A high stability chip aluminum electrolytic capacitor

Abstract

The present invention discloses a high-stability chip-type aluminum electrolytic capacitor, including a capacitor body and a capacitor seat plate; the capacitor body includes an aluminum shell, a core package, a capacitor cover plate, and a lead terminal led out from the capacitor cover plate; the lead terminal includes an extension portion, a bending portion, and a welding portion; the welding portion includes a first welding portion and a second welding portion perpendicular to the first welding portion; wherein the first welding portion and / or the second welding portion is bent in a U shape; the capacitor seat plate includes a seat plate body, and a terminal welding placement groove for placing the welding portion is provided on the seat plate body; the terminal welding placement groove includes a first section placement groove and a second section placement groove; the first welding portion and the second welding portion are placed in the first section placement groove and the second section placement groove, respectively. The high-stability chip-type aluminum electrolytic capacitor of the present invention can be stably installed and fixed on a circuit board to avoid shaking due to vibration to adapt to various complex application environments with bumps and vibrations.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic devices, and in particular relates to a high-stability surface-mount aluminum electrolytic capacitor. Background Art

[0002] SMD aluminum electrolytic capacitors are generally installed by soldering with SMT equipment, which firmly solders the capacitors on the circuit board. They are particularly suitable for highly automated production equipment and component-intensive manufacturing fields, which can greatly reduce labor costs and problems such as insertion errors caused by manual plug-ins. Then, compared with manual operation, the installation of SMD capacitors requires higher vibration resistance.

[0003] Especially as SMD aluminum electrolytic capacitors began to be widely used in the automotive industry, the vibration and collision indicators in the original industry standards for aluminum electrolytic capacitors could no longer meet the requirements of the automotive industry, and higher requirements were placed on the seismic resistance of capacitors.

[0004] However, the chip capacitors currently used in new energy vehicles have not taken the installation and fixation issues into consideration well. The positive and negative terminals of the capacitors are only welded to the circuit board. During the long-term use of the car, as the car is bumped and vibrated, the capacitors are prone to shaking. Long-term shaking will eventually cause the positive and negative terminals to loosen or be damaged, thus affecting the life of the capacitor products.

[0005] It can be seen that, with respect to the above-mentioned current existing technologies, it is necessary to conduct research and development to provide a solution so that the capacitor can be stably and firmly mounted on the circuit board to adapt to various complex application environments with bumps and vibrations.

[0006] The disclosure of the above background technology content is only used to assist in understanding the inventive concept and technical solution of the present invention. It does not necessarily belong to the prior art of this patent application. In the absence of clear evidence that the above content has been disclosed on the filing date of this patent application, the above background technology should not be used to evaluate the novelty and creativity of the present application. Summary of the invention

[0007] The object of the present invention is to provide a high-stability surface-mount aluminum electrolytic capacitor to solve at least one of the above-mentioned background technical problems.

[0008] To achieve the above object, the technical solution of the embodiment of the present invention is implemented as follows:

[0009] A high-stability chip-type aluminum electrolytic capacitor comprises a capacitor body and a capacitor seat plate sleeved on the head of the capacitor body; the capacitor body comprises an aluminum shell, a core package encapsulated in the aluminum shell, a capacitor cover plate for encapsulating the core package in the aluminum shell, and a lead terminal led out from the capacitor cover plate; the lead terminal comprises an extension portion extending perpendicularly to the capacitor cover plate, a bending portion bent from the end of the extension portion, and a welding portion extending perpendicularly from the end of the bending portion; the welding portion is multi-fold bent, comprising a first welding portion and a second welding portion bent perpendicularly to the first welding portion; wherein the first welding portion and / or the second welding portion are U-shaped bent; the capacitor seat plate comprises a seat plate body, and a terminal welding placement groove for placing the welding portion of the lead terminal is provided on the seat plate body; the terminal welding placement groove comprises a first section placement groove and a second section placement groove; the first welding portion and the second welding portion are respectively placed in the first section placement groove and the second section placement groove.

[0010] In some embodiments, the depth of the first section placement groove is twice the depth of the second section placement groove or the width of the second section placement groove is twice the width of the first section placement groove.

[0011] In some embodiments, the seat plate body is further provided with a slot that matches with the extension portion of the lead-out terminal, and a terminal guide slot that accommodates the bent portion of the lead-out terminal.

