High temperature resistant pressure sensitive adhesive for adhesive tape, adhesive tape and preparation method

Abstract

The invention discloses a high temperature resistant pressure sensitive adhesive for an adhesive tape, an adhesive tape and a preparation method thereof, comprising the following components: polysiloxane, a polyurethane resin, a polyimide resin, a fluorinated polymer, a resin tackifier, an SBS copolymer, silicon dioxide, aluminum powder, an antioxidant, a UV stabilizer, an organic solvent, a plasticizer and deionized water; the high temperature resistant pressure sensitive adhesive for an adhesive tape solves the deficiencies of ordinary adhesive tapes in terms of high temperature, weather resistance, adhesion, flexibility, mechanical strength and the like through precise component ratio and application of high performance materials, thereby providing an adhesive tape product with high stability and long-lasting effect in extreme environments.

Description

Technical Field

[0001] The invention relates to a high temperature resistant pressure sensitive adhesive for an adhesive tape, the adhesive tape and a preparation method. Background Art

[0002] In modern industrial applications, adhesive tapes are an important bonding material and are widely used in electronics, automobiles, aviation, construction, home appliances and other fields. Especially in high temperature environments, the performance of traditional tapes is often difficult to meet specific needs. Traditional pressure-sensitive tapes generally use adhesives based on rubber, acrylic or other conventional resins. These tapes perform well at room temperature, but their adhesion, stability and weather resistance are prone to decline in high temperature or extreme environments.

[0003] Traditional pressure-sensitive adhesives tend to lose adhesion in high-temperature environments, soften, fall off, or have reduced adhesion, causing the tape to be unable to continue working at high temperatures. This greatly limits the application of tapes under high-temperature conditions, affecting their use in high-temperature electronic equipment, automotive engine parts, and high-temperature processing.

[0004] Many traditional tapes will age and become brittle when exposed to ultraviolet light, high humidity and oxidation for a long time, which will lead to a significant decrease in adhesion. This problem is particularly prominent in outdoor applications, solar cell modules and aerospace, which require stronger UV and oxidation resistance to ensure the long-term stability and reliability of the tape.

[0005] Although some tapes can provide good initial adhesion, after long-term use, the tapes may experience problems such as debonding, bubbling, and cracking. This defect makes traditional pressure-sensitive tapes unable to provide continuous and reliable bonding effects in some special applications, such as fixing electronic components and bonding precision parts.

[0006] Many existing pressure-sensitive tapes are prone to rupture or deformation when subjected to external forces such as stretching, tearing or shearing, resulting in the tapes being unable to withstand the large mechanical stresses that occur during industrial production. This defect limits the application of tapes in industrial fields that require higher strength and stability, such as automotive manufacturing, aerospace and other fields. Summary of the invention

[0007] The purpose of the present invention is to provide a high temperature resistant pressure-sensitive adhesive for tape, tape and preparation method. Through the application of precise ingredient ratio and high performance materials, the deficiencies of ordinary tape in high temperature, weather resistance, adhesion, flexibility, mechanical strength, etc. are solved, thereby providing a tape product with high stability and long-lasting effect in extreme environments.

[0008] The technical solution adopted by the present invention to solve its technical problem is:

[0009] A high temperature resistant pressure sensitive adhesive for adhesive tape comprises the following components: polysiloxane, polyurethane resin, polyimide resin, fluorinated polymer, resin tackifier, SBS copolymer, silicon dioxide, aluminum powder, antioxidant, UV stabilizer, organic solvent, plasticizer and deionized water.

[0010] Preferably, the composition comprises the following components in mass fraction: 0.5% to 5% polysiloxane, 5% to 15% polyurethane resin, 5% to 10% polyimide resin, 1% to 10% fluorinated polymer, 0.5% to 5% resin tackifier, 2% to 8% SBS copolymer, 1% to 5% silicon dioxide, 0.1% to 2% aluminum powder, 0.1% to 1% antioxidant, 0.1% to 1% UV stabilizer, 10% to 30% organic solvent, 2% to 8% plasticizer, and the balance is deionized water.

[0011] Preferably, the antioxidant comprises one or more of tert-butylhydroquinone or benzotriazole.

