully and evenly coated. The chip is transported by the external conveyor belt, and the lifting motor 26 drives the screw rod 24 to rotate. The screw rod 24 and the lifting block 25 drive the lifting rod 22 to move downward, and the chip is adsorbed and grabbed by the suction plate 23 on one side; Step 4: The lifting motor 26 drives the screw rod 24 to reverse, and the lifting rod 22 moves upward. The spring pin first slides in the vertical slot, and then enters the oblique slot under the guidance of the guide block, thereby driving the cross plate to rotate 180 degrees, and the suction plate 23 that is adsorbed and grabbed is placed above the conveyor belt 11. The screw rod 24 rotates forward again, and a group of suction platens 23 grabs the next chip. A group of suction platens 23 carries the chip downward, and the square chip substrate after glue coating moves to the bottom of the chip. The placement process is completed with the descent of the suction platen 23, and the next chip is grabbed at the same time; Step 5: When applying glue to the circular chip substrate, the servo motor 13 drives the gear 14 to rotate, and the gear 14 meshes with the toothed plates 15 on both sides to drive the two groups of L-shaped frames 31 to move relative to each other. The linkage seat 32 and the inclined surface of the trapezoidal seat 33 slide relative to each other, and the cooperation of multiple first springs 38 causes the glue coating drum 35 to be deformed into a drum-shaped structure. At the same time, the height of the glue coating drum 35 is raised to reduce the glue coating area. The edge of the circular chip substrate in the moving direction is firstly applied with glue. Then, as the circular chip moves, the servo motor 13 drives the gear 14 to reverse, and the two groups of L-shaped frames 31 move away from each other. The glue coating drum 35 is reset, and the height is lowered to increase the glue coating area. Then, the servo motor 13 drives the L-shaped frame 31 to move relative to each other to complete the glue coating process of the circular chip substrate. Step six: According to the size of the square chip substrate or the round chip substrate, adjust the contact amount between the glue coating wheels 45 on the two sets of glue outlet seats 42 and the glue coating drum 35, move the excess glue outlet tube 44 upward, and make the hook plate 47 on the glue outlet seat 42 engage with the protrusion on the glue outlet tube 44, limit the contact between the corresponding glue coating wheel 45 and the glue coating drum 35, control the glue coating range, complete the glue coating process of square chip substrates or round chip substrates of different sizes, and avoid wasting excess conductive glue.

[0033] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip mounting machine based on uniform coating, comprising a conveyor table (1), a conveyor belt (11) being installed on the conveyor table (1), and a mounting unit (2) located on one side of the conveyor table (1), characterized in that: The conveying platform (1) is provided with a deformable gluing unit (3), the deformable gluing unit (3) comprising two sets of L-shaped frames (31) with adjustable spacing, and a linkage seat (32) is fixedly mounted on the L-shaped frame (31), a mounting plate (34) is connected to the linkage seat (32) via a trapezoidal seat (33), a gluing rotating drum (35) is mounted between the mounting plates (34), a plurality of protrusions (36) are fixedly connected to the annular outer wall of the gluing rotating drum (35), and a gluing brush (37) is mounted on the protrusion (36); A glue discharging unit (4) cooperating with the deformable glue coating unit (3) is arranged on the mounting plate (34), the glue discharging unit (4) comprising a glue storage box (41) fixedly connected to the mounting plate (34), a glue discharging seat (42) being installed at the bottom of the glue storage box (41), and a plurality of glue discharging ports (43) being equidistantly provided at the bottom of the glue discharging seat (42).

2. The chip mounter based on uniform coating according to claim 1, characterized in that: A square tube (12) slidably connected to the L-shaped frame (31) is fixedly connected to the bottom of the conveying platform (1), a servo motor (13) is mounted on the square tube (12), a gear (14) is mounted on the output shaft of the servo motor (13), and a toothed plate (15) meshing with the gear (14) is welded to the L-shaped frame (31).

3. The chip mounter based on uniform coating according to claim 1, characterized in that: A protrusion that is slidably connected to the corresponding inclined surface of the linkage seat (32) is fixedly connected to the trapezoidal seat (33), and a first spring (38) is fixedly connected between one side of the protrusion and the linkage seat (32). The trapezoidal seat (33) is fixedly connected to the mounting plate (34).

4. The chip mounter based on uniform coating according to claim 1, characterized in that: Rotating discs rotatably connected to the mounting plates (34) are mounted on both sides of the gluing drum (35); a driving motor (39) for driving the corresponding rotating disc to rotate is mounted on one side of the mounting plates (34); a plurality of elastic rods are mounted on the side wall of the gluing drum (35); and a plurality of supporting rods are hinged between the inner side wall of the gluing drum (35) and the rotating disc.

5. The chip mounter based on uniform coating according to claim 1, characterized in that: A glue outlet pipe (44) is slidably connected to the glue outlet (43), and a glue coating wheel (45) that rolls with the glue coating rotating drum (35) is rotatably mounted on the bottom opening end of the glue outlet pipe (44).

6. The chip mounter based on uniform coating according to claim 5, characterized in that: A first one-way valve in communication with the glue storage box (41) is installed at the top of the glue outlet (43), a second one-way valve in communication with the glue outlet (43) is installed at the top closed end of the glue outlet pipe (44), and a second spring (46) is fixedly connected between the two sides of the glue outlet pipe (44) and the glue outlet seat (42).

7. The uniform coating based chip mounter according to claim 6, characterized in that: A U-shaped frame is fixedly connected to one side of the glue outlet seat (42), and a hook plate (47) that matches the glue outlet pipe (44) is rotatably connected inside the U-shaped frame.

8. The uniform coating based chip mounter according to claim 1, characterized in that: The surface of the conveyor belt (11) is provided with a plurality of material blocking strips (16) equidistantly mounted thereon, and L-shaped anti-deflection plates (17) are symmetrically mounted on both sides of the top of the conveyor belt (11), the L-shaped anti-deflection plates (17) being connected to guide rods that slide with the conveyor platform (1), and an electric push rod (18) being mounted between the conveyor platform (1) and the L-shaped anti-deflection plates (17).

9. The chip mounter based on uniform coating according to claim 1, characterized in that: The mounting unit (2) comprises a base, and a fixed cylinder (21) is fixedly connected to the top of the base, a lifting rod (22) is slidably connected inside the fixed cylinder (21), a cross plate is fixedly connected to the top of the lifting rod (22), and suction pressure plates (23) are symmetrically installed on both sides of the bottom of the cross plate, a screw rod (24) is rotatably installed on the base, and a lifting block (25) that rotates with the lifting rod (22) is threadedly connected to the screw rod (24), and a lifting motor (26) that drives the screw rod (24) to rotate is installed on the base.

10. The uniform coating based chip mounter according to claim 9, characterized in that: Vertical grooves are symmetrically provided on the inner walls of both sides of the fixed cylinder (21), and an oblique groove is provided between the tops of the vertical grooves. A guide block is fixedly connected to the vertical groove above the bottom of the oblique groove, and a spring pin that cooperates with the vertical groove is installed on the lifting rod (22).

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