Circuit board and electronic equipment

Abstract

The present application discloses a circuit board and an electronic device. A plug-in part for connecting with a target connection object is arranged at a target board edge of the circuit board. The plug-in part includes at least a first row of gold fingers and a second row of gold fingers located on the same board surface side of the circuit board. The first gold finger in the first row of gold fingers and the second gold finger at the corresponding position in the second row of gold fingers are arranged in a first direction by an insulating area, and the first direction and the plug-in direction of the plug-in part meet a parallel condition. The first gold finger and the target board edge are separated by a first distance in the first direction, and the second gold finger and the target board edge are separated by a second distance in the first direction, and the first distance is different from the second distance.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board and electronic equipment. Background Art

[0002] Circuit boards can usually be equipped with gold fingers at the edge of the board to achieve electrical connection with other hardware. Gold fingers are conductive sheets arranged in an array on the circuit board. They are called gold fingers because they are arranged like fingers and are gold-plated on the surface. The rows of gold fingers occupy a certain size in their arrangement direction, and this size determines the width of the interface formed by the gold fingers. When designing hardware upgrades, higher requirements are placed on signal transmission efficiency. Therefore, how to improve the signal transmission efficiency of the interface under the condition of limited interface width has become a technical problem that needs to be solved urgently by technicians in this field. Summary of the invention

[0003] This application provides the following technical solutions:

[0004] A circuit board, wherein a plug-in portion for connecting to a target connection object is arranged at a target board edge of the circuit board, the plug-in portion at least comprises a first row of gold fingers and a second row of gold fingers located on the same board surface side of the circuit board, a first gold finger in the first row of gold fingers and a second gold finger at a corresponding position in the second row of gold fingers are arranged in a first direction separated by an insulating area, and the first direction and the plug-in direction of the plug-in portion meet a parallel condition;

[0005] The first golden finger and the target board edge are separated by a first distance in the first direction, and the second golden finger and the target board edge are separated by a second distance in the first direction, and the first distance is different from the second distance.

[0006] Optionally, in the above circuit board, the first row of gold fingers and the second row of gold fingers are located in the same board layer of the circuit board, and the insulating area is composed of insulating material arranged in the board layer where the first gold fingers and the second gold fingers are located.

[0007] Optionally, in the above-mentioned circuit board, the first row of gold fingers is arranged on the first board layer of the circuit board for transmitting the first layer signal, and the second row of gold fingers is arranged on the second board layer of the circuit board for transmitting the second layer signal, and the height difference formed by the first board layer and the second board layer in the thickness direction of the circuit board is not greater than 0.3 mm.

[0008] Optionally, in the above circuit board, the plug-in portion has an outermost surface and a secondary outermost surface along the thickness direction of the circuit board, and the outermost surface and the outer surface of the circuit board meet the coplanar condition;

[0009] One of the first row of gold fingers and the second row of gold fingers is located on the outermost surface, and the other is located on the secondary outer surface.

[0010] Optionally, in the above circuit board, a part of the circuit board extends outward from the edge of the target board along the first direction to form the plug-in portion, and the first distance is greater than the second distance; or,

[0011] A portion of the circuit board is retracted inward from an edge of the target board along the first direction to form the plug-in portion, and the first distance is smaller than the second distance.

[0012] Optionally, in the above-mentioned circuit board, the plug-in portion has a plurality of step portions arranged sequentially along the first direction, and the thickness of the plurality of step portions increases sequentially along the edge of the target board toward the central area of ​​the circuit board, and the thickness of the step portions is not greater than the thickness of the circuit board and not less than 50% of the thickness of the circuit board.

[0013] Optionally, in the above circuit board, the plug-in portion includes a third row of gold fingers located on the side of the circuit board facing away from the first row of gold fingers, and the projections of the third row of gold fingers and the first row of gold fingers along the thickness direction of the circuit board have overlapping parts; and / or,

[0014] The plug-in portion includes a fourth row of gold fingers located on the side of the circuit board facing away from the second row of gold fingers, and projections of the fourth row of gold fingers and the second row of gold fingers along the thickness direction of the circuit board have overlapping portions.

[0015] Optionally, in the above circuit board, the plug-in portion is connected to the edge of the target board, and the dimension of the plug-in portion along the second direction is not greater than the dimension of the edge of the target board along the second direction;

[0016] The plug-in portion is used for adapting and connecting with a connecting portion of a target plug-in width of the target connection object, the target plug-in width is the size of the connecting portion along the second direction, and the second direction satisfies a parallel condition with the target board edge.

