A PCB gold panel printing anti-diffusion agent and its preparation and use method

Abstract

The present invention discloses a PCB gold panel printing anti-diffusion agent and its preparation and use method, and relates to the field of printed circuit board production technology. The anti-diffusion agent is composed of the following mass percentage components: the first oleophobic agent 0.05-0.3%, the second oleophobic agent 0.1-0.7%, the adhesion promoter 0.2-1.5%, the wetting agent 0.5-4.0%, the cosolvent 0.1-5.0%, and the remainder is water; the first oleophobic agent is an aminofluorophenol compound, and the second oleophobic agent is a halobenzyl alcohol compound. The present invention provides a PCB gold panel printing anti-diffusion agent and its preparation and use method, the anti-diffusion agent contains the first oleophobic agent, the second oleophobic agent and other effective ingredients, can form an organic layer on the gold surface of the circuit board and the substrate surface, strengthen the anti-diffusion ability and adhesion of the gold surface and the substrate surface with ink, prevent the diffusion of inkjet printing ink, and improve the product qualification rate of the PCB gold panel printing solder mask process.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit board production, and in particular to a PCB gold panel printing anti-diffusion agent and a preparation and use method thereof. Background Art

[0002] PCB inkjet printing technology is a digital inkjet technology used in the production of printed circuit boards (PCBs). The technical principle is to apply an electrical signal to a piezoelectric crystal, causing the piezoelectric crystal to deform and squeeze the ink cavity, squeezing the ink from the nozzle to form tiny ink droplets that are sprayed onto the PCB surface. The inkjet machine sprays ink according to a predetermined pattern and program, ultimately forming the desired circuits, characters, solder mask and other graphics, and then solidifies the ink through a curing method to stably adhere the graphics to the PCB.

[0003] PCB inkjet printing technology can not only meet the needs of fine graphics and high-density PCB manufacturing, but also achieve micron-level accuracy and can print fine lines and fine-pitch patterns. It can also be customized on demand to meet the printing needs of PCBs of different designs, sizes, and shapes, and quickly realize design changes and prototype production. Inkjet printing technology is non-contact printing, which reduces physical damage to PCB boards and can improve the yield rate of production. Compared with traditional screen printing, PCB inkjet printing reduces the generation of chemical waste and wastewater, which is in line with the green and environmentally friendly production concept.

[0004] Inkjet printing technology has achieved industrial development in the field of PCB character printing. Although circuit and solder mask graphic printing technology has made certain progress, it is still difficult to achieve mass production. Ink adhesion and anti-diffusion performance are the problems that plague the development of inkjet printing technology in the PCB field. From the perspective of PCB board materials, if the surface tension of the board is lower than that of the ink, it is difficult for the ink to spread on its surface and form good adhesion; if the surface roughness is not suitable, the surface is too smooth or rough, and the ink is difficult to cover evenly, which will affect the adhesion and anti-diffusion performance.

[0005] Existing patents introduce methods related to inkjet printing technology. Chinese patent CN114845474B introduces a method for printing graphic solder mask on PCB, using an anti-diffusion liquid to pre-treat the PCB. The anti-diffusion liquid contains effective ingredients such as bonding agent, reinforcing agent, wetting agent, accelerator, stabilizer, etc., which can effectively prevent the diffusion of ink on the substrate during the printing process. The contact angle between the substrate surface and the solder mask ink is greater than 80°. This method introduces a method for improving the contact angle between the substrate surface and the ink, but the diffusion performance of the copper surface and the ink is very poor. Chinese patent CN118290987A discloses a method for preparing a PCB inkjet printing anti-diffusion agent and a method for using the agent, which is used for the pretreatment process in the PCB inkjet printing solder mask process. The anti-diffusion liquid contains effective ingredients such as oleophobic agent 1, oleophobic agent 2, wetting agent, stabilizer, and cosolvent, and can form an organic layer on the copper surface and substrate surface of the circuit board to strengthen the bonding force between the copper surface and the substrate surface and the ink. The contact angle between the copper surface and the solder mask ink is greater than 90°, and the contact angle between the substrate surface and the solder mask ink is greater than 80°, which can prevent the ink from spreading on the copper surface and the substrate surface.