[0012] In some embodiments, the depth and width of the terminal guide groove are equal to each other and are greater than or equal to the diameter of the lead terminal.

[0013] In some embodiments, the bent portion of the lead terminal is L-shaped and parallel to the surface of the capacitor cover.

[0014] In some embodiments, a plane where the first welding portion is located is orthogonal to a plane where the capacitor cover plate is located, and a U-shaped bend opening of the first welding portion is oriented in the same direction as an extension direction of the extension portion.

[0015] In some embodiments, the second welding portion extends in a direction away from the side surface of the capacitor seat plate, and a surface of the second welding portion is flush with an outer surface of the capacitor seat plate.

[0016] In some embodiments, it also includes a capacitor fixing seat installed at the tail of the capacitor body, and the capacitor fixing seat is provided with a receiving space for accommodating the tail of the capacitor body.

[0017] In some embodiments, the capacitor seat plate is provided with a cavity for accommodating the head of the capacitor body, and the cavity is configured such that the depth of the cavity is greater than or equal to the thickness of the capacitor cover plate and less than half the length of the capacitor body.

[0018] In some embodiments, a plurality of support arms are vertically extended from the periphery of the inner surface of the seat plate body, and the inner sides of the plurality of support arms are enclosed to form a cavity for accommodating the head of the capacitor body.

[0019] In some embodiments, the capacitor fixing seat includes a seat body and a plurality of support blocks at the periphery of the inner surface of the seat body and perpendicular to the inner surface of the seat body; wherein the inner sides of the plurality of support blocks are surrounded to form a receiving space for accommodating the tail of the capacitor body.

[0020] The beneficial effects of the technical solution of the present invention are:

[0021] Compared with the prior art, the high-stability chip-type aluminum electrolytic capacitor of the present invention can be stably mounted and fixed on a circuit board to avoid shaking due to vibration and adapt to various complex application environments with bumps and vibrations. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1 It is a three-dimensional schematic diagram of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0024] Figure 2 It is a three-dimensional schematic diagram of a capacitor body of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0025] Figure 3 It is a three-dimensional schematic diagram of a capacitor seat plate of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0026] Figure 4 It is a schematic diagram from another angle of a capacitor seat plate of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0027] Figure 5 This is another angled schematic diagram of a capacitor seat plate of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0028] Figure 6 It is a three-dimensional schematic diagram of a capacitor fixing plate of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0029] Figure 7 It is another three-dimensional schematic diagram of a capacitor fixing plate of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0030] Figure 8 It is an exploded schematic diagram of a capacitor fixing plate of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention;

[0031] Fig. 9 It is a partially exploded schematic diagram of a high-stability surface-mount aluminum electrolytic capacitor according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the embodiments of the present invention clearer and more understandable, and to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only embodiments of a part of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, connection can be used for fixing or for circuit connection.

[0034] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, unless otherwise clearly specified and defined, the meaning of "multiple" is two or more, and the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral whole; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0036] Reference Figure 1-Figure 6 As shown, as an embodiment of the present invention, a high-stability surface-mount aluminum electrolytic capacitor is provided, comprising a capacitor body 100, and a capacitor seat plate 200 sleeved on the head of the capacitor body 100; the capacitor body 100 comprises an aluminum shell 1, a core package encapsulated in the aluminum shell, a capacitor cover plate 2 for encapsulating the core package in the aluminum shell, and a lead terminal 21 led out from the capacitor cover plate 2; the lead terminal 21 comprises an extension portion 210 extending perpendicularly to the capacitor cover plate, a bent portion 211 bent from the end of the extension portion 210, and a welding portion 212 extending perpendicularly from the end of the bent portion 211; wherein the welding portion 212 is multi-fold bent, and comprises a first welding portion 2120, and a second welding portion 2121 bent perpendicularly to the first welding portion 2120; wherein the first welding portion 2120 and / or The second welding portion 2121 is bent in a U shape; the capacitor seat plate 200 includes a seat plate body 10, on which a slot 101 is provided for cooperating with the extension portion 210 of the lead terminal, a terminal guide slot 102 for accommodating the bent portion 211 of the lead terminal, and a terminal welding placement slot 103 for placing the welding portion 212 of the lead terminal; the terminal welding placement slot 103 includes a first section placement slot 1031 and a second section placement slot 1032; the depth of the first section placement slot 1031 is twice the depth of the second section placement slot 1032 or the width of the second section placement slot 1032 is twice the width of the first section placement slot 1031; the first welding portion 2120 and the second welding portion 2121 are respectively placed in the first section placement slot 1031 and the second section placement slot 1032.