[0012] Preferably, the organic solvent is one or more of xylene, toluene and alcohol solvents.

[0013] Preferably, the plasticizer is one or more of dioctyl phthalate, cyclohexyl dicarboxylate and tris(hydroxymethyl)aminomethane.

[0014] Another technical problem to be solved by the present invention is to provide a method for preparing a high temperature resistant pressure sensitive adhesive for an adhesive tape, comprising the following steps:

[0015] Add the organic solvent into the reactor and slowly heat it to 40-60°C;

[0016] In a reaction kettle, first add polysiloxane, polyurethane resin and polyimide resin, start stirring until they are completely dissolved, and then add plasticizer and deionized water;

[0017] Add the fluorinated polymer and SBS copolymer and continue stirring until the mixture is homogeneous;

[0018] Adding resin tackifier and silica;

[0019] Then add aluminum powder;

[0020] Finally, antioxidants and UV stabilizers are added;

[0021] After the above ingredients are mixed, continue heating and stirring for 10-15 minutes to ensure a uniform solution;

[0022] Use vacuum degassing device to remove bubbles from the glue;

[0023] Use a suitable filter to filter the glue to remove impurities or particles that are not completely dissolved;

[0024] Another technical problem to be solved by the present invention is to provide a high temperature resistant pressure-sensitive adhesive tape, wherein the substrate of the tape is coated with the high temperature resistant pressure-sensitive adhesive as described above, and the mass fraction of the high temperature resistant pressure-sensitive adhesive is 30% to 70% of the total mass of the tape.

[0025] Preferably, the substrate of the adhesive tape is a polyester film, a polyimide film or a polytetrafluoroethylene film.

[0026] Preferably, the adhesive tape coats the high temperature resistant pressure sensitive adhesive on the surface of the substrate by spraying, dipping or coating.

[0027] Another technical problem to be solved by the present invention is to provide a method for preparing a high temperature resistant pressure-sensitive adhesive tape, comprising the following steps:

[0028] Evenly coating the prepared high temperature resistant pressure sensitive adhesive on the surface of the selected substrate;

[0029] After coating, the substrate is initially dried in a temperature-controlled environment at 60-80°C to remove the solvent;

[0030] Subsequently, the coated tape is sent into an oven for curing at a temperature of 120-160°C for 10-30 minutes;

[0031] The cured tape is cooled to room temperature to ensure that the adhesive layer is fully cured and has good adhesion;

[0032] Cut the cured tape into required specifications and sizes according to needs.

[0033] The beneficial effects of the present invention are:

[0034] The main components of the pressure-sensitive adhesive, such as polysiloxane, polyimide resin, fluorinated polymer and other materials, have excellent high temperature resistance and can maintain stable adhesion and structural strength in high temperature environments, solving the problem that ordinary pressure-sensitive adhesives are prone to failure or softening at high temperatures. This allows the tape to be used in high temperature conditions without affecting its bonding performance and stability.

[0035] By adding antioxidants and UV stabilizers, the pressure-sensitive adhesive can effectively resist the influence of external environmental factors such as oxidation and ultraviolet radiation, extend the service life of the tape and maintain its bonding performance. This solves the problem that the adhesive surface of traditional tapes is prone to aging, brittleness, and decreased adhesion when exposed to sunlight or high humidity for a long time.

[0036] The resin tackifier and SBS copolymer in the solution enhance the initial adhesion and lasting adhesion of the tape, and can maintain good bonding effect at low and normal temperatures, providing more durable and efficient adhesion performance. In addition, the addition of plasticizer improves the flexibility of the tape, allowing it to adapt to different application environments and surface shapes, improving the convenience and applicability of operation.

