Auxiliary assembly structure of vehicle lamp heat dissipation module and use method thereof

Abstract

The present application relates to the technical field of automobile parts assembly, and in particular to an auxiliary assembly structure of a headlight heat dissipation module and a method of using the same, comprising a bottom plate, a first placement groove for placing a PCBA board is provided on the bottom plate, a top plate is hinged on the bottom plate through a connecting rod, and a glue brushing port is provided between the top and the bottom wall of the top plate; when the top plate is rotated to be pressed against the PCBA board, the glue brushing port is located directly above the PCBA board; a worker places the PCBA board in the first placement groove, and then rotates the connecting rod, and the top plate rotates accordingly, until the glue brushing port moves directly above the PCBA board, and a brush covered with heat dissipation glue is placed in the first placement groove and the PCBA board is brushed with glue; the worker rotates the connecting rod in the opposite direction, so that the top plate is removed from the PCBA board, and the PCBA board is manually taken out of the first placement groove and bolted to the radiator. The present application has the advantage of improving the assembly quality of the heat dissipation module.

Description

Technical Field

[0001] The present application relates to the technical field of automobile parts assembly, and in particular to an auxiliary assembly structure of a vehicle lamp heat dissipation module and a use method thereof. Background Art

[0002] The headlight heat dissipation module is an important component of the automotive lighting system. Its main function is to ensure that the heat generated by the headlight during operation can be effectively dissipated, thereby maintaining the stable operation of the headlight and extending its service life.

[0003] The related art discloses a heat dissipation module including a heat sink and a PCBA board bolted to the heat sink. A worker first applies heat dissipation glue on the PCBA board, then adheres the PCBA board to the heat sink, and finally bolts the two together.

[0004] The coating of the heat dissipation adhesive on the PCBA board and the positioning of the PCBA board on the radiator are all manually performed by workers, so there may be operational errors, resulting in a high defective rate of the heat dissipation module, which is obviously insufficient. Summary of the invention

[0005] In order to improve the assembly quality of the heat dissipation module, the present application provides an auxiliary assembly structure of the heat dissipation module of a vehicle lamp and a method of using the same.

[0006] In a first aspect, the present application provides an auxiliary assembly structure of a vehicle lamp heat dissipation module, which adopts the following technical solution: An auxiliary assembly structure of a vehicle lamp heat dissipation module comprises a bottom plate, the bottom plate is provided with a first placement groove for placing a PCBA board, the bottom plate is hinged with a top plate via a connecting rod, a glue brushing port is provided between the top and the bottom wall of the top plate; when the top plate is rotated to be pressed against the PCBA board, the glue brushing port is located directly above the PCBA board.

[0007] By adopting the above technical solution, the worker places the PCBA board in the first placement slot, and then rotates the connecting rod so that the glue brushing port on the top plate rotates to the top of the PCBA board. After that, the brush is applied in the glue brushing port, and the heat dissipation glue is applied to the PCBA board. After that, the PCBA board is manually removed and bonded to the radiator, and then the two are bolted together. The present application uses auxiliary tools to apply glue to the PCBA board. The gluing process is easy to operate and has high accuracy, which reduces the defective rate of the heat dissipation module.

[0008] Optionally, a pickup slot communicating with the first placement slot is provided on the bottom plate at a position adjacent to the first placement slot.

[0009] By adopting the above technical solution, the removal slot makes it convenient for workers to manually take the PCBA board out of the first placement slot.

[0010] Optionally, a base is placed next to the bottom plate, and a second placement groove is provided on the base for placing the radiator. A vertical guide rod is arranged on the base, and a pressure plate for pressing the PCBA board onto the radiator is slidably sleeved on the guide rod, and a mounting hole is provided on the pressure plate at a bolted position relative to the PCBA board and the radiator.

[0011] By adopting the above technical solution, the worker places the radiator in the second placement groove and adheres the PCBA board coated with glue to the radiator. Then the pressing plate moves downward and presses the PCBA board. The heat dissipation glue is evenly distributed between the radiator and the PCBA board under pressure. Then the radiator and the PCBA board are bolted together through the mounting holes on the pressing plate.

