Anti-oxidation hot stamping film and preparation method thereof

Abstract

The present invention discloses an anti-oxidation hot stamping film and a preparation method thereof, wherein the anti-oxidation hot stamping film comprises a first anti-oxidation layer, a metal layer and a second anti-oxidation layer, wherein the metal layer is arranged between the first anti-oxidation layer and the second anti-oxidation layer, wherein the first anti-oxidation layer is configured to prevent impurities on a side of the first anti-oxidation layer away from the metal layer from penetrating into the metal layer, and the second anti-oxidation layer is configured to prevent impurities on a side of the second anti-oxidation layer away from the metal layer from penetrating into the metal layer. The hot stamping film of the present invention forms a sandwich protection for the metal layer through two anti-oxidation layers, has better anti-permeability to water vapor, oxygen and halides, and prevents corrosion from sulfur-containing gases, thereby extending the service life.

Description

Technical Field

[0001] The invention relates to the technical field of film materials, and in particular to an anti-oxidation hot stamping film and a preparation method thereof. Background Art

[0002] Hot stamping film, also known as electroplated aluminum, is a hot stamping material made by coating and laminating a layer of aluminum foil on a thin film base. Hot stamping film is widely used in the paper industry, plastic industry, cosmetics industry, artificial leather, textile industry, 3C products, home appliances, credit card industry, book binding industry and other industries; when hot stamping film is used in the paper industry, it is a special film covering the surface of printed products with a metallic luster effect. When the hot stamping machine heats the hot stamping film, the glue layer on the base film melts, and the metal foil material in the hot stamping film adheres to the surface of the printed matter to form a hot stamping effect. Hot stamping film can be used on different types of printed matter, including publications, covers, packaging boxes, etc. Moreover, in the design of printed matter, the hot stamping effect is not necessarily only achieved on the black part. Hot stamping film can also be used for other colors. For example, gold hot stamping effects can be achieved on black, red, blue, yellow and green colors. When hot stamping film is used in LCD displays of various sizes such as TVs, monitors, laptops, tablets, industrial control, etc., it serves as a reflective film in the components of the backlight source. Its main function is to increase the reflectivity of the optical surface and reflect the light that leaks out of the bottom of the light guide plate efficiently and without loss, thereby reducing light loss, reducing power consumption, and improving the light saturation of the liquid crystal display surface. Therefore, hot stamping film is an indispensable and important industrial product.

[0003] At present, the shortcomings of hot stamping film are gradually highlighted in long-term use, which are as follows: 1. Hot stamping film is used in products such as televisions, flat panels, and monitors. When it is used as a reflective film in the components of the backlight source, the reflectivity of the aluminum plating layer is not high enough, which often leads to poor reflective performance of the product; 2. The oxidation resistance is not strong enough, and it is easily penetrated by water vapor, oxygen, and halides, as well as corroded by sulfur-containing gases, resulting in a short life; 3. Before use, the metal layer is easily scratched, causing damage; 4. The traditional hot stamping film production process has cumbersome steps and low production efficiency, and the traditional magnetron sputtering coating process has poor adhesion and low purity of the metal layer. Summary of the invention

[0004] The present invention aims to solve the above problems and provides an anti-oxidation hot stamping film capable of improving oxidation resistance and service life and a preparation method thereof.

[0005] To achieve the above-mentioned objectives, the first aspect of the present invention provides an anti-oxidation hot stamping film, comprising a first anti-oxidation layer, a metal layer and a second anti-oxidation layer, the metal layer being arranged between the first anti-oxidation layer and the second anti-oxidation layer, the first anti-oxidation layer being configured to prevent impurities on a side of the first anti-oxidation layer away from the metal layer from penetrating into the metal layer, and the second anti-oxidation layer being configured to prevent impurities on a side of the second anti-oxidation layer away from the metal layer from penetrating into the metal layer.

[0006] In the present invention, by placing the metal layer between the first anti-oxidation layer and the second anti-oxidation layer, it is possible to reduce the infiltration of impurities from the first anti-oxidation layer and the second anti-oxidation layer away from the metal layer into the metal layer, thereby reducing the oxidation resistance and service life of the hot stamping film.

[0007] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the metal layer is at least one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer.

[0008] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the first anti-oxidation layer includes a main adhesive and a corrosion inhibitor, and the second anti-oxidation layer includes a main adhesive and a corrosion inhibitor.

[0009] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, it also includes a base film layer, and the base film layer is arranged on a side of the first oxide layer away from the metal layer.

[0010] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the corrosion inhibitor is octadecanethiol.

[0011] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the thickness of the metal layer is 0.01 micrometer to 0.1 micrometer.

[0012] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the thickness of the base film layer is 10 micrometers to 100 micrometers.

[0013] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the base film layer includes a first substrate layer, a first release layer, and a colored layer, the colored layer is arranged on a side of the first oxide layer away from the metal layer, the first release layer is arranged on a side of the colored layer away from the first oxide layer, and the first substrate layer is arranged on a side of the first release layer away from the colored layer.

[0014] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the thickness of the first substrate layer is 40 micrometers to 60 micrometers.

[0015] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the thickness of the first release layer is 1 micrometer to 10 micrometers.

[0016] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the thickness of the colored layer is 0.5 micrometer to 2 micrometers.