[0017] An electronic device comprises a circuit board and a target connection object, wherein a plug-in portion for connecting to the target connection object is provided at a target board edge of the circuit board;

[0018] The plug-in portion at least includes a first row of gold fingers and a second row of gold fingers located on the same side of the circuit board, a first gold finger in the first row of gold fingers and a second gold finger at a corresponding position in the second row of gold fingers are arranged in a first direction separated by an insulating area, and the first direction and the plug-in direction of the plug-in portion meet a parallel condition;

[0019] The first golden finger and the target board edge are separated by a first distance in the first direction, the second golden finger and the target board edge are separated by a second distance in the first direction, and the first distance is different from the second distance;

[0020] The circuit board is connected to the target connection object for multi-layer signal transmission.

[0021] Optionally, in the above electronic device, the target connection object includes:

[0022] A connector, the connector comprising at least a first elastic terminal and a second elastic terminal located on the same side of the connector, adapted to connect the first row of gold fingers and the second row of gold fingers so that the circuit board can perform multi-layer signal transmission;

[0023] The first end of the connector has a first connection portion with a first target plugging width, and the second end of the connector has a second connection portion with a second target plugging width. The structure of the first connection portion is the same as or different from that of the second connection portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0025] Figure 1 is a schematic diagram of a circuit board according to an embodiment of the present application;

[0026] Figure 2 yes Figure 1 A top view of the circuit board shown;

[0027] Figure 3 yes Figure 1 a cross-sectional view of the circuit board shown;

[0028] Figure 4 is a cross-sectional view of a circuit board according to another embodiment of the present application;

[0029] Figure 5 yes Figure 4 A top view of the circuit board shown;

[0030] Figure 6 is a top view of a circuit board according to another embodiment of the present application;

[0031] Figure 7 is a top view of a circuit board according to another embodiment of the present application;

[0032] Figure 8 is a schematic diagram of a gold finger of a circuit board according to another embodiment of the present application;

[0033] Fig. 9 is a schematic diagram of a gold finger of a circuit board according to another embodiment of the present application;

[0034] Fig.10 is a cross-sectional view of a circuit board according to another embodiment of the present application;

[0035] Fig.11 is a three-dimensional diagram of a circuit board according to another embodiment of the present application;

[0036] Fig.12 is a three-dimensional diagram of a circuit board according to another embodiment of the present application;

[0037] Fig.13 It is a schematic diagram of a first circuit board, a second circuit board and a connector in an electronic device after being disassembled and separated;

[0038] Fig.14 yes Fig.13 A schematic diagram of a first circuit board and a second circuit board being electrically connected via a connector;

[0039] Fig.15 yes Fig.13 Schematic diagram of the connector structure.

[0040] The markings in the figure are:

[0041] 100, target board edge;

[0042] 200, plug-in part; 210, first row of gold fingers; 211, first gold finger; 220, second row of gold fingers; 221, second gold finger; 230, third row of gold fingers; 240, fourth row of gold fingers; 250, third gold finger;

[0043] 310, first circuit board; 320, second circuit board;

[0044] 400, connector; 401, first connecting portion; 402, second connecting portion; 410, first elastic terminal; 420, second elastic terminal; 430, third elastic terminal; 440, fourth elastic terminal;

[0045] K1, first direction; K2, second direction; K3, plate thickness direction. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0047] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0048] In the description of this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0049] See also Figure 1 to Figure 15 The embodiment of the present application provides a circuit board, wherein a plug-in portion 200 for connecting to a target connection object is provided at a target board edge 100 of the circuit board, and the plug-in portion 200 at least includes a first row of gold fingers 210 and a second row of gold fingers 220 located on the same board surface side of the circuit board, and a first gold finger 211 in the first row of gold fingers 210 and a second gold finger 221 at a corresponding position in the second row of gold fingers 220 are arranged in a first direction K1 by an insulating region, and the first direction K1 and the plug-in direction of the plug-in portion 200 meet a parallel condition. The first gold finger 211 and the target board edge 100 are separated by a first distance in the first direction K1, and the second gold finger and the target board edge 100 are separated by a second distance in the first direction K1, and the first distance is different from the second distance.

