A method and device for exposure alignment of multi-layer PCB

Abstract

The present invention discloses an exposure alignment method and device for a multi-layer PCB, wherein the exposure alignment method for the multi-layer PCB includes: performing multi-spectrum scanning on each layer of the PCB to obtain feedback signals; performing resonance focusing processing on the interface of each layer to obtain characteristic data; performing block division according to the characteristic data and forming quantum dot micro-marks; performing selective phase processing and holographic exposure through spatial light modulation; setting a bionic self-repairing film between layers and performing electric field stimulation; performing asynchronous curing and topographic processing; and finally performing iterative correction verification. The technical solution of the present invention can effectively solve the accuracy and yield problems of thick-layer PCBs containing ferrite, metal heat sinks and high-dielectric composite layers during the exposure alignment process.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure alignment of a multi-layer PCB, and in particular to an exposure alignment method and device for a multi-layer PCB. Background Art

[0002] Multilayer PCB refers to a printed circuit board with two or more circuit layers stacked and pressed together by prepreg or adhesive layer. It plays an indispensable role in complex electronic systems and high-density packaging. In order to achieve precise interconnection between circuit layers, the relative position of the circuit pattern and the via must be accurate, which requires "exposure alignment". The so-called exposure alignment is to optically match and calibrate the circuit pattern or pad distribution to be imaged with the target or alignment point on the substrate during processes such as photolithography or laser direct writing, so that each layer of circuit can be accurately superimposed after subsequent etching or plating. If there is a deviation in alignment, it will cause serious defects such as short circuit between layers, open circuit or via failure. Based on this, multilayer PCB must be exposed and aligned with high precision to meet the strict requirements of electronic products for reliability and performance under the trend of high speed and high power density.

[0003] However, existing exposure alignment methods for multi-layer PCBs are often only adapted to the characteristics of a single or a few material layers, and lack sufficient response mechanisms for the extreme environments of multi-material composite structures that appear in actual production (for example, those containing ferrite shields, metal heat sinks, high-dielectric dielectrics, etc.). Once the board thickness increases and is superimposed with materials with huge differences in reflection and absorption coefficients in different bands, traditional optical inspection and exposure processes will have problems such as distortion of alignment targets, local overexposure or underexposure; at the same time, the internal stress caused by repeated hot pressing and curing will cause interlayer deformation, making it difficult to completely eliminate layer misalignment in conventional alignment correction. Given the strong demand for multi-material, multi-layer PCBs in the current high-reliability field, how to maintain high-precision exposure alignment under extreme material conditions has become a core challenge that existing technologies urgently need to break through. Summary of the invention

[0004] The main purpose of the present invention is to solve the technical problem of lack of effective compensation for reflection of different materials and thermal stress deformation in the existing exposure alignment of multi-layer PCBs.

[0005] A first aspect of the present invention provides an exposure alignment method for a multi-layer PCB, the exposure alignment method for the multi-layer PCB comprising:

[0006] Perform multi-spectrum scanning on each layer of the multi-material composite PCB to obtain feedback signals of each spectrum band;

[0007] According to the comparison result between the feedback signal and the preset characteristics of the material, resonant focusing processing is performed on the interfaces of each layer to obtain characteristic data including focusing gain coefficient and interface type label;

[0008] Dividing the multi-material composite PCB into blocks according to the characteristic data, forming quantum dot micro-marks at preset positions of each block, and establishing management data including coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block;

[0009] According to the characteristic data and the management data, selective phase processing is performed on each block through spatial light modulation and holographic exposure is performed to obtain exposure results of each block;

[0010] A bionic self-repairing film is provided between the layers of the multi-material composite PCB;

[0011] Acquiring interface temperature and thermal stress distribution data of the multi-material composite PCB, applying electric field stimulation to the bionic self-repairing film according to the interface temperature and thermal stress distribution data, so that the bionic self-repairing film produces a stress release response, and obtaining an alignment calibration result;

[0012] Perform asynchronous solidification processing on each block according to the alignment calibration result, obtain surface contour data after solidification, and perform selective topographic processing on the local area according to the surface contour data to obtain a flattening result;

[0013] According to the flattening result, the management data and the characteristic data, each block is iteratively corrected and calculated to obtain correction parameters, and each block is verified according to the correction parameters and multi-angle detection data to determine the final inter-layer alignment state.

[0014] Optionally, performing multi-spectrum scanning on each layer of the multi-material composite PCB to obtain feedback signals of each spectrum segment includes:

[0015] Perform ultraviolet light scanning of the first frequency band on the ferrite layer and the metal heat dissipation layer in the multi-material composite PCB to obtain the material absorption coefficient data of the first frequency band;

[0016] Determine the scanning energy threshold of each layer according to the absorption coefficient data of the material in the first frequency band, perform a pre-scan of each layer of the multi-material composite PCB in the visible light frequency band, and obtain initial optical characteristic data of the interface of each layer;

[0017] Selecting an optimal scanning angle according to the initial optical characteristic data, performing near-infrared band scanning on the metal heat dissipation layer of the multi-material composite PCB, and obtaining metal layer thickness distribution data;

[0018] According to the metal layer thickness distribution data and the initial optical characteristic data, a terahertz band scan is performed on the ferrite layer of the multi-material composite PCB to obtain ferrite layer depth distribution data;

[0019] Performing stacking analysis on the metal layer thickness distribution data and the ferrite layer depth distribution data to obtain a layer interface characteristic spectrum;

[0020] The multi-angle reflectivity of the multi-material composite PCB is measured according to the interlayer interface characteristic spectrum to obtain feedback signals of each spectrum segment.

[0021] Optionally, the resonant focusing process is performed on each layer interface according to the comparison result between the feedback signal and the preset material characteristics to obtain characteristic data including a focusing gain coefficient and an interface type label, including:

[0022] Matching and comparing the feedback signal with the standard spectrum data in the material preset characteristic library to obtain the initial characteristic deviation data of each layer of material;

[0023] Performing wavelength compensation processing on the feedback signal according to the initial characteristic deviation data to obtain corrected spectrum data of each spectrum segment;

[0024] Classifying and analyzing the corrected spectral data according to the material interface type to obtain spectral response characteristic diagrams of various interfaces;

[0025] Calculate the phase delay and resonance frequency range of each layer interface according to the spectral response characteristic diagram to obtain interface resonance characteristic data;

[0026] The interface resonance characteristic data is input into a resonance focusing control system, and the resonance frequency of each layer interface is scanned to obtain the interface resonance state parameters;

[0027] The focusing parameters of each layer interface are adjusted according to the interface resonance state parameters, and a resonance gain process is performed to obtain a resonance focusing gain coefficient;

[0028] The resonance focusing gain coefficient is fused with the spectral response characteristic diagram to obtain characteristic data including the focusing gain coefficient and the interface type label.

[0029] Optionally, the multi-material composite PCB is divided into blocks according to the characteristic data, quantum dot micro-marks are formed at preset positions of each block, and management data including coordinate information, luminous characteristics and correction coefficients of the micro-marks of each block is established, including:

[0030] Perform material partitioning and boundary optimization processing on the multi-material composite PCB according to the interface type label and the focusing gain coefficient in the characteristic data to obtain block boundary correction data;

[0031] Dividing the block boundary correction data into a heat dissipation core area, a ferrite shielding area, a high dielectric area, and an FR-4 area, and performing grid processing on each area to generate a layout position coordinate table of quantum dot micro-marks;

[0032] According to the comparison result between the layout position coordinate table and the line layout data, the avoidance vias and wiring areas are determined to obtain an optimized layout scheme of quantum dot micro-markers, and the deposition process of quantum dot markers is performed according to the optimized layout scheme to obtain quantum dot marker arrays of each block;

[0033] Performing multi-wavelength excitation and intensity attenuation tests on the quantum dot marker array to obtain the luminescence wavelength, intensity curve and attenuation coefficient, and obtaining the luminescence characteristic data of the quantum dots in each block;

[0034] The quantum dot marking array is multi-dimensionally associated with the luminescence characteristic data to obtain a marking mapping relationship table for each block, and the spectral correction coefficient corresponding to the material interface is calculated based on the marking mapping relationship table to establish management data containing the coordinate information, luminescence characteristics and correction coefficient of the micro-marks of each block.

[0035] Optionally, performing selective phase processing on each block and performing holographic exposure by spatial light modulation according to the characteristic data and the management data to obtain exposure results of each block includes:

[0036] According to the interface type label in the characteristic data and the luminous characteristics in the management data, the optical characteristics of each block are comprehensively analyzed to obtain a block light energy allocation plan;

[0037] Performing phase modulation calculation on the light intensity data of each block in the block light energy allocation scheme, performing spatial compensation in combination with the coordinate information in the management data, and obtaining an initial phase modulation pattern;

[0038] The initial phase modulation pattern is subjected to differentiated processing according to the material type of each block, wherein the differentiated processing includes compensating and calculating the reflectivity of the metal heat dissipation layer area and the absorption coefficient of the ferrite shielding area to obtain a compensated phase modulation scheme;

[0039] Generate a holographic interference pattern according to the compensated phase modulation scheme, locally optimize the light intensity distribution of the holographic interference pattern in combination with the correction coefficient in the management data, and obtain a final holographic exposure pattern;

[0040] The final holographic exposure pattern is subjected to time-sequential exposure processing according to the material interface characteristics of each block, and dynamic compensation is performed according to the real-time feedback signal of the quantum dot micro-mark to obtain the exposure result of each block.

