A semiconductor wafer photoelectrochemical mechanical polishing processing device and processing method thereof

Abstract

The invention relates to the technical field of wafer polishing, and discloses a semiconductor wafer photoelectrochemical mechanical polishing processing device and a processing method thereof. The device comprises an electric telescopic rod, the bottom of which is fixedly connected with a mounting frame, the bottom of which is fixedly connected with a motor, when in use, the power of the motor and the electric telescopic rod is turned on, the motor drives a gear ring and an input pipe to rotate through a driving gear, the input pipe drives the bottom fixed frame and a grinding pad to rotate regularly through a mounting box, forcing an L-shaped support rod to slide outward, a water outlet gap is formed between a bevel groove and a water outlet chute, a chemical solution in a water storage tank reaches the inside of a water retaining ring through the above water outlet gap, and the water source in the water retaining ring enters the inside of a water outlet pipe through a water outlet hole, and is sprayed outward from the other end of the water outlet hole, the water flow in the water outlet pipe is also affected by centrifugal force, diffuses to all sides, increases the contact area between the chemical solution and the grinding pad, and indirectly improves the polishing efficiency of the chemical solution.

Description

Technical Field

[0001] The invention relates to the technical field of wafer polishing equipment, in particular to a semiconductor wafer photoelectrochemical mechanical polishing processing device and a processing method thereof. Background Art

[0002] When GaN and SiC crystal materials are used as devices, they are required to have high surface quality, no scratches, microcracks, low dislocations, residual stress and other surface / subsurface damage. However, GaN and SiC crystal materials have large bond energy, strong chemical inertness, and almost no chemical reaction with any acid or alkali reagents at room temperature. They are typical hard and brittle materials that are difficult to process. In the processing of these two types of materials, diamond abrasives are usually used for grinding and lapping to achieve good surface quality and high flatness.

[0003] Among them, when the wafer is subjected to photoelectrochemical mechanical polishing, most of the chemical solution output ends and the polishing device are designed to be separated. In addition, during polishing, the crystal plate will rotate synchronously with the chassis, and the centrifugal force generated will force the chemical solution to diffuse around the wafer, reducing the polishing efficiency of the chemical solution and the polishing device. In response to the above problems, the following solutions are proposed. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a semiconductor wafer photoelectrochemical mechanical polishing processing device, comprising an electric telescopic rod, the bottom of the electric telescopic rod is fixedly connected to a mounting frame, the bottom of the mounting frame is fixedly connected to a motor, the output end of the motor is fixedly connected to a driving gear, and the inner wall of the mounting frame is fixedly connected to a water inlet pipe;

[0005] The grinding mechanism includes an input pipe rotatably connected to the inner wall of the mounting frame, an end of the input pipe away from the mounting frame is connected to a mounting box, the bottom of the mounting box is fixedly connected to a fixing frame, the bottom of the fixing frame is fixedly connected to a grinding pad, the outer wall of the input pipe is fixedly connected to a gear ring 1, and the outer wall of the mounting box is fixedly connected to a water retaining assembly;

[0006] The feeding mechanism includes eight water outlet holes opened at the bottom of the installation box, the inner walls of the eight water outlet holes are connected with water outlet pipes, the inner wall of the installation box is fixedly connected with a water storage tank, the inner wall of the installation box is fixedly connected with a water retaining ring, and the side wall of the water storage tank is fixedly connected with a discharge assembly.

[0007] Preferably, the discharge assembly includes a water outlet chute provided on the side wall of the water storage tank, an L-shaped support rod is slidably connected to the inner wall of the water outlet chute, and an inclined groove is provided on the outer wall of the L-shaped support rod.

