Plating apparatus

Abstract

Provided is a plating device in which, even if the flow rate of a plating solution ejected from an ejection unit is increased, a plated object does not excessively rise to a high position in the stored plating solution, and the occurrence of defects in the plated object is suppressed. A plating device is provided with: a plating tank for storing a plating solution containing an object to be plated; and a spraying part which is formed in the plating tank and sprays the plating liquid, and the plated object contained in the plating liquid is stirred by the plating liquid sprayed from the spraying part, the spraying part is in the shape of an inner cylinder having a bottom surface extending in the horizontal direction, an inner wall extending from the bottom surface to the height direction, and an opening formed at the upper end of the inner wall, and the spraying part is formed in the plating tank and is used for spraying the plating liquid, and the plated object contained in the plating liquid is stirred by the plating liquid sprayed from the spraying part. The opening is a first injection port for injecting the plating liquid into the plating tank, the first injection port is provided with a screen member, the bottom surface is provided with a second injection port for injecting the plating liquid into the injection part, a flow rate control plate in which a plurality of holes are formed is provided midway along the height direction of the injection part and parallel to the bottom surface, and the flow rate control plate is provided with a plurality of holes. The flow rate control plate has a central portion and a peripheral portion provided on the outside of the central portion, each opening area of the holes formed in the central portion is smaller than each opening area of the holes formed in the peripheral portion, and a cylindrical member having a hollow portion is provided between the flow rate control plate and the screen member of the first injection port.

Description

Technical Field

[0001] The present invention relates to a plating apparatus. Background Art

[0002] So-called jet-type plating apparatuses are widely used for forming external electrodes of electronic components, etc. Patent Document 1 (Japanese Patent Application Laid-Open No. 2021-138999) discloses a jet-type plating apparatus.

[0003] The plating device disclosed in Patent Document 1 includes a plating tank. The plating tank contains a metal tube (cathode) as a first electrode, a partition tube made of an insulating material, and a second electrode (anode). In addition, a plurality of small holes are formed in the partition tube so that the plating solution can pass through but the plated object, medium, etc. cannot pass through.

[0004] A metal tube is arranged inside the partition tube, and a plating forming portion is formed between the inner side of the partition tube and the outer side of the metal tube. The plating forming portion refers to a region (space) where plating is applied to the object to be plated. A second electrode is arranged outside the partition tube.

[0005] A jetting unit having a jetting port for jetting the plating liquid is provided below the metal pipe. The jetting unit is used to generate an upward flow of the plating liquid inside the metal pipe. In addition, although not disclosed in the plating device of Patent Document 1, a screen member is usually provided at the jetting port of the jetting unit so that the plated object and the medium do not fall into the jetting unit when the jetting stops.

[0006] The plating device disclosed in Patent Document 1 contains a plating solution in a plating tank. Next, an object to be plated, a conductive medium, and, if necessary, insulating balls are put into the plating tank containing the plating solution. However, the plating solution may be contained in the plating tank after the object to be plated, the medium, and the insulating balls are put into the plating tank. In addition, the medium is used to electrically connect the metal tube that serves as the first electrode in the plating of the object to be plated in the plating forming section and the plating forming area (area where the base electrode, etc. are formed) on the surface of the object to be plated. The insulating balls are used to improve the fluidity of the object to be plated circulating in the plating device.

[0007] The object to be plated, the dielectric, and the insulating ball rise inside the metal pipe along with the upward flow of the plating solution inside the metal pipe generated by the jetting portion, are ejected outward from the upper end of the metal pipe, and are stirred in the plating solution.

[0008] The stirred object to be plated, dielectric, and insulating balls are then deposited on the upper side of the plating formation portion. At this time, other objects to be plated, dielectrics, and insulating balls are already deposited in the plating formation portion. The objects to be plated, dielectrics, and insulating balls deposited on the upper side of the plating formation portion then gradually descend in the plating formation portion. At this time, a plating film is formed in the plating formation area on the surface of the object to be plated by applying a current between the metal tube as the first electrode and the second electrode.

[0009] The object to be plated, dielectric, and insulating balls with the plated film formed thereon are pushed out from the lower end of the plated forming part, and rise again inside the metal pipe along with the rising flow of the plating liquid generated inside the metal pipe, and are ejected outward from the upper end of the metal pipe and stirred. Then, the stirred object to be plated, dielectric, and insulating balls are deposited on the upper side of the plated forming part in the same manner as last time, and then gradually descend in the plated forming part, and a plated film is formed on the object to be plated during the descent.

[0010] The object to be plated may circulate in the plating apparatus several to several thousand times until the plated film reaches a predetermined thickness and the plating process is completed.

[0011] Prior Art Literature

[0012] Patent Literature

[0013] Patent Document 1: Japanese Patent Application Publication No. 2021-138999 Summary of the invention

[0014] Problem that the invention aims to solve

[0015] Plating on an object to be plated needs to satisfy the following (a) and (b).

[0016] (a) A plated film having a thickness greater than or equal to a predetermined thickness is formed on each object to be plated.

[0017] (b) The variation in thickness of the plated film formed between a plurality of objects to be plated simultaneously is small (within a predetermined allowable value).

[0018] In one (one batch) plating process, when the time from the start of plating to the end of plating is defined as the "total plating time", if the total plating time is fixed, even if the time required for the plated object to pass through the plating forming section once and the number of times the plated object passes through the plating forming section change, the thickness of the plated film formed on each plated object is substantially the same. This is because the thickness of the plated film formed on the plated object depends on the total time for each plated object to pass through the plating forming section (the time required to pass through the plating forming section once × the number of times it passes). In addition, of course, when the total plating time is fixed, if the time required for the plated object to pass through the plating forming section once becomes longer, the number of times the plated object passes through the plating forming section becomes fewer, and if the time required for the plated object to pass through the plating forming section once becomes shorter, the number of times the plated object passes through the plating forming section becomes more.

[0019] On the other hand, when the total plating time is fixed, when the time required for the object to be plated to pass through the plating forming section once is shortened, thereby increasing the number of times the object to be plated circulates in the plating device, the variation in the thickness of the plated film formed between the plurality of objects to be plated becomes smaller than when the time required for the object to be plated to pass through the plating forming section once is lengthened, thereby reducing the number of times the object to be plated circulates in the plating device. That is, each time the object to be plated passes through the plating forming section once, the thickness of the plated film formed (grown) on the object to be plated varies depending on whether the object to be plated passes near the metal tube, near the next-wall tube, or near the middle of the metal tube and the next-wall tube, and therefore, by increasing the number of times the object passes to achieve equalization, the variation in the thickness of the plated film formed can be reduced.

[0020] Considering the productivity of the plating process, it is preferred that the total plating time is short. In order to increase the number of times the plated object passes through the plating forming portion within the limited total plating time, it is sufficient to increase the flow rate of the plating solution sprayed from the spray portion. In order to increase the flow rate of the plating solution sprayed from the spray portion, for example, it is sufficient to increase the output of a pump connected to the spray portion.

[0021] However, if the flow rate of the plating solution sprayed from the spraying part is increased, there is a case where "cracks" or "defects" occur in the object to be plated, or "peeling" occurs in the plating film formed on the object to be plated, etc., resulting in defects in the object to be plated. It is believed that the reason is that if the flow rate of the plating solution sprayed from the spraying part is increased, the speed of the object to be plated rising in the metal pipe as the first electrode becomes too fast, and the object to be plated sprayed outward from the upper end of the metal pipe rises to a higher position in the plating solution stored in the plating tank and collides with a reflector called a deflector, or collides with the inner wall of the plating tank or other objects to be plated when descending (settling) from a higher position in the plating solution. That is, the object to be plated is discharged outward from the upper end of the metal pipe together with the dielectric and the insulating ball in order to stir them, but at this time, if the object to be plated rises to a higher position in the stored plating solution too quickly, sometimes defects occur in the object to be plated.