[0041] Optionally, the acquiring of interface temperature and thermal stress distribution data of the multi-material composite PCB, applying electric field stimulation to the bionic self-repairing film according to the interface temperature and thermal stress distribution data, so that the bionic self-repairing film produces a stress release response, and obtaining an alignment calibration result includes:

[0042] Performing a multi-point array temperature scan on the interlayer interface of the multi-material composite PCB to obtain temperature distribution data of the interface of each layer;

[0043] Calculate the temperature gradient value of each layer interface according to the temperature distribution data, and obtain the interface thermal stress distribution data in combination with the thermal expansion coefficient of each layer material;

[0044] Performing regional threshold analysis on the interface thermal stress distribution data, determining key stress regions and key stress region distribution characteristics, and obtaining a stress distribution map;

[0045] Performing regional response planning on the bionic self-repairing membrane according to the stress distribution map, calculating the electric field intensity and action time required for each area, and obtaining an electric field stimulation parameter table;

[0046] Performing time-sequential electric field regulation on each response area of ​​the bionic self-repairing film according to the electric field stimulation parameter table, monitoring the displacement change of the nano-metal complex in the bionic self-repairing film, and obtaining stress release displacement data;

[0047] The stress release displacement data and the temperature distribution data are correlated and analyzed, and the deformation compensation amount of each area is calculated to obtain the alignment calibration result.

[0048] Optionally, performing asynchronous solidification processing on each block according to the alignment calibration result to obtain surface contour data after solidification, and performing selective topographic processing on a local area according to the surface contour data to obtain a flattening result, including:

[0049] According to the alignment calibration result, the key areas of the multi-material composite PCB are identified, and the curing priority levels are divided according to the regional stress characteristics to obtain an asynchronous curing partitioning scheme;

[0050] Performing a first sequence of curing treatment on the heat dissipation core area in the asynchronous curing partition scheme, obtaining the regional deformation amount and stress distribution value during the curing process, and obtaining the curing state data of the core area;

[0051] Calculating stress compensation parameters of the ferrite shielding area and the high dielectric area according to the core area solidification state data, and performing a second sequence solidification process according to the compensation parameters to obtain functional area solidification state data;

[0052] Taking the functional area curing state data as a reference, performing stress matching calculation and final curing treatment on the FR-4 area to obtain full board curing data;

[0053] Performing multi-point grid profile scanning on the whole plate curing data, recording the surface undulation and thickness distribution values, and obtaining surface profile feature data;

[0054] The positions and deviations of the concave and convex areas are determined according to the surface profile feature data, a trace amount of resin is filled into the concave area, and local grinding is performed on the convex area to obtain a flattening result.

[0055] Optionally, performing iterative correction calculation on each block according to the flattening result, the management data and the characteristic data to obtain correction parameters, verifying each block according to the correction parameters and multi-angle detection data to determine the final inter-layer alignment state, including:

[0056] Comparing and analyzing the flattening result with the coordinate information in the management data, and combining the interface type label in the feature data, to obtain the initial position deviation data of each block;

[0057] Performing hierarchical progressive iterative calculation on the initial position deviation data, and performing correction compensation in combination with the correction coefficient in the management data to obtain the first round of iterative correction data;

[0058] Analyzing the deviation trend of each block according to the first round of iterative correction data, optimizing and calculating the focus gain coefficient in the characteristic data, and obtaining the correction convergence parameter of each block;

[0059] Performing regional mapping analysis and compensation amount calculation on the correction convergence parameters to obtain final correction parameters;

[0060] According to the final calibration parameters, a UV-visible-infrared three-band scanning method is used to perform multi-angle detection on each block to obtain three-dimensional detection data;

[0061] The three-dimensional detection data is matched and verified with the interface type label in the feature data, the final inter-layer deviation value is calculated, and the final inter-layer alignment state is determined.

[0062] A second aspect of the present invention provides an exposure alignment device for a multi-layer PCB, the exposure alignment device for the multi-layer PCB comprising:

[0063] Multi-spectrum scanning module, used to perform multi-spectrum scanning on each layer of multi-material composite PCB to obtain feedback signals of each spectrum segment;

[0064] A resonance focusing processing module, used to perform resonance focusing processing on each layer interface according to the comparison result between the feedback signal and the preset characteristics of the material, and obtain characteristic data including focusing gain coefficient and interface type label;

[0065] A quantum dot mark construction module, used to divide the multi-material composite PCB into blocks according to the characteristic data, form quantum dot micro-marks at preset positions of each block, and establish management data including coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block;

[0066] A holographic exposure module, used to perform selective phase processing and holographic exposure on each block through spatial light modulation according to the characteristic data and the management data, so as to obtain an exposure result of each block;

[0067] A bionic self-repairing control module, wherein a bionic self-repairing film is disposed between the layers of the multi-material composite PCB; the bionic self-repairing control module is used to obtain the interface temperature and thermal stress distribution data of the multi-material composite PCB, and according to the interface temperature and thermal stress distribution data, apply an electric field stimulation to the bionic self-repairing film to make the bionic self-repairing film produce a stress release response, thereby obtaining an alignment calibration result;

[0068] An asynchronous curing processing module is used to perform asynchronous curing processing on each block according to the alignment calibration result, obtain surface contour data after curing, and perform selective topographic processing on the local area according to the surface contour data to obtain a flattening result;

[0069] The iterative correction verification module is used to perform iterative correction calculations on each block according to the flattening results, the management data and the feature data to obtain correction parameters, verify each block according to the correction parameters and multi-angle detection data, and determine the final inter-layer alignment state.

[0070] This application identifies the differences in optical properties and interface distribution of different media such as ferrites, metal heat sinks, and high dielectric layers from the source by performing multi-band optical scanning and resonant focusing on multi-material laminated structures. First, the feedback signal obtained by scanning is compared with the material property library, and the phase delay and resonance frequency of each interface are extracted, so as to achieve higher-precision positioning in the subsequent partition identification and quantum dot micro-marking layout. Since wavelength compensation and focusing gain can be performed for the reflection, absorption, and refraction characteristics of various materials, the final holographic exposure is no longer limited to a single optical means, thus avoiding overexposure or underexposure in metal or ferrite areas, greatly improving the alignment accuracy in complex thick layer board environments, and providing a stable positioning reference for subsequent processes.

[0071] After completing the quantum dot micro-marking and holographic exposure, deformation and stress accumulation are inevitable during multiple hot pressing and curing steps. This application uses a self-healing film that can apply an electric field and an asynchronous curing strategy to actively address these problems. During the heat treatment of high-layer boards, the differences in expansion coefficients of each layer and local stress often lead to interface warping. Through the displacement of metal complexes in the self-healing film, interlayer micro-correction can be actively performed according to the thermal stress monitoring data. Asynchronous curing allows the most critical heat dissipation core area to be finalized first, and then other areas are gradually cured to avoid severe deformation caused by one-time large-scale heat treatment. In addition, the topographic repair method can finely fill or grind the local concave and convex areas after curing to keep the overall surface in good fit. Combining multi-dimensional iterative correction with multi-angle detection, repeated comparison between the material feature data obtained in the early scan and the actual state produced by the later repair compensation can continuously improve the interlayer alignment effect and effectively solve the misalignment phenomenon caused by different medium combinations such as ferrite, metal and high dielectric layers and thermal cycle stress, thereby meeting the precision manufacturing requirements for high-thickness, multi-material printed circuit boards in the high-reliability field and further reducing the scrap rate of mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0073] Figure 1 A schematic diagram of an embodiment of an exposure alignment method for a multi-layer PCB in an embodiment of the present invention;

[0074] Figure 2 Schematic diagram of an embodiment of an exposure alignment device for a multi-layer PCB in an embodiment of the present invention.

[0075] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0076] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0077] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0078] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, which must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0079] An embodiment of the present application provides an exposure alignment method for a multi-layer PCB. Figure 1 A flow chart of an exposure alignment method for a multi-layer PCB provided in an embodiment of the present application. In this embodiment, the method includes:

[0080] See also Figure 1 , perform multi-spectrum scanning on each layer of the multi-material composite PCB to obtain feedback signals of each spectrum segment;

[0081] In one embodiment of the present invention, the multi-spectrum scanning of each layer of the multi-material composite PCB to obtain feedback signals of each spectrum segment includes: performing ultraviolet light scanning of the ferrite layer and the metal heat dissipation layer in the multi-material composite PCB in a first frequency band to obtain material absorption coefficient data of the first frequency band; determining the scanning energy threshold of each layer according to the material absorption coefficient data of the first frequency band, performing a visible light frequency band pre-scan on each layer of the multi-material composite PCB to obtain initial optical characteristic data of the interface of each layer; selecting the optimal scanning angle according to the initial optical characteristic data, performing a near-infrared band scanning on the metal heat dissipation layer of the multi-material composite PCB to obtain metal layer thickness distribution data; performing a terahertz band scanning on the ferrite layer of the multi-material composite PCB according to the metal layer thickness distribution data and the initial optical characteristic data to obtain ferrite layer depth distribution data; performing a stacking analysis on the metal layer thickness distribution data and the ferrite layer depth distribution data to obtain a layer interface characteristic map; performing multi-angle reflectivity measurement on the multi-material composite PCB according to the layer interface characteristic map to obtain feedback signals of each spectrum segment.

[0082] Specifically, when performing ultraviolet light scanning of the first frequency band on the ferrite layer and the metal heat dissipation layer in the multi-material composite PCB, it is necessary to arrange an ultraviolet light source and a detector on the scanning platform, and set the wavelength and energy range of the ultraviolet light to be suitable for the surfaces of the two materials, the ferrite and the metal heat dissipation layer. During the scanning process, the ultraviolet light is irradiated to the surface of the multi-material composite PCB at a fixed angle and power. The detector calculates the energy attenuation value of these materials in the ultraviolet band based on the transmitted or reflected light intensity, and then obtains the absorption coefficient value of the ferrite and metal heat dissipation layer in this band. If it is found in this process that the attenuation value of the ferrite layer area and the metal heat dissipation layer area is significantly different, the incident light energy and exposure time of the visible light, near-infrared and terahertz bands can be adjusted in a targeted manner in the subsequent steps to avoid excessive reflection or underexposure during subsequent scanning.