[0006] The existing technology solves the problem of inkjet ink diffusion on the copper surface and the substrate surface, effectively slows down the ink diffusion speed, and helps to promote the application of inkjet printing technology on mainstream PCB boards. However, the existing technology has a poor anti-diffusion effect on gold-surface PCB boards. The existing technology adopts the "super-roughening + anti-diffusion agent" mode, which is more suitable for copper boards. Gold-surface PCB boards cannot be super-roughened, and the ink adhesion will be very poor. At the same time, the effect of the gold-surface anti-diffusion agent is also difficult to achieve a high contact angle. Therefore, a PCB gold-surface anti-diffusion agent is needed to maintain a good contact angle between the gold surface and the substrate and the ink, and at the same time provide a strong ink adhesion to the substrate surface, to ensure that the inkjet printing process of the PCB gold panel can be successfully completed, thereby expanding the application scope of inkjet printing technology in the PCB field. Summary of the invention

[0007] In order to solve the above technical problems, the present invention provides a PCB gold panel printing anti-diffusion agent and its preparation and use method, which is used in the anti-diffusion process in the PCB gold panel inkjet printing solder mask process. The PCB gold panel printing anti-diffusion agent contains a first oleophobic agent, a second oleophobic agent, an adhesion promoter, a wetting agent, and a cosolvent as effective ingredients, which can form an organic thin layer on the gold surface and the substrate surface of the circuit board, strengthen the bonding force between the gold surface and the substrate surface and the ink, and at the same time alleviate the diffusion of the inkjet printing ink on the gold surface and the substrate surface, thereby improving the yield of the gold surface inkjet printing solder mask.

[0008] Among them, the anti-diffusion agent for PCB gold panel printing mainly relies on the synergistic effect of the functional groups in the two oleophobic agents to enhance the bonding effect between the ink and the gold surface and the substrate surface, and realize the bonding link effect of "ink-multi-functional thin layer-gold surface and substrate surface"; the adhesion promoter mainly acts on the surface of the board to improve the adhesion of the gold surface and the substrate surface, and ensure the yield of the post-processing process; the wetting agent is a kind of substance containing both hydrophilic and oleophilic functional groups, which can reduce the surface tension of the copper surface and the substrate surface, so that the oleophobic component in the anti-diffusion agent can fully contact the surface of the circuit board, which is beneficial to the full bonding between the circuit board surface and the ink; the co-solvent can fully dissolve the insoluble substances in the components to form a stable solution.

[0009] The specific technical solutions include the following:

[0010] In a first aspect, a PCB gold panel printing anti-diffusion agent is provided, which is composed of the following components in mass percentage: 0.05-0.3% of a first oleophobic agent, 0.1-0.7% of a second oleophobic agent, 0.2-1.5% of an adhesion promoter, 0.5-4.0% of a wetting agent, 0.1-5.0% of a cosolvent, and the balance is water; the first oleophobic agent is an aminofluorophenol compound, the second oleophobic agent is a halobenzyl alcohol compound, the adhesion promoter is a disilazane compound derivative, the wetting agent is an alkyl ester compound, and the cosolvent is a diphenyl sulfide derivative.

[0011] Furthermore, the PCB gold panel printing anti-diffusion agent is composed of the following components in mass percentage: 0.05-0.2% of a first oleophobic agent, 0.1-0.4% of a second oleophobic agent, 0.2-1.0% of an adhesion promoter, 0.5-2.5% of a wetting agent, 0.1-3.0% of a cosolvent, and the balance is water.

[0012] Furthermore, the mass ratio of the first oleophobic agent to the second oleophobic agent is 1:(1.0-3.0).