[0050] The first row of gold fingers 210 is formed by arranging a plurality of first gold fingers 211, and the lengths of different first gold fingers 211 (i.e., the dimensions along the plugging direction) can be the same or different. The second row of gold fingers 220 is formed by arranging a plurality of second gold fingers 221, and the lengths of different second gold fingers 221 (i.e., the dimensions along the plugging direction) can be the same or different. The first row of gold fingers 210 and the second row of gold fingers 220 are located on the same side of the circuit board, and can be located on the top side of the circuit board or on the bottom side of the circuit board. The first gold fingers 211 and the second gold fingers 221 at the corresponding position are separated by an insulating region along the first direction K1, and the insulating region plays the role of a safe electrical distance between the first gold fingers 211 and the second gold fingers 221. The insulating region can be implemented in a variety of ways, for example, the insulating region can be a solid formed by an insulating material, blocking between the first gold finger 211 and the second gold finger 221, and for another example, the insulating region can be a virtual body formed by a space (such as a hole on a board layer), separating the first gold finger 211 and the second gold finger 221. In the first direction K1, the first distance between the first golden finger 211 and the target board edge 100 is different from the second distance between the second golden finger 221 and the target board edge 100. The first distance may be smaller than the second distance, that is, the first golden finger 211 is closer to the target board edge 100 than the second golden finger 221. The first distance may also be greater than the second distance, that is, the second golden finger 221 is closer to the target board edge 100 than the first golden finger 211.

[0051] Since the circuit board is provided with a first row of gold fingers 210 and a second row of gold fingers 220 located on the same side of the board surface, and the first gold fingers 211 in the first row of gold fingers 210 and the second gold fingers 221 at corresponding positions in the second row of gold fingers 220 are spaced apart by an insulating area along the first direction K1, more conductive contact points are provided for the interface formed by the plug-in portion 200 without increasing the interface width formed by the plug-in portion 200 (i.e., the size of the plug-in portion 200 along the second direction K2 that is perpendicular to the first direction K1), so that more data or signals can be transmitted in the same time. It can be seen that the circuit board of the present application is conducive to improving the signal transmission efficiency of the interface under the condition of limited interface width.

[0052] In some embodiments, the circuit board may be a single-sided board or a double-sided board, that is, the circuit board may be provided with gold fingers only on one side of the board surface, while the other side of the board surface may not be provided with gold fingers, or may be provided with gold fingers on both sides of the board surface. For example, in some embodiments, the plug-in portion 200 may include a third row of gold fingers 230 located on the side of the board surface of the circuit board facing away from the first row of gold fingers 210, and the projections of the third row of gold fingers 230 and the first row of gold fingers 210 along the board thickness direction K3 of the circuit board have overlapping parts, so that the two sides of the board surface of the circuit board are provided with gold fingers. For another example, in some embodiments, the plug-in portion 200 may include a fourth row of gold fingers 240 located on the side of the board surface of the circuit board facing away from the second row of gold fingers 220, and the projections of the fourth row of gold fingers 240 and the second row of gold fingers 220 along the board thickness direction K3 of the circuit board have overlapping parts, so that the two sides of the board surface of the circuit board are provided with gold fingers. Of course, in other embodiments, the way in which the circuit board realizes the double-sided board form can be a combination of the above-mentioned ways, that is, the plug-in portion 200 can include the third row of gold fingers 230 and the fourth row of gold fingers 240 at the same time. It is easy to understand that by arranging gold fingers on both sides of the board surface of the circuit board, more conductive contact points can be further provided under the condition of limited interface width, thereby further improving the signal transmission efficiency of the interface. For convenience, this specification describes in detail the structural form of the first row of gold fingers 210 and the second row of gold fingers 220 and their variant structures. Other gold fingers of the circuit board, such as the third row of gold fingers 230 and / or the fourth row of gold fingers 240, can be set with reference to the setting method of the first row of gold fingers 210 and / or the second row of gold fingers 220.

[0053] See also Figure 1~Figure 3 In some embodiments, the first row of gold fingers 210 can be arranged on the first board layer of the circuit board for transmitting the first layer signal, and the second row of gold fingers 220 can be arranged on the second board layer of the circuit board for transmitting the second layer signal, and the height difference formed between the first board layer and the second board layer in the board thickness direction K3 of the circuit board is not greater than 0.3 mm. That is, the circuit board can be a double-layer board or a multi-layer board with more than two layers, and the first row of gold fingers 210 and the second row of gold fingers 220 are arranged on different board layers of the circuit board. At the same time, the first row of gold fingers 210 is used to transmit the first layer signal, and the second row of gold fingers 220 is used to transmit the second layer signal, thereby realizing multi-layer signal transmission. It should be noted that the first layer signal can be the signal of the board layer where the first row of gold fingers 210 is located, or it can be the signal of other board layers. Similarly, the second layer signal can be the signal of the board layer where the second row of gold fingers 220 is located, or it can be the signal of other board layers. It is easy to understand that the signal of the board layer where the gold finger is located is directly transmitted through the gold finger. Since the signal transmission process does not require a conductive path such as vias, drill holes, and buried holes to connect different board layers, a relatively higher transmission speed can be achieved.