[0037] In some embodiments, the capacitor further includes a capacitor fixing seat 300 installed at the tail of the capacitor body 100; the capacitor fixing seat 300 is provided with a receiving space for accommodating the tail of the capacitor body.

[0038] The capacitor seat plate 200 is provided with a cavity 20 for accommodating the head of the capacitor body 100, and the cavity 20 is configured such that the depth of the cavity is greater than or equal to the thickness of the capacitor cover plate 2 and less than half the length of the capacitor body 100. The inner diameter of the cavity 20 is equal to the outer diameter of the capacitor body 100, and the outer wall of the shell of the capacitor body 100 is in full contact with the inner wall of the cavity 20.

[0039] Specifically, refer to Figure 3-Figure 5 As shown, a plurality of support arms are vertically extended from the periphery of the inner surface of the seat plate body 10, and the inner sides of the plurality of support arms are enclosed to form the cavity 20 for accommodating the capacitor; a groove 101 is provided on the seat plate body 10, which passes through the inner surface of the seat plate body 10 and the outer surface of the seat plate body 10; a terminal guide groove 102 is provided on the outer surface of the seat plate body 10; the bottom surface of the seat plate body 10 is set to a flat plane, which is used to mount and fix the seat plate 200 on the circuit board, and a terminal welding placement groove 103 connected to the terminal guide groove 102 is provided on the bottom surface, which is used to place the welding part 212 of the capacitor lead terminal 21.

[0040] Reference Figure 3 As shown, the inner side of the plurality of support arms is configured as an arc surface, and the inner sides of the plurality of support arms are combined to form a cylindrical cavity 20 to match the circular capacitor. It should be noted that in some other embodiments, the inner sides of the plurality of support arms can also be configured as other shapes, such as being configured as a plane, and the inner sides of the plurality of support arms are combined to form a square cavity to match the square capacitor. In some embodiments, the outer side of each of the plurality of support arms is configured to be composed of a plurality of planes, and a reinforcing rib is formed at the connection between each two planes, thereby taking into account both the high strength of the seat plate and the small volume of the seat plate.

[0041] Reference Figure 3 As shown, in one embodiment, the plurality of support arms include a first support arm 104, a second support arm 105, a third support arm 106, and a fourth support arm 107; wherein the first support arm 104, the second support arm 105, and the third support arm 106 are located on one half of the seat plate body 10, and the fourth support arm 107 is located on the other half of the seat plate body 10; the slots 101 are respectively provided between the second support arm 105 and the first support arm 104 and the third support arm 106. A notch 108 is provided between the first support arm 104 and the fourth support arm 107, and correspondingly, a notch 108 is also provided between the third support arm 106 and the fourth support arm 107; the notch 108 is higher than the inner surface of the seat plate body 10. By providing the notch and the large-scale slot, the exposed area of ​​the capacitor body is increased, which is beneficial to the heat dissipation of the capacitor body.

[0042] Reference Figure 4 , Figure 5 As shown, the slot 101 is symmetrically arranged with the center line of the outer surface of the seat plate body 10 as the center, and the terminal guide slot 102 is connected to the slot 101; correspondingly, the terminal guide slot 102 is symmetrically arranged on both sides of the outer surface of the seat plate body 10. In some embodiments, the slot width of the slot 102 is greater than or equal to the width of the terminal guide slot 102.

[0043] The terminal welding placement groove 103 includes a first section placement groove 1031 and a second section placement groove 1032, and the first section placement groove 1031 and the second section placement groove 1032 form an L shape on the bottom surface of the seat plate body 10; the first section placement groove 1031 and the second section placement groove 1032 are respectively connected to the terminal guide groove 102; the connection between the first section placement groove 1031, the second section placement groove 1032 and the terminal guide groove 102 is set to an arc transition.

