Semiconductor package resin material supply device

Abstract

The application provides a semiconductor packaging resin material supply device, which comprises a bottom plate, a weighing and metering unit installed on the bottom plate, a first moving part and a support, a first vibrator and an adjusting assembly installed on the support, a locking assembly installed on the first vibrator, a resin box installed on the locking assembly, a conveying track installed on the weighing and metering unit, a spraying track slidingly installed on the adjusting assembly, a second moving part installed on the first moving part, a resin platform installed on the second moving part, and a resin tray placed on the resin platform; automatic opening and closing are realized through a moving cylinder, the resin box is convenient to replace, and the need for manual intervention is reduced; a lifting cylinder and a suction cup can be adjusted according to resin trays of different sizes, and a U-shaped groove is used for limiting the sliding distance of a moving plate and preventing the moving plate from exceeding a safe range.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging resin material supply device, in particular to the technical field of resin supply. Background Art

[0002] With the rapid development of the modern electronics industry, particularly the increasingly miniaturized and high-performance trends in semiconductor devices, the requirements for semiconductor packaging processes are becoming increasingly stringent. Resin materials, as a critical packaging medium, are crucial in the semiconductor packaging process. Their supply and processing accuracy directly impact the quality and performance of the final product. Traditional resin material supply systems often suffer from uneven feeding, low metering accuracy, and insufficient automation. These issues not only impact production efficiency but can also lead to increased product defect rates.

[0003] Traditional equipment often struggles to ensure a stable supply of resin materials, especially when precise control of material dosage is required. This can easily lead to oversupply or undersupply, which in turn affects the packaging effect. Due to the lack of efficient weighing and metering methods, existing equipment struggles to achieve high-precision metering of resin materials, directly leading to issues with the consistency of finished products.

[0004] The operating procedures of traditional equipment are cumbersome and require frequent manual intervention, which increases production costs and the probability of errors. For different types of resin materials or different production process requirements, existing equipment often shows low adaptability and flexibility and cannot be quickly adjusted to meet diverse needs. Summary of the Invention

[0005] Purpose of the invention: To propose a semiconductor packaging resin material supply device to solve the above-mentioned problems existing in the prior art.

[0006] Technical solution: A semiconductor packaging resin material supply device, comprising:

[0007] A base plate, a weighing and metering unit mounted on the base plate, a first moving part and a bracket, a first vibrator and an adjustment assembly mounted on the bracket, a locking assembly mounted on the first vibrator, a resin box mounted on the locking assembly, a conveying track mounted on the weighing and metering unit, a spraying track slidably mounted on the adjustment assembly, a second moving part mounted on the first moving part, a resin platform mounted on the second moving part, and a resin tray placed on the resin platform;

[0008] The locking assembly includes a fixed plate mounted on the bracket, a movable plate slidably mounted on the fixed plate, a movable cylinder mounted on the fixed plate, and a clamping plate mounted on the output end of the movable cylinder, wherein the clamping plate is slidably connected to the fixed plate and a sliding guide rail is provided at the connection;

[0009] The adjustment assembly includes a support frame mounted on the bracket and an adjustment frame movably mounted on the support plate.

[0010] The conveying track includes a second vibrator movably mounted on the weighing and metering unit, a guide trough mounted on the second vibrator, and a funnel arranged on the guide trough and connected to the bottom plate;

[0011] The spraying track includes a guide plate slidably mounted on the adjustment frame, a guide plate mounted in the guide plate and arranged in the same direction as the guide groove, and a cover plate mounted on the guide plate.

[0012] In a further embodiment, the resin box is further provided with a box cover, and the cover is hinged to the resin box; a baffle is provided on one side of the resin box and is close to the funnel position, the baffle is slidably fitted with the resin box and a positioning pin installed on the baffle is provided at the fitting position, the positioning pin is threaded with the resin box and abuts against the baffle.

[0013] In a further embodiment, the resin box is provided with a discharge port located above the funnel, the discharge port is located above the funnel, a plurality of guide grooves are provided, and the funnel is located above the guide grooves.