[0054] When the first row of gold fingers 210 and the second row of gold fingers 220 are arranged on different layers of the circuit board, since the first row of gold fingers 210 and the second row of gold fingers 220 are located on the same side of the circuit board, a step structure can be arranged between the first layer and the second layer to realize that the first row of gold fingers 210 and the second row of gold fingers 220 are exposed on the same side of the circuit board. Figure 3 In the exemplary embodiment, the second board layer where the second row of gold fingers 220 is located is retracted along the first direction K1 relative to the first board layer where the first row of gold fingers 210 is located, so that a step structure is formed between the first board layer and the second board layer. In this structure, since the first row of gold fingers 210 and the second row of gold fingers 220 are located in different board layers, the aforementioned insulating area separating the first gold fingers 211 and the second gold fingers 221 can be understood as a staggered structure, that is, the first gold fingers 211 and the second gold fingers 221 achieve a safe electrical distance through staggered settings. It can be understood that in some embodiments, the insulating area can be a combination of a virtual body and a real body, for example, the insulating area can simultaneously include a staggered structure (virtual body) of the first board layer and the second board layer in space and an insulating material arranged on the first board layer and / or the second board layer.

[0055] When the first row of gold fingers 210 and the second row of gold fingers 220 are arranged on different layers of the circuit board, the height difference formed between the first layer and the second layer in the thickness direction K3 of the circuit board can be set to no more than 0.3 mm, for example, 0.2~0.25 mm. This height difference is roughly equal to the thickness of a single layer of the circuit board. Material removal processing can be performed only on the top layer or the ground layer of the circuit board to form staggered steps, thereby minimizing damage to the original structure of other layers of the circuit board. In this way, while achieving the staggered arrangement of the first row of gold fingers 210 and the second row of gold fingers 220, it is possible to avoid a large difference between the thickness of the plug-in part 200 corresponding to the first row of gold fingers 210 (i.e., the size along the thickness direction K3) and the thickness of the second row of gold fingers 220, resulting in a local thickness of the plug-in part 200 being too small, thereby affecting the structural strength of the plug-in part 200. Figure 3In the exemplary embodiment, the staggered height between the first row of gold fingers 210 and the second row of gold fingers 220 may be equal to the staggered height between the third row of gold fingers 230 and the fourth row of gold fingers 240. In this case, the height difference between the first board layer and the second board layer in the board thickness direction K3 of the circuit board is equal to the board thickness H1 of the circuit board minus half of the difference in thickness H2 at the plug-in portion 200 corresponding to the first row of gold fingers 210. Of course, in other embodiments, the staggered height between the first row of gold fingers 210 and the second row of gold fingers 220 may not be equal to the staggered height between the third row of gold fingers 230 and the fourth row of gold fingers 240, and this application does not limit this. In order to minimize the impact of the step structure on the overall strength of the circuit board, the thickness H2 may be set to be not less than half of the board thickness H1 of the circuit board.

[0056] See also Fig.10 In some embodiments, the plug-in portion 200 may have a plurality of step portions sequentially arranged along the first direction K1, the thickness of the plurality of step portions sequentially increases along the target board edge 100 toward the central area of ​​the circuit board, and the thickness of the step portions is not greater than the thickness of the circuit board and not less than 50% of the thickness of the circuit board. Fig.10 In the exemplary embodiment, the plug-in portion 200 may have three step portions, which are, in order of thickness from small to large, a first step portion with a thickness of H3, a second step portion with a thickness of H2, and a third step portion with a thickness of H1, wherein the thickness of the third step portion is equal to the thickness of the circuit board, and the thickness H3 is not less than half of the thickness H1. For example, the thickness H3 can be set to 60%, 70% or 80% of the thickness H1.