[0017] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, it further includes a protective layer, and the protective layer is arranged on a side of the second anti-oxidation layer away from the metal layer.

[0018] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the protective layer includes a second substrate layer, a second release layer and a composite adhesive layer, the composite adhesive layer is bonded to the second anti-oxidation layer, the second release layer is arranged on a side of the composite adhesive layer away from the second anti-oxidation layer, and the second substrate layer is arranged on a side of the second release layer away from the composite adhesive layer.

[0019] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, a composite adhesive is coated on the surface of the second release layer to form the composite adhesive layer on the surface of the second release layer.

[0020] In the anti-oxidation hot stamping film involved in the first aspect of the present invention, optionally, the composite adhesive layer is prepared from a composite adhesive main agent, a curing agent, an organic solvent, and an auxiliary agent.

[0021] The second aspect of the present invention provides a method for preparing an anti-oxidation hot stamping film, and the preparation method has the following steps: preparing a first anti-oxidation layer; evaporating a film on the surface of the first anti-oxidation layer to form a metal layer on the surface of the first anti-oxidation layer; coating the second anti-oxidation glue on the side of the metal layer away from the first anti-oxidation layer, and curing the second anti-oxidation glue to form the second anti-oxidation layer on the surface of the metal layer.

[0022] In the method for preparing the anti-oxidation hot stamping film involved in the second aspect of the present invention, optionally, the method further comprises: preparing a protective layer, and laminating the protective layer to a side of the second anti-oxidation layer away from the metal layer.

[0023] In the preparation method of the anti-oxidation hot stamping film involved in the second aspect of the present invention, optionally, the preparation method also includes: preparing a base film layer, coating a first anti-oxidation glue on the surface of the base film layer, and curing the first anti-oxidation glue to form the first anti-oxidation layer on the surface of the base film layer.

[0024] According to the present invention, an anti-oxidation hot stamping film with improved oxidation resistance and long service life and a preparation method thereof can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the description are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a structural schematic diagram of Example 1 of the anti-oxidation hot stamping film of the present invention.

[0027] Figure 2 It is a schematic structural diagram of Example 2 of the anti-oxidation hot stamping film of the present invention.

[0028] Figure 3 It is a flow chart of Example 1 of the method for preparing the anti-oxidation hot stamping film of the present invention.

[0029] Figure 4 It is a flow chart of Example 2 of the method for preparing the anti-oxidation hot stamping film of the present invention.

[0030] Figure numerals: 10, base film layer; 11, first substrate layer; 12, first release layer; 13, colored layer; 20, first anti-oxidation layer; 30, metal layer; 40, second anti-oxidation layer; 50, protective layer; 51, composite adhesive layer; 52, second release layer; 53, second substrate layer.

[0031] The following is a further description of the implementation, functional features and advantages of the present invention with reference to the embodiments and accompanying drawings. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] The present invention provides an anti-oxidation hot stamping film, which can be transferred to the surface of a target object or a hot stamped printed product by hot pressing transfer or pasting. The anti-oxidation hot stamping film is sometimes referred to as hot stamping film below. The anti-oxidation hot stamping film of the present invention can also be referred to as a high-reflectivity anti-oxidation hot stamping film or a high-reflectivity hot stamping film.

[0034] In some embodiments, the hot stamping film may include a first anti-oxidation layer 20 and a metal layer 30. The first anti-oxidation layer 20 may be disposed on one side of the metal layer 30, and the first anti-oxidation layer 20 may be configured to prevent impurities on the side of the first anti-oxidation layer 20 away from the metal layer 30 from penetrating into the metal layer 30. Thus, the possibility of impurities on the side of the first anti-oxidation layer 20 away from the metal layer 30 penetrating into the metal layer 30 and causing the metal layer 30 to be oxidized can be reduced.

[0035] In some embodiments, the hot stamping film may further include a second anti-oxidation layer 40. The second anti-oxidation layer 40 may be disposed on the other side of the metal layer 30 (i.e., the side of the metal layer 30 away from the first anti-oxidation layer 20), and the second anti-oxidation layer 40 may be configured to prevent impurities on the side of the second anti-oxidation layer 40 away from the metal layer 30 from penetrating into the metal layer 30. Thus, the possibility of impurities on the side of the second anti-oxidation layer 40 away from the metal layer 30 penetrating into the metal layer 30 and causing the metal layer 30 to be oxidized can be reduced.

[0036] In some embodiments, the first anti-oxidation layer 20 may include a main adhesive and a corrosion inhibitor. In some embodiments, the main adhesive and the corrosion inhibitor may be put into a mixer and stirred to form a viscous, slurry-like first anti-oxidation adhesive. The first anti-oxidation layer 20 may be prepared using the first anti-oxidation adhesive.

[0037] In some embodiments, the first anti-oxidation layer 20 may have a thickness of 1 micrometer to 10 micrometers. Preferably, the first anti-oxidation layer 20 may have a thickness of 5 micrometers.

[0038] In some embodiments, the metal layer 30 may be at least one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer.

[0039] In some embodiments, the metal layer 30 may be a single layer or a multilayer. The single layer metal layer 30 may be one of a silver layer, a copper layer, an iron layer, a nickel layer, and a zinc layer. The multilayer metal layer may be formed by stacking at least two of the silver layer, the copper layer, the iron layer, the nickel layer, and the zinc layer.