[0014] In a further embodiment, the first movable part and the second movable part both include a screw, a slider sleeved on and engaged with the screw, and a motor installed at one end of the screw; a partition is provided in the first movable part and the second movable part, and the partition is installed on the slider in the first movable part; a lifting cylinder is also provided between the resin platform and the resin tray, the slider on the second movable part is connected to the lifting cylinder, and the output end of the lifting cylinder is connected to the resin tray; a suction cup is provided in the resin platform.

[0015] In a further embodiment, the first vibrator is connected to the bracket via a shock absorber, and the second vibrator is connected to the weighing and metering unit via a shock absorber.

[0016] In a further embodiment, the fixed plate is further provided with a U-shaped groove for limiting the sliding distance of the movable plate; the movable plate is located between the fixed plate and the baffle.

[0017] In a further embodiment, the support frame is rotatably connected to the adjustment frame and a locking bolt is provided at the connection; the adjustment frame is slidably connected to the guide plate and a positioning bolt is provided at the connection.

[0018] In a further embodiment, a scraper is provided on one side of the funnel, and the scraper is placed in the guide groove with a gap between the scraper and the guide groove.

[0019] Beneficial effects: The present invention proposes a semiconductor packaging resin material supply device, which realizes automatic opening and closing through a moving cylinder, facilitates the replacement of resin boxes, and reduces the need for manual intervention; the lifting cylinder and the suction cup can be adjusted according to resin trays of different sizes, and the U-shaped groove is used to limit the sliding distance of the moving plate to prevent the moving plate from exceeding the safety range; the locking assembly allows the resin box to be installed and removed quickly and safely; the second vibrator, the guide groove and the funnel ensure that the resin material can be smoothly transported to the designated position, and the scraper helps to remove the residual resin material adhering to the wall of the guide groove; the guide plate, the guide plate and the cover plate ensure that the resin material is accurately distributed along the predetermined path to prevent the material from scattering; the box cover and the baffle protect the resin material from external contamination, and also facilitate the control of the unloading amount; the positioning pin ensures a close fit between the baffle and the resin box, ensuring the stability of the unloading process; the first moving part and the second moving part can flexibly adjust the position of the resin box according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a first-view stereoscopic structural diagram of the present invention.

[0021] Figure 2 This is a structural diagram of the guide plate installation of the present invention.

[0022] Figure 3 It is a structural diagram of the position of the splint of the present invention.

[0023] Figure 4 This is a diagram of the matching structure of the fixing plate and the clamping plate of the present invention.

[0024] Figure 5 It is the front view of the present invention.

[0025] Figure 6 It is a top view of the present invention.

[0026] Figure 7 It is a rear view of the present invention.

[0027] Figure 8 This is a second perspective three-dimensional structural diagram of the present invention.

[0028] The accompanying drawings are marked as follows: 1. base plate; 2. resin box; 3. locking assembly; 4. spraying track; 5. resin platform; 6. second moving part; 7. first moving part; 8. adjustment assembly; 9. conveying track; 11. weighing and metering unit; 12. bracket; 21. box cover; 22. baffle; 23. positioning pin; 31. fixed plate; 32. moving plate; 33. moving cylinder; 34. clamping plate; 35. sliding guide rail; 41. guide plate; 42. guide plate; 43. cover plate; 51. resin tray; 81. support frame; 82. adjustment frame; 83. locking bolt; 84. positioning bolt; 91. second vibrator; 92. funnel; 93. guide trough; 121. first vibrator; 921. scraper. DETAILED DESCRIPTION

[0029] The applicant believes that traditional equipment often finds it difficult to ensure a stable supply of resin materials, especially when the amount of material needs to be precisely controlled. It is easy for too much or too little to occur, which in turn affects the packaging effect. Due to the lack of efficient weighing and metering methods, existing equipment is difficult to achieve high-precision measurement of resin materials, which directly leads to consistency problems in the finished products. Therefore, rapid adjustments are necessary to meet diverse needs.