[0044] Reference Figure 3 , Figure 4 , Figure 5 As shown, on the outer surface of the seat plate body 10, the direction parallel to the outer surface of the seat plate body 10 is defined as the width direction, and the direction perpendicular to the outer surface of the seat plate body 10 is defined as the depth direction. In some embodiments, the depth d of the terminal guide groove 102 is equal to the width w, and is greater than or equal to the diameter of the lead terminal; the width w of the first section placement groove 1031 is equal to the width w of the first section placement groove 1031. ` The depth d of the first section placement groove 1031 is the same as the width w of the terminal guide groove 102. ` It is twice the depth d of the terminal guide groove 102. On the bottom surface of the seat plate body, the direction parallel to the bottom surface of the seat plate body 10 is defined as the width direction, and the direction perpendicular to the bottom surface of the seat plate body 10 is defined as the depth direction; in some embodiments, the depth of the second section placement groove 1032 is equal to the depth of the terminal guide groove 102; in some embodiments, the width of the second section placement groove 1032 is equal to the width of the terminal guide groove 102; in some embodiments, the width of the second section placement groove 1032 is twice the width of the terminal guide groove.

[0045] Reference Figure 1 , Figure 2 , Figure 6As shown, specifically, the lead terminal 21 includes an extension portion 210 extending perpendicularly to the capacitor cover plate 2, a bent portion 211 bent into an L shape from the end of the extension portion 210, and a welding portion bent and extended from the end of the bent portion 211 in the opposite direction of the extension direction of the extension portion 210; the welding portion is multi-folded, and includes a first welding portion 2120 parallel to the surface of the capacitor, and a second welding portion 2121 parallel to the plane of the cover plate; wherein the first welding portion 2120 is bent in a U shape, the second welding portion 2121 is bent perpendicular to the first welding portion 2120, and the end of the second welding portion 2121 points to a direction away from the center of the seat plate body 10. In some embodiments, the bent portion 211 is bent in a direction away from the center of the capacitor cover plate 2; in some implementations, the bent portion 211 is parallel to the surface of the capacitor cover plate 2. In some embodiments, a gap is provided on the first welding portion 2120, which facilitates full contact between the solder and the welding portion 212 during welding, thereby improving the firmness of the welding. In some embodiments, the plane where the first welding portion 2120 is located is orthogonal to the plane where the capacitor cover plate 2 is located, the opening direction of the U-shaped bend of the first welding portion 2120 is the same as the extension direction of the extension portion 210, the second welding portion 2121 extends in a direction away from the side of the capacitor seat plate, and the surface of the second welding portion 2121 is flush with the outer surface of the capacitor seat plate. In some embodiments, the plane where the bending portion 211 is located is perpendicular to the plane where the first welding portion 2120 is located, and the surface of the first welding portion 2120 is flush with the bottom surface of the capacitor seat plate. In some embodiments, the first welding portion 2120 is provided with a gap to facilitate full contact between the solder and the welding portion 212 during welding, thereby improving the firmness of the welding.

[0046] In some embodiments, the second welding portion 2121 is bent in a U-shape, the opening of the U-shape is toward the side of the capacitor seat plate, and the surface of the second welding portion 2121 is flush with the bottom surface of the capacitor seat plate.

[0047] Reference Figure 1 , Figure 2As shown, the lead terminal 21 passes through the slot 101 on the seat plate body 10, the length of the extension portion 210 of the lead terminal 21 is less than the thickness of the seat plate body 10, and the inner surface of the seat plate contacts the surface of the cover plate of the capacitor, so that the capacitor is stably installed and fixed on the seat plate to prevent the capacitor from shaking. The bent portion 211 of the lead terminal 21 is placed in the terminal guide groove 102 on the outer surface of the seat plate body 10, and the shape and size of the bent portion 211 are adapted to the guide groove. The first welding portion 2120 of the lead terminal 21 is placed in the first section placement groove 1031 of the terminal welding placement groove 103; the second welding portion 2121 of the lead terminal 21 is placed in the second section placement groove 1032 of the terminal welding placement groove 103. In some embodiments, the diameter of the bent portion 211 of the lead terminal 21 is adapted to the width of the terminal guide groove 102, so that the bent portion 211 is in seamless contact with the terminal guide groove 102 and is tightly held in the guide groove; in some embodiments, the surface of the bent portion 211 of the lead terminal 21 is flush with the outer surface of the seat plate body 10.

[0048] It should be noted that, corresponding to the two slots 101 on the seat plate body 10, the lead terminals include a positive lead terminal 21 and a negative lead terminal 22, and the positive lead terminal includes a positive lead terminal and a negative lead terminal having the same structure, which respectively correspond to the two slots of the seat plate body 10. In some embodiments, the distance between the two slots 101 is equal to the distance between the positive lead terminal 21 and the negative lead terminal 22.