[0037] The addition of silicon dioxide improves the mechanical strength of the tape and enhances its tear and stretch resistance. The addition of aluminum powder not only improves the thermal reflection performance of the tape, but also helps to improve the overall hardness and durability of the tape, further solving the problem that the tape is easily deformed or damaged under high temperature and mechanical stress. Specific implementation methods

[0039] The principles and features of the present invention are described below, and the examples given are only used to explain the present invention and are not used to limit the scope of the present invention. The present invention is described more specifically by way of examples in the following paragraphs.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] Example 1

[0042] A high temperature resistant pressure sensitive adhesive for adhesive tape, comprising the following components:

[0043] Element Mass fraction (%) Polysiloxane 2.0 Polyurethane resin 10.0 Polyimide resin 7.0 Fluorinated polymers 4.0 Resin tackifier 2.0 SBS copolymer 5.0 Silicon dioxide 3.0 Aluminum powder 0.5 Antioxidants 0.3 UV Stabilizers 0.2 Organic solvents (mixed solvents: xylene, toluene, alcohols) 18.0 Plasticizer (Dioctyl Phthalate) 4.0 Deionized water margin

[0044] Preparation method:

[0045] Dissolution steps:

[0046] Add xylene and toluene into the reactor in a ratio of 2:1 and heat to 50°C;

[0047] Add polysiloxane, polyurethane resin and polyimide resin in sequence and begin stirring until they are completely dissolved;

[0048] Add plasticizer (dioctyl phthalate) and deionized water and continue stirring until completely dissolved.

[0049] Mixing steps:

[0050] Add the fluorinated polymer and the SBS copolymer to the above mixture and continue stirring until the mixture is homogeneous;

[0051] The resin tackifier and silica are then added, and stirring is continued to ensure uniform dispersion.

[0052] Enhanced performance:

[0053] Aluminum powder is added to enhance the thermal conductivity and oxidation resistance of the adhesive;

[0054] Finally, add antioxidant (tert-butylhydroquinone) and UV stabilizer and stir well.

[0055] Further stirring:

[0056] Continue to heat the mixture, keep it at about 50℃, and stir for 10-15 minutes to ensure that the glue is uniform.

[0057] Defoaming and filtering:

[0058] Use a vacuum degassing device to remove bubbles in the glue to ensure that there are no bubbles in the glue;

[0059] The glue solution is filtered through a suitable filter to remove impurities or particles that are not completely dissolved and obtain a uniform glue solution.

[0060] Tape preparation:

[0061] Substrate selection:

[0062] Polyimide film was selected as the substrate of the tape.

[0063] Coating:

[0064] The prepared high temperature resistant pressure sensitive adhesive is evenly coated on the surface of the polyimide film by a coating method to ensure that the adhesive evenly covers the substrate.

[0065] Initial drying:

[0066] The coated substrate is sent to a temperature-controlled environment of 60-80°C for preliminary drying to remove the solvent.

[0067] Curing:

[0068] The coated tape is sent into an oven with a curing temperature of 140°C and a curing time of 20 minutes to ensure that the adhesive layer is fully cured.

[0069] Cooling and cutting:

[0070] The cured tape is cooled to room temperature to ensure that the adhesive layer has good adhesion and high temperature resistance.

[0071] Cut the cured tape into required specifications and sizes according to needs.

[0072] Final product features:

[0073] This high temperature resistant pressure sensitive tape has excellent high temperature resistance, adhesion and oxidation resistance, and is suitable for industrial fields that require use in high temperature environments, such as electronics, aviation and high temperature coating.

[0074] Example 2

[0075] A high temperature resistant pressure sensitive adhesive for adhesive tape, comprising the following components:

[0076]

[0077]

[0078] Preparation method:

[0079] Add a mixed solvent of xylene and toluene in a ratio of 3:1 into the reactor and heat to 55°C;

[0080] Add polysiloxane, polyurethane resin and polyimide resin in order, start stirring and continue stirring until they are completely dissolved;

[0081] Add plasticizer (cyclohexyl dicarboxylate) and deionized water and continue stirring until dissolved evenly;

[0082] Mixing steps:

[0083] Add the fluorinated polymer and SBS copolymer to the solution and keep stirring to ensure uniform mixing;

[0084] Then add the resin tackifier and silica and stir until completely dispersed.

[0085] Enhanced performance:

[0086] Add aluminum powder and continue stirring to ensure that the aluminum powder is evenly distributed in the adhesive to improve the thermal conductivity of the adhesive;

[0087] Add antioxidant (benzotriazole) and UV stabilizer (UV-531) and stir well.