[0057] In the case where the plug-in part 200 has a step portion, the plug-in part 200 has an outermost surface and a secondary outer surface along the board thickness direction K3 of the circuit board. In some embodiments, the outermost surface can be set to meet the coplanar condition with the outer surface of the circuit board, and one of the first row of gold fingers 210 and the second row of gold fingers 220 is located on the outermost surface, and the other is located on the secondary outer surface. The first row of gold fingers 210 and the second row of gold fingers 220 are set on different surfaces of the plug-in part 200, and the gold fingers located on the secondary outer surface can be directly connected to the inner electrical layer of the circuit board. This can reduce the demand for cross-layer electrical connection structures (such as vias) and make the production cost of the circuit board lower. It is easy to understand that the outermost surface of the plug-in part 200 is the surface corresponding to the step portion with the largest thickness, and the secondary outer surface is the surface corresponding to the step portion with the second largest thickness. The outermost surface of the plug-in part 200 and the outer surface of the circuit board meet the coplanar condition, which means that the outermost surface of the plug-in part 200 and the outer surface of the circuit board do not form a height difference in the board thickness direction K3. Figure 3In the exemplary embodiment, the plug-in portion 200 can be provided with two step portions, the outermost surface of the plug-in portion 200 is flush with the outer surface of the circuit board, the second row of gold fingers 220 is arranged on the outermost surface of the plug-in portion 200, and the first row of gold fingers 210 is arranged on the secondary outer surface of the plug-in portion 200.

[0058] See also Figure 4 and Figure 5 In some embodiments, the first row of gold fingers 210 and the second row of gold fingers 220 may be located on the same board layer of the circuit board, and the insulating area is composed of insulating materials provided on the board layer where the first gold fingers 211 and the second gold fingers 221 are located. In this structure, the board layer where the first gold fingers 211 and the second gold fingers 221 are located may be the top surface layer of the circuit board or the bottom surface layer of the circuit board, and the signal of the board layer may be transmitted by the first row of gold fingers 210 and the second row of gold fingers 220 which is closer to the center area of ​​the circuit board, and the one which is farther from the center area of ​​the circuit board may directly transmit the signal of other board layers through the conductive path provided by, for example, the buried hole structure. Figure 4 and Figure 5 In the exemplary embodiment, the first row of gold fingers 210 is farther from the central area of ​​the circuit board than the second row of gold fingers 220. Both are located outside the target board edge 100, that is, the target board edge 100 is located on the side away from the central area of ​​the circuit board along the first direction K1. In other embodiments, the first row of gold fingers 210 and the second row of gold fingers 220 may also be arranged as follows. Figure 6 As shown, the first row of gold fingers 210 and the second row of gold fingers 220 are located on both sides of the target board edge 100. Of course, when the first row of gold fingers 210 and the second row of gold fingers 220 are located on different layers of the circuit board, the first row of gold fingers 210 and the second row of gold fingers 220 can also be as shown. Figure 7 As shown, the target board edge 100 is located on both sides. Figure 6 or Figure 7 In the exemplary embodiment, the number of first gold fingers 211 included in the first row of gold fingers 210 is equal to the number of second gold fingers 221 included in the second row of gold fingers 220. In other embodiments, the number of first gold fingers 211 and the number of second gold fingers 221 may be set to be different. Figure 6 or Figure 7 In addition to being arranged in a straight line along a direction parallel to the second direction K2 as shown, it can also be arranged in a straight line, a curve or a broken line along a direction forming a certain angle with the second direction K2. Figure 8In the exemplary embodiment, the first row of gold fingers 210 includes first gold fingers 211 of different lengths, the second row of gold fingers 220 includes second gold fingers 221 of different lengths, and the insulating area between the first gold fingers 211 and the second gold fingers 221 is no longer arranged in a straight line in a direction parallel to the second direction K2. In this structure, the plug-in portion 200 may include a plurality of third gold fingers 250 that simultaneously occupy the parts of the first row of gold fingers 210 and the parts of the second row of gold fingers 220. Figure 8 As shown, the size of the third gold finger 250 in the first direction K1 is larger than the sum of the sizes of the first gold finger 211 and the second gold finger 221. The size of the third gold finger 250 is relatively large, which can provide a larger conductive area and achieve better current flow. Therefore, the third gold finger 250 can be used to connect to the power layer or ground layer of the circuit board.

[0059] In addition, Figure 6 or Figure 7 In the exemplary embodiment, the first gold finger 211 of the first row of gold fingers 210 and the second gold finger 221 of the second row of gold fingers 220 are arranged opposite to each other in the first direction K1, that is, the first gold finger 211 and the second gold finger 221 are in the same row in the first direction K1. In other embodiments, the first gold finger 211 and the second gold finger 221 may also be arranged not to face each other in the first direction K1. Fig. 9 In the exemplary embodiment shown, the first gold finger 211 and the second gold finger 221 are staggered in the second direction K2, and the second gold finger 221 is directly opposite to the spacing area of ​​the first gold finger 211 in the first row of gold fingers 210 in the first direction K1.