[0040] In some embodiments, the thickness of the metal layer 30 may be 0.01 to 0.1 micrometers. Preferably, the thickness of the metal layer may be 0.05 micrometers.

[0041] In some embodiments, the metal layer 30 may be prepared by electron beam evaporation, thereby facilitating the control of the film thickness of the metal layer 30 .

[0042] In some embodiments, the second anti-oxidation layer 40 may include a main adhesive and a corrosion inhibitor. In some embodiments, the main adhesive and the corrosion inhibitor may be put into a mixer and stirred to form a viscous, slurry-like second anti-oxidation adhesive. The second anti-oxidation layer 40 may be prepared using the second anti-oxidation adhesive.

[0043] In some embodiments, the first anti-oxidation layer 20 and the second anti-oxidation layer 40 may have the same components, for example, both use the above-mentioned main adhesive and corrosion inhibitor. In other embodiments, the first anti-oxidation layer 20 and the second anti-oxidation layer 40 may have different components.

[0044] In the present invention, the metal layer 30 may be preferably a silver layer. The thickness of the silver layer may be 0.05 micrometers. The advantages of combining the silver layer and the anti-oxidation layer are introduced below by taking the metal layer 30 as an example.

[0045] In some embodiments, the corrosion inhibitor can be octadecanethiol. The corrosion inhibitor can react with the silver layer to form a self-assembled monolayer (SAM). The self-assembled monolayer can effectively protect the silver surface, prevent silver from sulfidation and corrosion, maintain the color, gloss and reflectivity of silver, and has high protection efficiency and good durability.

[0046] Specifically, the corrosion inhibitor can be complexed with the silver atoms of the silver layer through the sulfur atoms in the molecule to form a dense hydrophobic layer. The hydrophobic layer can be used to prevent water vapor, oxygen, and halides in the outside world (the first anti-oxidation layer 20 and / or the second anti-oxidation layer 40 away from the side of the silver layer) from penetrating into the silver layer, thereby reducing the possibility of water vapor, oxygen, and halides penetrating into the silver layer and chemically or physically reacting with the silver layer to cause the silver layer to be oxidized. In addition, due to the generation of an anti-oxidation layer or a hydrophobic layer, the first anti-oxidation layer 20 and the second anti-oxidation layer 40 made in the same way have better anti-permeability to water vapor, oxygen, and halides, and can prevent corrosion from sulfur-containing gases, thereby extending the service life of the hot stamping film.

[0047] In some embodiments, the main adhesive may be a natural or synthetic, organic or inorganic substance that connects two or more parts or materials together through interfacial adhesion and cohesion. The raw materials of the main adhesive may be various resins, rubbers and natural polymer compounds.

[0048] In some embodiments, the hot stamping film may include a base film layer 10. The base film layer 10 may be configured to serve as a substrate for making the hot stamping film. The base film layer 10 may be disposed on a side of the first oxide layer 20 away from the metal layer 30.

[0049] In some embodiments, the base film layer 10 can be torn off when the hot stamping film is used.

[0050] In some embodiments, a first anti-oxidation adhesive may be coated on the surface of the base film layer 10 , and after the first anti-oxidation adhesive is cured, a first anti-oxidation layer 20 is formed on the surface of the base film layer 10 .

[0051] In some embodiments, the base film layer 10 may include a first substrate layer 11, a first release layer 12, and a colored layer 13. The colored layer 13 may be disposed on a side of the first oxide layer 20 away from the metal layer 30. The first release layer 12 may be disposed on a side of the colored layer 13 away from the first oxide layer 20, and the first substrate layer 11 may be disposed on a side of the first release layer 12 away from the colored layer 13. The colored layer 13 may be made of a dye with high light transmittance. The metal layer 30 may be used to reflect incident light to achieve the metallic texture of the hot stamping film.

[0052] In some embodiments, the first release layer 12 may be formed by a release agent coated between the first substrate layer 11 and the colored layer 13. The release agent may be coated on the first substrate layer 11 to form the first release layer 12.

[0053] In some embodiments, the hot stamping film can tear off the first substrate layer 11 through the glass effect of the first release layer 12 when in use.

[0054] In some embodiments, the material of the first substrate layer 11 can be PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), PVC (polyvinyl chloride), PBT (polybutylene terephthalate), PEF (polyethylene furanoate), PU (polyurethane), etc.

[0055] In some embodiments, a first anti-oxidation adhesive may be coated on the surface of the colored layer 13 , and after the first anti-oxidation adhesive is cured, a first anti-oxidation layer 20 is formed on the colored layer 13 .

[0056] In some embodiments, the thickness of the base film layer 10 may be 10 micrometers to 100 micrometers. Preferably, the thickness of the base film layer 10 may be 50 micrometers.

[0057] In some embodiments, the thickness of the first substrate layer 11 may be 40 micrometers to 60 micrometers. Preferably, the thickness of the first substrate layer 11 may be 45 micrometers.

[0058] In some embodiments, the thickness of the first release layer 12 may be 1 micrometer to 10 micrometers. Preferably, the thickness of the first release layer 12 may be 4 micrometers.

[0059] In some embodiments, the thickness of the colored layer 13 may be 0.5 micrometers to 2 micrometers. Preferably, the thickness of the colored layer 13 may be 1 micrometer.