[0012] Optionally, a plurality of guide rods are arranged on the base and the pressure plate is slidably sleeved on the plurality of guide rods.

[0013] By adopting the above technical solution, multiple guide rods limit the circumferential rotation of the pressing plate, ensuring that the mounting holes on the pressing plate can be aligned with the heat sink and the bolting positions of the PCBA board.

[0014] Optionally, a bearing plate is arranged on the guide rod, the bearing plate is located above the pressing plate, and a magnetic patch for magnetic attraction with the bearing plate is arranged on the pressing plate.

[0015] By adopting the above technical solution, the pressure plate can be sucked to a high place under the action of the magnetic sticker.

[0016] Optionally, a torque gun electrically connected to a control system is arranged next to the base.

[0017] By adopting the above technical solution, the torque gun facilitates the bolting of the heat sink and the PCBA board, thereby improving the assembly efficiency.

[0018] Optionally, the pressure plate includes a lifting plate slidably mounted on the guide rod, a sheet plate located above the lifting plate and used to press the PCBA board, the lifting plate is arranged with pillars, a tension spring mounted on the pillars is arranged between the lifting plate and the sheet plate, a suction head is arranged at the bottom of the sheet plate, a through hole is opened on the bearing plate, a plurality of elastic rods slidably penetrate the through hole and are arranged circumferentially, the bottom end of the elastic rod is arranged on the lifting plate, an elastic bag is arranged between the plurality of elastic rods, a hose is connected between the elastic bag and the suction head, and when the lifting plate is at the highest point, the distance between the elastic rod and the axis of the through hole gradually increases in a direction from bottom to top.

[0019] By adopting the above technical solution, during the descent of the lifting plate, multiple elastic rods are pulled through the through holes, so that the multiple elastic rods gradually shrink and the air in the elastic bag is squeezed out. The sheet plate is first pressed against the PCBA board. At this time, the lifting plate continues to descend a certain height and the tension spring is stretched. When the pressure plate returns upward, the lifting plate rises first, and the sheet plate continues to press the PCBA board until the tension spring completely recovers its deformation. After that, the lifting plate and the sheet plate rise synchronously. During the rising process, the top ends of the multiple elastic rods gradually move away from each other, and the elastic bag is pulled open, so that negative pressure is formed in the elastic bag, and then the heat dissipation module is adsorbed through the hose and the suction head, and then the heat dissipation module is brought to a high place suspended in the air, which is convenient for workers to manually pick up materials.

[0020] Optionally, the bottom plate is connected to the base, and the bottom plate includes a substrate and a positioning plate placed on the substrate, the first placement groove is located on the positioning plate and extends to the bottom surface of the first placement groove, the positioning plate is hinged on the substrate, and an elastic plate extending to directly below the first placement groove is also arranged at the bottom of the positioning plate.

[0021] By adopting the above technical solution, after the glue is applied, the worker manually rotates the positioning plate until the PCBA board is rotated to the top of the heat sink, and the worker manually presses the elastic plate, so that the elastic plate pushes the PCBA board out of the first placement slot to the radiator. During the transfer process, the worker's hands do not touch the PCBA board at all, thereby reducing the possibility of accidental contamination with heat dissipation glue.

[0022] In a second aspect, the present application provides a method for using a vehicle lamp heat dissipation module auxiliary assembly structure, which adopts the following technical solution: A method for using a vehicle lamp heat dissipation module auxiliary assembly structure comprises the following steps: S1. The worker places the PCBA board in the first placement slot, then rotates the connecting rod, and the top plate rotates accordingly, until the glue brushing port moves to the top of the PCBA board, and places the brush covered with heat dissipation glue in the first placement slot and applies glue to the PCBA board; S2. The worker rotates the connecting rod in the opposite direction to remove the top plate from the PCBA board, manually takes the PCBA board out of the first placement slot and bolts it to the heat sink.