[0008] Preferably, the discharge assembly also includes a spring telescopic rod fixedly connected to the side wall of the L-shaped support rod, one end of the spring telescopic rod away from the L-shaped support rod is fixedly connected to the inner wall of the water tank, and one end of the L-shaped support rod away from the spring telescopic rod is fixedly connected to a counterweight block. When in use, the electric telescopic rod is installed in the required position, and it is ensured that the chemical solvent shell reaches the inside of the water tank through the water inlet pipe and the input pipe. Then, the staff turns on the power of the motor and the electric telescopic rod. At this time, the motor drives the gear ring 1 and the input pipe to rotate through the driving gear, and the input pipe drives the bottom fixing frame and the grinding pad to rotate regularly through the installation box, thereby realizing the grinding function of the grinding pad; wherein, During the rotation of the installation box, the installation box will generate centrifugal force, which forces the L-shaped support rod and the counterweight to slide outward along the inner wall of the water outlet chute. The spring telescopic rod is compressed and deformed. At this time, a water outlet gap will be formed between the inclined groove and the water outlet chute. The chemical solution inside the water storage tank reaches the inside of the water retaining ring through the above water outlet gap, and the water source inside the water retaining ring enters the inside of the water outlet pipe through the water outlet hole, and is sprayed outward from the other end of the water outlet hole and acts on the outer wall of the chip. In this process, the water flow inside the water outlet pipe is also affected by the centrifugal force and diffuses to the surroundings, thereby increasing the contact area between the chemical solution and the grinding pad, and indirectly improving the polishing efficiency of the chemical solution.

[0009] Preferably, the discharge assembly also includes a sliding rod fixedly connected to the side wall of the counterweight block, the side wall of the sliding rod is slidably connected due to the inner wall of the through hole of the water retaining ring, the end of the sliding rod away from the counterweight block is fixedly connected to a gear rod, the top of the mounting box is rotatably connected to gear one, and the top of gear one is fixedly connected to gear two.

[0010] Preferably, the discharge assembly also includes a gear ring rotatably connected to the inner wall of the installation box, the side wall of gear one is meshedly connected with the side wall of the gear rod, the side wall of gear two is meshedly connected with the side wall of the gear ring, and the outer wall of the gear ring one is meshedly connected with the outer wall of the driving gear. Utilizing the characteristics of the counterweight block and the L-shaped support rod being compressed and diffused to the surroundings, a gear ring and gear two are arranged inside the equipment. When the counterweight block expands outward due to centrifugal force, the counterweight block pushes the sliding rod to move outward, and the sliding rod drives the gear rod to move outward synchronously, and the gear rod drives the top gear two to rotate synchronously through gear one. The gear two rotates and drives the gear ring on the side wall to rotate synchronously. Through the application of the above-mentioned components, the rotation angle of the gear ring will control the rotation angles of multiple gear twos, and the rotation angles of multiple gear twos are relative, which will push the corresponding gear rods, sliding rods and counterweight blocks to move. In this process, the distances between the multiple counterweight blocks and the gear rod and the center of the equipment are equal, ensuring that the distances between the multiple counterweight blocks and the center of the circle are equal, avoiding the displacement of the rotation center of gravity of the equipment due to unequal lengths, affecting the stability of the equipment, causing the center of gravity of the equipment to shift during polishing, and affecting the polishing efficiency.

[0011] Preferably, the water retaining assembly includes a slide groove opened at the side wall of the installation box, a retaining ring is slidably connected to the outer wall of the installation box, an inclined panel is fixedly connected to the top of the inclined retaining ring, and a pulling spring is fixedly connected to the side wall of the retaining ring, and the end of the pulling spring away from the retaining ring is fixedly connected to the side wall of the installation box. After completing the polishing process, as the motor loses external power, the centrifugal force generated by the installation box decreases, and as the centrifugal force decreases, the outward force generated by the counterweight block and the gear rod also decreases synchronously. At this time, multiple spring telescopic rods will push the corresponding L-shaped support rods to reset, and force the L-shaped support rods to block the corresponding water outlet chute, so that the chemical solution inside the water tank cannot be discharged outward through the water outlet gap. Through the application of the above-mentioned components, autonomous discharge and blockage of the equipment solution can be achieved; in addition, during the rotation process, multiple gears 2 will drive the same gear ring to rotate, thereby increasing the force generated by the gear ring during the rotation process.

[0012] Preferably, the water retaining assembly also includes a fixed plate fixedly connected to the bottom of the installation box, a limiting groove is provided at the side wall of the fixed plate, the outer wall of the water outlet pipe is fixedly connected to the inner wall of the limiting groove, and a pushing roller is rotatably connected to the outer wall of the gear ring. By utilizing the characteristic that the above-mentioned gear 2 drives the gear ring to rotate, a pushing roller and an inclined panel are arranged inside the equipment. When the equipment starts to polish and grind, the gear ring will drive the pushing roller to move horizontally along the inner wall of the slide groove, and at this time the pushing roller will roll along the inclined surface of the inclined panel, presenting a Figure 7 In the state shown, the roller is pushed to move horizontally, applying a downward pressure on the inclined surface of the inclined plate, and the inclined plate pushes the retaining ring to move downward along the outer wall of the mounting box, forming a shield on the outer wall of the grinding pad to prevent the grinding pad from being thrown to the surroundings due to the centrifugal force generated by the rotation during the polishing process. The chemical solution has a slight corrosive effect, and the splashing chemical solution is blocked by the retaining ring to prevent the splashing solution from causing corrosion to the surrounding environment.