[0060] In some embodiments, the hot stamping film may include a protective layer 50. The protective layer 50 may be configured as the outermost layer of the hot stamping film to reduce damage to the hot stamping film, for example, to prevent the hot stamping film from being scratched and worn during transportation. When the hot stamping film is attached to a target object for use, the protective layer 50 may be attached to the target object. The protective layer 50 may be disposed on a side of the second anti-oxidation layer 40 away from the metal layer 30.

[0061] In some embodiments, the protective layer 50 may include a second substrate layer 53, a second release layer 52 and a composite adhesive layer 53. The composite adhesive layer 53 may be attached to the second anti-oxidation layer 40. The second release layer 52 may be disposed between the second substrate layer 53 and the composite adhesive layer 53.

[0062] In some embodiments, a release agent may be first applied on one side of the second substrate layer 53 to form a second release layer 52 on one side of the second substrate layer 53. Then, a composite adhesive may be applied on a side of the second release layer 52 away from the second substrate layer 53 to form a composite adhesive layer 53 on one side of the second release layer 52.

[0063] In some embodiments, the material of the second substrate layer 53 may be PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), PVC (polyvinyl chloride), PBT (polybutylene terephthalate), PEF (polyethylene furanoate), PU (polyurethane), etc.

[0064] In some embodiments, the composite adhesive layer 53 may be prepared from a composite adhesive main agent, a curing agent, an organic solvent, and an auxiliary agent.

[0065] In some embodiments, the main agent of the composite adhesive may be acrylic resin; the curing agent may be toluene diisocyanate; the organic solvent may be ethyl acetate; and the auxiliary agent may be a leveling agent.

[0066] In some embodiments, acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent can be selected in a weight ratio of 100:4:100:15. The acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent are added to a mixer and stirred to form a viscous, slurry-like composite adhesive. The composite adhesive layer 53 can be prepared using the composite adhesive.

[0067] In some embodiments, the composite adhesive layer 53 of the protective layer 50 can be arranged in contact with the second anti-oxidation layer 40 . Thus, the adhesiveness of the composite adhesive layer 53 can be used to make the protective layer 50 and the second anti-oxidation layer 40 closely contact each other.

[0068] Embodiment 1:

[0069] like Figure 3As shown, the present invention provides a method for preparing an anti-oxidation hot stamping film, and the method for preparing an anti-oxidation hot stamping film can be referred to as a preparation method for short.

[0070] In some embodiments, the preparation method may include step S100 of preparing a first anti-oxidation layer 20 .

[0071] In some embodiments, step S100 (ie, the preparation process of the first anti-oxidation layer 20 ) may include step S110 , preparing a first anti-oxidation adhesive. Specifically, a main adhesive and a corrosion inhibitor may be obtained and stirred to form the first anti-oxidation adhesive.

[0072] In some embodiments, the main adhesive and the corrosion inhibitor can be obtained in a ratio of 20:1 by weight.

[0073] In some embodiments, the main adhesive and the corrosion inhibitor can be put into a mixer and dispersed and stirred for 10 minutes to form a viscous, slurry-like first antioxidant adhesive.

[0074] In some embodiments, step S100 may include step S120 , coating a first anti-oxidation glue on the surface of the base film layer 10 to form a first anti-oxidation layer 20 on the surface of the base film layer 10 .

[0075] In some embodiments, the thickness of the first anti-oxidation layer 20 may be 5 micrometers.

[0076] In some embodiments, the main component of the main adhesive may be epoxy resin.

[0077] In some embodiments, the metal layer 30 may be a silver layer.

[0078] In some embodiments, the corrosion inhibitor can be selected from octadecyl mercaptan. The corrosion inhibitor can form an antioxidant layer at the interface between the main adhesive and the silver layer. The corrosion inhibitor can be complexed with the silver atoms of the silver layer through the sulfur atoms in the molecule to form a dense hydrophobic layer. The hydrophobic layer can be used to prevent water vapor, oxygen, and halides outside the silver layer from penetrating into the silver layer. The hydrophobic layer can be used to prevent water vapor, oxygen, and halides in the outside world (the first anti-oxidation layer 20 and / or the second anti-oxidation layer 40 away from the side of the silver layer) from penetrating into the silver layer, thereby reducing the possibility that water vapor, oxygen, and halides penetrate into the silver layer and chemically or physically react with the silver layer to cause the silver layer to be oxidized. In addition, due to the generation of an antioxidant layer or a hydrophobic layer, the first anti-oxidation layer 20 and the second anti-oxidation layer 40 made in the same way have more excellent anti-permeability to water vapor, oxygen, and halides, and can prevent corrosion from sulfur-containing gases, thereby extending the service life of the hot stamping film.

[0079] In some embodiments, the main adhesive may be a natural or synthetic, organic or inorganic substance that connects two or more parts or materials together through interfacial adhesion and cohesion. The raw materials of the main adhesive may be various resins, rubbers and natural polymer compounds.

[0080] In some embodiments, the preparation method may include step S200 , evaporating a film on the surface of the first anti-oxidation layer 20 to form a metal layer 30 on the surface of the first anti-oxidation layer 20 .

[0081] In some embodiments, step S200 (i.e., the step of preparing the metal layer 30) may include step S210, placing the prepared first semi-finished substrate into a vacuum chamber of an electron beam evaporation coating device, and evacuating the vacuum chamber. The first semi-finished substrate is a general term for the combination of the first anti-oxidation layer 20 and the base film layer 10.