[0030] In order to solve the problems existing in the prior art, a semiconductor packaging resin material supply device is proposed, comprising:

[0031] A base plate 1, a weighing and metering unit 11 mounted on the base plate 1, a first moving part 7 and a bracket 12, a first vibrator 121 and an adjustment component 8 mounted on the bracket 12, a locking component 3 mounted on the first vibrator 121, a resin box 2 mounted on the locking component 3, a conveying track 9 mounted on the weighing and metering unit 11, a spraying track 4 slidably mounted on the adjustment component 8, a second moving part 6 mounted on the first moving part 7, a resin platform 5 mounted on the second moving part 6, and a resin tray 51 placed on the resin platform 5.

[0032] The resin box 2 is also provided with a box cover 21, and the cover plate 43 is hingedly connected to the resin box 2. A baffle 22 is provided on one side of the resin box 2 and is located near the funnel 92. The baffle 22 slides with the resin box 2 and is provided with a positioning pin 23 mounted on the baffle 22 at the point of engagement. The positioning pin 23 is threadedly engaged with the resin box 2 and abuts against the baffle 22. The resin box 2 has a discharge port located above the funnel 92. The discharge port is located above the funnel 92.

[0033] The first movable part 7 and the second movable part 6 both include a screw, a slider sleeved on the screw and engaged with the screw, and a motor installed at one end of the screw; a partition is provided in the first movable part 7 and the second movable part 6, and the partition is installed on the slider in the first movable part 7; a lifting cylinder is also provided between the resin platform 5 and the resin tray 51, the slider on the second movable part 6 is connected to the lifting cylinder, and the output end of the lifting cylinder is connected to the resin tray 51; a suction cup is provided in the resin platform 5; the first vibrator 121 is connected to the bracket 12 through a shock absorber.

[0034] The locking assembly 3 includes a fixed plate 31 mounted on the bracket 12, a movable plate 32 slidably mounted on the fixed plate 31, a movable cylinder 33 mounted on the fixed plate 31, and a clamping plate 34 mounted on the output end of the movable cylinder 33. The clamping plate 34 is slidably connected to the fixed plate 31 and a sliding guide rail 35 is provided at the connection; the fixed plate 31 is also provided with a U-shaped groove for limiting the sliding distance of the movable plate 32; the movable plate 32 is located between the fixed plate 31 and the baffle 22.

[0035] The adjustment assembly 8 includes a support frame 81 installed on the bracket 12 and an adjustment frame 82 movably installed on the support plate. The support frame 81 is rotatably connected to the adjustment frame 82 and a locking bolt 83 is provided at the connection. The adjustment frame 82 is slidably connected to the guide plate 41 and a positioning bolt 84 is provided at the connection.

[0036] The conveyor track 9 includes a second vibrator 91 movably mounted on the weighing and metering unit 11, a guide trough 93 mounted on the second vibrator 91, and a funnel 92 disposed on the guide trough 93 and connected to the bottom plate 1. The guide troughs 93 are provided in plurality, and the funnel 92 is located above the guide troughs 93. The second vibrator 91 is connected to the weighing and metering unit 11 via a shock absorber. A scraper 921 is provided on one side of the funnel 92, which is positioned within the guide trough 93 with a gap between the scraper 921 and the guide trough 93.

[0037] The spraying track 4 includes a guide plate 41 slidably mounted on the adjustment frame 82 , a guide plate 42 mounted in the guide plate 41 and arranged in the same direction as the guide groove 93 , and a cover plate 43 mounted on the guide plate 41 .

[0038] Working principle: Open the lid 21 on the resin box 2, pour an appropriate amount of semiconductor encapsulation resin material into the resin box 2, and close the lid 21; the movable cylinder 33 in the locking assembly 3 drives the clamping plate 34, causing the clamping plate 34 to slide along the fixed plate 31 and cooperate with the baffle 22, thereby firmly fixing the resin box 2; the positioning pin 23 ensures the precise position of the baffle 22 to prevent it from accidentally sliding; the U-shaped groove on the fixed plate 31 limits the maximum sliding distance of the movable plate 32, and the first vibrator 121 is started to work, slightly vibrating the resin box 2, so that the resin material can flow evenly to the discharge port near the funnel 92;

[0039] As the resin material enters the hopper 92 through the discharge port, the weighing and metering unit 11 monitors the weight of the resin material in real time. Once the preset value is reached, the first vibrator 121 automatically stops, preventing further material discharge. The adjustment assembly 8 adjusts the position of the spray track 4 as needed to accommodate resin trays 51 of different sizes or shapes. The guide plate 42 ensures that the resin material is accurately distributed along the predetermined path, while the cover plate 43 prevents the material from scattering during transportation.