[0013] A method for processing a semiconductor wafer photoelectrochemical mechanical polishing device comprises the following steps:

[0014] S1: When in use, install the electric telescopic rod at the required position and ensure that the chemical solvent shell reaches the inside of the water storage tank through the water inlet pipe and the input pipe. Then, the staff turns on the power of the motor and the electric telescopic rod;

[0015] S2: The motor drives the gear ring 1 and the input pipe to rotate through the driving gear, and the input pipe drives the bottom fixing frame and the grinding pad to rotate regularly through the mounting box;

[0016] S3: During the rotation of the installation box, the installation box will generate centrifugal force, which forces the L-shaped support rod and the counterweight block to slide outward along the inner wall of the water outlet chute. The spring telescopic rod is compressed and deformed. At this time, a water outlet gap will be formed between the inclined groove and the water outlet chute. The chemical solution inside the water storage tank reaches the inside of the water retaining ring through the above water outlet gap.

[0017] The present invention has the following beneficial effects:

[0018] (1) The present invention utilizes the centrifugal force generated by grinding, and is provided with a feeding mechanism inside the equipment. When in use, the electric telescopic rod is installed at the desired position, and it is ensured that the chemical solvent shell reaches the inside of the water storage tank through the water inlet pipe and the input pipe. Then, the staff turns on the power of the motor and the electric telescopic rod. At this time, the motor drives the gear ring 1 and the input pipe to rotate through the driving gear. The input pipe drives the bottom fixing frame and the grinding pad to rotate regularly through the installation box, thereby realizing the grinding function of the grinding pad. In the process of the rotation of the installation box, the installation box will generate centrifugal force. The centrifugal force The L-shaped support rod and the counterweight are forced to slide outward along the inner wall of the water outlet chute, and the spring telescopic rod is deformed under pressure. At this time, a water outlet gap will be formed between the inclined groove and the water outlet chute. The chemical solution inside the water storage tank reaches the inside of the water retaining ring through the above water outlet gap, and the water source inside the water retaining ring enters the inside of the water outlet pipe through the water outlet hole, and is sprayed outward from the other end of the water outlet hole and acts on the outer wall of the chip. In this process, the water flow inside the water outlet pipe is also affected by the centrifugal force and diffuses to the surroundings, thereby increasing the contact area between the chemical solution and the grinding pad, and indirectly improving the polishing efficiency of the chemical solution.

[0019] (2) The present invention utilizes the characteristics that the counterweight block and the L-shaped support rod are compressed and diffused to the surroundings. A gear ring and gear 2 are arranged inside the equipment. When the counterweight block expands outward due to centrifugal force, the counterweight block pushes the slide bar to move outward, and the slide bar drives the gear bar to move outward synchronously. The gear bar drives the top gear 2 to rotate synchronously through gear 1. The gear 2 rotates and drives the gear ring on the side wall to rotate synchronously. Through the application of the above components, the rotation angle of the gear ring will control the rotation angles of multiple gear 2s. The rotation angles of multiple gear 2s are relative, which will push the corresponding gear bar, slide bar and counterweight block to move. In this process, the distances between the multiple counterweight blocks and the gear bar and the center of the device are equal, ensuring that the distances between the multiple counterweight blocks and the center of the device are equal, avoiding the displacement of the rotation center of the device due to unequal lengths, affecting the stability of the device, and causing the center of gravity of the device to shift during polishing, affecting the polishing efficiency.

[0020] (3) The present invention utilizes the characteristic that the gear 2 drives the gear ring to rotate, and a driving roller and an inclined plate are arranged inside the device. When the device starts polishing, the gear ring will drive the driving roller to move horizontally along the inner wall of the slide groove, and at this time, the driving roller will roll along the inclined surface of the inclined plate, presenting a Figure 7In the state shown, the roller is pushed to move horizontally, applying a downward pressure on the inclined surface of the inclined plate, and the inclined plate pushes the retaining ring to move downward along the outer wall of the mounting box, forming a shield on the outer wall of the grinding pad to prevent the grinding pad from being thrown to the surroundings due to the centrifugal force generated by the rotation during the polishing process. The chemical solution has a slight corrosive effect, and the splashing chemical solution is blocked by the retaining ring to prevent the splashing solution from causing corrosion to the surrounding environment.

