Method for cleaning photoresist coating machine

By adopting a self-cleaning Cup design structure in the photoresist coating machine, automatic cleaning is achieved, and the problem of dirty walls of the Cup is solved, which improves production efficiency and reduces costs.

CN119733719APending Publication Date: 2025-04-01RESEARCH ON RIYUE NEW ADVANCED TECHNOLOGY (KUNSHAN) CO LTD
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Patent Information

Application Number
CN202510036869.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-09
Publication Date
2025-04-01

AI Technical Summary

Technical Problem

In the existing photoresist coating technology, the dirty problem of Cup inner wall causes photoresist to splash back into the wafer, affecting the wafer yield, and the traditional manual cleaning method is time-consuming and labor-intensive and costly.

Method used

The self-cleaning Cup design structure is adopted, including a photoresist spraying unit, an upper cover unit, a cup cavity and a gas liquid supply and collection unit, to realize automated cleaning and reduce manual intervention.

Benefits of technology

It greatly shortens cleaning time, reduces equipment downtime, improves production efficiency, reduces comprehensive costs, and reduces human, material and financial resources consumption.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a photoresist coating machine cleaning method, and belongs to the technical field of photoresist coating. A self-cleaning Cup design structure is adopted for cleaning, and the design structure comprises a photoresist spraying unit used for spraying a photoresist; the upper covering unit is used for covering the cup when the cup is coated and cleaned so as to prevent the Particle from falling into the cup and prevent the liquid medicine from splashing when the cup is cleaned; the Cup cavity is used for coating and cleaning a photoresist; and the gas and liquid supplying and collecting unit is used for supplying and recycling the cleaning liquid and the gas. According to the Cup inner wall self-cleaning structure device and the cleaning mode, compared with traditional manual operation, the cleaning time consumption is greatly shortened, the equipment downtime is shortened, the overall production efficiency is improved, a large amount of production cost is reduced, the number of chips does not need to be manually and frequently monitored, Cup replacement does not need to be manually and frequently conducted, the purchasing and maintaining cost of multiple Cup sets is reduced, and the cleaning efficiency is improved. And the consumption of manpower, material resources and financial resources is remarkably reduced, and the method can be applied to all subsequent Bumping packaging fields.
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Description

Technical Field

[0001] The invention belongs to the technical field of photoresist coating, and in particular relates to a photoresist coating machine cleaning method. Background Art

[0002] When applying photoresist, the nozzle sprays the photoresist onto the wafer surface, and the rotary motor controls the wafer to rotate and throw out the excess photoresist, so that a uniform photoresist layer is formed on the wafer surface. The thrown-out photoresist will hit the inner wall of the Cup, causing contamination on the inner wall of the Cup. When a certain amount accumulates, it will splash back onto the wafer, resulting in a loss of wafer yield.

[0003] In order to solve the problem of dirty inner wall of coating cup, the industry generally improves it by regularly replacing and cleaning the cup. The specific method is as follows: manually accumulate the number of cups produced; replace the cup when the number of cups produced is reached; replace with a new cup; soak and clean the replaced cup; clean the cup; replace it again and repeat the above steps. However, this method requires manual replacement and cleaning of the cup according to the number of cups, which is easy to forget. In addition, cleaning also requires the preparation of a specific liquid tank, which takes a long time to clean and requires the preparation of multiple sets of cups, which is time-consuming, labor-intensive and consumable. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention starts from structural design and cleaning process optimization, and proposes a photoresist coater cleaning method to achieve efficient and automated photoresist coater cleaning, improve production efficiency and reduce overall cost.

[0005] In order to achieve the above object, the following technical scheme is adopted: The present invention provides a photoresist coating machine cleaning method, which adopts a self-cleaning Cup design structure for cleaning, and the design structure includes:

[0006] Photoresist spraying unit, used for spraying photoresist;

[0007] The upper cover unit is used to cover the cup when coating and cleaning the cup to prevent particles from falling in and the liquid from splashing when cleaning the cup;

[0008] Cup chamber, used for photoresist coating and cleaning;

[0009] Gas and liquid supply and collection unit for supply and recovery of cleaning liquids and gases.

[0010] Furthermore, the photoresist spraying unit is composed of a photoresist bottle, a glue pump, a glue hose, and a glue nozzle;

[0011] The upper covering unit is composed of an upper cover, a screw cap, a magnetic adsorption unit, and a nitrogen nozzle unit;

[0012] The Cup chamber is composed of a Chuck unit, a Cup unit, a cleaning liquid nozzle, a waste liquid collection port, and a rotating motor;

[0013] The gas and liquid supply and collection unit is composed of a waste liquid collection tank, a cleaning liquid tank, a nitrogen supply end, a waste liquid collection pipeline, a cleaning liquid supply pipeline, a nitrogen pipeline, and flow valves arranged on the cleaning liquid supply pipeline and the nitrogen pipeline.

[0014] Furthermore, the flow rate of the nitrogen nozzle is adjustable, and the upper covering unit is rotatable.

[0015] Furthermore, the angle of the cleaning liquid nozzle can be adjusted arbitrarily, and the waste liquid collection port can be opened and closed.