[0060] exist Figure 1 and Figure 2 In the exemplary embodiment, the plug-in portion 200 is connected to the target board edge 100, and the size of the plug-in portion 200 along the second direction K2 is smaller than the size of the target board edge 100 along the second direction K2, and the second direction K2 and the target board edge 100 meet the parallel condition. The plug-in portion 200 is used to adapt and connect with the connecting portion of the target connection object with a target plug-in width, and the target plug-in width is the size of the plug-in portion 200 of the connecting portion along the second direction K2. In other embodiments, the size of the plug-in portion 200 along the second direction K2 can be set to be equal to the size of the target board edge 100 along the second direction K2, such as Fig.11 shown.

[0061] See also Figure 1 and Figure 2In some embodiments, the plug-in portion 200 may be formed by a portion of the circuit board extending outward from the target board edge 100 along the first direction K1, and the first distance is greater than the second distance, that is, the portion of the circuit board protrudes outward from the target board edge 100 along the first direction K1, and at least a portion of the first row of gold fingers 210 and the second row of gold fingers 220 are disposed on the protruding portion. In the first direction K1, the first row of gold fingers 210 is farther from the target board edge 100 than the second row of gold fingers 220. The first distance is the distance between the side of the first gold finger 211 of the first row of gold fingers 210 close to the target board edge 100 and the target board edge 100, and the second distance is the distance between the side of the second gold finger 221 of the second row of gold fingers 220 close to the target board edge 100 and the target board edge 100. Figure 6 As shown, in the case where the first gold finger 211 and the second gold finger 221 are located on both sides of the target board edge 100, the distances from the side where the first gold finger 211 and the second gold finger 221 are close to each other to the target board edge 100 are respectively the first distance and the second distance. In this structure, the first row of gold fingers 210 can be set closer to the target board edge 100 than the second row of gold fingers 220, that is, in the case where the plug-in portion 200 is formed by the local expansion of the circuit board from the target board edge 100 along the first direction K1, the first distance can be smaller than the second distance, which can reduce the expansion size of the outward protruding portion of the circuit board and enhance the ability of the outward protruding portion of the circuit board to resist deformation.

[0062] See also Fig.12 In other embodiments, the plug-in portion 200 can be formed by a part of the circuit board being retracted inwardly from the target board edge 100 along the first direction K1, and the first distance is smaller than the second distance, that is, the part of the circuit board is retracted relative to the target board edge 100 toward the central area of ​​the circuit board, and a groove structure is formed on the board surface side of the circuit board, and the groove structure forms at least part of the plug-in portion 200. In the first direction K1, the second row of gold fingers 220 is farther from the target board edge 100 than the first row of gold fingers 210. Since the plug-in portion 200 is formed by a part of the circuit board being retracted inwardly from the target board edge 100 along the first direction K1, the circuit board is prevented from having a convex portion at the target board edge 100, and the overall ability of the circuit board to resist deformation is stronger.

[0063] See also Figure 1 to Figure 15, an embodiment of the present application provides an electronic device, including a circuit board and a target connection object, a plug-in portion 200 for connecting to the target connection object is provided at the target board edge 100 of the circuit board, and the circuit board and the target connection object are connected for multi-layer signal transmission. The plug-in portion 200 includes at least a first row of gold fingers 210 and a second row of gold fingers 220 located on the same board surface side of the circuit board, a first gold finger 211 in the first row of gold fingers 210 and a second gold finger 221 at a corresponding position in the second row of gold fingers 220 are arranged along a first direction K1 by an insulating region, and the first direction K1 and the plug-in direction of the plug-in portion 200 meet a parallel condition. The first gold finger 211 and the target board edge 100 are separated by a first distance in the first direction K1, and the second gold finger and the target board edge 100 are separated by a second distance in the first direction K1, and the first distance is different from the second distance.

[0064] The electronic device can be of various types such as a laptop computer, a tablet computer, a mobile phone, etc., the circuit board can be of various types such as a graphics card, a memory, a sound card, etc., and the target connection object can be of various types such as a board mounting seat, a connector, etc., and the present application does not limit the types of the above-mentioned devices or components. The structural form of the circuit board can refer to the description of the circuit board in the previous text, and will not be repeated here. The connection between the circuit board and the target connection object for multi-layer signal transmission means that the signals on at least two board layers of the circuit board are transmitted through the connection between the plug-in portion 200 and the target connection object. As mentioned above, the circuit board is conducive to improving the signal transmission efficiency of the interface under the condition of limited interface width, so the electronic device of the present application can perform multi-layer signal transmission with higher transmission efficiency.