[0083] When determining the visible light scanning energy threshold of each layer, the absorption coefficient values ​​obtained in the UV scanning stage need to be input into a processing process for parameter mapping. This processing process can convert the UV absorption coefficient into a series of values ​​of visible light intensity and exposure time according to the absorption law of the material in different bands. Specifically, the UV band attenuation curve can be cross-compared with the spectral response characteristics of the target material in the visible light band, and then interpolation or fitting technology can be used to output the optimal power, exposure time and incident angle that meet the needs of visible light scanning. When using these values ​​to perform visible light pre-scanning on each layer of the multi-material composite PCB, the optical detection device will record the basic reflectivity distribution, surface texture and possible high reflection or high absorption areas at the interface of each layer. If the ferrite layer shows an extremely high absorption coefficient in the UV scan, the local light source output will be increased after referring to the results of the above process during the visible light scan to ensure that the ferrite area obtains sufficient light intensity and avoids underexposure, so as to accurately obtain the initial optical characteristic data.

[0084] After obtaining the initial optical characteristic data of the visible light pre-scan, it is necessary to select the optimal scanning angle according to the reflection distribution of the metal heat dissipation layer, so as to perform a higher-precision scan of the metal heat dissipation layer in the near-infrared band. If the specular reflection of certain heat dissipation areas is found to be very strong in the visible light pre-scan results, the incident angle can be adjusted or the output power of the near-infrared light source can be appropriately adjusted for these areas to reduce optical saturation or ghosting. In this way, the near-infrared band can clearly distinguish the thickness gradient and boundary contour of the metal layer. For example, if a metal gradient layer from thick to thin appears in the central heat dissipation area of ​​a circuit board, the angle most likely to cause excessive reflection can be confirmed based on the visible light pre-scan, and then the angle can be corrected and the local power can be reduced during the near-infrared scan, and finally a more accurate metal thickness distribution data can be obtained.

[0085] While obtaining the thickness distribution of the metal layer, the ferrite layer can also be scanned in the terahertz band in combination with the initial optical property information output in the visible light scanning stage, in order to extract the depth distribution data of the ferrite layer. Since the response of ferrite to the terahertz band may include various types of absorption and phase changes, after considering the thickness information of this layer and the metal layer together, the ferrite area can be scanned in the terahertz detection process. For circuit boards with multiple layers of ferrite sheets stacked, the terahertz signal can produce different transmission or reflection responses at the interface between each ferrite and the adjacent layer, and then the specific distribution of the ferrite layer in the depth direction can be obtained through time domain or frequency domain processing. If the relative position of the metal layer is known during the pre-scan, the metal heat sink can be prevented from excessively blocking the terahertz signal, and the detection focus of the terahertz band can be placed on the ferrite material itself, so as to realize the layered visualization of the superposition area of ​​ferrite layers.

[0086] After combining the metal layer thickness distribution data with the ferrite layer depth distribution data, a layer-to-layer interface feature map can be generated through stacking analysis. This map is a comprehensive description formed by aligning the detection results of each band in the coordinate system and performing fusion calculations. If there are complex areas where the metal and ferrite interface is in the board, the map will show obvious signs of the interlayer transition zone or irregular interface, providing a target reference for subsequent exposure alignment or partitioning processing. If a certain area is detected where the ferrite and metal heat dissipation layers are closely stacked or even partially overlapped, the data in the map will show the corresponding attenuation and thickness differences, so that subsequent processes can adopt differentiated exposure intensities or compensation measures in a targeted manner to reduce the risk of misalignment caused by medium aliasing.

[0087] After obtaining the interlayer interface feature map, the feedback signals of each spectrum band can be obtained by multi-angle reflectivity measurement, which can further verify whether there are blind spots or details that are difficult to accurately identify in the previous band scans. The measurement process gradually changes the inclination of the light source and detector at the key positions of the metal heat dissipation layer or ferrite layer indicated in the map, and then records the reflection intensity and spectral characteristics at different angles. If some places have no obvious features in the ultraviolet or near-infrared scan, but expose high-intensity reflection or absorption differences at a certain angle, multi-angle measurement can incorporate this part of information into the final data set, thereby making the description of the interlayer interface characteristics more complete. For those printed circuit boards with a large number of layers and a variety of material types, multi-angle and multi-band measurements and data fusion of different scanning modes in the previous steps will provide comprehensive reference information in the final alignment and subsequent processes, and reduce positioning misalignment caused by medium reflection differences, thickness changes or too many superimposed layers. In this way, when facing the coexistence of ferrites, metal heat sinks and other complex structures, all scanning and measurement links can build a detailed multi-band material database, making energy distribution, thermal stress management and layer alignment during exposure more accurate.

[0088] Please continue reading Figure 1 , according to the comparison result between the feedback signal and the preset characteristics of the material, resonant focusing processing is performed on the interfaces of each layer to obtain characteristic data including focusing gain coefficient and interface type label;

[0089] In one embodiment of the present invention, the comparison result between the feedback signal and the preset material characteristics is used to perform resonance focusing processing on each layer of interface to obtain characteristic data including a focusing gain coefficient and an interface type label, including: matching and comparing the feedback signal with the standard spectral data in the preset material characteristic library to obtain initial characteristic deviation data of each layer of material; performing wavelength compensation processing on the feedback signal according to the initial characteristic deviation data to obtain corrected spectral data of each spectrum band; classifying and analyzing the corrected spectral data according to the material interface type to obtain a spectral response characteristic diagram of each type of interface; calculating the phase delay and resonance frequency range of each layer of interface according to the spectral response characteristic diagram to obtain interface resonance characteristic data; inputting the interface resonance characteristic data into a resonance focusing control system to perform resonance frequency scanning on each layer of interface to obtain interface resonance state parameters; adjusting the focusing parameters of each layer of interface according to the interface resonance state parameters, performing resonance gain processing to obtain a resonance focusing gain coefficient; fusing the resonance focusing gain coefficient with the spectral response characteristic diagram to obtain characteristic data including a focusing gain coefficient and an interface type label.

[0090] Specifically, when matching and comparing the feedback signal with the standard spectral data in the preset material characteristic library, it is necessary to call a set of spectral similarity calculation and deviation analysis functions in the data processing module. To achieve this function, the standard spectral data can be pre-stored in the form of discrete coordinates (frequency-intensity or wavelength-intensity pairs), and then the feedback signal obtained by the actual scan is resampled or interpolated at the same coordinate point. By calculating the difference, ratio or cosine similarity between the two at each frequency point, a deviation matrix reflecting the degree of difference between the two is output. If the feedback signal of the ferrite layer in a certain frequency range is 10% lower than the standard spectrum, this specific value will be recorded in the corresponding coordinates in the deviation matrix. This can intuitively show the degree to which each layer of material deviates from the theoretical spectrum in multiple frequency bands, thereby forming the initial characteristic deviation data of each layer of material.

[0091] When the feedback signal is wavelength compensated according to the initial characteristic deviation data, it is necessary to increase or decrease the amplitude or baseline correction of the relevant frequency band with the help of the material correction function. This process first reads the difference value of each band in the deviation matrix, and then performs amplitude gain or attenuation according to the known response model of the material in this band. If the ferrite layer is obviously underexposed in a specific band, the band is amplified; if the metal heat dissipation layer is over-reflected in another band, attenuation or truncation is performed. The compensated spectral curve is called the corrected spectral data, which can be closer to the theoretical value and provide a more reliable benchmark for subsequent analysis.

[0092] After obtaining the corrected spectral data, it can be classified and analyzed according to the material interface type, so as to aggregate the data of the same interface and generate a spectral response characteristic diagram. This classification step requires that different material partitions, coordinates or numbers be registered into the system in the early scanning or marking stage. Based on this, the program will extract the data of the metal heat dissipation layer, ferrite layer or other interface areas respectively, and draw the absorption peaks, reflection peaks, etc. of each band. If an interface is composed of a superposition of metal and ferrite, a combined curve of the characteristics of the two materials will appear on the graph. Through this classification analysis, the spectral characteristics of each type of interface can be clearly distinguished, laying the foundation for the subsequent calculation of the phase delay and the resonant frequency range.

[0093] When calculating the phase delay and resonant frequency range of each layer interface, the data processing module needs to use the phase and frequency transformation model to transform and analyze the spectral response characteristic diagram in the frequency domain or time domain. Short-time Fourier transform or discrete wavelet transform can be used in this model to map the corrected spectral signal to a two-dimensional coordinate system containing amplitude and phase. If the metal heat sink and ferrite area show obvious coupling peaks in a certain frequency range, the model will show high energy concentration at the corresponding position with a certain phase shift. The system calculates the main resonant frequency and the phase delay of the interface at this frequency by reading these peak coordinates, and then forms the interface resonance characteristic data. For areas with multiple resonance characteristics, the data table will record the specific frequency and phase information of each resonance point.

[0094] When the interface resonance characteristic data is input into the resonance focusing control system, a segmented resonance frequency scan will be triggered. At this time, the tunable light source or phase modulation unit will perform a more detailed scan near the calculated resonance frequency and record the phase and energy changes of the material at each frequency. If significant coupling occurs at a certain point, it means that this interface is extremely sensitive to this frequency, and the system will mark the phase shift and energy gain value corresponding to this frequency as "resonance state parameters". If multiple resonance peaks are found on the same interface, their respective resonance state parameters will be recorded in turn to facilitate more comprehensive energy compensation or distribution during subsequent focusing.

[0095] When the focusing parameters of each layer interface are adjusted according to the interface resonance state parameters, the system can perform targeted gain or attenuation on different frequencies and phases to achieve resonant gain processing. If the metal heat sink area produces extremely strong reflection at a certain frequency, the beam power can be enhanced or the phase can be changed in this frequency band to offset the reflection loss and focus the effective energy to the interface position that needs to be processed. This can provide sufficient light energy or electromagnetic energy for those sections that are easily distorted or easily absorbed during subsequent exposure, heat treatment or other processing, avoiding interlayer misalignment or uneven exposure. After completing the gain calculation, the system will obtain a list of resonant focusing gain coefficients, which records the gain requirements of different interfaces at different frequencies.