[0016] The beneficial effects of the present invention are as follows: compared with traditional manual operations, the Cup inner wall self-cleaning structure device and cleaning method proposed in the present invention greatly shorten the cleaning time, reduce equipment downtime, improve overall production efficiency, and save a lot of production costs. There is no need for manual frequent monitoring of the number of pieces and replacement of Cups, which reduces the purchase and maintenance costs of multiple sets of Cups, and the consumption of manpower, material resources, and financial resources are significantly reduced. It can be applied to all back-end bumping packaging fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The schematic diagram of the structure of the self-cleaning Cup design structure used in the photoresist coating machine cleaning method of the present invention.

[0018] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0019] Legend: 1. Photoresist spraying unit; 101. Photoresist bottle; 102. Glue pump; 103. Glue hose; 104. Glue nozzle; 2. Upper covering unit; 201. Upper cover; 202. Screw cap and magnetic adsorption unit; 203. Nitrogen nozzle unit; 3. Cup cavity; 301. Chuck unit; 302. Cup unit; 303. Cleaning liquid nozzle; 304. Waste liquid collection port; 305. Rotating motor; 4. Gas and liquid supply and collection unit; 401. Waste liquid collection tank; 402. Cleaning liquid tank; 403. Nitrogen supply end; 404. Waste liquid collection pipeline; 405. Cleaning liquid supply pipeline; 406. Nitrogen pipeline; 407. Flow valve. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0021] Unless otherwise defined, all professional and scientific terms used herein have the same meanings as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to those described herein may be applied to the present invention. The preferred implementation methods and materials described herein are for demonstration purposes only and are not intended to limit the content of this application.

[0022] The experimental methods in the following examples are conventional methods unless otherwise specified, and the experimental materials used in the following examples are purchased from commercial channels unless otherwise specified.

[0023] Example

[0024] A photoresist coating machine cleaning method adopts a self-cleaning Cup design structure for cleaning, the design structure comprising:

[0025] The photoresist spray unit is used for spraying photoresist. It is a key component for precise coating of photoresist, ensuring that the wafer surface can be evenly covered with photoresist, laying the foundation for subsequent chip manufacturing processes. It consists of a photoresist bottle, a glue pump, a rubber hose, and a glue nozzle. The photoresist bottle, as a storage container for photoresist, has good sealing and stability, and can effectively prevent the volatilization and deterioration of the photoresist; the glue pump is responsible for providing a stable delivery pressure, accurately controlling the flow of photoresist, and ensuring the consistency of each spraying amount; the rubber hose is made of chemically resistant materials to ensure that the photoresist is not contaminated during the transmission process; the glue nozzle is specially designed, and its outlet shape and size are adapted to the wafer coating requirements, to achieve uniform atomization and spraying of photoresist, laying the foundation for subsequent chip manufacturing processes;

[0026] The upper covering unit is used to cover the cup when coating and cleaning the cup to prevent particles from falling in and liquid from splashing when cleaning the cup. This design greatly ensures the cleanliness of the cleaning environment and avoids secondary contamination of the cup and the surrounding working area by external impurities. It consists of an upper cover, a screw cap, a magnetic adsorption unit, and a nitrogen nozzle unit. The upper cover is made of lightweight and high-strength material, which is easy to open and close while ensuring protective performance; the screw cap structure is cleverly designed and fits tightly with the upper cover to achieve rapid rotation to meet protection needs at different angles; the magnetic adsorption unit has a built-in strong magnet, which can instantly generate strong suction when the upper cover is closed to ensure that the upper cover is tightly closed and effectively block the entry of tiny particles from the outside; the nitrogen nozzle unit is connected to a pure nitrogen source. In a specific cleaning stage, it can spray a high-speed nitrogen flow to clean up the tiny particles attached to the surface of the cup and the upper cover to remove potential pollution;

[0027] The Cup cavity, used for photoresist coating and cleaning, is one of the core areas of the entire process, carrying the photoresist coating and subsequent cleaning tasks. It consists of a Chuck unit, a Cup unit, a cleaning liquid nozzle, a waste liquid collection port, and a rotating motor. The Chuck unit provides a stable support platform for the wafer. Its surface has been specially treated to have good adsorption and wear resistance, ensuring that the wafer does not move during high-speed rotation. The Cup unit is made of chemically resistant and easy-to-clean materials, and its inner wall is smooth to reduce the probability of residual photoresist adhesion. The cleaning liquid nozzle is installed at a key position inside the Cup cavity. Through a special universal adjustment structure, the angle can be adjusted arbitrarily to ensure that the cleaning liquid can be sprayed to every corner of the Cup cavity without leaving a dead corner for cleaning. The waste liquid collection port is designed at the lowest point at the bottom of the Cup cavity. The opening and closing is controlled by an electromagnetic valve, which can accurately control the timing of waste liquid discharge to prevent waste liquid leakage. It is connected to an external waste liquid collection tank to promptly remove cleaning waste liquid and maintain the cleanliness of the cavity. The rotating motor uses a high-precision, high-speed model with a strong torque output, which can stably drive the Cup unit to rotate and cooperate with the cleaning liquid nozzle to achieve a full range of cleaning effects.