[0040] The scraper 921 removes residues as the resin material passes through the guide groove 93, keeping the channel clean and unobstructed. The second vibrator 91 is activated, driving the guide groove 93 to vibrate, helping the resin material to flow smoothly from the funnel 92 into the conveyor track 9 and eventually reach the designated position. The motor then drives the slider on the screw rod to achieve horizontal movement of the resin platform 5 and its resin tray 51.

[0041] When the resin tray 51 reaches the designated position, the lifting cylinder lifts the tray to a suitable height for the next operation, and the suction cup is used to stabilize the resin tray 51 to prevent it from moving. After completing the task, the system automatically stops all moving parts, releases the locking assembly 3, and prepares for the next operation.

[0042] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes may be made to it in form and detail without departing from the spirit and scope of the present invention as defined in the appended claims.

Claims

1. A semiconductor encapsulation resin material supply device, comprising: A base plate, a weighing and metering unit mounted on the base plate, a first moving part and a bracket, a first vibrator and an adjustment assembly mounted on the bracket, a locking assembly mounted on the first vibrator, a resin box mounted on the locking assembly, a conveying track mounted on the weighing and metering unit, a spraying track slidably mounted on the adjustment assembly, a second moving part mounted on the first moving part, a resin platform mounted on the second moving part, and a resin tray placed on the resin platform; It is characterized in that the locking assembly includes a fixed plate mounted on the bracket, a movable plate slidably mounted on the fixed plate, a movable cylinder mounted on the fixed plate, and a clamping plate mounted on the output end of the movable cylinder, wherein the clamping plate is slidably connected to the fixed plate and a sliding guide rail is provided at the connection; The adjustment assembly includes a support frame mounted on the bracket and an adjustment frame movably mounted on the support frame. The conveying track includes a second vibrator movably mounted on the weighing and metering unit, a guide trough mounted on the second vibrator, and a funnel arranged on the guide trough and connected to the bottom plate; The spraying track includes a guide plate slidably mounted on the adjustment frame, a guide plate mounted in the guide plate and arranged in the same direction as the guide groove, and a cover plate mounted on the guide plate; The first movable part and the second movable part each include a screw, a slider sleeved on and engaged with the screw, and a motor mounted on one end of the screw; a partition is provided between the first movable part and the second movable part, and the partition is mounted on the slider in the first movable part; a lifting cylinder is further provided between the resin platform and the resin tray; the slider on the second movable part is connected to the lifting cylinder, and the output end of the lifting cylinder is connected to the resin tray; a suction cup is provided inside the resin platform; The support frame is rotatably connected to the adjustment frame and a locking bolt is provided at the connection. The adjustment frame is slidably connected to the guide plate and a positioning bolt is provided at the connection.

2. A semiconductor encapsulation resin material supply device according to claim 1, characterized in that: The resin box is also provided with a box cover, and the cover is hinged to the resin box; a baffle is provided on one side of the resin box and is close to the funnel position, the baffle is slidably matched with the resin box and a positioning pin installed on the baffle is provided at the matching position, the positioning pin is threaded with the resin box and abuts against the baffle.

3. A semiconductor encapsulation resin material supply device according to claim 1, characterized in that: The resin box is provided with a discharge port above the funnel. The discharge port is located above the funnel. A plurality of guide grooves are provided and the funnel is located above the guide grooves.

4. A semiconductor encapsulation resin material supply device according to claim 1, characterized in that: The first vibrator is connected to the bracket through a shock absorber, and the second vibrator is connected to the weighing and metering unit through a shock absorber.

5. The semiconductor encapsulation resin material supply device according to claim 1, wherein: The fixed plate is further provided with a U-shaped groove for limiting the sliding distance of the movable plate; the movable plate is located between the fixed plate and the baffle.

6. The semiconductor encapsulation resin material supply device according to claim 1, wherein: A scraper is provided on one side of the funnel, and the scraper is placed in the guide groove with a gap between the scraper and the guide groove.

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