Backlight module and display panel

Abstract

The invention provides a backlight module and a display panel. The backlight module comprises a circuit board and a plurality of light-emitting units, wherein the light-emitting units are uniformly arranged on the circuit board at intervals; the light-emitting unit comprises a plurality of light-emitting diode chips and a fluorescent layer covering the light-emitting diode chips, the light-emitting diode chips comprise blue light-emitting diode chips and purple light-emitting diode chips, and the number of the blue light-emitting diode chips is larger than or equal to that of the purple light-emitting diode chips. The fluorescent layer is a yellow fluorescent layer. The blue light emitting diode chip and the purple light emitting diode chip are electrically connected with the circuit board to excite the yellow fluorescent layer to form white light, the spectral energy of the blue light is weakened after the white light passes through the backlight module, the photochemical damage of the blue light to the retina and the oxidative damage to cells in a macular region are effectively reduced, the damage to the vision of a user is reduced, and the user experience is improved. The display device using the backlight module has an eye protection effect.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a backlight module and a display panel. Background Art

[0002] The backlight module is a device that provides light source in a display device.

[0003] The related art provides a backlight module, which includes a circuit board and a plurality of light-emitting units, and the plurality of light-emitting units are electrically connected to the circuit board. The light-emitting units include a blue light-emitting diode chip and phosphor, thereby emitting white light.

[0004] Related technology: The blue light spectrum in the light emitted by the above-mentioned backlight module has a relatively large energy, which can cause photochemical damage to the retina, accelerate oxidative damage to macular cells, and cause damage to the user's vision. Summary of the invention

[0005] The embodiments of the present disclosure provide a backlight module and a display panel, which can reduce the spectral energy of blue light and play a role in eye protection. The technical solution is as follows:

[0006] In one aspect, a backlight module is provided, the backlight module comprising:

[0007] A circuit board and a plurality of light-emitting units, wherein the plurality of light-emitting units are evenly spaced and arranged on the circuit board;

[0008] The light-emitting unit includes a plurality of light-emitting diode chips and a fluorescent layer covering the plurality of light-emitting diode chips, the plurality of light-emitting diode chips include blue light-emitting diode chips and purple light-emitting diode chips, and the number of the blue light-emitting diode chips is greater than or equal to the number of the purple light-emitting diode chips, and the fluorescent layer is a yellow fluorescent layer.

[0009] Optionally, the light-emitting unit further includes a bracket, bracket pins and wires;

[0010] The light-emitting diode chip is electrically connected to the bracket pin on the bracket pin, the light-emitting diode chips are electrically connected to each other through the wire, and the light-emitting diode chips located on both sides are electrically connected to the bracket pin through the wire; the fluorescent layer is located in the bracket and covers the light-emitting diode chip.

[0011] Optionally, the light emission wavelength of the blue light emitting diode chip is 457.5-465 nm.

[0012] Optionally, the light emission wavelength of the purple light emitting diode chip is 400-410 nm.

[0013] Optionally, the fluorescent layer is a mixture of fluorescent powder and glue, and the fluorescent powder is yellow powder with an emission wavelength of 545 to 555 nm.

[0014] Optionally, the wire connecting two adjacent light-emitting diode chips in the light-emitting unit is an M-shaped arc, and the wire connecting the light-emitting diode chip and the bracket pin is a J-shaped arc.

[0015] Optionally, a spectral energy ratio of the purple light emitting diode chip to the blue light emitting diode chip is 4-5:1.

[0016] Optionally, the backlight module further includes a light guide plate and a diffusion plate;

[0017] The plurality of light emitting units are located on a side surface of the light guide plate, and the diffusion plate is located on a light emitting surface of the light guide plate.

[0018] Optionally, the backlight module further includes a diffusion plate; and the plurality of light-emitting units are located between the diffusion plate and the circuit board.

[0019] In another aspect, a display panel is provided, the display panel comprising:

[0020] A backlight module and a liquid crystal panel; the liquid crystal panel is located on the light emitting surface of the backlight module.