[0021] (4) After the polishing process is completed, as the motor loses external power, the centrifugal force generated by the installation box decreases. As the centrifugal force decreases, the outward force generated by the counterweight block and the gear rod also decreases synchronously. At this time, the multiple spring telescopic rods will push the corresponding L-shaped support rods to reset and force the L-shaped support rods to block the corresponding water outlet chute, so that the chemical solution inside the water tank cannot be discharged outward through the water outlet gap. Through the application of the above-mentioned components, the autonomous discharge and blockage of the equipment solution can be achieved; in addition, during the rotation process, the multiple gears will drive the same gear ring to rotate, increase the force generated by the gear ring during the rotation process, and ensure that the gear ring and the push roller have sufficient force to push the inclined plate and the retaining ring to slide downward. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0023] Figure 1 It is a schematic cross-sectional view of the overall structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the bottom component of the overall structure of the present invention;

[0025] Figure 3 It is a cross-sectional schematic diagram of the grinding mechanism of the present invention;

[0026] Figure 4 It is a cross-sectional schematic diagram of the discharge assembly of the present invention;

[0027] Figure 5 For the present invention Figure 4 A is an enlarged schematic diagram;

[0028] Figure 6 It is a cross-sectional schematic diagram of the water retaining assembly of the present invention;

[0029] Figure 7 For the present invention Figure 6 A magnified schematic diagram of B;

[0030] Figure 8It is a schematic diagram of the working process of the present invention.

[0031] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0032] In the figure: 1. electric telescopic rod; 11. mounting frame; 12. motor; 13. driving gear; 14. water inlet pipe; 2. grinding mechanism; 21. input pipe; 22. mounting box; 23. fixing frame; 24. grinding gasket; 25. gear ring 1; 3. feeding mechanism; 31. water outlet hole; 32. water outlet pipe; 33. water storage tank; 34. water retaining ring; 4. discharge assembly; 41. water outlet chute; 42. L-shaped support rod; 43. inclined groove; 44. spring telescopic rod; 45. counterweight; 46. slide rod; 47. gear rod; 48. gear 1; 49. gear 2; 410. gear ring; 5. water retaining assembly; 51. chute; 52. retaining ring; 53. inclined panel; 54. pulling spring; 55. fixing plate; 56. limiting groove; 57. pushing roller. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] For example, see Figure 1 - Figure 3 The present invention is a semiconductor wafer photoelectrochemical mechanical polishing processing device, comprising an electric telescopic rod 1, a mounting frame 11 is fixedly connected to the bottom of the electric telescopic rod 1, a motor 12 is fixedly connected to the bottom of the mounting frame 11, a driving gear 13 is fixedly connected to the output end of the motor 12, and a water inlet pipe 14 is fixedly connected to the inner wall of the mounting frame 11;

[0035] The grinding mechanism 2 includes an input pipe 21 rotatably connected to the inner wall of the mounting frame 11, an end of the input pipe 21 away from the mounting frame 11 is connected to a mounting box 22, a fixing frame 23 is fixedly connected to the bottom of the mounting box 22, a grinding pad 24 is fixedly connected to the bottom of the fixing frame 23, a gear ring 25 is fixedly connected to the outer wall of the input pipe 21, and a water retaining assembly 5 is fixedly connected to the outer wall of the mounting box 22;

[0036] The feeding mechanism 3 includes eight water outlet holes 31 provided at the bottom of the installation box 22, the inner walls of the eight water outlet holes 31 are connected with water outlet pipes 32, the inner wall of the installation box 22 is fixedly connected with a water storage tank 33, the inner wall of the installation box 22 is fixedly connected with a water retaining ring 34, and the side wall of the water storage tank 33 is fixedly connected with a discharge assembly 4.

[0037] The discharge assembly 4 includes a water outlet chute 41 provided on the side wall of the water storage tank 33 , an L-shaped support rod 42 is slidably connected to the inner wall of the water outlet chute 41 , and an inclined groove 43 is provided on the outer wall of the L-shaped support rod 42 .