[0013] Furthermore, the first oleophobic agent is selected from one or more of 4-amino-2-fluorophenol (CAS No.: 399-96-2), 2-amino-4-fluorophenol (CAS No.: 399-97-3), and 4-amino-3-fluorophenol (CAS No.: 399-95-1), and the second oleophobic agent is selected from one or more of 2-fluorobenzyl alcohol (CAS No.: 446-51-5), 3-fluorobenzyl alcohol (CAS No.: 456-47-3), and 4-fluorobenzyl alcohol (CAS No.: 459-56-3).

[0014] Furthermore, the adhesion promoter is selected from one or more of hexamethyldisilazane (CAS No.: 999-97-3), heptamethyldisilazane (CAS No.: 920-68-3), and 1,1,3,3-tetramethyldisilazane (CAS No.: 15933-59-2).

[0015] Furthermore, the wetting agent is selected from one or more of 2-dodecyl acrylate (CAS No.: 2156-97-0), hexadecyl lactate (CAS No.: 35274-05-6), and dodecyl stearate (CAS No.: 5303-25-3).

[0016] Furthermore, the co-solvent is selected from one or more of 4,4'-dihydroxydiphenyl sulfide (CAS No.: 2664-63-3), 4-tert-butyl diphenyl sulfide (CAS No.: 85609-03-6), and 4,4'-diaminodiphenyl sulfide (CAS No.: 139-65-1).

[0017] Preferably, the water is tap water or DI water.

[0018] In a second aspect, a method for preparing a PCB gold panel printing anti-diffusion agent as described in the first aspect is provided, comprising the following steps: weighing a first oleophobic agent, a second oleophobic agent adhesion promoter, a wetting agent, a co-solvent and the remainder of water in sequence according to the formula and adding them into a reactor, stirring and mixing at a normal temperature of 25-28°C for 30-35 minutes to obtain a PCB gold panel printing anti-diffusion agent.

[0019] In a third aspect, a method for using the anti-diffusion agent for printing the PCB gold panel as described in the first aspect is provided, comprising the following steps: configuring the anti-diffusion agent for printing the PCB gold panel as described in the first aspect into a bath liquid with a mass concentration of 5%, and performing surface treatment on the PCB gold panel.

[0020] Furthermore, the surface treatment temperature is 25±2°C and the line speed is 4.0±0.2 m / min.

[0021] The beneficial effects of the present invention are:

[0022] The PCB gold panel printing anti-diffusion agent contains the first oleophobic agent, the second oleophobic agent, the adhesion promoter, the wetting agent, and the co-solvent as effective ingredients. These ingredients can form an organic thin layer on the gold surface and the substrate surface of the circuit board, strengthen the bonding force between the gold surface and the substrate surface and the ink, and at the same time alleviate the diffusion of the printing ink on the gold surface and the substrate surface, thereby improving the yield rate of the gold surface printing solder mask.

[0023] Among them, the anti-diffusion agent for printing PCB gold panels mainly relies on the synergistic effect of the functional groups in the two oleophobic agents to enhance the bonding effect between the ink and the gold surface and the substrate surface, and achieve the bonding link effect of "ink-multi-functional thin layer-gold surface and substrate surface". DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0026] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0027] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0028] In order to more fully understand the technical content of the present invention, the technical solution of the present invention is further introduced and illustrated in conjunction with specific embodiments below.

[0029] Example 1

[0030] A PCB gold panel printing anti-diffusion agent is composed of the following components in percentage by mass: 0.1% of a first oleophobic agent (4-amino-2-fluorophenol), 0.3% of a second oleophobic agent (2-fluorobenzyl alcohol), 0.5% of an adhesion promoter (hexamethyldisilazane), 1.5% of a wetting agent (2-dodecyl acrylate), 1.5% of a cosolvent (4,4'-dihydroxydiphenyl sulfide), and the balance is water (DI water).