[0096] When the resonant focusing gain coefficient and the spectral response characteristic diagram are fused, the data processing module will combine the material type, phase delay, main resonant frequency and gain coefficient corresponding to each interface into a set of comprehensive labels. If high gain processing is required in the transition zone between ferrite and metal, the interface type, gain multiple, target frequency and other information will be indicated in the label. This labeled data can be used for step-by-step processing and can also be traced back in the inspection stage of the final product. If a subsequent step requires deep processing of the ferrite layer, the gain coefficient and phase characteristics recorded in the label can be directly retrieved to provide additional energy or phase compensation in the corresponding band. Through this set of matching comparison, wavelength compensation, classification analysis, phase and frequency conversion model calculation, resonant scanning and gain processing and other continuous steps, a control mechanism that runs through the entire process from scanning to exposure can be constructed, so that multi-material composite PCBs can maintain stable and predictable optical and electromagnetic response characteristics at different interlayer interfaces, thereby meeting the manufacturing requirements of high-precision, high-density and multi-functional stacking.

[0097] Please continue reading Figure 1 , dividing the multi-material composite PCB into blocks according to the characteristic data, forming quantum dot micro-marks at preset positions of each block, and establishing management data including coordinate information, luminous characteristics and correction coefficients of the micro-marks of each block;

[0098] In one embodiment of the present invention, the multi-material composite PCB is divided into blocks according to the characteristic data, quantum dot micro-marks are formed at preset positions of each block, and management data containing coordinate information, luminous characteristics and correction coefficients of the micro-marks of each block are established, including: material partitioning and boundary optimization processing of the multi-material composite PCB is performed according to the interface type label and focusing gain coefficient in the characteristic data to obtain block boundary correction data; the block boundary correction data is divided into a heat dissipation core area, a ferrite shielding area, a high dielectric area and an FR-4 area, and each area is gridded to generate a layout position coordinate table of quantum dot micro-marks; according to the layout position coordinate table and the line layout Based on the comparison results of local data, the avoidance of vias and wiring areas is determined to obtain the optimized layout plan of quantum dot micro-marks, and the quantum dot markers are deposited according to the optimized layout plan to obtain the quantum dot marker arrays of each block; multi-wavelength excitation and intensity attenuation tests are performed on the quantum dot marker arrays to obtain the luminescence wavelength, intensity curve and attenuation coefficient, and the luminescence characteristic data of the quantum dots in each block are obtained; the quantum dot marker arrays are multi-dimensionally associated with the luminescence characteristic data to obtain the marker mapping relationship table of each block, the spectral correction coefficient corresponding to the material interface is calculated according to the marker mapping relationship table, and management data including the coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block are established.

[0099] Specifically, when performing material partitioning and boundary optimization processing on a multi-material composite PCB according to the interface type label and focus gain coefficient in the feature data, it is necessary to first load the feature data generated in the previous step into the data processing environment, and identify the material combination and main optical or electromagnetic response characteristics of each interface according to the interface type label. In this process, a boundary optimization algorithm is used to compare the interface labels and focus gain coefficients of adjacent pixels or grids. If the label distribution in a certain area tends to be consistent and the gain coefficient difference is not large, the area is classified as the same material block. If the label changes significantly at the edge and the gain coefficient difference is large, the demarcation point is recorded here and a corrected block outline is generated. If it is detected that ferrite and metal heat sinks overlap frequently or there is a high dielectric material surrounding the metal layer in the same area, the algorithm will generate more detailed boundary nodes in these complex areas so that the part can be processed more flexibly in subsequent steps. The process outputs a list of block boundary correction data, which contains the geometric edges, interface type identification and focus gain coefficient distribution of each block in the plane coordinate system.

[0100] In the process of dividing the block boundary correction data into the heat dissipation core area, ferrite shielding area, high dielectric area and FR-4 area, the program will classify the parts with high reflectivity or high thermal conductivity characteristics of the metal heat dissipation layer into the heat dissipation core area according to the material properties and interface labels, concentrate the layers or shielding components with detected ferrite interface labels into the ferrite shielding area, mark the layers or dielectric segments with high dielectric constants as high dielectric areas, and divide the remaining large areas of ordinary dielectrics into the FR-4 area. Then, gridding is performed for each area. The specific method is to divide the two-dimensional plane into grid units of a certain density inside it, so that the subsequent layout position of the quantum dot micro-marker can accurately correspond to the grid nodes in the coordinate system. If an arc or special-shaped heat dissipation area is encountered, the gridding algorithm will use a smaller step size to adapt to the curve contour, and strive to make the coordinate data more refined without destroying the overall partition. This step finally generates a layout position coordinate table of the quantum dot micro-marker, and each grid node is marked with the block ID and plane coordinate information.

[0101] The process of determining the avoidance of vias and routing areas based on the comparison results of the layout position coordinate table and the line layout data requires comparing the via distribution and routing positions in the circuit design file with the table one by one. If a grid node falls on a critical signal routing line or near the center of a via, the system will mark the node as an area where micro-marks should not be placed, and indicate the reason in the record. For those grid points that are too close to the signal line or are easily affected by mechanical drilling, they will also be adjusted or replaced in the layout plan to ensure that the micro-marks will not be damaged during the subsequent manufacturing process. After obtaining the optimized layout plan of the quantum dot micro-markers through this comparison process, it is necessary to deposit the quantum dot markers at the corresponding positions. Specifically, screen printing or inkjet technology can be used to make the quantum dot material evenly attached to the specified grid coordinates. If the marking density needs to be increased in the heat dissipation core area, the system will allocate more deposition distribution points on the grid in this area. After completion, the quantum dot marking array is formed in each block to form a relatively complete marking network.

[0102] When performing multi-wavelength excitation and intensity attenuation tests on quantum dot marker arrays, a tunable light source and a matching optical detector can be used to switch the light source band to the preset ultraviolet, visible, near-infrared and other frequency bands in turn, and measure the peak wavelength of the quantum dots under excitation in each band and the light intensity attenuation curve. When collecting data, the system needs to record the peak position of the quantum dot emission at each grid node and its attenuation trend over time or wavelength, so as to obtain the luminescence characteristic data of the quantum dots in each block. If the quantum dots in the ferrite shielding area decay faster in a specific band, the luminescence intensity will show a significant decrease in the corresponding record. If the heat dissipation core area causes an increase in attenuation due to high temperature, it will also be reflected in the luminescence intensity curve. In this way, the tolerance and response differences of quantum dot markers in different areas can be accurately evaluated.

[0103] When the quantum dot marker array is multi-dimensionally associated with the luminescence characteristic data, it is necessary to retrieve the coordinate information of each block grid point, as well as the corresponding quantum dot luminescence intensity curve, attenuation coefficient, excitation wavelength peak and other parameters, and then pair these data within the system and write them into the marker mapping table. If it is detected that some blocks have higher attenuation coefficients in high temperature or high reflection areas, the system will store additional correction coefficients in the mapping table so that the blocks can be specially treated in the future exposure process. Finally, the spectral correction coefficient corresponding to the material interface is calculated according to the marker mapping table, and the quantum dot attenuation data is comprehensively calculated with the previous interface type label, focusing gain coefficient and other information. If a ferrite shielding area is detected to require stronger compensation in the previous step, the correction coefficient can be used to concentrate or increase the subsequent exposure energy in this block. For each block of micro-marking, management data entries of coordinate information, luminescence characteristics and correction coefficients must be established. When output, a management data table is formed, which includes all the regional partition information and quantum dot distribution characteristics, and is used for subsequent alignment control, exposure energy scheduling and production inspection. Through these steps, the marking distribution and optical response differences of the heat dissipation core area, ferrite shielding area, high dielectric area and FR-4 area are fully and finely managed, thus providing more stable and complete support for the high-precision manufacturing of multi-material composite PCBs.

[0104] Please continue reading Figure 1 , according to the characteristic data and the management data, selectively phase-process each block through spatial light modulation and perform holographic exposure to obtain an exposure result of each block;

[0105] In one embodiment of the present invention, the selective phase processing of each block and holographic exposure are performed through spatial light modulation according to the characteristic data and the management data to obtain the exposure result of each block, including: according to the interface type label in the characteristic data and the luminous characteristics in the management data, the optical characteristics of each block are comprehensively analyzed to obtain the block light energy distribution plan; the light intensity data of each block in the block light energy distribution plan is phase modulated and spatially compensated in combination with the coordinate information in the management data to obtain the initial phase modulation pattern; the initial phase modulation pattern is converted into the phase modulation pattern according to each block The method comprises the steps of: performing differentiated processing on the material type of the material, wherein the differentiated processing comprises compensating and calculating the reflectivity of the metal heat dissipation layer area and the absorption coefficient of the ferrite shielding area to obtain a compensated phase modulation scheme; generating a holographic interference pattern according to the compensated phase modulation scheme, locally optimizing the light intensity distribution of the holographic interference pattern in combination with the correction coefficient in the management data to obtain a final holographic exposure pattern; performing time-sequential exposure processing on the final holographic exposure pattern according to the material interface characteristics of each block, and performing dynamic compensation according to the real-time feedback signal of the quantum dot micro-mark to obtain an exposure result of each block.

[0106] Specifically, when the optical characteristics of each block are comprehensively analyzed according to the interface type label in the characteristic data and the luminescence characteristics in the management data, it is necessary to read the material category, quantum dot marker luminescence curve, focusing gain and other preliminary calculation results of each block one by one in a data processing environment. The data processing environment will combine the interface type label with the peak wavelength, attenuation coefficient and local light intensity contrast contained in the luminescence characteristics to determine how much light energy should be allocated in the block to avoid overexposure of the material area and maintain sufficient energy coverage at high absorption or high reflection positions. If the metal reflectivity of a heat dissipation core area is determined to be high in the previous step, the data processing environment will appropriately increase the beam energy in the calculation of the light energy allocation plan to ensure that it has stronger penetration or anti-reflection ability during subsequent exposure. If a ferrite shielding area shows obvious absorption characteristics in the preliminary test, the area will be marked as a "high absorption area" during the calculation, and the system will further increase the light energy budget of this part in the final allocation to ensure that subsequent exposure will not be significantly underexposed due to energy loss. These operations ultimately form a block light energy distribution plan, where each block has one or more values ​​that represent the distribution ratio of the light source power or exposure time within the block.