[0088] Keep stirring:

[0089] Keep the reaction temperature at 50°C and continue stirring for 10-15 minutes to ensure that all ingredients are fully blended to obtain a uniform glue solution.

[0090] Defoaming and filtering:

[0091] Use a vacuum degassing device to remove bubbles from the glue to ensure that there are no bubbles in the glue that interfere with subsequent applications;

[0092] Filter the glue liquid through the filter to remove impurities or particles that are not completely dissolved to ensure the purity of the glue liquid.

[0093] Tape preparation:

[0094] Substrate selection:

[0095] Polytetrafluoroethylene film is selected as the base material of the tape.

[0096] Coating:

[0097] The prepared high temperature resistant pressure sensitive adhesive solution is evenly coated on the surface of the polytetrafluoroethylene film by spraying to ensure uniform coating.

[0098] Initial drying:

[0099] The coated substrate is placed in a temperature-controlled environment of 60-75°C for preliminary drying to remove the solvent.

[0100] Curing:

[0101] Send the coated tape into the oven, set the curing temperature to 130°C and the curing time to 25 minutes to ensure that the adhesive layer is completely cured.

[0102] Cooling and cutting:

[0103] The cured tape is cooled at room temperature to ensure strong adhesiveness and a smooth surface.

[0104] According to the requirements, the cured tape is cut into the required specifications and sizes.

[0105] Final product features:

[0106] The high-temperature resistant pressure-sensitive tape produced by this formula has strong resistance to heat aging and oxidation, and maintains stable adhesion in high-temperature environments. It is suitable for high-temperature packaging, protection and insulation applications in the electronics, aerospace, automotive and other industries.

[0107] In this embodiment, different resin ratios and reinforcing components (such as plasticizers, aluminum powder and antioxidants, etc.) are used to make the tape exhibit better mechanical properties and thermal stability at high temperatures;

[0108] Compared with Example 1, the ratio of polyurethane resin to polyimide resin in this example is higher, which enhances high temperature resistance and adhesion.

[0109] Example 3

[0110] A high temperature resistant pressure sensitive adhesive for adhesive tape, comprising the following components:

[0111] Element Mass fraction (%) Polysiloxane 1.5 Polyurethane resin 12.0 Polyimide resin 8.0 Fluorinated polymers 6.0 Resin tackifier 3.0 SBS copolymer 6.5 Silicon dioxide 2.5 Aluminum powder 1.0 Antioxidants 0.5 UV Stabilizers 0.3 Organic solvents (mixed solvents: xylene, toluene, alcohols) 20.0 Plasticizer (cyclohexyl dicarboxylate) 4.2 Deionized water margin

[0112] Xylene and toluene are added into the reactor in a ratio of 2:1 and heated to 50°C. This step helps to dissolve the subsequent polymer materials and reduce the viscosity, making it easier to stir.

[0113] Add polysiloxane, polyurethane resin and polyimide resin (7.0%) into the reaction kettle in sequence and start stirring. The stirring process continues until the resin is completely dissolved to form a uniform solution. The temperature is controlled at around 50°C to prevent overheating that may cause the solution to become too viscous.

[0114] Add plasticizer and deionized water to the reactor and continue stirring until the plasticizer is completely dissolved and evenly dispersed to form a stable adhesive solution. The plasticizer helps to improve the flexibility of the adhesive, and the deionized water helps to adjust the viscosity.

[0115] Mixing steps:

[0116] Add the fluorinated polymer and SBS copolymer to the dissolved solution and continue stirring to ensure that the two are fully mixed with other ingredients to form a uniform adhesive solution. The SBS copolymer improves the flexibility and adhesion of the tape, and the fluorinated polymer improves its chemical resistance and heat resistance.

[0117] Add resin tackifier and silica and continue to stir evenly. The tackifier enhances the adhesion of the adhesive, while the silica helps to improve the tensile strength and heat resistance of the adhesive.

[0118] Enhanced performance:

[0119] Adding aluminum powder to the adhesive can effectively improve the thermal conductivity of the adhesive and enhance its stability in high temperature environments;

[0120] Finally, antioxidants and UV stabilizers are added. These ingredients help improve the tape's antioxidant and UV resistance, extending its service life and preventing aging.