[0082] In some embodiments, the vacuum degree of the vacuum chamber can reach 7.2×10-3 Pa. Specifically, it is necessary to ensure that the vacuum degree of the vacuum chamber is not less than 7×10-3 Pa. In this process, by controlling a higher vacuum degree, the energy loss of the electron beam can be reduced, and breakdown due to gas discharge can be prevented, thereby damaging the electron beam evaporation coating device.

[0083] Vacuum degree refers to the rarefaction of gas in a vacuum state; if the pressure in the measured device is lower than the atmospheric pressure, a vacuum gauge is required for pressure measurement. The value read from the vacuum gauge is called vacuum degree. The vacuum degree value indicates that the actual value of the system pressure is lower than the atmospheric pressure, that is: vacuum degree = atmospheric pressure - absolute pressure; Pa is Pascal, which is the basic unit of pressure in the International System of Units, referred to as Pa.

[0084] In some embodiments, step S200 may include step S210, preheating the electron gun filament cathode of the electron beam evaporation coating device, allowing the electron beam to scan the metal target material to pre-melt the metal target material for 30 minutes, and finally making the metal target material reach a molten state.

[0085] Specifically, the current of the cathode of the electron gun filament of the electron beam evaporation coating device is increased from 10 amps to 26 amps within 6 minutes, and the secondary high voltage of the electron gun filament is raised to 900 volts. After the preheating of the electron gun filament is completed, the current of the electron gun filament is maintained at 26 amps, the secondary high voltage is lowered to 500 volts, the main high voltage of the electron gun filament is raised to 30 kilovolts, and the main high voltage current is 0.03 amps, and then the electron beam of the electron gun is focused to the center of the crucible containing the metal target material. At this time, the electron beam scanning range is on the metal target material in the crucible. The power of the electron gun is adjusted to 36 kilowatts, and the electron beam scans the metal target material in the crucible, so that the metal target material is pre-melted for 30 minutes, and finally the metal target material reaches a molten state. At this time, the power of the electron beam is guaranteed to be not less than 36 kilowatts to ensure that the metal target material reaches a molten state in the crucible. In the subsequent coating process, the metal target material can be quickly vaporized, which is conducive to the electron beam evaporation silver plating. After the pre-melting of the metal target is completed, the electron gun filament can be kept in a preheated state by controlling the current and the secondary high voltage.

[0086] In some embodiments, step S200 may include step S230 of focusing the electron beam scanning range onto the first semi-finished substrate, and preheating the semi-finished substrate to 100° C. by scanning the first semi-finished substrate with the electron beam.

[0087] Specifically, the scanning power of the electron beam can be 36 kilowatts, and the scanning time for the first semi-finished substrate can be 1 minute. The first semi-finished substrate can keep rotating during the scanning process, and the rotation speed of the first semi-finished substrate can be 16 revolutions per minute. Thus, the surface of the first semi-finished substrate can be scanned alternately, and by controlling the electron beam scanning power, the first semi-finished substrate can be subjected to high-energy-density electron beam scanning. When the surface temperature of the first semi-finished substrate rises to a temperature exceeding the vaporization temperature of the impurities on the surface of the semi-finished substrate, the surface impurities of the first semi-finished substrate can be evaporated and removed, and by preheating the first semi-finished substrate, the stress in the subsequent coating process can be reduced, the activation energy of the deposition reaction can be increased, and the firmness of the metal layer can be enhanced. After the scanning is completed, the first semi-finished substrate can be preheated to 100°C, thereby achieving the effect of increasing the bonding force between the metal layer and the first anti-oxidation layer 20. This production process is easy to operate and highly efficient. In addition, the first semi-finished substrate keeps rotating during the scanning process, and by controlling the rotation speed, the surfaces of the base film layer 10 and the first anti-oxidation layer 20 can be scanned alternately. The scanning time is relatively short and will not exceed the phase change temperature and melting point temperature of the base film layer 10 and the first anti-oxidation layer 20, thereby avoiding deformation of the base film layer 10 and the first anti-oxidation layer 20 due to excessive temperature.

[0088] In some embodiments, step S200 may include step S240, adjusting the electron beam scanning range to the metal target in a molten state to perform electron beam evaporation coating.

[0089] In some embodiments, the evaporated metal may be uniformly attached to the surface of the first anti-oxidation layer 20 to form a metal layer 30 on the surface of the first anti-oxidation layer 20 .

[0090] Specifically, the vacuum chamber of the electron beam evaporation coating device can be 7.2×10 -3 Under the vacuum degree of 1.5 Pa, the electron beam scanning range is adjusted to the molten metal target, and the electron beam power is increased to 40 kilowatts to perform electron beam evaporation coating, so that the molten metal evaporates for 10 minutes. In this process, the thickness of the metal layer 30 formed by the electron beam evaporation coating can be controlled by controlling the electron beam power.

[0091] In some embodiments, the thickness of metal layer 30 may be 0.05 micrometers.

[0092] In some embodiments, step S200 may include step S250, cooling the second semi-finished substrate to room temperature, and then taking the second semi-finished substrate out of the vacuum chamber. The first semi-finished substrate plated with the metal layer 30 is the second semi-finished substrate.