[0031] The preparation method of the PCB gold panel printing anti-diffusion agent comprises the following steps: weighing a first oleophobic agent, a second oleophobic agent adhesion promoter, a wetting agent, a cosolvent and the remaining water in sequence according to a formula and adding them into a reaction kettle, stirring and mixing at a room temperature of 25° C. for 30 minutes to obtain the PCB gold panel printing anti-diffusion agent.

[0032] Example 2

[0033] A PCB gold panel printing anti-diffusion agent is composed of the following components in percentage by mass: 0.1% of a first oleophobic agent (2-amino-4-fluorophenol), 0.3% of a second oleophobic agent (3-fluorobenzyl alcohol), 0.5% of an adhesion promoter (heptamethyldisilazane), 1.5% of a wetting agent (hexadecyl lactate), 1.5% of a cosolvent (4-tert-butyldiphenyl sulfide), and the balance is water (DI water).

[0034] Example 3

[0035] A PCB gold panel printing anti-diffusion agent is composed of the following components in percentage by mass: 0.1% of a first oleophobic agent (4-amino-3-fluorophenol), 0.3% of a second oleophobic agent (4-fluorobenzyl alcohol), 0.5% of an adhesion promoter (1,1,3,3-tetramethyldisilazane), 1.5% of a wetting agent (dodecyl stearate), 1.5% of a cosolvent (4,4'-diaminodiphenyl sulfide), and the balance is water (DI water).

[0036] Example 4

[0037] A PCB gold panel printing anti-diffusion agent is composed of the following components in percentage by mass: 0.1% of a first oleophobic agent (4-amino-3-fluorophenol), 0.3% of a second oleophobic agent (2-fluorobenzyl alcohol), 0.5% of an adhesion promoter (hexamethyldisilazane), 1.5% of a wetting agent (dodecyl stearate), 1.5% of a cosolvent (4-tert-butyl diphenyl sulfide), and the balance is water (DI water).

[0038] Example 5

[0039] A PCB gold panel printing anti-diffusion agent is composed of the following components in percentage by mass: 0.05% of a first oleophobic agent (4-amino-2-fluorophenol), 0.1% of a second oleophobic agent (2-fluorobenzyl alcohol), 0.2% of an adhesion promoter (hexamethyldisilazane), 0.5% of a wetting agent (2-dodecyl acrylate), 0.1% of a cosolvent (4,4'-dihydroxydiphenyl sulfide), and the balance is water (DI water).

[0040] Example 6

[0041] A PCB gold panel printing anti-diffusion agent is composed of the following components in percentage by mass: 0.2% of a first oleophobic agent (4-amino-2-fluorophenol), 0.4% of a second oleophobic agent (2-fluorobenzyl alcohol), 1.0% of an adhesion promoter (hexamethyldisilazane), 2.5% of a wetting agent (2-dodecyl acrylate), 3.0% of a cosolvent (4,4'-dihydroxydiphenyl sulfide), and the balance is water (DI water).

[0042] Comparative Example 1

[0043] The only difference between Comparative Example 1 and Example 1 is that the first oleophobic agent is not contained in the component.

[0044] Comparative Example 2

[0045] The only difference between Comparative Example 2 and Example 1 is that the component does not contain the second oleophobic agent.

[0046] Comparative Example 3

[0047] The only difference between Comparative Example 3 and Example 1 is that the components do not contain an adhesion promoter.

[0048] Comparative Example 4

[0049] The only difference between Comparative Example 4 and Example 1 is that the components do not contain a wetting agent.

[0050] Comparative Example 5

[0051] The only difference between Comparative Example 5 and Example 1 is that the components do not contain a co-solvent.

[0052] Comparative Example 6

[0053] The only difference between Comparative Example 6 and Example 1 is that the mass percentage content of the first oleophobic agent in the component is 0.4%.

[0054] Comparative Example 7

[0055] The only difference between Comparative Example 7 and Example 1 is that the mass percentage content of the second oleophobic agent in the component is 0.8%.