[0121] Further stirring:

[0122] Continue to heat the mixture, keep it at about 50℃, and stir for 10-15 minutes to ensure that the glue is uniform and stable to avoid particles or uneven dissolution.

[0123] Defoaming and filtering:

[0124] Use a vacuum degassing device to remove bubbles from the glue. Vacuum degassing helps eliminate bubbles in the glue to avoid affecting the adhesion and appearance of the tape.

[0125] The glue liquid is filtered through a filter to remove impurities or particles that are not completely dissolved, thus ensuring that the final glue liquid is more uniform and free of impurities.

[0126] Tape preparation:

[0127] Polyimide film is selected as the substrate of the tape. Polyimide film has good high temperature resistance, mechanical strength and electrical insulation, and is an ideal substrate for the tape.

[0128] Coating:

[0129] The prepared high temperature resistant pressure sensitive adhesive is evenly coated on the surface of the polyimide film by coating method to ensure that the adhesive can evenly cover the entire substrate surface. The coating thickness needs to be adjusted according to the final tape requirements.

[0130] Initial drying:

[0131] The coated polyimide film is sent to a temperature-controlled environment of 60-80°C for preliminary drying, the purpose of which is to remove most of the solvent in the glue and prepare for curing.

[0132] Curing:

[0133] The coated tape is sent into the oven, the curing temperature is set to 140°C, and the curing is maintained for 20 minutes. This process ensures that the adhesive layer is fully cured and achieves ideal high temperature resistance and adhesion performance.

[0134] Cooling and cutting:

[0135] The cured tape is cooled to room temperature to ensure that the adhesive layer has good adhesion and high temperature resistance.

[0136] According to needs, the cured tape is cut into required specifications and sizes for subsequent application.

[0137] Final product features:

[0138] The obtained high temperature resistant pressure sensitive adhesive tape has the following characteristics:

[0139] It can be used stably in high temperature environments and can withstand temperatures as high as 200°C. The tape has good initial tack and adhesion and is suitable for various surfaces. It will not age or fail during long-term use. It is suitable for electronics, aviation, automobiles, precision industry, high-temperature coating and other fields.

[0140] Experimental example

[0141] Experimental Materials:

[0142] The high temperature resistant pressure-sensitive adhesive tape prepared in Example 1-3 (hereinafter referred to as "new adhesive tape") was prepared according to the above formula and process.

[0143] Traditional pressure-sensitive adhesive tape (commercially available product): It adopts conventional formulation, usually based on styrene-isoprene-styrene (SBS) copolymer, supplemented with conventional plasticizers, resins and solvents.

[0144] Experimental methods:

[0145] High temperature resistance test:

[0146] Experimental steps:

[0147] The new tape and the traditional tape were cut into 5cm×5cm samples respectively.

[0148] The two tape samples were respectively attached to the cleaned aluminum plate surface.

[0149] The tape samples were placed in a constant temperature oven and heated at 150°C, 180°C, and 200°C for 72 hours respectively.

[0150] Take out the sample and observe the adhesion and appearance changes of the tape.

[0151] Experimental evaluation:

[0152] Observe the tape to see if it softens, falls off, or becomes deformed.

[0153] Tape adhesion was measured (using a standard peel test method).

[0154] Experimental results:

[0155] Temperature(℃) New tape Traditional tape 150℃ Good, adhesion retention Slight softening, decreased adhesion 180℃ No significant changes Begins to soften, and adhesion decreases significantly 200℃ Stable adhesion Falling off, completely losing adhesion

[0156] After being tested at 200°C for 72 hours, the new tape still maintained good adhesion and appearance, with no obvious softening or falling off. The traditional tape softened and showed decreased adhesion to varying degrees above 150°C, and showed obvious falling off at 200°C.

[0157] in conclusion:

[0158] The new tape has significantly better high temperature resistance than traditional tape and can be used stably at higher temperatures.

[0159] Weathering test:

[0160] Experimental steps:

[0161] The new tape and the traditional tape were cut into 5cm×5cm samples respectively.

[0162] The two tape samples were respectively attached to the surface of a clean glass plate.