[0021] The technical solution provided by the embodiments of the present disclosure has the following beneficial effects:

[0022] In the disclosed embodiment, a plurality of light-emitting units are arranged on the circuit board as a backlight module, wherein each light-emitting unit includes a blue light-emitting diode chip and a purple light-emitting diode chip, and then emits white light after passing through a yellow fluorescent layer. Compared with the related art that uses a blue light-emitting diode chip plus a fluorescent layer to form white light, the above structure reduces the blue light spectrum energy in the emitted white light by adding a purple light-emitting diode chip, effectively reducing the photochemical damage caused by blue light to the retina and the oxidative damage to the macular cells, reducing the damage to the user's vision, and making the display device using the backlight module have an eye protection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 is a structural schematic diagram of a backlight module provided by an embodiment of the present disclosure;

[0025] Figure 2 is a structural schematic diagram of a light-emitting unit provided in an embodiment of the present disclosure;

[0026] Figure 3 is a top view of the structure of an edge-type backlight module provided by an embodiment of the present disclosure;

[0027] Figure 4 is a top view of the structure of a direct-type backlight module provided by an embodiment of the present disclosure;

[0028] Figure 5 is a schematic diagram of a display panel provided by an embodiment of the present disclosure;

[0029] Figure 6 is a flow chart of a method for preparing a backlight module provided by an embodiment of the present disclosure;

[0030] Figure 7 is a flow chart of another method for preparing a backlight module provided by an embodiment of the present disclosure;

[0031] Figure 8 It is a structural schematic diagram of the backlight module manufacturing process provided by the embodiment of the present disclosure;

[0032] Fig. 9 It is a structural schematic diagram of the backlight module manufacturing process provided by the embodiment of the present disclosure;

[0033] Fig.10 is a spectrum diagram of a light-emitting unit provided by an embodiment of the present disclosure;

[0034] Fig.11 is a spectrum diagram of light emitted by a light-emitting unit after passing through a light guide plate provided by an embodiment of the present disclosure;

[0035] Fig.12 is a spectrum diagram of light emitted by a light-emitting unit after passing through a light guide plate and a diffuser plate provided by an embodiment of the present disclosure;

[0036] Fig.13 is a spectrum diagram of light emitted by a light-emitting unit after passing through a light guide plate, a diffusion plate and a liquid crystal panel provided by an embodiment of the present disclosure;

[0037] Fig.14 It is a spectrum diagram provided by the related technology of the light emitted by a light emitting unit after passing through a light guide plate, a diffusion plate and a liquid crystal panel.

[0038] The reference numerals are as follows:

[0039] 101: back plate; 102: circuit board; 103: light emitting unit; 104: light guide plate; 105: diffusion plate; 106: reflection layer;

[0040] 201: bracket; 202: bracket pin; 203: light emitting diode chip; 204: wire; 205: fluorescent layer;

[0041] 2031: blue light emitting diode chip; 2032: purple light emitting diode chip;

[0042] 10: backlight module; 20: LCD panel. DETAILED DESCRIPTION

[0043] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0044] In the related art, a conventional structured LED is used which uses a blue light chip with a wavelength of 447.5 to 455 nm and phosphor to excite the blue light to form white light. The blue light with a wavelength of 447.5 to 455 nm is very harmful to the human eye.

[0045] Figure 1 Schematic diagram of the structure of a backlight module provided by an embodiment of the present disclosure. Figure 1 The backlight module includes: a circuit board 102 and a plurality of light-emitting units 103 , wherein the plurality of light-emitting units 103 are evenly spaced and arranged on the circuit board 102 .

[0046] Figure 2 is a schematic diagram of the structure of the light-emitting unit provided in the embodiment of the present disclosure. Figure 2 The light-emitting unit 103 includes a plurality of light-emitting diode chips 203 and a fluorescent layer 205 covering the plurality of light-emitting diode chips 203. The plurality of light-emitting diode chips 203 include a blue light-emitting diode chip 2031 and a purple light-emitting diode chip 2032. The number of the blue light-emitting diode chips 2031 is greater than or equal to the number of the purple light-emitting diode chips 2032. The fluorescent layer 205 is a yellow fluorescent layer.