[0023] By adopting the above technical solution, the worker places the PCBA board in the first placement groove, and then rotates the connecting rod to rotate the glue brushing port on the top plate to the top of the PCBA board. Thereafter, the heat dissipation glue is applied to the PCBA board from the glue brushing port. The PCBA board is then manually removed and bonded to the radiator, and finally the two are bolted together.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. The worker places the PCBA board in the first placement slot, and then rotates the connecting rod so that the glue-brushing port on the top plate rotates to the top of the PCBA board. After that, the brush is applied in the glue-brushing port, and the heat dissipation glue is applied to the PCBA board. Then the PCBA board is manually removed and bonded to the radiator, and then the two are bolted together. This application uses auxiliary tools to apply glue to the PCBA board. The gluing process is easy to operate and has high accuracy, which reduces the defective rate of the heat dissipation module. 2. The worker places the radiator in the second placement slot and adheres the PCBA board coated with glue to the radiator. Then the pressing plate moves downward and presses the PCBA board tightly. The heat dissipation glue is evenly spread between the radiator and the PCBA board under pressure. Then the radiator and the PCBA board are bolted together through the mounting holes on the pressing plate. 3. After the glue is applied, the worker manually rotates the positioning plate until the PCBA board is rotated to the top of the heat sink. The worker manually presses the elastic plate to push the PCBA board out of the first placement slot onto the radiator. During the transfer process, the worker's hands do not touch the PCBA board at all, thereby reducing the possibility of accidental contamination with heat dissipation glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the structure of an embodiment of the present application.

[0026] Figure 2 It is a cross-sectional view showing the positional relationship among the elastic plate, the base plate and the positioning plate in the embodiment of the present application.

[0027] Figure 3 It is an exploded view of the hose, the elastic bag and the elastic rod in the embodiment of the present application.

[0028] Explanation of the reference numerals: 1. Radiator; 2. PCBA board; 3. Bottom plate; 31. Positioning plate; 32. Base plate; 311. First placement slot; 312. Pick-up slot; 4. Connecting rod; 5. Top plate; 51. Glue brushing port; 6. Base; 61. Second placement slot; 7. Guide rod; 8. Press plate; 81. Lifting plate; 82. Sheet plate; 821. Mounting hole; 9. Load-bearing plate; 91. Through hole; 10. Magnetic tile; 11. Elastic plate; 12. Pillar; 13. Tension spring; 14. Suction head; 15. Elastic rod; 16. Elastic bag; 17. Hose. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-3 This application is described in further detail.

[0030] An embodiment of the present application discloses an auxiliary assembly structure of a vehicle lamp heat dissipation module.

[0031] Example 1 Reference Figure 1The auxiliary assembly structure of the headlight heat dissipation module includes a bottom plate 3, which includes a horizontal substrate 32 and a positioning plate 31 placed above the substrate 32. The top of the positioning plate 31 is provided with a first placement groove 311 for placing the PCBA board 2, and the first placement groove 311 extends to the bottom surface of the positioning plate 31.

[0032] Reference Figure 1 A horizontal top plate 5 is hinged on the base plate 32 through a plurality of connecting rods 4, and a glue brushing port 51 is opened between the top of the top plate 5 and the bottom wall.

[0033] The worker places the PCBA board 2 in the first placement groove 311 , and then rotates the connecting rod 4 , and the top plate 5 moves accordingly. When the top plate 5 rotates to be pressed against the PCBA board 2 , the glue brushing port 51 is located directly above the PCBA board 2 .

[0034] At this time, the worker uses a brush to brush the heat dissipation glue back and forth in the glue brushing port 51, and the heat dissipation glue is brushed onto the PCBA board 2, thereby achieving fixed-point brushing of the heat dissipation glue on the PCBA board 2, improving the accuracy and uniformity of the heat dissipation glue brushing position, and reducing errors.

[0035] Reference Figure 1 A take-out slot 312 communicating with the first placement slot 311 is provided at the top of the positioning plate 31 , and the take-out slot 312 facilitates workers to manually take the PCBA board 2 out of the first placement slot 311 .