[0022] Therefore, an object of the present invention is to provide a plating apparatus that prevents an object to be plated from excessively rising to a high position in a stored plating solution even when the flow rate of the plating solution sprayed from a spray portion is increased, thereby suppressing occurrence of defects in the object to be plated.

[0023] Technical solutions to solve problems

[0024] In order to solve the above-mentioned conventional problems, a plating device according to one embodiment of the present invention comprises: a plating tank storing a plating liquid containing an object to be plated; and a jetting portion formed in the plating tank and jetting the plating liquid, wherein the object to be plated contained in the plating liquid is stirred by the plating liquid jetted from the jetting portion, wherein the jetting portion is an inner cylindrical shape having a bottom surface extending in a horizontal direction, an inner wall extending from the bottom surface in a height direction, and an opening formed at an upper end of the inner wall, the opening being a first jetting port for jetting the plating liquid into the plating tank, a screen member being provided at the first jetting port, a second jetting port for jetting the plating liquid into the jetting portion being provided on the bottom surface, a flow rate control plate having a plurality of holes formed therein being provided midway in the height direction of the jetting portion and parallel to the bottom surface, the flow rate control plate having a central portion and a peripheral portion provided outside the central portion when viewed in a planar direction, a plurality of holes being formed in the central portion and the peripheral portion, respectively, and a cylindrical member having a hollow portion being provided between the flow rate control plate and the screen member of the first jetting port.

[0025] Effects of the Invention

[0026] A plating device according to one embodiment of the present invention adjusts the size of each opening area, the total opening area per unit area of ​​multiple holes, the number of holes per unit area, etc. in the holes formed in the central portion and the holes formed in the peripheral portion, thereby being able to suppress the speed of the plating liquid passing through the central portion compared to the speed of the plating liquid passing through the peripheral portion.

[0027] As a result, when a cylindrical metal pipe having a hollow portion is arranged directly above the ejection unit in the plating apparatus according to one embodiment of the present invention, for example, the speed of the plating solution passing through the center of the metal pipe is suppressed, so that even if the flow rate of the plating solution ejected from the ejection unit is increased, the object to be plated does not rise excessively to a high position in the stored plating solution, and defects in the object to be plated can be suppressed. The following is a supplementary explanation.

[0028] For example, the speed of the plating solution passing through the inside of the metal tube as the first electrode (rising inside the metal tube) is not uniform over the entire cross-section of the metal tube, but is faster toward the center of the metal tube and slower toward the peripheral portion close to the inner wall of the metal tube. This is because resistance (friction resistance) is generated in the flow of the plating solution at the peripheral portion close to the inner wall of the metal tube, thereby suppressing the speed of the plating solution.

[0029] In addition, in a case where an inner cylindrical injection portion is provided on the bottom surface of a plating tank of a plating device, a first injection port is provided on the upper side of the injection portion, and a second injection port for injecting a plating liquid into the injection portion is provided on the bottom surface of the injection portion, and in a case where the diameter of the second injection port is smaller than the inner diameter of the metal tube, the plating liquid sometimes flows faster toward the center of the metal tube and flows slower toward the peripheral portion closer to the inner wall of the metal tube.

[0030] On the other hand, when the flow rate of the plating solution sprayed from the spraying part is increased, not all the objects to be plated sprayed outward from the upper end of the metal pipe rise to a higher position in the plating solution stored in the plating tank. It is considered that the objects to be plated that rise to a higher position in the plating solution stored in the plating tank are mainly objects to be plated that pass through (rise) at once in the center of the metal pipe where the speed of the plating solution is high.

[0031] A plating device involved in one embodiment of the present invention suppresses the speed of the plating liquid passing through the central part of the flow rate control plate. For example, when a cylindrical metal tube with a hollow portion is arranged directly above the injection portion, the speed of the plating liquid passing through the interior of the metal tube is suppressed in the central part of the metal tube. Therefore, even if the flow rate of the plating liquid injected from the injection portion is increased, the object to be plated will not rise excessively to a higher position in the stored plating liquid, thereby suppressing the occurrence of defects in the object to be plated. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a cross-sectional view of the plating apparatus 100 according to the first embodiment.

[0033] Figure 2 is a cross-sectional view of the plating apparatus 100, showing Figure 1 The single-dash arrow AA part.

[0034] Figure 3 It is a cross-sectional view of a main part of the plating apparatus 100 .

[0035] Figure 4 It is a perspective view of the main parts of the plating apparatus 100 .

[0036] Figure 5 (A) is a plan view of the flow rate control plate 8 and the cylindrical member 10 of the plating apparatus 100 . Figure 5 (B) is a plan view of a flow velocity control plate 8 ′ and a cylindrical member 10 as a modified example of the flow velocity control plate 8 of the plating apparatus 100 .

[0037] Figure 6 (A) is a plan view showing a mesh member 7 ′ which is a modified example of the mesh member 7 of the plating apparatus 100 . Figure 6 (B) is a plan view showing a mesh member 7 ″ which is a modified example of the mesh member 7 of the plating apparatus 100 .

[0038] Figure 7 It is a plan view of the main parts of the plating apparatus 200 according to the second embodiment. DETAILED DESCRIPTION

[0039] The following, with the attached Figure 1 The following describes a mode for carrying out the present invention.

[0040] In addition, each embodiment illustratively shows an embodiment of the present invention, and the present invention is not limited to the contents of the embodiment. In addition, it is also possible to combine the contents recorded in different embodiments to implement, and the implementation contents in this case are also included in the present invention. In addition, the drawings are used to help the understanding of the specification, and are sometimes schematically depicted, and the ratio of the dimensions of the depicted constituent elements or constituent elements is sometimes inconsistent with the ratio of their dimensions recorded in the specification. In addition, there are cases where the constituent elements recorded in the specification are omitted in the drawings, and the number of elements is omitted and depicted, etc.

[0041] [First embodiment]

[0042] exist Figure 1 , Figure 2 , Figure 3 , Figure 4 (A) and (B) show the plating apparatus 100 according to the first embodiment. Figure 1 2 is a cross-sectional view of the plating apparatus 100 . Figure 2 is also a cross-sectional view of the plating apparatus 100, showing Figure 1 The AA portion is indicated by the single-dot dash arrow. Figure 3 It is a cross-sectional view of a main part of the plating apparatus 100 . Figure 4It is a perspective view of the main parts of the plating apparatus 100 , and shows the injection unit 6 . Figure 5 (A) is a plan view of the flow rate control plate 8 and the cylindrical member 10 of the plating apparatus 100 . Figure 5 (B) is a plan view of a flow velocity control plate 8 ′ and a cylindrical member 10 as a modified example of the flow velocity control plate 8 .

[0043] The plating apparatus 100 includes a plating tank 1. The top of the plating tank 1 is open. The plating tank 1 is used to store a mixture 19 of a plating solution, an object to be plated, a medium, and insulating balls described later. However, the insulating balls may be omitted if not necessary.