[0047] In the disclosed embodiment, a plurality of light-emitting units are arranged on the circuit board as a backlight module, wherein each light-emitting unit includes a blue light-emitting diode chip and a purple light-emitting diode chip, and then emits white light after passing through a yellow fluorescent layer. Compared with the related art that uses a blue light-emitting diode chip plus a fluorescent layer to form white light, the above structure reduces the blue light spectrum energy in the emitted white light by adding a purple light-emitting diode chip, effectively reducing the photochemical damage caused by blue light to the retina and the oxidative damage to the macular cells, reducing the damage to the user's vision, and making the display device using the backlight module have an eye protection effect.

[0048] In the embodiment of the present disclosure, the circuit board 102 may be a flexible printed circuit (FPC).

[0049] In the embodiment of the present disclosure, the light emitting unit 103 further includes a bracket 201, a bracket pin 202 and a wire 204;

[0050] The LED chip 203 is electrically connected to the bracket pin 202 on the bracket pin 202, and the LED chips 203 are electrically connected to each other through the wire 204. The LED chips 203 located on both sides are electrically connected to the bracket pin 202 through the wire 204; the fluorescent layer 205 is located in the bracket 201 and covers the LED chip 203.

[0051] In this implementation, the light-emitting unit can arrange multiple light-emitting diode chips together through a bracket and protect the light-emitting diodes; electrical connections are made through pins and wires to form good electrical conduction.

[0052] In the disclosed embodiment, the material of the bracket 201 can be made of composite polymer materials such as PPA, PCT, EMC and SMC.

[0053] Exemplarily, the material of the bracket 201 is PPA.

[0054] In the disclosed embodiment, the shape of the bracket 201 is a circular bowl.

[0055] In the disclosed embodiment, the diameter of the bowl of the bracket 201 may be 0.5-0.7 mm.

[0056] Exemplarily, the diameter of the bowl of the support 201 is 0.6 mm.

[0057] In the disclosed embodiment, the material of the bracket pin 202 can be made of a metal such as iron, copper, steel, etc., and then electroplated with a layer of nickel, silver, gold, etc.

[0058] Exemplarily, the material of the bracket pin 202 can be made of a copper metal surface and then electroplated with a layer of nickel material.

[0059] In the disclosed embodiment, the emission wavelength of the blue light emitting diode chip 2031 can be 457.5-465nm. The blue light emitting diode chip with the above wavelength can excite the phosphor with the purple light emitting diode chip to form white light, and the spectral energy of the blue light is weakened, which plays a role in eye protection. Moreover, compared with the related technology 447.5-455nm, the 457.5-465nm blue light reduces the harm of blue light.

[0060] In the embodiment of the present disclosure, the emission wavelength of the purple light emitting diode chip 2032 may be 400-410 nm. The purple light emitting diode chip with the above wavelength can weaken the spectrum energy of the blue light emitted by the blue light emitting diode chip, thus playing a role in protecting the eyes.

[0061] In the disclosed embodiment, the above-mentioned purple light emitting diode chip 2032 and blue light emitting diode chip 2031 are combined to obtain a light emitting unit, and the energy ratio of the purple light spectrum to the blue light spectrum in the light emitted by the light emitting unit is 4 to 5: 1. Most of the blue light of the backlight with the above ratio is absorbed and weakened to less than one-fifth of the spectrum, which plays a role in protecting the eyes.

[0062] Exemplarily, the energy ratio of the purple light spectrum to the blue light spectrum in the light emitted by the light-emitting unit is 5:1.

[0063] In the disclosed embodiment, the fluorescent layer 205 is a mixture of fluorescent powder and glue, and the fluorescent powder accounts for 2-15%. The use of the fluorescent powder in the above proportion can ensure normal backlight brightness on the one hand, and ensure that the emitted white light color is purer on the other hand.

[0064] Exemplarily, the phosphor accounts for 8%.

[0065] In the embodiment of the present disclosure, the phosphor can be yellow phosphor with an emission wavelength of 545-555 nm. The yellow phosphor with the above wavelength can achieve white light output and reduce the blue light spectrum energy to meet the requirements of eye protection.

[0066] In the disclosed embodiment, the wire 204 may be a metal wire such as silver, gold, copper or alloy.