[0056] Comparative Example 8

[0057] The only difference between Comparative Example 8 and Example 1 is that the mass percentage content of the adhesion promoter in the component is 2.0%.

[0058] Comparative Example 9

[0059] The only difference between Comparative Example 9 and Example 1 is that the mass percentage content of the wetting agent in the component is 5.0%.

[0060] Comparative Example 10

[0061] The only difference between Comparative Example 10 and Example 1 is that the mass percentage content of the co-solvent in the component is 6.0%.

[0062] Comparative Example 11

[0063] Compared with Example 1, Comparative Example 11 is different only in that the mass percentage content of the first oleophobic agent in the component is 0.2%, and the mass percentage content of the second oleophobic agent is 0.1%, that is, the mass ratio of the first oleophobic agent to the second oleophobic agent is 1:0.5, which is lower than the limit value of the present invention.

[0064] Comparative Example 12

[0065] Compared with Example 1, Comparative Example 12 is different only in that the mass percentage content of the first oleophobic agent in the component is 0.05%, and the mass percentage content of the second oleophobic agent is 0.4%, that is, the mass ratio of the first oleophobic agent to the second oleophobic agent is 1:8, which is higher than the limit value of the present invention.

[0066] Comparative Example 13

[0067] Compared with Example 1, Comparative Example 13 is different only in that the first oleophobic agent component is replaced with an equal mass of 2,3-diaminofluorobenzene (CAS No.: 18645-88-0).

[0068] Comparative Example 14

[0069] The only difference between Comparative Example 14 and Example 1 is that the second oleophobic agent component is replaced with an equal mass of 2-chlorobenzyl alcohol (CAS No.: 17849-38-6).

[0070] Comparative Example 15

[0071] The anti-diffusion agent using the prior art (Chinese patent application CN118290987A) is specifically composed of the following components in mass percentage:

[0072] The content of oleophobic agent 1 is 0.2%, specifically: dicyclohexane-18-crown ether-6;

[0073] The content of oleophobic agent 2 is 0.2%, specifically: 6-amino-1-naphthalenesulfonic acid;

[0074] The wetting agent content is 0.8%, specifically betaine citrate;

[0075] The stabilizer content is 2.0%, specifically methyl 2,3-diaminobenzoate;

[0076] The co-solvent content is 2.0%, specifically 1-methyl-4-phenyl-4-piperidinol;

[0077] The balance is water.

[0078] The preparation methods of the PCB gold panel printing anti-diffusion agents of Examples 2-6 and Comparative Examples 1-15 are the same as that of Example 1.

[0079] Performance testing

[0080] The invention discloses a method for using a PCB gold panel printing anti-diffusion agent, comprising the following steps: S1 oil removal section; S2 water washing section; S3 anti-diffusion section; S4 water washing section; S5 drying section; S6 spray printing solder resist section;

[0081] The S1 degreasing section is used to degreasing the PCB gold panel and remove surface impurities. The process parameters of the degreasing section are as follows: the section is spray-type, the mass concentration of sulfuric acid in the degreasing tank is 1.0%, and the remainder is DI water; the temperature is 25±2℃, the degreasing section length is 2.0m; the line speed is 2.0±0.2m / min, and the pressure is 1.5±0.5kg / cm 2 ;

[0082] The S2 washing section is used to wash the PCB gold panel that has passed through the S1 degreasing section with DI water. The process parameters of the washing section are: this section is spray type, the temperature is 25±2°C, the washing section length is 2.0m; the line speed is 2.0±0.2m / min, and the pressure is 1.5±0.5kg / cm 2 ;

[0083] The S3 anti-diffusion section is used to perform surface treatment on the PCB gold panel that has passed through the S2 water washing section. The anti-diffusion agent prepared in the embodiment or comparative example of the present invention is added to the tank at a mass concentration of 5%, and the remainder is DI water to form a tank liquid. The process parameters of the anti-diffusion section are: this section is immersion type, the temperature is 25±2℃, the anti-diffusion section length is 2.0m; the line speed is 4.0±0.2m / min;