[0036] Reference Figure 1 and Figure 2 A base 6 is bolted to the bottom plate 3, and a second placement groove 61 for placing the radiator 1 is provided on the base 6. The positioning plate 31 is hinged on the base plate 32, and the bottom of the positioning plate 31 is also bolted to an elastic plate 11 extending to the bottom of the first placement groove 311.

[0037] Reference Figure 1 and Figure 2 After the glue is applied, the worker manually rotates the positioning plate 31 until the PCBA board 2 is rotated to the top of the radiator 1, and manually presses the elastic plate 11 downward. The elastic plate 11 pushes the PCBA board 2 out of the first placement groove 311 until it falls on the radiator 1. During the transfer process, the worker's hands do not touch the PCBA board 2 at all, thereby reducing the possibility of accidental contamination of the heat dissipation glue.

[0038] Reference Figure 1 and Figure 3 A plurality of vertical guide rods 7 are threadedly connected to the base 6 , and a pressing plate 8 for pressing the PCBA board 2 onto the heat sink 1 is slidably sleeved on the plurality of guide rods 7 .

[0039] The pressing plate 8 includes a lifting plate 81 slidably mounted on the guide rod 7, and a plate 82 located above the lifting plate 81 and used to press the PCBA board 2. A pillar 12 is integrally formed on the lifting plate 81, and a tension spring 13 mounted on the pillar 12 is arranged between the lifting plate 81 and the plate 82. A mounting hole 821 is opened on the plate 82 at the bolted position relative to the PCBA board 2 and the radiator 1, and a suction head 14 is bonded to the bottom of the plate 82.

[0040] The carrier plate 9 is provided with a through hole 91, in which a plurality of elastic rods 15 arranged circumferentially are slidably penetrated, the bottom ends of the elastic rods 15 are welded to the lifting plate 81, elastic bags 16 are bonded between the plurality of elastic rods 15, and a hose 17 is connected between the elastic bags 16 and the suction head 14. When the lifting plate 81 is at the highest point, the distance between the elastic rods 15 and the axis of the through hole 91 gradually increases from bottom to top.

[0041] The worker manually presses down the lifting plate 81. During the process of the lifting plate 81 descending, the multiple elastic rods 15 are pulled through the through holes 91, so that the multiple elastic rods 15 gradually shrink and the air in the elastic bag 16 is squeezed out. The sheet 82 is first pressed against the PCBA board 2. At this time, the lifting plate 81 continues to descend a certain height, and the tension spring 13 is stretched.

[0042] The pressing plate 8 presses the PCBA board 2 so that the heat dissipation adhesive is evenly distributed between the PCBA board 2 and the radiator 1 , and then the radiator 1 is bolted to the PCBA board 2 through the mounting holes 821 on the pressing plate 8 .

[0043] When the pressing plate 8 returns upward, the lifting plate 81 rises first, and the sheet plate 82 continues to press the PCBA board 2 until the tension spring 13 completely recovers its deformation, after which the lifting plate 81 and the sheet plate 82 rise synchronously.

[0044] During the rising process, the top ends of the multiple elastic rods 15 gradually move away from each other, and the elastic bag 16 is pulled open, thereby forming a negative pressure in the elastic bag 16, and then the heat dissipation module is adsorbed through the hose 17 and the suction head 14, and then the heat dissipation module is brought to a high place and suspended in the air, making it convenient for workers to manually take out materials.

[0045] Reference Figure 1 A torque gun (not shown in the figure) electrically connected to the control system is arranged next to the base 6. The torque gun facilitates the bolting of the radiator 1 and the PCBA board 2, thereby improving the assembly efficiency.

[0046] Reference Figure 1 and Figure 3A carrier plate 9 is arranged on the top of the plurality of guide rods 7. The carrier plate 9 is located above the pressure plate 8. A magnetic patch 10 is arranged on the pressure plate 8 for magnetic attraction with the carrier plate 9. When the pressure plate 8 is not in use, the pressure plate 8 is kept at a high position under the magnetic effect of the magnetic patch 10 and the carrier plate 9, so as to facilitate the taking and placing of the heat dissipation module.