[0163] The samples were exposed to an artificial weathering chamber to simulate exposure to ultraviolet light and humidity, and the ultraviolet radiation intensity was set to 0.89W / m 2 nm, temperature is 60℃, humidity is 90%, continuous exposure is 500 hours.

[0164] Take out the sample and observe the change in the adhesion and appearance of the tape.

[0165] Experimental evaluation:

[0166] Observe the surface changes of the tape (such as yellowing, cracks, falling off, etc.).

[0167] Tape adhesion was measured (using a standard peel test method).

[0168] Experimental results:

[0169] Exposure time (hours) New tape Traditional tape 200 hours Normal appearance, slight decrease in adhesion Surface yellowing, cracking, and falling off 500 hours No obvious change in appearance, adhesion maintained Obvious yellowing, severe decrease in adhesion

[0170] After being exposed for 500 hours, the new tape had no obvious change in appearance, and its adhesion decreased slightly, but it still maintained a high adhesion performance. After being exposed for 200 hours, the traditional tape showed obvious surface yellowing, cracks, and adhesive layer shedding, and its adhesion decreased significantly.

[0171] in conclusion:

[0172] The new tape excels in weather resistance and can better withstand ultraviolet rays and high humidity environments while maintaining better performance.

[0173] Adhesion test:

[0174] Experimental steps:

[0175] The peeling force of the new tape and the traditional tape was measured at room temperature (25°C) and high temperature (150°C) using a standard peeling test device.

[0176] Peel force test method: Apply the tape on an aluminum plate and measure the adhesion using a tensile gauge at a peel angle of 180° at a speed of 1 inch / min.

[0177] Experimental evaluation:

[0178] The peel forces of the two tapes were measured at room temperature and high temperature, and their changes were compared.

[0179] Experimental results:

[0180] temperature New tape peeling force (N / cm) Traditional tape peeling force (N / cm) Normal temperature (25℃) 2.3 1.5 High temperature (150℃) 1.9 0.6

[0181] The peel force of the new tape is 2.3N / cm at room temperature and 1.9N / cm at high temperature (150°C), showing good adhesion; the peel force of the traditional tape is 1.5N / cm at room temperature and drops to 0.6N / cm at high temperature (150°C), showing significant adhesion attenuation.

[0182] in conclusion:

[0183] The new tape maintains better adhesion at high temperatures, while the adhesion of the traditional tape decreases significantly.

[0184] Mechanical strength test:

[0185] Experimental steps:

[0186] The tensile strength and elongation at break of the new tape and conventional tape were measured using standard tensile testing equipment.

[0187] Tape sample size: 100 mm long, 10 mm wide.

[0188] The test was carried out at a tensile speed of 10 mm / min.

[0189] Experimental evaluation:

[0190] The tensile strength (unit: MPa) and the elongation at break (unit: %) were measured.

[0191] Experimental results:

[0192] property New tape Traditional tape Tensile strength(MPa) 4.2 2.5 Elongation at break (%) 140％ 80％

[0193] The new tape has a tensile strength of 4.2MPa and an elongation at break of 140%; the traditional tape has a tensile strength of 2.5MPa and an elongation at break of 80%.

[0194] in conclusion:

[0195] The mechanical strength of the new tape is significantly better than that of traditional tape, with higher tensile strength and ductility.

[0196] Comprehensive results:

[0197] Through comparative experiments on high temperature resistance, weather resistance, adhesion and mechanical strength of new tape and traditional tape, the following conclusions were drawn:

[0198] The new tape has excellent stability at high temperatures and can withstand higher temperatures (above 200°C), while traditional tape softens and fails at lower temperatures; the new tape performed well in UV and humidity aging tests and did not age significantly, while traditional tape showed obvious changes in appearance and decreased adhesion; the new tape has strong adhesion at both room and high temperatures, especially in high temperature environments, where the adhesion remains stable; traditional tape significantly declines at high temperatures; the tensile strength and elongation at break of the new tape are higher than those of traditional tape, and it has better tensile strength and flexibility.

[0199] In general, the high temperature resistant pressure-sensitive tapes prepared in Examples 1-3 have better comprehensive performance than traditional pressure-sensitive tapes, and are particularly suitable for high-end industrial fields that require high temperature resistance, weather resistance and strong adhesion.