[0044] The plating device 100 includes a cylindrical metal tube 2 inside a plating tank 1. The metal tube 2 has a hollow portion 2a. The metal tube 2 is a first electrode, and in the present embodiment, is a cathode electrode. In the present embodiment, the metal tube 2 is cylindrical. However, the metal tube 2 may also be a polygonal tube. The material of the metal tube 2 is arbitrary, and various metals may be used. The dimensions of the metal tube 2, such as the outer diameter, inner diameter, and length, are arbitrary and may be appropriately set.

[0045] In the present embodiment, two rod-shaped conductive support parts 2b are formed integrally with the metal pipe 2 at the upper part of the metal pipe 2. However, the number of the support parts 2b is arbitrary and is not limited to two.

[0046] The plating device 100 is provided with a bulkhead tube 3 made of an insulating material inside the plating tank 1. The bulkhead tube 3 has a hollow portion 3a. In the present embodiment, the bulkhead tube 3 is cylindrical. However, the bulkhead tube 3 may also be a polygonal cylindrical shape. A plurality of small holes 3b are formed in the bulkhead tube 3, which allow the plating solution to pass through but do not allow the plated object, the medium, and the insulating ball to pass through. When an electric current is applied between the metal tube 2 as the first electrode and the second electrode 5, the hole 3b allows the electric current to pass through using the plating solution as a medium. The material of the bulkhead tube 3 is arbitrary, for example, various resins can be used. The dimensions of the bulkhead tube 3, such as the outer diameter, inner diameter, and length, are arbitrary and can be set appropriately.

[0047] The inner diameter of the partition tube 3 is larger than the outer diameter of the metal tube 2. The metal tube 2 is arranged in the hollow portion 3a of the partition tube 3. A plating forming portion 4 is formed between the inner side of the partition tube 3 and the outer side of the metal tube 2. The plating forming portion 4 is a region (space) where plating is applied to the object to be plated. Figure 1 , Figure 2 , Figure 3 In FIG. 1 , the plating forming portion 4 is drawn in a grid shape. The area between the outer diameter of the metal tube 2 and the inner diameter of the partition tube 3 is the plating forming portion 4. The dimensions such as the length of the plating forming portion 4 are arbitrary and can be appropriately set.

[0048] The object to be plated, the dielectric, and the insulating balls are accumulated inside the plating forming portion 4 and gradually fall downward. During the fall, the surface of the object to be plated is plated.

[0049] The plating device 100 includes a second electrode 5 inside the plating tank 1. In the present embodiment, the second electrode 5 is an anode electrode. In the present embodiment, the second electrode 5 includes a cylindrical metal. The second electrode 5 is arranged outside the partition tube 3. The material of the second electrode 5 is arbitrary, and various metals can be used.

[0050] like Figure 2 As shown, when the plating device 100 is viewed in the planar direction, the metal tube 2, the partition tube 3, and the second electrode 5 are arranged in a concentric circle shape so that their central axes are aligned. Therefore, the plating device 100 uniformly applies current between the metal tube 2 as the first electrode and the second electrode 5 in any area of ​​the plating forming portion 4, thereby suppressing the thickness deviation of the formed plated film.

[0051] The plating device 100 includes a jet portion 6 below the metal pipe 2. The jet portion 6 is used to generate an upward flow of the plating solution inside the metal pipe 2. In the present embodiment, the jet portion 6 is an inner cylindrical shape having a bottom surface extending in the horizontal direction, an inner wall extending from the bottom surface in the height direction, and an opening formed at the upper end of the inner wall. In the present embodiment, the inner cylindrical shape of the jet portion 6 is an inner cylindrical shape. However, the inner cylindrical shape of the jet portion 6 is not limited to the inner cylindrical shape, but may also be other shapes. The dimensions of the inner diameter, depth, etc. of the jet portion 6 are arbitrary and can be appropriately set. In addition, the dimension of the inner diameter of the jet portion 6 is preferably the same as the dimension of the inner diameter of the metal pipe 2, but there is no problem even if they are different.

[0052] A first injection port 6a is formed in an opening formed at the upper end of the injection portion 6. The first injection port 6a may have any shape and size, but in the present embodiment, it is a circular shape with a diameter of 28 mm.

[0053] The second injection port 6b is formed on the bottom surface of the injection portion 6. The plating liquid is injected from the second injection port 6b into the injection portion 6. The plating liquid is injected from the first injection port 6a into the plating tank 1. In this embodiment, the opening area of ​​the second injection port 6b is smaller than the opening area of ​​the first injection port 6a.

[0054] Furthermore, when the inner diameter of the metal pipe 2 and the diameter of the second injection port 6b are compared, the diameter of the second injection port 6b is smaller than the inner diameter of the metal pipe 2. This also causes the speed of the plating solution in the center of the metal pipe 2 to increase, so a countermeasure to suppress the speed of the plating solution in the center of the metal pipe 2 is required.

[0055] The first injection port 6a of the injection unit 6 is provided with a mesh member 7. The mesh member 7 is provided so that when the injection of the injection unit 6 stops, the plated object, the medium, the insulating ball, etc. do not fall into the injection unit 6. In the present embodiment, the first injection port 6a of the injection unit 6 is circular, and therefore the mesh member 7 is also circular when viewed in the planar direction.

[0056] In this embodiment, the mesh member 7 is composed of a single-layer mesh having a mesh size of 900 μm. Figure 6 The screen member 7' shown in (A) Figure 6 Like the screen component 7" shown in (B), the screen component is composed of a screen central portion 7a and a screen peripheral portion 7b arranged on the outside of the screen central portion 7a, the screen central portion 7a is composed of multiple layers (for example, 2 layers) of screens, and the screen peripheral portion 7b is composed of 1 layer of screen. In this case, the shape and size of the screen central portion 7a are preferably the same as the shape and size of the central portion 8a of the flow velocity control plate 8 described later and the shape and size of the inner diameter of the cylindrical component 10 described later, but there is no problem even if they are different. The screen central portion 7a of the screen component 7' is circular, and the screen central portion 7a of the screen component 7" is rectangular.

[0057] The so-called "mesh size" of a screen is the size between adjacent lines (excluding wire diameter) in a screen where longitudinal lines and transverse lines intersect. The mesh size is sometimes referred to as opening (OP) or opening size. When talking about mesh size, it generally refers to the mesh size of a single layer of screen, but in this application document, when multiple screens are overlapped, it sometimes refers to the combined mesh size of multiple screens. When comparing the mesh size of a single layer of screen with the mesh size when the screen is overlapped with two layers (or the mesh size when the screen and another screen are overlapped), the latter is smaller (finer) than the former.

[0058] In the mesh members 7', 7", the mesh size of the mesh central portion 7a is smaller than the mesh size of the mesh peripheral portion 7b. Therefore, in the mesh members 7', 7", the speed of the plating solution passing through the mesh central portion 7a is suppressed compared to the speed of the plating solution passing through the mesh peripheral portion 7b.

[0059] The material of the screen constituting the screen members 7, 7', 7" is arbitrary, but nylon can be used, for example. When the screens are overlapped in multiple layers for use, the screens can be joined, for example, by an adhesive, or the ends can be fixed after overlapping each other.

[0060] The plating device 100 is provided with a flow rate control plate 8 in parallel with the bottom surface of the spraying portion 6 at the middle of the height direction of the spraying portion 6. Figure 5As can be seen from (A), the flow velocity control plate 8 has a central portion 8 a and a peripheral portion 8 b provided outside the central portion 8 a when viewed in the planar direction.