[0038] The discharge assembly 4 also includes a spring telescopic rod 44 fixedly connected to the side wall of the L-shaped support rod 42, and one end of the spring telescopic rod 44 away from the L-shaped support rod 42 is fixedly connected to the inner wall of the water tank 33, and one end of the L-shaped support rod 42 away from the spring telescopic rod 44 is fixedly connected to a counterweight block 45. When in use, the electric telescopic rod 1 is installed in the required position, and it is ensured that the chemical solvent shell reaches the inside of the water tank 33 through the water inlet pipe 14 and the input pipe 21. Then, the staff turns on the power supply of the motor 12 and the electric telescopic rod 1. At this time, the motor 12 drives the gear ring 25 and the input pipe 21 to rotate through the driving gear 13, and the input pipe 21 drives the bottom fixed frame 23 and the grinding pad 24 to rotate regularly through the installation box 22, thereby realizing the grinding function of the grinding pad 24. ; Among them, during the rotation of the installation box 22, the installation box 22 will generate centrifugal force, which forces the L-shaped support rod 42 and the counterweight block 45 to slide outward along the inner wall of the water outlet chute 41, and the spring telescopic rod 44 is compressed and deformed. At this time, a water outlet gap will be formed between the inclined groove 43 and the water outlet chute 41, and the chemical solution inside the water storage tank 33 reaches the inside of the water retaining ring 34 through the above water outlet gap, and the water source inside the water retaining ring 34 enters the inside of the water outlet pipe 32 through the water outlet hole 31, and is sprayed outward from the other end of the water outlet hole 31 and acts on the outer wall of the chip. In this process, the water flow inside the water outlet pipe 32 is also affected by the centrifugal force and diffuses to the surroundings, thereby increasing the contact area between the chemical solution and the polishing pad 24, and indirectly improving the polishing efficiency of the chemical solution.

[0039] For example 2, please refer to Figure 4 - Figure 8 The present invention is a semiconductor wafer photoelectrochemical mechanical polishing processing device. On the basis of embodiment one, the discharge assembly 4 also includes a slide bar 46 fixedly connected to the side wall of the counterweight block 45. The side wall of the slide bar 46 is slidably connected to the inner wall of the through hole of the water retaining ring 34. The end of the slide bar 46 away from the counterweight block 45 is fixedly connected to a gear rod 47. The top of the installation box 22 is rotatably connected to a gear 1 48, and the top of the gear 1 48 is fixedly connected to a gear 2 49.

[0040] The discharge assembly 4 also includes a gear ring 410 rotatably connected to the inner wall of the installation box 22, the side wall of the gear 1 48 is meshed with the side wall of the gear rod 47, the side wall of the gear 2 49 is meshed with the side wall of the gear ring 410, and the outer wall of the gear ring 1 25 is meshed with the outer wall of the driving gear 13. The gear ring 410 and the gear 2 49 are arranged inside the device by utilizing the characteristics that the counterweight block 45 and the L-shaped support rod 42 are compressed and diffused to the surroundings. When the counterweight block 45 expands outward due to centrifugal force, the counterweight block 45 pushes the slide bar 46 to move outward, and the slide bar 46 drives the gear rod 47 to move outward synchronously, and the gear rod 47 drives the top through the gear 1 48. The gear 2 49 rotates synchronously, and the gear 2 49 rotates, driving the gear ring 410 on the side wall to rotate synchronously. Through the application of the above components, the rotation angle of the gear ring 410 will control the rotation angles of multiple gear 2s 49, and the rotation angles of multiple gear 2s 49 are relative, which will push the corresponding gear rod 47, sliding rod 46 and counterweight block 45 to move. In this process, the distance between the multiple counterweight blocks 45 and the gear rod 47 and the center of the equipment circle is equal, ensuring that the distance between the multiple counterweight blocks 45 and the center of the circle is equal, avoiding the unequal length causing the center of gravity of the equipment rotation to shift, affecting the stability of the equipment, causing the center of gravity of the equipment to shift during polishing, affecting the polishing efficiency.