[0049] Reference Figure 1 , Figure 2 As shown, when the capacitor body 100 is installed on the chip capacitor seat plate 200 of the present invention, the positive and negative lead terminals 21 and 22 of the capacitor body 100 pass through the slot 101 respectively, and after being guided by the terminal guide slot 102, the welding ends of the positive and negative lead terminals 21 and 22 are placed in the terminal welding placement slot 103 respectively, and then welded to the circuit board, and the bottom surface of the seat plate body is closely mounted on the circuit board. In some embodiments, the width of the terminal guide slot 102 is set to match the diameter of the positive and negative lead terminals 21 and 22 of the capacitor, so as to ensure that when the positive and negative lead terminals 21 and 22 of the capacitor are placed in the terminal guide slot, the positive and negative lead terminals 21 and 22 will not be higher than the bottom surface of the seat plate body.

[0050] When the capacitor is mounted on the circuit board, the base plate is fixed on the circuit board, the welding portion 212 in the terminal welding placement groove 103 is welded on the circuit board, and the terminal welding placement groove 103 is filled with solder, so that the capacitor is mounted on the circuit board, and the installation is fixed firmly. Among them, the welding portion 212 of the lead terminal 21 is set to be multi-folded, and the first welding portion 2120 parallel to the side of the capacitor is set to be U-shaped, which increases the welding area. After welding to the circuit board, the force of the capacitor in the longitudinal direction and the lateral direction are greatly improved, thereby ensuring that the capacitor is stably installed on the circuit board and improving the anti-seismic performance of the capacitor.

[0051] Reference Figure 4 , Figure 5 , Figure 6 As shown, the terminal welding placement groove 103 is configured to include a first section placement groove 1031 and a second section placement groove 1032, so as to meet various positive and negative lead-out terminal structures of the capacitor. The bottom surface of the seat plate body 10 is a flat surface, which can ensure that when the seat plate is mounted on the circuit board, the contact area is large and the mounting is stable and firm. If necessary, the seat plate can be fixed on the circuit board by dispensing glue or other methods.

[0052] Reference Figure 1 , Figure 3 , Figure 4 , Figure 5 As shown, in some embodiments, the inner surface and the outer surface of the seat plate body 10 are parallel to each other, and the inner surface of the seat plate body 10 is configured to match the shape of the cover plate of the capacitor body 100, so as to ensure that the capacitor body 100 can be fully contacted with the seat plate 200 when it is installed on the seat plate, and the installation is more firm and firm. In some embodiments, the seat plate body 10 is also provided with a positioning groove 109, and the positioning groove 109 is configured to divide the capacitor seat plate 200 into two halves; in some embodiments, the positioning groove 109 connects the second support arm 105, the outer surface of the seat plate body and the fourth support arm 107. When the capacitor is installed on the circuit board, the seat plate is fixed on the circuit board, and the welding part in the terminal welding placement groove is welded on the circuit board, and the solder fills the terminal welding placement groove, so that the capacitor is installed on the circuit board, and the installation is fixed and firm. In addition, the welding part of the lead terminal is parallel to the side of the capacitor. After being welded to the circuit board, the force of the capacitor in the longitudinal direction and the transverse direction is greatly improved, thereby ensuring that the capacitor is stably installed on the circuit board with strong anti-vibration performance. Furthermore, the seat plate of the present invention is designed in this way so as to take into account both the small size and high strength of the seat plate, and can stably fix the capacitor on the circuit board; in addition, by providing slots and recesses between the support arms, and arranging the cavity for accommodating the capacitor to ensure that the capacitor can be accommodated while maximizing the area of ​​the capacitor surface exposed to the outside, the heat dissipation performance of the capacitor is improved.

[0053] Reference Figure 6 , Fig. 9 As shown, the cover end of the capacitor body 100 is defined as the head of the capacitor body 100 , and the other end of the capacitor body is the tail of the capacitor body 100 ; in some embodiments, a capacitor fixing seat 300 is installed at the tail of the capacitor body 100 .

[0054] Reference Figure 6-Figure 8 As shown, the capacitor fixing seat 300 includes a seat body 30, a plurality of support blocks at the inner surface periphery of the seat body 30 perpendicular to the inner surface of the seat body, and a welding piece 31 installed on the seat body 30; wherein the inner sides of the plurality of support blocks are surrounded to form a receiving space 301 for accommodating the tail of the capacitor body 100; the welding piece 31 is installed on the bottom surface of the seat body 30 for welding to the circuit board, thereby fixing the capacitor fixing seat 300 on the circuit board, and further stably installing the capacitor body 100 on the circuit board.