[0061] The shape and size of the flow velocity control plate 8 are arbitrary, but in this embodiment, it is set to a disk shape with a diameter of 28 mm. In addition, the shape and size of the central part 8a are also arbitrary, but in this embodiment, it is set to a circle with a diameter of 20 mm.

[0062] The material of the flow velocity control plate 8 is arbitrary, but for example, vinyl chloride can be used.

[0063] A plurality of holes 9 (9a, 9b) are formed in the flow velocity control plate 8 so as to penetrate between the two main surfaces. The shape of the holes 9 (9a, 9b) is arbitrary, but in the present embodiment, they are set to be circular when viewed in the plane direction. In addition, as long as the holes 9 (9a, 9b) are circular, the holes 9 (9a, 9b) can be easily formed by irradiation with laser or drilling with a drilling machine.

[0064] In this embodiment, the opening area of ​​each hole 9a formed in the central portion 8a is smaller than the opening area of ​​each hole 9b formed in the peripheral portion 8b. Specifically, the diameter of the hole 9a formed in the central portion 8a is 1.2 mm, and the diameter of the hole 9b formed in the peripheral portion 8b is 3.0 mm.

[0065] In addition, in the present embodiment, the pattern shape of the central portion 8a where the holes 9a are formed and the pattern shape of the peripheral portion 8b where the holes 9b are formed are similar shapes. More specifically, a plurality of holes 9a with a diameter of 1.2 mm are formed in a matrix (checkerboard) at a given interval in the central portion 8a. Then, while maintaining this shape, the intervals between the holes are also expanded until the diameter of the holes becomes 3.0 mm in diameter, and holes 9b are formed in the peripheral portion 8b using the intervals between the expanded holes and the diameter of the expanded holes. Therefore, in the present embodiment, the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a is equal to the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b.

[0066] However, the total opening area of ​​the plurality of holes 9a per unit area and the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b do not necessarily have to be equal. In order to more effectively suppress the speed of the plating solution passing through the central portion 8a, it is preferred that the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a is smaller than the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b. However, even if the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a is larger than the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b, as long as the opening area of ​​each hole 9a formed in the central portion 8a is sufficiently smaller than the opening area of ​​each hole 9b formed in the peripheral portion 8b, the speed of the plating solution passing through the central portion 8a can be suppressed compared with the speed of the plating solution passing through the peripheral portion 8b.

[0067] In the flow rate control plate 8 of the plating device 100 of the present embodiment, since the opening area of ​​each hole 9a formed in the central portion 8a is smaller than the opening area of ​​each hole 9b formed in the peripheral portion 8b, the resistance applied to the plating solution passing through the central portion 8a is greater than the resistance applied to the plating solution passing through the peripheral portion 8b. Therefore, the speed of the plating solution passing through the central portion 8a is suppressed. That is, when a fluid such as a plating solution passes through a hole, the smaller the opening area of ​​the hole, the greater the resistance applied to the fluid, and the larger the opening area of ​​the hole, the smaller the resistance applied to the fluid. By increasing the opening area of ​​each hole 9b formed in the peripheral portion 8b as much as possible and reducing the opening area of ​​each hole 9a formed in the central portion 8a as much as possible, the speed of the plating solution passing through the central portion 8a can be suppressed compared with the speed of the plating solution passing through the peripheral portion 8b.

[0068] In addition, Figure 5 In the flow rate control plate 8 of the plating apparatus 100 shown in (A), the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a is equal to the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b, but it may also be like Figure 5 As in the modified example flow velocity control plate 8' shown in (B), the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a is made smaller than the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b. That is, the flow velocity control plate 8' of the modified example sets the diameter of the hole 9a to 1.2 mm and the diameter of the hole 9b to 3.0 mm, on the basis of setting the intervals between the centers of the plurality of holes 9a formed in the central portion 8a and the intervals between the centers of the plurality of holes 9b formed in the peripheral portion 8b to the same size.

[0069] Figure 5The flow rate control plate 8' of the modified example (B) further suppresses the speed of the plating solution passing through the central portion 8a through the synergistic effect of (I) the opening area of ​​each hole 9a formed in the central portion 8a is smaller than the opening area of ​​each hole 9b formed in the peripheral portion 8b, and (II) the total opening area of ​​the multiple holes 9a per unit area in the central portion 8a is smaller than the total opening area of ​​the multiple holes 9b per unit area in the peripheral portion 8b.

[0070] However, it is not necessary to make the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a the same as the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b, or to make the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a smaller than the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b. Even if the total opening area of ​​the plurality of holes 9a per unit area in the central portion 8a is larger than the total opening area of ​​the plurality of holes 9b per unit area in the peripheral portion 8b, as long as the opening area of ​​each hole 9a formed in the central portion 8a is sufficiently smaller than the opening area of ​​each hole 9b formed in the peripheral portion 8b, the speed of the plating solution passing through the central portion 8a can be suppressed compared with the speed of the plating solution passing through the peripheral portion 8b.

[0071] The plating device 100 is provided with a cylindrical member 10 having a hollow portion between the flow velocity control plate 8 and the screen member 7 of the first injection port 6a. The shape and size of the cylindrical member 10 are arbitrary, but preferably the same as the shape and size of the central portion 8a of the flow velocity control plate 8. However, there is no problem even if they are different. In this embodiment, the cylindrical member 10 is set to a cylindrical shape with an inner diameter of 20 mm. In this embodiment, as Figure 5 As shown in (A), when the flow velocity control plate 8 and the cylindrical member 10 are viewed in the planar direction, the central portion 8 a of the flow velocity control plate 8 is arranged inside the cylindrical member 10 , and the peripheral portion 8 b of the flow velocity control plate 8 is arranged outside the cylindrical member 10 .

[0072] The cylindrical member 10 is provided in order to maintain the difference between the speed (slow) of the plating solution passing through the central portion 8a and the speed (fast) of the plating solution passing through the peripheral portion 8b, which is generated in the flow rate control plate 8, as it is until the first jet port 6a of the jet portion 6 provided with the mesh member 7. That is, if there is no cylindrical member 10, the slow plating solution passing through the central portion 8a and the fast plating solution passing through the peripheral portion 8b are mixed in the middle, and the effect of making the speed of the plating solution sprayed from the central portion of the first jet port 6a slower than the speed of the plating solution sprayed from the peripheral portion of the first jet port 6a is weakened in the first jet port 6a of the jet portion 6 provided with the mesh member 7.

[0073] The lower end of the cylindrical member 10 is preferably connected to the flow velocity control plate 8. However, there is no problem even if there is a gap between the lower end of the cylindrical member 10 and the flow velocity control plate 8. In addition, the upper end of the cylindrical member 10 is preferably connected to the screen member 7. However, there is no problem even if there is a gap between the upper end of the cylindrical member 10 and the screen member 7.

[0074] The plating device 100 includes a circulation line 11 formed of a pipe. One end of the circulation line 11 is connected to a liquid suction port 12 formed in the plating tank 1. The other end of the circulation line 11 is connected to the second injection port 6b of the injection unit 6. A pump 13 and a filter 14 are provided in the middle of the circulation line 11. When the pump 13 is driven, the circulation line 11 sucks the plating solution from the liquid suction port 12 and injects the plating solution from the second injection port 6b.