[0107] When performing phase modulation calculation on the light intensity data of each block in the block light energy distribution scheme, it is necessary to input the light energy distribution parameters of each block into the phase modulation engine, and combine the coordinate information in the management data to perform more accurate spatial compensation for the light field distribution. This process can be performed by a module that has implemented optical simulation and coordinate mapping, converting the energy output value of each block into a corresponding phase vector, and then generating an initial phase modulation pattern in the spatial coordinate system. For example, if the heat dissipation core area is given a higher intensity weight in the light energy distribution scheme, the phase modulation pattern will show a higher phase amplitude in the coordinate area of ​​the heat dissipation core area, indicating that the energy distribution of the light beam here is larger. If a ferrite shielding area is judged to have a significantly increased absorption coefficient, the phase modulation pattern will also show a moderate phase increment in this area to ensure that the exposure energy can smoothly reach the deep layer of the material. The initial phase modulation pattern obtained in this way is a distribution function generated purely based on light intensity and coordinate position, and the further influence of metal and ferrite on light reflection and absorption needs to be considered later.

[0108] When the initial phase modulation pattern is differentiated according to the material type of each block, it is necessary to first distinguish the metal heat sink layer area and the ferrite shielding area, and then compensate for their reflectivity and absorption coefficients respectively, and obtain the compensated phase modulation scheme. If the reflectivity of the metal heat sink layer area is calibrated as high in early tests, the compensation algorithm will add local phase enhancement to this area in the initial phase modulation pattern or make a certain degree of correction to the beam angle, striving to maintain sufficient effective light intensity in a highly reflective environment. If the ferrite shielding area shows deep absorption or large attenuation in the previous analysis, the system will perform a larger phase gain on this area to offset this part of the absorption loss in subsequent exposures, so that the overall effect tends to be balanced. For example, if the compensation calculation of the ferrite shielding area of ​​a server motherboard finds that the segment needs to increase the phase amplitude by an additional five to ten percentage points, this information will be recorded in the compensated phase modulation scheme, and the area will obtain a higher energy flux in the final synthesized light field.

[0109] When generating a holographic interference pattern according to the compensated phase modulation scheme, it is necessary to call the holographic calculation module to simulate or iterate the interference distribution of the light field so that the light field presents the expected interference fringes and energy distribution on the two-dimensional plane. At this time, the light intensity distribution of the holographic interference pattern can be locally optimized with reference to the correction coefficient in the management data, that is, to increase or decrease the interference diffraction characteristics in those blocks that have been established as high attenuation or high reflection, so that the final output light field distribution is more consistent with the material properties of each block. If a specific diffraction direction is required in a high dielectric region to suppress lateral energy overflow, the interference phase of the region can be additionally corrected in the local optimization step to make the output pattern present a stronger focus convergence. The final holographic exposure pattern obtained in this process is a two-dimensional distribution file containing intensity and phase information, which is strictly corresponding to the coordinate system of the optical machine, and retains the corresponding gain or attenuation characteristic value at each block.

[0110] When the holographic exposure pattern is subjected to time-sequential exposure processing according to the material interface characteristics of each block, it is necessary to implement one or more exposure actions on the actual machine, and apply light to different blocks at different time periods according to the interference pattern and light energy distribution obtained previously. If the heat dissipation core area has large fluctuations in temperature or reflection characteristics, it can be exposed first or separately to avoid interference with other blocks. If a ferrite shielding area needs to be exposed more deeply in multiple times to overcome the excessive absorption of the light beam by the material, multiple rounds of energy superposition can also be arranged in the time-sequential control to allow the area to rest slightly after completing the first round of exposure, and then accept the second or third round of compensation exposure. In addition, when dynamic compensation is performed based on the real-time feedback signal of the quantum dot micro-marker, an optical detection module can be equipped on the exposure machine to quickly sample the excitation intensity or attenuation curve of the quantum dot mark in different bands. If insufficient or excessive light is detected in a certain area, the software will be triggered to modify the exposure time or light source intensity of the block in real time to achieve precise closed-loop control. If a ferrite shielding area has a high attenuation value after the first round of exposure, the system will increase the exposure power of this block or extend the illumination time in the second round, so that the graphics and trace positions in the final exposure result are more reliable. In this way, the exposure results of each block can better match the originally designed line shape and via size, reducing the alignment deviation or local underexposure caused by material differences. Combining the above series of processes, multi-material composite PCBs can simultaneously obtain appropriate and graded exposure energy in multiple areas such as highly reflective metal heat dissipation layers, deeply absorbed ferrite layers, and ordinary dielectric materials. The overall pattern quality presented in the end can also meet the needs of highly complex circuit and device layout.

[0111] Please continue reading Figure 1 , a bionic self-repairing film is arranged between the layers of the multi-material composite PCB; the interface temperature and thermal stress distribution data of the multi-material composite PCB are obtained, and according to the interface temperature and thermal stress distribution data, an electric field stimulation is applied to the bionic self-repairing film to make the bionic self-repairing film produce a stress release response, and obtain an alignment calibration result;

[0112] In one embodiment of the present invention, the interface temperature and thermal stress distribution data of the multi-material composite PCB are obtained, and according to the interface temperature and thermal stress distribution data, an electric field stimulation is applied to the bionic self-repairing film to make the bionic self-repairing film produce a stress release response, and the alignment calibration result is obtained, including: performing a multi-point array temperature scan on the interlayer interface of the multi-material composite PCB to obtain the temperature distribution data of the interface of each layer; calculating the temperature gradient value of each layer interface according to the temperature distribution data, and combining the thermal expansion coefficient of each layer material to obtain the interface thermal stress distribution data; partitioning the interface thermal stress distribution data The method comprises the following steps: performing domain threshold analysis, determining key stress areas and key stress area distribution characteristics, and obtaining a stress distribution map; performing regional response planning for the bionic self-repairing membrane according to the stress distribution map, calculating the electric field strength and action time required for each area, and obtaining an electric field stimulation parameter table; performing time-sequential electric field regulation on each response area of ​​the bionic self-repairing membrane according to the electric field stimulation parameter table, monitoring the displacement changes of the nano-metal complex in the bionic self-repairing membrane, and obtaining stress release displacement data; performing correlation analysis on the stress release displacement data and the temperature distribution data, calculating the deformation compensation amount of each area, and obtaining a registration calibration result.

[0113] Specifically, when performing a multi-point array temperature scan on the interlayer interface of a multi-material composite PCB, it is necessary to arrange multiple pairs of temperature sensors or infrared probes on a set of temperature acquisition devices or infrared detector platforms at array positions that can cover the entire board surface. The array deployment will select several sampling points for each interlayer interface to ensure that each sampling point can record the actual temperature value in time during the heating process of the board, and store these temperature values ​​in the data processing module. Some high-thickness printed circuit boards contain ferrite interlayers, metal heat sinks, and high dielectric materials. These areas will show different heating rates when heated. In order to make the acquisition results accurately reflect the actual temperature distribution of each interface, the temperature scanning process will control the temperature of the heat source or heating platform in a regional manner, and turn on or maintain a constant temperature state in different time periods to observe the behavior of each interface with temperature changes. If the temperature of a metal sheet in a heat dissipation core area rises rapidly after heating, while the temperature rise of the surrounding FR-4 area is relatively mild, the data processing module will mark the high-temperature concentration area in the temperature distribution diagram to prompt the subsequent stress analysis to pay attention to its impact on interlayer alignment.

[0114] When calculating the temperature gradient values ​​of each layer interface based on these temperature distribution data, it is necessary to calculate the temperature difference of adjacent measuring points on the same layer or the same interface, and record the temperature difference of adjacent grid units in the coordinate system. If a ferrite shielding area is adjacent to a metal heat dissipation area, due to the different thermal conductivity and specific heat capacity of the two, the temperature difference at the junction of the areas will be relatively obvious. By recording the difference, the temperature gradient formed above and below the interface can be obtained. The data processing module will combine these gradient values ​​with the thermal expansion coefficient registered in the material list to calculate the interface thermal stress distribution data. If the thermal expansion coefficient of the ferrite layer is significantly smaller than that of the metal heat dissipation layer and the temperature gradient is high, the combined area will show a large stress concentration value in the thermal stress distribution diagram. At this time, the system will mark such areas as "high stress areas" and write them into a list of stress calculation results, indicating that these areas are at risk of local deformation or local warping during the actual heating or cooling cycle.

[0115] When performing regional threshold analysis on the interface thermal stress distribution data, the data processing module sets several stress threshold intervals for each interface or partition, such as low stress, medium stress, and high stress. The value of each measuring point is then compared with these intervals. If the value exceeds the highest threshold, the surrounding area where the measuring point is located is marked as a critical stress area, and its stress magnitude and distribution range are additionally recorded. If a heat dissipation core area has multiple high-stress grids after measurement, the system will include these grids in the critical stress area and attach key information to the output file, such as the relative position to the edge of the ferrite interlayer or the distance to the via, to provide coordinate references for the subsequent regulation of the bionic self-healing membrane. Such an analysis summarizes the thermal stress conditions of all measuring points into a stress distribution map, which can intuitively show which areas have exceeded the upper limit of the safe stress and which areas are still at a relatively stable stress level.