[0055] Reference Figure 7 , Figure 8 , Fig. 9 As shown, the seat body 30 is provided with a mounting hole 302 at one end near the bottom surface of the seat body for mounting the welding piece 31; the mounting hole 302 passes through the inner surface of the seat body 30 and the outer surface of the seat body, and after the welding piece 31 is installed in the mounting hole 302, one side of the welding piece 31 is exposed to the inner surface of the seat body 30; the tail of the capacitor body 100 is placed in the receiving space 301 of the capacitor fixing seat 300, tightly fits the inner surface of the seat body 30, and contacts with the welding piece 31.

[0056] Reference Figure 7 , Figure 8 As shown, the welding piece 31 includes a mounting portion 310 and a welding portion 311 bent perpendicularly to the mounting portion 310; in some embodiments, the mounting portion 310 is mounted at the mounting hole 302 of the seat body, and a retaining piece 3101 is provided at the end of the mounting portion 310, and the retaining piece 3101 is clamped on the inner surface of the seat body. The welding portion 311 is attached to the bottom surface of the seat body and protrudes from the bottom surface of the seat body; in some embodiments, the welding portion 311 is fixedly connected to the bottom surface of the seat body, so that the capacitor fixing plate is more stable when installed on the circuit board. In some embodiments, the seat body 30 is also provided with a narrow groove 32 that runs through the inner surface of the seat body and the outer surface of the seat body; the bottom surface of the seat body 30 is set to a flat plane for mounting and fixing the capacitor fixing plate on the circuit board.

[0057] Reference Figure 6-Figure 8As shown, in one embodiment, the plurality of support blocks include a first support block 33, a second support block 34, a third support block 35, and a fourth support block 36; wherein the first support block 33, the second support block 34, and the third support block 35 are located on one half of the seat body, and the fourth support block 36 is located on the other half of the seat body; the narrow groove 32 is respectively provided between the second support block 34 and the first support block 33 and the third support block 35. A groove 37 is provided between the first support block 33 and the fourth support block 36, and correspondingly, a groove 37 is also provided between the third support block 35 and the fourth support block 36; the groove 37 is higher than the inner surface of the seat body. Referring to Figure 7 As shown, in some embodiments, the inner side of the fourth support block 36 is arranged in an L shape corresponding to the position of the mounting hole 302 of the seat body. Through such a design, the inner surface of the receiving space 301 for installing the capacitor is not completely an arc surface, thereby increasing the friction between the receiving space 301 and the surface of the capacitor, thereby preventing the capacitor body 100 from rotating; in addition, by hollowing out, the material can also be reduced and the weight of the capacitor fixing plate can be reduced.

[0058] Reference Figure 6 , Figure 8 As shown, there are two mounting holes 302 , which are respectively arranged at two corners of the fourth support block 36 close to the bottom surface of the seat body; corresponding to the mounting holes 302 , the welding sheets 31 are two sheets, which are respectively installed at the two mounting holes.

[0059] Reference Figure 6-Figure 8 As shown, the slots 32 are symmetrically arranged with the center line of the outer surface of the seat as the center, and a groove 38 connected to the slots 32 is also provided on the outer surface of the seat. When installing a fixed capacitor, the seat 30 is mainly loaded by the half where the fourth support block 36 is located. Therefore, by such a design, the structural strength and overall weight of the capacitor fixing plate are taken into account; by providing slots and grooves, the material can be reduced and the weight can be reduced, but the strength of the capacitor fixing plate is not affected as a whole; at the same time, the area of ​​the capacitor exposed to the outside can be increased, thereby improving the heat dissipation effect. In some embodiments, a groove 39 is also provided on the seat 30, and the groove 39 is configured to divide the capacitor fixing plate into two halves; in some embodiments, the groove 39 connects the second support block 34, the outer surface of the seat body, and the fourth support block 36.

[0060] It is understandable that the above content is a further detailed description of the invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the invention is limited to these descriptions. For ordinary technicians in the technical field to which the invention belongs, without departing from the concept of the invention, they can also make several substitutions or modifications to the described embodiments, and these substitutions or modifications should be deemed to belong to the scope of protection of this patent. In the description of this specification, the description of reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention.