[0065] In some embodiments, the target connection object may include a connector 400, which includes at least a first elastic terminal 410 and a second elastic terminal 420 located on the same side of the connector 400, which are used to adapt and connect the first row of gold fingers 210 and the second row of gold fingers 220 to enable multi-layer signal transmission on the circuit board, that is, the first elastic terminal 410 is in electrical contact with the first row of gold fingers 210, and the second elastic terminal 420 is in electrical contact with the second row of gold fingers 220. Fig.14 In the exemplary embodiment, the first circuit board 310 can be configured as Figure 3 The structure shown, that is, the plug-in portion 200 of the first circuit board 310 may include a third row of gold fingers 230 and a fourth row of gold fingers 240. In this case, the connector 400 may include a third elastic terminal 430 and a fourth elastic terminal 440 located on the same side of the connector 400, which are used to adapt and connect the third row of gold fingers 230 and the fourth row of gold fingers 240.

[0066] In some embodiments, the first end of the connector 400 may have a first connection portion 401 of a first target plug width, and the second end of the connector 400 may have a second connection portion 402 of a second target plug width. The structure of the first connection portion 401 and the structure of the second connection portion 402 may be the same or different. Fig.15 In the exemplary embodiment, the structures of the first connection part 401 and the second connection part 402 are different, wherein the first connection part 401 is convex in shape, enclosing the elastic terminal to form a closed connection part structure; the second connection part 402 is concave in shape, exposing the elastic terminal to the outside to form an open connection part structure. The first target plug width refers to the size occupied by all the elastic terminals corresponding to the first connection part 401 in the direction perpendicular to the plug direction (i.e., the arrangement direction of the elastic terminals), and the second target plug width refers to the size occupied by all the elastic terminals corresponding to the second connection part 402 in the direction perpendicular to the plug direction (i.e., the arrangement direction of the elastic terminals). The first target plug width and the second target plug width may be equal or unequal, and this application does not limit this.

[0067] See also Fig.13 and Fig.15 In some embodiments, the first connection portion 401 of the connector 400 is connected to the first circuit board 310, and the second connection portion 402 of the connector 400 is connected to the second circuit board 320, that is, the first connection portion 401 and the second connection portion 402 of the connector 400 are both connected to the circuit board, and the connector 400 is used to achieve electrical connection between the two circuit boards. In other embodiments, the connector 400 can be configured as follows: one of the first connection portion 401 and the second connection portion 402 is connected to the circuit board, and the other is connected to the non-circuit board, and the non-circuit board can be a device or accessory such as a card reader or a data cable.

[0068] exist Fig.15 In the exemplary embodiment, the first end and the second end of the connector 400 are located on opposite sides, that is, the plugging direction of the first connection portion 401 and the plugging direction of the second connection portion 402 meet the parallel condition. In other embodiments, the first end and the second end of the connector 400 may be located on adjacent sides. Fig.15 Taking the example where the positions of the first connection part 401 and the second connection part 402 are respectively called the front side and the rear side of the connector 400, the adjacent two sides can be, for example, the front side and the top side of the connector 400, or the front side and the left side of the connector 400, so that the plug-in direction of the first connection part 401 and the plug-in direction of the second connection part 402 meet the vertical condition.

[0069] In some embodiments, the electronic device may be a server. Currently, the thickness of the mainboard of the mainstream server is 1.97 mm, and the mainboard adopts a 14-layer design. Fig.14 As shown, the circuit board of the present application can be the mainboard of the server. In this structure, the second elastic terminal 420 and the fourth elastic terminal 440 are in contact with the outer layer gold finger, and the thickness here is the traditional board thickness of 1.97 mm. The first elastic terminal 410 and the third elastic terminal 430 are in contact with the inner layer gold finger, and the thickness here occupies 10 layers (that is, 2 signal layers and corresponding 2 reference layers are subtracted from the original 14 layers). Therefore, the thickness at the inner layer gold finger is approximately 1.97×10 / 14=1.4 mm. The thickness of 1.4 mm meets the design requirements of the mainboard strength for the thickness at the gold finger position, and also meets the current industry processing technology requirements. Moreover, after adopting the circuit board structure of the present application, on the same board side of the circuit board, it can change from supporting a single layer signal to supporting multiple layers of signals, which greatly improves the interface signal density. The outer layer gold fingers corresponding to the second elastic terminal 420 and the fourth elastic terminal 440 maintain the thickness of the traditional circuit board, so the original mainboard design stacking can be unchanged, the difficulty of connector design can be reduced, and the durability of the interface can be maintained.