[0084] The S4 washing section is used to wash the PCB gold panel that has passed through the S3 diffusion prevention section with DI water. The process parameters of the washing section are: this section is spray type, the temperature is 25±2°C, the washing section length is 3.0m; the line speed is 2.0±0.2m / min, and the pressure is 1.5±0.5kg / cm 2 ;

[0085] The S5 drying section is used to dry the PCB gold panel after the S4 washing section process, and the drying process parameters are: temperature 70±2° C., drying section length 2.0 m; line speed 2.0±0.2 m / min.

[0086] The S6 solder mask printing section performs inkjet printing on the PCB gold panel after the S5 drying section process. The ink model used is H-9100 produced by Shenzhen Rongda Photosensitive Technology Co., Ltd. The process parameters of the solder mask printing section are: printing must be carried out in a clean room environment, the printing temperature is 25±0.5°C, the curing method is ultraviolet UV curing, and double-sided printing is performed.

[0087] The performance of the PCB gold panel printing anti-diffusion agent of the present invention is mainly analyzed from two aspects:

[0088] The first is the anti-diffusion performance. A contact angle meter is used to measure the contact angle between the gold surface and substrate surface of the circuit board and the ink after printing. The larger the contact angle, the better the effect of the anti-diffusion agent.

[0089] The second is adhesion performance, which is tested using the 3M tape cross-cutting test method. The specific operation is to wait for the ink on the S6 printed solder mask section to solidify, and then use a cross-cutting tool to vertically scratch the surface of the PCB board with ink coating to form a grid-like scratch with a grid number of 5x5. Slowly and evenly stick the 3M600 test tape on the cross-cutting area to make the tape tightly adhere to the ink surface. After standing for 1 minute, tear off the tape evenly with tweezers and observe the ink shedding in the cross-cutting area. Rating is carried out according to the ISO2409 testing standards, etc.:

[0090] Level 0: The edges of the cut are completely smooth, and there is no ink falling off the edges of the grid;

[0091] Level 1: A little ink falls off at the intersection of the cuts, but the falling area does not exceed 5%;

[0092] Level 2: Ink falls off at the edges and intersections of the cuts, with the falling area ranging from 5% to 15%;

[0093] Level 3: The ink falls off obviously along the edge of the cut, and the ink falling off area of ​​some squares is between 15% and 35%;

[0094] Level 4: The ink falls off over a large area, and the ink falling off area of ​​most squares is between 35% and 65%;

[0095] Level 5: The ink is almost completely peeled off, and the peeling area exceeds 65%.

[0096] The test result must reach level 0 or level 1 to be qualified.

[0097] The performance test of the PCB gold panel printing anti-diffusion agent of Examples 1-6 was carried out, and the test results are shown in Table 1 below:

[0098] Table 1 Test results of the performance test of the anti-diffusion agent for printing on the PCB gold panel of Examples 1-6

[0099]

[0100] The performance test of the PCB gold panel printing anti-diffusion agent of Comparative Examples 1-15 was carried out, and the test results are shown in Table 2 below:

[0101] Table 2 Test results of the performance test of the anti-diffusion agent for printing on the PCB gold panel of Comparative Examples 1-15

[0102]

[0103] It can be seen from the experimental data of Examples 1-6 in Table 1 that the anti-diffusion agent for printing the PCB gold panel of the embodiment of the present invention has good anti-diffusion performance, the contact angle between the gold surface and the solder resist ink is greater than 77°, and the contact angle between the substrate surface and the solder resist ink is greater than 86°; the adhesion test result between the PCB board surface and the ink after printing is level 0, the edge of the incision is completely smooth, and there is no ink falling off at the edge of the grid. The adhesion performance of the anti-diffusion agent meets the production process requirements.