[0047] The implementation of Example 1 is as follows: the worker places the PCBA board 2 in the first placement groove 311, then rotates the connecting rod 4, and the top plate 5 rotates accordingly, until the glue brushing port 51 moves to the top of the PCBA board 2, and places the brush covered with heat dissipation glue in the first placement groove 311 and brushes the PCBA board 2 with glue, and the heat dissipation glue is brushed onto the PCBA board 2. The worker manually rotates the positioning plate 31 until the PCBA board 2 rotates to the top of the radiator 1, and manually presses the elastic plate 11 downward, and the elastic plate 11 pushes the PCBA board 2 out of the first placement groove 311 until it falls onto the radiator 1. The worker manually presses the lifting plate 81 downward, and during the descent of the lifting plate 81, multiple elastic rods 15 are pulled through the through holes 91, so that the multiple elastic rods 15 gradually shrink, and the air in the elastic bag 16 is squeezed out. The sheet plate 82 is first pressed against the PCBA board 2, so that the heat dissipation glue is evenly distributed between the PCBA board 2 and the radiator 1. At this time, the lifting plate 81 continues to descend for a certain height, and the tension spring 13 is stretched. When the lifting plate 81 moves to the lowest point, the heat sink 1 is bolted to the PCBA board 2 through the mounting holes 821 on the plate 82. When the pressing plate 8 returns upward, the lifting plate 81 rises first, and the plate 82 continues to press the PCBA board 2 until the tension spring 13 completely recovers its deformation, and then the lifting plate 81 and the plate 82 rise synchronously.

[0048] During the rising process, the top ends of the multiple elastic rods 15 gradually move away from each other, and the elastic bag 16 is pulled open, thereby forming a negative pressure in the elastic bag 16, and then the heat dissipation module is adsorbed through the hose 17 and the suction head 14, and then the heat dissipation module is brought to a high place and suspended in the air, making it convenient for workers to manually take out materials.

[0049] Example 2 Embodiment 2 of the present application discloses a method for using an auxiliary assembly structure of a vehicle lamp heat dissipation module, comprising the following steps: S1. The worker places the PCBA board 2 in the first placement groove 311, and then rotates the connecting rod 4, and the top plate 5 rotates accordingly, until the glue brushing port 51 moves to the top of the PCBA board 2, and places the brush covered with heat dissipation glue in the first placement groove 311 and brushes the PCBA board 2 with glue; S2, the worker rotates the connecting rod 4 in the opposite direction to remove the top plate 5 from the PCBA board 2; then manually rotates the positioning plate 31 until the PCBA board 2 is rotated to the top of the radiator 1, and manually presses the elastic plate 11 downward, so that the elastic plate 11 pushes the PCBA board 2 out of the first placement groove 311 until it falls onto the radiator 1; S3, the worker manually presses down the lifting plate 81. During the process of the lifting plate 81 descending, the multiple elastic rods 15 are pulled through the through holes 91, so that the multiple elastic rods 15 gradually shrink and the air in the elastic bag 16 is squeezed out. The sheet 82 is first pressed against the PCBA board 2, so that the heat dissipation glue is evenly distributed between the PCBA board 2 and the radiator 1. At this time, the lifting plate 81 continues to descend a certain height, and the tension spring 13 is stretched. When the lifting plate 81 moves to the lowest point, the radiator 1 is bolted to the PCBA board 2 through the mounting hole 821 on the sheet 82.