[0067] Exemplarily, the wire 204 is a copper metal wire.

[0068] In the embodiment of the present disclosure, the wire 204 connecting the two LED chips 203 is an M-shaped arc. The M-shaped arc can effectively improve the anti-fracture capability of the wire between the two LED chips and improve the yield of the LED.

[0069] In the embodiment of the present disclosure, the wire 204 connecting the LED chip 203 and the bracket pin 202 is a J-shaped arc. The J-shaped arc can effectively improve the anti-fracture ability of the wire between the LED chip and the bracket pin, and improve the yield of the LED.

[0070] Optionally, the J-shaped arc is welded to the bracket pin by the wire tail touching the ground, that is, the welding area between the J-shaped arc and the bracket pin is increased. The wire tail touching the ground connection method can increase the contact area between the wire and the bracket pin and improve the stability of the light-emitting diode.

[0071] Exemplarily, the diameter of the welding point between the J-shaped arc and the bracket pin is 40-70 mm, for example, 55 mm.

[0072] Figure 3 is a top view of the structure of an edge-lit backlight module provided by an embodiment of the present disclosure. Figure 3, the backlight module may further include a light guide plate 104 and a diffusion plate 105;

[0073] The plurality of light emitting units 103 are located on the side surface of the light guide plate 104 , and the diffusion plate 105 is located on the light emitting surface of the light guide plate 104 .

[0074] By adopting the above-mentioned side-entry structured light to emit from the side, the thickness of the backlight module can be reduced, and it can be applied in the fields of tablets, mobile phones, learning machines, educational machines, displays, etc.

[0075] In the embodiment of the present disclosure, the material of the light guide plate 104 may be a light guide plate made of polymethyl methacrylate, polycarbonate or polystyrene.

[0076] Exemplarily, the light guide plate 104 may be a light guide plate made of polymethyl methacrylate.

[0077] Figure 4 is a top view of the structure of a direct-type backlight module provided by an embodiment of the present disclosure. Figure 4 , the backlight module may further include a diffusion plate 105;

[0078] The plurality of light emitting units 103 are located between the diffusion plate 105 and the circuit board 102 .

[0079] The direct-down structure described above is adopted, because the direct-down structure does not have a light guide plate, thereby reducing energy loss in the light refraction process.

[0080] In the embodiment of the present disclosure, the material of the diffusion plate 105 can be a diffusion plate made of silicone, epoxy resin, acrylic material, etc.

[0081] Exemplarily, the material of the diffusion plate 105 is silica gel.

[0082] See again Figure 4 The backlight module may further include a back plate 101 and a reflective layer 106 , the circuit board 102 is on the back plate 101 , and the reflective layer covers the back plate 101 and the circuit board 102 .

[0083] In the embodiment of the present disclosure, the back plate 101 may be a metal back plate, for example, a metal back plate that can be stamped by a punching die.

[0084] Figure 5 is a schematic diagram of a display panel provided by an embodiment of the present disclosure. Figure 5 The display panel includes: a backlight module 10 and a liquid crystal panel 20; the liquid crystal panel 20 is located on the light emitting surface of the backlight module 10. The backlight module 10 can be Figures 1 to 4 The backlight module 10 shown in any one of the figures.

[0085] Figure 6is a flow chart of a method for preparing a backlight module provided by an embodiment of the present disclosure. Figure 6 The method steps include:

[0086] S11, making a plurality of light-emitting units.

[0087] S12. Install the multiple light-emitting units on a circuit board, the multiple light-emitting units include multiple light-emitting diode chips and a fluorescent layer covering the multiple light-emitting diode chips, the multiple light-emitting diode chips include blue light-emitting diode chips and purple light-emitting diode chips, and the number of the blue light-emitting diode chips is greater than or equal to the number of the purple light-emitting diode chips, and the fluorescent layer is a yellow fluorescent layer.