[0104] It can be seen from the experimental data of Comparative Examples 1-5 in Table 2 that the difference between Comparative Examples 1-5 and Example 1 is that the anti-diffusion agent lacks a single component of the first oleophobic agent, the second oleophobic agent, the adhesion promoter, the wetting agent, and the cosolvent. The experimental data show that the lack of any component of the anti-diffusion agent of the present invention will affect the performance of the anti-diffusion agent. The synergistic effect of the first oleophobic agent and the second oleophobic agent is the main factor that makes the gold surface and the substrate surface have anti-diffusion performance. If any one of the oleophobic agents is missing, the contact angles of the gold surface and the substrate surface will be significantly diffused, and it will also indirectly affect the surface adhesion of the PCB board; the adhesion promoter can enhance the adhesion between the board and the ink. If this component is missing, the adhesion between the gold surface and the substrate surface will be significantly reduced, which may easily lead to defective products; the wetting agent promotes the uniform mixing of the internal components of the anti-diffusion agent and the spreading of the anti-diffusion agent on the board surface. If this component is missing, the performance of the anti-diffusion agent will be reduced; the co-solvent is used to make all components in the solvent completely dissolved to avoid precipitation and turbidity of the anti-diffusion agent. If this component is missing, the performance of the anti-diffusion agent will be greatly reduced.

[0105] The difference between Comparative Examples 6-10 and Example 1 is that the first oleophobic agent, the second oleophobic agent, the adhesion promoter, the wetting agent, and the cosolvent in the anti-diffusion agent component are respectively higher than the upper limit of the mass percentage content of the components specified in the present invention. The experimental data show that, compared with Example 1, the mass percentage content of the first oleophobic agent and the second oleophobic agent is too high, which will lead to a decrease in the contact angle between the gold surface and the substrate surface. From the contact angle test results of Comparative Examples 8-10, it can be seen that the mass percentage content of the adhesion promoter, the wetting agent, and the cosolvent is too high to change the contact angle. From the cost perspective, the excessive mass percentage content will increase the cost of the solution. Therefore, the concentration of these three components in the anti-diffusion liquid of the present invention should not be too high, and it can be within the concentration range of the embodiment.

[0106] The difference between Comparative Examples 11 and 12 and Example 1 is that the mass ratio of the first oleophobic agent to the second oleophobic agent is respectively lower or higher than the range of the mass ratio of the first oleophobic agent to the second oleophobic agent specified in the present invention. Experimental data show that if the mass ratio of the first oleophobic agent to the second oleophobic agent is too low or too high, the synergistic effect between the functional groups in the oleophobic agent will be reduced, resulting in a decrease in the ink contact angle between the gold surface and the substrate surface, and a decrease in the adhesion performance. Therefore, it is necessary to control the mass ratio of the first oleophobic agent to the second oleophobic agent to be 1: (1.0-3.0).

[0107] The difference between Comparative Example 13 and Example 1 is that the first oleophobic agent component: 4-amino-2-fluorophenol is replaced by an equal mass of 2,3-diaminofluorobenzene, and the difference between Comparative Example 14 and Example 1 is that the second oleophobic agent component: 2-fluorobenzyl alcohol is replaced by an equal mass of 2-chlorobenzyl alcohol. Experimental data show that oleophobic agents with different types of branched groups will also affect the anti-diffusion performance and adhesion strength. The aminofluorobenzene without phenol group in the first oleophobic agent component and the non-fluorinated halogenated benzyl alcohol in the second oleophobic agent component will reduce the contact angle between the gold surface and the substrate surface and reduce the adhesion performance.

[0108] The difference between Comparative Example 15 and Example 1 is that the prior art (Chinese patent CN118290987A) is used for comparison with the anti-diffusion agent of the present invention. Experimental data show that the anti-diffusion agent of the present invention has better anti-diffusion performance for the ink on the gold surface and base material of the circuit board, and the adhesion strength of the ink on the gold surface is higher.