[0041] The water retaining assembly 5 includes a slide groove 51 opened at the side wall of the installation box 22, a retaining ring 52 is slidably connected to the outer wall of the installation box 22, and an inclined panel 53 is fixedly connected to the top of the inclined retaining ring 52. A pulling spring 54 is fixedly connected to the side wall of the retaining ring 52, and one end of the pulling spring 54 away from the retaining ring 52 is fixedly connected to the side wall of the installation box 22. After completing the polishing process, as the motor 12 loses external power, the centrifugal force generated by the installation box 22 decreases, and as the centrifugal force decreases, the outward force generated by the counterweight block 45 and the gear rod 47 also decreases synchronously. At this time, the multiple spring telescopic rods 44 will push the corresponding L-shaped support rod 42 to reset, and force the L-shaped support rod 42 to block the corresponding water outlet slide groove 41, so that the chemical solution inside the water storage tank 33 cannot be discharged outward through the water outlet gap. Through the application of the above-mentioned components, the autonomous discharge and blocking of the equipment solution is realized; in addition, during the rotation process, the multiple gears 49 will drive the same gear ring 410 to rotate, thereby increasing the force generated by the gear ring 410 during the rotation process.

[0042] The water retaining assembly 5 also includes a fixing plate 55 fixedly connected to the bottom of the installation box 22, and a limiting groove 56 is provided at the side wall of the fixing plate 55. The outer wall of the water outlet pipe 32 is fixedly connected to the inner wall of the limiting groove 56. A pushing roller 57 is rotatably connected to the outer wall of the gear ring 410. By utilizing the characteristic that the gear 2 49 drives the gear ring 410 to rotate, a pushing roller 57 and an inclined panel 53 are arranged inside the equipment. When the equipment starts to polish and grind, the gear ring 410 will drive the pushing roller 57 to move horizontally along the inner wall of the slide groove 51. At this time, the pushing roller 57 will roll along the inclined surface of the inclined panel 53, presenting a Figure 7In the state shown, the roller 57 is pushed to move horizontally, applying a downward pressure on the inclined surface of the inclined plate 53. The inclined plate 53 pushes the retaining ring 52 to move downward along the outer wall of the mounting box 22, forming a shield on the outer wall of the grinding pad 24 to prevent the grinding pad 24 from being thrown to the surroundings due to the centrifugal force generated by the rotation during the polishing process. The chemical solution has a slight corrosive effect, and the splashing chemical solution is blocked by the retaining ring 52 to prevent the splashing solution from causing corrosion to the surrounding environment.

[0043] The processing method of the processing device comprises the following steps:

[0044] S1: When in use, the electric telescopic rod 1 is installed at the desired position, and the chemical solvent shell is ensured to reach the inside of the water storage tank 33 through the water inlet pipe 14 and the input pipe 21. Then, the staff turns on the power of the motor 12 and the electric telescopic rod 1;

[0045] S2: The motor 12 drives the gear ring 1 25 and the input pipe 21 to rotate through the driving gear 13, and the input pipe 21 drives the bottom fixing frame 23 and the grinding pad 24 to rotate regularly through the mounting box 22;

[0046] S3: During the rotation of the installation box 22, the installation box 22 will generate centrifugal force, which forces the L-shaped support rod 42 and the counterweight block 45 to slide outward along the inner wall of the water outlet chute 41, and the spring telescopic rod 44 is compressed and deformed. At this time, a water outlet gap will be formed between the inclined groove 43 and the water outlet chute 41, and the chemical solution inside the water storage tank 33 will reach the inside of the water retaining ring 34 through the above water outlet gap.

[0047] A specific application of this embodiment is: when in use, the electric telescopic rod 1 is installed at the desired position, and it is ensured that the chemical solvent shell reaches the inside of the water storage tank 33 through the water inlet pipe 14 and the input pipe 21. Then, the staff turns on the power of the motor 12 and the electric telescopic rod 1. At this time, the motor 12 drives the gear ring 1 25 and the input pipe 21 to rotate through the driving gear 13, and the input pipe 21 drives the bottom fixing frame 23 and the grinding pad 24 to rotate regularly through the installation box 22, thereby realizing the grinding function of the grinding pad 24; wherein, during the rotation of the installation box 22, the installation box 22 will generate centrifugal force, which forces the L-shaped support rod 4 2 and the counterweight 45 slide outward along the inner wall of the water outlet chute 41, and the spring telescopic rod 44 is deformed by pressure. At this time, a water outlet gap is formed between the inclined groove 43 and the water outlet chute 41, and the chemical solution in the water storage tank 33 reaches the inside of the water retaining ring 34 through the above water outlet gap, and the water source inside the water retaining ring 34 enters the inside of the water outlet pipe 32 through the water outlet hole 31, and is sprayed outward from the other end of the water outlet hole 31 and acts on the outer wall of the wafer. In this process, the water flow inside the water outlet pipe 32 is also affected by the centrifugal force and diffuses to the surroundings, thereby increasing the contact area between the chemical solution and the polishing pad 24, and indirectly improving the polishing efficiency of the chemical solution.