[0116] When planning the regional response of the bionic self-repairing film according to the stress distribution map, it is necessary to retrieve the coordinate information of these key stress areas and the coverage of the bionic self-repairing film pasted or pressed at the corresponding position, and then determine the electric field strength and action time required for each area through a set of electric field stimulation parameter calculation modules. The bionic self-repairing film is composed of a polymer substrate with deformation characteristics and nano-metal complexes dispersed therein. These metal complexes will undergo reversible displacement or structural rearrangement under certain electric field conditions, thereby applying a slight pulling force or thrust to the film attachment area. If a ferrite area overlaps with the metal heat dissipation layer and shows high stress, the electric field stimulation parameter table will match the area with a higher electric field strength or a longer power-on time, so that the internal complex of the membrane will produce a larger displacement, hoping to offset the interlayer dislocation caused by thermal stress. If a high dielectric region has a small temperature change but a high stress concentration, different electric field strengths and timings will also be obtained to ensure that the electric field action in this area can more accurately match the calculated stress level.

[0117] When the response areas of the bionic self-repairing membrane are controlled in time sequence according to the electric field stimulation parameter table, it is necessary to apply different electric fields to the membranes in different areas within a fixed time period or temperature range. If the parameter corresponding to the metal heat dissipation core area is "high electric field intensity and short action time", the system will first apply a high-intensity electric field pulse to this block within the time interval, allowing the nanometal complex to move quickly and try to maintain a good fit between this area and the surrounding materials. If the parameter corresponding to the ferrite shielding area is "medium electric field intensity and longer action time", the system will maintain a relatively stable medium-intensity electric field during this time period and continue to monitor changes in the membrane area. During the monitoring process, a set of high-resolution displacement sensors or interferometric measurement methods will be used to observe the microscopic displacement of the membrane surface or nanometal complex, and the obtained numbers will be recorded as stress release displacement data and updated in the detection table one by one. If a block has reached the expected value in a short time, the electric field module will automatically reduce the stimulation intensity of the block, allowing other key areas to take over new control actions.

[0118] When correlating the stress release displacement data with the previously obtained temperature distribution data, it is necessary to match the coordinates of each area separately to check how many micrometers or nanometers of deformation changes these areas have experienced before and after the electric field is applied, and compare them with their original thermal stress values. If the displacement of the nanocomplex inside the membrane in a heat dissipation core area increases significantly after a high electric field is applied, and at the same time, the temperature there is high but the surface deformation tends to decrease, the system will determine that the key stress area has been effectively repaired. On the other hand, if it is found that the deformation of a high dielectric region has not decreased below the threshold after the electric field is applied, the system will list it as a candidate area for repeated regulation, and the electric field can be applied again in the subsequent cooling or heating stage for fine-tuning. Through the comprehensive comparison of these stress release displacement data and temperature distribution data, an interlayer correction algorithm can be used to calculate the compensation amount of deformation in each area, thereby obtaining the alignment calibration result. If the misalignment of the heat dissipation core area near the metal layer or ferrite layer has been largely compensated by the stretching or rebounding action of the film, the system will register the value as "basically completed repair", and if there is still residual deformation in some areas, it can also prompt in the alignment calibration results that subsequent processes or secondary film control methods are needed for further correction. After this process, the interlayer deformation caused by high temperature or repeated thermal cycles of multi-material composite PCBs can be actively relieved and corrected, making the overall alignment accuracy more reliable.

[0119] Please continue reading Figure 1 , performing asynchronous solidification processing on each block according to the alignment calibration result, obtaining surface contour data after solidification, and performing selective topographic processing on the local area according to the surface contour data to obtain a flattening result;

[0120] In one embodiment of the present invention, the asynchronous curing process is performed on each block according to the alignment calibration result, the surface contour data after curing is obtained, and the local area is selectively topographically processed according to the surface contour data to obtain a flattening result, including: identifying key areas of the multi-material composite PCB according to the alignment calibration result, dividing the curing priority levels according to the regional force characteristics, and obtaining an asynchronous curing partition scheme; performing a first sequence curing process on the heat dissipation core area in the asynchronous curing partition scheme, obtaining the regional deformation amount and stress distribution value during the curing process, and obtaining the core area curing state data; and curing the core area according to the core area. The stress compensation parameters of the ferrite shielding area and the high dielectric area are calculated based on the curing state data, and a second sequence curing treatment is performed according to the compensation parameters to obtain the curing state data of the functional area; the curing state data of the functional area is used as a reference to perform stress matching calculation and final curing treatment on the FR-4 area to obtain the curing data of the whole board; a multi-point grid profile scan is performed on the curing data of the whole board, and the surface undulation and thickness distribution values ​​are recorded to obtain the surface profile feature data; the position and deviation of the concave area and the convex area are determined according to the surface profile feature data, the concave area is filled with a trace amount of resin, and the convex area is locally ground to obtain the flattening result.

[0121] Specifically, when identifying the key areas of a multi-material composite PCB based on the alignment calibration results, it is necessary to retrieve the stress data, thermal expansion coefficient, and previous micro-deformation compensation of each partition or grid unit in the data analysis module, and select those parts with high stress concentration and deformation or significant differences in material properties after comprehensive comparison as priority processing objects. In this process, the relevant information and force characteristics of the heat dissipation core area, ferrite shielding area, high dielectric area, and FR-4 area will be included in the calculation scope, and the curing priority level will be divided according to the regional force characteristics, so as to obtain an asynchronous curing partitioning scheme. If the heat dissipation core area shows excessive deformation risk in an environment close to the heat source or with high load, it will be divided into the first sequence curing treatment list, while the ferrite shielding area and the high dielectric area will be placed in the subsequent sequence so that the additional stress or deformation of the remaining areas can be evaluated after the first sequence curing is completed. The asynchronous curing partitioning scheme generated in this way sorts the areas according to different processing orders, and registers the address and reference temperature range of each area in the task list of the curing equipment.

[0122] When the first sequence of curing is performed on the heat dissipation core area in the asynchronous curing partition scheme, it is necessary to implement a thermosetting or photocuring process on the area at a certain temperature and time, and monitor the regional deformation and stress distribution value during the process. During monitoring, an embedded stress sensor device or infrared measurement method can be used to record the in-plane shrinkage and interface peeling degree of the key position of the heat dissipation core area to form the core area curing state data. If it is found that the stress value of the area gradually tends to be stable during the curing process, and the deformation has met the design requirements, this can be recorded in the operating system of the curing equipment as the completion of the first sequence of curing, and a core area curing state data report is output, including the final deformation and stress history curve of the heat dissipation core area. Subsequently, the stress compensation parameters of the ferrite shielding area and the high dielectric area are calculated according to the core area curing state data, and the second sequence of curing is performed according to the compensation parameters. The purpose is to perform separate thermal curing or photocuring on the functional area without interfering with the stabilized heat dissipation core area. If the stress margin of the ferrite shielding area is large, the system will increase the thermal curing time or slightly increase the temperature at this step to allow the bonding layer or dielectric to more fully eliminate the internal stress; if the high dielectric area shows a relatively small deformation trend, the curing time may be shortened to reduce the additional stress accumulation in this area at high temperature. After completing the second sequence of curing, the functional area curing status data will be output to reflect the actual molding quality and stress stability of the ferrite shielding area and the high dielectric area.

[0123] Taking the functional area curing state data as a benchmark, when performing stress matching calculation and final curing treatment on the FR-4 area, the system needs to identify the thermal expansion and contraction coefficient of the FR-4 area and adapt it to the curing state of the first two sequences to avoid new local stress shocks after the heat dissipation core area or the ferrite shielding area has been cured. At this time, if it is detected that there is still a high stress gradient at the boundary of the FR-4 area and the adjacent position of the high dielectric area, the system will appropriately extend the curing time of the FR-4 area, or increase and maintain the temperature in the local section of the area, so as to achieve matching with the overall stress field of the functional area. After completion, the full board curing data will be generated, recording the final curing parameters and mechanical balance information of each area for subsequent contour scanning and surface detection. When performing a multi-point grid contour scan on the full board curing data, the scanner needs to collect the surface height value and local thickness information at each position on the board, and store it as a set of grid coordinate-height value mapping. If the heat dissipation core area has a slight depression after the first sequence of curing or the ferrite shielding area has a slight bulge during the secondary curing, it will be reflected in the surface undulation and thickness distribution values, and the system will generate a surface profile feature data file based on this.

[0124] When determining the position and deviation of the concave and convex areas based on the surface contour feature data, it is necessary to perform differential operations on the contour sampling results. If the height value of a certain coordinate segment is significantly lower than the design benchmark, it is regarded as a concave area and the deviation is marked. If the height value is significantly higher, it is regarded as a convex area. After finding these abnormal areas, the concave areas can be filled with a small amount of resin to allow their surfaces to regain a flatness similar to that of the surrounding areas. The convex areas can be locally ground or milled in a small range to remove the remaining amount. If the heat dissipation core area produces upper and lower ripples or irregular protrusions appear on the ferrite shielding layer, the system will perform precise grinding in this area to ensure that the metal and ferrite interface maintains sufficient smoothness; if there is a slight depression in the high dielectric area, it will also be filled with resin to prevent subsequent routing or patch processes from being affected. After completing the above repair, the surface is scanned again to confirm whether it has reached the target tolerance range. If the measured concave-convex deviation value has dropped to within the design threshold, the repair result is registered as the flattening result and a record is generated in the overall database, indicating that the multi-material composite PCB has obtained a relatively balanced surface morphology after asynchronous curing and contour correction. This achieves accurate and effective sequential curing and local flattening in a high-thickness, multi-functional board environment, reduces the warping and stress concentration caused by heat dissipation, ferrite and high dielectric combinations, and provides a more stable benchmark for subsequent lamination processing or assembly.

[0125] Please continue reading Figure 1 According to the flattening result, the management data and the characteristic data, each block is iteratively corrected and calculated to obtain correction parameters, and each block is verified according to the correction parameters and multi-angle detection data to determine the final inter-layer alignment state.