[0050] S3, the pressing plate 8 returns upward, the lifting plate 81 rises first, and the plate 82 continues to press the PCBA board 2 until the tension spring 13 completely recovers its deformation, after which the lifting plate 81 and the plate 82 rise synchronously. During the rising process, the top ends of the multiple elastic rods 15 gradually move away from each other, and the elastic capsule 16 is pulled open, thereby forming a negative pressure in the elastic capsule 16, and then the heat dissipation module is adsorbed through the hose 17 and the suction head 14, and then the heat dissipation module is brought to a high place.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An auxiliary assembly structure of a vehicle lamp heat dissipation module, characterized in that: The invention comprises a bottom plate (3), wherein a first placement groove (311) for placing a PCBA board (2) is provided on the bottom plate (3), a top plate (5) is hingedly connected to the bottom plate (3) via a connecting rod (4), and a glue brushing opening (51) is provided between the top and the bottom wall of the top plate (5); when the top plate (5) is rotated to be pressed against the PCBA board (2), the glue brushing opening (51) is located directly above the PCBA board (2).

2. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 1, characterized in that: A piece taking slot (312) communicating with the first placement slot (311) is provided on the bottom plate (3) at a position adjacent to the first placement slot (311).

3. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 1, characterized in that: A base (6) is also placed next to the bottom plate (3), and a second placement groove (61) for placing the radiator (1) is provided on the base (6). A vertical guide rod (7) is arranged on the base (6), and a pressure plate (8) for pressing the PCBA board (2) onto the radiator (1) is slidably sleeved on the guide rod (7), and a mounting hole (81) is provided on the pressure plate (8) at a bolted position relative to the PCBA board (2) and the radiator (1).

4. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 3, characterized in that: A plurality of guide rods (7) are arranged on the base (6), and a pressure plate (8) is slidably sleeved on the plurality of guide rods (7).

5. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 3, characterized in that: A bearing plate (9) is arranged on the guide rod (7), the bearing plate (9) is located above the pressing plate (8), and a magnetic patch (10) for magnetic attraction with the bearing plate (9) is arranged on the pressing plate (8).

6. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 3, characterized in that: A torque gun electrically connected to the control system is arranged next to the base (6).

7. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 3, characterized in that: The pressing plate (8) comprises a lifting plate (81) slidably mounted on the guide rod (7), a plate (82) located above the lifting plate (81) and used to press the PCBA board (2), a pillar (12) is arranged on the lifting plate (81), a tension spring (13) mounted on the pillar (12) is arranged between the lifting plate (81) and the plate (82), a suction head (14) is arranged at the bottom of the plate (82), and a through hole (91) is opened on the carrying plate (9) ), a plurality of elastic rods (15) are slidably inserted into the through hole (91) and arranged in a circumferential direction, the bottom ends of the elastic rods (15) are arranged on the lifting plate (81), elastic bags (16) are arranged between the plurality of elastic rods (15), a hose (17) is connected between the elastic bag (16) and the suction head (14), and when the lifting plate (81) is at the highest point, the distance between the elastic rod (15) and the axis of the through hole (91) gradually increases in a direction from bottom to top.

8. The auxiliary assembly structure of the vehicle lamp heat dissipation module according to claim 3, characterized in that: The bottom plate (3) is connected to the base (6), and the bottom plate (3) comprises a base plate (32) and a positioning plate (31) placed on the base plate (32); the first placement groove (311) is located on the positioning plate (31) and extends to the bottom surface of the first placement groove (311); the positioning plate (31) is hinged on the base plate (32); and an elastic plate (11) is also arranged at the bottom of the positioning plate (31) and extends to directly below the first placement groove (311).

9. A method for using the auxiliary assembly structure of a vehicle lamp heat dissipation module according to any one of claims 1 to 8, characterized in that: The steps include: S1. A worker places the PCBA board (2) in the first placement groove (311), then rotates the connecting rod (4), and the top plate (5) rotates accordingly, until the glue brushing port (51) moves to the top of the PCBA board (2), and places a brush covered with heat dissipation glue in the first placement groove (311) and applies glue to the PCBA board (2); S2. The worker rotates the connecting rod (4) in the opposite direction to remove the top plate (5) from the PCBA board (2), and manually takes the PCBA board (2) out of the first placement groove (311) and bolts it to the heat sink (1).

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