[0093] Specifically, the method for forming the metal layer 30 is electron beam evaporation coating method. High-speed electrons are used to bombard the metal target in the crucible, and the kinetic energy of the electrons is converted into thermal energy, so that the metal target in the crucible is heated and evaporated to form a metal layer 30. Compared with the traditional magnetron sputtering coating process, the metal layer 30 obtained by the electron beam evaporation coating method has better adhesion, higher purity, high reliability, and will not be oxidized by the influence of environmental water and oxygen. High reliability means that the metal layer 30 does not oxidize and fall off after using high temperature and high humidity of 65°C / 95%RH for 1000 hours, and %RH is relative humidity.

[0094] In some embodiments, the preparation method may include step S300, preparing a second anti-oxidation adhesive, coating the second anti-oxidation adhesive on the side of the metal layer 30 away from the first anti-oxidation layer 20, and curing the second anti-oxidation adhesive to form a second anti-oxidation layer 40 on the surface of the metal layer 30.

[0095] In some embodiments, the second anti-oxidation layer 40 and the first anti-oxidation layer 20 may be prepared in the same process.

[0096] In some embodiments, step S300 (ie, the preparation process of the second anti-oxidation layer 40 ) may include step S310 , obtaining a main adhesive and a corrosion inhibitor, and stirring them to form a viscous, slurry-like second anti-oxidation adhesive.

[0097] In some embodiments, the main adhesive and the corrosion inhibitor can be obtained in a ratio of 20:1 by weight.

[0098] In some embodiments, the main adhesive and the corrosion inhibitor can be put into a mixer and dispersed and stirred for 10 minutes to form a viscous, slurry-like second antioxidant adhesive.

[0099] Similarly, an anti-oxidation layer or a hydrophobic layer may be formed in the second anti-oxidation layer 40 .

[0100] In some embodiments, the thickness of the second anti-oxidation layer 40 may be 5 micrometers.

[0101] Reference Figure 4 In some embodiments, the preparation method may include step S400 of preparing a protective layer 50 .

[0102] In some embodiments, the protection layer 50 may include a second substrate layer 53 , a second release layer 52 , and a composite adhesive layer 53 .

[0103] In some embodiments, a composite adhesive may be prepared and coated on a surface of the second release layer 52 away from the second substrate layer 53 to form a composite adhesive layer 53 on the surface of the second release layer 52 .

[0104] Specifically, in some embodiments, step S400 may include step S410, selecting a composite adhesive main agent, a curing agent, an organic solvent, and an auxiliary agent.

[0105] In some embodiments, the main agent of the composite adhesive may be acrylic resin, the curing agent may be toluene diisocyanate, the organic solvent may be ethyl acetate, and the auxiliary agent may be a leveling agent.

[0106] In some embodiments, acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent may be selected in a weight ratio of 100:4:100:15. The acrylic resin, toluene diisocyanate, ethyl acetate, and leveling agent are added to a blender and dispersed and stirred for 10 minutes to form a viscous, slurry-like composite adhesive.

[0107] In some embodiments, step S400 may include step 420, in which composite adhesive may be coated on the surface of the second release layer 52 away from the second substrate layer 53 to form a composite adhesive layer 51 on the surface of the second release layer 52, and the composite adhesive layer 51 may be baked to a semi-dry state at room temperature.

[0108] In some embodiments, when the hot stamping film is used, the second substrate layer 53 and the second release layer 52 can be torn off by the peeling effect of the second release layer 52, and then the hot stamping film can be attached to the target object by using the adhesiveness of the composite adhesive layer 51. The composite adhesive layer 51 has strong adhesiveness, and the hot stamping film can be attached to the target object by using the adhesiveness of the composite adhesive layer 51.

[0109] Specifically, the second anti-oxidation layer 40 may be bonded to the composite adhesive layer 51 of the protective layer 50 .

[0110] In some embodiments, the thickness of the second substrate layer 53 may be 45 micrometers or 65 micrometers.

[0111] In some embodiments, the thickness of the composite adhesive layer 51 may be 5 micrometers or 10 micrometers.

[0112] In other words, the thickness of the protection layer 50 may be 50 micrometers or 75 micrometers.

[0113] In some embodiments, the preparation method may include step S500 of preparing a base film layer 10 .

[0114] In some embodiments, a first anti-oxidation adhesive may be coated on the surface of the base film layer 10 , and the first anti-oxidation adhesive may be cured to form a first anti-oxidation layer 20 on the surface of the base film layer 10 .

[0115] In some embodiments, the base film layer 10 may include a first substrate layer 11, a first release layer 12, and a colored layer 13. The colored layer 13 may be disposed on a side of the first oxide layer 20 away from the metal layer 30, the first release layer 12 may be disposed on a side of the colored layer 13 away from the first oxide layer 20, and the first substrate layer 11 may be disposed on a side of the first release layer 12 away from the colored layer 13.

[0116] In some embodiments, step S500 (the method for preparing the base film layer 10 ) may include step S510 , preparing a colored layer 13 , and forming the colored layer 13 on a side of the first release layer 12 away from the first substrate layer 11 .

[0117] In some embodiments, the colored layer 13 may be made of dye and synthetic resin.

[0118] In some embodiments, the synthetic resin may include polyurethane, acrylic resin, epoxy resin, or the like.