[0126] In one embodiment of the present invention, the iterative correction calculation is performed on each block according to the flattening result, the management data and the feature data to obtain the correction parameters, and each block is verified according to the correction parameters and the multi-angle detection data to determine the final inter-layer alignment state, including: comparing and analyzing the flattening result with the coordinate information in the management data, combining the interface type label in the feature data, to obtain the initial position deviation data of each block; performing hierarchical progressive iterative calculation on the initial position deviation data, combining the correction coefficient in the management data for correction compensation, and obtaining the first round of iterative calculation. generation of correction data; analyzing the deviation trend of each block according to the first round of iterative correction data, optimizing and calculating according to the focusing gain coefficient in the feature data, and obtaining the correction convergence parameters of each block; performing regional mapping analysis and compensation calculation on the correction convergence parameters, and obtaining final correction parameters; based on the final correction parameters, performing multi-angle detection on each block using an ultraviolet-visible-infrared three-band scanning method, and obtaining three-dimensional detection data; matching and verifying the three-dimensional detection data with the interface type label in the feature data, calculating the final inter-layer deviation value, and determining the final inter-layer alignment state.

[0127] Specifically, when comparing and analyzing the flattening result with the coordinate information in the management data, it is necessary to import the surface height data or repair record after flattening in a data processing environment, and then retrieve each grid point or coordinate unit in the management data to check the change range of the position before and after flattening. If the flattening result shows that a part of the local height of a heat dissipation core area has been cut off or a layer of resin has been filled in a ferrite shielding area, the system will record this change as a positive or negative deviation value during the comparison, and perform a differential operation with the coordinates registered in the original management data to obtain the initial position deviation data of each block. If a coordinate point is lowered by 2 microns during the flattening process, and the management data records that the point belongs to the metal heat dissipation layer block, the deviation data of the point will be written into a deviation matrix, and the material block label will be attached for subsequent correction. In this way, the system can intuitively understand whether each block still retains deformation marks after repair or whether there is a gap with the initial nominal value.

[0128] When performing layered progressive iterative calculations on the initial position deviation data, the deviation values ​​of each block need to be split into layers first. Usually, the vertical and horizontal corrections are calculated according to the outermost and inner layers, respectively. In particular, in high-thickness or multi-material stacks, the layers need to be clearly divided. When combined with the correction coefficients in the management data, the program reads the repair formula or increase or decrease coefficient previously set for the block or material type, and then multiplies or adds it to the current deviation value to obtain the compensation strength that should be performed on the block in the first round of correction. If the inner layer of a ferrite shielding area has been repaired many times and the residual deviation value is still high, the correction coefficient will be set larger accordingly, indicating that more aggressive compensation is required in this block so that a single iteration can significantly approach the ideal value. This process outputs a set of first-round iterative correction data, providing new correction instructions for each block, such as which coordinates need to add how much thickness or how much surface to grind off, or whether additional time or energy allocation is required in subsequent exposure and thermal management.

[0129] When analyzing the deviation trend of each block based on the first round of iterative correction data, it is necessary to compare the focus gain coefficient in the feature data to determine how to prioritize in the optical or thermal treatment process. If the deviation value of a heat dissipation core area has dropped significantly after the first round of correction, but there are still small areas of high convexity or concavity, the system will check the focus gain coefficient to determine whether the small convexity can be further smoothed by increasing the beam energy or local heat treatment during subsequent exposure or local thermal compensation. If a ferrite shielding area still shows a diffuse deviation trend, it means that effective convergence has not been achieved after the initial correction. It may be necessary to use a higher focus gain or higher diffraction compensation in this block so that the subsequent process can focus more specifically. Through the comprehensive analysis of these deviation trends and the optimization calculation of the focus gain coefficient, a correction convergence parameter table can be output for each block, indicating what kind of enhancement or attenuation ratio should be applied to each block during subsequent processing or multi-band scanning, to ensure accelerated convergence rather than repeated deviation in the next operation.

[0130] When performing regional mapping analysis and compensation calculation on the correction convergence parameters, it is necessary to combine the aforementioned correction convergence parameters with the coordinate distribution, thickness layer number and thermal expansion information of each material block, so that the data processing module can insert the corresponding compensation values ​​in a coordinate-compensation multidimensional table. If a transition zone contains both ferrite and metal heat sink, the system will superimpose two compensation amounts on the coordinate segment to make its final energy distribution or heat treatment time closer to actual needs. This process will output the final correction parameters and generate one or more values ​​for each block, corresponding to how to allocate or increase or decrease in the optical process or thermal management process in the next stage. If there is a multi-functional production machine that can inject compensation directly into the light source or heating program, the final correction parameters can be transmitted to the machine control module for real-time adjustment or preset adjustment.

[0131] When using the ultraviolet-visible-infrared three-band scanning method to perform multi-angle inspection on each block according to the final correction parameters, it is necessary to first set three different bands of light sources on the scanning platform, and measure each block at different angles or different incident directions in each band. This can fully obtain the reflectivity, transmittance or scattering characteristics of the surface and inner layer. If a high dielectric area does not have obvious mismatch under visible light, but shows signs of local warping in the infrared band, multi-angle inspection can record this phenomenon and compare it with the previous compensation parameters. If there is a contradiction between the two, it indicates that additional correction operations are required. The ferrite shielding area and the heat dissipation core area can also be fine-tuned in the infrared and ultraviolet bands to prevent such high-reflection or high-absorption areas from failing to fully show defects in a single band. Finally, a three-dimensional stereoscopic inspection data will be produced, that is, the geometric and optical characteristics of the current board surface are presented in the XYZ coordinate or three-dimensional coordinate system, and then the data will be matched and verified with the interface type label in the feature data.

[0132] When matching and verifying the 3D detection data with the interface type label, the program needs to compare the material type of each block with the newly collected 3D coordinates or optical features one by one. If a certain location should be a metal heat dissipation layer but the absorption peak is abnormally offset, it can be determined that there is still a residual deviation and the value is recorded in the temporary report; if the surface morphology of a ferrite area is close to the ideal spectrum after multi-band detection, the program will mark this part as "completed" and no longer require repairs in the subsequent summary. In this way, the final interlayer deviation value of all blocks can be calculated, and which areas have reached the standard and which areas still have a slight deviation from the theoretical coordinates can be marked in the interlayer alignment results of the whole board. If the overall deviation is within the preset threshold, this iteration can be determined as the final interlayer alignment state. Through this multi-stage matching and verification process, multi-material composite PCBs can gradually reduce the surface and inner layer deviations to the allowable range in complex environments such as high thickness, high dielectric, and ferrite-metal mixing, laying a more solid foundation for the next step of circuit processing or functional testing.

[0133] The exposure alignment method of the multi-layer PCB in the embodiment of the present invention is described above. The exposure alignment device of the multi-layer PCB in the embodiment of the present invention is described below. Figure 2 An embodiment of the exposure alignment device of a multi-layer PCB in the embodiment of the present invention includes:

[0134] The multi-spectrum scanning module 101 is used to perform multi-spectrum scanning on each layer of the multi-material composite PCB to obtain feedback signals of each spectrum segment;

[0135] The resonance focusing processing module 102 is used to perform resonance focusing processing on each layer interface according to the comparison result between the feedback signal and the preset material characteristics, and obtain characteristic data including focusing gain coefficient and interface type label;

[0136] The quantum dot mark construction module 103 is used to divide the multi-material composite PCB into blocks according to the characteristic data, form quantum dot micro-marks at preset positions of each block, and establish management data including coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block;

[0137] A holographic exposure module 104 is used to perform selective phase processing and holographic exposure on each block through spatial light modulation according to the characteristic data and the management data, so as to obtain an exposure result of each block;

[0138] A bionic self-repairing control module 105, wherein a bionic self-repairing film is disposed between the layers of the multi-material composite PCB; the bionic self-repairing control module is used to obtain the interface temperature and thermal stress distribution data of the multi-material composite PCB, and according to the interface temperature and thermal stress distribution data, apply an electric field stimulation to the bionic self-repairing film to make the bionic self-repairing film produce a stress release response, thereby obtaining an alignment calibration result;

[0139] The asynchronous curing processing module 106 is used to perform asynchronous curing processing on each block according to the alignment calibration result, obtain surface contour data after curing, and perform selective topographic processing on the local area according to the surface contour data to obtain a flattening result;

[0140] The iterative correction verification module 107 is used to perform iterative correction calculations on each block according to the flattening result, the management data and the feature data to obtain correction parameters, verify each block according to the correction parameters and multi-angle detection data, and determine the final inter-layer alignment state.

[0141] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for exposure and alignment of a multi-layer PCB, characterized in that: include: Perform multi-spectrum scanning on each layer of the multi-material composite PCB to obtain feedback signals of each spectrum band; According to the comparison result between the feedback signal and the preset characteristics of the material, resonant focusing processing is performed on the interfaces of each layer to obtain characteristic data including focusing gain coefficient and interface type label; Dividing the multi-material composite PCB into blocks according to the characteristic data, forming quantum dot micro-marks at preset positions of each block, and establishing management data including coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block; According to the characteristic data and the management data, selective phase processing is performed on each block through spatial light modulation and holographic exposure is performed to obtain exposure results of each block; A bionic self-repairing film is provided between the layers of the multi-material composite PCB; Acquiring interface temperature and thermal stress distribution data of the multi-material composite PCB, applying electric field stimulation to the bionic self-repairing film according to the interface temperature and thermal stress distribution data, so that the bionic self-repairing film produces a stress release response, and obtaining an alignment calibration result; Perform asynchronous solidification processing on each block according to the alignment calibration result, obtain surface contour data after solidification, and perform selective topographic processing on the local area according to the surface contour data to obtain a flattening result; According to the flattening result, the management data and the characteristic data, each block is iteratively corrected and calculated to obtain correction parameters, and each block is verified according to the correction parameters and multi-angle detection data to determine the final inter-layer alignment state.

2. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: The multi-spectrum scanning of each layer of the multi-material composite PCB to obtain feedback signals of each spectrum segment includes: Perform ultraviolet light scanning of the first frequency band on the ferrite layer and the metal heat dissipation layer in the multi-material composite PCB to obtain the material absorption coefficient data of the first frequency band; Determine the scanning energy threshold of each layer according to the absorption coefficient data of the material in the first frequency band, perform a pre-scan of each layer of the multi-material composite PCB in the visible light frequency band, and obtain initial optical characteristic data of the interface of each layer; Selecting an optimal scanning angle according to the initial optical characteristic data, performing near-infrared band scanning on the metal heat dissipation layer of the multi-material composite PCB, and obtaining metal layer thickness distribution data; According to the metal layer thickness distribution data and the initial optical characteristic data, a terahertz band scan is performed on the ferrite layer of the multi-material composite PCB to obtain ferrite layer depth distribution data; Performing stacking analysis on the metal layer thickness distribution data and the ferrite layer depth distribution data to obtain a layer interface characteristic spectrum; The multi-angle reflectivity of the multi-material composite PCB is measured according to the interlayer interface characteristic spectrum to obtain feedback signals of each spectrum segment.

3. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: According to the comparison result between the feedback signal and the preset characteristics of the material, the resonance focusing process is performed on each layer interface to obtain characteristic data including a focusing gain coefficient and an interface type label, including: Matching and comparing the feedback signal with the standard spectrum data in the material preset characteristic library to obtain the initial characteristic deviation data of each layer of material; Performing wavelength compensation processing on the feedback signal according to the initial characteristic deviation data to obtain corrected spectrum data of each spectrum segment; Classifying and analyzing the corrected spectral data according to the material interface type to obtain spectral response characteristic diagrams of various interfaces; Calculate the phase delay and resonance frequency range of each layer interface according to the spectral response characteristic diagram to obtain interface resonance characteristic data; The interface resonance characteristic data is input into a resonance focusing control system, and the resonance frequency of each layer interface is scanned to obtain the interface resonance state parameters; The focusing parameters of each layer interface are adjusted according to the interface resonance state parameters, and a resonance gain process is performed to obtain a resonance focusing gain coefficient; The resonance focusing gain coefficient is fused with the spectral response characteristic diagram to obtain characteristic data including the focusing gain coefficient and the interface type label.

4. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: The multi-material composite PCB is divided into blocks according to the characteristic data, quantum dot micro-marks are formed at preset positions of each block, and management data including coordinate information, luminous characteristics and correction coefficients of the micro-marks of each block is established, including: Perform material partitioning and boundary optimization processing on the multi-material composite PCB according to the interface type label and the focusing gain coefficient in the characteristic data to obtain block boundary correction data; Dividing the block boundary correction data into a heat dissipation core area, a ferrite shielding area, a high dielectric area, and an FR-4 area, and performing grid processing on each area to generate a layout position coordinate table of quantum dot micro-marks; According to the comparison result of the layout position coordinate table and the line layout data, the avoidance vias and wiring areas are determined to obtain an optimized layout scheme of quantum dot micro-marks, and the deposition process of quantum dot markers is performed according to the optimized layout scheme to obtain quantum dot marker arrays of each block; Performing multi-wavelength excitation and intensity attenuation tests on the quantum dot marker array to obtain the luminescence wavelength, intensity curve and attenuation coefficient, and obtaining the luminescence characteristic data of the quantum dots in each block; The quantum dot marking array is multi-dimensionally associated with the luminescence characteristic data to obtain a marking mapping relationship table for each block, and the spectral correction coefficient corresponding to the material interface is calculated based on the marking mapping relationship table to establish management data containing the coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block.

5. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: According to the characteristic data and the management data, selective phase processing is performed on each block through spatial light modulation and holographic exposure is performed to obtain exposure results of each block, including: According to the interface type label in the characteristic data and the luminous characteristics in the management data, the optical characteristics of each block are comprehensively analyzed to obtain a block light energy allocation plan; Performing phase modulation calculation on the light intensity data of each block in the block light energy allocation scheme, performing spatial compensation in combination with the coordinate information in the management data, and obtaining an initial phase modulation pattern; The initial phase modulation pattern is subjected to differentiated processing according to the material type of each block, wherein the differentiated processing includes compensating and calculating the reflectivity of the metal heat dissipation layer area and the absorption coefficient of the ferrite shielding area to obtain a compensated phase modulation scheme; Generate a holographic interference pattern according to the compensated phase modulation scheme, locally optimize the light intensity distribution of the holographic interference pattern in combination with the correction coefficient in the management data, and obtain a final holographic exposure pattern; The final holographic exposure pattern is subjected to time-sequential exposure processing according to the material interface characteristics of each block, and dynamic compensation is performed according to the real-time feedback signal of the quantum dot micro-mark to obtain the exposure result of each block.

6. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: The step of obtaining the interface temperature and thermal stress distribution data of the multi-material composite PCB, applying electric field stimulation to the bionic self-repairing film according to the interface temperature and thermal stress distribution data to make the bionic self-repairing film produce a stress release response, and obtaining the alignment calibration result includes: Performing a multi-point array temperature scan on the interlayer interface of the multi-material composite PCB to obtain temperature distribution data of the interface of each layer; Calculate the temperature gradient value of each layer interface according to the temperature distribution data, and obtain the interface thermal stress distribution data in combination with the thermal expansion coefficient of each layer material; Performing regional threshold analysis on the interface thermal stress distribution data, determining key stress regions and key stress region distribution characteristics, and obtaining a stress distribution map; Performing regional response planning on the bionic self-repairing membrane according to the stress distribution map, calculating the electric field intensity and action time required for each area, and obtaining an electric field stimulation parameter table; Performing time-sequential electric field regulation on each response area of ​​the bionic self-repairing film according to the electric field stimulation parameter table, monitoring the displacement change of the nano-metal complex in the bionic self-repairing film, and obtaining stress release displacement data; The stress release displacement data and the temperature distribution data are correlated and analyzed, and the deformation compensation amount of each area is calculated to obtain the alignment calibration result.

7. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: The step of performing asynchronous solidification processing on each block according to the alignment calibration result, obtaining surface contour data after solidification, and performing selective topographic processing on a local area according to the surface contour data to obtain a flattening result includes: According to the alignment calibration result, the key areas of the multi-material composite PCB are identified, and the curing priority levels are divided according to the regional stress characteristics to obtain an asynchronous curing partitioning scheme; Performing a first sequence of curing treatment on the heat dissipation core area in the asynchronous curing partition scheme, obtaining the regional deformation amount and stress distribution value during the curing process, and obtaining the curing state data of the core area; Calculating stress compensation parameters of the ferrite shielding area and the high dielectric area according to the core area solidification state data, and performing a second sequence solidification process according to the compensation parameters to obtain functional area solidification state data; Taking the functional area curing state data as a reference, performing stress matching calculation and final curing treatment on the FR-4 area to obtain full board curing data; Performing multi-point grid profile scanning on the whole plate curing data, recording the surface undulation and thickness distribution values, and obtaining surface profile feature data; The positions and deviations of the concave and convex areas are determined according to the surface profile feature data, a trace amount of resin is filled into the concave area, and local grinding is performed on the convex area to obtain a flattening result.

8. The exposure alignment method of a multi-layer PCB according to claim 1, characterized in that: The iterative correction calculation is performed on each block according to the flattening result, the management data and the characteristic data to obtain correction parameters, and each block is verified according to the correction parameters and multi-angle detection data to determine the final inter-layer alignment state, including: Comparing and analyzing the flattening result with the coordinate information in the management data, and combining the interface type label in the feature data, to obtain the initial position deviation data of each block; Performing hierarchical progressive iterative calculation on the initial position deviation data, and performing correction compensation in combination with the correction coefficient in the management data to obtain the first round of iterative correction data; Analyzing the deviation trend of each block according to the first round of iterative correction data, optimizing and calculating the focus gain coefficient in the characteristic data, and obtaining the correction convergence parameter of each block; Performing regional mapping analysis and compensation amount calculation on the correction convergence parameters to obtain final correction parameters; According to the final calibration parameters, a UV-visible-infrared three-band scanning method is used to perform multi-angle detection on each block to obtain three-dimensional detection data; The three-dimensional detection data is matched and verified with the interface type label in the feature data, the final inter-layer deviation value is calculated, and the final inter-layer alignment state is determined.

9. An exposure alignment device for a multi-layer PCB, characterized in that: The exposure and alignment device of the multi-layer PCB adopts the exposure and alignment method of the multi-layer PCB according to any one of claims 1 to 8, and the exposure and alignment device of the multi-layer PCB comprises: Multi-spectrum scanning module, used to perform multi-spectrum scanning on each layer of multi-material composite PCB to obtain feedback signals of each spectrum segment; A resonance focusing processing module, used to perform resonance focusing processing on each layer interface according to the comparison result between the feedback signal and the preset characteristics of the material, and obtain characteristic data including focusing gain coefficient and interface type label; A quantum dot mark construction module, used to divide the multi-material composite PCB into blocks according to the characteristic data, form quantum dot micro-marks at preset positions of each block, and establish management data including coordinate information, luminescence characteristics and correction coefficients of the micro-marks of each block; A holographic exposure module, used to perform selective phase processing and holographic exposure on each block through spatial light modulation according to the characteristic data and the management data, so as to obtain an exposure result of each block; A bionic self-repairing control module, wherein a bionic self-repairing film is disposed between the layers of the multi-material composite PCB; the bionic self-repairing control module is used to obtain the interface temperature and thermal stress distribution data of the multi-material composite PCB, and according to the interface temperature and thermal stress distribution data, apply an electric field stimulation to the bionic self-repairing film to make the bionic self-repairing film produce a stress release response, thereby obtaining an alignment calibration result; An asynchronous curing processing module is used to perform asynchronous curing processing on each block according to the alignment calibration result, obtain surface contour data after curing, and perform selective topographic processing on the local area according to the surface contour data to obtain a flattening result; The iterative correction verification module is used to perform iterative correction calculations on each block according to the flattening result, the management data and the feature data to obtain correction parameters, verify each block according to the correction parameters and multi-angle detection data, and determine the final inter-layer alignment state.

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