[0070] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0071] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit board, wherein a plug-in portion for connecting to a target connection object is provided at a target board edge of the circuit board, the plug-in portion at least comprises a first row of gold fingers and a second row of gold fingers located on the same board surface side of the circuit board, a first gold finger in the first row of gold fingers and a second gold finger at a corresponding position in the second row of gold fingers are arranged in a first direction separated by an insulating region, and the first direction and the plug-in direction of the plug-in portion meet a parallel condition; The first golden finger and the target board edge are separated by a first distance in the first direction, and the second golden finger and the target board edge are separated by a second distance in the first direction, and the first distance is different from the second distance.

2. The circuit board according to claim 1, wherein the first row of gold fingers and the second row of gold fingers are located on the same board layer of the circuit board, and the insulating area is composed of insulating material arranged on the board layer where the first gold fingers and the second gold fingers are located.

3. According to the circuit board of claim 1, the first row of gold fingers is arranged on the first board layer of the circuit board for transmitting the first layer signal, and the second row of gold fingers is arranged on the second board layer of the circuit board for transmitting the second layer signal, and the height difference formed by the first board layer and the second board layer in the board thickness direction of the circuit board is not greater than 0.3mm.

4. The circuit board according to claim 1, wherein the plug-in portion has an outermost surface and a secondary outermost surface along the thickness direction of the circuit board, and the outermost surface and the outer surface of the circuit board meet the coplanar condition; One of the first row of gold fingers and the second row of gold fingers is located on the outermost surface, and the other is located on the secondary outer surface.

5. The circuit board according to claim 1, wherein a portion of the circuit board extends outward from an edge of the target board along the first direction to form the plug-in portion, and the first distance is greater than the second distance; or A portion of the circuit board is retracted inward from an edge of the target board along the first direction to form the plug-in portion, and the first distance is smaller than the second distance.

6. According to the circuit board according to claim 1, the plug-in portion has a plurality of step portions arranged in sequence along the first direction, the thickness of the plurality of step portions increases in sequence along the edge of the target board toward the central area of ​​the circuit board, and the thickness of the step portion is not greater than the thickness of the circuit board and not less than 50% of the thickness of the circuit board.

7. The circuit board according to claim 1, wherein the plug-in portion comprises a third row of gold fingers located on the side of the circuit board facing away from the first row of gold fingers, and the projections of the third row of gold fingers and the first row of gold fingers along the thickness direction of the circuit board have overlapping parts; and / or, The plug-in portion includes a fourth row of gold fingers located on the side of the circuit board facing away from the second row of gold fingers, and projections of the fourth row of gold fingers and the second row of gold fingers along the thickness direction of the circuit board have overlapping portions.

8. The circuit board according to any one of claims 1 to 7, wherein the plug-in portion is connected to the edge of the target board, and the dimension of the plug-in portion along the second direction is not greater than the dimension of the edge of the target board along the second direction; The plug-in portion is used for adapting and connecting with a connecting portion of a target plug-in width of the target connection object, the target plug-in width is the size of the connecting portion along the second direction, and the second direction satisfies a parallel condition with the target board edge.

9. An electronic device, comprising a circuit board and a target connection object, wherein a plug-in portion for connecting to the target connection object is provided at a target board edge of the circuit board; The plug-in portion at least includes a first row of gold fingers and a second row of gold fingers located on the same side of the circuit board, a first gold finger in the first row of gold fingers and a second gold finger at a corresponding position in the second row of gold fingers are arranged in a first direction separated by an insulating area, and the first direction and the plug-in direction of the plug-in portion meet a parallel condition; The first golden finger and the target board edge are separated by a first distance in the first direction, the second golden finger and the target board edge are separated by a second distance in the first direction, and the first distance is different from the second distance; The circuit board is connected to the target connection object for multi-layer signal transmission.

10. The electronic device according to claim 9, wherein the target connection object comprises: A connector, the connector comprising at least a first elastic terminal and a second elastic terminal located on the same side of the connector, adapted to connect the first row of gold fingers and the second row of gold fingers so that the circuit board can perform multi-layer signal transmission; The first end of the connector has a first connection portion with a first target plugging width, and the second end of the connector has a second connection portion with a second target plugging width. The structure of the first connection portion is the same as or different from that of the second connection portion.

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