[0088] In the disclosed embodiment, a plurality of light-emitting units are arranged on the circuit board as a backlight module, wherein each light-emitting unit includes a blue light-emitting diode chip and a purple light-emitting diode chip, and then emits white light after passing through a yellow fluorescent layer. Compared with the related art that uses a blue light-emitting diode chip plus a fluorescent layer to form white light, the above structure reduces the blue light spectrum energy in the emitted white light by adding a purple light-emitting diode chip, effectively reducing the photochemical damage caused by blue light to the retina and the oxidative damage to the macular cells, reducing the damage to the user's vision, and making the display device using the backlight module have an eye protection effect.

[0089] Figure 7 is a flow chart of another method for preparing a backlight module provided by an embodiment of the present disclosure. Figure 7 The method steps include:

[0090] S21. Provide a bracket.

[0091] In the disclosed embodiment, the material of the bracket can be made of composite polymer materials such as PPA, PCT, EMC and SMC.

[0092] Exemplarily, the material of the bracket is PPA.

[0093] In the disclosed embodiment, the bracket is shaped like a circular bowl.

[0094] In the disclosed embodiment, the diameter of the bracket bowl may be 0.5 to 0.7 mm.

[0095] Exemplarily, the diameter of the support cup is 0.6 mm.

[0096] In the disclosed embodiment, the bracket is grooved on the carrier material by laser to obtain a circular bowl-shaped structure.

[0097] S22. Make bracket pins on the bracket.

[0098] In the disclosed embodiment, the material of the bracket pin can be made of a metal such as iron, copper, steel, etc., and then electroplated with a layer of nickel, silver, gold, etc.

[0099] Exemplarily, the material of the bracket pin can be made of a copper metal surface electroplated with a layer of nickel material.

[0100] S23, installing a light-emitting diode chip, and electrically connecting the light-emitting diode chip to the bracket pins.

[0101] Figure 8 FIG. 1 is a schematic diagram of the structure of the backlight module manufacturing process provided by the embodiment of the present disclosure. Figure 8 The LED chip 203 includes a blue LED chip 2031 and a purple LED chip 2032 , and the LED chip 203 is electrically connected to the bracket pin 202 on the bracket pin 202 .

[0102] In the disclosed embodiment, the emission wavelength of the blue light emitting diode chip can be 457.5-465nm. The blue light emitting diode chip with the above wavelength can excite the phosphor with the purple light emitting diode chip to form white light, and the spectral energy of the blue light is weakened, which plays a role in eye protection. Moreover, compared with the related technology 447.5-455nm, the 457.5-465nm blue light reduces the harm of blue light.

[0103] In the disclosed embodiment, the emission wavelength of the purple light emitting diode chip may be 400-410 nm. The purple light emitting diode chip with the above wavelength can weaken the spectral energy of the blue light emitted by the blue light emitting diode chip, thus playing a role in protecting the eyes.

[0104] In the disclosed embodiment, the above-mentioned purple light emitting diode chip and blue light emitting diode chip are combined to obtain a light emitting unit, and the energy ratio of the purple light spectrum to the blue light spectrum in the light emitted by the light emitting unit is 4 to 5: 1. The backlight with the above ratio absorbs most of the blue light after passing through the light guide plate, the diffusion plate, and the liquid crystal screen to less than one-fifth of the spectrum, which plays a role in protecting the eyes.

[0105] Exemplarily, the energy ratio of the purple light spectrum to the blue light spectrum in the light emitted by the light-emitting unit is 5:1.

[0106] Exemplarily, the light-emitting diode chip tube is fixed to the bracket pin by a spot flux eutectic method.

[0107] S24, making wires, the light-emitting diode chips are electrically connected to each other through the wires, and the light-emitting diode chips on both sides are electrically connected to the bracket pins through the wires.

[0108] Fig. 9 FIG. 1 is a schematic diagram of the structure of the backlight module manufacturing process provided by the embodiment of the present disclosure. Fig. 9 The LED chips 203 on both sides are electrically connected to the bracket pins 202 through the wires 204 ; the fluorescent layer 205 is located in the bracket 201 and covers the LED chips 203 .

[0109] In the disclosed embodiment, a wire bonding machine is used to bond metal wires to chip electrodes and brackets under the action of temperature, pressure, and ultrasound.

[0110] In the embodiment of the present disclosure, the conductive wire may be a metal wire such as silver, gold, copper or an alloy.