[0119] In some embodiments, the preparation method of the colored layer 13 may include: mixing a dye and a synthetic resin in a certain proportion to form a colored solution, ensuring that the dye is evenly dispersed in the resin; coating a colored solvent on the side of the first release layer 12 away from the first substrate layer 11 to form a colored layer 13 on the first release layer 12.

[0120] In some embodiments, step S500 (the method for preparing the base film layer 10 ) may include step S510 , coating a release agent on one side of the first substrate layer 11 to form a first release layer 12 on the first substrate layer 11 .

[0121] In some embodiments, a first anti-oxidation glue may be coated on the surface of the colored layer 13 to form a first anti-oxidation layer 20 on the surface of the colored layer 13 , and the colored layer 13 and the first anti-oxidation layer 20 may be dried and cured at room temperature.

[0122] In some embodiments, the thickness of the base film layer 10 may be 50 microns.

[0123] In some embodiments, the thickness of the first substrate layer 11 may be 45 micrometers.

[0124] In some embodiments, the thickness of the first release layer 12 may be 4 micrometers.

[0125] In some embodiments, the thickness of the colored layer 13 may be 1 micrometer.

[0126] In some embodiments, the preparation method may include step S600, curing the finished product at room temperature for four days to solidify it.

[0127] The invention discloses a high reflectivity anti-oxidation hot stamping film, which may include, from bottom to top, a base film layer 10, a first anti-oxidation layer 20, a metal layer 30, a second anti-oxidation layer 40 and a protective layer 50.

[0128] In the present invention, the metal layer 30 is sandwiched between the first anti-oxidation layer 20 and the second anti-oxidation layer 40. The first anti-oxidation layer 20 and the second anti-oxidation layer 40 are respectively formed with an anti-oxidation layer and a hydrophobic layer, thereby effectively preventing external water vapor, oxygen, and halides from penetrating into the metal layer 30, and preventing corrosion from sulfur-containing gases.

[0129] In addition, the first anti-oxidation layer 20 and the second anti-oxidation layer 40 are sandwiched between the base film layer 10 and the protective layer 50, thereby ensuring that the hot stamping film is not easily scratched or damaged before use.

[0130] The materials of the first substrate layer 11 and the second substrate layer 53 can be PET plastic raw materials, such as polyethylene terephthalate. Advantages of PET plastic raw materials: 1. It has good mechanical properties, the impact strength is 3 to 5 times that of other films, and it has good folding resistance. 2. It is resistant to oil, fat, olefinic acid, dilute alkali, and most solvents; 3. It has excellent high and low temperature resistance, can be used for a long time in the temperature range of 120°C, can withstand high temperatures of 150°C for short-term use, and can withstand low temperatures of -70°C, and its mechanical properties are little affected by high and low temperatures; 4. It has low gas and water vapor permeability, and has excellent gas, water, oil and odor resistance; 5. It has high transparency, can block ultraviolet rays, and has good gloss; it is non-toxic, odorless, and has good hygiene and safety.

[0131] Specifically, the first substrate layer 11 and the second substrate layer 53 can play a very good protective role on the first anti-oxidation layer 20, the metal layer 30, and the second anti-oxidation layer 40, and can protect the metal layer 30 from being scratched and damaged.

[0132] In some embodiments, the light transmittance of the first substrate layer 11 and the second substrate layer 53 may be greater than or equal to 90%. In this case, the high light transmittance of the first substrate layer 11 and the second substrate layer 53 can be used to prevent the reflectivity of the metal layer 30 from being affected.

[0133] The reflectivity of aluminum is about 80%, and the reflectivity of silver is about 95%, so the silver coating has a higher reflectivity than the aluminum coating.

[0134] Therefore, when the present invention is used as a reflective film in a backlight component, its effect is better; secondly, when the present invention is used as an anti-counterfeiting label raw material, laser color hologram platemaking technology and precise molding technology are used to make anti-counterfeiting labels, which can be made into anti-counterfeiting labels with precise positioning, exquisite patterns, unique personality, super strong anti-counterfeiting and colorful colors. Compared with ordinary full-page hot stamping films, the present invention has higher anti-counterfeiting technology and higher anti-counterfeiting efficiency.

[0135] The materials of the first substrate layer 11 and the second substrate layer 53 may be selected from at least one of polyethylene terephthalate, polymethyl methacrylate, polycarbonate, polyamide, polyimide, or polystyrene.

[0136] In some embodiments, the thickness of the base film layer may be 50 microns, the thickness of the first anti-oxidation layer may be 5 microns, the thickness of the metal layer may be 0.05 microns, the thickness of the second anti-oxidation layer may be 5 microns, and the thickness of the protective layer 50 may be 50 microns or 75 microns.

[0137] Embodiment 2:

[0138] The difference between Example 2 and Example 1 lies in the thickness of each layer of the high-reflectivity anti-oxidation hot stamping film. According to the method principle of Example 1, a high-reflectivity anti-oxidation hot stamping film produced by Example 2 may have a base film layer thickness of 50 microns, a first anti-oxidation layer thickness of 7 microns, a metal layer thickness of 0.08 microns, a second anti-oxidation layer thickness of 7 microns, and a protective layer 50 thickness of 50 microns or 75 microns.