[0075] The plating device 100 is provided with a mixing section 15 below the metal tube 2 and the adjacent tube 3 and above the injection section 6. The mixing section 15 is a region where the plating liquid injected from the first injection port 6a of the injection section 6 and the plated object, the medium, and the insulating balls descending from the plating forming section 4 are mixed. In the present embodiment, the mixing section 15 includes an insulating material and has an inverted frustum-shaped recessed portion formed on the upper surface. In addition, the so-called inverted frustum refers to a frustum whose upper bottom surface is larger than the lower bottom surface. However, the shape of the recessed portion is arbitrary, and may be mortar-shaped or the like instead of the inverted frustum-shaped.

[0076] The first injection port 6a of the injection portion 6 is arranged on the bottom surface of the mixing portion 15. As described above, the mesh member 7 is provided at the first injection port 6a of the injection portion 6. Since the mesh member 7 is provided at the first injection port 6a, when the injection of the injection portion 6 stops, the plated object, the medium, the insulating ball, etc. do not fall into the injection portion 6.

[0077] The plating device 100 is provided with a guide portion 16 above the metal pipe 2 and the next-wall pipe 3. The guide portion 16 is a region where the plated object, medium, and insulating balls that rise along with the rising flow of the plating liquid formed inside the hollow portion 2a of the metal pipe 2 by the injection from the first injection port 6a of the injection portion 6 and are ejected (discharged) from the opening on the upper side of the hollow portion 2a of the metal pipe 2 are stirred and guided to the plating forming portion 4 after being stirred. The guide portion 16 contains an insulating material and, in the present embodiment, is in the shape of an inverted truncated cone. The upper end of the metal pipe 2 protrudes from the bottom surface of the guide portion 16. The upper end of the hollow portion 2a of the metal pipe 2 opens at the bottom surface of the guide portion 16. The bottom surface of the guide portion 16 is connected to the next-wall pipe 3.

[0078] The plating device 100 is provided with an insulating reflector 17 above the opening of the plating tank 1. The reflector 17 is sometimes called a guide plate. The reflector 17 plays a role in suppressing the scattering of the plating solution. In addition, a support portion 2b of the metal pipe 2 is mounted on the lower surface of the reflector 17. In addition, a cylindrical suppression plate 17a is formed on the lower surface of the reflector 17. The suppression plate 17a is arranged in the guide portion 16. The plating solution sometimes overflows from the upper edge of the guide portion 16, but the suppression plate 17a allows only the plating solution to overflow from the guide portion 16, thereby suppressing the overflow of the plated object, the dielectric, and the insulating ball.

[0079] The plating apparatus 100 includes a power source 18. One line of the power source 18 is connected to the support portion 2b of the metal pipe 2 as the first electrode, and the other line is connected to the second electrode 5. The power source 18 applies a current between the metal pipe 2 as the first electrode and the second electrode 5.

[0080] The plating apparatus 100 according to the first embodiment including the above-mentioned structure controls (adjusts) the speed of the plating solution sprayed from the first spray port 6a of the spray section 6 by providing the flow rate control plate 8 and the cylindrical member 10. Specifically, the speed of the plating solution that passes through the central portion 8a of the flow rate control plate 8 and further passes through the inner side of the cylindrical member 10 and is sprayed from the first spray port 6a of the spray section 6 is suppressed (decelerated) compared with the speed of the plating solution that passes through the peripheral portion 8b of the flow rate control plate 8 and further passes through the outer side of the cylindrical member 10 and is sprayed from the first spray port 6a of the spray section 6.

[0081] As described above, the speed of the plating solution rising inside the metal pipe 2 serving as the first electrode is faster as it approaches the center of the metal pipe 2, and slower as it approaches the peripheral portion of the inner wall of the metal pipe 2. In addition, it is considered that when the flow rate of the plating solution sprayed from the spraying portion 6 is increased, the objects to be plated that are sprayed outward from the upper end of the metal pipe 2 and rise to a higher position in the plating solution stored in the plating tank are mainly the objects to be plated that rise all at once in the center of the metal pipe 2 where the speed of the plating solution is fast.

[0082] In the plating apparatus 100, the speed of the plating liquid sprayed from the first spray port 6a of the spray section 6 through the inner side of the cylindrical member 10 is slower than the speed of the plating liquid sprayed from the first spray port 6a of the spray section 6 through the outer side of the cylindrical member 10, so the speed of the plating liquid rising in the center of the metal pipe 2 is suppressed. More specifically, with respect to the plating apparatus 100, when the spray amount of the plating liquid sprayed from the spray section 6 is fixed, the speed of the plating liquid rising in the center of the metal pipe 2 can be reduced compared to the case where the flow rate control plate 8 and the cylindrical member 10 are not provided.

[0083] Therefore, even if the plating apparatus 100 increases the amount of plating solution sprayed from the spraying portion 6, shortens the time required for the object to be plated to pass through the plating forming portion 4 once, and increases the number of times the object to be plated circulates in the plating apparatus, the object to be plated will not rise excessively to a high position in the stored plating solution. Therefore, the plating apparatus 100 suppresses defects such as cracks, defects, and peeling of the plated film on the object to be plated caused by the object to be plated rising to a high position in the stored plating solution.

[0084] (Usage Example of Plating Apparatus 100)

[0085] An example of a plating process using the plating apparatus 100 is described below.

[0086] First, a desired plating solution is put into the plating tank 1 .

[0087] Next, objects to be plated, dielectrics, and insulating balls of desired shapes, desired sizes, and desired numbers are introduced into the guide portion 16 in the plating tank 1. The order of introducing the plating solution and the objects to be plated, dielectrics, and insulating balls can be reversed. The introduced objects to be plated, dielectrics, and insulating balls are accumulated in the plating forming portion 4.

[0088] Next, the pump 13 is driven to eject the plating solution from the first ejection port 6a of the ejection portion 6. As a result, an upward flow of the plating solution is generated inside the metal pipe 2. Then, a portion of the objects to be plated, the dielectric, and the insulating balls accumulated in the plating forming portion 4 are taken out from the lower end of the plating forming portion 4 to the mixing portion 15, mixed with the ejected plating solution, and rise inside the metal pipe 2 along with the upward flow.

[0089] The object to be plated, the dielectric, and the insulating balls rising in the metal pipe 2 are ejected outward from the upper end of the metal pipe 2 and stirred.

[0090] The stirred object to be plated, dielectric, and insulating balls are deposited on the upper side of other objects to be plated, dielectric, and insulating balls that have already been deposited on the plating forming portion 4 .

[0091] A portion of the objects to be plated, dielectrics, and insulating balls accumulated in the plating forming section 4 is taken out from the lower end of the plating forming section 4 to the mixing section 15, whereby newly accumulated objects to be plated, dielectrics, and insulating balls gradually descend. In this way, the objects to be plated, dielectrics, and insulating balls circulate inside the plating device 100.

[0092] Next, the power source 18 is driven to apply a current between the metal pipe 2 as the first electrode and the second electrode 5. As a result, plating on the object to be plated is started in the plating forming portion 4.

[0093] When a plated film of a desired thickness is formed on the object to be plated after a given period of time, the power source 18 is stopped to stop plating the object to be plated. Next, the pump 13 is stopped to stop the circulation of the object to be plated, the medium, and the insulating balls in the plating apparatus 100.

[0094] The plating process is completed by taking out the object to be plated, the dielectric, and the insulating ball from the plating tank 1 and sorting the object to be plated.

[0095] (experiment)

[0096] In order to confirm the effectiveness of the present invention, the following experiment was conducted. Specifically, Examples 1 and 2 were conducted using the above-mentioned plating apparatus 100, and Comparative Example 1 was conducted using a plating apparatus other than the plating apparatus of the present invention. In addition, in this experiment, it was assumed that even if the diameter of the central portion 8a of the flow velocity control plate 8 and the inner diameter of the tubular member 10 were different, as long as the flow velocity control plate 8 and the tubular member 10 were provided, the plating apparatus also belonged to the plating apparatus 100.