[0028] The gas and liquid supply and collection unit is used for the supply and recovery of cleaning liquids and gases. It provides a continuous source of power and material support for the cleaning process, ensuring the continuity and stability of the cleaning operation. It consists of a waste liquid collection tank, a cleaning liquid tank, a nitrogen supply end, a waste liquid collection pipeline, a cleaning liquid supply pipeline, a nitrogen pipeline, and flow valves arranged on the cleaning liquid supply pipeline and the nitrogen pipeline. The waste liquid collection tank has a large volume and is made of corrosion-resistant materials, which can safely store a large amount of cleaning waste liquid; the cleaning liquid tank is equipped with an intelligent liquid level monitoring system to grasp the cleaning liquid reserves in real time to ensure uninterrupted supply, and the internal cleaning liquid can be pre-prepared with a variety of formulas according to different cleaning needs; the nitrogen supply end is connected to a high-pressure nitrogen source, and after decompression and filtration, pure nitrogen is provided to the nitrogen pipeline; the waste liquid collection pipeline is connected to the waste liquid collection port and the waste liquid collection tank, and pipes with strong corrosion resistance and good sealing are selected to ensure smooth discharge of waste liquid; the cleaning liquid supply pipeline connects the cleaning liquid tank with the cleaning liquid nozzle, and realizes the precise supply of cleaning liquid on demand by accurately controlling the flow valve on the pipeline; the nitrogen pipeline connects the nitrogen supply end with the nitrogen nozzle unit, and also uses the flow valve to regulate the nitrogen flow to meet different purge intensity requirements.

[0029] The flow rate of the nitrogen nozzle is adjustable, and the nitrogen purge strength can be flexibly adjusted according to different cleaning requirements. The flow rate adjustment range is wide, ranging from gentle breeze-style purge to strong storm-style purge, which can meet the cleaning requirements of the Cup at different levels of dirtiness. The upper covering unit can be rotated, driven by a motor or manually rotating the mechanism, so as to facilitate multi-angle coverage during the cleaning process and improve the cleaning effect. The rotation angle can be precisely controlled, and whether it is horizontal rotation or vertical flipping, it can be accurately positioned to ensure that every potential contaminated area can be effectively treated.

[0030] The angle of the cleaning liquid nozzle can be adjusted arbitrarily. With the help of precise universal joints and electric adjustment devices, the operator can remotely control it or automatically control it through a preset program to ensure that the cleaning liquid can be sprayed to every corner of the Cup cavity without leaving any cleaning dead corners. The waste liquid collection port can be opened and closed freely, and adopts advanced electromagnetic induction valves with fast response speed and good sealing. It can accurately control the timing of waste liquid discharge to prevent waste liquid leakage. At the same time, it has fault self-detection and alarm functions. Once abnormal closure is not tight, the operator can be notified in time to handle it.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0032] The present invention and its implementation methods are described above, which is not restrictive. The drawings are only one of the implementation methods of the present invention, and the actual application is not limited thereto. In short, if ordinary technicians in the field are inspired by it and design methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention, they should all fall within the protection scope of the present invention.

Claims

1. A photoresist coating machine cleaning method, characterized in that: A self-cleaning Cup design structure is used for cleaning, and the design structure includes: Photoresist spraying unit, used for spraying photoresist; The upper cover unit is used to cover the cup when coating and cleaning the cup to prevent particles from falling in and the liquid from splashing when cleaning the cup; Cup chamber, used for photoresist coating and cleaning; Gas and liquid supply and collection unit for supply and recovery of cleaning liquids and gases.

2. The photoresist coating machine cleaning method according to claim 1, characterized in that: The photoresist spraying unit is composed of a photoresist bottle, a glue pump, a glue hose and a glue nozzle.

3. The photoresist coating machine cleaning method according to claim 2, characterized in that: The upper covering unit is composed of an upper cover, a screw cap, a magnetic adsorption unit, and a nitrogen nozzle unit.

4. The photoresist coating machine cleaning method according to claim 3, characterized in that: The Cup cavity is composed of a Chuck unit, a Cup unit, a cleaning liquid nozzle, a waste liquid collection port, and a rotating motor.

5. The photoresist coating machine cleaning method according to claim 4, characterized in that: The gas and liquid supply and collection unit is composed of a waste liquid collection tank, a cleaning liquid tank, a nitrogen supply end, a waste liquid collection pipeline, a cleaning liquid supply pipeline, a nitrogen pipeline, and flow valves arranged on the cleaning liquid supply pipeline and the nitrogen pipeline.

6. The photoresist coating machine cleaning method according to claim 5, characterized in that: The flow rate of the nitrogen nozzle is adjustable, and the upper covering unit is rotatable.

7. The photoresist coating machine cleaning method according to claim 6, characterized in that: The angle of the cleaning liquid nozzle can be adjusted arbitrarily, and the waste liquid collection port can be opened and closed.

Citation Information

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