A conductive composite copper foil and preparation method thereof

By perforating the polymer substrate and plating copper on both sides, a copper plating layer on the side is formed, the problem of large differences in the resistance value of the composite copper foil on both sides is solved, the uniformity of the negative electrode current distribution of lithium batteries is improved, and the process difficulty of plating thickness control is simplified.

CN119736579APending Publication Date: 2025-04-01SUZHOU VICTORY PRECISION MFG
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Patent Information

Application Number
CN202411765049.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-02
Publication Date
2025-04-01

AI Technical Summary

Technical Problem

It is difficult to control the thickness of the copper layer during the double-sided copper plating process, resulting in a large difference in the resistance value of the two-sided surfaces, affecting the uniformity of the negative electrode current distribution of lithium batteries.

Method used

By perforating the polymer substrate, magnetron sputtering copper plating and water-electrolytic copper plating are performed on both sides, forming a side copper plating layer to enhance conductivity, thereby reducing the square resistance fluctuation caused by fluctuations in the thickness of the double-sided copper layer.

Benefits of technology

It effectively reduces the difference in the resistance value of the composite copper foil on both sides, improves the uniformity of the negative electrode current distribution of lithium batteries, and simplifies the process difficulty of plating thickness control.

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Abstract

The present invention discloses a method for preparing a conductive composite copper foil, comprising the following steps: S1, performing a perforation treatment on a polymer substrate, forming a plurality of perforations penetrating the thickness direction on the polymer substrate, wherein the plurality of perforations are evenly arranged on the surface of the polymer substrate; S2, sequentially performing magnetron sputtering copper plating on the first surface and the second surface of the polymer substrate obtained in step S1, obtaining a first copper plating layer on the first surface of the polymer substrate, obtaining a second copper plating layer on the second surface of the polymer substrate, and forming a first side copper plating layer in each perforation; S3, sequentially performing water electroplating copper plating on the first surface and the second surface of the polymer substrate obtained in step S2, obtaining a thickened first copper layer and a second copper layer on the first surface and the second surface of the polymer substrate, respectively, and forming a thickened second side copper plating layer in each perforation. The method for preparing a conductive composite copper foil provided by the present invention can solve the problem of uneven negative electrode current distribution.
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