[0097] The plating apparatus 100 used in Example 1 and the plating apparatus 100 used in Example 2 are different in the diameter of the central portion 8a of the flow rate control plate 8 and the inner diameter of the cylindrical member 10. In addition, the plating apparatus other than the plating apparatus of the present invention used in Comparative Example 1 is different from the plating apparatus 100 and does not include the flow rate control plate 8 and the cylindrical member 10.

[0098] The plating apparatus 100 of Example 1, the plating apparatus 100 of Example 2, and the plating apparatus of Comparative Example 1 have the same structure except for the flow rate control plate 8 and the cylindrical member 10. For example, the length of the plating forming portion 4 is 220 mm.

[0099] First, Example 1 was implemented. The plating apparatus 100 used in Example 1 was used with the flow rate control plate 8 having a circular shape of 28 mm in diameter and the central portion 8a of the flow rate control plate 8 having a circular shape of 15 mm in diameter. In addition, the plating apparatus 100 used in Example 1 was used with the tubular member 10 having a cylindrical shape of 15 mm in inner diameter.

[0100] In addition, the plating device 100 used in Example 1 forms a plurality of holes 9a with a diameter of 1.2 mm in the central portion 8a of the flow velocity control plate 8, and forms a plurality of holes 9b with a diameter of 3.0 mm in the peripheral portion 8b of the flow velocity control plate 8. In addition, the pattern shape of the central portion 8a where the holes 9a are formed and the pattern shape of the peripheral portion 8b where the holes 9b are formed are similar in shape. That is, the pattern shape of the peripheral portion 8b where the holes 9b are formed is obtained by enlarging the pattern shape of the central portion 8a where the holes 9a are formed, including the intervals between the holes, until the diameter of the holes becomes 3.0 mm.

[0101] The plating tank 1 of the plating apparatus 100 contains a plating solution.

[0102] The object to be plated, the dielectric, and the insulating balls are put into the guide part 16 in the plating tank 1 of the plating device 100. The total amount of the object to be plated, the dielectric, and the insulating balls is set to 1720cc. Regarding the mixing ratio, the object to be plated is set to 1376cc (80 volume %), the dielectric is set to 86cc (5 volume %), and the insulating balls are set to 258cc (15 volume %).

[0103] The pump 13 is driven at a low output to eject the plating solution from the first ejection port 6a of the ejection unit 6, so that the object to be plated, the dielectric, and the insulating ball are circulated in the order of the mixing unit 15, the hollow portion 2a of the metal pipe 2, the guide portion 16, the plating forming portion 4, and the mixing unit 15. The output of the pump 13 is gradually increased to increase the speed of the circulation of the object to be plated, the dielectric, and the insulating ball. Then, when the object to be plated that rises (sprays) relatively high in the stored plating solution among the objects to be plated discharged from the upper end of the hollow portion 2a of the metal pipe 2 reaches a given height, the increase in the output of the pump 13 is stopped and the output of the pump 13 is fixed. Specifically, when the object to be plated that rises relatively high in the stored plating solution among the objects to be plated discharged from the upper end of the hollow portion 2a of the metal pipe 2 reaches a height of 1 / 2 of the height between the upper end of the metal pipe 2 and the liquid level of the plating solution contained in the plating tank 1, the output of the pump 13 is fixed.

[0104] Next, the power source 18 is driven to apply a current between the metal pipe 2 as the first electrode and the second electrode 5 , and plating on the object to be plated is started in the plating forming portion 4 .

[0105] In this state, the amount of plating solution injected from the first injection port 6a of the injection unit 6 (the flow rate of the plating solution) was measured. In this state, the time required for each object to be plated to pass through the plating forming unit 4 once was measured.

[0106] In Example 1, the injection amount of the plating solution injected from the first injection port 6a of the injection portion 6 was 39 L / min. The time required for each object to be plated to pass through the plating forming portion 4 once was 10.5 seconds.

[0107] Next, Example 2 was implemented. In the plating apparatus 100 used in Example 2, the flow velocity control plate 8 was set to a circular shape with a diameter of 28 mm, the central portion 8a of the flow velocity control plate 8 was set to a circular shape with a diameter of 20 mm, and the tubular member 10 was set to a cylindrical shape with an inner diameter of 20 mm.

[0108] In addition, in the plating device 100 used in Example 2, a plurality of holes 9a with a diameter of 1.2 mm are formed in the central portion 8a of the flow velocity control plate 8, and a plurality of holes 9b with a diameter of 3.0 mm are formed in the peripheral portion 8b of the flow velocity control plate 8, as in Example 1. In addition, the pattern shape of the central portion 8a where the holes 9a are formed and the pattern shape of the peripheral portion 8b where the holes 9b are formed are similar shapes as in Example 1.

[0109] In Example 2, under the same conditions as in Example 1, the plating solution was contained in the plating tank 1 of the plating apparatus 100 .

[0110] In Example 2, under the same conditions as in Example 1, an object to be plated, a dielectric, and insulating balls were introduced into the guide portion 16 in the plating tank 1 of the plating apparatus 100 .

[0111] In Example 2, under the same conditions as in Example 1, the pump 13 is driven at a low output, and then the output of the pump 13 is gradually increased, and when the object to be plated that has risen relatively high in the stored plating solution among the objects to be plated discharged from the upper end of the hollow portion 2a of the metal pipe 2 reaches a height of 1 / 2 of the height between the upper end of the metal pipe 2 and the liquid level of the plating solution contained in the plating tank 1, the output of the pump 13 is fixed. Next, the power supply 18 is driven to apply a current between the metal pipe 2 as the first electrode and the second electrode 5, and plating on the object to be plated is started in the plating forming portion 4.

[0112] In Example 2, the amount of plating solution injected from the first injection port 6a of the injection unit 6 (the flow rate of the plating solution) was measured in this state. In addition, the time required for each object to be plated to pass through the plating forming unit 4 once was measured in this state.

[0113] In Example 2, the injection amount of the plating solution injected from the first injection port 6a of the injection portion 6 was 40 L / min. The time required for each object to be plated to pass through the plating forming portion 4 once was 6.1 seconds.

[0114] Next, Comparative Example 1 was implemented. The plating apparatus used in Comparative Example 1 did not include the flow velocity control plate 8 and the cylindrical member 10 as described above. The other configurations of the plating apparatus used in Comparative Example 1 were the same as those of the plating apparatus 100 .

[0115] In Comparative Example 1, under the same conditions as in Examples 1 and 2, the plating solution was contained in the plating tank 1 of the plating apparatus 100 .

[0116] In Comparative Example 1, under the same conditions as in Examples 1 and 2, an object to be plated, a dielectric, and insulating balls were introduced into the guide portion 16 in the plating tank 1 of the plating apparatus 100 .

[0117] In Comparative Example 1, under the same conditions as in Examples 1 and 2, the pump 13 was driven at a low output, and then the output of the pump 13 was gradually increased, and the output of the pump 13 was fixed when the object to be plated that rose relatively high in the stored plating solution among the objects to be plated discharged from the upper end of the hollow portion 2a of the metal pipe 2 reached a height of 1 / 2 of the height between the upper end of the metal pipe 2 and the liquid level of the plating solution contained in the plating tank 1. Next, the power supply 18 was driven to apply a current between the metal pipe 2 as the first electrode and the second electrode 5, and plating on the object to be plated was started in the plating forming portion 4.