[0061] In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradicting each other. Although the embodiments and advantages of the invention have been described in detail, it should be understood that various changes, substitutions and modifications may be made herein without departing from the scope defined by the appended claims.

[0062] Furthermore, the scope of the invention is not intended to be limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. One of ordinary skill in the art will readily appreciate that the above disclosures, processes, machines, manufactures, compositions of matter, means, methods, or steps currently existing or to be developed that perform substantially the same functions as the corresponding embodiments described herein or obtain substantially the same results as the embodiments described herein may be utilized. Therefore, the appended claims are intended to include such processes, machines, manufactures, compositions of matter, means, methods, or steps within their scope.

Claims

1. A high-stability chip aluminum electrolytic capacitor, characterized by: It comprises a capacitor body and a capacitor seat plate sleeved on the head of the capacitor body; the capacitor body comprises an aluminum shell, a core package encapsulated in the aluminum shell, a capacitor cover plate for encapsulating the core package in the aluminum shell, and a lead terminal led out from the capacitor cover plate; the lead terminal comprises an extension portion extending perpendicularly to the capacitor cover plate, a bending portion bent from the end of the extension portion, and a welding portion extending perpendicularly from the end of the bending portion; the welding portion is multi-bent, comprising a first welding portion, and a second welding portion bent perpendicularly to the first welding portion; wherein the first welding portion and / or the second welding portion is U-shaped; the capacitor seat plate comprises a seat plate body, and a terminal welding placement groove for placing the welding portion of the lead terminal is provided on the seat plate body; the terminal welding placement groove comprises a first section placement groove and a second section placement groove; the first welding portion and the second welding portion are respectively placed in the first section placement groove and the second section placement groove.

2. The high stability chip aluminum electrolytic capacitor according to claim 1, characterized in that: The depth of the first section placement groove is twice the depth of the second section placement groove or the width of the second section placement groove is twice the width of the first section placement groove.

3. The high stability chip aluminum electrolytic capacitor according to claim 1, characterized in that: The seat plate body is also provided with a slot matched with the extension portion of the lead-out terminal, and a terminal guide slot for accommodating the bent portion of the lead-out terminal.

4. The high stability chip aluminum electrolytic capacitor according to claim 3, characterized in that: The depth and width of the terminal guiding groove are equal and greater than or equal to the diameter of the lead-out terminal.

5. The high stability chip aluminum electrolytic capacitor according to claim 1, characterized in that: The bent portion of the lead-out terminal is L-shaped and parallel to the surface of the capacitor cover.

6. The high stability chip aluminum electrolytic capacitor according to claim 1, characterized in that: The plane where the first welding portion is located is orthogonal to the plane where the capacitor cover plate is located, and the opening direction of the U-shaped bend of the first welding portion is the same as the extending direction of the extending portion.

7. The high stability chip aluminum electrolytic capacitor according to claim 1, characterized in that: The second welding portion extends in a direction away from the side surface of the capacitor seat plate, and a surface of the second welding portion is flush with an outer surface of the capacitor seat plate.

8. The high-stability chip-type aluminum electrolytic capacitor according to any one of claims 1 to 7, characterized in that: It also includes a capacitor fixing seat installed at the tail of the capacitor body, and the capacitor fixing seat is provided with a receiving space for accommodating the tail of the capacitor body.

9. The high-stability chip-type aluminum electrolytic capacitor according to any one of claims 1 to 7, characterized in that: The capacitor seat plate is provided with a cavity for accommodating the head of the capacitor body, and the cavity is configured such that the depth of the cavity is greater than or equal to the thickness of the capacitor cover plate and less than half the length of the capacitor body.

10. The high stability chip aluminum electrolytic capacitor according to claim 9, characterized in that: A plurality of support arms are vertically extended from the periphery of the inner surface of the seat plate body, and the inner sides of the plurality of support arms are surrounded to form a cavity for accommodating the head of the capacitor body.

11. The high stability chip aluminum electrolytic capacitor according to claim 8, characterized in that: The capacitor fixing seat comprises a seat body and a plurality of supporting blocks which are perpendicular to the inner surface of the seat body at the periphery of the inner surface of the seat body; wherein the inner sides of the plurality of supporting blocks are surrounded to form a receiving space for accommodating the tail of the capacitor body.

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