[0048] Taking advantage of the fact that the counterweight block 45 and the L-shaped support rod 42 are compressed and diffused to the surroundings, a gear ring 410 and a gear 2 49 are arranged inside the device. When the counterweight block 45 expands outward due to centrifugal force, the counterweight block 45 pushes the slide bar 46 to move outward, and the slide bar 46 drives the gear rod 47 to move outward synchronously, and the gear rod 47 drives the top gear 2 49 to rotate synchronously through the gear 1 48. The gear 2 49 rotates, driving the gear ring 410 on the side wall to rotate synchronously. Through the application of the above components, the rotation angle of the gear ring 410 will control the rotation angles of multiple gear 2s 49, and the rotation angles of multiple gear 2s 49 are relative, which will push the corresponding gear rods 47, slide bars 46 and The counterweight block 45 is displaced. During this process, the multiple counterweight blocks 45 and the gear rod 47 are at an equal distance from the center of the device, ensuring that the multiple counterweight blocks 45 are at an equal distance from the center of the circle to avoid the unequal length causing the center of gravity of the device to shift, affecting the stability of the device, causing the center of gravity of the device to shift during polishing, affecting the polishing efficiency. The feature of the gear 2 49 driving the gear ring 410 to rotate is utilized, and a pushing roller 57 and an inclined plate 53 are provided inside the device. When the device starts polishing, the gear ring 410 will drive the pushing roller 57 to move horizontally along the inner wall of the slide groove 51. At this time, the pushing roller 57 will roll along the inclined surface of the inclined plate 53, presenting a Figure 7In the state shown, the roller 57 is pushed to move horizontally, applying a downward pressure on the inclined surface of the inclined plate 53. The inclined plate 53 pushes the retaining ring 52 to move downward along the outer wall of the mounting box 22, forming a shield on the outer wall of the grinding pad 24 to prevent the grinding pad 24 from being thrown to the surroundings due to the centrifugal force generated by the rotation during the polishing process. The chemical solution has a slight corrosive effect, and the splashing chemical solution is blocked by the retaining ring 52 to prevent the splashing solution from causing corrosion to the surrounding environment.

[0049] After completing the polishing process, as the motor 12 loses external power, the centrifugal force generated by the installation box 22 decreases, and as the centrifugal force decreases, the outward force generated by the counterweight block 45 and the gear rod 47 also decreases synchronously. At this time, the multiple spring telescopic rods 44 will push the corresponding L-shaped support rod 42 to reset, and force the L-shaped support rod 42 to block the corresponding water outlet chute 41, so that the chemical solution inside the water tank 33 cannot be discharged outward through the water outlet gap. Through the application of the above-mentioned components, the autonomous discharge and blockage of the equipment solution can be achieved; in addition, during the rotation process, the multiple gears 49 will drive the same gear ring 410 to rotate, increase the force generated by the gear ring 410 during the rotation process, and ensure that the gear ring 410 and the push roller 57 have sufficient force to push the inclined panel 53 and the retaining ring 52 to slide downward. When the equipment speed decreases, the pulling spring 54 will drive the retaining ring 52 to reset.

[0050] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor wafer photoelectrochemical mechanical polishing device, an electric telescopic rod (1), the bottom of the electric telescopic rod (1) is fixedly connected to a mounting frame (11), the bottom of the mounting frame (11) is fixedly connected to a motor (12), the output end of the motor (12) is fixedly connected to a driving gear (13), and the inner wall of the mounting frame (11) is fixedly connected to a water inlet pipe (14), characterized in that: Also includes: A grinding mechanism (2), the grinding mechanism (2) comprising an input pipe (21) rotatably connected to the inner wall of a mounting frame (11), the end of the input pipe (21) away from the mounting frame (11) being connected to a mounting box (22), the bottom of the mounting box (22) being fixedly connected to a fixing frame (23), the bottom of the fixing frame (23) being fixedly connected to a grinding pad (24), the outer wall of the input pipe (21) being fixedly connected to a gear ring (25), and the outer wall of the mounting box (22) being fixedly connected to a water retaining assembly (5); A feeding mechanism (3), the feeding mechanism (3) comprising eight water outlet holes (31) provided at the bottom of the installation box (22), the inner walls of the eight water outlet holes (31) being connected with water outlet pipes (32), the inner wall of the installation box (22) being fixedly connected with a water storage tank (33), the inner wall of the installation box (22) being fixedly connected with a water retaining ring (34), and the side wall of the water storage tank (33) being fixedly connected with a discharge assembly (4).