[0109] In summary, the present invention provides a preparation method and use method of a PCB gold panel printing anti-diffusion agent, which is used for the anti-diffusion step in the PCB gold panel printing solder mask process. The anti-diffusion agent contains a first oleophobic agent, a second oleophobic agent, an adhesion promoter, a wetting agent, and a cosolvent as effective ingredients, and can form an organic layer on the gold surface of the circuit board and the surface of the substrate, enhance the anti-diffusion ability and adhesion of the gold surface and the substrate surface with the ink, prevent the inkjet printing ink from diffusing on the gold surface and the substrate surface, and improve the product qualification rate of the PCB gold panel printing solder mask process.

[0110] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A PCB gold panel printing anti-diffusion agent, characterized in that: The invention is composed of the following components in mass percentage: 0.05-0.3% of a first oleophobic agent, 0.1-0.7% of a second oleophobic agent, 0.2-1.5% of an adhesion promoter, 0.5-4.0% of a wetting agent, 0.1-5.0% of a cosolvent, and the balance is water; the first oleophobic agent is an aminofluorophenol compound, the second oleophobic agent is a halobenzyl alcohol compound, the adhesion promoter is a disilazane compound derivative, the wetting agent is an alkyl ester compound, and the cosolvent is a diphenyl sulfide derivative; the mass ratio of the first oleophobic agent to the second oleophobic agent is 1:(1.0-3.0); the first oleophobic agent is selected from one or more of 4-amino-2-fluorophenol, 2-amino-4-fluorophenol, and 4-amino-3-fluorophenol, and the second oleophobic agent is selected from one or more of 2-fluorobenzyl alcohol, 3-fluorobenzyl alcohol, and 4-fluorobenzyl alcohol.

2. The PCB gold panel printing anti-diffusion agent as claimed in claim 1, characterized in that: The invention is composed of the following components in percentage by weight: 0.05-0.2% of a first oleophobic agent, 0.1-0.4% of a second oleophobic agent, 0.2-1.0% of an adhesion promoter, 0.5-2.5% of a wetting agent, 0.1-3.0% of a cosolvent, and the balance is water.

3. The PCB gold panel printing anti-diffusion agent as claimed in claim 1, characterized in that: The adhesion promoter is selected from one or more of hexamethyldisilazane, heptamethyldisilazane and 1,1,3,3-tetramethyldisilazane.

4. The PCB gold panel printing anti-diffusion agent as claimed in claim 1, characterized in that: The wetting agent is selected from one or more of 2-dodecyl acrylate, hexadecyl lactate, and dodecyl stearate.

5. The PCB gold panel printing anti-diffusion agent as claimed in claim 1, characterized in that: The co-solvent is selected from one or more of 4,4'-dihydroxydiphenyl sulfide, 4-tert-butyl diphenyl sulfide and 4,4'-diaminodiphenyl sulfide.

6. The method for preparing a PCB gold panel printing anti-diffusion agent according to any one of claims 1 to 5, characterized in that: The following steps are involved: According to the formula, weigh the first oleophobic agent, the second oleophobic agent, the adhesion promoter, the wetting agent, the co-solvent and the remaining water in sequence and add them into the reaction kettle, stir and mix them at room temperature of 25-28°C for 30-35 minutes to obtain the PCB gold panel printing anti-diffusion agent.

7. The method for using the anti-diffusion agent for printing a PCB gold panel according to any one of claims 1 to 5, characterized in that: The following steps are involved: The PCB gold panel printing anti-diffusion agent according to any one of claims 1 to 5 is used in the anti-diffusion tank, added into the tank at a mass concentration of 5%, and the remainder is DI water to form a tank liquid, and the surface of the PCB gold panel is treated.

8. The method for using the PCB gold panel printing anti-diffusion agent as claimed in claim 7, characterized in that: The surface treatment temperature is 25±2°C and the line speed is 4.0±0.2m / min.

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