[0111] Exemplarily, the conductive wire is a copper metal wire.

[0112] In the embodiment of the present disclosure, the wire connecting the two LED chips is an M-shaped arc. The M-shaped arc can effectively improve the anti-fracture capability of the wire between the two LED chips and improve the yield rate of the LED.

[0113] In the embodiment of the present disclosure, the wire connecting the LED chip and the bracket pin is a J-shaped arc. The J-shaped arc can effectively improve the fracture resistance of the LED chip and the bracket pin wire and improve the yield of the LED.

[0114] Optionally, the J-shaped arc is welded to the bracket pin by the wire tail touching the ground, that is, the welding area between the J-shaped arc and the bracket pin is increased. The wire tail touching the ground connection method can increase the contact area between the wire and the bracket pin and improve the stability of the light-emitting diode.

[0115] Exemplarily, the diameter of the welding point between the J-shaped arc and the bracket pin is 40-70 mm, for example, 55 mm.

[0116] S25, making a fluorescent layer, where the fluorescent layer is located in the bracket and covers the light emitting diode chip.

[0117] In the disclosed embodiment, the fluorescent layer is a mixture of fluorescent powder and glue, and the fluorescent powder accounts for 2-15%. The use of the fluorescent powder in the above proportion can ensure normal backlight brightness on the one hand, and ensure that the emitted white light color is purer on the other hand.

[0118] Exemplarily, the phosphor accounts for 8%.

[0119] In the embodiment of the present disclosure, the phosphor can be yellow phosphor with an emission wavelength of 545-555 nm. The yellow phosphor with the above wavelength can achieve white light output and reduce the blue light spectrum energy to meet the requirements of eye protection.

[0120] S26, connecting the light-emitting unit to the circuit board to form an electrical path.

[0121] Exemplarily, step S26 may include:

[0122] The first step is to place an appropriate amount of conductive material onto the pins of the circuit board.

[0123] In the embodiment of the present disclosure, the conductive material may be silver glue, solder paste, etc.

[0124] Exemplarily, the conductive material may be solder paste.

[0125] In the disclosed embodiment, a suitable amount of conductive material is placed at the mounting position of the circuit board by printing or spraying the dispensing valve body.

[0126] Exemplarily, a suitable amount of conductive material is placed at the mounting position of the circuit board by printing.

[0127] In the second step, high temperature curing forms an electrical path.

[0128] In the disclosed embodiment, the light emitting unit is fixed to the mounting position of the circuit board by a chip mounter or a die bonder.

[0129] Exemplarily, the light-emitting unit is fixed to the mounting position of the circuit board by a placement machine.

[0130] In other embodiments, the light emitting unit may also be formed on a circuit board by means of Chips on Board packaging.

[0131] The third step is to perform reflow soldering.

[0132] In the disclosed embodiment, the mounted light emitting unit is fixed to the circuit board by soldering with solder paste.

[0133] S27, assembling the light guide plate and the diffusion plate.

[0134] Wherein, a plurality of light emitting units are located on the side surface of the light guide plate, and a diffusion plate is located on the light emitting surface of the light guide plate.

[0135] In the embodiment of the present disclosure, the material of the light guide plate may be a light guide plate made of polymethyl methacrylate, polycarbonate or polystyrene.

[0136] Exemplarily, the light guide plate may be a light guide plate made of polymethyl methacrylate.

[0137] In the disclosed embodiment, the material of the diffuser plate can be a diffuser plate made of silicone, epoxy resin, acrylic material, etc. The silicone diffuser plate has excellent weather resistance and flexibility; the epoxy resin diffuser plate has good mechanical strength and electrical insulation; the acrylic diffuser plate has high light transmittance and easy processing characteristics, and can be adjusted according to the uniformity of light emission.

[0138] Exemplarily, the material of the diffusion plate is silica gel.