2. The semiconductor wafer photoelectrochemical mechanical polishing device according to claim 1, characterized in that: The discharge assembly (4) comprises a water outlet chute (41) provided on the side wall of the water storage tank (33); an L-shaped support rod (42) is slidably connected to the inner wall of the water outlet chute (41); and an inclined groove (43) is provided on the outer wall of the L-shaped support rod (42).

3. The semiconductor wafer photoelectrochemical mechanical polishing device according to claim 2, characterized in that: The discharge assembly (4) further comprises a spring telescopic rod (44) fixedly connected to the side wall of the L-shaped support rod (42); one end of the spring telescopic rod (44) away from the L-shaped support rod (42) is fixedly connected to the inner wall of the water storage tank (33); and one end of the L-shaped support rod (42) away from the spring telescopic rod (44) is fixedly connected to a counterweight (45).

4. The semiconductor wafer photoelectrochemical mechanical polishing device according to claim 3, characterized in that: The discharge assembly (4) also includes a sliding rod (46) fixedly connected to the side wall of the counterweight block (45), the side wall of the sliding rod (46) is slidably connected to the inner wall of the through hole of the water retaining ring (34), one end of the sliding rod (46) away from the counterweight block (45) is fixedly connected to a gear rod (47), the top of the installation box (22) is rotatably connected to a gear one (48), and the top of the gear one (48) is fixedly connected to a gear two (49).

5. The semiconductor wafer photoelectrochemical mechanical polishing device according to claim 4, characterized in that: The discharge assembly (4) also includes a gear ring (410) rotatably connected to the inner wall of the installation box (22), the side wall of the gear 1 (48) is meshingly connected to the side wall of the gear rod (47), the side wall of the gear 2 (49) is meshingly connected to the side wall of the gear ring (410), and the outer wall of the gear ring 1 (25) is meshingly connected to the outer wall of the driving gear (13).

6. The semiconductor wafer photoelectrochemical mechanical polishing device according to claim 5, characterized in that: The water retaining assembly (5) comprises a slide groove (51) provided on the side wall of the installation box (22); a retaining ring (52) is slidably connected to the outer wall of the installation box (22); a slanted panel (53) is fixedly connected to the top of the inclined retaining ring (52); a pulling spring (54) is fixedly connected to the side wall of the retaining ring (52); and one end of the pulling spring (54) away from the retaining ring (52) is fixedly connected to the side wall of the installation box (22).

7. The semiconductor wafer photoelectrochemical mechanical polishing device according to claim 6, characterized in that: The water retaining assembly (5) further comprises a fixing plate (55) fixedly connected to the bottom of the installation box (22); a limiting groove (56) is provided on the side wall of the fixing plate (55); the outer wall of the water outlet pipe (32) is fixedly connected to the inner wall of the limiting groove (56); and a driving roller (57) is rotatably connected to the outer wall of the gear ring (410).

8. A method for processing a semiconductor wafer photoelectrochemical mechanical polishing device, using the wafer mechanical polishing device as claimed in claim 7, characterized in that: The following steps are included: S1: When in use, the electric telescopic rod (1) is installed at a desired position, and the chemical solvent shell is ensured to reach the inside of the water storage tank (33) through the water inlet pipe (14) and the input pipe (21). Then, the staff turns on the power supply of the motor (12) and the electric telescopic rod (1); S2: The motor (12) drives the gear ring 1 (25) and the input pipe (21) to rotate through the driving gear (13), and the input pipe (21) drives the bottom fixing frame (23) and the grinding pad (24) to rotate regularly through the mounting box (22); S3: During the rotation of the installation box (22), the installation box (22) will generate centrifugal force, which forces the L-shaped support rod (42) and the counterweight (45) to slide outward along the inner wall of the water outlet chute (41), and the spring telescopic rod (44) is compressed and deformed. At this time, a water outlet gap will be formed between the inclined groove (43) and the water outlet chute (41), and the chemical solution in the water storage tank (33) will reach the inside of the water retaining ring (34) through the above water outlet gap.

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