[0200] The above embodiments of the present invention are not intended to limit the protection scope of the present invention, and the implementation modes of the present invention are not limited thereto. All other modifications, replacements or changes made to the above structures of the present invention based on the above contents of the present invention, in accordance with common technical knowledge and customary means in the art, without departing from the above basic technical ideas of the present invention, should fall within the protection scope of the present invention.

Claims

1. A high temperature resistant pressure sensitive adhesive for adhesive tape, characterized in that: The invention comprises the following ingredients: polysiloxane, polyurethane resin, polyimide resin, fluorinated polymer, resin tackifier, SBS copolymer, silicon dioxide, aluminum powder, antioxidant, UV stabilizer, organic solvent, plasticizer and deionized water.

2. The high temperature resistant pressure sensitive adhesive for adhesive tape according to claim 1, characterized in that: The invention comprises the following components in mass fraction: 0.5% to 5% of polysiloxane, 5% to 15% of polyurethane resin, 5% to 10% of polyimide resin, 1% to 10% of fluorinated polymer, 0.5% to 5% of resin tackifier, 2% to 8% of SBS copolymer, 1% to 5% of silicon dioxide, 0.1% to 2% of aluminum powder, 0.1% to 1% of antioxidant, 0.1% to 1% of UV stabilizer, 10% to 30% of organic solvent, 2% to 8% of plasticizer, and the balance is deionized water.

3. The high temperature resistant pressure sensitive adhesive for adhesive tape according to claim 1 or 2, characterized in that: The antioxidant includes one or more of tert-butylhydroquinone or benzotriazole.

4. The high temperature resistant pressure sensitive adhesive for adhesive tape according to claim 1 or 2, characterized in that: The organic solvent is one or more of xylene, toluene and alcohol solvents.

5. The high temperature resistant pressure sensitive adhesive for adhesive tape according to claim 1 or 2, characterized in that: The plasticizer is one or more of dioctyl phthalate, cyclohexyl dicarboxylate and tris(hydroxymethyl)aminomethane.

6. A method for preparing a high temperature resistant pressure sensitive adhesive for an adhesive tape, characterized in that: The following steps are involved: Add the organic solvent into the reactor and slowly heat it to 40-60°C; In a reaction kettle, first add polysiloxane, polyurethane resin and polyimide resin, start stirring until they are completely dissolved, and then add plasticizer and deionized water; Add the fluorinated polymer and SBS copolymer and continue stirring until the mixture is homogeneous; Adding resin tackifier and silica; Then add aluminum powder; Finally, antioxidants and UV stabilizers are added; After the above ingredients are mixed, continue heating and stirring for 10-15 minutes to ensure a uniform solution; Use vacuum degassing device to remove bubbles from the glue; Use a suitable filter to filter the glue to remove impurities or particles that are not completely dissolved.

7. A high temperature resistant pressure sensitive adhesive tape, characterized in that: The substrate of the adhesive tape is coated with the high temperature resistant pressure sensitive adhesive as claimed in any one of claims 1 to 6, and the mass fraction of the high temperature resistant pressure sensitive adhesive is 30% to 70% of the total mass of the adhesive tape.

8. The high temperature resistant pressure sensitive adhesive tape according to claim 7, characterized in that: The substrate of the adhesive tape is a polyester film, a polyimide film or a polytetrafluoroethylene film.

9. The high temperature resistant pressure sensitive adhesive tape according to claim 7, characterized in that: The adhesive tape is coated with the high temperature resistant pressure sensitive adhesive on the surface of the substrate by spraying, dipping or coating.

10. A method for preparing a high temperature resistant pressure sensitive adhesive tape, characterized in that: The following steps are involved: Evenly coating the prepared high temperature resistant pressure sensitive adhesive on the surface of the selected substrate; After coating, the substrate is initially dried in a temperature-controlled environment at 60-80°C to remove the solvent; Subsequently, the coated tape is sent into an oven for curing at a temperature of 120-160°C for 10-30 minutes; The cured tape is cooled to room temperature to ensure that the adhesive layer is fully cured and has good adhesion; Cut the cured tape into required specifications and sizes according to needs.

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