[0139] Fig.10 is a spectrum diagram of a light-emitting unit provided by an embodiment of the present disclosure; Fig.11 is a spectrum diagram of light emitted by a light-emitting unit after passing through a light guide plate provided by an embodiment of the present disclosure; Fig.12 is a spectrum diagram of light emitted by a light-emitting unit after passing through a light guide plate and a diffuser plate provided by an embodiment of the present disclosure; Fig.13 is a spectrum diagram of light emitted by a light-emitting unit after passing through a light guide plate, a diffusion plate and a liquid crystal panel provided by an embodiment of the present disclosure; Fig.14 It is a spectrum diagram provided by the related technology of the light emitted by a light emitting unit after passing through a light guide plate, a diffusion plate and a liquid crystal panel.

[0140] refer to Figures 10 to 14 , the horizontal axis is wavelength, in nanometers; the vertical axis is spectral visual efficiency. It can be clearly seen that compared with the backlight module provided by the related art, the blue light spectral visual efficiency of the backlight module provided by the embodiment of the present disclosure is significantly reduced after passing through the light guide plate, the diffuser plate and the liquid crystal panel, which can weaken the spectral energy of the blue light, effectively reduce the photochemical damage caused by the blue light to the retina and the oxidative damage to the macular cells, and reduce the damage to the user's vision.

[0141] The display device of the backlight module has an eye protection effect and can be applied to devices such as a tablet (Tablet Personal Computer, Tablet), a notebook computer (Notebook, NB), a monitor (Monitor, MNT) and a television (Television, TV).

[0142] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A backlight module, characterized in that: The backlight module comprises: a circuit board (102) and a plurality of light-emitting units (103), wherein the plurality of light-emitting units (103) are evenly spaced and arranged on the circuit board (102); The light-emitting unit (103) comprises a plurality of light-emitting diode chips (203) and a fluorescent layer (205) covering the plurality of light-emitting diode chips (203); the plurality of light-emitting diode chips (203) comprise blue light-emitting diode chips (2031) and purple light-emitting diode chips (2032); the number of the blue light-emitting diode chips (2031) is greater than or equal to the number of the purple light-emitting diode chips (2032); and the fluorescent layer (205) is a yellow fluorescent layer.

2. The backlight module according to claim 1, characterized in that: The light-emitting unit (103) further comprises a bracket (201), bracket pins (202) and wires (204); The light-emitting diode chip (203) is electrically connected to the bracket pin (202) on the bracket pin (202); the light-emitting diode chips (203) are electrically connected to each other via the wire (204); the light-emitting diode chips (203) located on both sides are electrically connected to the bracket pin (202) via the wire (204); and the fluorescent layer (205) is located inside the bracket (201) and covers the light-emitting diode chip (203).

3. The backlight module according to claim 1 or 2, characterized in that: The blue light emitting diode chip (2031) has a light emission wavelength of 457.5-465 nm.

4. The backlight module according to claim 1 or 2, characterized in that: The light emission wavelength of the purple light emitting diode chip (2032) is 400-410 nm.

5. The backlight module according to claim 1 or 2, characterized in that: The fluorescent layer (205) is a mixture of fluorescent powder and glue, and the fluorescent powder is yellow powder with an emission wavelength of 545 to 555 nm.

6. The backlight module according to claim 2, characterized in that: The wire (204) connecting two adjacent light-emitting diode chips (203) in the light-emitting unit (103) is an M-shaped arc, and the wire (204) connecting the light-emitting diode chip (203) and the bracket pin (202) is a J-shaped arc.

7. The backlight module according to claim 1 or 2, characterized in that: The spectral energy ratio of the purple light emitting diode chip (2032) and the blue light emitting diode chip (2031) is 4 to 5:

1.

8. The backlight module according to claim 1 or 2, characterized in that: The backlight module also includes a light guide plate (104) and a diffusion plate (105); The plurality of light-emitting units (103) are located on the side surface of the light guide plate (104), and the diffusion plate (105) is located on the light-emitting surface of the light guide plate (104).

9. The backlight module according to claim 1 or 2, characterized in that: The backlight module also includes a diffusion plate (105); The plurality of light emitting units (103) are located between the diffusion plate (105) and the circuit board (102).

10. A display panel, characterized in that: The display panel comprises: a backlight module (10) and a liquid crystal panel (20); the liquid crystal panel (20) is located on the light emitting surface of the backlight module (10); The backlight module (10) is the backlight module according to any one of claims 1 to 9.

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