[0118] In Comparative Example 1, the amount of plating solution (flow rate of plating solution) sprayed from the first spray port 6 a of the spray unit 6 was measured in this state. In addition, the time required for each object to be plated to pass through the plating forming unit 4 once was measured in this state.

[0119] In Comparative Example 1, the injection amount of the plating solution injected from the first injection port 6a of the injection unit 6 was 34 L / min. The time required for each object to be plated to pass through the plating forming unit 4 once was 16.7 seconds.

[0120] Table 1 shows the details of Example 1, Example 2, and Comparative Example 1 and the experimental results.

[0121] [Table 1]

[0122]

[0123] It can be seen from Table 1 that under the condition that the output of the pump 13 is fixed (maintained) when the object to be plated that has risen relatively high in the stored plating solution among the objects to be plated discharged from the upper end of the hollow portion 2a of the metal tube 2 reaches a height of 1 / 2 between the upper end of the metal tube 2 and the liquid level of the plating solution contained in the plating tank 1, the flow rate of the plating solution in Examples 1 and 2 is greater than that in Comparative Example 1, and the time required for the objects to be plated in Examples 1 and 2 to pass through the plating forming portion 4 once is shorter than that in Comparative Example 1.

[0124] Furthermore, when comparing Example 1 and Example 2, Example 2, in which the diameter of the center portion 8a of the flow velocity control plate 8 and the inner diameter of the cylindrical member 10 are large, has a larger flow rate of the plating solution and a shorter time required for the object to be plated to pass through the plating forming portion 4 once, compared with Example 1, in which the diameter of the center portion 8a of the flow velocity control plate 8 and the inner diameter of the cylindrical member 10 are small. It is considered that when the present invention is implemented, the diameter of the center portion 8a of the flow velocity control plate 8 and the inner diameter of the cylindrical member 10, which can suppress the speed of the plating solution, can make the flow rate of the plating solution larger and the time required for the object to be plated to pass through the plating forming portion 4 once can be shortened.

[0125] As described above, according to the present invention, the flow rate of the plating solution can be increased while suppressing the occurrence of defects in the object to be plated, and the number of times the object to be plated circulates in the plating apparatus can be increased, thereby suppressing the thickness variation of the formed plated film.

[0126] [Second embodiment]

[0127] exist Figure 7 A plating device 200 according to a second embodiment is shown. Figure 7 2 is a top view of the main parts of the plating device 200. Specifically, Figure 7 It is a plan view of the flow rate control plate 28 and the tubular member 10 of the plating apparatus 200 .

[0128] The plating apparatus 200 according to the second embodiment is obtained by partially changing the configuration of the plating apparatus 100 according to the first embodiment described above. The changed points will be described below.

[0129] In the flow rate control plate 8 of the plating device 100 according to the first embodiment, the opening area of ​​each hole 9a formed in the central portion 8a is smaller than the opening area of ​​each hole 9b formed in the peripheral portion 8b. In contrast, in the flow rate control plate 28 of the plating device 200 according to the second embodiment, the opening area of ​​each hole 29a formed in the central portion 28a becomes the same as the opening area of ​​each hole 29b formed in the peripheral portion 28b. However, in the flow rate control plate 28 of the plating device 200, the number of holes 29a formed in the central portion 28a per unit area is less than the number of holes 29b formed in the peripheral portion 28b per unit area. The other structures of the plating device are set to be the same as those of the plating device 100.

[0130] In the flow rate control plate 28 of the plating apparatus 200 according to the second embodiment, the total opening area per unit area of ​​the plurality of holes 29a formed in the central portion 28a is smaller than the total opening area per unit area of ​​the plurality of holes 29b formed in the peripheral portion 28b.

[0131] In the plating apparatus 200 according to the second embodiment, the speed of the plating solution that passes through the central portion 28a of the flow rate control plate 28, passes through the inner side of the cylindrical member 10, and is ejected from the first ejection port 6a of the ejection portion 6 is also suppressed (decelerated) compared with the speed of the plating solution that passes through the peripheral portion 28b of the flow rate control plate 28, passes through the outer side of the cylindrical member 10, and is ejected from the first ejection port 6a of the ejection portion 6. Therefore, in the plating apparatus 200, even if the ejection amount of the plating solution ejected from the ejection portion 6 is increased for the purpose of suppressing the variation in the thickness of the plated film, the time required for the object to be plated to pass through the plating forming portion 4 once is shortened, and the number of times the object to be plated circulates in the plating apparatus is increased, it is unlikely that defects will occur in the object to be plated.

[0132] The plating apparatuses according to the first and second embodiments have been described above. However, the present invention is not limited to the above-described contents, and various modifications can be made according to the gist of the invention.

[0133] For example, in the above-mentioned embodiment, the mesh member 7 is composed of a single layer of mesh throughout the entirety, but for example, it may be Figure 6 As shown in (A), the mesh member 7' is composed of a mesh central portion 7a and a mesh peripheral portion 7b provided outside the mesh central portion 7a, the mesh central portion 7a is composed of multiple layers of mesh, and the mesh peripheral portion 7b is composed of a single layer of mesh. In this case, in the mesh member 7', the speed of the plating solution passing through the mesh central portion 7a can be suppressed compared to the speed of the plating solution passing through the mesh peripheral portion 7b, and the effect of the present invention can be further improved.

[0134] A plating apparatus according to an embodiment of the present invention is as described in the column of “Solution to Problem”.

[0135] In the plating device, it is also preferred that each opening area of ​​the holes formed in the central portion is smaller than each opening area of ​​the holes formed in the peripheral portion. In this case, the resistance applied to the plating solution passing through each hole formed in the central portion becomes larger than the resistance applied to the plating solution passing through each hole formed in the peripheral portion, so that the speed of the plating solution passing through the central portion can be suppressed compared with the speed of the plating solution passing through the peripheral portion. In this case, it is also preferred that the total opening area per unit area of ​​the plurality of holes formed in the central portion is the same as the total opening area per unit area of ​​the plurality of holes formed in the peripheral portion, or the total opening area per unit area of ​​the plurality of holes formed in the central portion is smaller than the total opening area per unit area of ​​the plurality of holes formed in the peripheral portion. In this case, the speed of the plating solution passing through the central portion can be further suppressed.

[0136] In addition, it is also preferred that the opening area of ​​each hole formed in the central portion is the same as the opening area of ​​each hole formed in the peripheral portion, but the number of holes formed in the central portion per unit area is smaller than the number of holes formed in the peripheral portion per unit area. In this case, the speed of the plating solution passing through the central portion can be suppressed compared to the speed of the plating solution passing through the peripheral portion.

[0137] It is also preferred that the total opening area per unit area of ​​the plurality of holes formed in the central portion is smaller than the total opening area per unit area of ​​the plurality of holes formed in the peripheral portion. In this case, the speed of the plating solution passing through the central portion can be suppressed compared to the speed of the plating solution passing through the peripheral portion.

[0138] In these plating devices, it is also preferred that when the flow velocity control plate and the cylindrical member are viewed in a planar direction, the central portion of the flow velocity control plate is arranged inside the cylindrical member, and the peripheral portion of the flow velocity control plate is arranged outside the cylindrical member. In this case, the difference in speed between the plating solution passing through the central portion and the plating solution passing through the peripheral portion generated in the flow velocity control plate can be maintained as it is until the first injection port of the injection portion.