[0139] Embodiment three:

[0140] The difference between Example 3 and Example 1 lies in the thickness of each layer of the high-reflectivity anti-oxidation hot stamping film. According to the method principle of Example 1, Example 3 produces a high-reflectivity anti-oxidation hot stamping film, in which the base film layer has a thickness of 50 microns, the first anti-oxidation layer has a thickness of 8 microns, the metal layer has a thickness of 0.12 microns, the second anti-oxidation layer has a thickness of 8 microns, and the protective layer 50 has a thickness of 50 microns or 75 microns.

[0141] The following are specific examples and comparative examples, and their detailed formulas are shown in Table 1.

[0142] Table 1:

[0143] Embodiment 1 Embodiment 2 Embodiment 3 Basement membrane layer 50μm 50μm 50μμ m The first anti-oxidation layer 5μm 7μm 8μm Silver coating 0.05μm 0.08μm 0.12μm The second anti-oxidation layer 5μm 7μm 8μm Protective layer 50 / 75μm 50 / 75μm 50 / 75μm

[0144] The performance test was carried out and the results are shown in Table 2 below.

[0145] Table 2:

[0146] project Embodiment 1 Embodiment 2 Embodiment 3 Test method Reflectivity ≥95％ ≥96％ ≥97％ Reflectivity detector test Waterproof against vapor and oxygen penetration PASS PASS PASS Gas Permeability Test Anti-halide penetration PASS PASS PASS Halide Permeability Test Anti-corrosion of sulfurous gas PASS PASS PASS Sulfur gas corrosion test Peel high strength ICA-CL-PI 7N / em 7N / cm 7N / cm IPC-TM 650-2.4.9 Peel strength ICA-CL-CU 7N / em 7N / cm 7N / em IPC-TM 650-2.4.9 Chemical resistance PASS PASS PASS JISC 64711995-9.2 ROHS PASS PASS PASS 2011 / 66 / EU REACH 219 PASS PASS PASS N01907 / 2006 Halogen Free 50 / 75μμ m 50 / 75μm 50 / 75μm BS SEN 14582:2007

[0147] From Table 1 and Table 2, it can be seen that the high reflectivity anti-oxidation hot stamping films prepared in the above three embodiments have excellent performance in water vapor, oxygen, halide permeability, sulfur-containing gas corrosion resistance, reflectivity and other indicators.

[0148] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An anti-oxidation hot stamping film, characterized in that: The invention comprises a first anti-oxidation layer, a metal layer and a second anti-oxidation layer, wherein the metal layer is arranged between the first anti-oxidation layer and the second anti-oxidation layer, the first anti-oxidation layer is configured to prevent impurities on a side of the first anti-oxidation layer away from the metal layer from penetrating into the metal layer, and the second anti-oxidation layer is configured to prevent impurities on a side of the second anti-oxidation layer away from the metal layer from penetrating into the metal layer.

2. The anti-oxidation hot stamping film according to claim 1, characterized in that: The metal layer is at least one of a silver layer, a copper layer, an iron layer, a nickel layer and a zinc layer.

3. The anti-oxidation hot stamping film according to claim 1, characterized in that: The first anti-oxidation layer comprises a main adhesive and a corrosion inhibitor, and the second anti-oxidation layer comprises a main adhesive and a corrosion inhibitor.

4. The anti-oxidation hot stamping film according to claim 1, characterized in that: It also includes a base film layer, which is arranged on a side of the first oxide layer away from the metal layer.

5. The anti-oxidation hot stamping film according to claim 3, characterized in that: The corrosion inhibitor is octadecyl mercaptan.

6. The anti-oxidation hot stamping film according to claim 4, characterized in that: The base film layer includes a first substrate layer, a first release layer, and a colored layer. The colored layer is arranged on a side of the first oxide layer away from the metal layer, the first release layer is arranged on a side of the colored layer away from the first oxide layer, and the first substrate layer is arranged on a side of the first release layer away from the colored layer.

7. The anti-oxidation hot stamping film according to claim 1, characterized in that: It also includes a protective layer, which is arranged on a side of the second anti-oxidation layer away from the metal layer.

8. The anti-oxidation hot stamping film according to claim 7, characterized in that: The protective layer includes a second substrate layer, a second release layer and a composite adhesive layer, the composite adhesive layer is bonded to the second anti-oxidation layer, the second release layer is arranged on a side of the composite adhesive layer away from the second anti-oxidation layer, and the second substrate layer is arranged on a side of the second release layer away from the composite adhesive layer.

9. A method for preparing an anti-oxidation hot stamping film, characterized in that: The preparation method steps are as follows: preparing a first anti-oxidation layer; Evaporating a coating on the surface of the first anti-oxidation layer to form a metal layer on the surface of the first anti-oxidation layer; The second anti-oxidation adhesive is coated on a side of the metal layer away from the first anti-oxidation layer, and the second anti-oxidation adhesive is cured to form the second anti-oxidation layer on the surface of the metal layer.

10. The preparation method according to claim 9, characterized in that: The preparation method further comprises: preparing a protective layer, and laminating the protective layer to a side of the second anti-oxidation layer away from the metal layer.

11. The preparation method according to claim 9, characterized in that: The preparation method also includes: preparing a base film layer; coating a first anti-oxidation adhesive on the surface of the base film layer, and curing the first anti-oxidation adhesive to form the first anti-oxidation layer on the surface of the base film layer.

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