[0139] It is also preferred that the hole formed in the center and the hole formed in the peripheral portion are circular when the flow velocity control plate is viewed in a planar direction. In this case, it is easy to form the hole in the flow velocity control plate.

[0140] It is also preferred that the screen member has a screen central portion and a screen peripheral portion disposed outside the screen central portion when viewed in a planar direction, and the mesh size of the screen central portion is smaller than the mesh size of the screen peripheral portion. In this case, in the screen member, the speed of the plating solution passing through the screen central portion can also be suppressed compared to the speed of the plating solution passing through the screen peripheral portion. In this case, it is also preferred that the screen member of the screen peripheral portion includes a single layer of screen, and the screen member of the screen central portion includes multiple layers of screen.

[0141] It is also preferred to provide a cylindrical metal pipe having a hollow portion directly above the injection portion. In this case, the speed of the plating solution rising inside the metal pipe can be controlled, and in particular, the flow of the plating solution rising at a high speed in the center portion inside the metal pipe can be suppressed (decelerated).

[0142] It is also preferable to include: a partition tube made of an insulating material, having a hollow cylindrical portion, and having a plurality of holes formed therein for passing the plating solution but not the object to be plated; and a second electrode, wherein the metal tube is the first electrode, the metal tube, the partition tube, and the second electrode are respectively accommodated in a plating tank, the metal tube is arranged in the hollow portion of the partition tube, a plating forming portion is formed between the inner side of the partition tube and the outer side of the metal tube, the second electrode is arranged on the outer side of the partition tube, the jet portion is arranged below the metal tube, the object to be plated rises in the hollow portion of the metal tube along with the rising flow of the plating solution jetted by the jet portion, is discharged to the outside from the upper end of the hollow portion of the metal tube, is stirred in the plating solution, and then descends in the plating forming portion, and is plated by applying a current between the metal tube as the first electrode and the second electrode during the descent. In this case, the speed of the plating solution rising in the metal tube can be controlled, and in particular, the flow of the plating solution with a fast rising speed in the center portion of the metal tube can be suppressed (decelerated). In addition, the first electrode is, for example, a cathode electrode, and the second electrode is, for example, an anode electrode.

[0143] Description of Reference Numerals

[0144] 1···plating tank;

[0145] 2···metal tube (first electrode; cathode);

[0146] 2a···hollow part;

[0147] 2b···supporting portion;

[0148] 3···septum tube;

[0149] 3a···hollow part;

[0150] 3b···hole;

[0151] 4···plating forming portion;

[0152] 5···second electrode (anode);

[0153] 6···jet unit;

[0154] 6a···1st injection port;

[0155] 6b···the second injection port;

[0156] 7, 7', 7"···screen member;

[0157] 7a···center part of screen;

[0158] 7b···the peripheral part of the screen;

[0159] 8, 28···flow rate control panel;

[0160] 8a, 28a···central part;

[0161] 8b, 28b···peripheral;

[0162] 9, 29····hole;

[0163] 9a, 29a···hole (hole formed in the central portion 8a);

[0164] 9b, 29b···hole (hole formed in the peripheral portion 8b);

[0165] 10···cylindrical member;

[0166] 11···Circular line;

[0167] 12···Liquid suction port;

[0168] 13···Pump;

[0169] 14···Filter;

[0170] 15···Mixing Department;

[0171] 16···Guide;

[0172] 17···Reflector (deflector);

[0173] 17a···Suppression plate;

[0174] 18···Power supply.

Claims

1. A plating device comprising: a plating tank storing a plating solution containing an object to be plated; and a spraying part formed in the plating tank and spraying the plating solution; The plating solution ejected from the ejection unit agitates the object to be plated contained in the plating solution. in, The injection portion is in the shape of an inner cylinder having a bottom surface extending in the horizontal direction, an inner wall extending from the bottom surface in the height direction, and an opening formed at the upper end of the inner wall. The opening is a first injection port for injecting the plating solution into the plating tank. A screen member is provided at the first injection port, A second injection port for injecting the plating liquid toward the injection portion is provided on the bottom surface. A flow rate control plate having a plurality of holes formed therein is provided in parallel with the bottom surface midway in the height direction of the injection portion. The flow velocity control plate has a central portion and a peripheral portion arranged outside the central portion when viewed in a planar direction. A plurality of holes are formed in the central portion and the peripheral portion, respectively. A cylindrical member having a hollow portion is provided between the flow velocity control plate and the mesh member of the first injection port.

2. The plating device according to claim 1, wherein: The opening area of ​​each of the holes formed in the central portion is smaller than the opening area of ​​each of the holes formed in the peripheral portion.

3. The plating device according to claim 2, wherein: The total opening area per unit area of ​​the multiple holes formed in the central portion is the same as the total opening area per unit area of ​​the multiple holes formed in the peripheral portion, or the total opening area per unit area of ​​the multiple holes formed in the central portion is smaller than the total opening area per unit area of ​​the multiple holes formed in the peripheral portion.

4. The plating device according to claim 1, wherein: The opening areas of the holes formed in the central portion are the same as the opening areas of the holes formed in the peripheral portion, but the number of holes per unit area formed in the central portion is smaller than the number of holes per unit area formed in the peripheral portion.

5. The plating device according to claim 1, wherein: The total opening area per unit area of ​​the plurality of holes formed in the central portion is smaller than the total opening area per unit area of ​​the plurality of holes formed in the peripheral portion.

6. The plating device according to any one of claims 1 to 5, wherein: When the flow velocity control plate and the cylindrical member are viewed in a planar direction, The central portion of the flow velocity control plate is arranged inside the cylindrical member. The peripheral portion of the flow velocity control plate is arranged outside the cylindrical member.

7. The plating device according to any one of claims 1 to 6, wherein: When the flow rate control plate is observed in the plane direction, The hole formed in the central portion and the hole formed in the peripheral portion are each circular.

8. The plating device according to any one of claims 1 to 7, wherein: The screen member has a screen central portion and a screen peripheral portion disposed outside the screen central portion when viewed in a planar direction. The mesh size of the central portion of the screen is smaller than the mesh size of the peripheral portion of the screen.

9. The plating device according to claim 8, wherein: The mesh member at the periphery of the mesh includes a layer of mesh, The mesh member in the central portion of the mesh includes multiple layers of mesh.

10. The plating device according to any one of claims 1 to 9, wherein: A cylindrical metal pipe having a hollow portion is provided directly above the injection portion.

11. The plating device according to claim 10, wherein: The plating device comprises: The partition tube is made of an insulating material, is in a cylindrical shape with a hollow portion, and is formed with a plurality of holes that allow the plating solution to pass but do not allow the plated object to pass; and The second electrode, The metal tube is the first electrode, The metal tube, the partition tube, and the second electrode are respectively accommodated in the plating tank. The metal tube is arranged in the hollow portion of the partition tube, and a plating forming portion is formed between the inner side of the partition tube and the outer side of the metal tube. The second electrode is arranged outside the partition tube, The injection unit is arranged below the metal pipe. The object to be plated rises in the hollow portion of the metal tube along with the rising flow of the plating solution sprayed by the spray portion and is discharged outward from the upper end of the hollow portion of the metal tube. After being stirred in the plating solution, the object descends in the plating forming portion, and is plated by applying current between the metal tube serving as the first electrode and the second electrode during the descent.

12. The plating device according to claim 11, wherein: The first electrode is a cathode electrode, The second electrode is an anode electrode.

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